PROCEEDINGS

OF THE TECHNICAL

PROGRAM

Conference: February 27 - March 4,1994 • Exposition: March 1-3,1994

Anaheim Convention Center • Anaheim, California

TECHNICAL SESSION 32

Fine- and Ultra-Fine-Pitch TechnologyChairmen: Phil Zarrow and Debra Kopp, Integrated Technology Group

"Improved Productivity through Fine-Pitch Dispensing" 1589

Patricia Waitkus and Kevin Gaugler, ESP Solder Plus

"Comparative Analysis of Stencil Technologies for Fine-Pitch and

Ultra-Fine-Pitch Printing" N/A

Richard Clouthier, AMTX-Advanced Micro Tech.

"Alternative Solder Paste Application for Ultra Fine Pitch" 1596

Donald Burr and Mike Buseman, Unisys Corporation

"Fine Pitch Rework and Repair-Process Modeling" 1601

Joe Mearig, Electronic Manufacturing Productivity Facility

TECHNICAL SESSION 33

Advances in UV Processes for Electronics

Chairman: John Beasley, California Sales Manager, EFOS Inc.

"Technology of UV-Cured, Coating, Decorating and Bonding in Electronic

Manufacturing" 1611

Richard Stowe, Mgr. of Product Development, Fusion Systems, Inc.

"New Developments in ODC-Free UV Curing, Coatings and Adhesives" 1620

Dr. Steve Cantor and Farre Huang, Dymax Corporation

"Process Control and Measurement: Key Factors Insuring the Success of

UV-Curing Adhesives, Sealants and Encapsulants" 1635

Christy Marinelli and Gregory Marinelli, Loctite Corporation

"UV-Curable Barrier Coatings for MCM's" 1648

Michael Lucey, President, Micro-Lite Technology

"Automation in UV Process for Electronics: How to Design for Them" 1655

Robert Alvarez, President, Base Technology and Pierre Metivier, ASI

"Ultra-Violet Spot Curing: An In-Line and Off-Line Spot-Cure Approach" 1661

John Beasley, California Sales Manager, EFOS Inc.

TECHNICAL SESSION 34

Advances in Test Fixtures

Chairman: Lisa MacMaster, Marketing Manager, TTI Testron

"Circuit Board Test Fixture Solutions" 1671

Ray Caggiano, Advisory Mechanical Engineer, IBM Corp.

"Improving Test Fixture Quality and Delivery with CAD Data" 1683

Tom Merline, Operations Manager, Everett Charles Technologies

"Wireless Fixture Technology" 1690

Wayne Wardwell and Lisa MacMasters, TTI Testron, Inc.

"No-Clean Flux Applications" N/AMike McKenna, Senior Test Engineer, Epic Technologies

"Incircuit Test Fixture for High-Technology Printed Circuit Boards" 1694

Monroe Taylor, III, Sr. Test Engineer, Motorola Computer Group

"Partnering for Customer Wins" 1699

Greg Geary, Marketing Manager, Automated Test Engineering

TECHNICAL SESSION 35

Linking Design to ManufacturingChairman: P. J. Noble, Consultant in Mfg. Mgmt & Tech., Noble <fe Moore Consultancy

"Linking Design to Manufacture-The Problems" 1705

P. J. Noble, Consultant in Mfg. Mgmt. & Tech., Noble & Moore Consultancy

"Using CAD Data in Manufacturing - The Right Way" 1708

Robert Myers, President, Omnimation

"Ensuring the Correctness of CAD Data in an Electric Assembly Environment" N/A

Michael Marsh and Carston Svanholm, CAM Software Research, Inc.

"Linking CAD and MRP with Manufacturing-Test and Repair" 1719

John Malon and Antony Caulcut, Fabmaster S.A.

"Dealing with the Data Explosion in PWB Fabrication"

Laura Scholten, Valor Computerized Systems

1721

TECHNICAL SESSION 36

User-Implemented CFC Phase-Outs

Chairman: Jim Price, Director of Sales and Marketing, Westek, Inc.

"High Reliability Automotive CFC Phase-Out" N/A

Mary Nutial, Autecs

"Water-Soluble Fluxes in the Military" N/A

Robert Clark, Hughes Aircraft Company

"OA Flux and Ceramic Circuits" N/A

Tim Kougher, GE SANUC

TECHNICAL SESSION 37

Materials for Electronics

Chairman: Alvin Weinberg, Mgr., Hybrid Design & Development, Siemens Pacesetter, Inc.

"Thick Film Metallic Resistors for Lightning Surge Protection" 1729

David Nabatian, Orville Brown, Anthony Maslowski, and Samson Shahbazi,EMCA - REMEX Products

"A Novel Process for the Fabrication of Corrosion-Free MultilayerMetal Conductor Structures for I/O Pin Interconnection" 1737

Umar M. Ahmad, H.S. Bhatia, S. Purushothaman, H. Dalai, W. Price,IBM Corporation

"An Alternate Technique of Producing Cofired Ceramic Circuits

and Components" 1751

Dr. Jerry Steinberg, Director of Research, Heraeus Incorporated

"Cofirable Resistors for Low Temperature Ceramic Tape" 1759

John Alexander, Product Manager, Ferro Corporation

"Diffusion Patterning-Materials Performance and Process" 1766

Robert Mason, M. T. Kirks, and C. R. S. Needes, The DuPont Company

"Material Properties and Applications of Polycrystalline Diamond for

Thermal Management" 1774

Dr. David Pickrell, Research Associate, Diamonex, Inc.

This session is Part 1 of the ISHM-organized Symposium at Nepcon West 1994.

TECHNICAL SESSION 38

Rework Issues and Solutions

Chairman: Wilfred Bernier, Jr., Process Engineer, AT&T Network Systems

"Rework of Ceramic Printed Circuit Boards" N/APhil Stenstrum, Engineer, EG&G - WASC

"Solder Replenishment for SMT Rework" 1785

Harold Hyman, Regional Sales Manager, SRT Research Technology

"No-Clean Rework" 1788

Manthos Economou, Mfg. Development Eng., Hewlett-Packard Company

"Third-Party Trainer in Rework/Repair" 1797

Doug Peck, Director, Advance Electronic Interconnect Ctr. Inc.

"The Significance of Training" 1809

Wilfred Bernier, Jr., Process Engineer, AT&T Network Systems

TECHNICAL SESSION 39

Structured Methods for Quality and Customer Satisfaction

Chairman: Sammy Shina, Associate Professor, University of Massachusetts, Lowell

Co-Chairman: Jud Miner, V. P., Sales Data Collection Prod., Datapage Technologies International, Inc.

"Zero to Sixty in Six Seconds: A Small Company's Experience in the

Development of PTFE (Teflon) Lamination Capability" 1819

N. Balakrishnan, Mfg. Engineering Manager, New Bedford Panoramex Corp.

"Bar Codes, Quality Control and the Information Highway" 1830

Jud Miner, V. P. Sales Data Collection Prod., DATAPAGE

"Barcode Applications in the Electronics Industry" 1840

Bill Bulzoni, Mktg. Manager-Electronics, Zebra Technologies Corporation

TECHNICAL SESSION 40

Fine-Pitch Technology ProcessingChairman: John Sprowl, Product Manager, Solder Creams, Alpha Metals

"Advances in Stencil Technology" 1851

Ian Heck, Product Manager, Alpha Sigma Technology

"Fine Pitch Printing Results" N/A

Mark Jalilian, Engineering Manager, Solectron

"Advances in Screen Printing Technology" 1856

Craig Brown, Vice President, DEK USA Inc.

"Printing Techniques for Fine Pitch Screen Printing" 1862

Jamey Lideen, Manufacturing Engineer, EMD Associates, Inc.

"The Synergy Required in (Specific) No-Clean Fine-Pitch Processes" 1877

Sam Gutierrez, S. Barlow, R. R. Komm and C. Tulkoff, IBM

TECHNICAL SESSION 41

Contract Manufacturing in the PWB Manufacturing IndustryChairman: Dennis Sullivan, Unisys Corporation

"Using Electronics Contract Manufactures: A Review of Industry Trends" 1885

Sandy Fox, Vice President, Technology Forecasters, Inc.

"Contract Manufacturing at a Distance-Improving Productivitythrough Effective Interaction Strategies" 1888

Jeff Shaw, V.P. Manufacturing, Picture Tel Corp.

"Contract Manufacturing-Going Cold Turkey" 1895

Vince Sonju, Manager Procurement, Unysis Corp.

"Gradual Implementation of Contract Manufacturing" N/A

Ben Parab, Dir. Supplier Mgmt., EMC Corp.

"Asia, the World's Printed Circuit Board Shop?"Mark Christensen, BPA (Technology and Management) Inc.

N/A

TECHNICAL SESSION 42

Test in the Integrated Manufacturing Environment

Chairman: Dan Romanchik, Editor, Test & Measurement World Company

"Using a Process Verification Strategy to Meet Quality, Cost and

Schedule Requirements" 1903

Dominick Haigh, Production Manager, Teradyne Inc.

"Test and the Corrective Action Process--A Systems Perspective of

ISO 9002" 1910

James Dawdy and Lynden Jones, Hewlett-Packard Company

"SPC at Polaroid: Instant Feedback for its Instant Cameras" 1920

Michael Boulos, Manufacturing Engrg. Mgr., Polaroid Corporation

"ULF: Uniform Log Format a Standard Datalog Specification for Electronic

Test Equipment" 1925

Ed Woods, President, ATE PC Product Services

"MDA's and Integrated Manufacturing" 1935

Brian Laine, Checksum, Inc.

"Latest Open Testing: An Alternative or Supplement to Automated

Optical Inspection" 1945

Irving Memis, IBM Corporation

TECHNICAL SESSION 43

PWB Manufacturing Issues: Laminates, Wet Finishes and Resists

Chairman: William Vuono, Process Engineer, Boeing Defense and Space

"Thermal and Mechanical Characterizing of High-Performance Laminates" 1957

Mark Paczkowski and Jib. Yuan, AT&T Bell Laboratories

"Effect of Lamination Tooling Dimensional Stability of Multilayer

Circuit Boards" 1965

Jih Yuan and Nien-Hua Chao, AT&T Bell Laboratories

"The Importance of Thermal Stability to the PCB and Laminate Industry" 1983

Curt Mitchell, Technical Service, General Electric ElectroMaterials

"Process Quality Assurance & Reliability Requirements for Choosing a

Solder Mask"1990

Robert Hall, Manager OEM Documentation & Specifications, McDermid, Inc.

"PWB and Component Incoming Cleanliness Issues"

Terry Mason, President, Contamination Studies Laboratory

N/A

TECHNICAL SESSION 44

Future Trends in Multichip Module PackagingChairman: Dr. Jerry Sergent, BBS PowerMod

"Three-Dimensional Multichip Modules" 2001

Dr. Charles Bauer, Techlead, Inc.

"Advanced BGA Technology for MCM Applications" 2006

Robert Marrs, Amkor/Anam

TECHNICAL SESSION 45

Materials Applications in Electronics

Chairman: Richard Sigliano, New Product Dev./Mktg. Mgr., Kyocera International

"A Comparison of MCM Packaging Technologies for a 32-Bit

High-Performance Processor" 2013

Raymond Brown and Robert L. Bone, Hughes Aircraft Company

"Higher Density Using Diffusion-Patterned Vias and Fine-Line Printing" 2229

David Bender and Amy M. Ferreira, CMAC of America, Inc.

"MCM-C Applications for Multilayer Avionics Communication Networks" N/A

Tony Jordon, United Technology Microelectronics Center

"Multilayer High Temperature Ceramics for Semiconductor & MCM Packaging" 2023

Kevin Gaughin, Kyocera International

"Application of Metal Matrix Composite Materials in SEM-E Cores and

Multi-Chip Modules" 2026

Paul Heller, Consultant, Lanxide Electronics

"Fine-Line Additive Technology for High Density Printed Wiring Boards" 2032

Michael G. Todd, M. Albert Capote, and Pradeep Granhi,

Toranaga Technologies, Inc.

"Silicon-on Silicon MCM Technologies" 2038

Jeff Demmin, National Semiconductor

This session is Part 2 of the ISHM-organized Symposium at Nepcon West 1994.

TECHNICAL SESSION 46

Very Fine-Pitch Interconnect Technology Using Laminate Substrates

Chairman: Donald Kuk, Director of Technology, Intergraph

"High Performance Materials for Advanced Interconnect Technologies" 2043

William Varnell, Corp. Director of Research & Dev., Polyclad Laminates,Inc.

"Advanced Substrate Fabrication Techniques" N/A

Dr. John Acocella, Dir. of the Advanced Tech. Group, IBM Technology Products

"Direct Photoplotting of Very Fine-Line Conductors" N/A

David Orthman, Dir. of Research & Development, Ozo Diversified Automation

"Assembly Process Tolerance Issues for Very Fine-Pitch" 2044

Jack Leonard, Michael Deley, Craig Ramsey, David and Smith,

Quad Systems Corporation

"Advanced Packaging Approaches to Very Fine-Pitch Surface-Mount

Interconnection" 2056

Phil Marcoux, Vice President, Micro SMT, Inc.

TECHNICAL SESSION 47

Volume TAB: PCB Supply Chain Issues

Chairman: Michael Baughman, Commodity Manager, Sun Microsystems Computer Corp.

"TAB PWB Specifications: Critical Concerns" 2063

Karl Sauter, Senior Staff Engineer, Sun Microsystems

"Robust TAB Process: An Assembler's View Point" 2070

Dr. Srinivas Rao and Harjinder Ladhar, Solectron

"Fine Pitch TAB: A PCB Perspective" 2079

George Dudnikow, Senior Engineering Mgr., Hadco Corporation

"TAB Bonding Process: Rework Ability/PCB Producibility" N/A

Leroy Jarvis, Advanced Process Engr., Avex Electronics

"TAB OLB in a High-Product-Mix Environment" 2082

Chris Thornton, Process/Producibility Engrg. Mgr., Texas Instruments

TECHNICAL SESSION 48

Inert Atmosphere SolderingChairman: Dr. Armin Rahn, ERSA Ernst Sachs KG, GmbH & Co.

Co-Chairman: Larry Lichtenberg, Motorola

"Investigations about the Reliability of Atmospheric and Inert-Wave

Soldering 1812-Capacitors at Various Footprint Configurations" 2091

Dr. Ing. Gundolf Reichelt, Gabriela Laneous, and Margrit Ehrich, DeTeWe

"TBD" N/ATom Schopflocher, Robologic

"Inert Soldering, Changes and Opportunities" 2108Peter Lensch, ERSA KG

"Elimination of Ozone-Depleting Chemicals through the Implementationof Cleanable Low-Solids/No-Clean Fluxes on High Reliability Harware" 2118

Patrick Scott, Phil Schuessler, Ed Hauptfleisch, and Randy Long, IBM

"Successful Implementation of No-Clean Inert AtmosphereReflow Soldering" 2128Les Hymes, Les Hymes and Associates

TECHNICAL SESSION 49

Cable and Harness Testing from the Front-Line PerspectiveChairman: Jeff Finkelstein, National Sales Manager, OmniTester Corporation

"Harness and Cable Testing Philosophy and Strategy" 2141Eric Hansen and Rob Neeper, Beckman Instruments

"From the Supplier Perspective" 2146Brent Stringham, Sales Manager, Cirris Systmes Coporation

"Harness Testing from the Automotive Perspective"Gary James, Dynalabs

2151

TECHNICAL SESSION 50

Integrated Boundary SCAN

Chairman: Tim Aspell, Manager, Innovative Technologies

"P1149.4 Mixed Signal Test Bus Standard-A Status Report" 2161

Stig Oresjo and John E. McDermid, Hewlett-Packard

"Merging Mixed-Signal Boundary-Scan Testing" 2171

Carl Thatcher, Technical Specialist, Ford Electronics

"Testing New Manufacturing Technologies" N/A

Barry Johnson, Director of Marketing, Schlumberger

"Boundary SCAN: Beyond Just Fiddling" 2182

Ellis Goldberg, Alpine Image Systems, Inc.

TECHNICAL SESSION 51

Progress in CFC-Free Product Technology to Clean and Protect Electronics

Chairman: Dr. Mo Tazi, Director of R & D, Chemtronics, Inc.

"CFC-Free Surface Preparation and Polymer Protection for

Printed Circuit Boards" 2193

Suneer Patel and Eric J. Martini, Chemtronics, Inc.

"Performance Fluids for Critical Cleaning and Drying Applications" 2197

Mark W. Grenfell, John G. Owens, and Frank Klenk, 3M Company

"Special Considerations for Cleaning with Alcohol" 2204

Peter Davis, Prod. Mgr. for Precision Cleaning and Drying, Forward

Technology Industries

"Cleaning Water-Sensitive Parts Without Ozone-Depleting Solvents" 2208

Michael Hayes, Dr.Christine Fouts, and Kevin Hrebenar, Petroferm, Inc.

"Zero Discharge, High-Performance Semi-Aqueous Cleaning of Printed-Wiring

Assemblies with a New, Non-ODC Process" 2219

Dr. Karsten Lessmann, Dr. O. K. Wack Chemie GmbH and Ed Mines,

HumiSeal Division, Chase Corp.

"Rinse-Water Treatment of Micropure CDF Circuit Cleaner" 2226

James Butler, Process Engineer, International Specialty Products

"Volatile Methyl Siloxanes (VMS) as Replacements for CFCs and Methyl

Chloroform in Precision and Electronics Cleaning" 2236

Richard Burow, R&D Commercial Devlop. Leader, Dow Corning Corporation

"An Ozone-Friendly CFC-113 Alternatives for the 1990's 2243

Abid Merchant, E.I. DuPont de Nemours & Co.

TECHNICAL SESSION 52

Thermal and Mechanical Reliability of Interconnects-Application to MCMs

Chairman: K. L. Murty, Professor, North Carolina State University

"Creep/Plastic Deformation of Components During Power Cycling of 2255

a Multichip Module"

B. Sur, and I. Turlik, MCNC Center for Microelectronic Systems Technologies

"Heatpipes-Operating Characteristics Performance Stability" 2265

J. Bowman, Digital Equipment Corporation

"Failure Processes in As-Cast Solders-Thermal Cycling and Deformation" N/AV. Raman and S. Pattanaik, IBM-ADSTAR

TECHNICAL SESSION 53

Solutions to the Known Good Die Problem

Chairman: Phil Marcoux, PPM Associates, Inc.

"Overview of Integrated Circuit Interconnect Options for

Multichip Modules" 2275Phil Marcoux, PPM Associates, Inc.

"Hardware Access Issues Confronting KGD Suppliers and Users" 2279Dr. Charles Bauer, Techlead, Inc.

"Known Good Die Solutions for Flip-Chips" 2282Dr. Glen Rinne, Gretchen M. Adema, and Iwona Turlik, MCNC Centerfor Microelectronics

"Burn-In and Dynamic Test Fixtures for KGD" 2291B. Y. Min, Fariborz Agahdel, Brad Griswold and Syed Husain,MicroModule Systems Co.; Randy Roebuck, Salvatore P. Rizzio, TexasInstruments M&C

"Testing Strategies for KGD"

Kevin Wilson and Martin Kleiner, Insyte2291

TECHNICAL SESSION 54

Concurrent Engineering-Successful ImplementationChairman: Sammy Shina, Associate Professor, University of Massachusetts, Lowell

"Avoiding the Deficit Engineering Trap" 2305

Michael Diamond, Product Manager, Industrial Dynamics Company, Ltd.

"Design for Manufacturability at the International Business

Machines Corp." 2313

Dr. Perminder Bindra and Dr. Philip Kraft, IBM Consulting Group

"Concurrent Engineering at Rockwell International" N/A

Larry Butler, Integrated Product Definition Team, Rockwell

International Corporation

"A Dynamic, Integrated Manufacturing Approach to QFD" 2322

Allen I. Sharkey, Sharkey Associates and Cindy Adiano, IBM Corp.

TECHNICAL SESSION 55

Surface Mount Technology from A to Z

Chairmen: Debra Kopp and Phil Zarrow, Integrated Technology Group

"Solder Paste and Deposition" 2329

Brian Bauer, Heraeus-Cermalloy

"TBD" N/A

Mike Zurn, Electronic Systems, Inc.

"SMT: Profile and Profiling" 2340

Norm Cox, Research, Incorporated

"Surface Mount Cleaning" 2352

Michael D. Buseman, Unisys Corporation

"Automated Inspection and Workmanship" 2356

Robert Savage, NASA Goodard Space Fit. Ctr.

TECHNICAL SESSION 56

Profiting from Test

Chairman: Louis Ungar, President, AT.E. Solutions, Inc.

"Profiting from Test: Advantages of VXIbus-Based Test Systems" 2361

Arlene Meadows, Racal Dana

"Profiting from Software Test" N/A

Dr. Jack Alanen, Litton Data Systems

"Profiting from Boundary Scan" 2380

Dr. Rod Tullos, AT&T Engineering Research Center

"Profiting from Built-in Test" 2373

Louis Ungar, President, AT.E. Solutions, Inc.

"Profiting from Integrated Diagnostics" 2389

Dr. William Randy Simpson, Institute for Defense Analysis

This session is sponsored by the ASTE.