Products and Services Catalogue - CMC Microsystems

September 2013 V 3.0

Page 2September 2013 V 3.0

© CMC Microsystems

Products and Services Catalogue

Copyright © 2013 CMC MicrosystemsTrademarks are the property of their respective owners.

Prices are subject to change. We have made every effort to ensure that the information is accurate and current on the date of publication. However, the document may contain typographical errors, inaccuracies, or omissions that may relate to product descriptions, pricing, and availability. CMC Microsystems reserves the right to correct any errors, inaccuracies or omissions and to change or update information at any time without prior notice (including after you have submitted your order). If you have any questions or would like to report an error, please e-mail [email protected].

Products and services described in this document are subject to certain legal and licensing agreements, or other terms of use. Please contact [email protected] for licensing information on specifi c products.

Most Up-to-Date Version of the Product Catalogue can be found at www.cmc.ca/catalogue

The content of the product catalogue is dynamic and updated as new products are released to Canada’s National Design Network. Visit our website to view the current version of the product catalogue.


© CMC Microsystems


Table of ContentsLearn About CMC and Get Started 5

Benefi ts of CMC Subscription 6

Design 7Methodologies 8

Process Design Kits for Partner Micro/Nano Technologies 9

Tools 10

Prototyping 21Fabrication Services 22

STMicroelectronics 28nm FD SOI CMOS 23

TSMC 65 and 90-nm CMOS Process Technologies 23

IBM 0.13-micron CMOS Process Technology 24

IMST Low Temperature Co-fi red Ceramics (LTCC) 24

TSMC 0.18 and 0.35-micron CMOS Process Technologies 25

AMS 0.35-micron CMOS Process Technology 26

ON Semiconductor 0.5-micron CMOS (C5) Process Technology 26

Teledyne DALSA 0.8-micron CMOS Process Technology 27

CPFC GaN500 Electronics Process Technology 28

CMC 2.5 GHz Bipolar Linear Array Technology 28

MEMSCAP Multi-User MEMS Process (MUMPs) Technology 29

University of Waterloo UW-MEMS Process Technology 30

MEMS Integrated Design for Inertial Sensors (MIDIS) 31

FlowJEM Polymer Microfl uidic Technology 32

Micronit Microfl uidic Device Fabrication: Sensonit Technology 33

Optoelectronic/Photonic III-V Prototyping Services 34

NanoSOI Process 35

IMEC SOI Photonics Process Technology 36

Multi-Technology Integration: Packaging and Assembly Services 37


© CMC Microsystems


Silicon Nanophotonics Fabrication Training 38

Fabrication, Assembly, Characterization and Test (FACT) Services 39

University-based Fabrication Facilities (MNT Portal) 40

Test 41Device Fixturing 42

Generic Micromirror Test Fixture 43

Equipment Loan 44

Dolomite Microfl uidic Products 45

Development Systems 46Microsystems Integration Platf orm (MIP) 47

FPGA-based Development Systems 48

Systems Development: Virtual Algorithm|Architecture Lab 50

Custom Microsystems Prototyping: Compact Wireless Platf orm 51

Real-time Embedded Systems Lab 52

Embedded Soft ware R&D 53

Documents 54Application Notes 55

User Guides 56

Business & Technology Reports 57

Community 58Events Linking You to the Microsystems Community 59


© CMC Microsystems

Products and Services Catalogue About CMC

Overview

Canada’s National Design Network enhances the competitiveness of academic researchers and industry in Canada through innovation in the development and application of microsystems. Researchers in Canada’s NDN have access to industry-quality tools, technologies and solutions to train the next generation of innovators, as well as to design, prototype, and validate their novel microsystems and prove their commercial viability. The vision to 2025 for the National Design Network (NDN) is to enable a vibrant advanced technology manufacturing ecosystem in Canada. Together with partner organizations, CMC Microsystems will increase its support for multi-sectoral use of advanced technologies. New research, development, and innovation will be stimulated resulting in signifi cant contributions to Canadian prosperity.

Canadian Academic Researchers Can:

• Access and get support for proven tools and technologies for designing, prototyping, and testing microsystems.

• Validate design concepts with our proof-of-concept platforms and environments.

• Access our staff scientists and engineers for technical support.

• Get connected to the extended microsystems research community, and leverage our supplier partnerships and our Canadian and international relationships.

Get Started:

• We look forward to working with you. We suggest you begin by getting an account at www.cmc.ca. It only takes a few minutes.

Researchers Involved in Industrial Projects Can:

• Access and get support for design, prototype, package, and test services as well as development engineering assistance.

• Access a range of suppliers in both commercial and academic environments and achieve commercial microsystems prototypes in pre-production and, in some cases, full production volumes.

• Leverage the know-how and contacts built-up by CMC Microsystems over 25 years.

Get Started with CMC

Acknowledge CMC:

If your research benefi ts from products and services provided by CMC Microsystems, please acknowledge this support in any publications about your work. Learn more at www.cmc.ca/acknowledge.

Inquiries from Academia: Brent JodoinManager, Products and Services MarketingCMC [email protected] or 613.530.4679

To learn more about Products and Services for Industrial Projects: Ray FilteauManager, Sourcing and SupplyCMC Microsystemsfi [email protected] or 613.530.4789


© CMC Microsystems


Subscription Overview:

A CMC Subscription connects you with the information, tools, services, and price discounts that add value to your microsystems research and development activities.

Subscription is a Valuable Research Tool:

• Subscribers optimize their research time with a consistent design environment; receive tools when and where you need them

• Subscribers leverage CMC’s strong supplier relationships and get timely and affordable access to the tools and technologies your research needs

• Subscribers get access to tools and technologies relevant to industry and acquire valuable professional experience

• Subscribers can access technical support from a team of highly experienced and innovative engineers and scientists

• Subscribers are involved in setting the microsystems technology roadmap and defi ning the technologies offered to researchers in the National Design Network

• Subscribers enhance their proposal development activities by accessing a library of economic and technical insight documents

• Subscribers get discounted access to workshops and events where they can participate, network or collaborate with peers and industrial attendees

Subscriber Benefi ts:

1. Complimentary access to design tools (number varies with subscription level)

2. Free Trial access for Design Tools3. Ability to switch design tools accessed at any time4. No-charge access to Intelligence Reports, Kits

and Methodologies, Developement Systems, Test Equipment and Engineering Support

5. Early access to new products, such as technologies, engineering services, design kits, training materials, test methodologies and market information as they becomeavailable

6. Opportunities for networking and collaboration.

Subscription

Subscription Options:

You may choose one of three subscription options which provide increasing benefi ts in this orderwith set annual fees (transaction fees may apply for specifi c products or services):

1. Basic: $100 annually2. Designer: $350 annually3. Prototyping: $800 annually

For details on subscription terms and conditions go to www.cmc.ca/Subscription. Not sure which Subscription option is best for you? Contact us to sign up for a free 90-day trial.

Subscription is intended to:

• Provide a ‘value discovery mechanism’ for CMC to identify which are the most valuable items (and so adjust current deliverables to the user’s needs or do better in the next generation)

• Provide a quality mechanism by closing the loop with those who have paid

• Provide a source of revenue which will grow with the number of users in the National Design Network

Designer and Prototyping Subscribers receive a personalized Subscription Resource Report. Log in to your Account to see your details.

September 2013© CMC Microsystems Trademarks are the property of their respective owners

DesignCMC provides access to leading-edge design tools, methodologies, intellectual property and related assets used in the commercial realm, at deep academic discounts. Th ese are supported with training programs, reference designs, and a wide variety of support services including assistance from expert engineers. Use these products and services to complete a design and simulate it, and to carry the design through to a working physical prototype.

To get the most out of Design products and services, purchase your Designer or Prototyping Subscription today. Learn more at www.cmc.ca.

Th e same Design tools that have been available to academic researchers in Canada are now available for Industry. Look for the tools with

? Did you Know?Review a researcher-authored library of

application notes. In these documents, students and faculty members address

techniques to solve technical problems in the design and test of microsystems. Access at

www.cmc.ca/appnotes

Tap into Canada’s National Design Network:

Available for industriall use.


© CMC Microsystems

Products and Services Catalogue Design | Methodologies

Instructional materials guide users through a structured approach, with proven methods and design fl ows that take a project from initial idea to completed design. Examples include:

HW/SW Co-Design:Implementation from MATLAB to FPGA This guide presents a HW/SW co-design fl ow for implementing system electronics, based on a CMC-supported tool set and targeting the AMIRIX FPGA Development Platform. Built around a CMC-developed reference design that provides a foundation for building applications, the training materials encompass system-level modeling, design partitioning and implementation.

MATLAB/Simulink-Based FPGA Design Flow This tutorial takes microsystems researchers and graduate students through a complete design fl ow process, built around MATLAB/Simulink and Xilinx System Generator tools, for use with the CMC-supported AMIRIX FPGA development platform. It includes a design example fi le that implements wave-analysis techniques used in biomedical signal processing.

Customizable Ethernet IP and Reference DesignsFull source code, reference design and user guide enable rapid development of networking-based embedded system designs and applications. By working with a full-featured Gigabit Ethernet Media Access Controller core, students are exposed to commercially developed, pre-validated source code IP and have a working reference design as a starting point.

Cadence RF SiP MethodologyThis kit from Cadence provides a complete SiP (system-in-package) development platform for adopting and implementing advanced package design techniques for mixed-signal SiPs. It guides researchers through the latest proven methodologies for RF and mixed-signal SiP designs, and incorporates reference designs, complete how-to tutorials, and best practices.

Gett ing Started with CadenceTwo tutorials developed at Royal Military College provide novice designers with orientation to the basic tools in the Cadence software suite for designing integrated circuits. Getting Started with Cadence takes users through the steps to create and simulate an inverter. Getting Started with Cadence Layout and Layout Simulation shows how to perform more detailed analysis of the circuit.

Cadence Analog/Mixed Signal Design Methodology KitCovering the design concepts for analog and digital block authoring and overall mixed-signal design, this kit is based on the Cadence design environment. It includes 90nm CMOS generic libraries, layout fi les, and reference designs. More than 1000 pages of documentation include step-by-step tutorials detailing the use of the latest version of the cadence tools for designing and simulating individualblocks as well as the complete design.

Digital IC Design Flow (from RMC) Written to guide users at the Royal Military College (RMC) through a basic digital IC design fl ow process, the prime focus of this tutorial is to take a design from VHDL source to a fabrication-ready IC.

Digital and Analog Design Flows Documentation describing design fl ows for digital and analog integrated circuits provides designers with guidance so they can produce working devices and make the parts re-usable. Covering system-level design to tape-out, each design fl ow includes a diagram of the fl ow, a detailed description of each step, and a checklist of the rules and guidelines to ensure designers have conformed to each step.

Th ere is a library of instructional materials available online. Be sure to check them out at www.cmc.ca.

Design:Methodologies

Available to CMC Subscription Holders at the following price

Designer or Prototyping

Included with Subscription


© CMC Microsystems

Products and Services Catalogue Design | Kits

Kits contain technology fi les and device libraries for use with specifi c CAD tools. Th ey may be used for simulation and for taking designs to fabrication.

Process Design Kits (PDKs) forPartner Micro/Nano Technologies

See the Prototyping section of our catalogue for information on the technology processes that match these design kits.

Design kits for microelectronic designs:

Depending on the supported process, kits typically contain the following for digital, analog and mixed-signal design:

• Mask layer information to enable creation of integrated circuit layouts

• DRC (design rule check) rules to check the layout for conformance with manufacturing rules

• Schematic components, circuit simulation models and layout extraction rules to enable simulation of both schematics and layouts

• LVS (layout versus schematic) rules to assist with design verifi cation

• Characterized device libraries with digital logic cells, analog cells, input/output pads, and more

• Cell datasheets• Numerous technology fi les that confi gure the

CAD tools correctly for startup, confi guration, maintenance, and bug fi xes

• Additional technology fi les, fi lter scripts, and documentation on exporting designs from Synopsys tools and importing into Cadence tools

• Documentation to assist the user with the design fl ow.

Designs can be captured with the layout editor, schematic editor, HDL (Verilog and VHDL) editors or imported via GDSII, EDIF, Verilog, or VHDL. Output is usually an integrated circuit design in GDSII format, ready for fabrication.

Design kits for MEMS, microfl uidic and photonic designs:

These kits typically contain process details, design rules and starter fi les for CAD tools.Access to some design kits requires that the CMC Supported

Technology Confi guration (STC) environment is in place, or that certain agreements have been executed with foundries and CMC partners.

*Fabrication services for this process are not available through CMC**Discounted access to fabrication in this technology is no longer available

Design Kit/Process CAD Tools Supported/RequiredMicroelectronics

STMicroelectronics 28nm LP CMOS* Cadence, Mentor Graphics, Synopsys

STM 28nm FD SOI CMOS Cadence, Mentor Graphics, Synopsys

TSMC 65nm CMOS GP Cadence, Mentor Graphics, Synopsys

STM 65nm CMOS* Cadence, Mentor Graphics, Synopsys

TSMC 90nm CMOS** Cadence, Mentor Graphics, Synopsys

STM 90nm CMOS* Cadence, Mentor Graphics, Synopsys

IBM 0.13μm CMOS Cadence, Mentor Graphics, Synopsys

TSMC 0.18μm CMOS Cadence, Mentor Graphics, Synopsys

AMS 0.35μm CMOS Cadence, Mentor Graphics, Synopsys

TSMC 0.35μm CMOS Cadence, Mentor Graphics, Synopsys

ON Semi 0.5μm CMOS Cadence, Mentor Graphics, Synopsys

Teledyne-DALSA 0.8μm CMOS Cadence, Synopsys

CPFC GAN500 Electronics Process Technology

Agilent

CMC 2.5 GHz Bipolar Linear Array Cadence, Synopsys

MultiLib component library for LTCC Agilent

MEMS

MEMSCAP MetalMUMPs/PolyMUMPs MEMS Pro, CoventorWare

MEMSCAP SOIMUMPs MEMS Pro, CoventorWare, Cadence

University of Waterloo UW-MEMS MEMS Pro, CoventorWare

MIDIS Tanner (L-edit), CoventorWare, Cadence

Microfl uidics

Micronit Sensonit MEMS Pro, Cadence

FlowJEM MEMS Pro

Photonics

CMC/CPFC III-V Design Workshop dw-2000

IMEC SOI Design Workshop dw-2000

ANT/INO NanoSOI MEMS Pro, Cadence

IMEC SOI Design Workshop dw-2000

Available to CMC Subscription Holders at the following price

Designer or Prototyping

Included with Subscription


© CMC Microsystems

Products and Services Catalogue Design | Tools

Design Tools

CMC off ers leading design tools to faculty members and their research teams at the Designer and Prototyping Subscription levels, for R&D in microelectronics, MEMS, microfl uidics, photonics, and embedded systems. Subscription holders have options for trial use of selected tools, and the fl exibility to change a pass from one tool to another.

A CMC Subscription provides you with a number of design tool benefi ts. A Designer Subscription allows you to select three annual design tool passes. Additional passes are available for $50 each.

Subscription includes access to a comprehensive support environment, including:

Training Workshops Application notes

Reference documents Design kits

Engineering support Design rulechecking services

Available for industrial use.

Companies requiring access to CAD tools now have access to a number of tools on a daily, monthly, or yearly basis. Look for the


© CMC Microsystems


Primary Uses:Micro-

electronicsMEMS Micro-

fl uidicsPhotonics Embedded

Software Systems

Includes:• Advanced Design System (ADS) • Electromagnetic Professional (EMPro) • Genesys RF and Microwave Design Software• GoldenGate RF and Microwave Design Software• IC-CAP Devise Modeling Software • SystemVue ESL Software

Agilent Electronics Design Automation (EDA) is a set of designer tools for high-frequency system, circuit and modeling applications.

Includes:• 3-D full-wave electromagnetic fi eld simulations• HFSS Antenna Design Kit• Q3D Extractor• Q3D Extractor, Designer, and Slwave

ANSYS HFSS is a simulation tool for 3D full-wave electromagnetic fi eld simulation and is essential for the design of high-frequency and high-speed component.

Primary Uses:Micro-



Software Systems

Includes:• Altera Quartus II design software—provides a complete,

multi-platform design environment for system-on-a-programmable-chip (SOPC) design for Altera FPGAs.

• Altera Nios II EDS—provides comprehensive environment for developing and debugging software applications forNios II embedded systems.

• Altera ModelSim, Altera university edition—provides thesimulation environment for user’s design.

• Altera DSP Builder—working together with MathworksSimulink tool, provides users with the capability of designingDSP systems from system defi nition and simulation tosystem implementation.

Includes:• PCB design, FPGA and embedded software design as well as

providing: • Mixed-Signal simulation• Analog and digital circuit analysis.

Primary Uses:Micro-



Software Systems

Primary Uses:Micro-



Software Systems

Tools for hardware and embedded design for Altera FPGAs.

Altium Designer is an EDA software package used for implementing schematic, PCB design, FPGA and embedded software design as well as providing Mixed-Signal simulation, and analog and digital circuit analysis.


Available for industrial use. Available for

industrial use.


© CMC Microsystems


Includes:• Bluespec Compiler (BSC): A high-level synthesis compiler

that can compile high-level models, transactor, test bench or implementation into Verilog RTL or SystemC

• Bluespec Simulator (Bluesim): A high-level synthesis simulator that is used to simulate Bluespec designs

• Azure IP Foundation Library: A pre-packaged and verifi ed IP library (components, types and functions) that are included with the Bluespec toolsets for use in user’s models and designs

• Bluespec Development Workstation (BWD): A GUI-based development environment for the design, analysis and debug of Bluespec designs

Includes:• ARM Cortex-A9MP core• ARM Fast Model simulator• System Designer and system generator for Fast Models• Model debugger for Fast Models

Fast Models is an environment for the creation of ARM-based virtual platforms that execute with high simulation speeds.

Primary Uses:Micro-



Software Systems

Primary Uses:Micro-



Software Systems

Includes:• ARM Compiler• Debugger for bare-metal• RTOS and Linux and Android Platforms

ARM DS-5 is a tool chain for developing and analyzing software for ARM’s A and R series processors.

Primary Uses:Micro-



Software Systems

Bluespec offers a set of tools for electronic system designs that provide the capability of specifi cation (synthesizable), synthesis, modeling (synthesizable), and verifi cation (synthesizable).

Primary Uses:Micro-



Software Systems

Includes:• ANSYS Multiphysics• ANSYS Workbench• ANSYS Fluent• ANSYS CFX• ANSYS ICEM CFD• ANSYS TAS• ANSYS AUTODYNE

ANSYS Multiphysics bundle provides ANSYS simulation technology including structural, thermal, fl uid dynamics, explicit dynamics, electromagnetics and multiphysics solvers, ANSYS Workbench, CAD import tools, solid modeling, advanced meshing, and post-processing features.



© CMC Microsystems


Includes:• Finite element analysis (FEA) and simulation capabilities• Modeling capabilities for defi ning geometry, meshing and

physical parameters• Additional modules for extended physical effects are also

available.

COMSOL Multiphysics provides software solutions for multiphysics modeling.

Includes:• Architect3D to simulate complex MEMS devices and MEMS-based

systems• Analyzer for multiphysics simulation• Integrator for reduced order model extraction

Provides 3D MEMS simulation, analysis and design automation softwarefor the development of micro- and nano-scale devices and systems.

Primary Uses:Micro-



Software Systems

Primary Uses:Micro-



Software Systems

Includes:• Custom Integrated Circuits Bundle for analog, mixed-signal, and

RF ASIC designs• Digital Integrated Circuits Bundle for digital ASICS and used in

conjunction with the Custom Integrated Circuits Bundle for mixed- signal designs

• Verifi cation Bundle that includes tools for functional verifi cation, verifi cation process automation, and pre-verifi ed, reusable verifi cation IP components

• Silicon-Package-Board Bundle that includes tools for PCB design and layout, PCB high-speed analysis, IC packaging, and simulation

Consists of CAD tool bundles for the design, simulation, verifi cation, layout, and analysis of ASIC and PCB designs.

Primary Uses:Micro-



Software Systems

Crosslight’s full suite of CAD tools for micro- and opto-electronic device design:• Software package for device simulation, including APSYS,

LASTIP, PICS3D, CSupreme and Procom• Models cover a full range of devices from basic silicon

MOSFETS to more complex devices such as lasers• 2D/3D fi nite element analysis of electrical, optical and thermal

properties of compound semiconductor devices• Optical gain model for quantum well/wire/dot with spectral

broadening, Coulomb interaction, and kp non-parabolic sub-band

• 3D-simulator for surface and edge emission laser diodes, SOA, and other similar active waveguide devices

Primary Uses:Micro-



Software Systems

Crosslight is a suite of semiconductor device simulation tools, featuring modeling of optoelectronic devices and materials properties.



© CMC Microsystems


Includes:• Layout Editor• Photonics Element Library• P-Cell Developer Kit• Extended Design Rule Checker (XDRC)• Functionality can be customized for particular foundry

processes via technology packages available from CMC

dw-2000 offers technologies for electronic design automation (EDA) and photonic design with an emphasis on physical layout and verifi cation.

Includes:• Free Gridding Separates Meshing from Geometry Construction• Modeling Fluid Flow in Complex Geometry is Easy with

FAVOR™ (Fractional Area Volume Obstacle Representation)• TruVOF™ (Volume of Fluid) and Free Surface Modeling• Multi-Block Meshing for Effi ciency and Speed

Provides fl ow simulation solutions for engineers investigating the dynamicbehavior of liquids and gases,specializing in the solution of time-dependent (transient), free- surface problems in one, two and threedimensions, and models confi ned fl owsand steady-state problems

Enables:• Implementation of boundary scan testing of connectivity in a JTAG-

compliant or custom microelectronic circuit• Generation and execution of automated test plans to diagnose

faults

Includes: • Software to confi gure and implement JTAG tests on your system• Access to a dedicated Goepel JTAG hardware interface, through

the CMC test equipment lending pool

Goepel CASCON allows you to design and implement JTAG testing on your circuit or system when used in conjunction with Goepel’s boundary scan physical interface.

Primary Uses:Micro-



Software SystemsPrimary Uses:

Micro-electronics

MEMS Micro-fl uidics

Photonics Embedded Software Systems

Primary Uses:Micro-



Software Systems

Includes:• Cynthesizer for SystemC Transaction Level Modeling and

Synthesis• SystemC-Verilog Cosimulation and verifi cation when used

with Cadence NC-Verilog• Cynthesizer Workbench reports for design analysis • Optimized RTL generation for ASICs and FPGAs

Cynthesizer provides a complete SystemC design environment that includes behavioral synthesis and verifi cation as well as FPGAprototyping and design management.

Primary Uses:Micro-



Software Systems



© CMC Microsystems


Includes:• Embedded Design: Fixed-point Toolbox, Simulink Fixed Point, HDL

Code, Simulink Coder, Embedded Coder, MATLAB Coder• Signal Processing: Signal Processing toolbox, DSP system toolbox,

Filter Design HDL Code, Communications system toolbox• Image Processing: Image Processing Toolbox, Image Acquisition

Toolbox• Control: Control System Toolbox, Simulink Control Design• Verifi cation: Simulink design verifi er, Simulink verifi cation and

validation, HDL Verifi er• Event-based Modeling: Statefl ow, SimEvents• Paralleling Computing: Parallel Computing Toolbox

Primary Uses:Micro-



Software Systems

Mathworks MATLAB/Simulink and the embedded system design related toolboxes enable users to develop algorithms at the system-level, perform hardware-in-the-loop simulation, and generate embedded hardware and software targeting various FPGA-based development boards.

Includes:• IC Nanometer Design, an environment for the design, capture,

layout, and verifi cation of analog, digital, and mixed-signal integrated circuits

• Design, Verifi cation and Test, a solution for HDL design verifi cation, synthesis and test of ASICs and FPGAs

• PCD Expedition, a complete fl ow for design defi nition with schematics and HDL, FPGA integration for reduced design cycles, and an integrated layout and routing environment and signal integrity analysis tool

• PCB PADS, a PCB design solution combining schematicdefi nition with layout and simulation tools

• Embedded SW Development, a development, debug andtesting environment for embedded software

The Mentor Higher Education Program offers for National Design Network researchers.

Primary Uses:Micro-



Software Systems

Primary Uses:Micro-



Software Systems

Includes:• Full data integrity throughout the entire design and IP

management process. • Flow-wide concurrent engineering, commonly resulting in a

reduction of 30% to 60% cycle time and up to 80% decrease in integration effort across disciplines.

• Correct-by-design Methodology and Flow Automation can increase engineering productivity by 40% or more by reducing error rate and eliminating time consuming batch post-processes.

• Virtual prototyping cuts down costly and time-consuming physical prototypes and opens time for cost and quality optimization by improving electrical, thermal, and electromechanical quality and reliability.

• Integrated design-for-manufacturing to eliminate new product introduction risks by reducing design spins by 60% or more, and optimizing fi rst-pass yield by integrating the design chain with the extended supply chain.

Expedition Enterprise provides a complete PCB design portfolio of best-in-class solutions for engineering, design, analysis, manufacturing, and data management.

Primary Uses:Micro-



Software Systems

Includes:• HyperLynx Agif, a Cadence Allegro import interface. • HyperLynx Mgrid, a drawing and grid meshing graphical window.• HyperLynx Modua, a window in which S-parameters of different

sub-circuits may be connected.• HyperLynx MD Spice, a program that converts a wideband

S-parameter network to an equivalent RLC network.• HyperLynx PatterView, a window for displaying EM fi elds, such as

antenna patterns.

HyperLynx consists of several modules, including: HyperLynx Agif, HyperLynx Mgri, HyperLynx Modua, HyperLynx MDSpice and HyperLynx PatternView.





© CMC Microsystems


Includes:• All standard elements for analog high-frequency multi-layered

circuit designs, such as LTCCs, PCBs, and others.• The MultiLibTM modeler library employs the User-Compiled

Analog Model interface of Agilent’s ADS and is thus fullyintegrated in Agilent’s ADS. The researcher is required to have access to the licensed version of ADS2009.

• Automatic layout generation is supported. The MultiLibTM 3D viewer for visualization and verifi cation of complex shapes complements it.

Primary Uses:Micro-



Software Systems

OptiFDTD includes:• Layout and analysis tools• 2D/3D mode solvers• Integrated scripting capability• Support for multi-processor and multi-core simulation• GDSII/DXF output mask formats

OptiFDTD’s simulator is based on the 2D/3D fi nite-difference time-domain (FDTD) method:• Typical uses include high index contrast structures, periodic

structures and photonic crystals• Long simulation times (multi-processor and multi-core hardware

an asset)

Provides engineering design tools for photonic, biophotonic, and systemdesign engineers.

Primary Uses:Micro-



Software Systems

MultiLib is a new state-of-the-art model library, which includes all standard elements for analog high-frequency multi-layered circuit designs, such as LTCCs, PCBs and others.

This is a central tool in the current Microsystem Integration Platform confi guration. It includes:• Integrated environment for design, simulation, instrument

control, hardware-in-the-loop verifi cation, and microsystemdevice characterization and validation.

• The professional version of LabVIEW tool suite is generally available to all emSYSCAN universities for academic research applications

Primary Uses:Micro-



Software Systems

NI LabVIEW is a software tool for creating and deploying measurement and control systems. It supplies an integrated environment for design, simulation, instrument control, hardware-in-the-loop verifi cation, and microsystem device characterization and validation.

OptiBPM includes:• Layout and analysis tools• 2D/3D mode solvers• Integrated scripting capability• Support for multi-processor and multi-core simulation• GDSII/DXF output mask formats

OptiBPM’s simulator is based on the 2D/3D beam propagation method (BPM):• Typical uses include slowly varying structures, low index contrast

structures and long structures which would be too large for FDTD• Short simulation times

Provides engineering design tools for photonic, biophotonic, and systemdesign engineers.

Primary Uses:Micro-



Software Systems




© CMC Microsystems


Includes:• ZEMAX-EE - Model, analyze, and assist in the design of

optical systems. The interface to Zemax has been designed to be easy to use, and with a little practice it can allow very rapid interactive design.

• ZEMAX Part Designer - An interface that allows users to create and manipulate geometries in an environment separate from Zemax.

Primary Uses:Micro-



Software Systems

Offers a set of tools for optical lens system designs, lens libraries, import/export capability for porting designs into 3D models for manufacture, and a superior Knowledge Base (KB) available at no charge to users mastering this CAD tool

CrystalWave and OMNISIM are modeling tools from Photon Design which are offered as a software bundle from CMC

• Design environment for the layout and design of integrated optics components.

• Supports Finite-Difference Time-Domain (FDTD) and Finite Element Frequency Domain (FEFD) simulators

• Includes a mask fi le generator specifi cally optimized for planar photonic crystal structures

• Features a band structure analyzer employing plane-wave expansion (PWE)

Primary Uses:Micro-



Software Systems

CRYSTALWAVE is a design environment for the layout and design of integrated optics components. OMNISIM is a design environment for the omni-directional layout and design of integrated optics components. Examples Include:

• Low-index polymer waveguides, high-index SOI, and GaAs/AIGaAs waveguides

• Buried, etched (rib, ridge), and diffused geometries commonly used in opto-electronics

• Single-mode and multi-mode optical fi bres, as well as photonic crystal fi bres

• Slot waveguides, slanted-wall, and graded structures• Plasmonic and microwave waveguides

FIMMWAVE is a software tool from Photon Design which includes waveguide mode solvers, advanced fi nite-difference and fi nite-element solvers, and fi bre solvers.

Primary Uses:Micro-



Software Systems

Includes:• Polyspace Client for C/C++• Polyspace Server for C/C++• Polyspace Model Link SL• Polyspace Model Link RH

The Polyspace product is a set of commercial quality tools for software verifi cation and certifi cation, providing static code analysis for C-based designs and Model-based designs with Simulink or IBM Rational Rhapsody.

Primary Uses:Micro-



Software Systems


© CMC Microsystems


A single software license gives you access to multiple tools from RSoft’s Passive Device Suite for the design of waveguide devices and circuits:• RSoft CAD Environment, BeamPROP, FemSIM, MOST,

FullWAVE, BandSOLVE, ModePROP, DiffractMOD• Collectively, this suite allows you to perform a comprehensive

range of photonic materials and device simulations, including calculations based on beam propagation, fi nite element, fi nite-difference time-domain, Eigenmode expansion, plane wave expansion and rigorous coupled wave methods

Passive Device Suite supplies photonic and network design automation products.

Primary Uses:Micro-



Software Systems

Solido Design Automation offers a suite of design analysis and optimization tools under the product bundle Variation Designer

Solido Variation Designer:• The tools facilitate PVT corner simulations and Monte Carlo

simulation and automate transistor sizing for circuit optimization• The tools run on an external circuit simulator such as Cadence’s

Spectre, Synopsys’s Hspice and others

Includes:• Memory+ Suite• Standard Cell+ Suite• Low Power + Suite and Analog + Suite• Runs on Red Hat/CentOS 4 and 5, SLES 9 and 10, Solaris 10, 32-

bit and 64-bit

Primary Uses:Micro-



Software Systems

Dassault Systèmes SolidWorks Corp. offers complete 3D software tools that let you create, simulate, publish, and manage your data.

Includes:• 3D solid modeling: Create 3D parts with complex geometries,

assemblies, and associated drawings• 2D drawings: Expedite the creation of production-ready 2D

drawings• Rapid prototyping: Directly outputs STL and other fi le formats

to rapid prototype equipment such as 3D printer• PCB assembly: Read PCB data as 3D parts to assist fi xture

modeling and prototype assembly• Animations and photorealistic renderings

Primary Uses:Micro-



Software Systems

Includes:• MEMS Pro that includes mixed MEMS schematic capture and

simulation, full custom mask layout capability and verifi cation, 3D model generation and visualization, behavioral model creation, and links to 3D analysis packages.

MEMS Pro offers solutions for the design of integrated systems incorporating MEMS.

Primary Uses:Micro-



Software Systems




© CMC Microsystems


SpaceClaim:

• Exports to Multiphysics CAD tools that perform thermal and stress/strain analyses

• Imports from other commercial 3D modelers and drawing programs and repairs these fi les if necessary

• Intergrates with the following CMC-supported tools: COMSOL, ANSYS

• Creates a full set of 2D shop drawings for CNC milling, sheet metal assembly or 3D printing

• SpaceClaim Corp. also offers a free 3D part viewer for design reviews and classroom presentations

Primary Uses:Micro-



Software Systems

SpaceClaim Engineer is a 3D direct modeler that enables engineers to easily create concepts and prepare 3D designs for digital prototyping, analysis and manufacturing.

Includes:• Space Codesign ELIX for functional system creation and

simulationC.• Space Codesign SIMTEK for HW/SW architecture exploration• Space Codesign GENX for system implementation

SpaceStudio enables: • Virtual platform creation and simulation targeting ARM Cortex-A9

and Xilinx Microblaze• Architecture exploration with automatic HW/SW partitioning• Embedded software code generation from the TLM model

Primary Uses:Micro-



Software Systems

The SpaceStudio tool guides you through the creation, simulation, and monitoring of a system prior to implementation on an FPGA or as an ASIC.

Examples of available tools include:• Embedded Systems and System Level Design: Virtualizer (Platform

Architect), Processor Designer, Synphony C Compiler, Synphony Model Compiler, SPW

• FPGA Design: Synplify Premier with Design Planner • Digital and mixed-signal IC design and verifi cation: Design Vision,

IC Compiler, HSPICE, VCS, Formality, StarRC, Saber• TCAD: Sentaurus Device, Sentaurus Process• Design for manufacturability and test: TetraMAX ATPG, DSMTest,

IddQTest

Synopsys provides a comprehensive portfolio of tools for embedded system, FPGA, digital and mixed-signal IC design and verifi cation, TCAD, and design for manufacturability and test.

Primary Uses:Micro-



Software Systems

Includes:• L-Edit for layout design, LVS, and DRC• S-Edit for schematic capture• T-Spice for circuit simulation featuring multi-threading support,

device state plotting, real-time waveform viewing and analysis, and a command wizard for simpler SPICE syntax creation

• W-Edit for waveform viewing and analysis

Offers solutions for the design, layout and verifi cation of analogand mixed-signal (A/MS)integrated circuits.

Primary Uses:Micro-



Software Systems



© CMC Microsystems


Includes:• ISE Design Suite System Edition: The ISE Design Suite

provides access to an integrated software solution supporting the combined methodologies of logic, connectivity, embedded, and DSP design for Xilinx FPGAs.

• AutoESL Design Tool: AutoESL is a High-Level Synthesis (HIL) tool that can transform a design specifi cation implemented in C, C++, or SystemC to a Register Transfer Level (RTL) implementation that can be synthesized as a Xilinx FPGA design

Primary Uses:Micro-



Software Systems

Suite of design tools for logic, connectivity, embedded systems and DSP design for Xilinx FPGAs; includes ISE Design Suite: System Edition, Vivado HLS (formerly AutoESL), and Partial Reconfi guration Flow.

Includes:• Certus Implementor - quickly implement minimized on-chip

signal capture probes in FPGA-targeted RTL• Certus Analyzer - manage generated capture probes through

standard JTAG, including complex triggers across multiple clock domains and FPGAs

Certus Debug Suite offers fast debug analysis tools for FPGA (including multiple FPGA systems) and ASIC design and emulation.

Primary Uses:Micro-



Software Systems

CADpass is a CMC provided utility that creates a secure connection between client PC’s, workstations and computer sessions, and the CMC managed NDN infrastructure.

Learn more at www.cmc.ca/cadpass


PrototypingTh rough strong relationships with partners and suppliers, CMC is able to present a comprehensive set of capabilities for fabricating and packaging devices as working prototypes. Th ese include access to industrial foundry runs and packaging services.Th e convenient single-source service includes assistance from and consultation with experienced engineers. Services are open to academic and industrial participation.

Resources are available at special academic prices or at even greater discounts by qualifying through peer-reviewed competitions. Designs from diff erent projects may be included in one multi-project wafer (MPW) fabrication run so you only have to pay for the space you need.

For more information on fabrication, visit the fabrication schedule at www.cmc.ca/fabschedule.

New faculty and faculty who are new to microsystems are eligible to receive signifi cant discounts on many fabrication technologies. Contact [email protected] to learn more.

? Did you Know?

Academic and Industrial researchers have access to multi-project wafer services. Learn more about how MPW services can help reduce costs associated with R&D projects at www. cmc.ca



© CMC Microsystems

Products and Services Catalogue Prototyping | MPW and Custom Fab

Fabrication Services

Our services deliver technologies from the following suppliers:

Th rough CMC’s cost-eff ective multi-project wafer or custom services, delivered in partnership with suppliers from around the world, researchers can prove their design concepts in commercial microelectronic, photonic, MEMS, and microfl uidic technologies.

Our comprehensive support environment accelerates progress up the technology learning curve and speeds the path to commercialization. In addition to our standard off erings, we also work with lead researchers to investigate emerging technologies.

We provide a comprehensive support environment, including:

Training Workshops

Reference documents Design kits

Engineering support Design rulechecking services

Design tools Supply management


© CMC Microsystems


Th ese technologies off er a mixed-signal/RF 1P9M low-power process with ultra-thick (34kA) top metal options.

CMC’s multi-project wafer service delivers Taiwan Semiconductor Manufacturing Company (TSMC) CMOS technologies through partnership with MOSIS.

Applications

• RF/mixed-signal designs• High-speed digital circuits• RF, microwave systems• Optical communications systems

65 and 90-nanometerCMOS Process Technologies

FeatureProcess

65-nanometer CRN65GP (General purpose) 90-nanometerPeer-Reviewed Price

(Canadian Academic Price)$2,800 per mm2

($7,500 per mm2)N/A, contact [email protected] for special requests

Technology Features 9 metal layers (34kA ultra-thick top metal), 1 poly layer, MiM capacitor, dual gate oxide for 1.0V/2.5V devices

Metal-insulator-metal capacitor, resistor options, and other features

Supply Voltages 1.0V and 2.5V

Support Services

• Cadence design kit• Access to CMC support engineers• Online community forum • Design rule checking services• Documentation• Packaging & assembly services

Applications

This is a low-power advanced CMOS process targeted to serve battery-operated and wireless applications. The technology is made available through partnership with CMP and is suitable for:

• Digital designs• RF designs• Mixed-signal designs

STMicroelectronics 28nmFD SOI CMOS

Feature 28nm

Peer-Reviewed Price(Canadian Academic Price)

$5,000 per mm2

($18,500 per mm2)

Technology Features

Gate length : 28nm drawn poly length; Dual Vt MOS transistors; Dual gate oxide; Dual-damascene copper for

interconnect; 10 metal layers for interconnect;0.01um metal pitch;

Supply Voltages 1.0V, 1.8V

Support Services

• Design rule checking (DRC) services• Access to CMC Support Engineers• Analog/Digital Design Flow• Design kit

Academic Subscribers

Level: PrototypingPrice: See table below

For Industrial Projects Contact: [email protected]

Prototyping | MPW | Microelectronics

Th is technology is an ASIC design platf orm based on bulk silicon substrate.





© CMC Microsystems

Products and Services Catalogue Prototyping | MPW | Microelectronics

Th is technology off ers an eight-layer metal structure with 1.2V core and 2.5V supply voltages.

CMC’s multi-project wafer service delivers the IBM CMRF8SF-DM CMOS technology through partnership with MOSIS. This technology is supported by the digital design capability of the ARM libraries (including standard cells, I/O cells, and memory generators).

Technical Information

0.13-micron CMOS Process Technology

Technology Features 8 metal layers: 3 thin metal layers (M1/M2/M3), 2 thick metal layers (MQ/MG), 3 thick RF metal layers (LY(Al), E1(Cu), MA(Al))

Supply Voltages 1.2V core and 2.5V I/O

Peer-Reviewed Price $550 per mm2

Canadian Academic Price $1,400 per mm2

Applications:

• Digital designs• Analog designs• RF designs• Mixed-signal designs

Support Services:

• Cadence design kit• Access to CMC support engineers• Online community forum • Design rule checking services • Documentation• Packaging & assembly services

Low Temperature Co-fi red Ceramics (LTCC) shutt le run through IMST-Germany.

The technology provides a capability to make high quality passives, antennas, and offers the possibility to build complete modules using hybrid integration. The technology is supported with a design fi le based on Agilent ADS which includes the technology fi le and DRC.

Low TemperatureCo-fi red Ceramics (LTCC)

Support Services:

• MultiLib Design Kit for ADS• Access to CMC support engineers• Design rule checking services• Documentation

• User Guide: LTCC Design Guideline• Getting Started Guide: The LTCC

Shuttle Run (ICI-278)• Quick Start Guide: Installing MultiLib

for LTCC Design in Agilent ADS (ICI-282)

• Packaging and assembly services

System Du Pont 9K7

Peer-Reviewed Price(Canadian Academic Price)

$1,200 (3cm by 3cm)($4,500 (3cm by 3cm))

Substrate Layers 9K7X and 9K7V

Metal Layers Gold: LL505Au

Resistive Layers 200 Ohm and 20 Ohm: HFB22 and HFB12

Number of layers 6

Applications Packaging and RF circuits• For inquiries, contact [email protected]

Applications:

• Radio Frequency passive circuits• Antennas• Custom packaging






Level: DesignerPrice: See table below



© CMC Microsystems


Th ese include our mainstream 0.18μm CMOS technology, as well as the 0.35μm CMOS technology.

CMC’s multi-project wafer service delivers Taiwan Semiconductor Manufacturing Company (TSMC) CMOS technologies through partnership with MOSIS.

CMOSP18 is supported as our mainstream technology and is offered with a robust design kit (with a commercial cell library) that supports RF, analog, mixed-signal and digital design fl ows. For full custom digital designs, CMC strongly encourages researchers to consider the IBM 0.13μm CMOS technology in order to reduce the fabrication cost.

0.18 and 0.35-micronCMOS Process Technologies

FeatureProcess

0.18-micron 0.35-micronPeer-Reviewed Price

(Canadian Academic Price) $750 per mm2

($1,400 per mm2) $175 per mm2

($500 per mm2)

Electrical Contact Forming Technology

Salicide Polycide

Layers 6 metal, 1 poly 4 metal, 2 poly

Supply Voltages 1.8V and 3.3V 3.3V

Minimum Drawn Gate Length 0.18μm 0.35μm

Options

• Logic (default)• Mixed-signal (deep N-well and metal-

insulator-metal [MiM] capacitor)• Thick metal

Support Services:


Applications

• Analog• RF designs• Mixed-signal designs• Full custom digital designs (.18-micron)






© CMC Microsystems


Th is technology off ers four metal layers, ananti-refl ective coating and high-effi ciency photodiodes,digital standard cells, and bulk micromachining.

CMC’s multi-project wafer service delivers technology from austriamicrosystems (AMS) through partnership with Circuits Multi-Projets (CMP) in France that offers three processes: Basic, Opto, and High-voltage.

Applications:

• Embedded photodiodes • High-density CMOS imaging

0.35-micron CMOSProcess Technology

FeatureProcess

Basic Opto High-voltage

Technology Features4 metal, 2 poly layers 4 metal, 2 poly layers with a thick metal layer

High-effi ciency photodiode and anti-refl ective coating

Supply Voltages 3.3V or 5V 50V, 5V or 3.3V allowing 20V at the gate

Bulk Micromachining* Available for $550 (Peer-Reviewed Price) Not available

Canadian Academic Price

$1,000 per mm2 $1,250 per mm2 $1,500 per mm2

* Allows monolithic implementation of MEMS and microelectronics.

Support Services:

• Cadence design kit• Access to CMC support engineers• Online community forum• Design rule checking services • Documentation• Packaging & assembly services• Also used in MEMS research

Th is technology off ers a non-silicided process with three metal layers, two poly layers, one high-resistance layer and stackable contact/vias. Th e process is for 5 volt applications.

CMC delivers the ON Semi CMOS technology through partnership with MOSIS. Whole wafer runs are available on special request.


0.5-micron CMOS (C5) Process Technology

Technology Features 3 metal, 2 poly (poly-to-poly capacitor, 950 aF/μm2), high-resistance poly layers

Supply Voltages 5V

Applications:

• Mixed-signal designs• Sensor designs• Post-processing experiments• Graduate student training• Bio-instrumentation• Imaging sensors• Signal conditioning• Control circuitry in integrated microsystems

Support Services:

• Cadence design kit• Online community forum• Design rule checking services and other

fabrication services through MOSIS


Level: PrototypingPeer-Reviewed Price: $225 per mm2

Canadian Academic Price: See Table BelowFor Industrial

Projects Contact: [email protected]


Level: PrototypingPrice: Contact [email protected]



© CMC Microsystems


Th is technology provides excellent driving or actuating capabilities as well as signal conditioning and processing capabilities.

CMC’s multi-project wafer service delivers technology from the Teledyne DALSA Semiconductor Foundry that offers three voltage ranges:

• Standard-voltage – Provides fl exibility, speed and packing density needed in mixed-signal designs (targeting analog application) operating in the 2.7V to 5.5V range. The overall design rules are compatible with most other 0.8μm processes.

• Mid-voltage – A quadruple-well and double-poly epitaxial silicon process with a high-resistivity polysilicon option. Intended for applications that need to combine low voltage (2.7V to 5.5V) and high voltage (up to 20V operating, > 25V breakdown) analog and digital functions on a single chip. The 20V transistors are fully junction-isolated from the core 5V CMOS. This technology is useful for audio applications.

• High-voltage – A quadruple-well, triple-metal and double-poly epitaxial silicon process with a high-resistivity polysilicon option. Intended for applications that need to combine low voltage (2.7V to 5.5V) and high voltage (up to 300V operating / >350V breakdown) analog and digital functions on a single chip. Useful for electrostatic MEMS drivers.

FeatureVoltage Range

Standard-voltage High-voltagePeer-Reviewed Price

(Canadian Academic Price)Minimum charge is for a 6mm2 design

$150/mm2

($350)/mm2$150/mm2

($700)/mm2

Process Flavor CMOSP8C5V analog/mixed-signal

CMOSP8G5/300V analog/mixed-signal

Technology Features

• 0.8μm 2.7V to 5.5Vmixed-signal CMOS

• Double poly • Triple metal • Hi-res poly option

(5 kOhms/sq)• Twin-tub process on

P-type wafers

• 0.8μm 5V mixed-signal CMOS• 20-300V N-channel LDMOS and EDPMOS transistors• 5V CMOS isolated from 20-300V LDMOS/EDPMOS• Isolated PNP and NPN bipolars• Dual-gate oxide technology• Hi-res poly option (5 kOhms/sq)• High-voltage (> 30V breakdown) inter-poly capacitors• P-type epitaxy over p+ substrate

Supply Voltages 2.7V to 5.5V Up to 300V

Bulk Micromachining* Available for $50 per design (Peer-Reviewed Price) or $200 per design (Canadian Academic Price)

* Allows monolithic implementation of MEMS devices within the CMOS design.

Applications:

• Flat display panels• Automotive • Actuating MEMS devices• Stimulating muscles in an implantable

device• Manipulating particles or cells in fl uidics

Support Services:


0.8-micron CMOSProcess Technology





© CMC Microsystems


Th is technology is based on pre-manufactured wafers containing tiles of capacitors, resistors, NPN transistors, PNP transistors, diodes, and bond pads.

A design is typically on a 2x1 array of tiles where a designer has drawn metal interconnect lines to implement a circuit. During manufacturing, the metal interconnect is patterned and CMC returns several integrated circuits packaged in 20-pin dual in-line packages. Fabrication time, from stream fi le to packaged chips, takes two weeks.

Applications

• Simple analog circuits• Classroom training in semiconductor design

2.5 GHz Bipolar LinearArray Technology

Support Services:

• Design kit for Cadence Analog Artist• Access to CMC support engineers • Design rule checking service

Th is is a GaN MMIC process on SiC substrate with a gate length of 500nm. Th e service is off ered through the Canadian Photonics Fabrication Centre.

The technology is supported by a design guide and the GaN500 Agilent ADS Design kit. The typical block size is 2mm by 2mm. A 4mm by 2mm is possible depending on the availability. The process combines high power density, excellent thermal conductivity and high gain performance.

Features: • A wide bandgap semiconductor

material• SiC substrate for optimal

thermal conductivity• Two metal layers• 500nm gate length• Optimized ohmic contacts• Tailored mesa isolation

Applications: • Power amplifi ers, power electronics• Operation in harsh environments• Telecommunications

GaN500 ElectronicsProcess Technology

Support Services:

• Design manual• Design kit for Agilent ADS• Design rule checking service• Packaging and assembly• CMC support engineers• Online community forum

SEM image of a GaN500 devicedeveloped at CPFC

• Optimized Schottky contacts• Nichrome (NiCr) resistors• Interconnect metallization• Airbridges• High Q passive devices• Metal-Insulator-Metal (MIM)

capacitors• Spiral inductors

• Defense• Space• Automotive


Level: PrototypingPeer-Reviewed Price: $700 per mm2

Canadian Academic Price: $2,200 per mm2



Level: PrototypingPrice: $500 per class



© CMC Microsystems

Products and Services Catalogue Prototyping | MPW | MEMS

Th is service provides access to three multi-mask MEMS processes: PolyMUMPs, SOIMUMPs, and MetalMUMPs.

CMC’s multi-project wafer service delivers the MUMPs technology, through a partnership with MEMSCAP Inc.

Support Services

• Design kits• Access to CMC support engineers• Online community forum • Design rule checking services • Documentation including design handbooks• Packaging & assembly services

Multi-User MEMSProcess (MUMPs )Technology

Cross-sectional view of SOIMUMPs process (Image courtesy of MEMSCAP)

Cross-sectional view of MetalMUMPs process (Image courtesy of MEMSCAP)

Cross-sectional view of PolyMUMPs process (Image courtesy of MEMSCAP)

METAL

POLY 1

POLY 1 POLY 1

POLY 0

Silicon Substrate

NITRIDEPOLY 1

METAL

Process PolyMUMPs SOIMUMPs MetalMUMPs

Description A triple polysilicon, single metal surface micromachining process with deposited oxide (PSG) as the sacrifi cial material and silicon nitride for electrical isolation from the substrate

A silicon-on-insulator (SOI) wafer stack consisting of a handle wafer (fi xed at 400μm), a buried oxide wafer, and a doped silicon device wafer

Incorporates the three major MEMS processes: LIGA-like, thick metal electroplating, and both bulk and surface micromachining

Features Three polysilicon, single metal surface micromachining with minimum feature size down to 2μm.One gold layer deposited on top polysilicon layer for wiring and contact pads.Two sacrifi cial layers to release the top two polysilicon structural layers.

Thick SOI structural layer (option of 10μm or 25μm thickness) with small minimum feature size (down to 2μm).Through-holes to pass light through the substrate.Two metal layers: one for pads and wires, another for creating a highly-refl ective mirror surface.

20μm thick electroplated nickel structural layer with minimum feature size down to 8μm.0.7μm thick polysilicon embedded by silicon nitride. 25μm deep KOH-etched trench in substrate.Electroplated gold side wall on nickel for low resistance contacts.

Applications • Acoustics• Sensors and

actuators• Micromirrors• Micro-assembly

• High- performance inertial sensors

• Optical and display devices

• Resonators and actuators

• RF MEMS for communications

• BioMEMS

Design Kits • MEMS Pro• CoventorWare

• MEMS Pro• CoventorWare

• MEMS Pro• CoventorWare• Cadence

Post Processing $150/design (Peer-Reviewed Price)$800/design (Canadian Academic Price)


Level: PrototypingPeer-Reviewed Price: $325 per 5mm x 5mm

Canadian Academic Price: $900 per 5mm x 5mmFor Industrial



© CMC Microsystems


Th is process can help designers achieve high-performance tunable RF-MEMS devices, sensors and actuators.

CMC’s multi-project wafer service delivers the UW-MEMS technology through the Center for Integrated RF Engineering (CIRFE) at the University of Waterloo.

Features

Alumina substrate, two gold layers, and 5μm feature size produce devices with high quality factor and low loss that operate at higher frequencies.

• Alumina substrate• High-resistance titanium tungsten bias lines• Two gold layers with interconnect• Second gold layer released• Dimples for second gold layer• Mechanical contact between the two gold layers• Silicon oxide layer as a dielectric between the two gold layers

Applications

• Tunable and re-confi gurable RF-MEMS devices for application in communications

• Sensors and actuators• Digital microfl uidics using electrowetting

Support Services

• MEMS Pro and CoventorWare design kits• Access to CMC support engineers• Online community forum• Design rule checking services• Documentation including design handbook• Packaging & assembly services

Cross-section view of UW-MEMS process(Courtesy of CIRFE)

UW-MEMSProcess Technology

SEM picture of ohmic contact switch, fabricated in UW-MEMS process

(Courtesy of CIRFE)

TiW


Level: PrototypingPeer-Reviewed Price: $900 per 1cm2

Canadian Academic Price: $3,500 per 1cm2



© CMC Microsystems


MEMS Integrated Design for Inertial Sensors (MIDIS)

The MEMS Integrated Design for Inertial Sensors (MIDIS™) platform is designed to provide a standard process for manufacturing accelerometers and gyroscopes and integrating them into an Inertial Measurement Unit (IMU) for consumer (mobile), automotive, and sports/health applications.

Features

• Getter-free, high-vacuum sealing allows resonator Q factors > 20,000• Effi cient wafer level packaging minimizes overall die size• 1.5um feature size in a 30um thick membrane• Comb height control allows out-of-plane sensing• TSV allows compact design ready for co-packaging• Deliver 40 copies for each design

Applications

• Accelerometers• Gyroscopes• Resonators• Inertial sensor combos (Sensor fusion)

Support Services

• Short term CAD tool loan• Design kits• Design consultation• Access to CMC support engineers• Design rule checking services• Documentation including design handbooks,

application notes and design methodologies• Packaging & assembly services

Fabrication Schedule

• 3 runs scheduled for 2014• Visit www.cmc.ca/fabschedule


Level: PrototypingPeer-Reviewed Price: $2,100 per 4mm x 4mm

Canadian Academic Price: $6,400 per 4mm x 4mmFor Industrial



© CMC Microsystems

Products and Services Catalogue Prototyping | Microfl uidics

FlowJEM Polymer Microfl uidic Technology

Feedback from Lead Clients:

• “The microscopic inspection of the chips demonstrated that the FlowJEM technology is capable of producing well-defi ned microfl uidic structures.”

• “The chip holder worked fi ne and provided leakage-free fl uidic connections. Pressure up to 1 bar was applied without observing any leakage.”

• “After the fi nal design submission, the turnaround was 4-6 weeks. It can be 2-4 weeks for more simple designs.”

Blood Cell Characterization under MicroenvironmentDr. Marianne Fenech, University of Ottawa

Cell or Microparticle Sorting in MicrochannelDr. Boris Stoeber, University of British Columbia

Support Services:

CMC provides a wide range of support services and products for the entire design/make/test cycle, to assist researcher in taking an initial idea to a full working prototype

• Fully documented design rules and process steps

• Design kits for MEMS Pro• Test fi xturing and carrier platform for functional

prototype testing

Th is technology provides rapid and cost-eff ective fabrication of customized microfl uidic devices in a variet of thermoplastic materials.

Key technical advances developed by FlowJEM include rapidprototyping of microfl uidic devices in thermoplastic materials, chip holder and interfacing component. Resources available through CMC include a user guide, CAD design fi les, and expert support services

Features

• Support and fabrication access for research using rigid and biocompatible polymer material for fl uidic dynamics, chemical analysis/synthesis, or lab-on-a-chip for sensing and detection, with the end objective of publishing, prototyping and commercialization.

• Possibility of integration of microfl uidics with other technologies such as CE, fl uorescent sensing or chemiluminescence throught the chip holder and interfacing components.

• Aff ordable cost (peer-reviewed price of $700/design including 5 copies) Fast fabrication turnaround: approximately 4-6 weeks

Applications

• Fluid dynamics• Droplet generation and manipulation• Life science• Bio-sensing and chemical analysis


Level: PrototypingPeer-Reviewed Price: $700/design

Canadian Academic Price: $2,300/designFor Industrial



© CMC Microsystems

Products and Services Catalogue Prototyping | MPW | Microfl uidics

CMC off ers a multi-project wafer service for customprototypes, complete with embedded microelectrodes,for testing and proving microfl uidic designs.

Sensonit is a microfl uidic prototyping technology developed by Micronit Microfl uidics BV and available exclusively through CMC. The technology enables researchers to turn microfl uidic design fi les into a physical microfl uidic chip, complete with electrodes and ready for test fi xturing.

Technical Specifi cations

Micro-Channels

ITOConductor

CMOSSensor

In ChannelElectrodes

FluidPort

ComponentAccessHole

Top SideComponent

SensorMetal

Single Sensonit Chip : ExampleLayout View

Whole Sensonit Wafer

90mm

90m

m

Single Sensonit Chip : ExampleCross Section

FluidPort

ITO Electrode

Microchannel

Top Plate

Bottom Plate

In ChannelElectrode

CMOSSensor Sensor

Metal

ApplicationsSensonit has many physical and chemical applications, as well as applications in the life sciences such as:

• Cell manipulation• Genetic analysis• Medical diagnostics• Protein and peptide

analysis

Support ServicesCMC provides a wide range of support services and products for the entire design/make/test cycle, to assist researchers in taking an initial idea to a fully working prototype.

• Fully-documented design rules and process steps

• Design kits for Cadence and MEMS Pro• Reference designs with application notes• Test fi xturing and carrier platform for

functional prototype testing• Packaging & assembly services

Base Process Three design layers realized in two bonded glass plates:• Top plate: Powder-blasted holes for fl uid ports,

electrical connections, mechanical component access• Underside of top plate: Channel structures created by

wet-etching• Bottom plate: In-channel metallized electrodes

Substrates • Sensonit-Thin: D263 1.1mm top sheet bonded to 0.1mm, 0.145mm or 0.175mm bottom sheet

• Sensonit-Thick: Borofl oat 1.1mm top sheet bonded to 0.7mm bottom sheet

• Alternative glass types including Borofl oat-33, fused silica and silicon may be available

Process Options • Optically transparent indium tin oxide on underside of top plate for in-channel electrodes

• Cr-Ni-Au metallization on underside for integrating sensors and computing/control chips via fl ip-chip bonding

• Options for channel depth, material and material thickness adjusted according to a consensus of participants on a fabrication run

Design Dimensions Multiples of 15mm x 15mm, to maximum size of90mm x 90mm

Electrodes Ta-Pt standard; Ta-Au and other options available

Electrode Functions • Electrical heating• Temperature sensing• Amperometric, conductivity and electrical impedance

measurements• Fluid manipulation, cytometer, DEP

• Microchemical analysis

• Drug delivery• DNA analysis

A 30 x 90mm structure containing in-channel heater strips, fabricated in the Sensonit

technology (Courtesy of Dr. Karan Kaler, University of Calgary)

Microfl uidics DeviceFabrication: Sensonit Technology


Level: PrototypingPeer-Reviewed Price: $300 per 15mm x 15mm

tileCanadian Academic Price: Contact [email protected]



© CMC Microsystems

Products and Services Catalogue Prototyping | MPW | Photonics

Prototyping services in III-V compound materials, supported by design kits and CMC engineering expertise, streamline prototyping of nano-photonics via complex processes.

For early-stage prototyping in III-V materials, CMC provides access to foundry services at subsidized rates. The foundry grows epitaxial wafers on GaAs and InP substrates via MOCVD, supported by metrology services for quality assurance. Custom processes applied on a case-by-case basis realize the desired geometry and functionality.

III-V Custom Processes

As guidelines, the following are currently in place and available to CMC clients. Project feasibility is evaluated on a case-by-case basis.

Passive waveguides• Typically formed through maximum two-step etching process

Ridge waveguide-type active devices • Fabry-Perot (F-P) laser process• Semiconductor optical amplifi er (SOA) / Superluminescent light

emitting diode (SLED) process• Distributed feedback (DFB) laser process• Electroabsorption modulator (EAM) process

Buried Hetero-structure waveguide type active (limited availability)• Fabry-Perot (F-P) laser process

Support Services:

To help ensure a successful prototype, a CMC support engineer assists with the fabrication process.

The CMC-supported design kit provides a fl ow based on dw-2000 physical layout and verifi cation software. For system-level or other requirements, packaging & assembly services can be considered on a case-by-case basis.

Optoelectronic/PhotonicIII-V Prototyping Services

MOCVD epitaxy on InP SubstrateEpitaxy (lattice matched):Epitaxy layers InP, InGaAs, InGaAsP, InAlGaAs

Substrate characteristics Crystal orientation (100) or 2 degree off (100)

Wafer count/size per run 6x3” or 3x3”

Dopant n-type, p-type, and S.I.

MOCVD epitaxy on GaAs SubstrateEpitaxy (lattice matched):Epitaxy layers GaAs, AlAs, AlGaAs, InAlGaAs,

InGaAs

Substrate characteristics Crystal orientation (100) or 2 degree off (100)

Wafer count/size per run 5x3” or 5x4”

Dopant n-type, p-type, and S.I.

Epitaxy-Specifi c Metrology

• In-situ refl ectance growth rate monitoring and optical pyrometry

• Double crystal X-ray diffraction (single point and mapping)

• Photoluminescence (PL) and refl ectance (R) mapping

• Surfscan (for defect counting and mapping)

• Electrochemical (Polaron) profi ling • Hall effect • Nomarski surface inspection • SEM, AUGER, SIMS, TEM, AFM, STEM

Suppliers include Canadian Photonics Fabrication Centre, Ferdinand-Braun-Institut, and Landmark


Level: PrototypingPrice: Custom pricing - Contact [email protected] to

learn about available discountsFor Industrial



© CMC Microsystems


NanoSOI technology provides nanomachining of metal andsilicon on a silicon-on-insulator (SOI) substrate.

CMC delivers the NanoSOI technology through a partnership with Applied Nanotools (ANT). NanoSOI enables researchers to rapid prototype Nanophotonics devices, to develop nanostructures as well as NanoElectroMechanical Systems (NEMS).

Features

The silicon and the deposited metal are patterned using e-beam lithography. • The NanoSOI process is conducted on a thin SOI wafer. • The buried oxide is isotropically etched to release the nano structures.• Process options:

• Silicon-On-Insulator: two thicknesses are available(145nm and 300nm).

• Metal: two materials are available(Aluminum and Chromium/Gold).

Applications

• NEMS• Nanophotonics• THz• Bio-Health

Support Services

• Design kits for MEMS Pro and Cadence • Access to CMC support engineers• Online community forum• Design rule checking services • Documentation• Packaging & assembly services• Laser-assisted cleaving

NanoSOI Process

Nanobeam resonator

Photonics crystal bandgap

Nano-electrodes

A released nano cantilever using the NanoSOI process

Silicon

Metal Handle Substrate

Buried oxide






© CMC Microsystems


SOI PhotonicsProcess Technology

Applications

• Optical communications• Sensors• Biomedical devices• Telecom and access networks

Support Services

• Technology Package for the Design Workshop dw-2000 layout and verifi cation tool, along with a user guide and detailed layout rules

• Access to CMC support engineers• Online community forum • Design rule checking services • Packaging & assembly services• Laser-assisted cleaving

Access to a passive silicon photonic IC technology

CMC’s multi-project wafer service delivers the Imec-ePIXfab SiPhotonics technology through partnership with EUROPRACTICE.

Features

• 200mm silicon-on-insulator wafers with 220nm crystalline top silicon fi lm and 2000nm buried oxide (BOX)

• 193nm deep UV lithography, enabling features down to ~120nm• Photonic wire losses of 2.5 to 3 dB/cm• Supports a wide range of planar lightwave circuits (PLCs), such as:

• 2D photonic crystals• waveguides (photonic crystal or ridge)• gratings for fi ber coupling• multiplexers (diffraction or arrayed waveguide)• ring resonators• fi lters

Image courtesy of Imec

Visit www.cmc.ca for more details on these processes and design kits, fabrication scheduling and design submission deadlines.






© CMC Microsystems

Products and Services Catalogue Prototyping | Packaging

Package Type Description

Hermetic or Vacuum packaging

Sealed atmosphere within a ceramic or metal package

Photonic packaging in a 14-pin butterfl y package

Photonic component packaging with DC/RF connection, high-precision fi bre coupling, thermal monitoring, and thermoelectric cooling

Complete/selective bond wire encapsulation

Custom wire bonding for single or multi-die applications. Complete or donut-shaped glob top to protect bond wires and the die from mechanical and environmental infl uences or to provide controlled environmental access to the die

Die-on-board Direct connections of bare dies to a substrate can be made through wire bonding

Die stacking Multiple dies can be stacked using combination of wire bond and fl ip-chip.

Others Any relevant microsystem packaging & assembly services

Package Pin Count Target Applications

DIP 40* MEMS

CFP/CQFP 24*, 44*, 80, 120 Digital, MEMS, RF, Mixed-Signal

CPGA 69*, 84*, 85*, 209* MEMS, Digital, Mixed-Signal

Die on glass Slide RF, MEMS

A full range of packaging services, backed by support fromexperienced engineers and consultation, provides researcherswith physical components for testing and building prototypes.

CMC offers access to state-of-the-art packaging and assembly capabilities for integrating multi-technology components into a microsystem, taking into account specifi c requirements for system miniaturization, signal management, environmental protection and biocompatibility.

Packaging and Assembly

Standard Package Options

* Hermetic sealing compatible

CMC Services:

• Standard packages• Special component packaging• Single or multi-die (stacked die) assembly

services• Engineering support and (global)

consultation• Custom services on a case-by-case basis

Suppliers include Advanced Coating, Corwil, CVInc, INO, Silitronics, and Spectrum Semiconductor Materials.

Multi-Technology Integration:Packaging and Assembly Services

SEM image of laser cleaved device

Image courtesy of Dr. Dileepan Joseph, University of Alberta

Package Type Description

Generic AIN Carriers

For photonic chip-on-carrier applications, optimized for semiconductor laser testing and optical waveguide device testing, compatible with the 14-pin butterfl y package.

Die bumping and fl ip chip

Solder or gold stud bumps on loose dies. Flip-chip attachment for reduced package footprint, improved electrical/thermal performance, and multi-technology integration.

Parylene Coating

For applications requiring electrical insulation or biocompatibility.

Laser-assisted cleaving

For siphotonics and silicon-based chips. SOI substrates, thin top silicon layer, facet coupling, with cleaving along vertical plane of the waveguide and singulation of specifi c area of a chip.

Custom Packaging and Assembly Sample Service List

Image courtesy of Dr. Roman Genov, University of Toronto


Level: Designer, PrototypingPrice: Custom pricing - Contact [email protected] to




© CMC Microsystems

Products and Services Catalogue Prototyping | Training

Hands-on training coupled with fabrication services provides exposure to leading-edge design methods, culminating in a working device for testing and research.

In partnership with the University of British Columbia, CMC Microsystems provides hands-on training in the design, modeling, fabrication and test of photonic integrated circuits.

There are two options for access: a graduate-level course, or a one-week workshop for those already familiar with nano-optics principles. Special pricing and discounts for travel and accommodations are available to CMC subscribers or their eligible students.

Visit the CMC training page for a detailed schedule.

Silicon Nanophotonics Fabrication Training

For information on dates and locations visit www.cmc.ca.

Services Include:

• Instruction• Use of design tools• Device fabrication• Use of test equipment• Support including discussion forum access• Lunch and refreshment breaks during onsite

session

Process Silicon-on-insulator, 220nm top Si fi lm, 2000nm buried oxide (BOX)

Feature size 193nm deep UV lithography, enabling features down to 120nm

Applications

Optical communications and sensor PICs, including:• Photonic crystals • Waveguides (photonic crystal or

ridge) • Gratings for fi ber coupling • Multiplexers (diffraction or arrayed

waveguide) • Ring resonators • Filters

Silicon Nanophotonics Courses:

Silicon Nanophotonics Fabrication Graduate Course & ePIXfab Passives Training - This course provides training in the design, fabrication, and test of photonic integrated circuits (PICs) targeting IMEC’s silicon-on-insulator (SOI) technology, available through ePIXfab.

Active Silicon Photonics Fabrication Course - This course provides an opportunity for training in the design, fabrication and test of photonic integrated circuits (PICs) targeting IME’s silicon-on-insulator (SOI) technology.

CMOS-Silicon Photonics Design Training Course - This course provides training in the design, fabrication and test of CMOS integrated circuits for opto-electronics integration targeting IBM 0.13 μm CMOS technology.

IMEC SOI Technology and Applications:


Level: PrototypingPrice: May vary by year. Visit our website for

updated pricing informationFor Industrial



© CMC Microsystems

Products and Services Catalogue Prototyping | Services

Fabrication, Assembly, Characterization and Test (FACT) Services

Custom microfabrication professional services and expertise to help realize your prototypes.

Overview:

Take your idea from a sketch to a successful prototype. Use our expertise and access to premiere MNT capability across Canada to achieve higher success rates and faster turnaround. Projects include consultation and hands-on expertise. FACT Services are available to academic and industrial researchers. Academics in Canada with a CMC Prototyping Subscription receive discounted access.

Capabilities:

We help clients realize their MEMS, microfl uidics, and general micromachining prototypes by developing and optimizing their process fl ow and assisting them in their design stage. We also offer selected capabilities in characterization, assembly and testing.

Areas of expertise include:

• Thin fi lm processing of different materials

• Bulk micromachining• Plating of different metals• ITO deposition• Gold based MEMS devices• LTCC• Nano-patterning using E-beam

Lithography• Processing of high aspect ratio

structures• PDMS processing• Polymer and glass processing• Hot embossing• Hydrophobic treatment, Parylene and

Tefl on coating• Characterization, SEM, advanced

imaging• Die thinning and TSV• Flip-chip and wire bonding• Microsurgery of chips

Learn more at www.cmc.ca/FACTServices





Prototyping | MNT

A one-stop information source about university-based microfabricationfacilities throughout Canada.

This web portal consolidates the information, guidance, and services you need to most effi ciently choose from and access more than 30 facilities.

Search for labs, processes and equipment at universities across Canada. Locate the following capabilities:

Micro-Nano TechnologiesFacilities Portal

• Mask generation • Lithography• ... and more

• Deposition of materials • Access to cleanroom

• Etching • Characterization

A proven path to a successful prototyping project

Find FacilitiesUse the Lab Locator to

fi ndthe best candidate

facilities

Apply for FundingSubmit an application to qualify for subsidized lab

fees and travel costs

Fabricate the DeviceUse the optimum lab and processes to support your

research

Locate EquipmentUse online search to

verify that labs support the equipment and

processes you need

Att end TrainingUndergo Workplace Hazardous Material

Information System and cleanroom-safety training

Submit Your ReportComplete a post-project

summary to be eligible for fi nancial assistance on

future projects

Seek Expert AdviceUse the discussion forum

to consult with other researchers and technical

experts - or contact a CMC engineer directly

Contact the LabGet in touch with the

lab manager to confi rm availability and obtain

pricing information

Get MNT Financial Assistance

Financial assistance is intended to reduce the cost that is associated with conducting custom microfabrication processes, as well as to reduce the cost impediment that may be associated with traveling to non-local facilities. A Prototyping Subscription is required. Learn more at htt p://mntportal.cmc.ca/


Level: PrototypingPrice: N/A



© CMC Microsystems



TestCMC provides cost-eff ective access to a wide range of equipment, products, and services to verify, characterize, or debug the manufactured device. Th e off erings include, but are not limited to, equipment on short-term loan for use in a researcher’s laboratory.

Review our researcher-authored library of application notes. In these documents,

students and faculty members address techniques to solve technical problems in the

test of microsystems. Search for “Application Notes” at www.cmc.ca


To get the most out of Test products and services, purchase your Designer Subscription today. Individuals who hold a Prototyping Subscription can also benefi t. Learn more at www.cmc.ca

Th e Community Space is a service for Canada’s National Design Network intended to help facilitate open discussions to share best practices, learn about cutt ing-edge technologies or foster research collaborations. Learn more at www.cmc.ca

? Did you Know?


© CMC Microsystems

Products and Services Catalogue Test | Fixtures

CFP80 Package, High Speed (RF)Interfaces a CFP80 packaged device to SMA connectors for RF testing. Frequency range DC to10 GHz.

CFP24 Package, RFInterfaces a CFP24 packaged device to SMA connectors for RF testing. Frequency range DC to10 GHz.

DIP40 Package, High VoltageInterfaces a DIP40 packaged device to header pins and is suitable for high-voltage microelectronicor MEMS device test. Frequency range DC to 10 MHz.

PGA68 Package, High VoltageInterfaces a PGA68 packaged device to header pins and is suitable for high-voltagemicroelectronic or MEMS device test. Frequency range DC to 10 MHz.

PGA84 Package, High VoltageInterfaces a PGA84 packaged device to header pins and is suitable for high-voltagemicroelectronic or MEMS device test. Frequency range DC to 10 MHz.

PGA68 Package, MEMS/FPGA Mixed Signal PrototypingInterfaces a PGA68 packaged device to header pins and BNC connectors and is suitable for high-voltage microelectronic or MEMS device test. Frequency range DC to 10 MHz.

CQFP44 Package, Clamshell SocketInterfaces a CQFP44 packaged device to header pins and incorporates a clamshell quick releasesocket. Frequency range DC to 10 MHz.

CMC Interface Board for iNEMOThis product is intended for researchers who need additional connectivity including A/D and DC/DC voltage conversion as well as a GPIO interface to iNEMO or other SPI-master devices.

CMC Interface Board for STM iNEMO Sensor Module (SPI Extension) The barrier for sensor integration is lowered by providing an interface device between your sensor and iNEMO.

Test:Device Fixturing

For more information or to order, contact [email protected].

Test fi xtures for benchtop testing and devicecharacterization maintain signal integrity, and support themost popular package footprints.


Level: Designer or PrototypingPrice: Custom pricing - Contact [email protected] to




© CMC Microsystems

Products and Services Catalogue Test | Micromirror Fixture

Preconfi gured system with position-sensing capability sets up in minutes, speeding calibration of mirror motion in a micromirror device and enabling system-level prototyping.

The Generic Micromirror Test Fixture takes the place of time-consuming trial-and-error approaches to calibrating mirror motion, and is especially valuable for designing and verifying a multicolour vector display system. It typically sets up in 20 minutes, and allows researchers to rapidly and effi ciently verify micromirror technology for proof-of-concept and system-level prototyping.

Th e fi xture furnishes:

• Red and green laser sources that can be modulated by TTL-level signals

• Fixture for holding a micromirror device and defi ning/securing its electrical connections

• Position-sensing module that detects the location of laser light in an X-Y plane for laser position detection and micromirror calibration

Key Specifi cations

Th e fi xture can be used for:• Calibration of a micromirror prototype• Creation of a micromirror feedback control

system using the CMC MEMS-FPGA platform or user-defi ned microcontroller

• Measurement of light intensity and position in optical applications

The fi xture consists of a physical/electrical interface for a user-designed micromirror chip, a laser module, and a position sensing module to analyze the chip functionality.

Open and user-customizable, the fi xture design is comprised of standard modular functional blocks with standard interfaces between those blocks.

Test:Generic Micromirror Test Fixture

To purchase this fi xture or borrow it from our equipment pool, contact [email protected]

MEMS fi xture

Package type 68-pin PGA

Connectors BNC, confi gurable to device pinout via jumpers

Lasers

Wavelength Green 532nmRed 655nm

Diameter Collimated to spot size of Ø1.6mm

Optical output power 5mW

On/Off control Via TTL-level signal up to 3 kHz

Position Sensor

Active area 10mm x 10mm

Output voltage Duolateral X-Y position sensing +-10V Light intensity sum 0 – 6V

MEMS/FPGA Platformor customized

controllerPosition sensor

Position SensingModule

Mirror & Fixture

Beamcombiner

Greenlaser

Red

lase

r

Conc

ave

lens

Fixture Module

Screen

Laser Module

Beamsplitter92/8

May also be borrowed on short-term loan


Level: Designer or PrototypingPrice: $700



© CMC Microsystems

Products and Services Catalogue Test | Equipment Loan

Leading-edge test equipment from premier manufacturersand CMC-developed test platf orms are available foracademic research and teaching to qualifi ed applicants.

From the Equipment Pool, CMC distributes equipment on short-term loan to researchers for use in their own laboratories.

Rack-and-Stack Benchtop Equipment

CMC offers discrete instruments and related resources on an as-needed basis, giving researchers access to equipment without investment in full ownership. Manufacturers include:

• Agilent• Analogic• Anritsu• Cascade Microtech• Centellax• Durham• Eppendorfer• Fluigent• Fluke• Fujitsu• GGB Industries• Hamamatsu

CMC-Developed Test Resources

To help you exploit the benefi ts of test equipment, CMC offers a range of supporting resources. This includes access to user guides, technical support from our engineers, and application notes authored by academic researchers that describe how they used the instruments.

In some cases, test pool resources are provided in pre-confi gured bundles (with documentation) to help you get started more quickly on your testing program. Examples include signal generators and amplifi ers for electrophoresis experiments, and amplifi ers and test code for characterizing the resonance properties of MEMS devices.

• Keithley• Mini Circuits• Miteq• National Instruments• Rohde & Schwarz• Sensirion• Tabor• Tektronix• Toptica

You can borrow the following:

• 10GB/s Bit Error Rate Tester• 4 and 16GHz Real Time Oscilloscopes

with sampling rates up to 80GS/s• Range of Vector Network Analyzers with

working frequency range up to 67 GHz• Spectrum Analyzers and signal analyzers

with phase noise and noise fi gure measurement applications

• Carrier Platform for Microfl uidic Research• Generic MEMS Micromirror Fixture• HV Amplifi er for DEP Applications /

Coupled Function Generator• Laser/Photonic Waveguide Chip-On-

Carrier Test Stage• Optical Probe Arm for Vertical Optical

Coupling• Laser-Induced Fluorescence Unit• PXI-based NI Intelligent DAQ FPGA

Systems• Stereozoom Viewing Microscope• Viewing Microscope with Integrated Video

Camera• ... and more

Test: Equipment Loan

For questions about the equipment pool, borrowing process, or accessing university-based test labs, contact [email protected]. To initiate an equipment loan, fi ll out an Equipment Pool Request Form at www.cmc.ca.


Level: Designer or PrototypingPrice: 3 months free access. Additional

transaction fees may apply for extended loan periods.



© CMC Microsystems

Products and Services Catalogue Test | Interfacing

Th ese devices precisely control the transition between microvolumes of reagents and samples and microfl uidicdevices. Use these components to build your experimentalsetup for the test and validation of microfl uidic systems.

CMC, a Canadian distributor for Dolomite Microfl uidics, can provide an affordable and ready supply of the essential components to interface with and control the fl ow into microfl uidic devices. Researchers can use the components to build simple systems for initial investigation, or complex systems for prototyping fully functional, working systems.

ChipsChips provide microchannel networks with geometries for a wide variety of markets and applications. These components perform functions in the microfl uidic realm that include mixing, separation, droplet formation, and serving as reaction vessels. Fabricated to the highest quality standards in glass or fused silica, they are particularly suitable for applications where properties such as reusability, chemical compatibility, optical transparency and thermal characteristics are important.

ConnectorsConnecting microfl uidic devices to macro-scale systems presents many challenges. To help ensure success, Dolomite provides several novel interconnects designed for ease of use, allowing fast and reliable connection to microfl uidic chips. They are available in a variety of confi gurations to accommodate various chip sizes and as many as 12 fl uid connections.

PumpsPumps designed specifi cally to manipulate fl uids within a microfl uidic system are designed for the extremely smooth fl ow rates, minimal pulsing, and precise control required for tasks such as droplet formation. The pumps are complemented by accessories including vessel holders and fl ow resistors.

SensorsFlow-rate sensors in various ranges handle rates as low as 0.05 - 1.5 μl/min to as high as 200 – 5000 μl/min. There are sensors that support direct digital readout, as well as sensors with a serial interface for continuous logging via computer.

Temperature ControlsDigitally controlled hotplates, with external thermocouples that are designed to hold Dolomite chips, afford extremely precise control over reaction temperatures up to +300°C.

ValvesValves that are solenoid-driven consume low power for automating fl uid handling in a microfl uidics system. A perfl uoroelastomer diaphragm and PEEK body ensure that the fl uid only comes into contact with inert materials

Dolomite Microfl uidics Products

Price Discounts, Free Shipping with your CMC SubscriptionDolomite components are available at special pricing for the academic researchcommunity. With your CMC Designer Subscription, get up to 20% discounts,plus free shipping. For more information, please contact [email protected]

(Images courtesy of Dolomite)


Level: Designer or PrototypingPrice: See website for extensive list of more than

100 parts and prices.For Industrial


Development SystemsModular platf orms accelerate the design, integration and verifi cation of hardware and soft ware blocks through to functional system prototypes. Use these development systems to explore embedded architectures, validate system function, or test devices in a system context—including for microelectronic devices integrated with MEMS, photonics or microfl uidics. Or focus on protocols and algorithms that enable functions, improve performance, and link embedded devices to larger systems.

To get the most out of Development Systems products and services, purchase your Designer Subscription today. Individuals who hold a Prototyping Subscription can also benefi t. Learn more at www.cmc.ca/Subscription.

www.cmc.ca off ers a Product Locator feature to help you fi nd development systems products across Canada. You can also fi nd information on the development systems coordinator at each university.

? Did you Know?Review our researcher-authored library

of application notes. In these documents, students and faculty members address

techniques to solve technical problems in the test of microsystems. Search for

“Application Notes” at www.cmc.ca



© CMC Microsystems

Products and Services Catalogue Development Systems | MIP

Product Overview

The Microsystems Integration Platform (MIP) is a benchtop instrument intended for multi-technology validation of thefunctionality of a micro-device in a system context. Designed to enable proof-of-concept experiments at a laboratory-based system level, the MIP effectively bridges the gap between algorithmic/architectural exploration, stimulus, andmeasurement of sensors and actuators. These Platforms have been delivered to universities across Canada and are available for academic and industrial research.

Key Platf orm Benefi ts

• Accelerates research by providing a pre-confi gured, research-ready system that works out-of-the-box; the included reference design, training and CMC confi guration support help jump-start your research and speed up improvements to your sensor or other application.

• Addresses specifi c research needs through a modular, customizable, and programmable system that users can tailor to specifi c projects and applications; technology-specifi c variants include features for MEMS, micromirror, microfl uidic, and RF-MEMS applications.

• Enables a faster path to commercialization by sourcing commercial-grade components and by compliance with commercial standards and interfaces (e.g., PXI).

MIP Confi guration

There are four variants available for the MIP confi guration: MEMS, Microfl uidics, Micromirror, and RF-MEMS. The fi rstthree variants share a common National Instruments (NI) PXI-express base, which includes:

• System controller• PXIe expansion card slots including high-end FPGA-

based DAQ, high-resolution digitizer, arbitrary waveform generator, digitalmultimeter, and high-accuracy power measurement unit

• Program environment: LabVIEW, C/C++

Microsystems Integration Platf orm (MIP)

1. MEMS variant: includes PXI-express base, imaging module, high-voltage amplifi er, and high-voltage fi xtures that provide an environment for real-time feedback loop control (analog or video-based) of MEMS devices such as accelerometers.

2. Microfl uidic variant: includes PXI-express base, imaging module, high-voltage amplifi er, fl ow pumps and fl ow meters, and interface boards or fi xture that provide an environment for Microfl uidic applications such as bio-particle tracking.

3. MEMS Micromirror variant: includes PXI-express base, high-voltage amplifi er, laser sources, position sensors and Micromirror fi xtures that provide an environment for real-time control of MEMS Micromirror devices.

4. RF-MEMS variant: includes PXI RF system with 18-slot PXI express chassis, high-voltage amplifi er, RF Vector Signal Generator (VSG), RF Vector Signal Analyzer (VSA), and RF switch modules that provide an environment for control and measurement of RF-MEMS devices operating up to 6.6 GHz RF.

The Imaging module used for the MEMS and Microfl uidic variants includes: two color cameras (2048x1088, up to 337 FPS for Camera-link camera snd 50 FPS for GigE camera), microscopic lens system (resolution 0.3 μm for MEMS and 1 μm for Microfl uidics), motorized zoom, illuminator, FPGAvideo adapter, microscope stand, camera cables, FPGA camera interface software, FPGA image processing library and reference design, zoom and lighting interface card, and zoom and lighting control software.


Level: Designer or PrototypingPrice: Included with Subscription



© CMC Microsystems

Products and Services Catalogue Development Systems | FPGA -based Platf orms

Product Overview

CMC delivers to Canadian universities a broad range of desktop systems employing Field-Programmable Gate Array (FPGA) technology for advanced system prototyping and provides an online product locator. FPGAs are a technology that allow hardware logic to be programmed and re-programmed in the fi eld or lab rather than manufactured at signifi cant expense and turnaround time at a semiconductor fab. Using hardware platforms, combined with comprehensive development environments including system-level design and automated code generation, embedded processors and software development fl ows, researchers can quickly demonstrate the commercialpotential of their research, and integrate sensor and actuator designs to create multi-technology microsystems. A range of available platforms enable research in a variety of topics, including:

• Embedded architecture exploration• High-performance custom computing and algorithm

acceleration• Advanced signal processing design• Software-defi ned radio• Microsystems component and system emulation/

verifi cation

Key Platf orm Benefi ts

• Accelerates research by providing: Feature-rich platforms for integrating and validating embedded system architectures and algorithmsAccess to a comprehensive platform design environment, including system-level design and simulation, automated code generation, software and hardware development, programming and debugging toolsReduced learning curve and faster time to research results by providing usabilitymaterials such as getting started guides, tutorials, reference designs, hands-ontraining, User Community forum and engineering technical support

• Addresses specifi c research needs through modular and programmable systems by interfacing to various application-specifi c daughter cards (e.g., analog input/output modules)

• Enables a faster path to commercialization by sourcing commercial-grade components and through compliance with commercial standards and interfaces (e.g., PCI-express)

FPGA-based DevelopmentSystems

Embedded Soft ware DvelopmentDevelopment system platform hardware is enhanced by embedded software development tools, environments and methodologies:• Cross compiling environments (e.g. compiler, linker,

debugger tool chains for Xilinx MicroBlaze and Altera Nios II Embedded processors)

• Board Support Packages (BSPs) and Application Programming Interfaces (APIs)

• Embedded and Real-time Operating System support packages (e.g., Linux)

• Methodologies providing guidelines and examples to develop software for customized hardware:o Embedded Software Development Flowo HW/SW Co-Design Methodology: Implementation from MATLAB to FPGA

Example of Embedded Development Methodology





© CMC Microsystems

Products and Services Catalogue Development Systems | FPGA -based Platf orms

Platf orms and Features

Embedded Systems Platf orm:Altera-based DE4-530: based on the Terasic DE4-530, this platform employs large design capacity Altera Stratix IV technology, a variety of standard and high-performance memory and I/O options (e.g., DDR2 SDRAM, 4x Gigabit Ethernet, PCI-express), and expansion card for multi-channel analog input (2x 14-bit, 150MSPS) and output (2x 14-bit, 250 MSPS) for embedded system development and signal processing.

Xilinx-based ML605: based on the Avnet ML605 FPGA Development Board, this platform employs Xilinx Virtex-6 FPGA technology, a variety of standard and high-performance memory and I/O options (e.g., DDR3 SDRAM, Gigabit Ethernet, PCI-express) and expansion card capability for embedded system development and signalprocessing.

Advance Processing Platf orm:BEEcube BEE3: using 4 Xilinx Virtex-5 FPGAs, 64GB DDR2 DRAM, the BEE3offers a large prototyping space for complex architecture development, emulation,hardware-based application acceleration and high-performance signal processing.System-level development tools in MATLAB/Simulink assist developers to create andpartition designs across multiple FPGAs, and generate working implementations.

BEEcube BEE4: using 4 Xilinx Virtex-6 FPGAs, up to 128GB DDR3 DRAM, the BEE4 offers expansive prototyping space for complex architecture development, emulation, hardware-based application acceleration and high-performance signal processing. System-level development tools in MATLAB/Simulink assist developers to create and partition designs across multiple FPGAs, and generate working implementations.

BEEcube miniBEE: featuring a large-capacity Xilinx Virtex-6 FPGA, up to 32GB DDR3 DRAM, and embedded i7 processor module, the miniBEE offers a rich set of features suitable for a wide range of application including high-perfomrance Digital Signal Processing (DSP), software-defi ned radio (SDR) and hardware-based application acceleration. System-level developemtn tools in MATLAB/Simulink assist developers to create designs and generate working implementations.

Resources• Technical documents and Design examples• Technical Support• User community forum• Training

FPGA-based DevelopmentSystems





© CMC Microsystems

Products and Services Catalogue Development Systems | FPGA-based Platf orms

Remote access to high-performance, quad-FPGA prototyping environment provides a virtual “hands-on” experience without the complexities of system setup and maintenance.

The BEE3 FPGA-development system from BEEcube is used by researchers at institutions worldwide such as Berkeley, CMU, Microsoft Research, MIT, Tsinghua, Imperial College, and others. CMC hosts a BEE3 system and connected design workstation in the data center, with access via remote-desktop software. Researchers in Canada are able to achieve internationally competitive outcomes at a fraction ofthe cost.

• Full hardware/software environment maintained by CMC saves time and effort of sourcing and installing, to accelerate time-to-results

• Remote accessed CAD workstation provides connection to BEE3 via serial I/O and JTAG and direct data access to FPGA system via Ethernet

• Complete system-to-FPGA environment includes MATLAB/Simulink, Xilinx ISE Design Suite, ModelSim and BEEcube Platform Studio

• Shared system delivers access at a fraction of the cost• Multiple hardware units minimize system down-time • Reference designs and tutorials jumpstart projects• Seamless upgrades to next-generation design environments and

hardware ensure a leading-edge development path• CMC engineering support includes FAQs, application notes and

community support through an online forum

The BEE3 system is suitable for research in:• Multi-core SOC design and emulation• High-performance DSP• Application acceleration

Giving researchers access to high-performance system hardware for development, the BEE3 system includes:• 4 Xilinx Virtex-5 FPGAs• 16 GB DDR2 DRAM per FPGA• High-bandwidth inter-FPGA I/O• 4 10/100/1000 Ethernet ports• Serial I/O, SD card, PCI-Express

CMC limits the number of concurrent projects to ensure that individuals have adequate system access.

The BEEcube Platform Studio comprises a complete environment for FPGA systems development.

Systems Development: VirtualAlgorithm/Architecture (VAAR) Lab

For more information or to reserve your time, contact [email protected].





© CMC Microsystems

Products and Services Catalogue Development Systems | Sensor Platf orms

Th is prototyping platf orm for a compact, low-power, wireless-enabled microsystem is available as a design fi le that you can adopt as a starting point as you develop an application-specifi c prototype ready for fi eld trial. Proprietary to CMC, the Compact Wireless Microsystem is a reference design that can be easily confi gured to meet a wide range of sensor and actuator-based microsystem applications. The modular nature of the design addresses common functionalities, while the schematics and PCB layout fi les may be altered as necessary for specifi c requirements of the target application. For demonstration, the design incorporates a motion detection module.

The platform design is based on the Texas Instruments ChipCon 2531 (CC2531), a commercially available System-on-a-Chip (SOC). This device combines the functionality of a TI 8051 microprocessor with on-board programmable fl ash memory, RAM, and a ZigBee-compliant RF transceiver with its associated ZigBee protocol engine. CMC has developed a software tool that provides an interface for developing and implementing embedded software.

Th e Compact Wireless Platf orm design fi le includes:

• Hardware user guide (ICI-228) • Schematic fi les for the system modules • Gerber fi les of the standard PCB layouts • Programming user guide (ICI-227) • System monitor software

The reference design is furnished as a series of schematic diagrams and miniaturized printed circuit board layouts, each approximately 22 x 30mm in area. The modules may be hardwired together or stacked using a plug and play backbone. A fully functional assembled system has a volume under 5 cm³.

Custom Microsystem Prototyping:Compact Wireless Platf orm

For more information and to order the Compact Wireless Platf orm, visit www.cmc.ca.

Module Function

Master processor (MPU) module Texas Instruments CC2531 System-on-Chip, 8051 8-bit core, 8KB RAM, 128KB Flash memory, ZigBee RF engine

Foundation (IDC20 Host Interface board)

20-pin header, serial port level translation to RS232, multiple power options

Power Supply Li-ion coin cell rechargeable battery or AA cells, local capacitor for burst power, boost converter

Motion 3-axis linear accelerometer and a 1-axis gyroscope, range ± 3G, resolution of 5 μG

Analog/Digital (A/D) Conversion 6-channel signal selector, 16-bit micro-power A/D, 12-bit programmable window comparator

Input/Filter Low pass fi lter and following amplifi er, 6 channels of input (0-3V)

Shield/Routing Ground plane that shields low level signals from MPU and RF signals; also includes space for rerouting of system signals

Design customization assistance is available.For more information, please contact [email protected]


Level: Designer or PrototypingPrice: $200



© CMC Microsystems

Products and Services Catalogue Development Systems | RESL

Real-time Embedded Systems Lab (RESL)

Overview

The Real-time Embedded Systems Lab (RESL) at the University of Waterloo focuses on real-time embedded software and systems that are at the intersection of software technology, embedded networking, and applied formal methods. Real-time embedded systems are characterized by their interaction with the environment through sensors and actuators, their resource-constrained platforms, and non-functional properties. The RESL is staffed by a full-time software engineer and is open to both academic and industrial use by local and visiting researchers.

Real-time Embedded Systems Laboratory Capabilities

• Safety-Critical System Development- Rapitime RVS and the RTBx1210 – On target Worst Case Execution Time (WCET) and performance analysis of safety-critical systems- Mathworks Polyspace – Static source code analysis

• Benchmarking and Performance Evaluation Services- A heterogeneous set of machines with a wide variety of architectures (ARM, PowerPC, Intel, SPARC, AMD, and Atmel) to evaluate the robustness of benchmarking applications in a reproducible manner and map software performance requirements to platform’s capabilities.

• Test and Measurement Services• Technical Consultation and Expert Advice• Proof of Concept and Rapid Prototyping• Embedded Software Development

Case Study Examples

Avionics Case Study - A shared platform to be used by researchers for testing advancements in embedded software and systems control. The case study consists of a six-rotor helicopter and a fi xed wing aircraft. Systems controls include a Real-Time Linux based autopilot complete with on-board inertial and positioning sensors and an open source ground station. The aircraft links to a hardware-in-the-loop simulator that allows for the analysis of the sensors, control laws, CPU scheduling, as well as the implementation of new techniques such as run-time monitoring and verifi cation.

Quanser Control Case Studies - Double Inverted Pendulum and Laser Beam Stabilization platforms to test the effects of dynamic software instrumentation on time-critical systems. The laser beam platform allows researchers to assess their work by measuring the changes in functional and non-functional characteristics.





© CMC Microsystems


Embedded Soft ware R&D

Development Systems | Embedded Soft ware

Embedded Soft ware and Development Systems

Development Systems are hardware and software programmable platforms that deliver a demonstration environment for users developing embedded systems. Embedded software development tools and libraries are delivered along with the various Development Systems.

• Cross Compiling Environments - GNU-based tool chains (compiler, linker, and debugger etc.) for ARM, Altera Nios II, and Xilinx Microblaze embedded processors - Board Support Packages (BSP) for the Altera DE4 FPGA development system, the Xilinx ML605 FPGA development system, the BEEcube BEE3, BEE4, and MiniBEE systems.

• Embedded Operating Systems (OS): embedded Linux for Xilinx Microblaze and Altera Nios II embedded processors, TinyOS for TI MSP430 and ATmega1281 MCUs, FreeRTOS for ARM Cortex M3

• Applications: CMC supported wireless sensor network platforms enable research and application development involving wireless and sensor technologies. These platforms include CMC developed Compact Wireless platform (TI CC2530 MCU), Shimmer (TI MSP430), MEMSIC/Crossbow IRIS (ATmega1281 MCU), ST iNEMO (ARM Cortex M3) that are delivered with wireless protocol stack, embedded OS, and software development tools.

Methodologies

Methodologies provide guidelines on the design processes with either a view of a generic fl ow or targeting to a particular design environment.• Embedded Software Development Flow• HW/SW Co-Design Methodology: Implementation from MATLAB to FPGA

Virtual Platforms enable embedded software development and verifi cation early in an embedded system design cycle. Through CMC you can access tools from leading suppliers such as Synopsys, Mentor Graphics, STMicroelectronics and Space CoDesign.

Embedded System Software Tools provide capabilities on embedded software creation, automated code generation, hardware/software co-design, processor architecture design, embedded software tool chain generation, software verifi cation and certifi cation, and hardware platform creation. Through CMC you can access tools from leading suppliers such as Xilinx, Altera, Synopsys, Mentor Graphics, Mathworks and PolySpace.

For a complete listing, visit the Design Tool pages and look for the tools marked for embedded system use.

For more information, how to access, or seeking collaborative opportunities, contact [email protected].

DocumentsCMC provides diff erent types of documentation to help you get started with tools and technolgies.

Complimentary access to a document library is available to all Subscription holders and their teams.

All CMC Subscription holders, at any level, can benefi t from downloading CMC documents. Learn more about Documents at www.cmc.ca


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© CMC Microsystems

Products and Services Catalogue Documents | Application Notes

Application Notes

CMC collaborates with researchers at Canadian universities to build a library of microsystems application notes.

The documents are intended to help extend microsystems research in Canada by describing new techniques, processes, and design tools relating to microsystems, and to help stimulate new ideas that accelerate research and development activities.

This library is an extensive collection of application notes on Embedded Systems, MEMS, Microelectronics, Microfl uidics, and Photonics. Some recently published titles include:

Th e Shimmer EMG BoardShimmer is a commercially available platform for wireless microsystem prototyping that is available in a range of confi gurations for various healthcare applications, including electromyography (EMG). This application note describes the EMG expansion board for Shimmer wireless sensor network motes and how to acquire data in MATLAB.

Using Micromachining to Integrate RF MEMS Variable Capacitors in Conventional TSMC 0.35-μm CMOS Technology This application note was developed in conjunction with Dr. Raafat Mansour, Professor, Electrical and Computer Engineering, University of Waterloo. There is a continuing demand to integrate a complete transceiver for numerous applications including various types of wireless sensor networks (e.g., patient monitoring network), and wireless implantable devices.

Real-Time Power Monitoring for Xilinx-based FPGAs (VC707 Board)This application note is intended to educate the reader about the Virtex 7 FPGA power requirements and guide users in a step by step procedure on how to monitor Voltage, Current, and Power for Virtex-7 power sources.

Extracting Models of a Capacitive or Inductive Discontinuity on Transmission Lines Using Tektronix TDS8000 OscilloscopeThis application note describes how to use the built-in functions of the Tektronix TDS8000 Digital Sampling Oscilloscope to extract approximate models of capacitive or inductive discontinuities on a transmission line.

Test and Calibration on the Temperature Sensor of the iNEMO Microsystem Using the Temptronic TP4500 Environmental Th ermal Chamber This application note describes the use of a temperature environmental test chamber (Temptronic TP4500) to test the iNEMO multi-sensor module offered by STMicroelectronics over a range of operating temperatures. The TP4500 is a thermal forcing unit available to users of the Advanced Mixed Signal Systems Laboratory at McGill University. We describe how the TP4500 may be used to calibrate the temperature sensor internal to the iNEMO platform.

Th e Application Note Library is continually updated so check back oft en for new, updated application notes.

Honoraria are available for students who create and submit Application Notes. For more information, contact [email protected]

Learn more at www.cmc.ca.



For Industrial Projects

Level: BasicPrice: Included with Subscription


© CMC Microsystems

Products and Services Catalogue Documents | User Guides

CMC provides a collection of user guides to help you get started on installing and using our products and services.

This collection contains user guides sorted by Design, Make, Test, and Development systems. Some recently published titles include:

Video and Assembly Guide for MIP Imaging SystemThe step-by-step instructions on how to install the MIP imaging hardware with PXI control system.

Sett ing up MIP GigE Imaging System (ICI-303)This user guide describes the procedures to set up and test the MIP GigE-based imaging system. Using the reference design delivered with the system as a starting point and combining with LabVIEW vision library functions, you can perform GigE-based image processing in microfl uidics and MEMS applications such as bio-particle tracking, real-time bio-cell analysis, and MEMS strobe testing based on real-time video/image processing.

Sett ing up MIP FPGA Imaging System (ICI-289) This user guide describes the procedures to set up and test the MIP FPGA-based imaging system environment. Using the reference design delivered with the system as a starting point, you can perform FPGA-based imaging processing in microfl uidics and MEMS applications such as bio-particle tracking, real-time bio-cell analysis, and MEMS strobe testing based on real-time video/imaging processing.

Other titles include: • Sensonit Design Rules and Process Steps• MEMS/FPGA Prototyping Platform• PolyMUMPs Design Handbook for MEMS Pro• Photonic Chip on Carrier Test Stage • Remote Access BEE3

Installation and User Guide: National Instruments LabVIEW (ICI-294) LabVIEW is a software tool for creating and deploying measurement and control systems. It provides an integrated environment for design, simulation, instrument control, hardware-in-the-loop verifi cation, and microsystem device characterization and validation. The software is a product of National Instruments (NI).

User Guides are continually updated so check back oft en for new, updated application notes.Learn more at www.cmc.ca.

User GuidesAcademic

SubscribersLevel: Designer or Prototyping

Price: Included with SubscriptionFor Industrial

ProjectsLevel: Basic

Price: Included with Subscription


© CMC Microsystems

Products and Services Catalogue Documents | Market Intelligence

Th ere are a number of continually updated User Guides available online. Visit www.cmc.ca

To stimulate R&D and assist with proposal activity and business development, CMC reports on the state of microsystems adoption within Canadian industry.

CMC examines sectors, technologies, and supply chains in order to stimulate R&D, strengthen arguments in research and business proposals, and link technology and people to help uncover new opportunities. This intelligence covers the economic landscape of various industries, and the role that microsystems play or can potentially play within them.

CMC’s Business & Technology Report library includes:

Fabrication Summaries that describe designs fabricated across all of the processes that CMC supports, collectively providing an overall view into the research activities of the academic community.

Supply Chain Reports that cover specifi c industries report on Canadian fi rms involved in university-industry interactions, and their role in the supply chain for products that include micro- nano technologies.

Economic Advantage Reports that reveal R&D expenditures, as well as R&D activities and opportunities related to microsystems in individual industries.

CMC Research Workshop and Conference Presentations that provide recent developments and challenges on microtechnologies and processes from industry and academia, as well as presentations from CMC-associated events.

Business & TechnologyReports

Th ese resources are available to all CMC Subscription holders and areaccessed through www.cmc.ca.

CMC Business & Technology Reports cover multi-disciplinary micro- and nano-scale research in these areas:

• Microelectronics• Microelectromechanical systems (MEMS)• Microfl uidics • Nanoelectronics • Optoelectronics• Photonics • Embedded Systems

CMC stimulates R&D activities and opportunities where advantage is gained, or can be gained, from integrated microsystems – CMC’s market intelligence reports are useful to:

• Strengthen arguments in research and business proposals• Connect with R&D collaborators• Connect with suppliers• Market your product or start-up company• Learn more about Canada’s current economic and industrial landscape


Level: Any LevelPrice: Included with Subscription

For Industrial Projects

Level: BasicPrice: Included with Subscription

CommunityProducts and services to stimulate R&D and assist individuals with business development, and to bring together the community of individuals around the globe who are involved with R&D of microsystems.

All CMC Subscription holders, at any level, can benefi t from Community. Learn more about Subscription at www.cmc.ca


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© CMC Microsystems

Products and Services Catalogue Community

As a central resource for microsystems information, CMC provides connections to help researchers across Canada and around the world fi nd each other, jumpstart projects and speed development.

CMC brings together the community of individuals around the globe who are involved with research and development of microsystems. These include individuals from:

• Academia, including faculty and administrators• Private industry, encompassing business decision-makers as well as

engineers involved in product development• Government, representing offi cials interested in fostering

microsystems as a strategic element of the Canadian economy• Not-for-profi t organizations and industry associations

The community is comprised of individuals who are involved in activities that support micro- and nano-scale research in these areas:

• Microelectronics• Microelectromechanical systems (MEMS)• Microfl uidics • Nanoelectronics • Optoelectronics• Photonics • Embedded Systems

Events Linking You to Canada’s National Design NetworkCMC supports the joint aims of the community in these ways:Community and Insights

Individuals in the National Design Networkcan discover, communicate, and connectwith each other through the CMC Communityspace. The community forums facilitate open discussion to share best practices, learnabout cutting edge research and technologies,provide feedback, and get support.

On-line: community.cmc.ca also provides a means for professionals to fi nd each other, facilitating collaboration, consulting, and partnering within the microsystems community. Individual profi les in CMC Community are searchable by names, research terms, tools, technologies, publications, and more.

Access to the CMC Community space is opento all CMC account holders, but participationand some product-specifi c pages are limitedto Subscribers.

Annual Symposium

This annual celebration of microsystems research excellence brings together Canada’s academic, industry, and government leaders with top graduate students from science and engineering communities.

• Connect with organizations, researchers and suppliers• Gain insight into our community’s research & technology development, and education & training activities• Celebrate excellence at the Annual Awards Banquet as we recognize Canada’s research talent

• Save the Date for CMC’s 2014 Symposium, October 7 – 8 at Hilton Lac Leamy in Gatineau, Quebec

CMC and Canada’s National Design Network wish to acknowledge the contributions of the following funding agencies:

Alberta Ministry of Advanced Education and Technology

British Columbia Ministry of Small Business, Technology and Economic Development -

British Columbia Knowledge Development Fund

Manitoba Ministry of Innovation, Energy and Mines - Manitoba Research and Innovation Fund

New Brunswick Innovation Foundation

Department of Business New Brunswick

University of New Brunswick

Research and Development Corporation Newfoundland and Labrador -

Industrial Research and Innovation Fund

Nova Scotia Research and Innovation Trust

Ontario Ministry of Research and Innovation -Ontario Research Fund-Research Infrastructure

Québec Ministère du Développement économique, de l’Innovation et de l’Exportation

Saskatchewan Ministry of Advanced Education, Employment and Immigration

Natural Sciences and Engineering Research Council of Canada

Canada Foundation for Innovation

Putt ing Microsystems Technology to Work - CMC SolutionsOverview of CMC Solutions

CMC Solutions is an innovative cost-sharing program aimed at supporting projects with exploratory or commercialization objectives involving microscale and/or nanoscale technologies or integrated microsystems that leads to joint R&D projects.

Projects may be initiated by academic or government researchers, or companies. Continuing assistance may be available to those who intend to commercialize project output

Advantages for participants include:

• Accelerated progress for their research-oriented or development-oriented goals: Projects will often yield intellectual property or know-how and it is expected that these will subsequently result in a benefi t to Canada, preferably including economic value creation. Clients assisted by CMC will own their IP developments arising from the project and will be offered rights to property developed by CMC at no cost. CMC expects to have rights of a non-commercial-use nature for the purpose of delivering developments to university and college users.

Advantages for the National Design Network include:

• Enhancement of the set of tools, technologies and services, and related expertise available to multiple researchers across Canada, whether in the fi elds of individual technologies (microelectronics, microfl uidics, MEMS, photonics and embedded software) or integrated Microsystems.

Learn more at www.cmc.ca/CMCSolutions

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