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PRODUCTS GUIDE
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Page 1: PRODUCTS GUIDE GUIDE Osaki Wiz Tower, 11-1, ... Electric & Mechanical Products ... Crucibles for single crystal silicon ingot pulling

PRODUCTS GUIDE

Osaki Wiz Tower, 11-1, Osaki 2-chome,Shinagawa-ku, Tokyo 141-0032, Japan

www.coorstek.co.jp

Page 2: PRODUCTS GUIDE GUIDE Osaki Wiz Tower, 11-1, ... Electric & Mechanical Products ... Crucibles for single crystal silicon ingot pulling

We make the world measurably better.

For over 100 years, CoorsTek has been perfecting the process of

engineering advanced ceramics.

We are prepared to apply expertise to the toughest engineering

challenges around the world.

Much like the materials we work with, CoorsTek is versatile and

endlessly extendible. we work with our customers to develop

tomorrow’s technology for just about

every industry in the global economy.

We don’t simply deliver high-quality products.

We partner to deliver solutions that make the world

measurably better.

Contents

Semiconductor Related Products

FPD Related Products

General Industrial Products

Automotive, Electric & Mechanical Products

Solar Cell Related Products

Bio and Medical Related Products

Main Material Line-up

• Quartz Glass Crucibles• Carbon Susceptors• SiC Wafer Boats• Photomask Substrates

• Alumina Plasma Etcher Parts• Yttria Plasma Etcher Parts• Silicon Focus Rings• Silicon Susceptors

• SiC Polishing Plates• In-line Gas Filters “CEPURE”• Vacuum-Break Filters• GAISER Wire Bonding Tools

• Large Scale Photomask Substrates

• Fused Silica Refractories• SiC Heat-resistant Structural Parts• SiC Setters & Saggers• SiC Heating Elements “TECORUNDUM”

• Quartz Carbon Heaters “QCH-HEATER”• Quartz Electrostatic Chucks “ARISTORUM ESC”• Foundry Filters “FLOW-RITE”

• Carbon Brushes• Ceramic Balls “CERBEC”

• Crucibles for solar cell manufacturing

• Ceramic Bone Substitutes

3

6

7

9

10

10

11

Page 3: PRODUCTS GUIDE GUIDE Osaki Wiz Tower, 11-1, ... Electric & Mechanical Products ... Crucibles for single crystal silicon ingot pulling

We make the world measurably better.

For over 100 years, CoorsTek has been perfecting the process of

engineering advanced ceramics.

We are prepared to apply expertise to the toughest engineering

challenges around the world.

Much like the materials we work with, CoorsTek is versatile and

endlessly extendible. we work with our customers to develop

tomorrow’s technology for just about

every industry in the global economy.

We don’t simply deliver high-quality products.

We partner to deliver solutions that make the world

measurably better.

Contents

Semiconductor Related Products

FPD Related Products

General Industrial Products

Automotive, Electric & Mechanical Products

Solar Cell Related Products

Bio and Medical Related Products

Main Material Line-up

• Quartz Glass Crucibles• Carbon Susceptors• SiC Wafer Boats• Photomask Substrates

• Alumina Plasma Etcher Parts• Yttria Plasma Etcher Parts• Silicon Focus Rings• Silicon Susceptors

• SiC Polishing Plates• In-line Gas Filters “CEPURE”• Vacuum-Break Filters• GAISER Wire Bonding Tools

• Large Scale Photomask Substrates

• Fused Silica Refractories• SiC Heat-resistant Structural Parts• SiC Setters & Saggers• SiC Heating Elements “TECORUNDUM”

• Quartz Carbon Heaters “QCH-HEATER”• Quartz Electrostatic Chucks “ARISTORUM ESC”• Foundry Filters “FLOW-RITE”

• Carbon Brushes• Ceramic Balls “CERBEC”

• Crucibles for solar cell manufacturing

• Ceramic Bone Substitutes

3

6

7

9

10

10

11

Page 4: PRODUCTS GUIDE GUIDE Osaki Wiz Tower, 11-1, ... Electric & Mechanical Products ... Crucibles for single crystal silicon ingot pulling

Quartz Glass Crucibles

APPLICATION : Crucibles for single crystal silicon ingot pullingM A T E R I A L : High-purity quartz glass

■ Better yield by higher purity and less bubble■ Longer process run by crystalline layer■ Less variation by process stability

FUNCTIONS / FEATURES

FUNCTIONS / FEATURES

FUNCTIONS / FEATURES FUNCTIONS / FEATURES

FUNCTIONS / FEATURES

FUNCTIONS / FEATURES

FUNCTIONS / FEATURES

Carbon Susceptors

APPLICATION : Wafer carriers for epitaxial growth processingM A T E R I A L : High-purity SiC coated graphite “CLEAR CARBON”

■ High purity■ Controllability of temperature distribution on wafer■ Excellent high temperature durability

SiC Wafer Boats

APPLICATION : Wafer carriers for diffusion and LP-CVD processingM A T E R I A L : High-purity silicon impregnated silicon carbide “TPSS”

■ High purity■ High temperature stability (up to 1350℃)■ Less particle generation■ Certified by major furnace manufacturers

Alumina Plasma Etcher Parts

APPLICATION : Elements for plasma etching processingM A T E R I A L : High-purity translucent alumina “SAPPHAL”

■ Extremely high purity (≧99.9%)■ Larger grain size and translucency■ Excellent electrical properties (LLT)

Photomask Substrates

APPLICATION : Photomasks for lithography processingM A T E R I A L : High-purity synthetic silica glass

■ World's most popular substrates for lithography processing, including ArF■ Superior UV transmittance■ Superior ArF laser durability■ Low birefringence

Yttria Plasma Etcher Parts

APPLICATION : Elements for plasma etching processingM A T E R I A L : High-purity yttria “EXYRIA”

■ Excellent plasma durability■ High purity■ Large size production (up to Φ550mm)

Silicon Focus Rings

APPLICATION : Focus rings for plasma etching processingM A T E R I A L : High-purity single crystal silicon

■ High purity■ Surface damage removed by acid etching■ Very low risk of particle generation in use■ Large size production (up to Φ510mm)

CoorsTek KK develops and manufactures a variety of products made of inorganic materials such as quartz glass, graphite, silicon carbide, single crystal silicon and fine ceramics, all of which are indispensable to the production of semiconductor devices. CoorsTek KK maintains a large market share for many products related to semiconductor manufacturing, a position we achieved by providing high-quality products that contribute to the higher integration and improved productivity of semiconductor devices and by utilizing our unique high-purity material and high-precision machining technologies.

SemiconductorRelated Products

SEMICONDUCTOR MANUFACTURING PROCESS

Finaltesting

AssemblyDicingWafertesting

Ionimplantaton/Sputtering

EtchingLithographyOxidation/Deposition

Epitaxialgrowth

Slicing/Polishing

Silicon ingotpulling

SEMICONDUCTOR MANUFACTURING PROCESS

Finaltesting

AssemblyDicingWafertesting

Ionimplantaton/Sputtering

EtchingLithographyOxidation/Deposition

Epitaxialgrowth

Slicing/Polishing

Silicon ingotpulling

SEMICONDUCTOR MANUFACTURING PROCESS

Finaltesting

AssemblyDicingWafertesting

Ionimplantaton/Sputtering

EtchingLithographyOxidation/Deposition

Epitaxialgrowth

Slicing/Polishing

Silicon ingotpulling

SEMICONDUCTOR MANUFACTURING PROCESS

Finaltesting

AssemblyDicingWafertesting

Ionimplantaton/Sputtering

EtchingLithographyOxidation/Deposition

Epitaxialgrowth

Slicing/Polishing

Silicon ingotpulling

SEMICONDUCTOR MANUFACTURING PROCESS

Finaltesting

AssemblyDicingWafertesting

Ionimplantaton/Sputtering

EtchingLithographyOxidation/Deposition

Epitaxialgrowth

Slicing/Polishing

Silicon ingotpulling

SEMICONDUCTOR MANUFACTURING PROCESS

Finaltesting

AssemblyDicingWafertesting

Ionimplantaton/Sputtering

EtchingLithographyOxidation/Deposition

Epitaxialgrowth

Slicing/Polishing

Silicon ingotpulling

SEMICONDUCTOR MANUFACTURING PROCESS

Finaltesting

AssemblyDicingWafertesting

Ionimplantaton/Sputtering

EtchingLithographyOxidation/Deposition

Epitaxialgrowth

Slicing/Polishing

Silicon ingotpulling

3 PRODUCTS GUIDE PRODUCTS GUIDE 4

Page 5: PRODUCTS GUIDE GUIDE Osaki Wiz Tower, 11-1, ... Electric & Mechanical Products ... Crucibles for single crystal silicon ingot pulling

Quartz Glass Crucibles

APPLICATION : Crucibles for single crystal silicon ingot pullingM A T E R I A L : High-purity quartz glass

■ Better yield by higher purity and less bubble■ Longer process run by crystalline layer■ Less variation by process stability

FUNCTIONS / FEATURES

FUNCTIONS / FEATURES

FUNCTIONS / FEATURES FUNCTIONS / FEATURES

FUNCTIONS / FEATURES

FUNCTIONS / FEATURES

FUNCTIONS / FEATURES

Carbon Susceptors

APPLICATION : Wafer carriers for epitaxial growth processingM A T E R I A L : High-purity SiC coated graphite “CLEAR CARBON”

■ High purity■ Controllability of temperature distribution on wafer■ Excellent high temperature durability

SiC Wafer Boats

APPLICATION : Wafer carriers for diffusion and LP-CVD processingM A T E R I A L : High-purity silicon impregnated silicon carbide “TPSS”

■ High purity■ High temperature stability (up to 1350℃)■ Less particle generation■ Certified by major furnace manufacturers

Alumina Plasma Etcher Parts

APPLICATION : Elements for plasma etching processingM A T E R I A L : High-purity translucent alumina “SAPPHAL”

■ Extremely high purity (≧99.9%)■ Larger grain size and translucency■ Excellent electrical properties (LLT)

Photomask Substrates

APPLICATION : Photomasks for lithography processingM A T E R I A L : High-purity synthetic silica glass

■ World's most popular substrates for lithography processing, including ArF■ Superior UV transmittance■ Superior ArF laser durability■ Low birefringence

Yttria Plasma Etcher Parts

APPLICATION : Elements for plasma etching processingM A T E R I A L : High-purity yttria “EXYRIA”

■ Excellent plasma durability■ High purity■ Large size production (up to Φ550mm)

Silicon Focus Rings

APPLICATION : Focus rings for plasma etching processingM A T E R I A L : High-purity single crystal silicon

■ High purity■ Surface damage removed by acid etching■ Very low risk of particle generation in use■ Large size production (up to Φ510mm)

CoorsTek KK develops and manufactures a variety of products made of inorganic materials such as quartz glass, graphite, silicon carbide, single crystal silicon and fine ceramics, all of which are indispensable to the production of semiconductor devices. CoorsTek KK maintains a large market share for many products related to semiconductor manufacturing, a position we achieved by providing high-quality products that contribute to the higher integration and improved productivity of semiconductor devices and by utilizing our unique high-purity material and high-precision machining technologies.

SemiconductorRelated Products

SEMICONDUCTOR MANUFACTURING PROCESS

Finaltesting

AssemblyDicingWafertesting

Ionimplantaton/Sputtering

EtchingLithographyOxidation/Deposition

Epitaxialgrowth

Slicing/Polishing

Silicon ingotpulling

SEMICONDUCTOR MANUFACTURING PROCESS

Finaltesting

AssemblyDicingWafertesting

Ionimplantaton/Sputtering

EtchingLithographyOxidation/Deposition

Epitaxialgrowth

Slicing/Polishing

Silicon ingotpulling

SEMICONDUCTOR MANUFACTURING PROCESS

Finaltesting

AssemblyDicingWafertesting

Ionimplantaton/Sputtering

EtchingLithographyOxidation/Deposition

Epitaxialgrowth

Slicing/Polishing

Silicon ingotpulling

SEMICONDUCTOR MANUFACTURING PROCESS

Finaltesting

AssemblyDicingWafertesting

Ionimplantaton/Sputtering

EtchingLithographyOxidation/Deposition

Epitaxialgrowth

Slicing/Polishing

Silicon ingotpulling

SEMICONDUCTOR MANUFACTURING PROCESS

Finaltesting

AssemblyDicingWafertesting

Ionimplantaton/Sputtering

EtchingLithographyOxidation/Deposition

Epitaxialgrowth

Slicing/Polishing

Silicon ingotpulling

SEMICONDUCTOR MANUFACTURING PROCESS

Finaltesting

AssemblyDicingWafertesting

Ionimplantaton/Sputtering

EtchingLithographyOxidation/Deposition

Epitaxialgrowth

Slicing/Polishing

Silicon ingotpulling

SEMICONDUCTOR MANUFACTURING PROCESS

Finaltesting

AssemblyDicingWafertesting

Ionimplantaton/Sputtering

EtchingLithographyOxidation/Deposition

Epitaxialgrowth

Slicing/Polishing

Silicon ingotpulling

3 PRODUCTS GUIDE PRODUCTS GUIDE 4

Page 6: PRODUCTS GUIDE GUIDE Osaki Wiz Tower, 11-1, ... Electric & Mechanical Products ... Crucibles for single crystal silicon ingot pulling

FUNCTIONS / FEATURES

FUNCTIONS / FEATURES FUNCTIONS / FEATURES

FUNCTIONS / FEATURES

FUNCTIONS / FEATURES

SiC Polishing Plates

APPLICATION : Surface plates for wafer polishingM A T E R I A L : Sintered silicon carbide “CERASIC”

■ Exclusive bonding technology■ Large size production■ Precise green body machining

Silicon Susceptors

APPLICATION : Wafer carriers/adjusters for various processingM A T E R I A L : High-purity single crystal silicon

■ High purity■ Surface damage removed by acid etching■ Very low risk of particle generation in use ■ Large size production (up to Φ510mm)

GAISER Wire Bonding Tools

APPLICATION : Wire bonding of semiconductor chipM A T E R I A L : ZTA

■ Long life capillaries and high reliability wedge tools■ A wide range of capillaries for various types of package and wire

material (gold, silver and copper)■ A variety of wedge tools for small, large, ribbon and deep access< Manufactured by CoorsTek, Inc. (USA) >

In-line Gas Filters “CEPURE”

APPLICATION : In-line gas filters for various processingM A T E R I A L : Porous alumina (filter element), stainless steel, nickel & PTFE

■ Superior gas displacement characteristics■ High corrosion resistance

Vacuum-Break Filters

APPLICATION : Diffusers for vacuum chamber (loadlock, process, etc.)M A T E R I A L : Porous alumina / Porous silica

■ Prevention of dust dispersion■ Reduction of venting time■ High corrosion resistance

Large Scale Photomask SubstratesAPPLICATION : Photomasks for LCD manufacturingM A T E R I A L : High-purity synthetic silica glass

■ Low thermal expansion■ Superior transmittance in broad wavelength spectrum■ High purity and high homogeneous■ Large size production (up to 1220x1400mm)

Due to the enlargement of flat panel displays (FPD) and the glass substrates that are one of their main components, technologies required for FPD production have been advancing. As higher technical levels have become necessary for manufacturing FPD glass substrates, CoorsTek KK’s products for FPD glass substrate manufacturing are able to meet these requirements with our unique high-purity material and high-precision machining technologies for large scale products.

FPD Related Products

FUNCTIONS / FEATURES

SEMICONDUCTOR MANUFACTURING PROCESS

Finaltesting

AssemblyDicingWafertesting

Ionimplantaton/Sputtering

EtchingLithographyOxidation/Deposition

Epitaxialgrowth

Slicing/Polishing

Silicon ingotpulling

SEMICONDUCTOR MANUFACTURING PROCESS

Finaltesting

AssemblyDicingWafertesting

Ionimplantaton/Sputtering

EtchingLithographyOxidation/Deposition

Epitaxialgrowth

Slicing/Polishing

Silicon ingotpulling

SEMICONDUCTOR MANUFACTURING PROCESS

Finaltesting

AssemblyDicingWafertesting

Ionimplantaton/Sputtering

EtchingLithographyOxidation/Deposition

Epitaxialgrowth

Slicing/Polishing

Silicon ingotpulling

SEMICONDUCTOR MANUFACTURING PROCESS

Finaltesting

AssemblyDicingWafertesting

Ionimplantaton/Sputtering

EtchingLithographyOxidation/Deposition

Epitaxialgrowth

Slicing/Polishing

Silicon ingotpulling

SEMICONDUCTOR MANUFACTURING PROCESS

Finaltesting

AssemblyDicingWafertesting

Ionimplantaton/Sputtering

EtchingLithographyOxidation/Deposition

Epitaxialgrowth

Slicing/Polishing

Silicon ingotpulling

5 PRODUCTS GUIDE PRODUCTS GUIDE 6

Page 7: PRODUCTS GUIDE GUIDE Osaki Wiz Tower, 11-1, ... Electric & Mechanical Products ... Crucibles for single crystal silicon ingot pulling

FUNCTIONS / FEATURES

FUNCTIONS / FEATURES FUNCTIONS / FEATURES

FUNCTIONS / FEATURES

FUNCTIONS / FEATURES

SiC Polishing Plates

APPLICATION : Surface plates for wafer polishingM A T E R I A L : Sintered silicon carbide “CERASIC”

■ Exclusive bonding technology■ Large size production■ Precise green body machining

Silicon Susceptors

APPLICATION : Wafer carriers/adjusters for various processingM A T E R I A L : High-purity single crystal silicon

■ High purity■ Surface damage removed by acid etching■ Very low risk of particle generation in use ■ Large size production (up to Φ510mm)

GAISER Wire Bonding Tools

APPLICATION : Wire bonding of semiconductor chipM A T E R I A L : ZTA

■ Long life capillaries and high reliability wedge tools■ A wide range of capillaries for various types of package and wire

material (gold, silver and copper)■ A variety of wedge tools for small, large, ribbon and deep access< Manufactured by CoorsTek, Inc. (USA) >

In-line Gas Filters “CEPURE”

APPLICATION : In-line gas filters for various processingM A T E R I A L : Porous alumina (filter element), stainless steel, nickel & PTFE

■ Superior gas displacement characteristics■ High corrosion resistance

Vacuum-Break Filters

APPLICATION : Diffusers for vacuum chamber (loadlock, process, etc.)M A T E R I A L : Porous alumina / Porous silica

■ Prevention of dust dispersion■ Reduction of venting time■ High corrosion resistance

Large Scale Photomask SubstratesAPPLICATION : Photomasks for LCD manufacturingM A T E R I A L : High-purity synthetic silica glass

■ Low thermal expansion■ Superior transmittance in broad wavelength spectrum■ High purity and high homogeneous■ Large size production (up to 1220x1400mm)

Due to the enlargement of flat panel displays (FPD) and the glass substrates that are one of their main components, technologies required for FPD production have been advancing. As higher technical levels have become necessary for manufacturing FPD glass substrates, CoorsTek KK’s products for FPD glass substrate manufacturing are able to meet these requirements with our unique high-purity material and high-precision machining technologies for large scale products.

FPD Related Products

FUNCTIONS / FEATURES

SEMICONDUCTOR MANUFACTURING PROCESS

Finaltesting

AssemblyDicingWafertesting

Ionimplantaton/Sputtering

EtchingLithographyOxidation/Deposition

Epitaxialgrowth

Slicing/Polishing

Silicon ingotpulling

SEMICONDUCTOR MANUFACTURING PROCESS

Finaltesting

AssemblyDicingWafertesting

Ionimplantaton/Sputtering

EtchingLithographyOxidation/Deposition

Epitaxialgrowth

Slicing/Polishing

Silicon ingotpulling

SEMICONDUCTOR MANUFACTURING PROCESS

Finaltesting

AssemblyDicingWafertesting

Ionimplantaton/Sputtering

EtchingLithographyOxidation/Deposition

Epitaxialgrowth

Slicing/Polishing

Silicon ingotpulling

SEMICONDUCTOR MANUFACTURING PROCESS

Finaltesting

AssemblyDicingWafertesting

Ionimplantaton/Sputtering

EtchingLithographyOxidation/Deposition

Epitaxialgrowth

Slicing/Polishing

Silicon ingotpulling

SEMICONDUCTOR MANUFACTURING PROCESS

Finaltesting

AssemblyDicingWafertesting

Ionimplantaton/Sputtering

EtchingLithographyOxidation/Deposition

Epitaxialgrowth

Slicing/Polishing

Silicon ingotpulling

5 PRODUCTS GUIDE PRODUCTS GUIDE 6

Page 8: PRODUCTS GUIDE GUIDE Osaki Wiz Tower, 11-1, ... Electric & Mechanical Products ... Crucibles for single crystal silicon ingot pulling

Fused Silica RefractoriesAPPLICATION : Elements of glass melting furnaceM A T E R I A L : Fused silica refractory “GLASSUN”

■ Extremely low thermal expansion■ Low thermal conductivity■ Complicated and very large size production (up to 2000x3000x200mm)

SiC Heat-resistant Structural PartsAPPLICATION : Radiant tubes, heat exchange tubes, etc.M A T E R I A L : Sintered silicon carbide “CERASIC”

■ Long size production (up to 2350mm)■ High heat resistance and thermal conductivity■ Excellent chemical and corrosion resistance■ Long life

SiC Setters & SaggersAPPLICATION : Kiln furniture for electric partsM A T E R I A L : Recrystallized silicon carbide

■ Excellent creep resistance and thermal shock resistance■ Eexcllent temperature followability caused by low heat capacity and

high thermal conductivity■ Also available with prasma spray coating

Quartz Carbon Heaters “QCH-HEATER”APPLICATION : Various rapid, clean and partial heatingM A T E R I A L : Quartz glass & carbon wire

■ High-speed heating (reduction of heating time)■ Long-life (reduction of running costs)■ Clean and non-contact source of energy

SiC Heating Elements “TECORUNDUM”APPLICATION : Various high temperature industrial heatingM A T E R I A L : Recrystallized silicon carbide

■ High temperature (up to 1400℃)■ High chemical and corrosion resistance■ Various material grades, shapes, and coatings

Quartz Electrostatic Chucks “ARISTORUM ESC”APPLICATION : Chucking for non-conductive substratesM A T E R I A L : Quartz glass & electrically conductive material

■ Chucking wafers of sapphire, quartz glass and silicon■ Quick chucking and de-chucking response: within 1 sec■ Particle free and low outgassing

Foundry Filters “FLOW-RITE”APPLICATION : Foundry filters for iron, aluminum and steelM A T E R I A L : A kind of mullite

■ Excellent hot strength■ Stable filtration performance■ Applicable to various sizes of casting, from small to large< Manufactured by CoorsTek, Inc. (USA) >

FUNCTIONS / FEATURES

FUNCTIONS / FEATURES

FUNCTIONS / FEATURES

FUNCTIONS / FEATURES

FUNCTIONS / FEATURES

FUNCTIONS / FEATURES

FUNCTIONS / FEATURES

CoorsTek KK develops and manufactures a wide range of products made of inorganic materials for use in many industries with extreme environments that require high heat resistance, corrosion resistance, abrasion resistance and/or cleanliness by using in-depth knowledge and an abundance of know-how with materials such as silicon carbide and quartz glass.

General Industrial Products

7 PRODUCTS GUIDE PRODUCTS GUIDE 8

Page 9: PRODUCTS GUIDE GUIDE Osaki Wiz Tower, 11-1, ... Electric & Mechanical Products ... Crucibles for single crystal silicon ingot pulling

Fused Silica RefractoriesAPPLICATION : Elements of glass melting furnaceM A T E R I A L : Fused silica refractory “GLASSUN”

■ Extremely low thermal expansion■ Low thermal conductivity■ Complicated and very large size production (up to 2000x3000x200mm)

SiC Heat-resistant Structural PartsAPPLICATION : Radiant tubes, heat exchange tubes, etc.M A T E R I A L : Sintered silicon carbide “CERASIC”

■ Long size production (up to 2350mm)■ High heat resistance and thermal conductivity■ Excellent chemical and corrosion resistance■ Long life

SiC Setters & SaggersAPPLICATION : Kiln furniture for electric partsM A T E R I A L : Recrystallized silicon carbide

■ Excellent creep resistance and thermal shock resistance■ Eexcllent temperature followability caused by low heat capacity and

high thermal conductivity■ Also available with prasma spray coating

Quartz Carbon Heaters “QCH-HEATER”APPLICATION : Various rapid, clean and partial heatingM A T E R I A L : Quartz glass & carbon wire

■ High-speed heating (reduction of heating time)■ Long-life (reduction of running costs)■ Clean and non-contact source of energy

SiC Heating Elements “TECORUNDUM”APPLICATION : Various high temperature industrial heatingM A T E R I A L : Recrystallized silicon carbide

■ High temperature (up to 1400℃)■ High chemical and corrosion resistance■ Various material grades, shapes, and coatings

Quartz Electrostatic Chucks “ARISTORUM ESC”APPLICATION : Chucking for non-conductive substratesM A T E R I A L : Quartz glass & electrically conductive material

■ Chucking wafers of sapphire, quartz glass and silicon■ Quick chucking and de-chucking response: within 1 sec■ Particle free and low outgassing

Foundry Filters “FLOW-RITE”APPLICATION : Foundry filters for iron, aluminum and steelM A T E R I A L : A kind of mullite

■ Excellent hot strength■ Stable filtration performance■ Applicable to various sizes of casting, from small to large< Manufactured by CoorsTek, Inc. (USA) >

FUNCTIONS / FEATURES

FUNCTIONS / FEATURES

FUNCTIONS / FEATURES

FUNCTIONS / FEATURES

FUNCTIONS / FEATURES

FUNCTIONS / FEATURES

FUNCTIONS / FEATURES

CoorsTek KK develops and manufactures a wide range of products made of inorganic materials for use in many industries with extreme environments that require high heat resistance, corrosion resistance, abrasion resistance and/or cleanliness by using in-depth knowledge and an abundance of know-how with materials such as silicon carbide and quartz glass.

General Industrial Products

7 PRODUCTS GUIDE PRODUCTS GUIDE 8

Page 10: PRODUCTS GUIDE GUIDE Osaki Wiz Tower, 11-1, ... Electric & Mechanical Products ... Crucibles for single crystal silicon ingot pulling

Carbon BrushesAPPLICATION : Brushes for DC electric motorsM A T E R I A L : Carbon & copper

■ Lead-free and silica-free■ Stable quality by high productivity manufacturing process

FUNCTIONS / FEATURES FUNCTIONS / FEATURES

FUNCTIONS / FEATURES

FUNCTIONS / FEATURES

Ceramic Balls “CERBEC”APPLICATION : High-temperature and high-speed bearingsM A T E R I A L : Silicon nitride

■ Harder and sti�er■ High corrosion and electrical resistance■ Light weight and low thermal expansion■ Smooth surface and accurate geometry< Manufactured by CoorsTek, Inc. (USA) >

Crucibles for solar cell manufacturingAPPLICATION : Crucibles for polycrystalline silicon ingot castingM A T E R I A L : Fused silica

■ High purity and low contamination■ Large size production (up to □1300x500mm)

Ceramic Bone SubstitutesAPPLICATION : Artifical bones for orthopedic surgeryM A T E R I A L : 3D-interconnected porous structure hydroxyapatite

■ New natural bone growing inside■ High biocompatibility■ Good machinability

CoorsTek KK develops and manufactures automotive, electric and mechanical products whose users require materials with special functions not realized by metal or resin parts.

Automotive, Electric &Mechanical Products

As bio and medical needs increase with a rapidly aging society, CoorsTek KK has been developing and manufacturing bio and medical related products with our advanced material and porous medium forming technology.

Bio and Medical RelatedProducts

Using our experience in products related to semiconductor manufacturing, CoorsTek KK applies in-depth knowledge of silicon melting processes and manufacturing technology in fused silica refractories to provide products for solar cell manufacturing.

Solar Cell Related Products

9 PRODUCTS GUIDE PRODUCTS GUIDE 10

Page 11: PRODUCTS GUIDE GUIDE Osaki Wiz Tower, 11-1, ... Electric & Mechanical Products ... Crucibles for single crystal silicon ingot pulling

Carbon BrushesAPPLICATION : Brushes for DC electric motorsM A T E R I A L : Carbon & copper

■ Lead-free and silica-free■ Stable quality by high productivity manufacturing process

FUNCTIONS / FEATURES FUNCTIONS / FEATURES

FUNCTIONS / FEATURES

FUNCTIONS / FEATURES

Ceramic Balls “CERBEC”APPLICATION : High-temperature and high-speed bearingsM A T E R I A L : Silicon nitride

■ Harder and sti�er■ High corrosion and electrical resistance■ Light weight and low thermal expansion■ Smooth surface and accurate geometry< Manufactured by CoorsTek, Inc. (USA) >

Crucibles for solar cell manufacturingAPPLICATION : Crucibles for polycrystalline silicon ingot castingM A T E R I A L : Fused silica

■ High purity and low contamination■ Large size production (up to □1300x500mm)

Ceramic Bone SubstitutesAPPLICATION : Artifical bones for orthopedic surgeryM A T E R I A L : 3D-interconnected porous structure hydroxyapatite

■ New natural bone growing inside■ High biocompatibility■ Good machinability

CoorsTek KK develops and manufactures automotive, electric and mechanical products whose users require materials with special functions not realized by metal or resin parts.

Automotive, Electric &Mechanical Products

As bio and medical needs increase with a rapidly aging society, CoorsTek KK has been developing and manufacturing bio and medical related products with our advanced material and porous medium forming technology.

Bio and Medical RelatedProducts

Using our experience in products related to semiconductor manufacturing, CoorsTek KK applies in-depth knowledge of silicon melting processes and manufacturing technology in fused silica refractories to provide products for solar cell manufacturing.

Solar Cell Related Products

9 PRODUCTS GUIDE PRODUCTS GUIDE 10

Page 12: PRODUCTS GUIDE GUIDE Osaki Wiz Tower, 11-1, ... Electric & Mechanical Products ... Crucibles for single crystal silicon ingot pulling

Main Material Line-up

These values are typical and should not be considered as specifications. The characteristic values may vary depending on product shape and conditions of use.

1.40

90

-

17

0.18

100Hs

-

3.2RT~450℃

-

-

-

2000(inert atmos.)

5.0x10-3

-

-

0.79

4.95

-

-

-

-

-

-

0.4

-

-

-

-

-

-

-

40

-

-

-

-

-

4.8RT~450℃

-

-

1500(inert atmos.)

-

-

1.88

40

-

10

0.12

60Hs

-

4.8RT~450℃

107

52(1000℃)

-

3000(inert atmos.)

1.1x10-3

-

-

2.52

400

-

420~460

0.21

28.6~34.7GPa(2800~3400)

3~5

4.5RT~1000℃

20~40

-

10-1~101

-

-

2.4

42

401300℃

160

-

-

-

4.3RT~1000℃

105

-

-

1500

-

-

3.15

450

4501450℃

420

0.18

23.5GPa(2300)

3.5

4.5RT~1000℃

170

55(1000℃)

450

1500

104~106

-

-

3.0

260

2801200℃

360

0.16

20.4GPa(2000)

4.0

4.2RT~1000℃

220

55(1000℃)

350

1370

10+1~10-1

-

-

2.33

~300

-

190

0.27

10.6GPa(1040)

-

3.9RT~1000℃

157

-

-

1300

2.4x104

-

-

3.9

350

-

360

0.23

16GPa(1600)

4.5

7.8RT~900℃

30

8(1000℃)

220

1500

1016

9.910GHz

1.0x10-3

10GHz

3.99

300

-

395

0.23

17.7GPa(1770)

4.0

8.0RT~900℃

35

9(1000℃)

200

1800

1017

10.110GHz

1.0x10-4

10GHz

1.95

13.1

-

-

-

-

-

0.4RT~1000℃

-

1.02(1000℃)

-

1000

-

-

-

2.2

105

149900℃

72

0.17

9.7GPa(950)

-

0.65RT~1000℃

1.4

3(900℃)(t2.0mm)

>1000

1000

1018

3.581MHz

1.5x10-4

1MHz

2.2

105

149900℃

72

0.17

9.7GPa(950)

-

0.5RT~1000℃

1.5

-

>1000

1100

1018

3.581MHz

1.5x10-4

1MHz

4.9

110

-

170

0.30

6.1GPa(600)

1.2

8.2RT~900℃

14

-

130

2000

1016

12.013.56MHz

6x10-4

13.56MHz

g/cm3

MPa

MPa

GPa

-

GPa(kgf/mm2)

(MPa・m1/2)

x10-6/K

W/(m・K)

W/(m・K)

Ω・cm

Bulk Density

Typical Products

High-purityquartz glass

High-puritysynthetic

silica glass

GLASSUNFused silicarefractory

SAPPHALHigh-puritytranslucent

alumina

ADSHigh-purity

alumina

EXYRIAHigh-purity

yttria

High-puritysingle crystal

silicon

TPSS High-purity silicon

impregnatedsilicon carbide

CERASICSintered

silicon carbide

HE766Recrystallizedsilicon carbide

Sintered boron carbide

High-puritygraphite

CLEAR CARBONHigh-purity SiCcoated graphite

CERAPHITERobust

and sturdycarbon

3D-inter-connected porous

structurehydroxyapatite

HydroxyapatiteCarbonBoron CarbideSilicon CarbideSiliconQuartz Glass/Silica Alumina Yttria

BendingStrength

ThermalConductivity

Room Temp.

High Temp.

Young's Modulus

Poisson's Ratio

Vickers Hardness

Fracture Toughness(KⅠc)

Coe�cient of ThermalExpansion

Mec

hani

cal P

rop

erti

esTh

erm

al P

rop

erti

esEl

ectr

ical

Pro

pert

ies

Room Temp.

High Temp.

Thermal ShockResistance Tc

Max. Use Temperature

Electrical VolumeResistivity

Dielectric Constant

Dielectric Loss (Tan Delta)

Quartz glasscrucibles

Photomasksubstrates

Fused silicarefractories

Alumina plasmaetcher parts

Lapping plates Yttria plasmaetcher parts

Silicon focusrings

Siliconsusceptors

SiC wafer boats

SiC processtubes

SiC heat-resistantstructural parts

SiC polishingplates

SiC setters &saggers

Blasting nozzles Carboncrucibles

Carbon heaters

Carbonsusceptors

Carbon airsliders

Ceramic bonesubstitutes

11 PRODUCTS GUIDE PRODUCTS GUIDE 12

Page 13: PRODUCTS GUIDE GUIDE Osaki Wiz Tower, 11-1, ... Electric & Mechanical Products ... Crucibles for single crystal silicon ingot pulling

Main Material Line-up

These values are typical and should not be considered as specifications. The characteristic values may vary depending on product shape and conditions of use.

1.40

90

-

17

0.18

100Hs

-

3.2RT~450℃

-

-

-

2000(inert atmos.)

5.0x10-3

-

-

0.79

4.95

-

-

-

-

-

-

0.4

-

-

-

-

-

-

-

40

-

-

-

-

-

4.8RT~450℃

-

-

1500(inert atmos.)

-

-

1.88

40

-

10

0.12

60Hs

-

4.8RT~450℃

107

52(1000℃)

-

3000(inert atmos.)

1.1x10-3

-

-

2.52

400

-

420~460

0.21

28.6~34.7GPa(2800~3400)

3~5

4.5RT~1000℃

20~40

-

10-1~101

-

-

2.4

42

401300℃

160

-

-

-

4.3RT~1000℃

105

-

-

1500

-

-

3.15

450

4501450℃

420

0.18

23.5GPa(2300)

3.5

4.5RT~1000℃

170

55(1000℃)

450

1500

104~106

-

-

3.0

260

2801200℃

360

0.16

20.4GPa(2000)

4.0

4.2RT~1000℃

220

55(1000℃)

350

1370

10+1~10-1

-

-

2.33

~300

-

190

0.27

10.6GPa(1040)

-

3.9RT~1000℃

157

-

-

1300

2.4x104

-

-

3.9

350

-

360

0.23

16GPa(1600)

4.5

7.8RT~900℃

30

8(1000℃)

220

1500

1016

9.910GHz

1.0x10-3

10GHz

3.99

300

-

395

0.23

17.7GPa(1770)

4.0

8.0RT~900℃

35

9(1000℃)

200

1800

1017

10.110GHz

1.0x10-4

10GHz

1.95

13.1

-

-

-

-

-

0.4RT~1000℃

-

1.02(1000℃)

-

1000

-

-

-

2.2

105

149900℃

72

0.17

9.7GPa(950)

-

0.65RT~1000℃

1.4

3(900℃)(t2.0mm)

>1000

1000

1018

3.581MHz

1.5x10-4

1MHz

2.2

105

149900℃

72

0.17

9.7GPa(950)

-

0.5RT~1000℃

1.5

-

>1000

1100

1018

3.581MHz

1.5x10-4

1MHz

4.9

110

-

170

0.30

6.1GPa(600)

1.2

8.2RT~900℃

14

-

130

2000

1016

12.013.56MHz

6x10-4

13.56MHz

g/cm3

MPa

MPa

GPa

-

GPa(kgf/mm2)

(MPa・m1/2)

x10-6/K

W/(m・K)

W/(m・K)

Ω・cm

Bulk Density

Typical Products

High-purityquartz glass

High-puritysynthetic

silica glass

GLASSUNFused silicarefractory

SAPPHALHigh-puritytranslucent

alumina

ADSHigh-purity

alumina

EXYRIAHigh-purity

yttria

High-puritysingle crystal

silicon

TPSS High-purity silicon

impregnatedsilicon carbide

CERASICSintered

silicon carbide

HE766Recrystallizedsilicon carbide

Sintered boron carbide

High-puritygraphite

CLEAR CARBONHigh-purity SiCcoated graphite

CERAPHITERobust

and sturdycarbon

3D-inter-connected porous

structurehydroxyapatite

HydroxyapatiteCarbonBoron CarbideSilicon CarbideSiliconQuartz Glass/Silica Alumina Yttria

BendingStrength

ThermalConductivity

Room Temp.

High Temp.

Young's Modulus

Poisson's Ratio

Vickers Hardness

Fracture Toughness(KⅠc)

Coe�cient of ThermalExpansion

Mec

hani

cal P

rop

erti

esTh

erm

al P

rop

erti

esEl

ectr

ical

Pro

pert

ies

Room Temp.

High Temp.

Thermal ShockResistance Tc

Max. Use Temperature

Electrical VolumeResistivity

Dielectric Constant

Dielectric Loss (Tan Delta)

Quartz glasscrucibles

Photomasksubstrates

Fused silicarefractories

Alumina plasmaetcher parts

Lapping plates Yttria plasmaetcher parts

Silicon focusrings

Siliconsusceptors

SiC wafer boats

SiC processtubes

SiC heat-resistantstructural parts

SiC polishingplates

SiC setters &saggers

Blasting nozzles Carboncrucibles

Carbon heaters

Carbonsusceptors

Carbon airsliders

Ceramic bonesubstitutes

11 PRODUCTS GUIDE PRODUCTS GUIDE 12

Page 14: PRODUCTS GUIDE GUIDE Osaki Wiz Tower, 11-1, ... Electric & Mechanical Products ... Crucibles for single crystal silicon ingot pulling

CoorsTek KK

Head OfficeOsaki Wiz Tower, 11-1, Ohsaki 2-chome, Shinagawa-ku, Tokyo 141-0032, JapanTEL +81-3-5437-8411 FAX +81-3-5437-7172

Oguni Facility378, Oguni-machi Oaza, Oguni-machi, Nishiokitamagun, Yamagata Prefecture 999-1351, JapanTEL +81-238-62-5902 FAX +81-238-62-5178

Hadano Facility30, Soya, Hadano City,Kanagawa Prefecture 257-8566, JapanTEL +81-463-81-1050 FAX +81-463-81-1664

Kariya Facility1, Minami-Fuji, Ogakie-cho, Kariya City,Aichi Prefecture 448-8665, JapanTEL +81-566-21-2851 FAX +81-566-21-6365

CoorsTek Sales KK (Domestic Sales Company)

Head OfficeOsaki Wiz Tower, 11-1, Ohsaki 2-chome, Shinagawa-ku, Tokyo 141-0032, JapanTEL +81-3-5437-8411 FAX +81-3-5437-7395

Overseas Subsidiaries

CoorsTek Taiwan Corp.16F-4, No. 295, Sec. 2, Kuang-Fu Road, Hsin-Chu 30017, TaiwanTEL +886-(0)3-575-1238 FAX +886-(0)3-575-1633

Chubu Branch1, Minami-Fuji, Ogakie-cho, Kariya City, Aichi Prefecture 448-8665, JapanTEL (0566)21-3507 FAX (0566)21-3152

Domestic Subsidiaries

CoorsTek Tokuyama Corporation2-1-32, Eguchi, Shunan City, Yamaguchi Prefecture 745-0862, JapanTEL+81-834-32-3400 FAX+81-834-22-5898

CoorsTek Nagasaki Corporation296, Kawatana-cho Momozugo, Higashisonogi-gun, Nagasaki Prefecture 859-3605, JapanTEL+81-956-82-3111 FAX+81-956-82-3111

Tohoku Branch5-15, Kamisugi 1-chome, Aoba-ku, Sendai City, Miyagi Prefecture 980-0011, JapanTEL +81-22-264-2241 FAX +81-22-264-2242

CoorsTek Japan, which until recently had handled product sales in Japan for CoorsTek Inc., is now “CoorsTek Sales KK” as the result of a merger that took place on July 1, 2016.

CoorsTek, Inc. (USA)Based in Colorado in the United States, CoorsTek is the world’s largest engineered ceramics manufacturer. With over 50 manufacturing bases throughout the world, CoorsTek supplies products to customers in more than 10,000 businesses across 70 countries in many fields, including the semiconductor, energy, automotive and medical industries.

Our 100 year historyThe roots of CoorsTek, Inc. and CoorsTec KK originated in the US and Japan respectively in the early 1900s. We will continue to provide our customers with Amazing Solutions for the next 100 years based on assets cultivated each company over our combined 200 years.

CoorsTek KK (Japan) CoorsTek, Inc. (USA)

1910s

1920s

1930s

1940s

1950s

1960s

1970s

1980s

1990s

2000s

2010s

1918 Toyo Fire Brick Company established (later becomes Thoshiba Refractories Co., Ltd.)

1968 Thoshiba Denko and Toshiba Refractories merge to become Toshiba Ceramics Co., Ltd.

1910 Herold China and Pottery Company established (later becomes CoorsTek, Inc. (USA))

2007 Covalent Materials Corporation established through management buyout

1928 Denki Kinyu K.K. established (later becomes Thoshiba Denko Co., Ltd.)

1923 Introduces heat-resistant ovenware products

1942 Develops isostatic press technology1938 Oguni facility built

1965 Introduces ceramic substrates for use in electronic equipment

1986 Coors Porcelain becomes Coors Ceramics

2000 Coors Ceramics changes its name to CoorsTek

2011 Acquires Saint-Gobain's advanced ceramics business2014 Acquires Covalent Materials Corporation

1972 Introduces TPSS Si-Impregnated Silicone Cabide Products

1997 Develops and markets super high-purity quartz glass

2015 Covalent Materials changes its name to CoorsTek KK

13 PRODUCTS GUIDE PRODUCTS GUIDE 14

★ Corporate Headquarters

● CoorsTek Manufacturing Facility ● CoorsTek Sales/Distribution Center

Page 15: PRODUCTS GUIDE GUIDE Osaki Wiz Tower, 11-1, ... Electric & Mechanical Products ... Crucibles for single crystal silicon ingot pulling

CoorsTek KK

Head OfficeOsaki Wiz Tower, 11-1, Ohsaki 2-chome, Shinagawa-ku, Tokyo 141-0032, JapanTEL +81-3-5437-8411 FAX +81-3-5437-7172

Oguni Facility378, Oguni-machi Oaza, Oguni-machi, Nishiokitamagun, Yamagata Prefecture 999-1351, JapanTEL +81-238-62-5902 FAX +81-238-62-5178

Hadano Facility30, Soya, Hadano City,Kanagawa Prefecture 257-8566, JapanTEL +81-463-81-1050 FAX +81-463-81-1664

Kariya Facility1, Minami-Fuji, Ogakie-cho, Kariya City,Aichi Prefecture 448-8665, JapanTEL +81-566-21-2851 FAX +81-566-21-6365

CoorsTek Sales KK (Domestic Sales Company)

Head OfficeOsaki Wiz Tower, 11-1, Ohsaki 2-chome, Shinagawa-ku, Tokyo 141-0032, JapanTEL +81-3-5437-8411 FAX +81-3-5437-7395

Overseas Subsidiaries

CoorsTek Taiwan Corp.16F-4, No. 295, Sec. 2, Kuang-Fu Road, Hsin-Chu 30017, TaiwanTEL +886-(0)3-575-1238 FAX +886-(0)3-575-1633

Chubu Branch1, Minami-Fuji, Ogakie-cho, Kariya City, Aichi Prefecture 448-8665, JapanTEL (0566)21-3507 FAX (0566)21-3152

Domestic Subsidiaries

CoorsTek Tokuyama Corporation2-1-32, Eguchi, Shunan City, Yamaguchi Prefecture 745-0862, JapanTEL+81-834-32-3400 FAX+81-834-22-5898

CoorsTek Nagasaki Corporation296, Kawatana-cho Momozugo, Higashisonogi-gun, Nagasaki Prefecture 859-3605, JapanTEL+81-956-82-3111 FAX+81-956-82-3111

Tohoku Branch5-15, Kamisugi 1-chome, Aoba-ku, Sendai City, Miyagi Prefecture 980-0011, JapanTEL +81-22-264-2241 FAX +81-22-264-2242

CoorsTek Japan, which until recently had handled product sales in Japan for CoorsTek Inc., is now “CoorsTek Sales KK” as the result of a merger that took place on July 1, 2016.

CoorsTek, Inc. (USA)Based in Colorado in the United States, CoorsTek is the world’s largest engineered ceramics manufacturer. With over 50 manufacturing bases throughout the world, CoorsTek supplies products to customers in more than 10,000 businesses across 70 countries in many fields, including the semiconductor, energy, automotive and medical industries.

Our 100 year historyThe roots of CoorsTek, Inc. and CoorsTec KK originated in the US and Japan respectively in the early 1900s. We will continue to provide our customers with Amazing Solutions for the next 100 years based on assets cultivated each company over our combined 200 years.

CoorsTek KK (Japan) CoorsTek, Inc. (USA)

1910s

1920s

1930s

1940s

1950s

1960s

1970s

1980s

1990s

2000s

2010s

1918 Toyo Fire Brick Company established (later becomes Thoshiba Refractories Co., Ltd.)

1968 Thoshiba Denko and Toshiba Refractories merge to become Toshiba Ceramics Co., Ltd.

1910 Herold China and Pottery Company established (later becomes CoorsTek, Inc. (USA))

2007 Covalent Materials Corporation established through management buyout

1928 Denki Kinyu K.K. established (later becomes Thoshiba Denko Co., Ltd.)

1923 Introduces heat-resistant ovenware products

1942 Develops isostatic press technology1938 Oguni facility built

1965 Introduces ceramic substrates for use in electronic equipment

1986 Coors Porcelain becomes Coors Ceramics

2000 Coors Ceramics changes its name to CoorsTek

2011 Acquires Saint-Gobain's advanced ceramics business2014 Acquires Covalent Materials Corporation

1972 Introduces TPSS Si-Impregnated Silicone Cabide Products

1997 Develops and markets super high-purity quartz glass

2015 Covalent Materials changes its name to CoorsTek KK

13 PRODUCTS GUIDE PRODUCTS GUIDE 14

★ Corporate Headquarters

● CoorsTek Manufacturing Facility ● CoorsTek Sales/Distribution Center

Page 16: PRODUCTS GUIDE GUIDE Osaki Wiz Tower, 11-1, ... Electric & Mechanical Products ... Crucibles for single crystal silicon ingot pulling

PRODUCTS GUIDE

Osaki Wiz Tower, 11-1, Osaki 2-chome,Shinagawa-ku, Tokyo 141-0032, Japan

www.coorstek.co.jp


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