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Progress Report since last ECFA-DESY, Prague Nov ’02 Aurore Savoy-Navarro, LPNHE-Universités de...

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Progress Report since last ECFA-DESY, Progress Report since last ECFA-DESY, Prague Nov ’02 Prague Nov ’02 Aurore Savoy-Navarro, Aurore Savoy-Navarro, LPNHE-Universités de Paris 6/IN2P3-CNRS LPNHE-Universités de Paris 6/IN2P3-CNRS Sensor & Electronics Test bench Si-Envelope CAD design progress: Si-FCH More on cooling studies & protos More on MC performance studies Work on the SiLC –PRC proposal Visit: http://lpnhe-lc.in2p3.fr J.E. Augustin, M. Baubillier, M. Berggren, W.Bertoli, B. Canton, Cl. Chapron, C. Carimalo, W.DaSilva, D. Imbault, F. Kapusta, H. Lebbolo, F. Rossel, D. Vincent, ASN. And collaboration of Geneva U, ETHZ, Peruggia U. teams
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Page 1: Progress Report since last ECFA-DESY, Prague Nov ’02 Aurore Savoy-Navarro, LPNHE-Universités de Paris 6/IN2P3-CNRS  Sensor & Electronics Test bench

Progress Report since last ECFA-DESY, Prague Nov ’02Progress Report since last ECFA-DESY, Prague Nov ’02 Aurore Savoy-Navarro,Aurore Savoy-Navarro, LPNHE-Universités de Paris 6/IN2P3-CNRSLPNHE-Universités de Paris 6/IN2P3-CNRS

Sensor & Electronics Test bench

Si-Envelope CAD design progress: Si-FCH

More on cooling studies & protos

More on MC performance studies

Work on the SiLC –PRC proposal

Visit: http://lpnhe-lc.in2p3.fr J.E. Augustin, M. Baubillier, M. Berggren, W.Bertoli, B. Canton, Cl. Chapron, C. Carimalo, W.DaSilva, D. Imbault, F. Kapusta, H. Lebbolo, F. Rossel, D. Vincent, ASN. And collaboration of Geneva U, ETHZ, Peruggia U. teams

Page 2: Progress Report since last ECFA-DESY, Prague Nov ’02 Aurore Savoy-Navarro, LPNHE-Universités de Paris 6/IN2P3-CNRS  Sensor & Electronics Test bench

1.- SENSOR & ELECTRONICS TEST BENCH1.- SENSOR & ELECTRONICS TEST BENCH

Major step forward:The prototype long ladder has been built following the AMS recipes to build long ladders: Geneva U for assembling & mounting of the individual sensors that constitutes the long ladder, ETHZurich@ CERN bonded the sensors and the VFE electronics, and also Peruggia U. + Paris-LPNHE contributions

The prototyped long ladder is a key-element for the test-benchIt enable us to start an extensive study of the characteristics both of the long microstrips and the VFE electronics linked to it; S and N evolution wrt strip and shaping time length, with temperature etc… and also testing various VFE’s=>design of new VFE This test activity is starting now at the Lab

Page 3: Progress Report since last ECFA-DESY, Prague Nov ’02 Aurore Savoy-Navarro, LPNHE-Universités de Paris 6/IN2P3-CNRS  Sensor & Electronics Test bench

Assembly procedure (AMS)

Page 4: Progress Report since last ECFA-DESY, Prague Nov ’02 Aurore Savoy-Navarro, LPNHE-Universités de Paris 6/IN2P3-CNRS  Sensor & Electronics Test bench

Assembly procedure (AMS)

Page 5: Progress Report since last ECFA-DESY, Prague Nov ’02 Aurore Savoy-Navarro, LPNHE-Universités de Paris 6/IN2P3-CNRS  Sensor & Electronics Test bench

Assembly procedure (AMS)

Page 6: Progress Report since last ECFA-DESY, Prague Nov ’02 Aurore Savoy-Navarro, LPNHE-Universités de Paris 6/IN2P3-CNRS  Sensor & Electronics Test bench

Assembly procedure (AMS)

Page 7: Progress Report since last ECFA-DESY, Prague Nov ’02 Aurore Savoy-Navarro, LPNHE-Universités de Paris 6/IN2P3-CNRS  Sensor & Electronics Test bench

Assembly procedure (AMS)

Page 8: Progress Report since last ECFA-DESY, Prague Nov ’02 Aurore Savoy-Navarro, LPNHE-Universités de Paris 6/IN2P3-CNRS  Sensor & Electronics Test bench

Assembly procedure (AMS)

Page 9: Progress Report since last ECFA-DESY, Prague Nov ’02 Aurore Savoy-Navarro, LPNHE-Universités de Paris 6/IN2P3-CNRS  Sensor & Electronics Test bench

Assembly procedure (AMS)

Page 10: Progress Report since last ECFA-DESY, Prague Nov ’02 Aurore Savoy-Navarro, LPNHE-Universités de Paris 6/IN2P3-CNRS  Sensor & Electronics Test bench

AMS-01 Silicon precision cut

The distance between the reference marks on the silicon and the edge after the cut => the precision of the cutting itself

t1 t2

l1 l2

~ 3.5 m

Page 11: Progress Report since last ECFA-DESY, Prague Nov ’02 Aurore Savoy-Navarro, LPNHE-Universités de Paris 6/IN2P3-CNRS  Sensor & Electronics Test bench

AMS-01 Silicon alignement

The residual of the ladder metrology (after gluing)

Page 12: Progress Report since last ECFA-DESY, Prague Nov ’02 Aurore Savoy-Navarro, LPNHE-Universités de Paris 6/IN2P3-CNRS  Sensor & Electronics Test bench

The Prototype ladder & VFE outputs

The p-side, 110 -RO pitch

Ladder is made of 7 AMS, 4’’ sensors: 4.1x7.2 cm2, 300 thickToday and tomorrow: first measurements of the ladder on Geneva test bench

The n-side, 220 RO pitch

A lot was learnt by ourtechnical team on thedetails of the construction of long ladder:VALUABLE for the next times (from ``handmade’’to large scale fabrication)

The leakage current ofall strips of each sensor were measured

Page 13: Progress Report since last ECFA-DESY, Prague Nov ’02 Aurore Savoy-Navarro, LPNHE-Universités de Paris 6/IN2P3-CNRS  Sensor & Electronics Test bench

The output-kapton design allows:Variable lengths: 28, 56,112, and 224 cm strip-lengthChange VFE (cutting the kapton)First tests on VA-64-hdr &VA-1(better noise perf., lowerdynamic range wrt to other VA) Next step: design of a new VFE

(in September) =>foundry Jan’04

Page 14: Progress Report since last ECFA-DESY, Prague Nov ’02 Aurore Savoy-Navarro, LPNHE-Universités de Paris 6/IN2P3-CNRS  Sensor & Electronics Test bench

2.- Progress on CAD design of the Si-envelope2.- Progress on CAD design of the Si-envelope

Detailed CATIA-based design of SET and SIT

The SET-drawerFor 5 ladders

The ladder made of 6 sensors

The honeycomb structure

Page 15: Progress Report since last ECFA-DESY, Prague Nov ’02 Aurore Savoy-Navarro, LPNHE-Universités de Paris 6/IN2P3-CNRS  Sensor & Electronics Test bench

Importance of the tracking at large angleImportance of the tracking at large angle

growing interest on the Si-FCH design growing interest on the Si-FCH design The physics interest of the large angle region is growing with thewith the increase of Ecm. Physics both standard and beyond standard (SUSY, Xdim) is givingseveral appealing scenarios that require a good measurement of tracks including down to very low angles wrt beam axis.

The LPNHE-Paris team is interested in the Si-FCH and is thus pursuying the study of the large angle region in two ways:1) Physicist’s simus (SGV and to be started: GEANT4-based simu) study of the design (XUV geometry, number of layers, long strips ? How long? etc….), and of detector performances of Si-FCH (Momentum resolution, occupancy). Details from TESLA beam needed as input info.2) CAD mechanical design studies with as drawback to 1): def of geometry DB for the Si-FCH in GEANT 4 simu.

Page 16: Progress Report since last ECFA-DESY, Prague Nov ’02 Aurore Savoy-Navarro, LPNHE-Universités de Paris 6/IN2P3-CNRS  Sensor & Electronics Test bench

Si-FCH Design & Performance studies with SGV-based Si-FCH Design & Performance studies with SGV-based simulationssimulations

4 XUV planes are presently considered. Impulsion resolution of: TPC+straw tubes (100m reso/pt) wrt TPC+Si-FCH (25m reso/pt) Si-FCH better than straw tubes for large impulsion and when the angle wrt beam increases

Low Pt region < 25 GeV/c High Pt region > 25 GeV/c

Page 17: Progress Report since last ECFA-DESY, Prague Nov ’02 Aurore Savoy-Navarro, LPNHE-Universités de Paris 6/IN2P3-CNRS  Sensor & Electronics Test bench

Evolution of the Si-FCH design: from projective to XUV Evolution of the Si-FCH design: from projective to XUV

Chicago Wkshp: Jan’02

St-Malo: April ‘02

Going from projective to XUV geometry

XUV => long strips possible thus less channels & easy to build

Projective=> short strips

Page 18: Progress Report since last ECFA-DESY, Prague Nov ’02 Aurore Savoy-Navarro, LPNHE-Universités de Paris 6/IN2P3-CNRS  Sensor & Electronics Test bench

New Si-FCH design based on long laddersNew Si-FCH design based on long ladders

Single sided designs:

{XUV}-triplet

{XXXX} + {UUUU} + {VVVV}

Double-sided (true or false) with:{X} + {UVUVUVUV}+{X}

The region of cut (if any)and around beam axismust be studied andcarefully designed toavoid dead regions

Page 19: Progress Report since last ECFA-DESY, Prague Nov ’02 Aurore Savoy-Navarro, LPNHE-Universités de Paris 6/IN2P3-CNRS  Sensor & Electronics Test bench

More on: Cooling studiesMore on: Cooling studies

Mechanical prototype

CAD dedicated simu package

Two approaches in parallel:

Page 20: Progress Report since last ECFA-DESY, Prague Nov ’02 Aurore Savoy-Navarro, LPNHE-Universités de Paris 6/IN2P3-CNRS  Sensor & Electronics Test bench

Comparisons between proto measurements and Comparisons between proto measurements and CAD simus computationsCAD simus computations

Tunning the simulations with the measurement results on the mechanical prototype

New measurements on prototype surrounding it with an epoxy structure(more stringent than reality) that mimics the honeycomb struture

Page 21: Progress Report since last ECFA-DESY, Prague Nov ’02 Aurore Savoy-Navarro, LPNHE-Universités de Paris 6/IN2P3-CNRS  Sensor & Electronics Test bench

Further progress on the simulation studiesLC-Note to be submitted in about one week

and on: http://lpnhe-lc.in2p3.fr/lcnotes

Studies are SGV-based (see presentation by M. Berggren at Simu session)Main outcomes of this present work: Study on the best geometry design for the proposed SET device: The SET detector should be made of 3 layers, with one double sided, packed as closely as possible, and with the best possible point resolution. Making the detector as thin as possible is useful but a second priority wrt previous points.Momentum resolution with TPC with or without SET (next page) Same for the Si-FCH (see some transparencies above) Hit density in SET Hit density in Forward tracking: being startedEffect of SET device on gammas Remark: Although a fast simu, SGV includes : mulitple scattering, materials, spiralling of low Pt charged tracks etc…. (see SGV Web site)

Page 22: Progress Report since last ECFA-DESY, Prague Nov ’02 Aurore Savoy-Navarro, LPNHE-Universités de Paris 6/IN2P3-CNRS  Sensor & Electronics Test bench

Low Pt range: up to 25 GeV/c High Pt range: up to 250 GeV/c

Assumptions: TPC reduced to 155cm, pt resolution = 180 mUnder these assumptions:An improvement up to 20% is observed at high momenta and,For low momenta the 2 reso curves cross at 4.5 and 1 GeV/c(tracks < 1 GeV/c do not reach the SET) => modest (<5%)deterioration between 1 and 4,5 with SET, rising up to 10% at 1.5GeV/c

1GeV/c

4.5 GeV/c

Page 23: Progress Report since last ECFA-DESY, Prague Nov ’02 Aurore Savoy-Navarro, LPNHE-Universités de Paris 6/IN2P3-CNRS  Sensor & Electronics Test bench

Setting-up of the SiLC collaboration: PRCSetting-up of the SiLC collaboration: PRC

Worldwide R&D activity for Si-tracking at the LCfrom 2003 to end 2006,

With as main objectives, generic R&D on Si-sensors ( strips, SDD, new SS-sensors)

VFE, readout and RT processing electronics Mechanics: XXXXXthin detector

Simus studies & developments Test bench, including test beams Calibration & Monitoring issues

Submission of a proposal for the next PRC: May 7th-8th

See asn’s presentation on March 31st at the International LC tracking + Muon Report VRVS Conference – NIKHEF, see tracking WebsiteAnd: http://lpnhe-lc.in2p3.fr / Click on Amsterdam31


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