PWB Product Data-Driven Analysis Using STEP AP210 An Example XAI Application Russell S. Peak Senior...

PWB Product Data-Driven Analysis Using STEP AP210

An Example XAI Application

Russell S. PeakSenior Researcher & Co-DirectorEngineering Information Systems Labeislab.gatech.edu

CALS Technology CenterGeorgia Institute of Technology

ISTPED WorkshopRoanoke VAJuly 19, 2000

Integration of Software Tools for Power Electronics Designhttp://www-rp.me.vt.edu/bohn/ISTPED/

2Engineering Information Systems Lab eislab.gatech.edu© GIT

Outline

Generalized Analysis Integration Challenges Techniques and Applications

Experiences with AP210 Summary


X-Analysis Integration (XAI)(X=Design, Mfg., etc.)

Goal:Improve product engineering process by integrating

physical behavior simulations with other life cycle models Challenges:

– Heterogeneous Transformations– Diversity: Information, Behaviors, Disciplines, Fidelity, Feature

Levels, CAD/CAE Tools, etc.– Multidirectional Associativity:

Design Analysis, Analysis Analysis One Approach:

The Multi-Representation Architecture (MRA) Initial Focus:

Automation of ubiquitous analysis for design


Analysis Integration Challenges: Heterogeneous Transformations

Heterogeneous Transformation

Homogeneous Transformation

Mentor Graphics Cadence

STEPAP210

Mentor Graphics Ansys

STEPAP210

STEPAP209??

DesignModel A

DesignModel B

DesignModel A

AnalysisModel A


Analysis Integration Challenges:

Information Diversity

EnvironmentalConditions Specification

Semantics

Idealizations

“Manufacturable”Description

“Analyzable”Description

“PWB shouldhave low bow & twist”

“Warpage < 7.5% whenboard is cooled from lamination to 25oC”

laminationtemperature =

200oC

B

STEPAP220

STEPAP210


Diverse Analysis Disciplines

Thermal

Thermomechanical

Fatigue

Vibration

Electromagnetic

Electrical

PWA 95145

U101

L101 T102

Q105

T101

Q104

R101

CR102

C102

C203 CR154 CR152

R163 CR151 CR101

C104

C103

R109 R110

Q101 Q102 C120

CR133

C153

C146 C147 C106

C111

C112

R230 R232 R233

R102 Q103

U107

U108

U103

U104

U109

U110

U105

U106

C123

R106 R107 R108

R111 R112 R113 R114 R115

R231

C118

x y

PWB 96510

J101

U102

N


Multi-Fidelity IdealizationsSame Mode; Idealized Geometries of Varying Dimension

inboard beam

Design Model (MCAD) Analysis Models (MCAE)

1D Beam/Stick Model

3D Continuum/Brick Model

flap support assembly

Mode (Behavior) = Deformation


e

se

tr

Pf

02

21

e

be

ht

PCf

),,( 13 hbrfK

Missing Today:Explicit Design-Analysis Associativity

Analysis Model (with Idealized Features)

Detailed Design Model

Channel Fitting Analysis

“It is no secret that CAD models are driving more of today’s product development processes ... With the growing number of design tools on the market, however, the interoperability gap with downstream applications, such as finite element analysis, is a very real problem. As a result, CAD models are being re-created at unprecedented levels.” Ansys/ITI press Release, July 6 1999

http://www.ansys.com/webdocs/VisitAnsys/CorpInfo/PR/pr-060799.html

idealizations

No explicit

fine-grained

CAD-CAE

associativity

inconsisten

cy littleautomation

littleknowledge capture


X-Analysis Integration TechniquesMulti-Representation Architecture (MRA)

1 Solution Method Model

ABB SMM

2 Analysis Building Block

4 Context-Based Analysis Model3

SMMABB

APM ABB

CBAM

APM

Design Tools Solution Tools

Printed Wiring Assembly (PWA)

Solder Joint

Component

PWB

body3body2

body1

body4

T0

Printed Wiring Board (PWB)

SolderJoint

Component

AnalyzableProduct Model

I n f o r m a l A s s o c i a t i v i t y D i a g r a m

C o n s t r a i n t S c h e m a t i c ( I n f o r m a t i o n M o d e l )

P l a n e S t r a i n B o d i e s S y s t e m

P W A C o m p o n e n t O c c u r r e n c e

CL

1

m a t e r i a l ,E( , )g e o m e t r y

b o d y

p l a n e s t r a i n b o d y , i = 1 . . . 4P W B

S o l d e rJ o i n t

E p o x y

C o m p o n e n tb a s e : A l u m i n a

c o r e : F R 4

S o l d e r J o i n t P l a n e S t r a i n M o d e l

t o t a l h e i g h t , h

l i n e a r - e l a s t i c m o d e l

A P M A B B

3 A P M 4 C B A M

2 A B Bc

4b o d y 3b o d y

2b o d y

1h oT

p r i m a r y s t r u c t u r a l m a t e r i a l

ii

i

1 S M M

D e s i g n M o d e l A n a l y s i s M o d e l

A B B S M M

s o l d e rs o l d e r j o i n t

p w b

c o m p o n e n t

1 . 2 5

d e f o r m a t i o n m o d e l

t o t a l h e i g h t

d e t a i l e d s h a p e

r e c t a n g l e

[ 1 . 2 ]

[ 1 . 1 ]

a v e r a g e

[ 2 . 2 ]

[ 2 . 1 ]

cT c

T s

i n t e r - s o l d e r j o i n t d i s t a n c ea p p r o x i m a t e m a x i m u m

s j

L s

p r i m a r y s t r u c t u r a l m a t e r i a l

t o t a l t h i c k n e s s


P l a n e S t r a i n

g e o m e t r y m o d e l 3

a

s t r e s s - s t r a i nm o d e l 1



B o d i e s S y s t e m

x y , e x t r e m e , 3

T 2

L 1

T 1

T 0

L 2

h 1

h 2

T 3

T s j

h s

h c

L c

x y , e x t r e m e , s jb i l i n e a r - e l a s t o p l a s t i c m o d e l


p r i m a r y s t r u c t u r a l m a t e r i a l l i n e a r - e l a s t i c m o d e l

c o m p o n e n to c c u r r e n c e

s o l d e r j o i n ts h e a r s t r a i nr a n g e

[ 1 . 2 ]

[ 1 . 1 ]l e n g t h 2 +

3 A P M 2 A B B

Explicit Design-Analysis Associativity

Analysis Module Creation Methodology

Constrained Objects (COBs)

ProductModel Selected Module

Analysis Module Catalogs

MCAD

ECAD

Analysis Procedures

CommercialAnalysis Tools

Ansys

Abaqus

Solder Joint Deformation Model

Idealization/Defeaturization

CommercialDesign Tools

PWB

Solder Joint

Component

APM CBAM ABB SMM

Routine Analysis(Module Usage)

Routinization(Module Creation)

CAE

Physical Behavior Research,Know-How, Design Handbooks, ...


Diverse Analysis Integration Projects

Team Integrated Electronic Response (TIGER)– Sponsor: Defense Advanced Research Prog. Admin. (DARPA)

(SCRA subcontract)– Domain: PWA/B thermomechanical analysis

Product Data-Driven Analysis in a Missile Supply Chain (ProAM)– Sponsor: U. S. DoD JECPO National ECRC Program– Stakeholder: U. S. Army Missile Command (AMCOM)– Domain: PWA/B thermomechanical analysis

Design-Analysis Associativity Technology for PSI (PSI-DANTE)– Sponsor: Boeing– Domain: Structural analysis

Design-Analysis Integration Research for Electronic Packaging– Sponsor: Shinko Electric– Domain: Chip package thermal resistance analysis

AP210Usage

AP210Usage

PotentialAP210Usage


Flexible High Diversity Design-Analysis IntegrationTutorial Examples: Flap Link (Mechanical/Structural Analysis)

A n a ly s is M o d u le s (C B A M s ) o f D iv e rs e M o d e & F id e lity

M C A D T o o ls

M a te r ia ls D B

y

xPP

E , A

LL e ff

,

L

F E A A n sys

A b a q u s *

C A T IA E lfin i*

M S C N a stra n *

M S C P a tra n *

G e n e ra l M a thM a th em a tica

M a tla b *

M a th C A D *

A n a ly z a b le P ro d u c t M o d e l

X a iT o o ls

X a iT o o ls

E x te n s io n

T o rs io n 1 D

1 D

M o d u la r , R e u s a b leT e m p la te L ib ra r ie s

ID E A S * , P ro /E * , C A T IA

temperature change,T

material model

temperature, T

reference temperature, To

cte,

youngs modulus, E

force, F

area, A stress,

undeformed length, Lo

strain,

total elongation,L

length, L

start, x1

end, x2

mv6

mv5

smv1

mv1mv4

E

One D LinearElastic Model

(no shear)

T

e

t

thermal strain, t

elastic strain, e

mv3

mv2

x

FF

E, A,

LLo

T, ,

yL

r1

12 xxL

r2

oLLL

r4

A

F

sr1

oTTT

r3L

L

m ate ria l

e ffec tive le ngth, L e f f

de form a tion m ode l

line ar e las tic m ode l

L o

T ors iona l R od

G

J

r

2

1

sh ear m odu lus , G

cross section:e ffec tive r ing po lar m o m e nt o f ine rtia , J

al1

a l3

a l2 a

linkag e

m ode : shaft tors ion

co ndit ion re action

t s 1

A

S le e v e 1

A ts 2

d s 2

d s 1

S le e v e 2

L

S h a ft

L e f f

s

T

ou ter ra d ius , ro al2 b

stress m os m ode l

a llo w a ble stress

tw ist m os m ode l

M arg in o f S afety(> case )

a llo w a b le

a c tu a l

M S

M arg in o f S afety(> case )

a llo w a b le

a c tu a l

M S

allo w a bletw ist

A n a ly s is T o o ls

* = I te m n o t y e t a v a ila b le in to o lk it (a ll o th e rs h a v e w o rk in g e x a m p le s)

D e s ig n T o o ls

2 D ,3 D *


Analysis Tools

0.4375 in

0.5240 in

0.0000 in

2.440 in

1.267 in

0.307 in

0.5 in

0.310 in

2.088 in

1.770 in

67000 psi

65000 psi

57000 psi

52000 psi

39000 psi

0.067 in/in

0.030 in/in

5960 Ibs

1

10000000 psi

9.17

5.11

9.77

rear spar fitting attach point

BLE7K18

2G7T12U (Detent 0, Fairing Condition 1)

L29 -300

Outboard TE Flap, Support No 2;Inboard Beam, 123L4567

Bulkhead Fitting Joint

Program

Part

Feature

Channel FittingStatic Strength Analysis

Template

1 of 1Dataset

strength model

r1

e

b

h

tb

te

Pu

Ftu

E

r2

r0

a

FtuLT

Fty

FtyLT

epuLT

tw

MSwall

epu

jm

MSepb

MSeps

Channel FittingStatic Strength Analysis

Fsu

IAS FunctionRef D6-81766

end pad

base

material

wall

analysis context

mode: (ultimate static strength)

condition:

heuristic: overall fitting factor, Jm

bolt

fitting

headradius, r1

hole radius, ro

width, b

eccentricity, e

thickness, teheight, h

radius, r2

thickness, tb

hole

thickness, twangled height, a

max allowable ultimate stress,

allowable ultimate long transverse stress,

max allowable yield stress,

max allowable long transverse stress,

max allowable shear stress,

plastic ultimate strain,

plastic ultimate strain long transverse,

young modulus of elasticity,

load, Pu

Ftu

Fty

FtyLT

Fsu

epu

epuLT

E

FtuLT

product structure (channel fitting joint)

Flexible High Diversity Design-Analysis Integration Aerospace Examples:

“Bike Frame” / Flap Support Inboard Beam

Analysis Modules (CBAMs) of Diverse Feature:Mode, & Fidelity

Design Tools

Materials DBFEA

Elfini*MATDB-like

Analyzable Product Model

XaiTools

XaiTools

Fitting:Bending/Shear

3D

1.5D

Modular, ReusableTemplate Libraries

MCAD ToolsCATIA

Lug:Axial/Oblique; Ultimate/Shear

1.5D

Assembly:Ultimate/

FailSafe/Fatigue*

* = Item not yet available in toolkit (all others have working examples)

diagonal brace lug jointj = top

0.7500 in

0.35 in

0.7500 in

1.6000 in

2

0.7433

14.686 K

2.40

4.317 K

8.633 K

k = norm

Max. torque brake settingdetent 30, 2=3.5º

7050-T7452, MS 7-214

67 Ksi

L29 -300

Outboard TE Flap, Support No 2;Inboard Beam, 123L4567

Diagonal Brace Lug Joint

Program

Part

Feature

Lug JointAxial Ultimate Strength Model

Template

j = top lugk = normal diameter (1 of 4)

Dataset

material

deformation model

max allowable ultimate stress, FtuL

effective width, W

analysis context

objective

mode (ultimate static strength)

condition

estimated axial ultimate strength

Margin of Safety(> case)

allowable

actual

MS

normal diameter, Dnorm

thickness, t

edge margin, e

Plug joint

size,n

lugs

lugj hole

diameters

product structure (lug joint)

r1

n

P jointlug

L [ j:1,n ]

Plug

L [ k]Dk

oversize diameter, Dover

D

PaxuW

e

t

Ftuax

Kaxu

Lug Axial UltimateStrength Model

BDM 6630

Fasteners DB

FASTDB-like

General Math Mathematica

In-HouseCodes

Image API(CATGEO)


Flexible High Diversity Design-Analysis Integration

Electronic Packaging Examples: Chip Packages/Mounting (Project with Shinko Electric)

EBGA, PBGA, QFP

CuGround

PKG

Chip

Analysis Modules (CBAMs) of Diverse Mode & Fidelity

FEAAnsys

General MathMathematica


XaiTools

XaiToolsChipPackage

ThermalResistance

3D

Modular, ReusableTemplate Librariestemperature change,T

material model

temperature, T


cte,

youngs modulus, E

force, F

area, A stress,


strain,

total elongation,L

length, L

start, x1

end, x2

mv6

mv5

smv1

mv1mv4

E

One D LinearElastic Model(no shear)

T

e

t

thermal strain, t

elastic strain, e

mv3

mv2

x

FF

E, A,

LLo

T, ,

yL

r1

12 xxL

r2

oLLL

r4

A

F

sr1

oTTT

r3L

L

m a t e r i a l

e f f e c t i v e l e n g t h , L e f f


l i n e a r e l a s t i c m o d e l

L o

T o r s i o n a l R o d

G

J

r

2

1

s h e a r m o d u l u s , G

c r o s s s e c t i o n :e f f e c t i v e r i n g p o l a r m o m e n t o f i n e r t i a , J

a l 1

a l 3

a l 2 a

l i n k a g e

m o d e : s h a f t t o r s i o n

c o n d i t i o n r e a c t i o n

t s 1

A

S l e e v e 1

A t s 2

d s 2

d s 1

S l e e v e 2

L

S h a f t

L e f f

s

T

o u t e r r a d i u s , r o a l 2 b

s t r e s s m o s m o d e l

a l l o w a b l e s t r e s s

t w i s t m o s m o d e l

M a r g i n o f S a f e t y( > c a s e )

a l l o w a b l e

a c t u a l

M S


a l l o w a b l e

a c t u a l

M S

a l l o w a b l et w i s t Analysis Tools

Design Tools

PWB DB

Materials DB*

Prelim/APM Design ToolXaiTools ChipPackage

ThermalStress

Basic3D**

** = Demonstration module

BasicDocumentation

AutomationAuthoringMS Excel


Outline

Generalized Analysis Integration Challenges Techniques and Applications

Experiences with AP210 Summary


ProAM Design-Analysis IntegrationElectronic Packaging Examples: PWA/B

Analysis Modules (CBAMs) of Diverse Mode & Fidelity

Design Tools

Laminates DB

FEA Ansys

General MathMathematica


XaiToolsPWA-B

XaiToolsPWA-B

Solder JointDeformation*

PTHDeformation & Fatigue**

1D,2D

1D,2D,3D

Modular, ReusableTemplate Libraries

ECAD Tools Mentor Graphics,

Accel*

temperature change,T

material model

temperature, T


cte,

youngs modulus, E

force, F

area, A stress,


strain,

total elongation,L

length, L

start, x1

end, x2

mv6

mv5

smv1

mv1mv4

E

One D LinearElastic Model(no shear)

T

e

t

thermal strain, t

elastic strain, e

mv3

mv2

x

FF

E, A,

LLo

T, ,

yL

r1

12 xxL

r2

oLLL

r4

A

F

sr1

oTTT

r3L

L

m a t e r i a l

e f f e c t i v e l e n g t h , L e f f


l i n e a r e l a s t i c m o d e l

L o

T o r s i o n a l R o d

G

J

r

2

1

s h e a r m o d u l u s , G

c r o s s s e c t i o n :e f f e c t i v e r i n g p o l a r m o m e n t o f i n e r t i a , J

a l 1

a l 3

a l 2 a

l i n k a g e

m o d e : s h a f t t o r s i o n

c o n d i t i o n r e a c t i o n

t s 1

A

S l e e v e 1

A t s 2

d s 2

d s 1

S l e e v e 2

L

S h a f t

L e f f

s

T

o u t e r r a d i u s , r o a l 2 b

s t r e s s m o s m o d e l

a l l o w a b l e s t r e s s

t w i s t m o s m o d e l


a l l o w a b l e

a c t u a l

M S


a l l o w a b l e

a c t u a l

M S

a l l o w a b l et w i s t Analysis Tools

PWBWarpage

1D,2D

Materials DB

PWB Layup ToolXaiTools PWA-B

STEP AP210‡ GenCAM**,

PDIF*

‡ AP210 DIS WD1.7 * = Item not yet available in toolkit (all others have working examples) ** = Item available via U-Engineer.com


Information Requirementsof TIGER/ProAM Analysis Modules

PWB Warpage(Formula-Based)

PWB Warpage(FEA-Based)

Solder-JointDeformation

PWAWarpage

PTHDeformation

Detailed PWB Layup

Layer Functions

PWB Outline

Package Geometry

Package Materials

Lead/Termination Shape

Lead/Termination Material

Component Location

Solder Joint Shape

Solder Joint Material

PTH Geometry

PTH Plating Material


Analyzable Product Model (APM) Technique

Combine informationand add idealizations

Use idealizations

Solder-Joint Deformation Model

PWB Warpage Model

PWA Deformation Model

Analysis Models

Analyzable Product Model(APM)

Design Representations

1 Oz. Cu

1 Oz. Cu

1 Oz. Cu

1 Oz. CuM100P1P11184

3 x 1080

3 x 1080

Detailed component

PWA Layout

PWB Design

Ec , c , c

EB , B , B

EB , B , B

ES , S , S

Ec , c , c

T

T

T

EB , B , B


CAD-APM Integration TechniqueAnalyzable

Product Model

Mapping

CustomSchema DN

SourceFiles Target

File

MappingTool

Analyzable-

ProductDatabase

Analysis Application

A1

Analysis Application

AM

Design Application

D1

TranslatorD1-to-STEP

STEP File D1Design File D1

CustomSchema D1 STEP Schema

Design Application

DN

TranslatorDN-to-STEP

Design File DN STEP File DN

STEP Schema

Design

1

Translation

2

3

Analysis

4

MappingDefinitionLanguage


characterized_definition

AP210 Board Outline Information

shape_definition_representation product_definition_shape

geometric_curve_set

property_definition_representation

shape_aspect

inter_stratum_feature

curve

bounded_curve

polyline trimmed_curvecartesian_point

geometric_set_select

shape_definition

trimming_select

geometrically_bounded_2d_wireframe_shape_representation

REAL

definition definition

used_representation

items[0] elements

S[ 0 : ? ]

points

L[ 2 : ? ]L[ 1 : 3 ]

coordinates

trim_2

trim_1

S[ 1 : 2 ]

S[ 1 : 2 ]

‘board outline’

‘PCB outline’

name

name

Board outlinecoordinates

curve


capacitorresistor

surface mountpackage

discretecomponent

integratedcomponent

pwb copperfoil

plated throughpassage

through-holepackage

location

PWA-B APM in TIGER/ProAM Projects

electricalcomponent

assembly

pwa

part

pwbfeature

componentoccurrence

solidmaterial

pwb coppercladded laminate

pwb prepregset

electricalpackage

pwb

pwblayer

pwbpassage

linear elasticmodel

solderjoint

leads

(partial)


AP210 - APM Mappings

curve

bounded_curve

polyline trimmed_curvecartesian_point

trimming_select

REALpoints

L[ 2 : ? ]L[ 1 : 3 ]

coordinates

trim_2

trim_1S[ 1 : 2 ]

S[ 1 : 2 ]

pwbxy_coordinateREAL outline

L[ 1 : ? ]

x

y

Source schema (AP210)

Target schema (APM)Mappingassignment

curve


Iterative Design & AnalysisPWB Warpage

AnalyzableProduct Model

PWB Layup Design Tool

1 Oz. Cu

1 Oz. Cu

1 Oz. Cu

1 Oz. Cu

2 Oz. Cu

2 Oz. CuTetra GF

Tetra GF

3 x 1080

3 x 1080

2 x 2116

2D Plane Strain Model

b L T

t

2

Detailed FEA Check

bi i i

i

w y

t w

/ 2

1D Thermal Bending Model

LayupRe-design

PWB Warpage Modules

Quick Formula-based Check


PWB Warpage Modulesa.k.a. CBAMs: COB-based analysis templates

total_thicknesspwa

layup layers[0]

layers[1]

layers[2]

TOTAL

CU1T

CU2T

POLYT

PREPREGT

TETRA1T

EXCU

ALPXCU

EXEPGL

ALPXEGL

TO

deformation model

ParameterizedFEA Model

ux mos model

Margin of Safety(> case)

allowable

actual

MS

UX

condition

UY

SX

associated_pwb

nominal_thickness

prepregs[0] nominal_thickness

top_copper_layer nominal_thickness

related_core nominal_thickness

prepregs[0] nominal_thicknesslayers[3]

primary_structure_material linear_elastic_model E

cte

primary_structure_material linear_elastic_model E

cte

reference temperature

temperatureDELTAT

APM ABB

SMM

deformation model

Thermal Bending Beam

L

b

T

Treference

t

T

total diagonalassociated_pwb

total thickness

coefficient of thermal bending

al1

al2

al6

al3

t

TLb

2

warpage

wrapage mos model

allowable

MSactual

Marginof Safety

associated condition

al5

al4

temperature

reference temperature

pwa

APM

ABBPWB Thermal Bending Model (1D formula-based)

PWB Plane Strain Model (2D formula-based)


Experiences Using AP210 to Drive Analysis

AP210 originally geared toward manufacturing, but good source for analysis too.

Some information not available:– in AP210 (e.g., detailed PTH geometry)*

– in typical ECAD database (e.g., detailed PWB layup)

Some design performed by supply chain members– E.g., detailed PWB layup

– Need mechanism to add such info to a common repository

Need to coordinate unique identifiers in AP210 data with data from other sources (e.g., part numbers in laminate database)

*Note: Used c.1997 AP210 DIS WD1.7. The latest AP210 version may now support such information.


Design-Analysis IntegrationUsing STEP and APMs

Domain-specific models (AP210, AP207) are semantically richer than geometry-focused ones (and therefore easier to use for analysis).– Trend toward feature-based, object-oriented CAD

– “Smart product models”

Analysis has insatiable information appetite (multi-fidelity)– A given product model cannot support every conceivable future

idealization need.

– APMs enable additions as needed

Companies can implement mix of company PMs and APMs (along with standard PMs) to support design-analysis requirements for a given set of analysis modules.– Analysis module information needs dictate APM content


XAI Summary Emphasis on X-analysis integration (XAI) for design reuse (DAI,SBD) Multi-Representation Architecture (MRA)

– Addressing fundamental XAI/DAI issues» Explicit CAD-CAE associativity: multi-fidelity, multi-directional, fine-grained

– General methodology --> Flexibility & broad application Research advances & applications

– Product data-driven analysis (STEP AP210, GenCAM, etc.)– Internet-based engineering service bureau (ESB) techniques– Object techniques for next-generation aerospace analysis systems– FEA modeling time reduction in pilot tests (chip packages):

> 10:1 (days/hours to minutes)

Improved Simulation-Based Designs Tools and development services

– Analysis integration toolkit: XaiTools™ and applications– Pilot commercial ESB: U-Engineer.com– Company-tailored engineering information system solutions

Motivated by industry & government collaboration


For Further Information ... EIS Lab web site: http://eislab.gatech.edu/

– Publications, project overviews, tools, etc.– See: Publications DAI/XAI Suggested Starting Points

X-Analysis Integration (XAI) Technologyhttp://eislab.gatech.edu/pubs/reports/EL002/

– Regarding AP210 usage, see especially:» Tamburini, D. R.; Peak, R. S.; Fulton, R. E. (1997) Driving PWA Thermomechanical Analysis from

STEP AP210 Product Models. 1997 ASME Intl. Mech. Engr. Congress & Expo., Dallas. http://eislab.gatech.edu/pubs/conferences/wam97-tamburini/

» Product Data Driven Analysis in a Missile Supply Chain, http://eislab.gatech.edu/projects/proam/

XaiTools™ home page: http://eislab.gatech.edu/tools/XaiTools/

Pilot commercial ESB: http://www.u-engineer.com/– Internet-based self-serve analysis– Analysis module catalog for electronic packaging– Highly automated front-ends to general FEA & math tools


Nomenclature ABB-SMM transformation idealization relation between design and analysis attributes APM-ABB associativity linkage indicating usage of one or more i

ABB analysis building blockAMCOM U. S. Army Aviation and Missile CommandAPM analyzable product modelCAD computer aided designCAE computer aided engineeringCBAM context-based analysis modelCOB constrained objectCOI constrained object instanceCOS constrained object structureCORBA common ORB architectureDAI design-analysis integrationEIS engineering information systemsESB engineering service bureauFEA finite element analysisFTT fixed topology templateGUI graphical user interfaceIIOP Internet inter-ORB protocolMRA multi-representation architectureORB object request brokerOMG Object Management Group, www.omg.comPWA printed wiring assembly (a PWB populated with components)PWB printed wiring boardSBD simulation-based designSBE simulation-based engineeringSME small-to-medium sized enterprise (small business)SMM solution method modelProAM Product Data-Driven Analysis in a Missile Supply Chain (ProAM) project (AMCOM)PSI Product Simulation Integration project (Boeing)STEP Standard for the Exchange of Product Model Data (ISO 10303).VTMB variable topology multi-bodyXAI X-analysis integration (X= design, mfg., etc.)XCP XaiTools ChipPackage™

XFW XaiTools FrameWork™

XPWAB XaiTools PWA-B™

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PWB Product Data-Driven Analysis Using STEP AP210 An Example XAI Application Russell S. Peak Senior...

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