©2019 by System Plus Consulting | SP19425 – Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology 1
22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
Qualcomm QET5100M Envelope Tracker Module
SEMCO’s Embedded Die Packaging Technology in the Qualcomm QET5100M Envelope Tracker ModuleSP19425 – PACKAGING report by Stéphane ELISABETH
Laboratory Analysis by Peggy GALLOISNovember 2019 – Sample
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2019 by System Plus Consulting | SP19425 – Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology 2
Table of Contents
Overview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
Company Profile 8
o Qualcomm
o Envelope tracking technology
o Motorola Moto Mod 5G teardown
Market Analysis 18
o Market Positionning
o Market Trends and Drivers
o Embedded die technology and Roadmap
o Embedded Die Market Forecast
Physical Analysis 25
o Summary of the Physical Analysis 26
o Embedded Die Package Assembly 28
Package Views & Dimensions:
X-Ray, Opening
Package Cross-Section
o IC Die 59
Die View & Dimensions
Delayering & main Blocs
Die Process
Die Cross-Section
Die Process Characteristic
Physical Comparison: TDK’s vs. SEMCO Embedded Die technology 76
Manufacturing Process 80
o IC Die Front-End Process & Fabrication Unit
o Embedded Packaging Process & Fabrication Unit
Cost Analysis 95
o Summary of the cost analysis 96
o Yields Explanation & Hypotheses 97
o IC die 100
Die Front-End Cost
Die Wafer & Die Cost
o Embedded Die Packging 103
Embedded Die Panel Cost
Embedded Die Panel Cost per process steps
Embedded Die Panel Cost per module
Final Assembly Cost
Module Cost
Selling price 114
Feedbacks 118
SystemPlus Consulting services 120
©2019 by System Plus Consulting | SP19425 – Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology 3
Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Executive Summary
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling priceof the Qualcomm QET5100M.
The embedded die market has recently become attractive, as it’s set to build rapidly on total revenue estimated at $21 million in 2018. Yole Développement estimates that this revenue will nearly quadruple by 2021, with a compound annual growth rate (CAGR) for consumer applications around 28%. Several players are known to produce such packaging in the industry such as TDK, Intel, AT&S, Schweizer, …. New players are trying to enter this market by developing new technologies. Samsung Electro-Mechanics Co. (SEMCO) has started a new wave by introducing its recent six-layer embedded PCB substrate technology into the Qualcomm QET5100M envelope tracker for handset applications.
The module embeds a Qualcomm Envelope Tracking Integrated Circuit (IC) into a SEMCO 6-layer PCB substrate and features an integrated DC-DC converter assembled by Amkor. This technology extends the package size beyond the IC surface area. This allows additional passive components to be mounted on top of the laminated module.
SEMCO’s embedded die technology is a Chip-First Face-Down process realized at panel scale level. Unlike AT&S’s or TDK’s embedded die process, SEMCO uses a 2-layer PCB core with a cavity and a 4-layer built-up structure to embed the die. With this new approach and Amkor’s partnership, SEMCO has shown that PCB makers takes a larger role by adding considerable value.
The report includes an in-depth physical analysis of the envelope tracking module, and a complete description of the manufacturing process flow. Also, we compare SEMCO’s embedded die technology with TDK’s Semiconductor Embedded in SUBstrate (SESUB) to understand the technology choices made by each company.
©2019 by System Plus Consulting | SP19425 – Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology 4
Overview / Introduction
Company Profile & Supply Chain o Qualcommo Envelope tracking technologyo Motorola Moto Mod 5G
Teardown
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Motorola Moto Mod 5G Teardown
Motorola Moto Mod 5G Overview©2019 by System Plus Consulting
Dimensionso Height: 160.0 mmo Width: 72.9 mmo Thickness: 7.1 mm
Weighto 127 g
©2019 by System Plus Consulting | SP19425 – Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology 5
Overview / Introduction
Company Profile & Supply Chain o Qualcommo Envelope tracking technologyo Motorola Moto Mod 5G
Teardown
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Motorola Moto Mod 5G Teardown
• XX
Motorola Moto Mod 5G Overview©2019 by System Plus Consulting
Qualcomm QET5100M
Envelope Tracker
©2019 by System Plus Consulting | SP19425 – Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology 6
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Synthesiso Package Assembly
o Views & Dimensionso Cross-Sectiono Synthesis
o IC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Summary of the Physical Analysis
Molding
Envelope Tracker IC
Qualcomm QET5100M Assembly©2019 by System Plus Consulting
Envelope Tracker IC Assembly:
o Embedded Die assembly
o WLCSP followed by XX in Cavity
o Electrical Connections and support: X-Layer PCB Substrate
Envelope tracker IC Die:
o Process:
XX XX nm XP XM
o Placement : XX.
©2019 by System Plus Consulting | SP19425 – Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology 7
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Synthesiso Package Assembly
o Views & Dimensionso Cross-Sectiono Synthesis
o IC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Package View & Dimensions
Package Top View©2019 by System Plus Consulting
XX
mm
XX mm
• Package: XX
• Dimensions: XX x XX x XX mm
• Pitch: XX mmXX mm
• Marking: QET5100M004HC848MGS
Package Side View©2019 by System Plus Consulting
Package Bottom View©2019 by System Plus Consulting
©2019 by System Plus Consulting | SP19425 – Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology 8
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Synthesiso Package Assembly
o Views & Dimensionso Cross-Sectiono Synthesis
o IC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Package Overview
Package Top View©2019 by System Plus Consulting
Package Top View – X-Ray ©2019 by System Plus Consulting
• The die is packaged using embedded diepackaging.
• Die area : XX mm²(XX x XX mm)
• The die area represent XX% of the chip area.
• XX
Die
©2019 by System Plus Consulting | SP19425 – Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology 9
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Synthesiso Package Assembly
o Views & Dimensionso Cross-Sectiono Synthesis
o IC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
3D X-Ray Analysis – Cavity Layer #4
Package Top View – Opening©2019 by System Plus Consulting
• XX.
• The pads are SMD (Solder Mask Defined) pad type.
• Min pads Pitch: XX mm
• The pads seems to be circular.
• Pads Dimensions: Ø XX mm
• Pad to Cavity edge: XX mm
Ø: XX mm
XX mm
XX mm
XX mm
Package Top View – X-Ray – Fourth Layer ©2019 by System Plus Consulting
©2019 by System Plus Consulting | SP19425 – Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology 10
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Synthesiso Package Assembly
o Views & Dimensionso Cross-Sectiono Synthesis
o IC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Package Cross-Section
Cross-Section Plan©2019 by System Plus Consulting
• Dielectrics Layers Thickness:• Solder Mask : XX µm• Layer #1 : XX µm
• The PCB substrate is made with XX layer and XX layer.
©2019 by System Plus Consulting | SP19425 – Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology 11
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Synthesiso Package Assembly
o Views & Dimensionso Cross-Sectiono Synthesis
o IC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Package Cross-Section
Cross-Section Plan©2019 by System Plus Consulting
• Copper Line Thickness:• Line #X : XX µm• Line #X : XX µm
• Micro-Via Dimension:• #X Diameter: XX µm• #X Depth: XX µm
©2019 by System Plus Consulting | SP19425 – Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology 12
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Synthesiso Package Assembly
o Views & Dimensionso Cross-Sectiono Synthesis
o IC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Package Cross-Section
Cross-Section Plan©2019 by System Plus Consulting
• The PCB substrate has cavity to embed the die.
©2019 by System Plus Consulting | SP19425 – Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology 13
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Synthesiso Package Assembly
o Views & Dimensionso Cross-Sectiono Synthesis
o IC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Package Cross-Section – Copper reveal
©2019 by System Plus Consulting | SP19425 – Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology 14
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Synthesiso Package Assembly
o Views & Dimensionso Cross-Sectiono Synthesis
o IC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Die Overview & Dimensions
• Die Area: XX mm²(XX x XX mm)
• Nb of PGDW per XX-inch wafer: XX
• Pad number: XX
XX
mm
XX mm
Die Overview – Optical View ©2019 by System Plus Consulting
©2019 by System Plus Consulting | SP19425 – Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology 15
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Synthesiso Package Assembly
o Views & Dimensionso Cross-Sectiono Synthesis
o IC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Die Cross-Section – RDLs
©2019 by System Plus Consulting | SP19425 – Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology 16
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparisono SESUB vs. SEMCO’s ED
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Package Comparison – TDK SESUB vs. SEMCO Embedded Die
©2019 by System Plus Consulting | SP19425 – Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology 17
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flowo IC Die Front-End Processo IC Fabrication Unito SEMCO ED Process Flowo Assembly Unit & Process
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Packaging Process Flow (1/4)
©2019 by System Plus Consulting | SP19425 – Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology 18
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flowo IC Die Front-End Processo IC Fabrication Unito SEMCO ED Process Flowo Assembly Unit & Process
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Packaging Process Flow
©2019 by System Plus Consulting | SP19425 – Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology 19
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso IC Wafer & Die Costo Embedded Die Package Costo Assembly Costo Component Cost
Selling Price Analysis
Related Reports
About System Plus
Embedded Die Panel Cost
©2019 by System Plus Consulting | SP19425 – Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology 20
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso IC Wafer & Die Costo Embedded Die Package Costo Assembly Costo Component Cost
Selling Price Analysis
Related Reports
About System Plus
Final Assembly Cost
©2019 by System Plus Consulting | SP19425 – Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology 21
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysiso Definition of Priceso Manufacturer Financialso Complete Module Price
Related Reports
About System Plus
Estimated Manufacturer price
©2019 by System Plus Consulting | SP19425 – Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology 22
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Related Reports
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
ADVANCED PACKAGING• Status of Advanced Substrates 2019• Status of the Advanced Packaging Industry 2019• Advanced RF System-in-Package for Cellphones 2019
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
PACKAGING• TDK SESUB Bluetooth Module• ASE/Deca M-Series Fan-Out Process• Advanced packaging technology in the Apple Watch
Series 4’s System-in-Package
The embedded die market has recentlybecome attractive, as it’s set to buildrapidly on total revenue estimated at $21million in 2018. Yole Développementestimates that this revenue will nearlyquadruple by 2021, with a compoundannual growth rate (CAGR) for consumerapplications around 28%. Several playersare known to produce such packaging inthe industry such as TDK, Intel, AT&S,Schweizer, etc. New players are trying toenter this market by developing newtechnologies. Samsung Electro-MechanicsCo. (SEMCO) has started a new wave byintroducing its recent six-layer embeddedPCB substrate technology into theQualcomm QET5100M envelope trackerfor handset applications.
The module embeds a QualcommEnvelope Tracking Integrated Circuit (IC)into a SEMCO six-layer PCB substrate andfeatures an integrated DC-DC converterassembled by Amkor. This technologyextends the package size beyond the ICsurface area. This allows additional passivecomponents to be mounted on top of thelaminated module.
SEMCO’s embedded die technology is aChip-First Face-Down process realized atpanel scale level. Unlike AT&S’s or TDK’sembedded die process, SEMCO uses atwo-layer PCB core with a cavity and afour-layer built-up structure to embed thedie.
With this new approach and Amkor’spartnership, SEMCO has shown that PCBmakers takes a larger role by addingconsiderable value.
The report includes an in-depth physicalanalysis of the envelope tracking module,and a complete description of themanufacturing process flow. Also, itcompares SEMCO’s embedded dietechnology with TDK’s SemiconductorEmbedded in SUBstrate (SESUB) tounderstand the technology choices madeby each company.
COMPLETE TEARDOWN WITH
• Detailed photos and cross-sections
• Precise measurements
• Material analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Estimated sales price
• Comparison with TDK Semiconductor
Embedded in SUBstrate (SESUB)
The first device featuring a six-layer embedded die packaging technology foundin the consumer market from SEMCO and Amkor.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Title: Qualcomm QET5100M Envelope Tracker Module
Pages: 124
Date: November 2019
Format: PDF & Excel file
Price: EUR 3,990
Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology
IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY
TABLE OF CONTENTS
Overview/Introduction
Qualcomm Company Profile
Motorola Moto Mod 5G Teardown
Market Analysis
Physical Analysis
• Physical Analysis Methodology
Embedded die packaging analysis
Package view and dimensions
X-ray and package opening analysis: Components, dimensions, line/space
Package cross-section: PCB substrate, shielding, materials, structures
Package process analysis
• IC Die Analysis
Die view and dimensions
Die delayering and main block IDs
Die cross-section: Substrate, metal layers, RDLs
Die process
Manufacturing Process Flow
• IC Die Process and Fabrication Unit
• Embedded Die Packaging Process Flow and Fabrication Unit
AUTHORS
Cost Analysis
• Overview of the Cost Analysis
• Supply Chain Description
• Yield Hypotheses
• IC Die Cost Analyses
Front-end cost
Wafer and die cost
• Package Cost Analysis
Embedded die packaging front-end cost
Embedded die packaging cost by process step
Module assembly cost
• Final Test Cost
• Component Cost
Estimated Price Analysis
Comparison Between TDK’s and SEMCO’s Solutions for Embedded Die
QUALCOMM QET5100M ENVELOPE TRACKER MODULE WITH SEMCO'S EMBEDDED DIE PACKAGING TECHNOLOGY
ASE/Deca M-Series Fan-Out ProcessASE/Deca’s patented fan-out technology has penetrated a new commercially available device, the Qualcomm PM8150 PMIC.September 2019 - EUR 3,990*
Advanced packaging technology in the Apple Watch Series 4’s SiPFour major packaging technologies: ASE’s SiP & modified SESUB, TSMC’s inFO-ePoP, Skyworks’ Double Side BGA.January 2019 - EUR 3,990*
TDK SESUB Bluetooth ModuleLatest Release of TDK Embedded Die Package Technology.June 2017 - Price: EUR 3,490*
RELATED REPORTS
Peggy Gallois has joined System PlusConsulting’s laboratory of micro-electronics in 2019. She has a deepknowledge of metallic materials. Shepreviously worked in the laboratoryof metallographic expertises forDassault Aviation near Paris.
Dr. Stéphane Elisabeth has joinedSystem Plus Consulting's team in 2016.He has a deep knowledge of Materialscharacterizations and Electronicssystems. He holds an EngineeringDegree in Electronics and NumericalTechnology, and a PhD in Materials forMicroelectronics.
COSTING TOOLS
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Process-BasedCosting Tools
ParametricCosting Tools
WHAT IS A REVERSE COSTING®?
Reverse Costing® is the process of disassembling a device (or asystem) in order to identify its technology and calculate itsmanufacturing cost, using in-house models and tools.
IC Price+
MEMS CoSim+
MEMS Price+
Power CoSim+
Power Price+
LED CoSim+
3D PackageCoSim+
DisplayPrice+
PCBPrice+
SYSCost+
Our analysis is performed with our costing tools IC Price+ and 3D Package CoSim+.
System Plus Consulting offers powerful costing tools to evaluate any process or device, the production cost
and selling price, from single chip to complex structures. All these tools are on sale under corporate
license.
CONTACTS
ABOUT SYSTEM PLUS CONSULTING
System Plus Consulting is specialized
in the cost analysis of electronics
from semiconductor devices to
electronic systems.
A complete range of services and
costing tools to provide in-depth
production cost studies and to
estimate the objective selling price of
a product is available.
Our services:
• STRUCTURE & PROCESS
ANALYSES
• TEARDOWNS
• CUSTOM ANALYSES
• COSTING SERVICES
• COSTING TOOLS
• TRAININGS
www.systemplus.fr
3D Package CoSim+
Cost simulation tool to evaluate the cost of anyPackaging process: Wafer-level packaging, TSV, 3Dintegration…
IC Price+The tool performs the necessary cost simulation ofany Integrated Circuit: ASICs, microcontrollers,memories, DSP, smartpower…
Headquarters22, bd Benoni GoullinNantes Biotech44200 NantesFrance+33 2 40 18 09 [email protected]
Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGermany+49 151 23 54 41 [email protected]
America Sales OfficeSteven LAFERRIEREWestern USA & Canada+1 [email protected]
Chris YOUMANEastern USA & Canada+1 919-607-9839 [email protected]
Asia Sales OfficeTakashi ONOZAWAJapan & Rest of Asia+81 80 4371 [email protected]
Mavis WANGGreater China+886 979 336 [email protected]
Peter OKKorea+82 10 4089 [email protected]
ORDER FORMPlease process my order for Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology, Reverse Costing® – Structure, Process & Cost Report Ref: SP19425
Full Structure, Process & Cost Report : EUR 3,990* Annual Subscription offers possible from 3 reports, including this
report as the first of the year. Contact us for more information.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Each year System Plus Consultingreleases a comprehensive collectionof new reverse engineering andcosting analyses in various domains.You can choose to buy over 12months a set of 3, 4, 5, 7, 10 or 15Reverse Costing® reports.
Up to 47% discount!
More than 60 reports released eachyear on the following topics(considered for 2018):• MEMS & Sensors: Accelerometer
– Environment - Fingerprint - Gas - Gyroscope - IMU/Combo -Microphone - Optics - Oscillator -Pressure
• Power: GaN - IGBT - MOSFET - Si Diode - SiC
• Imaging: Camera - Spectrometer• LED and Laser: UV LED – VCSEL -
White/blue LED• Packaging: 3D Packaging -
Embedded - SIP - WLP• Integrated Circuits: IPD –
Memories – PMIC - SoC• RF: FEM - Duplexer• Systems: Automotive - Consumer
- Energy - Telecom
ANNUAL SUBSCRIPTIONS
QUALCOMM QET5100M ENVELOPE TRACKER MODULE
SHIP TO
Name (Mr/Ms/Dr/Pr): .............................................................
Job Title: …….............................................................................
Company: ….............................................................................
Address: …….............................................................................
City: ………………………………… State: ..........................................
Postcode/Zip: ..........................................................................
Country: ……............................................................................
VAT ID Number for EU members: ..........................................
Tel: ……………….........................................................................
Email: .....................................................................................
Date: ......................................................................................
Signature: ..............................................................................
BILLING CONTACT
First Name : ............................................................................
Last Name: …….......................................................................
Email: …..................................................................................
Phone: ……..............................................................................
PAYMENT
By credit card:
Number: |__|__|__|__| |__|__|__|__| |__|__|__|__|
|__|__|__|__|
Expiration date: |__|__|/|__|__|
Card Verification Value: |__|__|__|
By bank transfer:HSBC - CAE- Le Terminal -2 rue du Charron - 44800 St Herblain FranceBIC code: CCFRFRPP• In EUR
Bank code : 30056 - Branch code : 00955 - Account : 09550003234 IBAN: FR76 3005 6009 5509 5500 0323 439
• In USDBank code : 30056 - Branch code : 00955 - Account : 09550003247 IBAN: FR76 3005 6009 5509 5500 0324 797
Return order by: FAX: +33 (0)472 83 01 83MAIL: YOLE DEVELOPPEMENT
75 Cours Emile Zola69100 Villeurbanne – France
*For price in dollars please use the day’s exchange rate *All reports are delivered electronically in pdf format*For French customer, add 20 % for VAT*Our prices are subject to change. Please check our new releases and price changes on www.i-micronews.com. The present document is valid 6 months after its publishing date: November 2019
©2019 by System Plus Consulting | SP19425 – Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology 23
SystemPlusConsultingSERVI CES
©2019 by System Plus Consulting | SP19425 – Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology 24
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Pluso Company serviceso Contact
Business Models Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>60 reports per year)
Costing Tools
Trainings
©2019 by System Plus Consulting | SP19425 – Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology 25
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Pluso Company serviceso Contact
Contact
Headquarters22 bd Benoni Goullin44200 NantesFRANCE+33 2 40 18 09 [email protected]
Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]
www.systemplus.fr
Asia Sales OfficeTakashi ONOZAWATokyoJAPANT : +81 804 371 [email protected]
Mavis WANGTAIWANT :+886 979 336 [email protected]
NANTESHeadquarter
FRANKFURT/MAINEurope Sales Office
LYONYOLE HQ
TOKYOYOLE KK
GREATER CHINAYOLE
PHOENIXYOLE Inc.
KOREAYOLE
America Sales OfficeSteve LAFERRIEREPhoenix, AZWESTERN UST : +1 310 600 [email protected]
Chris YOUMANEASTERN US & CANADAT : +1 919 607 9839 [email protected]
