The 5G revolution is here. We are currently seeing uptake of the technology led by the Sub-6GHz frequency range application. Qualcomm, one of the major players in this segment, has claimed over 230 design wins in development or already launched on the market. Only a small fraction of these smartphones is 5G millimeter wavelength (mmWave) range compatible, mainly represented by Samsung. Last year, Samsung released its mmWave version of its flagship Galaxy S10 5G in America in partnership with Qualcomm, which supplies the complete chipset. This year, Samsung renewed the partnership and is offering the latest generation of Qualcomm’s 5G mmWave Chipset in its Galaxy S20 Ultra 5G. Like the previous generation, the complete solution has been especially designed for smartphone applications, starting with Samsung and expected to spread to others designs. The module in the Samsung Galaxy S20 Ultra 5G comes with five systems spread throughout the smartphone. The first System-in-Package (SiP) is the baseband processor, which uses standard Ball Grid Array (BGA) SiP Packaging. The second is the 5G mmWave receive/transmit (Rx/Tx) which uses standard flip-chip ball grid array (FCBGA) packaging. The other systems are combined in the antenna-on-package (AoP) module, which is spread around the corner of the smartphone in order to provide spherical coverage without any hand-blocking constraints. Two versions of the antenna modules are integrated into the flagship. The first version comes with a dipole antenna coupled with a patch antenna system. The patch antenna system is designed to provide wide-band polarized radiation. Among the innovations in the antenna design, Qualcomm seems to integrate two types of antenna patch in the same form factor. One is a Coupled Feed Antenna, and one is a Dual-Polarized and Dual Band Patch Antenna. Moreover, the design in the routing, in the filtering and in the transceiver has led to a better stability in terms of power emission. This report includes a full investigation of the system, featuring a detailed study of the SiPs, including die analyses, processes and board cross-sections. It contains a complete cost analysis and a selling price estimation of the system. Finally, it features a technical and cost comparison with the structure of the first generation of 5G mmWave chipset from Qualcomm. COMPLETE TEARDOWN WITH • Detailed photos and cross-sections • Precise measurements • Material analysis • Manufacturing process flow • Supply chain evaluation • Manufacturing cost analysis • Estimated sales price • Comparison with first generation of Qualcomm’s 5G mmWave chipset A study of the complete second generation of the 5G millimeter-wave chipset for handset applications, including the baseband modem SDX55M, the transceiver SMR526 and Antenna-on-Package QTM525. REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT Title: Qualcomm’s Second Generation 5G mmWave Chipset, from Modem to Antenna Pages: 216 Date: May 2020 Format: PDF & Excel file Price: EUR 3,990 Reference: SP20517 Qualcomm’s Second Generation 5G mmWave Chipset, from Modem to Antenna IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY
Transcript
The 5G revolution is here. We arecurrently seeing uptake of the technologyled by the Sub-6GHz frequency rangeapplication. Qualcomm, one of the majorplayers in this segment, has claimed over230 design wins in development oralready launched on the market. Only asmall fraction of these smartphones is 5Gmillimeter wavelength (mmWave) rangecompatible, mainly represented bySamsung. Last year, Samsung released itsmmWave version of its flagship Galaxy S105G in America in partnership withQualcomm, which supplies the completechipset. This year, Samsung renewed thepartnership and is offering the latestgeneration of Qualcomm’s 5G mmWaveChipset in its Galaxy S20 Ultra 5G.
Like the previous generation, thecomplete solution has been especiallydesigned for smartphone applications,starting with Samsung and expected tospread to others designs. The module inthe Samsung Galaxy S20 Ultra 5G comeswith five systems spread throughout thesmartphone. The first System-in-Package(SiP) is the baseband processor, whichuses standard Ball Grid Array (BGA) SiPPackaging. The second is the 5G mmWavereceive/transmit (Rx/Tx) which usesstandard flip-chip ball grid array (FCBGA)packaging. The other systems arecombined in the antenna-on-package(AoP) module, which is spread around thecorner of the smartphone in order toprovide spherical coverage without anyhand-blocking constraints.
Two versions of the antenna modules areintegrated into the flagship. The firstversion comes with a dipole antennacoupled with a patch antenna system. Thepatch antenna system is designed toprovide wide-band polarized radiation.Among the innovations in the antennadesign, Qualcomm seems to integrate twotypes of antenna patch in the same formfactor. One is a Coupled Feed Antenna,and one is a Dual-Polarized and Dual BandPatch Antenna. Moreover, the design inthe routing, in the filtering and in thetransceiver has led to a better stability interms of power emission.
This report includes a full investigation ofthe system, featuring a detailed study ofthe SiPs, including die analyses, processesand board cross-sections. It contains acomplete cost analysis and a selling priceestimation of the system. Finally, itfeatures a technical and cost comparisonwith the structure of the first generationof 5G mmWave chipset from Qualcomm.
COMPLETE TEARDOWN WITH
• Detailed photos and cross-sections
• Precise measurements
• Material analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Estimated sales price
• Comparison with first generation of Qualcomm’s 5G mmWave chipset
A study of the complete second generation of the 5G millimeter-wave chipset forhandset applications, including the baseband modem SDX55M, the transceiverSMR526 and Antenna-on-Package QTM525.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Title: Qualcomm’s Second Generation 5G mmWaveChipset, from Modem to Antenna
Pages: 216
Date: May 2020
Format: PDF & Excel file
Price: EUR 3,990
Reference: SP20517
Qualcomm’s Second Generation 5G mmWaveChipset, from Modem to Antenna
IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY
• Die Analysis: Baseband processor, Rx/Tx, transceiver, PMIC
Die view and dimensions, delayering and main block IDs, cross-section and process
• Physical analysis comparison Qualcomm’s first vs. second
generation of 5G mmWavechipsets
Manufacturing Process Flow
• Die fabrication unit: Baseband processor, Rx/Tx, transceiver, PMIC
• SiP packaging fabrication unit• PCB & AoP fabrication process
flow
Cost Analysis
• Overview of the cost analysis• Supply chain description• Yield hypotheses• Die cost analyses: Baseband
Processor, Rx/Tx, Transceiver, PMIC
Front-End (FE) cost Wafer and die cost
• Baseband, Rx/Tx and Antenna Package Cost Analysis
Packaging assembly cost Packaging cost by process step
• Final test cost and assembly• Component cost• Cost analysis comparison Qualcomm’s first vs. second
generation of 5G mmWavechipsets
Estimated Price Analysis
AUTHORS
QUALCOMM’S SECOND GENERATION 5G MMWAVE CHIPSET, FROM MODEM TO ANTENNA
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Stéphane Elisabeth, PhD has joined System Plus Consulting's team in 2016. Stéphane is Expert Cost Analyst in RF, Sensors and Advanced Packaging. He has a deep knowledge of materials characterizations and electronics systems. He holds an Engineering Degree in Electronics and Numerical Technology, and a PhD in Materials for Microelectronics.
Dr. Youssef El Gmili has joined System Plus Consulting's team in 2019 after ten years passed on high level research and development on microelectronics. He has a deep knowledge in the study and analysis of semiconductors Materials. He holds a Master Degree in Microelectronics, and a Phd in Physics/Materials Science.
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