R8C/13 GroupSINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Rev.1.20 Jan 27, 2006 page 1 of 27REJ03B0069-0120
REJ03B0069-0120Rev.1.20
Jan 27, 2006
1. OverviewThis MCU is built using the high-performance silicon gate CMOS process using a R8C/Tiny Series CPU
core and is packaged in a 32-pin plastic molded LQFP. This MCU operates using sophisticated instructions
featuring a high level of instruction efficiency. With 1M bytes of address space, it is capable of executing
instructions at high speed.
The data flash ROM (2 KB X 2 blocks) is embedded.
1.1 Applications
Electric household appliance, office equipment, housing equipment (sensor, security), general industrial
equipment, audio, etc.
Rev.1.20 Jan 27, 2006 page 2 of 27REJ03B0069-0120
R8C/13 Group 1. Overview
Table 1.1 Performance outline
1.2 Performance OverviewTable 1.1. lists the performance outline of this MCU.
Item PerformanceCPU Number of basic instructions 89 instructions
Minimum instruction execution time 50 ns (f(XIN) = 20 MHZ, VCC = 3.0 to 5.5 V)100 ns (f(XIN) = 10 MHZ, VCC = 2.7 to 5.5 V)
Operating mode Single-chipAddress space 1M bytesMemory capacity See Table 1.2.
Peripheral Port Input/Output: 22 (including LED drive port), Input: 2function LED drive port I/O port: 8
Timer Timer X: 8 bits x 1 channel, Timer Y: 8 bits x 1 channel,Timer Z: 8 bits x 1 channel(Each timer equipped with 8-bit prescaler)Timer C: 16 bits x 1 channel
(Circuits of input capture and output compare)Serial interface •1 channel
Clock synchronous, UART•1 channelUART
A/D converter 10-bit A/D converter: 1 circuit, 12 channelsWatchdog timer 15 bits x 1 (with prescaler)
Reset start function selectableInterrupt Internal: 11 factors, External: 5 factors,
Software: 4 factors, Priority level: 7 levelsClock generation circuit 2 circuits
•Main clock generation circuit (Equipped with a built-infeedback resistor)•On-chip oscillator (high-speed, low-speed)
On high-speed on-chip oscillator the frequency adjust-ment function is usable.
Oscillation stop detection function Main clock oscillation stop detection functionVoltage detection circuit IncludedPower on reset circuit Included
Electrical Supply voltage VCC = 3.0 to 5.5V (f(XIN) = 20MHZ)characteristics VCC = 2.7 to 5.5V (f(XIN) = 10MHZ)
Power consumption Typ.9 mA (VCC = 5.0V, (f(XIN) = 20MHZ)Typ.5 mA (VCC = 3.0V, (f(XIN) = 10MHZ)Typ.35 µA (VCC = 3.0V, Wait mode, Peripheral clock stops)Typ.0.7 µA (VCC = 3.0V, Stop mode)
Flash memory Program/erase supply voltage VCC = 2.7 to 5.5 VProgram/erase endurance 10,000 times (Data flash)
1,000 times (Program ROM)Operating ambient temperature -20 to 85°C
-40 to 85°C (D-version)Package 32-pin plastic mold LQFP
Rev.1.20 Jan 27, 2006 page 3 of 27REJ03B0069-0120
R8C/13 Group 1. Overview
1.3 Block DiagramFigure 1.1 shows this MCU block diagram.
Figure 1.1 Block Diagram
T
i
m
e
r
X
(
8
b
i
t
s
)T
i
m
e
r
Y
(
8
b
i
t
s
)T
i
m
e
r
Z
(
8
b
i
t
s
)T
i
m
e
r
C
(
1
6
b
i
t
s
)
W
a
t
c
h
d
o
g
t
i
m
e
r(
1
5
b
i
t
s
)
M
e
m
o
r
yR
8
C
/
T
i
n
y
S
e
r
i
e
s
C
P
U
c
o
r
e
I /
O
p
o
r
t P
o
r
t
P
0
8
P
o
r
t
P
1
8
Port P3
5
M
u
l
t
i
p
l
i
e
r
S
y
s
t
e
m
c
l
o
c
k
g
e
n
e
r
a
t
o
r
XIN-XOUTHigh-speed on-chip oscillatorLow-speed on-chip oscillator
UART(8 bits 1 channel)
P
o
r
t
P
4
1 2
Pe
r
i
p
h
e
r
a
l
f
u
n
c
t
i
o
n
s
U
A
R
T
o
r
C
l
o
c
k
s
y
n
c
h
r
o
n
o
u
ss
e
r
i
a
l
I
/
O(
8
b
i
t
s
1
c
h
a
n
n
e
l
)
A
/
D
c
o
n
v
e
r
t
e
r(
1
0
b
i
t
s
1
2
c
h
a
n
n
e
l
s
)
NOTES:1. ROM size depends on MCU type.2. RAM size depends on MCU type.
R
0
LR
0
HR
1
H R
1
LR2R3
A0A1F
B
S
B
ISP
USP
INTB
PC
FLG
T
i
m
e
r
ROM
RAM( 2
)
(1)
Rev.1.20 Jan 27, 2006 page 4 of 27REJ03B0069-0120
R8C/13 Group 1. Overview
1.4 Product InformationTable 1.2 lists the product information.
Table 1.2 Product Information
RAM capacityROM capacity
Package type RemarksType No.
As of January 2006
Flash memory versionR5F21132FP PLQP0032GB-A8K bytes 512 bytes
PLQP0032GB-A12K bytes 768 bytes
PLQP0032GB-A16K bytes 1K bytes
R5F21133FP
R5F21134FP
R5F21132DFP PLQP0032GB-A8K bytes 512 bytes
PLQP0032GB-A12K bytes 768 bytes
PLQP0032GB-A16K bytes 1K bytes
R5F21133DFP
R5F21134DFP
D version
Program ROM Data flash
2K bytes x 2
2K bytes x 2
2K bytes x 2
2K bytes x 2
2K bytes x 2
2K bytes x 2
Figure 1.2 Type No., Memory Size, and Package
Package type: FP : PLQP0032GB-A
ROM capacity: 2 : 8 KBytes. 3 : 12 KBytes. 4 : 16 KBytes.
Memory type: F: Flash memory version
Type No. R 5 F 21 13 4 D FP
R8C/13 group
R8C/Tiny series
Classification:D: Operating ambient temperature –40 °C to 85 °CNo symbol: Operating ambient temperature –20 °C to 85 °C
Renesas MCU
Renesas semiconductors
Rev.1.20 Jan 27, 2006 page 5 of 27REJ03B0069-0120
R8C/13 Group 1. Overview
Package: PLQP0032GB-A (32P6U-A)
Figure 1.3 Pin Assignments (Top View)
PIN Assignments (top view)
1 2 3 4 5 6 7 8
91
01
1
1
21
31
41
51
6
2
92
82
72
6
2
5
2
4 2
3 2
2 2
1 2
0 1
9 1
8 1
7
3
23
13
0
R8C/13 Group
XI
N
/
P
46V
S
S
R E
S
E
T
VC
C
C
N
VS
S
P
17/
I
N
T
1/
C
N
T
R0
P
16/
C
L
K0
P15/RxD0
P
14/
T
x
D0
P
37/
T
x
D
1
0/
R
x
D
1
P 30
/
C
N
T
R0/
C
M
P
10
P 33
/
I
N
T3/
P 3 1
/
T
ZO
U
T/
C
M
P
11
P 32
/
I
N
T2/
C
N
T
R
1/
C
M
P
12
I VC
C
A V
S
S
A V
C
C/
V
R
E
F
P
03/
A
N4
P02/AN5
P
01/
A
N6
P00/AN7/TxD11
P06/AN1
P
05/
A
N2
P04/AN3
P
45/
I
N
T0
P
10/
K
I0/
A
N8/
C
M
P
00
P11/KI1/AN9/CMP01
P
12/
K
I2/
A
N1
0/
C
M
P
02
P
13/
K
I3/
A
N1
1
P 07
/
A
N0
M
O
D
E
T C
I
N
NOTES: 1. P47 functions only as an input port. 2. When using On-chip debugger, do not use P00/AN7/TxD11 and P37/TxD10/RxD1 pins. 3. Do not connect IVcc to Vcc.
XO
U
T/
P
47
( 1 )
( 3 )
1.5 Pin AssignmentsFigure 1.3 shows the pin configuration (top view).
Rev.1.20 Jan 27, 2006 page 6 of 27REJ03B0069-0120
R8C/13 Group 1. Overview
Signal name Pin name I/O typePower supply Vcc, Iinput VssIVcc IVcc O
Analog power AVcc, AVss Isupply input
Reset input___________
RESET ICNVss CNVss IMODE MODE IMain clock input XIN I
Main clock output XOUT O
_____
INT interrupt input_______ _______
INT0 to INT3 IKey input interrupt
_____ _____
KI0 to KI3 IinputTimer X CNTR0 I/O
__________
CNTR0 OTimer Y CNTR1 I/OTimer Z TZOUT OTimer C TCIN I
CMP00 to CMP02, OCMP10 to CMP12
Serial interface CLK0 I/ORxD0, RxD1 ITxD0, TxD10, OTxD11
Reference voltage VREF IinputA/D converter AN0 to AN11 II/O port P00 to P07, I/O
P10 to P17,P30 to P33, P37,P45
Input port P46, P47 I
FunctionApply 2.7 V to 5.5 V to the Vcc pin. Apply 0 V to theVss pin.This pin is to stabilize internal power supply.Connect this pin to Vss via a capacitor (0.1 µF).Do not connect to Vcc.Power supply input pins for A/D converter. Connect theAVcc pin to Vcc. Connect the AVss pin to Vss. Connect acapacitor between pins AVcc and AVss.Input “L” on this pin resets the MCU.Connect this pin to Vss via a resistor.Connect this pin to Vcc via a resistor.These pins are provided for the main clock generat-ing circuit I/O. Connect a ceramic resonator or a crys-tal oscillator between the XIN and XOUT pins. To usean externally derived clock, input it to the XIN pin andleave the XOUT pin open.______
INT interrupt input pins.Key input interrupt pins.
Timer X I/O pinTimer X output pinTimer Y I/O pinTimer Z output pinTimer C input pinThe timer C output pins
Transfer clock I/O pin.Serial data input pins.Serial data output pins.
Reference voltage input pin for A/D converter. Con-nect the VREF pin to Vcc.Analog input pins for A/D converterThese are 8-bit CMOS I/O ports. Each port has an I/Oselect direction register, allowing each pin in that portto be directed for input or output individually.Any port set to input can select whether to use a pull-up resistor or not by program.P10 to P17 also function as LED drive ports.
Port for input-only
1.6 Pin DescriptionTable 1.3 shows the pin description
Table 1.3 Pin description
Rev.1.20 Jan 27, 2006 page 7 of 27REJ03B0069-0120
R8C/13 Group 2. Central Processing Unit (CPU)
2. Central Processing Unit (CPU)Figure 2.1 shows the CPU Register. The CPU contains 13 registers. Of these, R0, R1, R2, R3, A0, A1 and
FB comprise a register bank. Two sets of register banks are provided.
2.1 Data Registers (R0, R1, R2 and R3)
R0 is a 16-bit register for transfer, arithmetic and logic operations. The same applies to R1 to R3. The R0
can be split into high-order bit (R0H) and low-order bit (R0L) to be used separately as 8-bit data registers.
The same applies to R1H and R1L as R0H and R0L. R2 can be combined with R0 to be used as a 32-bit
data register (R2R0). The same applies to R3R1 as R2R0.
D
a
t
a
r
e
g
i
s
t
e
r
s(
1
)
Address registers(1)
F
r
a
m
e
b
a
s
e
r
e
g
i
s
t
e
r
s(
1
)
P
r
o
g
r
a
m
c
o
u
n
t
e
r
I n
t
e
r
r
u
p
t
t
a
b
l
e
r
e
g
i
s
t
e
r
User stack pointer
I n
t
e
r
r
u
p
t
s
t
a
c
k
p
o
i
n
t
e
r
Static base register
F
l
a
g
r
e
g
i
s
t
e
r
N
O
T
E
S
:
1
.
A
r
e
g
i
s
t
e
r
b
a
n
k
c
o
m
p
r
i
s
e
s
t
h
e
s
e
r
e
g
i
s
t
e
r
s
.
T
w
o
s
e
t
s
o
f
r
e
g
i
s
t
e
r
b
a
n
k
s
a
r
e
p
r
o
v
i
d
e
d
R0H(High-order of R0)
b
1
5
b
8
b
7
b0
R
3
I N
T
B
H
USP
I S
P
SB
CDZSBOIUI P
L
R
0
L
(
L
o
w
-
o
r
d
e
r
o
f
R
0
)
R1H(High-order of R1) R1L(Low-order of R1)
R
2b
3
1
R3
R2
A1
A0
F
B
b
1
9
I N
T
B
Lb
1
5
b0
P
Cb
1
9
b0
b15 b0
F
L
Gb
1
5
b0
b
1
5
b0 b
7
b8
Reserved bit
Carry flag
Debug flag
Zero flag
Sign flag
Register bank select flag
Overflow flag
Interrupt enable flag
Stack pointer select flag
Reserved bit
Processor interrupt priority level
The 4-high order bits of INTB are INTBH andthe 16-low bits of INTB are INTBL.
Figure 2.1 CPU Register
Rev.1.20 Jan 27, 2006 page 8 of 27REJ03B0069-0120
R8C/13 Group 2. Central Processing Unit (CPU)
2.2 Address Registers (A0 and A1)A0 is a 16-bit register for address register indirect addressing and address register relative addressing.
They also are used for transfer, arithmetic and logic operations. The same applies to A1 as A0. A0 can be
combined with A0 to be used as a 32-bit address register (A1A0).
2.3 Frame Base Register (FB)
FB is a 16-bit register for FB relative addressing.
2.4 Interrupt Table Register (INTB)
INTB is a 20-bit register indicates the start address of an interrupt vector table.
2.5 Program Counter (PC)
PC, 20 bits wide, indicates the address of an instruction to be executed.
2.6 User Stack Pointer (USP) and Interrupt Stack Pointer (ISP)
The stack pointer (SP), USP and ISP, are 16 bits wide each.
The U flag of FLG is used to switch between USP and ISP.
2.7 Static Base Register (SB)SB is a 16-bit register for SB relative addressing.
2.8 Flag Register (FLG)
FLG is a 11-bit register indicating the CPU state.
2.8.1 Carry Flag (C)
The C flag retains a carry, borrow, or shift-out bit that has occurred in the arithmetic logic unit.
2.8.2 Debug Flag (D)
The D flag is for debug only. Set to “0”.
2.8.3 Zero Flag (Z)
The Z flag is set to “1” when an arithmetic operation resulted in 0; otherwise, “0”.
2.8.4 Sign Flag (S)
The S flag is set to “1” when an arithmetic operation resulted in a negative value; otherwise, “0”.
2.8.5 Register Bank Select Flag (B)
The register bank 0 is selected when the B flag is “0”. The register bank 1 is selected when this flag is
set to “1”.
2.8.6 Overflow Flag (O)
The O flag is set to “1” when the operation resulted in an overflow; otherwise, “0”.
2.8.7 Interrupt Enable Flag (I)
The I flag enables a maskable interrupt.
An interrupt is disabled when the I flag is set to “0”, and are enabled when the I flag is set to “1”. The
I flag is set to “0” when an interrupt request is acknowledged.
2.8.8 Stack Pointer Select Flag (U)
ISP is selected when the U flag is set to “0”, USP is selected when the U flag is set to “1”.
The U flag is set to “0” when a hardware interrupt request is acknowledged or the INT instruction of
software interrupt numbers 0 to 31 is executed.
2.8.9 Processor Interrupt Priority Level (IPL)
IPL, 3 bits wide, assigns processor interrupt priority levels from level 0 to level 7.
If a requested interrupt has greater priority than IPL, the interrupt is enabled.
2.8.10 Reserved Bit
When write to this bit, set to “0”. When read, its content is indeterminate.
Rev.1.20 Jan 27, 2006 page 9 of 27REJ03B0069-0120
R8C/13 Group 3. Memory
3. MemoryFigure 3.1 is a memory map of this MCU. This MCU provides 1-Mbyte address space from addresses
0000016 to FFFFF16.
The internal ROM (program ROM) is allocated lower addresses beginning with address 0FFFF16. For
example, a 16-Kbyte internal ROM is allocated addresses from 0C00016 to 0FFFF16.
The fixed interrupt vector table is allocated addresses 0FFDC16 to 0FFFF16. They store the starting
address of each interrupt routine.
The internal ROM (data flash) is allocated addresses from 0200016 to 02FFF16.
The internal RAM is allocated higher addresses beginning with address 0040016. For example, a 1-Kbyte
internal RAM is allocated addresses 0040016 to 007FF16. The internal RAM is used not only for storing
data, but for calling subroutines and stacks when interrupt request is acknowledged.
Special function registers (SFR) are allocated addresses 0000016 to 002FF16. The peripheral function
control registers are located them. All addresses, which have nothing allocated within the SFR, are re-
served area and cannot be accessed by users.
Figure 3.1 Memory Map
0000016
0YYYY16
0FFFF16
002FF16
0040016
Internal ROM(program ROM)
SFR(See Chapter 4 for details.)
0FFDC16
0FFFF16
Undefined instructionOverflow
BRK instructionAddress match
Single stepWatchdog timer,Oscillation stop detection,Voltage detection
Reset
(Reserved)
Type name
0XXXX16 Internal RAM
FFFFF16
Address 0XXXX16
005FF16
Internal RAMSize
007FF16
512 bytes
1K bytes
006FF16768 bytes
Address 0YYYY16
0E00016
Internal ROMSize
0C00016
8K bytes
16K bytes
0D0001612K bytes
Expansion area
(Reserved)
R5F21134FP, R5F21134DFP
R5F21133FP, R5F21133DFP
R5F21132FP, R5F21132DFP
0200016
02FFF16 Internal ROM
(data flash)(1)
NOTES: 1. The data flash block A (2K bytes) and block B (2K bytes) are shown. 2. Blank spaces are reserved. No access is allowed.
Rev.1.20 Jan 27, 2006 page 10 of 27REJ03B0069-0120
R8C/13 Group 4. Special Function Register (SFR)
W
a
t
c
h
d
o
g
t
i
m
e
r
s
t
a
r
t
r
e
g
i
s
t
e
r W
D
T
S X
X1
6W
a
t
c
h
d
o
g
t
i
m
e
r
c
o
n
t
r
o
l
r
e
g
i
s
t
e
r W
D
C 0
0
0
1
1
1
1
12
Processor mode register 0 PM0 0016
S
y
s
t
e
m
c
l
o
c
k
c
o
n
t
r
o
l
r
e
g
i
s
t
e
r
0 C
M
0 0
1
1
0
1
0
0
02S
y
s
t
e
m
c
l
o
c
k
c
o
n
t
r
o
l
r
e
g
i
s
t
e
r
1 C
M
1 0
0
1
0
0
0
0
02
A
d
d
r
e
s
s
m
a
t
c
h
i
n
t
e
r
r
u
p
t
e
n
a
b
l
e
r
e
g
i
s
t
e
r A
I
E
R X
X
X
X
X
X
0
02P
r
o
t
e
c
t
r
e
g
i
s
t
e
r P
R
C
R 0
0
X
X
X
0
0
02
Processor mode register 1 PM1 0016
2 .
S
o
f
t
w
a
r
e
r
e
s
e
t
o
r
t
h
e
w
a
t
c
h
d
o
g
t
i
m
e
r
r
e
s
e
t
d
o
e
s
n
o
t
a
f
f
e
c
t
t
h
i
s
r
e
g
i
s
t
e
r
.
3
.
O
w
i
n
g
t
o
R
e
s
e
t
i
n
p
u
t
.4
.
I
n
t
h
e
c
a
s
e
o
f
R
E
S
E
T
p
i
n
=
H
r
e
t
a
i
n
i
n
g
.
O
s
c
i
l
l
a
t
i
o
n
s
t
o
p
d
e
t
e
c
t
i
o
n
r
e
g
i
s
t
e
r O
C
D 0
0
0
0
0
1
0
02
INT0 input filter select register INT0F XXXXX0002
0
0
0
01
6
0
0
0
11
6
0
0
0
21
6
0
0
0
31
6
0
0
0
41
6
0
0
0
51
6
0
0
0
61
6
0
0
0
71
6
0
0
0
81
6
0
0
0
91
6
0
0
0
A1
6
0
0
0
B1
6
0
0
0
C1
6
0
0
0
D1
6
0
0
0
E1
6
0
0
0
F1
6
0
0
1
01
6
0
0
1
11
6
0
0
1
21
6
0
0
1
31
6
0
0
1
41
6
0
0
1
51
6
0
0
1
61
6
0
0
1
71
6
0
0
1
81
6
0
0
1
91
6
0
0
1
A1
6
0
0
1
B1
6
0
0
1
C1
6
0
0
1
D1
6
0
0
1
E1
6
0
0
1
F1
6
0
0
2
01
6
0
0
2
11
6
0
0
2
21
6
0
0
2
31
6
0
0
2
41
6
0
0
2
51
6
0
0
2
61
6
0
0
2
71
6
0
0
2
81
6
0
0
2
91
6
0
0
2
A1
6
0
0
2
B1
6
0
0
2
C1
6
0
0
2
D1
6
0
0
2
E1
6
0
0
2
F1
6
0
0
3
01
6
0
0
3
11
6
0
0
3
21
6
0
0
3
31
6
0
0
3
41
6
0
0
3
51
6
0
0
3
61
6
0
0
3
71
6
0
0
3
81
6
0
0
3
91
6
0
0
3
A1
6
0
0
3
B1
6
0
0
3
C1
6
0
0
3
D1
6
0
0
3
E1
6
0
0
3
F1
6
A
d
d
r
e
s
s R
e
g
i
s
t
e
r S
y
m
b
o
l
After reset
A
d
d
r
e
s
s
m
a
t
c
h
i
n
t
e
r
r
u
p
t
r
e
g
i
s
t
e
r
0 R
M
A
D
0 0
01
60
01
6X
01
6
A
d
d
r
e
s
s
m
a
t
c
h
i
n
t
e
r
r
u
p
t
r
e
g
i
s
t
e
r
1 R
M
A
D
1 0
01
60
01
6X
01
6
W
a
t
c
h
d
o
g
t
i
m
e
r
r
e
s
e
t
r
e
g
i
s
t
e
r W
D
T
R X
X1
6
H
i
g
h
-
s
p
e
e
d
o
n
-
c
h
i
p
o
s
c
i
l
l
a
t
o
r
c
o
n
t
r
o
l
r
e
g
i
s
t
e
r
0 H
R
0 0
01
6
H
i
g
h
-
s
p
e
e
d
o
n
-
c
h
i
p
o
s
c
i
l
l
a
t
o
r
c
o
n
t
r
o
l
r
e
g
i
s
t
e
r
1 H
R
1 4
01
6
Voltage detection register 1 VCR1 000010002V
o
l
t
a
g
e
d
e
t
e
c
t
i
o
n
r
e
g
i
s
t
e
r
2 V
C
R
2 0
01
610
0
0
0
0
0
02
V
o
l
t
a
g
e
d
e
t
e
c
t
i
o
n
i
n
t
e
r
r
u
p
t
r
e
g
i
s
t
e
r D
4
I
N
T 0
01
6
X
:
U
n
d
e
f
i
n
e
dN
O
T
E
S
:
1
.
B
l
a
n
k
s
p
a
c
e
s
a
r
e
r
e
s
e
r
v
e
d
.
N
o
a
c
c
e
s
s
i
s
a
l
l
o
w
e
d
.
(1)
(2)
( 2
)
(2)
010000012
(3)
( 4
)
( 3
)
(4)
4. Special Function Register (SFR)SFR(Special Function Register) is the control register of peripheral functions. Tables 4.1 to 4.4 list the SFR
informationTable 4.1 SFR Information(1)(1)
Rev.1.20 Jan 27, 2006 page 11 of 27REJ03B0069-0120
R8C/13 Group 4. Special Function Register (SFR)
UART0 transmit interrupt control register S0TIC XXXXX0002
UART0 receive interrupt control register S0RIC XXXXX0002UART1 transmit interrupt control register S1TIC XXXXX0002UART1 receive interrupt control register S1RIC XXXXX0002
Key input interrupt control register KUPIC XXXXX0002
A
D
c
o
n
v
e
r
s
i
o
n
i
n
t
e
r
r
u
p
t
c
o
n
t
r
o
l
r
e
g
i
s
t
e
r A
D
I
C X
X
X
X
X
0
0
02
I N
T
1
i
n
t
e
r
r
u
p
t
c
o
n
t
r
o
l
r
e
g
i
s
t
e
r I
N
T
1
I
C X
X
X
X
X
0
0
02
INT2 interrupt control register INT2IC XXXXX0002
INT0 interrupt control register INT0IC XX00X0002
I N
T
3
i
n
t
e
r
r
u
p
t
c
o
n
t
r
o
l
r
e
g
i
s
t
e
r I
N
T
3
I
C X
X
X
X
X
0
0
02
0
0
4
01
6
0
0
4
11
6
0
0
4
21
6
0
0
4
31
6
0
0
4
41
6
0
0
4
51
6
0
0
4
61
6
0
0
4
71
6
0
0
4
81
6
0
0
4
91
6
0
0
4
A1
6
0
0
4
B1
6
0
0
4
C1
6
0
0
4
D1
6
0
0
4
E1
6
0
0
4
F1
6
0
0
5
01
6
0
0
5
11
6
0
0
5
21
6
0
0
5
31
6
0
0
5
41
6
0
0
5
51
6
0
0
5
61
6
0
0
5
71
6
0
0
5
81
6
0
0
5
91
6
0
0
5
A1
6
0
0
5
B1
6
0
0
5
C1
6
0
0
5
D1
6
0
0
5
E1
6
0
0
5
F1
6
0
0
6
01
6
0
0
6
11
6
0
0
6
21
6
0
0
6
31
6
0
0
6
41
6
0
0
6
51
6
0
0
6
61
6
0
0
6
71
6
0
0
6
81
6
0
0
6
91
6
0
0
6
A1
6
0
0
6
B1
6
0
0
6
C1
6
0
0
6
D1
6
0
0
6
E1
6
0
0
6
F1
6
0
0
7
01
6
0
0
7
11
6
0
0
7
21
6
0
0
7
31
6
0
0
7
41
6
0
0
7
51
6
0
0
7
61
6
0
0
7
71
6
0
0
7
81
6
0
0
7
91
6
0
0
7
A1
6
0
0
7
B1
6
0
0
7
C1
6
0
0
7
D1
6
0
0
7
E1
6
0
0
7
F1
6
A
d
d
r
e
s
s R
e
g
i
s
t
e
r Symbol A
f
t
e
r
r
e
s
e
t
Timer X interrupt control register TXIC XXXXX0002Timer Y interrupt control register TYIC XXXXX0002Timer Z interrupt control register TZIC XXXXX0002
Timer C interrupt control register TCIC XXXXX0002
Compare 1 interrupt control register CMP1IC XXXXX0002
Compare 0 interrupt control register CMP0IC XXXXX0002
X
:
U
n
d
e
f
i
n
e
dN
O
T
E
S
:
1
.
B
l
a
n
k
s
p
a
c
e
s
a
r
e
r
e
s
e
r
v
e
d
.
N
o
a
c
c
e
s
s
i
s
a
l
l
o
w
e
d
.
Table 4.2 SFR Information(2)(1)
Rev.1.20 Jan 27, 2006 page 12 of 27REJ03B0069-0120
R8C/13 Group 4. Special Function Register (SFR)
0
0
8
01
6
0
0
8
11
6
0
0
8
21
6
0
0
8
31
6
0
0
8
41
6
0
0
8
51
6
0
0
8
61
6
0
0
8
71
6
0
0
8
81
6
0
0
8
91
6
0
0
8
A1
6
0
0
8
B1
6
0
0
8
C1
6
0
0
8
D1
6
0
0
8
E1
6
0
0
8
F1
6
0
0
9
01
6
0
0
9
11
6
0
0
9
21
6
0
0
9
31
6
0
0
9
41
6
0
0
9
51
6
0
0
9
61
6
0
0
9
71
6
0
0
9
81
6
0
0
9
91
6
0
0
9
A1
6
0
0
9
B1
6
0
0
9
C1
6
0
0
9
D1
6
0
0
9
E1
6
0
0
9
F1
6
00A016
00A116
00A216
00A316
00A416
00A516
00A616
00A716
00A816
00A916
00AA16
00AB16
00AC16
00AD16
00AE16
00AF16
00B016
00B116
00B216
00B316
00B416
00B516
00B616
00B716
00B816
00B916
00BA16
00BB16
00BC16
00BD16
00BE16
00BF16
T
i
m
e
r
X
r
e
g
i
s
t
e
r T
X F
F1
6
T
i
m
e
r
Y
s
e
c
o
n
d
a
r
y
r
e
g
i
s
t
e
r T
Y
S
C F
F1
6
External input enable register INTEN 0016
P
r
e
s
c
a
l
e
r
Y
r
e
g
i
s
t
e
r P
R
E
Y F
F1
6
UART0 transmit/receive mode register U0MR 0016
U
A
R
T
0
t
r
a
n
s
m
i
t
b
u
f
f
e
r
r
e
g
i
s
t
e
r U
0
T
B X
X1
6X
X1
6
UART0 receive buffer register U0RB XX16XX16
U
A
R
T
1
t
r
a
n
s
m
i
t
/
r
e
c
e
i
v
e
m
o
d
e
r
e
g
i
s
t
e
r U
1
M
R 0
01
6
U
A
R
T
1
t
r
a
n
s
m
i
t
b
u
f
f
e
r
r
e
g
i
s
t
e
r U
1
T
B X
X1
6X
X1
6
U
A
R
T
1
r
e
c
e
i
v
e
b
u
f
f
e
r
r
e
g
i
s
t
e
r
U
1
R
B X
X1
6X
X1
6
U
A
R
T
0
b
i
t
r
a
t
e
r
e
g
i
s
t
e
r U
0
B
R
G X
X1
6
U
A
R
T
0
t
r
a
n
s
m
i
t
/
r
e
c
e
i
v
e
c
o
n
t
r
o
l
r
e
g
i
s
t
e
r
0 U
0
C
0 0
0
0
0
1
0
0
02U
A
R
T
0
t
r
a
n
s
m
i
t
/
r
e
c
e
i
v
e
c
o
n
t
r
o
l
r
e
g
i
s
t
e
r
1 U
0
C
1 0
0
0
0
0
0
1
02
U
A
R
T
1
b
i
t
r
a
t
e
r
e
g
i
s
t
e
r U
1
B
R
G X
X1
6
U
A
R
T
1
t
r
a
n
s
m
i
t
/
r
e
c
e
i
v
e
c
o
n
t
r
o
l
r
e
g
i
s
t
e
r
0 U
1
C
0 0
0
0
0
1
0
0
02U
A
R
T
1
t
r
a
n
s
m
i
t
/
r
e
c
e
i
v
e
c
o
n
t
r
o
l
r
e
g
i
s
t
e
r
1 U
1
C
1 0
0
0
0
0
0
1
02
U
A
R
T
t
r
a
n
s
m
i
t
/
r
e
c
e
i
v
e
c
o
n
t
r
o
l
r
e
g
i
s
t
e
r
2
U
C
O
N 0
01
6
A
d
d
r
e
s
s R
e
g
i
s
t
e
r Symbol A
f
t
e
r
r
e
s
e
t
T
i
m
e
r
Y
,
Z
m
o
d
e
r
e
g
i
s
t
e
r T
Y
Z
M
R 0
01
6
T
i
m
e
r
Y
p
r
i
m
a
r
y
r
e
g
i
s
t
e
r T
Y
P
R F
F1
6T
i
m
e
r
Y
,
Z
w
a
v
e
f
o
r
m
o
u
t
p
u
t
c
o
n
t
r
o
l
r
e
g
i
s
t
e
r P
U
M 0
01
6P
r
e
s
c
a
l
e
r
Z
r
e
g
i
s
t
e
r P
R
E
Z F
F1
6T
i
m
e
r
Z
s
e
c
o
n
d
a
r
y
r
e
g
i
s
t
e
r T
Z
S
C F
F1
6T
i
m
e
r
Z
p
r
i
m
a
r
y
r
e
g
i
s
t
e
r T
Z
P
R F
F1
6
T
i
m
e
r
Y
,
Z
o
u
t
p
u
t
c
o
n
t
r
o
l
r
e
g
i
s
t
e
r T
Y
Z
O
C 0
01
6T
i
m
e
r
X
m
o
d
e
r
e
g
i
s
t
e
r T
X
M
R 0
01
6P
r
e
s
c
a
l
e
r
X
r
e
g
i
s
t
e
r P
R
E
X F
F1
6
C
o
u
n
t
s
o
u
r
c
e
s
e
t
r
e
g
i
s
t
e
r T
C
S
S 0
01
6
T
i
m
e
r
C
r
e
g
i
s
t
e
r T
C 0
01
60
01
6
K
e
y
i
n
p
u
t
e
n
a
b
l
e
r
e
g
i
s
t
e
r K
I
E
N 0
01
6
Timer C control register 0 TCC0 0016T
i
m
e
r
C
c
o
n
t
r
o
l
r
e
g
i
s
t
e
r
1 T
C
C
1 0
01
6Capture, compare 0 register TM0 0016
0016Compare 1 register TM1 FF16
FF16
X
:
U
n
d
e
f
i
n
e
dN
O
T
E
S
:
1
.
B
l
a
n
k
s
p
a
c
e
s
a
r
e
r
e
s
e
r
v
e
d
.
N
o
a
c
c
e
s
s
i
s
a
l
l
o
w
e
d
.
2
.
W
h
e
n
o
u
t
p
u
t
c
o
m
p
a
r
e
m
o
d
e
(
t
h
e
T
C
C
1
3
b
i
t
i
n
t
h
e
T
C
C
1
r
e
g
i
s
t
e
r
=
1
)
i
s
s
e
l
e
c
t
e
d,
t
h
e
v
a
l
u
e
a
f
t
e
r
r
e
s
e
t
i
s
s
e
t
t
o
“
F
F
F
F1
6”.
(2)
Table 4.3 SFR Information(3)(1)
Rev.1.20 Jan 27, 2006 page 13 of 27REJ03B0069-0120
R8C/13 Group 4. Special Function Register (SFR)
0
0
C
01
6
0
0
C
11
6
0
0
C
21
6
0
0
C
31
6
0
0
C
41
6
0
0
C
51
6
0
0
C
61
6
0
0
C
71
6
0
0
C
81
6
0
0
C
91
6
0
0
C
A1
6
0
0
C
B1
6
0
0
C
C1
6
0
0
C
D1
6
0
0
C
E1
6
0
0
C
F1
6
0
0
D
01
6
0
0
D
11
6
0
0
D
21
6
0
0
D
31
6
0
0
D
41
6
0
0
D
51
6
0
0
D
61
6
0
0
D
71
6
0
0
D
81
6
0
0
D
91
6
0
0
D
A1
6
0
0
D
B1
6
0
0
D
C1
6
0
0
D
D1
6
0
0
D
E1
6
0
0
D
F1
6
0
0
E
01
6
0
0
E
11
6
0
0
E
21
6
0
0
E
31
6
0
0
E
41
6
0
0
E
51
6
0
0
E
61
6
0
0
E
71
6
0
0
E
81
6
0
0
E
91
6
0
0
E
A1
6
0
0
E
B1
6
0
0
E
C1
6
0
0
E
D1
6
0
0
E
E1
6
0
0
E
F1
6
0
0
F
01
6
0
0
F
11
6
0
0
F
21
6
0
0
F
31
6
0
0
F
41
6
0
0
F
51
6
0
0
F
61
6
0
0
F
71
6
0
0
F
81
6
0
0
F
91
6
0
3
F
A1
6
0
0
F
B1
6
0
0
F
C1
6
0
0
F
D1
6
0
0
F
E1
6
0
0
F
F1
6
0
1
B
31
6
0
1
B
41
6
0
1
B
51
6
0
1
B
61
6
0
1
B
71
6
A
D
r
e
g
i
s
t
e
r A
D X
X1
6X
X1
6
A
D
c
o
n
t
r
o
l
r
e
g
i
s
t
e
r
0 A
D
C
O
N
0 0
0
0
0
0
X
X
X2
A
D
c
o
n
t
r
o
l
r
e
g
i
s
t
e
r
2 A
D
C
O
N
2 0
01
6
A
D
c
o
n
t
r
o
l
r
e
g
i
s
t
e
r
1
A
D
C
O
N
1 0
01
6
P
o
r
t
P
0
r
e
g
i
s
t
e
r P
0 X
X1
6
P
o
r
t
P
0
d
i
r
e
c
t
i
o
n
r
e
g
i
s
t
e
r P
D
0 0
01
6P
o
r
t
P
1
r
e
g
i
s
t
e
r P
1 X
X1
6
P
o
r
t
P
1
d
i
r
e
c
t
i
o
n
r
e
g
i
s
t
e
r P
D
1 0
01
6
P
o
r
t
P
3
r
e
g
i
s
t
e
r P
3 X
X1
6
P
o
r
t
P
3
d
i
r
e
c
t
i
o
n
r
e
g
i
s
t
e
r P
D
3 0
01
6P
o
r
t
P
4
r
e
g
i
s
t
e
r P
4 X
X1
6
P
o
r
t
P
4
d
i
r
e
c
t
i
o
n
r
e
g
i
s
t
e
r P
D
4 0
01
6
P
u
l
l
-
u
p
c
o
n
t
r
o
l
r
e
g
i
s
t
e
r
0
P
U
R
0 0
0
X
X
0
0
0
02
P
o
r
t
P
1
d
r
i
ve
c
a
p
a
c
i
t
y
c
o
n
t
r
o
l
r
e
g
i
s
t
e
r
D
R
R 0
01
6
R
e
g
i
s
t
e
r S
y
m
b
o
l A
f
t
e
r
r
e
s
e
tA
d
d
r
e
s
s
P
u
l
l
-
u
p
c
o
n
t
r
o
l
r
e
g
i
s
t
e
r
1
P
U
R
1 X
X
X
X
X
X
0
X2
F
l
a
s
h
m
e
m
o
r
y
c
o
n
t
r
o
l
r
e
g
i
s
t
e
r
1
F
M
R
1 1
0
0
0
0
0
0
X2
F
l
a
s
h
m
e
m
o
r
y
c
o
n
t
r
o
l
r
e
g
i
s
t
e
r
0
F
M
R
0 0
0
0
0
0
0
0
12
T
i
m
e
r
C
o
u
t
p
u
t
c
o
n
t
r
o
l
r
e
g
i
s
t
e
r
T
C
O
U
T 0
01
6
F
l
a
s
h
m
e
m
o
r
y
c
o
n
t
r
o
l
r
e
g
i
s
t
e
r
4
F
M
R
4 0
1
0
0
0
0
0
02
0
F
F
F
F1
6 O
p
t
i
o
n
f
u
n
c
t
i
o
n
s
e
l
e
c
t
r
e
g
i
s
t
e
r
O
F
SX
:
U
n
d
e
f
i
n
e
dN
O
T
E
S
:
1
.
B
l
a
n
k
c
o
l
u
m
n
s
,
0
1
0
01
6
t
o
0
1
B
21
6
a
n
d
0
1
B
81
6
t
o
0
2
F
F1
6
a
r
e
a
l
l
r
e
s
e
r
v
e
d
.
N
o
a
c
c
e
s
s
i
s
a
l
l
o
w
e
d
.
2
.
T
h
e
w
a
t
c
h
d
o
g
t
i
m
e
r
c
o
n
t
r
o
l
b
i
t
i
s
a
s
s
i
g
n
e
d
.
R
e
f
e
r
t
o
"
F
i
g
u
r
e
1
1
.
2
O
F
S
,
W
D
C
,
W
D
T
R
a
n
d
W
D
T
S
r
e
g
i
s
t
e
r
s
"
o
f
H
a
r
d
w
a
r
e
M
a
n
u
a
l
f
o
r
d
e
t
a
i
l
s
(2) ( N
o
t
e
2
)
Table 4.4 SFR Information(4)(1)
R8C/13 Group 5. Electrical Characteristics
Rev.1.20 Jan 27, 2006 page 14 of 27REJ03B0069-0120
5. Electrical Characteristics
Operating ambient temperature
Parameter UnitSupply voltage
Output voltageVO
Pd Power dissipation
Storage temperature
Rated valueV
V
ConditionVCC
Tstg
Topr
Symbol
mW
VCC=AVCC
VAVCC
V
-0.3 to 6.5
-65 to 150
300
-20 to 85 / -40 to 85 (D version) C
Topr=25 C
Analog supply voltage VCC=AVCC -0.3 to 6.5
VI Input voltage -0.3 to VCC+0.3
-0.3 to VCC+0.3
C
Table 5.1 Absolute Maximum Ratings
Table 5.2 Recommended Operating Conditions
2
.
7 5.5T
y
p
. M
a
x
. U
n
i
tP
a
r
a
m
e
t
e
r
VC
C S
u
p
p
l
y
v
o
l
t
a
g
e
Symbol M
i
n
.S
t
a
n
d
a
r
d
A
n
a
l
o
g
s
u
p
p
l
y
v
o
l
t
a
g
e VC
C(3
)A
V
c
c VV0
0A
n
a
l
o
g
s
u
p
p
l
y
v
o
l
t
a
g
e
S
u
p
p
l
y
v
o
l
t
a
g
e
VI
H
V
s
s
A
V
s
s
0
.
8
VC
C
V
VVC
C
0
.
2
VC
C" L
"
i
n
p
u
t
v
o
l
t
a
g
e
" H
"
i
n
p
u
t
v
o
l
t
a
g
e
V
f (XIN) M
a
i
n
c
l
o
c
k
i
n
p
u
t
o
s
c
i
l
l
a
t
i
o
n
f
r
e
q
u
e
n
c
y
V
VI
L
103.0V ≤ Vcc ≤ 5.5V2.7V ≤ Vcc < 3.0V
MHzMHz
NOTES: 1. VCC = AVCC = 2.7 to 5.5V at Topr = -20 to 85 °C / -40 to 85 °C, unless otherwise specified. 2. The typical values when average output current is 100ms. 3. Hold Vcc=AVcc.
0
IO
H
(
s
u
m
) " H
"
p
e
a
k
a
l
l
o
u
t
p
u
t
c
u
r
r
e
n
t
s
Conditions
S
u
m
o
f
a
l
l
p
i
n
s
'
I
O
H
(
p
e
a
k
)-
6
0
.
0 mA
IOH (peak) "H" peak output current -
1
0
.
0 mAIOH (avg) "
H
"
a
v
e
r
a
g
e
o
u
t
p
u
t
c
u
r
r
e
n
t -
5
.
0 m
A
IO
L
(
s
u
m
) "L" peak all output currents
Sum of all pins' IOL (peak) 60 mA
IOL (peak) "L" peak output current
Except P10 to P17
P10 to P17
10 m
A
Drive ability HIGH
D
r
i
v
e
a
b
i
l
i
t
y
L
O
W
3
0
10
m
A
m
A
IOL (avg)"L" average output current
Except P10 to P17
P10 to P17 D
r
i
v
e
a
b
i
l
i
t
y
H
I
G
H
Drive ability LOW
515
5
mA
m
AmA
00
20
R8C/13 Group 5. Electrical Characteristics
Rev.1.20 Jan 27, 2006 page 15 of 27REJ03B0069-0120
Table 5.3 A/D Conversion CharacteristicsS
t
a
n
d
a
r
dM
i
n
. T
y
p
. M
a
x
.– R
e
s
o
l
u
t
i
o
n B
i
tVref =VCC 1
0
Symbol Parameter Measuring condition Unit
LSB±3
RL
A
D
D
E
R
tC
O
N
V
L a
d
d
e
r
r
e
s
i
s
t
a
n
c
e
Conversion time
R
e
f
e
r
e
n
c
e
v
o
l
t
a
g
e
A
n
a
l
o
g
i
n
p
u
t
v
o
l
t
a
g
e
V
VI
A
VR
E
F
0 Vr
e
f
N
O
T
E
S
:
1
.
VC
C=
A
VC
C=
2
.
7
t
o
5
.
5
V
a
t
T
o
p
r
=
-
2
0
t
o
8
5
°
C
/
-
4
0
t
o
8
5
°
C
,
u
n
l
e
s
s
o
t
h
e
r
w
i
s
e
s
p
e
c
i
f
i
e
d
.
2
.
I
f
fA
D
e
x
c
e
e
d
s
1
0
M
H
z
m
o
r
e
,
d
i
v
i
d
e
t
h
e
fA
D
a
n
d
h
o
l
d
A
/
D
o
p
e
r
a
t
i
n
g
c
l
o
c
k
f
r
e
q
u
e
n
c
y
(
ØA
D
)
1
0
M
H
z
o
r
b
e
l
o
w
.
3
.
I
f
t
h
e
A
V
c
c
i
s
l
e
s
s
t
h
a
n
4
.
2
V
,
d
i
v
i
d
e
t
h
e
fA
D
a
n
d
h
o
l
d
A
/
D
o
p
e
r
a
t
i
n
g
c
l
o
c
k
f
r
e
q
u
e
n
c
y
(
ØA
D
)
fA
D/
2
o
r
b
e
l
o
w
.
4
.
H
o
l
d
V
c
c
=
V
r
e
f
.
ø
A
D
=
1
0
M
H
z
,
V
r
e
f
=
V
c
c
=
5
.
0
V
VR
E
F=
VC
C
–
A
b
s
o
l
u
t
e
a
c
c
u
r
a
c
y– 1
0
b
i
t
m
o
d
e
8
b
i
t
m
o
d
e ø
A
D
=
1
0
M
H
z
,
V
r
e
f
=
V
c
c
=
5
.
0
V ±
2 L
S
B
1 0
b
i
t
m
o
d
e
8
b
i
t
m
o
d
e
ø
A
D
=
1
0
M
H
z
,
V
r
e
f
=
V
c
c
=
3
.
3
V(3
) ± 5 L
S
B
ø
A
D
=
1
0
M
H
z
,
V
r
e
f
=
V
c
c
=
3
.
3
V(
3
) ± 2 L
S
B
10 40 kΩ
10 bit mode
8
b
i
t
m
o
d
e
ø
A
D
=
1
0
M
H
z
,
V
r
e
f
=
V
c
c
=
5
.
0
V
ø
A
D
=
1
0
M
H
z
,
V
r
e
f
=
V
c
c
=
5
.
0
V
3.32.8
µs
µs
V
A
/
D
o
p
e
r
a
t
i
n
gc
l
o
c
k
f
r
e
q
u
e
n
c
y(2
)W
i
t
h
o
u
t
s
a
m
p
l
e
&
h
o
l
d
With sample & hold
0 .
2
5 1
0 M
H
z
1.0 1 0 MHz
VC
C(
4
)
Figure 5.1 Port P0 to P4 measurement circuit
P0
P1
P2
P3
P4
30pF
R8C/13 Group 5. Electrical Characteristics
Rev.1.20 Jan 27, 2006 page 16 of 27REJ03B0069-0120
Table 5.4 Flash Memory (Program ROM) Electrical Characteristics
Byte program time
B
l
o
c
k
e
r
a
s
e
t
i
m
e
P
r
o
g
r
a
m
,
E
r
a
s
e
V
o
l
t
a
g
e
R
e
a
d
V
o
l
t
a
g
e
5
0
0
.
4
µ
s
P
a
r
a
m
e
t
e
rStandard
Min. T
y
p
. M
a
x U
n
i
tMeasuring conditionS
y
m
b
o
l
–
–
–
–
P
r
o
g
r
a
m
,
E
r
a
s
e
T
e
m
p
e
r
a
t
u
r
e
2
.
7
2
.
7
0
5
.
5
5
.
5
60
s
V
V
°
C–
– P
r
o
g
r
a
m
/
E
r
a
s
e
e
n
d
u
r
a
n
c
e(2
) 1000(3) ti
m
e
s
T
i
m
e
d
e
l
a
y
f
r
o
m
S
u
s
p
e
n
d
R
e
q
u
e
s
t
u
n
t
i
l
E
r
a
s
e
S
u
s
p
e
n
d
8 m
std
(
S
R
-
E
S
)
D
a
t
a
h
o
l
d
t
i
m
e(
7
)– Ambient temperature = 55 °C
y
e
a
r20
E
r
a
s
e
S
u
s
p
e
n
d
R
e
q
u
e
s
t
I
n
t
e
r
v
a
l– 10 m
s
N
O
T
E
S
:
1
.
R
e
f
e
r
e
n
c
e
d
t
o
VC
C=
A
V
c
c
=
2
.
7
t
o
5
.
5
V
a
t
T
o
p
r
=
0
°
C
t
o
6
0
°
C
u
n
l
e
s
s
o
t
h
e
r
w
i
s
e
s
p
e
c
i
f
i
e
d
.
2
.
D
e
f
i
n
i
t
i
o
n
o
f
P
r
o
g
r
a
m
/
E
r
a
s
eT
h
e
e
n
d
u
r
a
n
c
e
o
f
P
r
o
g
r
a
m
/
E
r
a
s
e
s
h
o
w
s
a
t
i
m
e
f
o
r
e
a
c
h
b
l
o
c
k
.I
f
t
h
e
p
r
o
g
r
a
m
/
e
r
a
s
e
n
u
m
b
e
r
i
s
“
n
”
(
n
=
1
0
0
0
,
1
0
0
0
0
)
,
“
n
”
t
i
m
e
s
e
r
a
s
e
c
a
n
b
e
p
e
r
f
o
r
m
e
d
f
o
r
e
a
c
h
b
l
o
c
k
.F
o
r
e
x
a
m
p
l
e
,
i
f
p
e
r
f
o
r
m
i
n
g
o
n
e
-
b
y
t
e
w
r
i
t
e
t
o
t
h
e
d
i
s
t
i
n
c
t
a
d
d
r
e
s
s
e
s
o
n
B
l
o
c
k
A
o
f
2
K
-
b
y
t
e
b
l
o
c
k
2
0
4
8
t
i
m
e
s
a
n
d
t
h
e
ne
r
a
s
i
n
g
t
h
a
t
b
l
o
c
k
,
t
h
e
n
u
m
b
e
r
o
f
P
r
o
g
r
a
m
/
E
r
a
s
e
c
y
c
l
e
s
i
s
o
n
e
t
i
m
e
.H
o
w
e
v
e
r
,
p
e
r
f
o
r
m
i
n
g
m
u
l
t
i
p
l
e
w
r
i
t
e
s
t
o
t
h
e
s
a
m
e
a
d
d
r
e
s
s
b
e
f
o
r
e
a
n
e
r
a
s
e
o
p
e
r
a
t
i
o
n
i
s
p
r
o
h
i
b
i
t
e
d
(
o
v
e
r
w
r
i
t
i
n
gp
r
o
h
i
b
i
t
e
d
)
.3
.
N
u
m
b
e
r
s
o
f
P
r
o
g
r
a
m
/
E
r
a
s
e
c
y
c
l
e
s
f
o
r
w
h
i
c
h
a
l
l
e
l
e
c
t
r
i
c
a
l
c
h
a
r
a
c
t
e
r
i
s
t
i
c
s
i
s
g
u
a
r
a
n
t
e
e
d
.4
.
T
o
r
e
d
u
c
e
t
h
e
n
u
m
b
e
r
o
f
P
r
o
g
r
a
m
/
E
r
a
s
e
c
y
c
l
e
s
,
a
b
l
o
c
k
e
r
a
s
e
s
h
o
u
l
d
i
d
e
a
l
l
y
b
e
p
e
r
f
o
r
m
e
d
a
f
t
e
r
w
r
i
t
i
n
g
i
n
s
e
r
i
e
s
a
sm
a
n
y
d
i
s
t
i
n
c
t
a
d
d
r
e
s
s
e
s
(
o
n
l
y
o
n
e
t
i
m
e
e
a
c
h
)
a
s
p
o
s
s
i
b
l
e
.
I
f
p
r
o
g
r
a
m
m
i
n
g
a
s
e
t
o
f
1
6
b
y
t
e
s
,
w
r
i
t
e
u
p
t
o
1
2
8
s
e
t
s
a
n
dt
h
e
n
e
r
a
s
e
t
h
e
m
o
n
e
t
i
m
e
.
T
h
i
s
w
i
l
l
r
e
s
u
l
t
i
n
i
d
e
a
l
l
y
r
e
d
u
c
i
n
g
t
h
e
n
u
m
b
e
r
o
f
P
r
o
g
r
a
m
/
E
r
a
s
e
c
y
c
l
e
s
.
A
d
d
i
t
i
o
n
a
l
l
y
,a
v
e
r
a
g
i
n
g
t
h
e
n
u
m
b
e
r
o
f
P
r
o
g
r
a
m
/
E
r
a
s
e
c
y
c
l
e
s
f
o
r
B
l
o
c
k
A
a
n
d
B
w
i
l
l
b
e
m
o
r
e
e
f
f
e
c
t
i
v
e
.
I
t
i
s
i
m
p
o
r
t
a
n
t
t
o
t
r
a
c
k
t
h
e
t
o
t
a
ln
u
m
b
e
r
o
f
b
l
o
c
k
e
r
a
s
e
s
a
n
d
r
e
s
t
r
i
c
t
t
h
e
n
u
m
b
e
r
.5
.
I
f
e
r
r
o
r
o
c
c
u
r
s
d
u
r
i
n
g
b
l
o
c
k
e
r
a
s
e
,
a
t
t
e
m
p
t
t
o
e
x
e
c
u
t
e
t
h
e
c
l
e
a
r
s
t
a
t
u
s
r
e
g
i
s
t
e
r
c
o
m
m
a
n
d
,
t
h
e
n
t
h
e
b
l
o
c
k
e
r
a
s
ec
o
m
m
a
n
d
a
t
l
e
a
s
t
t
h
r
e
e
t
i
m
e
s
u
n
t
i
l
t
h
e
e
r
a
s
e
e
r
r
o
r
d
i
s
a
p
p
e
a
r
s
.6
.
C
u
s
t
o
m
e
r
s
d
e
s
i
r
i
n
g
P
r
o
g
r
a
m
/
E
r
a
s
e
f
a
i
l
u
r
e
r
a
t
e
i
n
f
o
r
m
a
t
i
o
n
s
h
o
u
l
d
c
o
n
t
a
c
t
t
h
e
i
r
R
e
n
e
s
a
s
t
e
c
h
n
i
c
a
l
s
u
p
p
o
r
t
r
e
p
r
e
s
e
n
t
a
-t
i
v
e
.7
.
T
h
e
d
a
t
a
h
o
l
d
t
i
m
e
i
n
c
l
u
d
e
s
t
i
m
e
t
h
a
t
t
h
e
p
o
w
e
r
s
u
p
p
l
y
i
s
o
f
f
o
r
t
h
e
c
l
o
c
k
i
s
n
o
t
s
u
p
p
l
i
e
d
.
R8C/13 Group 5. Electrical Characteristics
Rev.1.20 Jan 27, 2006 page 17 of 27REJ03B0069-0120
Table 5.5 Flash Memory (Data flash Block A, Block B) Electrical Characteristics(4)
B
y
t
e
p
r
o
g
r
a
m
t
i
m
e
(
p
r
o
g
r
a
m
/
e
r
a
s
e
e
n
d
u
r
a
n
c
e≤1
0
0
0
t
i
m
e
s
)
P
r
o
g
r
a
m
,
E
r
a
s
e
V
o
l
t
a
g
e
R
e
a
d
V
o
l
t
a
g
e
65
0.3
µs
P
a
r
a
m
e
t
e
rS
t
a
n
d
a
r
d
M
i
n
. T
y
p
. M
a
x U
n
i
t
N
O
T
E
S
:
1
.
R
e
f
e
r
e
n
c
e
d
t
o
VC
C=
A
V
c
c
=
2
.
7
t
o
5
.
5
V
a
t
T
o
p
r
=
-
2
0
°
C
t
o
8
5
°
C
/
-
4
0
°
C
t
o
8
5
°
C
u
n
l
e
s
s
o
t
h
e
r
w
i
s
e
s
p
e
c
i
f
i
e
d
.
2
.
D
e
f
i
n
i
t
i
o
n
o
f
P
r
o
g
r
a
m
/
E
r
a
s
eT
h
e
e
n
d
u
r
a
n
c
e
o
f
P
r
o
g
r
a
m
/
E
r
a
s
e
s
h
o
w
s
a
t
i
m
e
f
o
r
e
a
c
h
b
l
o
c
k
.I
f
t
h
e
p
r
o
g
r
a
m
/
e
r
a
s
e
n
u
m
b
e
r
i
s
“
n
”
(
n
=
1
0
0
0
,
1
0
0
0
0
)
,
“
n
”
t
i
m
e
s
e
r
a
s
e
c
a
n
b
e
p
e
r
f
o
r
m
e
d
f
o
r
e
a
c
h
b
l
o
c
k
.F
o
r
e
x
a
m
p
l
e
,
i
f
p
e
r
f
o
r
m
i
n
g
o
n
e
-
b
y
t
e
w
r
i
t
e
t
o
t
h
e
d
i
s
t
i
n
c
t
a
d
d
r
e
s
s
e
s
o
n
B
l
o
c
k
A
o
f
2
K
-
b
y
t
e
b
l
o
c
k
2
0
4
8
t
i
m
e
s
a
n
d
t
h
e
ne
r
a
s
i
n
g
t
h
a
t
b
l
o
c
k
,
t
h
e
n
u
m
b
e
r
o
f
P
r
o
g
r
a
m
/
E
r
a
s
e
c
y
c
l
e
s
i
s
o
n
e
t
i
m
e
.H
o
w
e
v
e
r
,
p
e
r
f
o
r
m
i
n
g
m
u
l
t
i
p
l
e
w
r
i
t
e
s
t
o
t
h
e
s
a
m
e
a
d
d
r
e
s
s
b
e
f
o
r
e
a
n
e
r
a
s
e
o
p
e
r
a
t
i
o
n
i
s
p
r
o
h
i
b
i
t
e
d
(
o
v
e
r
w
r
i
t
i
n
gp
r
o
h
i
b
i
t
e
d
)
.3
.
N
u
m
b
e
r
s
o
f
P
r
o
g
r
a
m
/
E
r
a
s
e
c
y
c
l
e
s
f
o
r
w
h
i
c
h
a
l
l
e
l
e
c
t
r
i
c
a
l
c
h
a
r
a
c
t
e
r
i
s
t
i
c
s
i
s
g
u
a
r
a
n
t
e
e
d
.4
.
T
a
b
l
e
5
.
5
a
p
p
l
i
e
s
f
o
r
B
l
o
c
k
A
o
r
B
w
h
e
n
t
h
e
P
r
o
g
r
a
m
/
E
r
a
s
e
c
y
c
l
e
s
a
r
e
m
o
r
e
t
h
a
n
1
0
0
0
.
T
h
e
b
y
t
e
p
r
o
g
r
a
m
t
i
m
e
u
p
t
o1
0
0
0
c
y
c
l
e
s
a
r
e
t
h
e
s
a
m
e
a
s
t
h
a
t
o
f
t
h
e
p
r
o
g
r
a
m
a
r
e
a
(
s
e
e
T
a
b
l
e
5
.
4
)
.5
.
T
o
r
e
d
u
c
e
t
h
e
n
u
m
b
e
r
o
f
P
r
o
g
r
a
m
/
E
r
a
s
e
c
y
c
l
e
s
,
a
b
l
o
c
k
e
r
a
s
e
s
h
o
u
l
d
i
d
e
a
l
l
y
b
e
p
e
r
f
o
r
m
e
d
a
f
t
e
r
w
r
i
t
i
n
g
i
n
s
e
r
i
e
s
a
sm
a
n
y
d
i
s
t
i
n
c
t
a
d
d
r
e
s
s
e
s
(
o
n
l
y
o
n
e
t
i
m
e
e
a
c
h
)
a
s
p
o
s
s
i
b
l
e
.
I
f
p
r
o
g
r
a
m
m
i
n
g
a
s
e
t
o
f
1
6
b
y
t
e
s
,
w
r
i
t
e
u
p
t
o
1
2
8
s
e
t
s
a
n
dt
h
e
n
e
r
a
s
e
t
h
e
m
o
n
e
t
i
m
e
.
T
h
i
s
w
i
l
l
r
e
s
u
l
t
i
n
i
d
e
a
l
l
y
r
e
d
u
c
i
n
g
t
h
e
n
u
m
b
e
r
o
f
P
r
o
g
r
a
m
/
E
r
a
s
e
c
y
c
l
e
s
.
A
d
d
i
t
i
o
n
a
l
l
y
,a
v
e
r
a
g
i
n
g
t
h
e
n
u
m
b
e
r
o
f
P
r
o
g
r
a
m
/
E
r
a
s
e
c
y
c
l
e
s
f
o
r
B
l
o
c
k
A
a
n
d
B
w
i
l
l
b
e
m
o
r
e
e
f
f
e
c
t
i
v
e
.
I
t
i
s
i
m
p
o
r
t
a
n
t
t
o
t
r
a
c
k
t
h
e
t
o
t
a
ln
u
m
b
e
r
o
f
b
l
o
c
k
e
r
a
s
e
s
a
n
d
r
e
s
t
r
i
c
t
t
h
e
n
u
m
b
e
r
.6
.
I
f
e
r
r
o
r
o
c
c
u
r
s
d
u
r
i
n
g
b
l
o
c
k
e
r
a
s
e
,
a
t
t
e
m
p
t
t
o
e
x
e
c
u
t
e
t
h
e
c
l
e
a
r
s
t
a
t
u
s
r
e
g
i
s
t
e
r
c
o
m
m
a
n
d
,
t
h
e
n
t
h
e
b
l
o
c
k
e
r
a
s
ec
o
m
m
a
n
d
a
t
l
e
a
s
t
t
h
r
e
e
t
i
m
e
s
u
n
t
i
l
t
h
e
e
r
a
s
e
e
r
r
o
r
d
i
s
a
p
p
e
a
r
s
.7
.
C
u
s
t
o
m
e
r
s
d
e
s
i
r
i
n
g
P
r
o
g
r
a
m
/
E
r
a
s
e
f
a
i
l
u
r
e
r
a
t
e
i
n
f
o
r
m
a
t
i
o
n
s
h
o
u
l
d
c
o
n
t
a
c
t
t
h
e
i
r
R
e
n
e
s
a
s
t
e
c
h
n
i
c
a
l
s
u
p
p
o
r
t
r
e
p
r
e
s
e
n
t
a
-t
i
v
e
.8
.
-
4
0
°C
f
o
r
D
v
e
r
s
i
o
n
.9
.
T
h
e
d
a
t
a
h
o
l
d
t
i
m
e
i
n
c
l
u
d
e
s
t
i
m
e
t
h
a
t
t
h
e
p
o
w
e
r
s
u
p
p
l
y
i
s
o
f
f
o
r
t
h
e
c
l
o
c
k
i
s
n
o
t
s
u
p
p
l
i
e
d
.
M
e
a
s
u
r
i
n
g
c
o
n
d
i
t
i
o
nSymbol
–
–
–
P
r
o
g
r
a
m
/
E
r
a
s
e
T
e
m
p
e
r
a
t
u
r
e
2.7
2.7
- 2
0
(
-
4
0
)(8
)
5
.
5
5
.
5
8
5
s
V
V
°
C
–
– P
r
o
g
r
a
m
/
E
r
a
s
e
e
n
d
u
r
a
n
c
e(2
) 1
0
0
0
0(3
) t
i
m
e
s
T
i
m
e
d
e
l
a
y
f
r
o
m
S
u
s
p
e
n
d
R
e
q
u
e
s
t
u
n
t
i
l
E
r
a
s
e
S
u
s
p
e
n
d
m
std
(
S
R
-
E
S
)
B
y
t
e
p
r
o
g
r
a
m
t
i
m
e
(
p
r
o
g
r
a
m
/
e
r
a
s
e
e
n
d
u
r
a
n
c
e>1
0
0
0
t
i
m
e
s
)
B
l
o
c
k
e
r
a
s
e
t
i
m
e
(
p
r
o
g
r
a
m
/
e
r
a
s
e
e
n
d
u
r
a
n
c
e≤1
0
0
0
t
i
m
e
s
)B
l
o
c
k
e
r
a
s
e
t
i
m
e
(
p
r
o
g
r
a
m
/
e
r
a
s
e
e
n
d
u
r
a
n
c
e>
1
0
0
0
t
i
m
e
s
)
–
–
–
D
a
t
a
h
o
l
d
t
i
m
e(
9
)
–
A
m
b
i
e
n
t
t
e
m
p
e
r
a
t
u
r
e
=
5
5
°
C
50
0.2
4
0
0
9
8
2
0
s
µ
s
y
e
a
r
E
r
a
s
e
S
u
s
p
e
n
d
R
e
q
u
e
s
t
I
n
t
e
r
v
a
l– 10 m
s
FMR46
Erase-suspend request(interrupt request)
td(SR-ES)
Figure 5.2 Time delay from Suspend Request until Erase Suspend
R8C/13 Group 5. Electrical Characteristics
Rev.1.20 Jan 27, 2006 page 18 of 27REJ03B0069-0120
Table 5.7 Reset Circuit Electrical Characteristics (When Using Hardware Reset 2(1, 3))
S
y
m
b
o
l StandardT
y
p
. U
n
i
tMeasuring condition
M
i
n
. M
a
x
.P
a
r
a
m
e
t
e
r
V
p
o
r
2 P
o
w
e
r
-
o
n
r
e
s
e
t
v
a
l
i
d
v
o
l
t
a
g
e VV
d
e
t
N
O
T
E
S
:
1
.
T
h
e
v
o
l
t
a
g
e
d
e
t
e
c
t
i
o
n
c
i
r
c
u
i
t
w
h
i
c
h
i
s
e
m
b
e
d
d
e
d
i
n
a
m
i
c
r
o
c
o
m
p
u
t
e
r
i
s
a
f
a
c
t
o
r
t
o
g
e
n
e
r
a
t
e
t
h
e
h
a
r
d
w
a
r
e
r
e
s
e
t
2
.
R
e
f
e
r
t
o
5
.
1
.
2
H
a
r
d
w
a
r
e
R
e
s
e
t
2
o
f
H
a
r
d
w
a
r
e
M
a
n
u
a
l
f
o
r
d
e
t
a
i
l
s
.
2
.
T
h
i
s
c
o
n
d
i
t
i
o
n
i
s
n
o
t
a
p
p
l
i
c
a
b
l
e
w
h
e
n
u
s
i
n
g
VC
C ≥
1
.
0
V
.
3
.
W
h
e
n
t
u
r
n
i
n
g
p
o
w
e
r
o
n
a
f
t
e
r
t
h
e
e
x
t
e
r
n
a
l
p
o
w
e
r
h
a
s
b
e
e
n
h
e
l
d
b
e
l
o
w
t
h
e
v
a
l
i
d
v
o
l
t
a
g
e
(
V
p
o
r
1
)
f
o
r
g
r
e
a
t
e
r
t
h
a
n
1
0
s
e
c
o
n
d
s
,
r
e
f
e
r
t
o
T
a
b
l
e
5
.
8
R
e
s
e
t
C
i
r
c
u
i
t
E
l
e
c
t
r
i
c
a
l
C
h
a
r
a
c
t
e
r
i
s
t
i
c
s
(
W
h
e
n
N
o
t
U
s
i
n
g
H
a
r
d
w
a
r
e
R
e
s
e
t
2
)
.
4
.
t
w
(
p
o
r
2
)
i
s
t
i
m
e
t
o
h
o
l
d
t
h
e
e
x
t
e
r
n
a
l
p
o
w
e
r
b
e
l
o
w
e
f
f
e
c
t
i
v
e
v
o
l
t
a
g
e
(
V
p
o
r
2
)
.
S
u
p
p
l
y
v
o
l
t
a
g
e
r
i
s
i
n
g
t
i
m
e
w
h
e
n
p
o
w
e
r
-
o
n
r
e
s
e
t
i
s
c
a
n
c
e
l
e
d(2
)tW(
V
p
o
r
2
-
V
d
e
t
)m
s1
0
0
–
2
0
°
C
≤
T
o
p
r
<
8
5
°
C
–
2
0
°
C
≤
T
o
p
r
<
8
5
°
C
,
tW(
p
o
r
2
)
≥
0
s(4
)
Figure 5.3 Reset Circuit Electrical Characteristics
Table 5.8 Reset Circuit Electrical Characteristics (When Not Using Hardware Reset 2)
Vpor1
Vcc min
Vdet(3) Vdet(3)
tw(por1) tw(Vpor1–Vdet)
Sampling time(1,2)
Internal reset signal(“L” effective)
fRING-S1 X 32 fRING-S
1 X 32
Vpor2
NOTES: 1. Hold the voltage of the microcomputer operation voltage range (Vccmin or above) within sampling time. 2. A sampling clock is selectable. Refer to “5.4 Voltage Detection Circuit” of Hardware manual for details. 3. Vdet shows the voltage detection level of the voltage detection circuit. Refer to “5.4 Voltage Detection Circuit” of Hardware manual for details.
tw(por2) tw(Vpor2 –Vdet)
Table 5.6 Voltage Detection Circuit Electrical Characteristics
Symbol Standard Typ. Unit Measuring condition
Min. Max. Parameter
Vdet Voltage detection level V3.8 4.3
NOTES: 1. The measuring condition is Vcc=AVcc=2.7V to 5.5V and Topr=-40°C to 85°C. 2. This shows the time until the voltage detection interrupt request is generated since the voltage passes Vdet. 3. This shows the required time until the voltage detection circuit operates when setting to "1" again after setting the VC27 bit in the VCR2 register to “0”.
Voltage detection interrupt request generating time(2) 40
nAVoltage detection circuit self consumption current
Waiting time until voltage detection circuit operation starts(3)td(E-A)
VC27=1, VCC=5.0V
3.3
20
600
µs
µs
Vccmin Microcomputer operation voltage minimum value 2.7 V
Symbol S
t
a
n
d
a
r
dT
y
p
. U
n
i
tM
e
a
s
u
r
i
n
g
c
o
n
d
i
t
i
o
n
Min. M
a
x
.Parameter
0
.
1
N
O
T
E
S
:
1
.
W
h
e
n
n
o
t
u
s
i
n
g
h
a
r
d
w
a
r
e
r
e
s
e
t
2
,
u
s
e
w
i
t
h
V
c
c
≥
2
.
7
V
.
2
.
t
w
(
p
o
r
1
)
i
s
t
i
m
e
t
o
h
o
l
d
t
h
e
e
x
t
e
r
n
a
l
p
o
w
e
r
b
e
l
o
w
e
f
f
e
c
t
i
v
e
v
o
l
t
a
g
e
(
V
p
o
r
1
)
.
100
1
tW(Vpor1- Vdet)
S
u
p
p
l
y
v
o
l
t
a
g
e
r
i
s
i
n
g
t
i
m
e
w
h
e
n
p
o
w
e
r
-
o
n
r
e
s
e
t
i
s
c
a
n
c
e
l
e
d
0
.
5
tW(Vpor1- Vdet) Supply voltage rising time when power-on reset is canceled
tW(Vpor1- Vdet)
Supply voltage rising time when power-on reset is canceled
VV
p
o
r
1 P
o
w
e
r
-
o
n
r
e
s
e
t
v
a
l
i
d
v
o
l
t
a
g
e
ms
ms
ms
tW(Vpor1- Vdet) Supply voltage rising time when power-on reset is canceled 100 ms
0°C ≤ Topr ≤ 85°C, tW(por1) ≥ 10s(2)
–
2
0
°
C
≤
T
o
p
r
<
0
°
C
,
tW(
p
o
r
1
)
≥
1
0
s(2
)
0°C ≤ Topr ≤ 85°C, tW(por1) ≥ 1s(2)
–
2
0
°
C
≤
T
o
p
r
<
8
5
°
C
–20°C ≤ Topr < 0°C, tW(por1) ≥ 30s(2)
R8C/13 Group 5. Electrical Characteristics
Rev.1.20 Jan 27, 2006 page 19 of 27REJ03B0069-0120
Table 5.11 Electrical Characteristics (1) [Vcc=5V]
S
y
m
b
o
l
VO
H
VO
L
" L
"
o
u
t
p
u
t
v
o
l
t
a
g
e
" H
"
o
u
t
p
u
t
v
o
l
t
a
g
e
S
t
a
n
d
a
r
dTyp. UnitMeasuring condition
V
V
V
Min. Max.VCC-2.0
P
a
r
a
m
e
t
e
r
IO
H=-5m
A
V
H
y
s
t
e
r
e
s
i
s
"H" input currentII
H
" L
"
i
n
p
u
t
c
u
r
r
e
n
tII
L
VR
A
M R
A
M
r
e
t
e
n
t
i
o
n
v
o
l
t
a
g
e
VT
+
-VT
- 0
.
2
V
µA
At stop mode 2
.
0
VI=
5
V
VI=
0
V
Rf
X
I
N F
e
e
d
b
a
c
k
r
e
s
i
s
t
a
n
c
e XI
N MΩRP
U
L
L
U
P P
u
l
l
-
u
p
r
e
s
i
s
t
a
n
c
e 1
6
7 kΩ3
0
12
5
N
O
T
E
S
:
1
.
R
e
f
e
r
e
n
c
e
d
t
o
VC
C
=
A
VC
C
=
4
.
2
t
o
5
.
5
V
a
t
T
o
p
r
=
-
2
0
t
o
8
5
°
C
/
-
4
0
t
o
8
5
°
C
,
f
(
XI
N)
=
2
0
M
H
z
u
n
l
e
s
s
o
t
h
e
r
w
i
s
e
s
p
e
c
i
f
i
e
d
.
VCCExcept XOUT
XOUT
IOH=-200µA
D
r
i
v
e
c
a
p
a
c
i
t
y
H
I
G
H
Drive capacity LOW
VC
C-0
.
3 VC
C V
IOH=-1 mA VC
C-2
.
0
VCC-2.0IOH=-500µAV
V
VCC
VC
C
E
x
c
e
p
t
P
10
t
o
P
17,
XO
U
T
P10 to P17
XO
U
T
Drive capacity HIGH
D
r
i
v
e
c
a
p
a
c
i
t
y
L
O
W
IOL= 5 mA
IOL= 200 µA
IO
L=
1
5
m
A
IOL= 5 mA
2
.
0
0.45 V
2
.
0
2.0 V
Drive capacity HIGH
Drive capacity LOWIOL= 1 mA
IOL=500 µA
2
.
0
2
.
0
V
R
E
S
E
T 0.2
1.
0
2.2
V
5.
0
-5.0 µ
A
VI=0V 50
1.0
fR
I
N
G
-
S L
o
w
-
s
p
e
e
d
o
n
-
c
h
i
p
o
s
c
i
l
l
a
t
o
r
f
r
e
q
u
e
n
c
y 40 2
5
0 k H
z
INT0, INT1, INT2, INT3, KI0, KI1,KI2, KI3, CNTRo, CNTR1, TCIN, RxD0, RxD1, P45
Drive capacity LOW IOL= 200 µA 0.45 V
V
S
y
m
b
o
l S
t
a
n
d
a
r
dT
y
p
. U
n
i
tM
e
a
s
u
r
i
n
g
c
o
n
d
i
t
i
o
n
Min. M
a
x
.P
a
r
a
m
e
t
e
r
H
i
g
h
-
s
p
e
e
d
o
n
-
c
h
i
p
o
s
c
i
l
l
a
t
o
r
f
r
e
q
u
e
n
c
y
1
/
t
d
(
H
R
o
f
f
s
e
t
)
+
t
d
(
H
R
)
w
h
e
n
t
h
e
r
e
s
e
t
i
s
r
e
l
e
a
s
e
d
N
O
T
E
S
:
1
.
T
h
e
m
e
a
s
u
r
i
n
g
c
o
n
d
i
t
i
o
n
i
s
V
c
c
=
A
V
c
c
=
5
.
0
V
a
n
d
T
o
p
r
=
2
5
°
C
.
H
i
g
h
-
s
p
e
e
d
o
n
-
c
h
i
p
o
s
c
i
l
l
a
t
o
r
p
e
r
i
o
d
a
d
j
u
s
t
e
d
u
n
i
t
M
H
z
n
sV
C
C
=
5
.
0
V
,
T
o
p
r
=
2
5
°
CS
e
t
"
0
01
6"
i
n
t
h
e
H
R
1
r
e
g
i
s
t
e
r
8
6
1
Differences when setting "0116" and "0016" in the HR register
S
e
t
t
a
b
l
e
h
i
g
h
-
s
p
e
e
d
o
n
-
c
h
i
p
o
s
c
i
l
l
a
t
o
r
m
i
n
i
m
u
m
p
e
r
i
o
d
High-speed on-chip oscillator frequency temperature dependence(1)
t d
(
H
R
o
f
f
s
e
t
)
td(HR)
V
C
C
=
5
.
0
V
,
T
o
p
r
=
2
5
°
CS
e
t
"
4
01
6"
i
n
t
h
e
H
R
1
r
e
g
i
s
t
e
r
1 n
s
F
r
e
q
u
e
n
c
y
f
l
u
c
t
u
a
t
i
o
n
i
n
t
e
m
p
e
r
a
t
u
r
e
r
a
n
g
e
o
f
-
1
0
°
C
t
o
5
0
°
C ±
5 %
%H
i
g
h
-
s
p
e
e
d
o
n
-
c
h
i
p
o
s
c
i
l
l
a
t
o
r
f
r
e
q
u
e
n
c
y
t
e
m
p
e
r
a
t
u
r
e
d
e
p
e
n
d
e
n
c
e
(
2
) F
r
e
q
u
e
n
c
y
f
l
u
c
t
u
a
t
i
o
n
i
n
t
e
m
p
e
r
a
t
u
r
e
r
a
n
g
e
o
f
-
4
0
°
C
t
o
8
5
°
C ±
1
0
Table 5.9 High-speed On-Chip Oscillator Circuit Electrical Characteristics
Symbol Standard Typ. Unit Measuring condition
Min. Max. Parameter
2000
NOTES: 1. The measuring condition is Vcc=AVcc=2.7 to 5.5 V and Topr=25 °C. 2. This shows the wait time until the internal power supply generating circuit is stabilized during power-on. 3. This shows the time until BCLK starts from the interrupt acknowledgement to cancel stop mode.
150td(R-S) STOP release time(3)
µstd(P-R) Time for internal power supply stabilization during powering-on(2)
µs
1
Table 5.10 Power Circuit Timing Characteristics
R8C/13 Group 5. Electrical Characteristics
Rev.1.20 Jan 27, 2006 page 20 of 27REJ03B0069-0120
S
y
m
b
o
l StandardT
y
p
. U
n
i
tM
e
a
s
u
r
i
n
g
c
o
n
d
i
t
i
o
n
Min. M
a
x
.P
a
r
a
m
e
t
e
r
No division
m
A
I n
s
i
n
g
l
e
-
c
h
i
p
m
o
d
e
,
t
h
e
o
u
t
p
u
t
p
i
n
s
a
r
e
o
p
e
n
a
n
d
o
t
h
e
r
p
i
n
s
a
r
e
VS
S
9 1
5
XIN=20 MHz (square wave)
m
A
High-speed mode
IC
C P
o
w
e
r
s
u
p
p
l
y
c
u
r
r
e
n
t(
VC
C=3
.
3
t
o
5
.
5
V
)
4
7
0
N
O
T
E
S
:
1
.
T
i
m
e
r
Y
i
s
o
p
e
r
a
t
e
d
w
i
t
h
t
i
m
e
r
m
o
d
e
. 2.
R
e
f
e
r
e
n
c
e
d
t
o
VC
C
=
A
VC
C
=
4
.
2
t
o
5
.
5
V
a
t
T
o
p
r
=
-
2
0
t
o
8
5
°
C
/
-
4
0
t
o
8
5
°
C
,
f
(
XI
N)
=
2
0
M
H
z
u
n
l
e
s
s
o
t
h
e
r
w
i
s
e
s
p
e
c
i
f
i
e
d
.
Wait mode
µA
m
AMedium-speed mode
High-speed on-chip oscillator mode
L
o
w
-
s
p
e
e
d
o
n
-
c
h
i
p
o
s
c
i
l
l
a
t
o
r
m
o
d
e
H
i
g
h
-
s
p
e
e
d
o
n
-
c
h
i
p
o
s
c
i
l
l
a
t
o
r
o
f
fL
o
w
-
s
p
e
e
d
o
n
-
c
h
i
p
o
s
c
i
l
l
a
t
o
r
o
n
=
1
2
5
k
H
z
XIN=16 MHz (square wave)H
i
g
h
-
s
p
e
e
d
o
n
-
c
h
i
p
o
s
c
i
l
l
a
t
o
r
o
f
fL
o
w
-
s
p
e
e
d
o
n
-
c
h
i
p
o
s
c
i
l
l
a
t
o
r
o
n
=
1
2
5
k
H
zNo division
8
XI
N=
2
0
M
H
z
(
s
q
u
a
r
e
w
a
v
e
)H
i
g
h
-
s
p
e
e
d
o
n
-
c
h
i
p
o
s
c
i
l
l
a
t
o
r
o
f
fLow-speed on-chip oscillator on=125 kHzD
i
v
i
s
i
o
n
b
y
8
4
XIN=16 MHz (square wave)H
i
g
h
-
s
p
e
e
d
o
n
-
c
h
i
p
o
s
c
i
l
l
a
t
o
r
o
f
fL
o
w
-
s
p
e
e
d
o
n
-
c
h
i
p
o
s
c
i
l
l
a
t
o
r
o
n
=
1
2
5
k
H
zD
i
v
i
s
i
o
n
b
y
8
3 m
A
M
a
i
n
c
l
o
c
k
o
f
fH
i
g
h
-
s
p
e
e
d
o
n
-
c
h
i
p
o
s
c
i
l
l
a
t
o
r
o
n
=
8
M
H
zLow-speed on-chip oscillator on=125 kHzNo division
4 8 m
A
Main clock off
Low-speed on-chip oscillator on=125 kHzDivision by 8
mA1.5
M
a
i
n
c
l
o
c
k
o
f
fHigh-speed on-chip oscillator offLow-speed on-chip oscillator on=125 kHzD
i
v
i
s
i
o
n
b
y
8
M
a
i
n
c
l
o
c
k
o
f
fHigh-speed on-chip oscillator offL
o
w
-
s
p
e
e
d
o
n
-
c
h
i
p
o
s
c
i
l
l
a
t
o
r
o
n
=
1
2
5
k
H
zW
h
e
n
a
W
A
I
T
i
n
s
t
r
u
c
t
i
o
n
i
s
e
x
e
c
u
t
e
d(
1
)
Peripheral clock operation
40
High-speed on-chip oscillator on=8 MHz
m
AXIN=10 MHz (square wave)H
i
g
h
-
s
p
e
e
d
o
n
-
c
h
i
p
o
s
c
i
l
l
a
t
o
r
o
f
fL
o
w
-
s
p
e
e
d
o
n
-
c
h
i
p
o
s
c
i
l
l
a
t
o
r
o
n
=
1
2
5
k
H
zNo division
5
XI
N=
1
0
M
H
z
(
s
q
u
a
r
e
w
a
v
e
)H
i
g
h
-
s
p
e
e
d
o
n
-
c
h
i
p
o
s
c
i
l
l
a
t
o
r
o
f
fL
o
w
-
s
p
e
e
d
o
n
-
c
h
i
p
o
s
c
i
l
l
a
t
o
r
o
n
=
1
2
5
k
H
zD
i
v
i
s
i
o
n
b
y
8
2 m
A
1
4
900
8
0
P
e
r
i
p
h
e
r
a
l
c
l
o
c
k
o
f
f
µA
S
t
o
p
m
o
d
e M
a
i
n
c
l
o
c
k
o
f
f
,
T
o
p
r
=
-
2
5
°
CHigh-speed on-chip oscillator offLow-speed on-chip oscillator offCM10="1"Peripheral clock off
0.8 3.0
V
C
2
7
=
"
0
"
µ
A
W
a
i
t
m
o
d
e M
a
i
n
c
l
o
c
k
o
f
fHigh-speed on-chip oscillator offLow-speed on-chip oscillator on=125 kHzWhen a WAIT instruction is executed(1)
38 76
V
C
2
7
=
"
0
"
V
C
2
7
=
"
0
"
µ
A
Table 5.12 Electrical Characteristics (2) [Vcc=5V]
R8C/13 Group 5. Electrical Characteristics
Rev.1.20 Jan 27, 2006 page 21 of 27REJ03B0069-0120
Timing requirements [VCC=5V] (Unless otherwise noted: VCC = 5V, VSS = 0V at Topr = 25 °C)
Table 5.13 XIN input
________
Table 5.14 CNTR0 input, CNTR1 input, INT2 input
________
Table 5.15 TCIN input, INT3 input
Symbol
tC(XIN)tWH(XIN)tWL(XIN)
Parameter
XIN input cycle timeXIN input HIGH pulse widthXIN input LOW pulse width
Min.502525
Max.–––
Unit
nsnsns
Standard
Symbol
tC(CNTR0)tWH(CNTR0)tWL(CNTR0)
Parameter
CNTR0 input cycle timeCNTR0 input HIGH pulse widthCNTR0 input LOW pulse width
Min.1004040
Max.–––
Unit
nsnsns
Standard
Symbol
tC(TCIN)tWH(TCIN)tWL(TCIN)
Parameter
TCIN input cycle timeTCIN input HIGH pulse widthTCIN input LOW pulse width
Min.400(1)
200(2)
200(2)
Max.–––
Unit
nsnsns
Standard
NOTES: 1. When using the Timer C input capture mode, adjust the cycle time above ( 1/ Timer C count source
frequency x 3). 2. When using the Timer C input capture mode, adjust the pulse width above ( 1/ Timer C count source
frequency x 1.5).
NOTES:________ ________
1. When selecting the digital filter by the INT0 input filter select bit, use the INT0 input HIGH pulse widthto the greater value,either ( 1/ digital filter clock frequency x 3) or the minimum value of standard.
________ ________
2. When selecting the digital filter by the INT0 input filter select bit, use the INT0 input LOW pusle widthto the greater value,either ( 1/ digital filter clock frequency x 3) or the minimum value of standard.
Table 5.5 Serial Interface
________
Table 5.17 External interrupt INT0 input
Symbol
tC(CK)tW(CKH)tW(CKL)td(C-Q)th(C-Q)tsu(D-C)th(C-D)
Parameter
CLKi input cycle timeCLKi input HIGH pulse widthCLKi input LOW pulse widthTxDi output delay timeTxDi hold timeRxDi input setup timeRxDi input hold time
Min.200100100
–0
3590
Max.–––
–––
Unit
nsnsnsnsnsnsns
Standard
80
Symbol
tW(INH)tW(INL)
Parameter
________
INT0 input HIGH pulse width________
INT0 input LOW pulse width
Min.250(1)
250(2)
Max.––
Unit
nsns
Standard
R8C/13 Group 5. Electrical Characteristics
Rev.1.20 Jan 27, 2006 page 22 of 27REJ03B0069-0120
Figure 5.4 Vcc=5V timing diagram
CLKi
TxDi
RxDi
INTi
tW(CKH)
tc(CK)
tW(CKL)
th(C-Q)
th(C-D)tsu(D-C)td(C-Q)
tW(INL)
tW(INH)
XIN input
tWH(XIN)
tc(XIN)
tWL(XIN)
TCIN input
tWH(TCIN)
tc(TCIN)
tWL(TCIN)
CNTR0 input
tWH(CNTR0)
tc(CNTR0)
tWL(CNTR0)
VCC = 5V
R8C/13 Group 5. Electrical Characteristics
Rev.1.20 Jan 27, 2006 page 23 of 27REJ03B0069-0120
S
y
m
b
o
l
VO
H
VO
L
" L
"
o
u
t
p
u
t
v
o
l
t
a
g
e
" H
"
o
u
t
p
u
t
v
o
l
t
a
g
e
S
t
a
n
d
a
r
dT
y
p
. U
n
i
tMeasuring condition
V
V
V
M
i
n
. M
a
x
.VC
C-0
.
5
P
a
r
a
m
e
t
e
r
IOH=-1mA
V
H
y
s
t
e
r
e
s
i
s
" H
"
i
n
p
u
t
c
u
r
r
e
n
tII
H
" L
"
i
n
p
u
t
c
u
r
r
e
n
tII
L
VR
A
M R
A
M
r
e
t
e
n
t
i
o
n
v
o
l
t
a
g
e
VT
+
-VT
- 0.2
V
µ
A
At stop mode 2
.
0
VI=
3
V
Rf
X
I
N F
e
e
d
b
a
c
k
r
e
s
i
s
t
a
n
c
e XI
N MΩRP
U
L
L
U
P P
u
l
l
-
u
p
r
e
s
i
s
t
a
n
c
e kΩ66
125
N
O
T
E
S
:
1
.
R
e
f
e
r
e
n
c
e
d
t
o
VC
C
=
A
VC
C
=
2
.
7
t
o
3
.
3
V
a
t
T
o
p
r
=
-
2
0
t
o
8
5
°
C
/
-
4
0
t
o
8
5
°
C
,
f
(
XI
N)
=
1
0
M
H
z
u
n
l
e
s
s
o
t
h
e
r
w
i
s
e
s
p
e
c
i
f
i
e
d
.
VCCE
x
c
e
p
t
XO
U
T
XO
U
T Drive capacity HIGHDrive capacity LOW
IO
H=-0
.
1
m
A VC
C-0
.
5VC
C-0
.
5IO
H=-50 µ
AVV
VCC
VCC
Except P10 to P17, XOUT
P
10
t
o
P
17
XO
U
T
Drive capacity HIGH
Drive capacity LOW
IOL= 1 mA
IO
L=
2
m
AIO
L= 1
m
A
0
.
5
V0
.
5
0
.
5
VDrive capacity HIGH
Drive capacity LOW
IO
L= 0
.
1
m
AIO
L=
5
0
µ
A0
.
50
.
5 V
R
E
S
E
T 0.2
0
.
8
1
.
8 V
4.
0
-4.
0 µAVI=0V
160
3.
0
fR
I
N
G
-
S L
o
w
-
s
p
e
e
d
o
n
-
c
h
i
p
o
s
c
i
l
l
a
t
o
r
f
r
e
q
u
e
n
c
y 40 2
5
0 kHz
VI=0V 5
0
0
I N
To,
I
N
T1,
I
N
T2,
I
N
T3,
K
I0,
K
I1,
K
I2,
K
I3,
C
N
T
R0,
C
N
T
R1,
T
CI
N,R
x
D0,
R
x
D1,
P
45
Table 5.18 Electrical Characteristics (3) [Vcc=3V]
R8C/13 Group 5. Electrical Characteristics
Rev.1.20 Jan 27, 2006 page 24 of 27REJ03B0069-0120
Table 5.19 Electrical Characteristics (4) [Vcc=3V]
S
y
m
b
o
l S
t
a
n
d
a
r
dT
y
p
. U
n
i
tM
e
a
s
u
r
i
n
g
c
o
n
d
i
t
i
o
n
M
i
n
. M
a
x
.Parameter
N
o
d
i
v
i
s
i
o
n
m
A
I n
s
i
n
g
l
e
-
c
h
i
p
m
o
d
e
,
t
h
e
o
u
t
p
u
t
p
i
n
s
a
r
e
o
p
e
n
a
n
d
o
t
h
e
r
p
i
n
s
a
r
e
VS
S
8 1
3
XIN=20 MHz (square wave)
m
A
High-speed mode
IC
C P
o
w
e
r
s
u
p
p
l
y
c
u
r
r
e
n
t(
VC
C=
2
.
7
t
o
3
.
3
V
)
4
2
0
N
O
T
E
S
:
1
.
T
i
m
e
r
Y
i
s
o
p
e
r
a
t
e
d
w
i
t
h
t
i
m
e
r
m
o
d
e
. 2.
R
e
f
e
r
e
n
c
e
d
t
o
VC
C
=
A
VC
C
=
2
.
7
t
o
3
.
3
V
a
t
T
o
p
r
=
-
2
0
t
o
8
5
°
C
/
-
4
0
t
o
8
5
°
C
,
f
(
XI
N)
=
1
0
M
H
z
u
n
l
e
s
s
o
t
h
e
r
w
i
s
e
s
p
e
c
i
f
i
e
d
.
W
a
i
t
m
o
d
e
µA
m
AM
e
d
i
u
m
-
s
p
e
e
d
m
o
d
e
H
i
g
h
-
s
p
e
e
do
n
-
c
h
i
p
o
s
c
i
l
l
a
t
o
r
m
o
d
e
L
o
w
-
s
p
e
e
do
n
-
c
h
i
p
o
s
c
i
l
l
a
t
o
r
m
o
d
e
High-speed on-chip oscillator offLow-speed on-chip oscillator on=125 kHz
XI
N=
1
6
M
H
z
(
s
q
u
a
r
e
w
a
v
e
)High-speed on-chip oscillator offLow-speed on-chip oscillator on=125 kHzN
o
d
i
v
i
s
i
o
n
7
XI
N=
2
0
M
H
z
(
s
q
u
a
r
e
w
a
v
e
)High-speed on-chip oscillator offLow-speed on-chip oscillator on=125 kHzDivision by 8
3
XI
N=
1
6
M
H
z
(
s
q
u
a
r
e
w
a
v
e
)High-speed on-chip oscillator offLow-speed on-chip oscillator on=125 kHzDivision by 8
2
.
5 m
A
M
a
i
n
c
l
o
c
k
o
f
fHigh-speed on-chip oscillator on=8 MHzLow-speed on-chip oscillator on=125 kHzNo division
3
.
5 7
.
5 m
A
M
a
i
n
c
l
o
c
k
o
f
f
Low-speed on-chip oscillator on=125 kHzDivision by 8
m
A1.5
M
a
i
n
c
l
o
c
k
o
f
fH
i
g
h
-
s
p
e
e
d
o
n
-
c
h
i
p
o
s
c
i
l
l
a
t
o
r
o
f
fL
o
w
-
s
p
e
e
d
o
n
-
c
h
i
p
o
s
c
i
l
l
a
t
o
r
o
n
=
1
2
5
k
H
zD
i
v
i
s
i
o
n
b
y
8
M
a
i
n
c
l
o
c
k
o
f
fHigh-speed on-chip oscillator offL
o
w
-
s
p
e
e
d
o
n
-
c
h
i
p
o
s
c
i
l
l
a
t
o
r
o
n
=
1
2
5
k
H
zW
h
e
n
a
W
A
I
T
i
n
s
t
r
u
c
t
i
o
n
i
s
e
x
e
c
u
t
e
d(1
)
P
e
r
i
p
h
e
r
a
l
c
l
o
c
k
o
p
e
r
a
t
i
o
n
37
High-speed on-chip oscillator on=8 MHz
m
AXI
N=
1
0
M
H
z
(
s
q
u
a
r
e
w
a
v
e
)High-speed on-chip oscillator offLow-speed on-chip oscillator on=125 kHzN
o
d
i
v
i
s
i
o
n
5
XI
N=
1
0
M
H
z
(
s
q
u
a
r
e
w
a
v
e
)High-speed on-chip oscillator offLow-speed on-chip oscillator on=125 kHzDivision by 8
1
.
6 m
A
1
2
800
7
4
µ
A
W
a
i
t
m
o
d
e Main clock offHigh-speed on-chip oscillator offLow-speed on-chip oscillator on=125 kHzWhen a WAIT instruction is executed(1)
Peripheral clock off
µA
Stop mode M
a
i
n
c
l
o
c
k
o
f
f
,
T
o
p
r
=
-
2
5
°
CHigh-speed on-chip oscillator offL
o
w
-
s
p
e
e
d
o
n
-
c
h
i
p
o
s
c
i
l
l
a
t
o
r
o
f
fCM10="1"Peripheral clock off
0.7 3.0
VC27="0"
3
5 7
0
VC27="0"
VC27="0"
µ
A
R8C/13 Group 5. Electrical Characteristics
Rev.1.20 Jan 27, 2006 page 25 of 27REJ03B0069-0120
Timing requirements [VCC=3V] (Unless otherwise noted: VCC = 3V, VSS = 0V at Topr = 25 °C)
Table 5.20 XIN input
________
Table 5.21 CNTR0 input, CNTR1 input, INT2 input
________
Table 5.22 TCIN input, INT3 input
Symbol
tC(XIN)tWH(XIN)tWL(XIN)
Parameter
XIN input cycle timeXIN input HIGH pulse widthXIN input LOW pulse width
Min.1004040
Max.–––
Unit
nsnsns
Standard
Symbol
tC(CNTR0)tWH(CNTR0)tWL(CNTR0)
Parameter
CNTR0 input cycle timeCNTR0 input HIGH pulse widthCNTR0 input LOW pulse width
Min.300120120
Max.–––
Unit
nsnsns
Standard
Symbol
tC(TCIN)tWH(TCIN)tWL(TCIN)
Parameter
TCIN input cycle timeTCIN input HIGH pulse widthTCIN input LOW pulse width
Min.1200(1)
600(2)
600(2)
Max.–––
Unit
nsnsns
Standard
NOTES: 1. When using the Timer C input capture mode, adjust the cycle time above ( 1/ Timer C count source
frequency x 3). 2. When using the Timer C input capture mode, adjust the pulse width above ( 1/ Timer C count source
frequency x 1.5).
NOTES:________ ________
1. When selecting the digital filter by the INT0 input filter select bit, use the INT0 input HIGH pulse widthto the greater value,either ( 1/ digital filter clock frequency x 3) or the minimum value of standard.
________ ________
2 . When selecting the digital filter by the INT0 input filter select bit, use the INT0 input LOW pusle widthto the greater value,either ( 1/ digital filter clock frequency x 3) or the minimum value of standard.
Table 5.23 Serial Interface
________
Table 5.24 External interrupt INT0 input
Symbol
tC(CK)tW(CKH)tW(CKL)td(C-Q)th(C-Q)tsu(D-C)th(C-D)
Parameter
CLKi input cycle timeCLKi input HIGH pulse widthCLKi input LOW pulse widthTxDi output delay timeTxDi hold timeRxDi input setup timeRxDi input hold time
Min.300150150
–05590
Max.–––
–––
Unit
nsnsnsnsnsnsns
Standard
160
Symbol
tW(INH)tW(INL)
Parameter
________
INT0 input HIGH pulse width________
INT0 input LOW pulse width
Min.380(1)
380(2)
Max.––
Unit
nsns
Standard
R8C/13 Group 5. Electrical Characteristics
Rev.1.20 Jan 27, 2006 page 26 of 27REJ03B0069-0120
Figure 5.5 Vcc=3V timing diagram
CLKi
TxDi
RxDi
INTi
tW(CKH)
tc(CK)
tW(CKL)
th(C-Q)
th(C-D)tsu(D-C)td(C-Q)
tW(INL)
tW(INH)
XIN input
tWH(XIN)
tc(XIN)
tWL(XIN)
TCIN input
tWH(TCIN)
tc(TCIN)
tWL(TCIN)
CNTR0 input
tWH(CNTR0)
tc(CNTR0)
tWL(CNTR0)
VCC = 3V
R8C/13 Group Package Dimensions
Rev.1.20 Jan 27, 2006 page 27 of 27REJ03B0069-0120
Package Dimensions
2.
1. DIMENSIONS "*1" AND "*2"DO NOT INCLUDE MOLD FLASH.
NOTE)
DIMENSION "*3" DOES NOTINCLUDE TRIM OFFSET.
y
Index mark
*3
F
32
25
24 17
16
9
81
*1
*2
xbpe
HEE
D
HD
ZD
ZE
Detail F
L1
L
A
cA2
A1
Previous CodeJEITA Package Code RENESAS Code
PLQP0032GB-A 32P6U-A
MASS[Typ.]
0.2gP-LQFP32-7x7-0.80
1.0
0.125
0.35
0.7
0.7
0.20
0.200.1450.09
0.420.370.32
MaxNomMin
Dimension in MillimetersSymbol
Reference
7.17.06.9D
7.17.06.9E
1.4A2
9.29.08.8
9.29.08.8
1.7A
0.20.10
0.70.50.3L
x
8°0°
c
0.8e
0.10y
HD
HE
A1
bp
b1
c1
ZD
ZE
L1
Terminal cross section
b1
c 1
bp
c
REVISION HISTORY R8C/13 Group Datasheet
Rev. Date Description
Page Summary
A-1
0.10 Oct 28, 2003 First edition issued
0.20 Dec05, 2003 5 Figure 1.3 revised
Chapter 4, NOTES revised
Table 5.4 revisedTable 5.5 revised
Table 5.6 revisedFigure 5.3 added
Table 5.8 revisedTable 5.10 revised
Figure 5.3 revised to Figure 5.4
Table 5.17 revised
Figure 5.4 revised to Figure 5.5
10
16
18
21
22
25
17
1.00 Sep 30, 2004 All pages
2
5
6
9
10-13
12
14
15
16
17
18
19
20
22
23
24
Words standardized (on-chip oscillator, serial interface, A/D)
Table 1.1 revised
Figure 1.3, NOTES 3 added
Table 1.3 revised
Figure 3.1, NOTES added
One body sentence in chapter 4 added ; Titles of Table 4.1 to 4.4 added
Table 4.3 revised ; Table 4.4 revised
Table 5.2 revised
Table 5.3 revised
Table 5.4 and Table 5.5 revised
Table 5.6, 5.7 and 5.8 revised ; Figure 5.3 revised
Table 5.9 and 5.11 revised
Table 5.12 revised
Table 5.13 revised
Table 5.18 revised
Table 5.19 revised
Table 5.20 and Table 5.24 revised
1.10 Apr.27.2005 4 Table 1.2, Figure 1.2 package name revised
5 Figure 1.3 package name revised
10 Table 4.1 revised
12 Table 4.3 revised
15 Table 5.3 partly revised
16 Table 5.4, Table 5.5 partly added
REVISION HISTORY R8C/13 Group Datasheet
Rev. Date Description
Page Summary
A-2
1.10 Apr.27.2005 17 Table 5.7, 5.8 revised
18 Table 5.10, Table 5.11 partly revised
22 Table 5.18 partly revised
26 Package Dimensions revised
1.20 Jan.27.2006 2 Table 1.1 Performance outline revised3 Figure 1.1 Block diagram partly revised4 1.4 Product Information, title of Table 1.2
“Product List” → “Product Informaton” revisedROM capacity; “Program area” → “Program ROM”,
“Data area” → “Data flash” revisedFigure 1.2 Type No., Memory Size, and Package partly revised
6 Table 1.3 Pin description revised7-8 2 Central Processing Unit (CPU) revised
Figure 2.1 CPU register revised9 3 Memory, Figure 3.1 Memory Map;
“Program area” → “Program ROM”, “Data area” → “Data flash” revised10 Table 4.1 SFR Information(1) NOTES:1 revised11 Table 4.2 SFR Information(2) NOTES:1 revised12 Table 4.3 SFR Information(3);
008116: “Prescaler Y” → “Prescaler Y Register”008216: “Timer Y Secondary” → “Timer Y Secondary Register”008316: “Timer Y Primary” → “Timer Y Primary Register”008516: “Prescaler Z” → “Prescaler Z Register”008616: “Timer Z Secondary” → “Timer Z Secondary Register”008716: “Timer Z Primary” → “Timer Z Primary Register”008C16: “Prescaler X” → “Prescaler X Register” revisedNOTES:1, 2 revised
13 Table 4.4 SFR Information(4) NOTES:1 revised14 Table 5.2 Recommended Operating Conditions; NOTES: 1, 2, 3 revised15 Table 5.3 A/D Conversion Characteristics;
“A/D operation clock frequency” → “A/D operating clock frequency” revisedNOTES: 1, 2, 3, 4 revised
16 Table 5.4 Flash Memory (Program ROM) Electrical Characteristics;“Data retention duration” → “Data hold time” revised“Topr” → “Ambient temperature”NOTES: 1 to 7 addedMeasuring condition of byte program time and block erase time deleted
17 Table 5.5 Flash Memory (Data flash Block A, Block B) Electrical characteristics“Data retention duration” → “Data hold time” revised“Topr” → “Ambient temperature”NOTES: 1, 3 revised, NOTES: 9 addedMeasuring condition of byte program time and block erase time deleted
18 Table 5.7 Reset Circuit Electrical Characteristics (When Using Hardware Reset 2)NOTES: 3 revised
19 Table 5.9 High-speed On-Chip Oscillator Circuit Electrical Characteristics;“High-speed on-chip oscillator temperature dependence” →“High-speed on-chip oscillator frequency temperature dependence” revisedTable 5.11 Electrical Characteristics (1) [VCC=5V];“P10 to P17 Except XOUT” → “Except P10 to P17, XOUT” revised
REVISION HISTORY R8C/13 Group Datasheet
Rev. Date Description
Page Summary
A-3
1.20 Jan.27.2006 20 Table 5.12 Electrical Characteristics (2) [VCC=5V];NOTES: 1, 2 revisedMeasuring condition Stop mode: “Topr=-25 °C” added
23 Table 5.18 Electrical Characteristics (3) [VCC=3V]“P10 to P17 Except XOUT” → “Except P10 to P17, XOUT” revised
24 Table 5.19 Electrical Characteristics (4) [VCC=3V]NOTES: 1, 2 revisedMeasuring condition Stop mode: “Topr=-25 °C” added
Keep safety first in your circuit designs!1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
http://www.renesas.comRefer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.450 Holger Way, San Jose, CA 95134-1368, U.S.ATel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe LimitedDukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology (Shanghai) Co., Ltd.Unit 205, AZIA Center, No.133 Yincheng Rd (n), Pudong District, Shanghai 200120, ChinaTel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898 Renesas Technology Hong Kong Ltd.7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071
Renesas Technology Taiwan Co., Ltd.10th Floor, No.99, Fushing North Road, Taipei, TaiwanTel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology Singapore Pte. Ltd.1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001
Renesas Technology Korea Co., Ltd.Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, KoreaTel: <82> (2) 796-3115, Fax: <82> (2) 796-2145 Renesas Technology Malaysia Sdn. BhdUnit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, MalaysiaTel: <603> 7955-9390, Fax: <603> 7955-9510
RENESAS SALES OFFICES
© 2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .5.0