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Radiation-induced single event transients modeling and testing on nanometric ash-based technologies L. Sterpone a, , B. Du a , S. Azimi b a Dipartimento di Automatica e Informatica, Politecnico di Torino, Torino, Italy b Noshirvari University of Technology, Babol, Iran abstract article info Article history: Received 27 May 2015 Received in revised form 15 July 2015 Accepted 15 July 2015 Available online xxxx Keywords: Nanometric FPGAs Radiation Heavy ions Fault tolerance Reliability The increasing technology node scaling makes VLSI devices extremely vulnerable to Single Event Effects (SEEs) induced by highly charged particles such as heavy ions, increasing the sensitivity to Single Event Transients (SETs). In this paper, we describe a new methodology combining an analytical and oriented model for analyzing the sensitivity of SET nanometric technologies. The paper includes radiation test experiments performed on Flash-based FPGAs using heavy ions radiation beam. Experimental results are detailed and commented demon- strating the effective mitigation capabilities thanks to the adoption of the developed model. © 2015 Elsevier Ltd. All rights reserved. 1. Introduction Due to the non-volatile conguration memory, ash-based tech- nology is becoming more interesting in safety critical elds, particu- larly for space and avionic applications. Among the various ash- based devices, Field Programmable Gate Array (FPGA) devices based on ash technology are a consolidated device used in space applications. These devices are composed of oating gate based switches that can suffer transient effects, also called Single Event Effects (SEEs), if hit by high energetic particles provoking possible critical consequences on the implemented circuit. SEEs may become critical for a circuit when it induces Single Event Upsets (SEUs). Several studies involve the analysis of SETs on ash-based FPGAs [1]. Several works investigated the nature of these events, analyzing the propagation of the transient pulse through the combinational logic data path and routing resources [2]. Previous works reported radiation test experi- ment [3] and electrical fault injection [4] of SET propagation on custom circuits designed specically to observing SETs; also some results on SET dependency on clock frequency have been presented [5]. Recent exper- iments of accurate SET pulse electrical injection [6] show a strong SET pulse-width modulation when SET pulses traverse logic gates. Besides, it has been observed that the SET pulse width at the input of a storage element is strictly dependent on the propagation and type of traversed logic gates [7]. On the other side, a variety of hardening solutions have been proposed adopting redundancy solution and logic ltering approaches. The purpose of this work is to provide an effective model for the SET phenomena and to analyze the sensitivity of a realistic de- sign implemented using ash-based FPGA technology under radiation beam with different fault tolerant design approaches. The presented ex- perimental results show that the usage of traditional fault tolerant strat- egy based on redundancy is not enough to mitigate the SEEs, while SET- model based design ow can be applied with low resource overhead and obtain a reduction of the measured SEE cross-section of more than the 76% with respect to the original unhardened RISC and around 48% versus traditional TMR techniques. 2. The proposed SET nanometer model The main idea behind the proposed work is based on the accurate modeling of the SET phenomena generated by radiation particles within the silicon structure of nanometer devices. The method consists of three phases: the generation of the SET pulse phenomena which is modeled as transient pulse shape, the localization of all the combinational gates within the circuit description and nally the execution of the propaga- tion of the SET pulse starting from each sensitive node of the circuit and traversing the logic gates and routing interconnections until an input of a storage element (i.e., a Flip-Flop or a Memory Bank) is reached. The model allows the identication of the expected SET width and allows estimation of the global sensitivity of the circuit. To the best knowledge of the authors, the proposed approach is the rst Microelectronics Reliability xxx (2015) xxxxxx Corresponding author. E-mail address: [email protected] (L. Sterpone). MR-11735; No of Pages 5 http://dx.doi.org/10.1016/j.microrel.2015.07.035 0026-2714/© 2015 Elsevier Ltd. All rights reserved. Contents lists available at ScienceDirect Microelectronics Reliability journal homepage: www.elsevier.com/locate/mr Please cite this article as: L. Sterpone, et al., Radiation-induced single event transients modeling and testing on nanometric ash-based technologies, Microelectronics Reliability (2015), http://dx.doi.org/10.1016/j.microrel.2015.07.035
Transcript

Microelectronics Reliability xxx (2015) xxx–xxx

MR-11735; No of Pages 5

Contents lists available at ScienceDirect

Microelectronics Reliability

j ourna l homepage: www.e lsev ie r .com/ locate /mr

Radiation-induced single event transients modeling and testing on nanometricflash-based technologies

L. Sterpone a,⁎, B. Du a, S. Azimi b

a Dipartimento di Automatica e Informatica, Politecnico di Torino, Torino, Italyb Noshirvari University of Technology, Babol, Iran

⁎ Corresponding author.E-mail address: [email protected] (L. Sterpone).

http://dx.doi.org/10.1016/j.microrel.2015.07.0350026-2714/© 2015 Elsevier Ltd. All rights reserved.

Please cite this article as: L. Sterpone, et atechnologies, Microelectronics Reliability (20

a b s t r a c t

a r t i c l e i n f o

Article history:Received 27 May 2015Received in revised form 15 July 2015Accepted 15 July 2015Available online xxxx

Keywords:NanometricFPGAsRadiationHeavy ionsFault toleranceReliability

The increasing technology node scaling makes VLSI devices extremely vulnerable to Single Event Effects (SEEs)induced by highly charged particles such as heavy ions, increasing the sensitivity to Single Event Transients(SETs). In this paper, we describe a newmethodology combining an analytical and oriented model for analyzingthe sensitivity of SET nanometric technologies. The paper includes radiation test experiments performed onFlash-based FPGAs using heavy ions radiation beam. Experimental results are detailed and commented demon-strating the effective mitigation capabilities thanks to the adoption of the developed model.

© 2015 Elsevier Ltd. All rights reserved.

1. Introduction

Due to the non-volatile configuration memory, flash-based tech-nology is becoming more interesting in safety critical fields, particu-larly for space and avionic applications. Among the various flash-based devices, Field Programmable Gate Array (FPGA) devicesbased on flash technology are a consolidated device used in spaceapplications. These devices are composed of floating gate basedswitches that can suffer transient effects, also called Single Event Effects(SEEs), if hit by high energetic particles provoking possible criticalconsequences on the implemented circuit. SEEs may become criticalfor a circuit when it induces Single Event Upsets (SEUs). Several studiesinvolve the analysis of SETs on flash-based FPGAs [1]. Several worksinvestigated the nature of these events, analyzing the propagation ofthe transient pulse through the combinational logic data path androuting resources [2]. Previous works reported radiation test experi-ment [3] and electrical fault injection [4] of SET propagation on customcircuits designed specifically to observing SETs; also some results on SETdependency on clock frequency have been presented [5]. Recent exper-iments of accurate SET pulse electrical injection [6] show a strong SETpulse-width modulation when SET pulses traverse logic gates. Besides,it has been observed that the SET pulse width at the input of a storageelement is strictly dependent on the propagation and type of traversedlogic gates [7]. On the other side, a variety of hardening solutions

l., Radiation-induced single15), http://dx.doi.org/10.101

have been proposed adopting redundancy solution and logic filteringapproaches. The purpose of this work is to provide an effective modelfor the SET phenomena and to analyze the sensitivity of a realistic de-sign implemented using flash-based FPGA technology under radiationbeamwith different fault tolerant design approaches. The presented ex-perimental results show that the usage of traditional fault tolerant strat-egy based on redundancy is not enough tomitigate the SEEs, while SET-model based design flow can be applied with low resource overheadand obtain a reduction of the measured SEE cross-section of morethan the 76% with respect to the original unhardened RISC and around48% versus traditional TMR techniques.

2. The proposed SET nanometer model

The main idea behind the proposed work is based on the accuratemodeling of the SET phenomena generated by radiation particleswithinthe silicon structure of nanometer devices. Themethod consists of threephases: the generation of the SET pulse phenomena which is modeledas transient pulse shape, the localization of all the combinational gateswithin the circuit description and finally the execution of the propaga-tion of the SET pulse starting from each sensitive node of the circuitand traversing the logic gates and routing interconnections untilan input of a storage element (i.e., a Flip-Flop or a Memory Bank) isreached. The model allows the identification of the expected SETwidth and allows estimation of the global sensitivity of the circuit. Tothe best knowledge of the authors, the proposed approach is the first

event transients modeling and testing on nanometric flash-based6/j.microrel.2015.07.035

Fig. 1. SET pulse shape modeling of the original pulse (i.e., positive transition) generatedfrom the GDS-I model (tn) and after the propagation through a logic gate (tn+ 1).

Fig. 3. RISC5x architecture.

2 L. Sterpone et al. / Microelectronics Reliability xxx (2015) xxx–xxx

solution that is able to integrate physical design analysis and Matlabcomputations in order to evaluate the dynamic behavior of a VLSIcircuit.

2.1. SET generation and analytical model

In order to generate the pulse shape, the developed model elabo-rates the physical layout description of each circuit logic gate, describedby standard Graphic Database System for IC layout (GDS-I), whichrepresents a 3D model of the implemented circuit. The model consistsof 3 phases described byMatlab code. The first phase, based on the char-acterization thatwas provided in [4], generates the SETmodel accordingto the definition depicted by the shape tn in Fig. 1.

The second phase executes the propagation on the basis of the Resis-tive and Capacitive load calculated on the GDS-I 3Dmodel of the circuit.The propagation coefficient is used in the model reported in Fig. 2 inorder to generate the expected propagation coefficients for all thelogic paths [6]. Please note that when the coefficient is lower than 0the signal is filtered, and vice versa the original pulse is broadened. InFig. 1, the pulse shape tn + 1 is obtained in case of broadening. Thethird phase includes the execution of the propagation and on the classi-fication of each Flip-Flop sensitivity. Themodel has been used to reducethe sensitivity of the benchmark circuits that we used for the experi-mental evaluation.

2.2. SET characterization

The Single Event Transients (SETs) characterization has beenperformed using the SETA tool, which has been implemented in [11]which is an algorithm that performs the SET propagation analysis of acircuit mapped on a flash-based FPGA. It consists of two phases: theformer locates all circuit combinational gates and identifies theirpropagation nodes until a storage element (a Flip-Flop or a Latch) is

Fig. 2. SET pulse analytical propagation model.

Please cite this article as: L. Sterpone, et al., Radiation-induced singletechnologies, Microelectronics Reliability (2015), http://dx.doi.org/10.101

reached, the latter performs the propagation of a SET pulse startingfrom each sensitive node and traversing all the circuit logic path andstoring the maximal length observed by the SET pulse at the input ofeach storage element. The results are stored in two databases reportingthemaximal SET pulse at the input of each Flip-Flop and the broadeningcoefficient between the couple of gates.

3. Experimental analysis

The experimental analysis we performed in this work consists of aset of radiation test campaigns performed with a heavy ions beam inorder to provoke radiation-induced SET and classify their effects. Theresults are compared with the developed prediction model.

3.1. Tested architectures

RISC5X fromOpenCores is a RISC CPU that is compatiblewith the 12-bit opcode PIC family [8]. It consists of an Instruction Decoder (IDEC), anArithmetic Logic Unit (ALU) which is capable of 8-bit addition, subtrac-tion and logic shift operation, and a register file of 128 bytes used asRAM. The RISC5x has three 8-bit wide ports which can be used asinput and output ports connecting to different peripherals. The portsare named PORTA, PORTB and PORTC respectively, as illustrated inFig. 3. To map RISC5x to the FPGA, we added a ROM module holdingthe instructions by means of signal array in VHDL, which was inferredas logic gates instead of Flip-Flops or latches by the Synplify tool inLibero IDE from Microsemi.

The original RISC5x from OpenCores has no fault tolerant strategyapplied. In order to reduce data corruptions in RAM caused by SEUs

Fig. 4. ECC scheme adopted in order to protect RISC register file, implemented using Flash-based FPGA embedded RAMmodules versus SEU accumulation.

event transients modeling and testing on nanometric flash-based6/j.microrel.2015.07.035

Fig. 5. TMR at entity level (IDEC & ALU).

Table 1Test circuits characteristics.

Design name Logic gates [#] FFs [#]

RISC5x 1401 1156RISC5x TMR + GG (1 ns) 20,808 3468RISC5x TMR-FF 4203 3468RISC5x SET modeling 5514 3468

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and to focus on the analysis of SETs induced by the radiation particles,we replaced the original RAM module with another version protectedby a Hamming Code which is enabled to correct two bit errors whenthey reside separately in the higher and lower half of the 8-bit register.The scheme of the Error Correction Code (ECC) applied to the registerfile RAM resources is depicted in Fig. 4.

We developed a hardened implementation of the RISCmicroproces-sor described above, applying TMR at different logic levels in order todrastically mitigate SEUs. We used two different methods. The firstmethod consists in applying the Synplify tool oriented to radiation hard-ened FPGA designs [9]; it applies the triplication of all the Flip-Flopsinserting amajority voter on their outputs. The second has been appliedat the entity level, in which the components in RISC5x, such as IDEC andALU are directly triplicated as represented in Fig. 5, except for the regis-ter file module (REGS) which has been already protected by ECC imple-mentation as mentioned above.

3.2. Fault tolerant strategies

Furthermore, we designed a RISC using a SET-aware Place and Routealgorithmapplied on the netlist generated by Synplify therefore appliedonly with TMR Flip-Flop. The SEE-aware place and route algorithm,

Fig. 6. Radiation expe

Please cite this article as: L. Sterpone, et al., Radiation-induced singletechnologies, Microelectronics Reliability (2015), http://dx.doi.org/10.101

which is based on a greedy approach that is able to reduce the SETbroadening effects [10], has the principal characteristics of performinga placement of the circuit logic resources by regulating the timingand capacitive load allowing modification of the original logic gateplacement positions into the regular array of the flash-based FPGAs inorder to achieve an optimal condition for the SETs mitigation. The PRalgorithm is part of a SEE-aware design flow by which an estimationof SET broadening effect of the design is made firstly, followed byguard gates insertions on user Flip-Flops where electrical filtering isnecessary. Finally, the PR algorithm implements the target circuit in-creasing the combinational logic filtering capabilities of each data pathby reducing and nullifying the broadening phenomena. Adopting thisdesign flow, SETs can be effectively mitigated with low resourcesoverhead.

3.3. Radiation test setup

The same test program implemented to capture the SEEs and prop-agate to the outputs to be captured has been used on the differentRISC5x implementations. The developed test program, generates asequence of data output with fixed time gap between each output.During execution of the test program, SEEs can cause errors in differentcomponents in FPGA, which can lead to corrupted data outputs andwrong time gaps between outputs. At this step, still there are errorsthat will be silenced by the fault tolerant strategies we applied or theinitialization stage in the test program.

The flash-based FPGA we used for the radiation test is A3P250 ofthe ProASIC3 family from Microsemi in 130-nm technology node.Another FPGA board from Altera was used as monitor board to con-trol theMicrosemi board, capture the data outputs and communicatewith the host PC outside the radiation beam chamber, as illustratedin the scheme reported in Fig. 6. As the three ports in RISC5x weresynchronized with clock source in the Microsemi board which was

rimental setup.

event transients modeling and testing on nanometric flash-based6/j.microrel.2015.07.035

Fig. 7. SEE cross-section comparison between different RISC5x implementation.

4 L. Sterpone et al. / Microelectronics Reliability xxx (2015) xxx–xxx

not shared with the Altera board, another port (PORTB) was used toindicate valid data on PORTA so that the asynchronous capturer inthe monitor board can read the correct data from PORTA and storethem in SRAM. The monitor board also controls the reset signal ofthe Microsemi board, and to avoid reset signal hazard, we triplicatedthe reset signal and used a voter in the design to ensure that the testprogram will be executed and stopped, as we wanted.

Experimental analysis has been performed on the RISC processor byheavy-ions radiation beam. The RISC has been implemented on aMicrosemi A3P250 flash-based FPGA and running a testing applicationconsisting in an iterative counter. A radiation campaign has been per-formed in September 2013 at the Cyclotron of the Université Catholiquede Louvain (UCL) on four different versions of the RISC processor:unhardened, TMR Synplify, TMR + GG and our method. The details ofthe resource usage are reported in Table 1. The RISC working frequencyhas been settled to 20MHzwhile the experiments have beenperformedusing a Kripton ion with a fluence of 3.04E8 [particles] and an averageflux of 1E4 [particles/sec]. A suitable monitor board has been developedin order to continuously monitor the RISC output and comparing themwith the expected data.

3.4. Results and discussion

The experimental results have been collected comparing the cross-section [errors/particles] for each of the implemented RISC version.The results obtained during the radiation test campaign demonstratedthat the RISC5x implementedwith SEE-aware placement tool has a sen-sitivity of about two orders of magnitude with respect to the RISC hard-ened with full TMR and guard-gate filtering 1 ns. Error bars werecomputed on the basis of the Monte Carlo process, which is calculatedas 1/√N where N corresponds to the number of errors counted. In the

Fig. 8. Error events

Please cite this article as: L. Sterpone, et al., Radiation-induced singletechnologies, Microelectronics Reliability (2015), http://dx.doi.org/10.101

worst case, the statistical error is 10%; the obtained results are reportedin Fig. 7.

The plain version of the RISC only protected with the ECC mecha-nism applied to the register file memory, reports a cross-section of1.52E−6 cm2. The TMR implementations, either using Guard-Gates(Full TMR + GG) and adopting TMR on sequential element (TMR–FF)have a reduction of cross-section of about 55% versus the plain version,while a negligible difference between the two TMR solutions is ob-served. On the other hand, the RISC5x implemented and mappedusing the SEE aware placement provides a reduction of more than 78%with respect to the plain version and about 48% less SEE sensibilitycompared to the TMR RISC5x implementations. Please note that perfor-mances are not degraded among the execution of three different RISC5xversions. In order to characterize the collected data, we analyzed thedata outputs provided by the RISC5x from the PORTA which can be di-vided into sequences containing 8 data output records each. The timedifference between two adjacent data records in a sequence wasmeasured by the monitor board and reports a fixed number ofclock cycles when no error is presented in the design. According tothe data outputs collected by the monitor board, the errors causedby SEEs can be functionally classified into 4 types: time gap, corre-sponding to the time difference between two data output outsidethe margin of the corrected ones; wrong data, corrupted data reportedon the PORTA output; wrong records, an erroneous number of recordsin a data sequence; and wrong sequence, an erroneous number ofdata sequences. The classification, reported in Fig. 8, gives insight onthe improvements performed by the SEE aware placement design ofthe RISC5x. In particular, the SEE-aware RISC5x reports a drastic reduc-tion of the wrong data effect (i.e., more than 60% versus the plainRISC5x) and an evident reduction of about 25% and 30% versus theTMR implementations, related to the time gap and missing sequenceeffects.

4. Conclusions and future works

In this paper we have analyzed the sensitiveness of a RISC micro-processor against SEEs induced by radiation particles, with differentfault tolerant strategies on flash-based FPGA. The experimental resultsdemonstrate the effectiveness of the proposed approach and providea reduction of the SET-sensitivity of more than 76% versus a not-mitigated version, while 48% versus traditional TMR methods.

In the future, we intend to extend the studies on the effectiveness ofASIC cell libraries based on a 15 nm technology.

Acknowledgments

The radiation test experiments performed at the Cyclotron of theUniversité Catholique de Louvain (UCL) have been supported by theEuropean Space Agency (ESA) (4000105142).

classification.

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5L. Sterpone et al. / Microelectronics Reliability xxx (2015) xxx–xxx

References

[1] J.J. Wang, S. Samiee, H.-S. Chen, C.-K. Huang, M. Cheung, J. Borillo, S.N. Sun, B.Cronquist, J. McCollum, Total ionizing dose effects on flash-based field programma-ble gate array, IEEE Trans. Nucl. Sci. 51 (Part 2) (Dec 2004) 3759–3766.

[2] S. Rezgui, J.J. Wang, Y. Sun, B. Cronquist, J. McCollum, Configuration and routing ef-fects on the SET propagation in flash-based FPGAs, IEEE Trans. Nucl. Sci. 55 (6) (Dec.2008) 3328–3335.

[3] M. Berg, H. Kim, M. Friendlich, C. Perez, C. Seidleck, K. LaBel, R. Ladbury, “SEU Anal-ysis of Complex Circuits Implemented in Actel RTAX-S FPGA Devices”, IEEE Trans.Nucl. Sci. 58 (3 Part 2) (2011) 1015–1022.

[4] L. Sterpone, N. Battezzati, V. Ferlet-Cavrois, Analysis of SET propagation in flash-based FPGAs by means of electrical pulse injection, IEEE Trans. Nucl. Sci. 57(4 Part 1) (2010) 1820–1826.

[5] N. Battezzati, S. Gerardin, A. Manuzzato, D. Merodio, A. Paccagnella, C. Poivey, L.Sterpone, M. Violante, Methodologies to study frequency-dependent single event

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effects sensitivity in flash-based FPGAs, IEEE Trans. Nucl. Sci. 56 (6 Part 1) (2009)3534–3541.

[6] L. Sterpone, N. Battezzati, F.L. Kastensmidt, R. Chipana, An analytical model of thepropagation induced pulse broadening (PIPB) effects on single event transient inflash-based FPGAs, IEEE Trans. Nucl. Sci. 58 (5/2) (2011) 2333–2340.

[7] S. Rezgui, R. Won, J. Tien, SET characterization and mitigation in 65-nm CMOS teststructures, IEEE Trans. Nucl. Sci. 59 (4) (August 2012).

[8] http://opencores.org/project/risc5x.[9] Microsemi Application Note AC139, Using Synplify to Design in Microsemi

Radiation-Hardened FPGAs, May 2012. 1–9.[10] L. Sterpone, B. Du, D. Merodio Codinachs, V. Ferlet-Cavrois, Accurate Mitigation of

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