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AGENDA
RECON® PACKAGING TECHNOLOGY FOR
“SYSTEM INTEGRATION & PORTABLE/WEARABLE/IOT DEVICES”
Edward Law
Senior Director
Package Engineering, Operations and Central Engineering
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OUTLINE
Market dynamics
Connectivity IoT challenges and current solutions
ReCon® technology and advantages
Production performance
Scalability
Conclusions
Acknowledgement
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New Content & Services Proliferation of Devices Exponential Network Traffic
TRENDS DRIVING SEMICONDUCTOR DEMAND
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New Content & Services Proliferation of Devices Exponential Network Traffic
4
Source: IDC Futures Report, 2014
Content services including mobility, cloud, big data and social media is expected to become a $137B market.
2018 By
4
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New Content & Services
Source: ABI Research, August 2014
2020 By
Proliferation of Devices
There will be more than 40.9 billion wireless connected devices– that will exceed the world’s population.
Exponential Network Traffic
5 oration. All rig
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Source: Cisco Visual Networking Index, June 2014
Every second, nearly a million minutes of video content will cross the network.
Exponential Network Traffic
2018 By
Proliferation of Devices New Content & Services
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Connectivity
LEVERAGING CONNECTIVITY TO LEAD IOT AND WEARABLES
Body-borne Computing and Sensors
Smart Devices Control and Analyze
Wearables
Everything Connected
to the Network
Internet of Things
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Health and Wellness
Sports and Fitness
Home, Security and Automation
Automotive
WICED™ SMART Bluetooth Boost for Low-power Products
Health and Wellness
Games and Entertainment
Home, Security and Automation
Home Appliances
WICED™ WI-FI Always-on Connection to the Home Network
WICED SENSE™
Development Kit
NEW APPLICATIONS UNLEASHING INNOVATION
Wireless Internet Connectivity for Embedded Devices (WICED™)
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High Performance Connectivity
On-board Diagnostics
Infotainment
360° Camera System
Wireless Hotspot
BUILDING MOMENTUM IN NEW MARKETS
Automotive
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CURRENT PACKAGING SOLUTIONS FOR CONNECTIVITY AND IOT
Flip Chip Package
Hybrid Package
Wafer Level Package
• Thermal dissipation
• Lower cost
• Smaller
• Ensuring signal and power integrity
• Smarter
• Ensuring reliability and quality
WLCSP (Ball) WLCSP (Bump)
Board
Stacked Die Package
Challenges
QFN / Multi-row QFN Package
Package On Package
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RECON® INNOVATIVE PACKAGING TECHNOLOGY
Package Size
IO / B
all C
ou
nt
Single infrastructure for all applications and package types
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ADVANTAGES OVER WL FANOUT, FLIPCHIP CSP AND BGA
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$
$ Size
Fan Out
ReCon® BGA
FanOut Recon BGA Strip FCCSPReCon® BGA
Performance Cost Interconnect
Density
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Over 16 million units shipped since year 2013
Broad application coverage
Equal or better assembly yield than current package technologies
RECON® PRODUCTION PERFORMANCE
0
2
4
6
8
10
12
14
16
18
百萬
RECON® CUMULATIVE VOLUME
YoY
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Interconnect Density & System Partitioning
Multilayer & Design Flexibility
Superior Electrical,Thermo/ Mechanical Performance
Quality & Reliability
Supply Chain Flexibility
Cost Advantage
DFT & DFM
Form Factor Flexibility
SCALABILITY
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ReCon® WLP
ReCon® Flipchip Package Variants
Heatspreader
ASIC Memory Interposer
Discrete Memory
Multiple Chips
Interposer
Substrate
Multiple Chips
Interposer
Substrate
Board
ReCon® iPoPTM -3D
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Packaging technologies convergence
Volume drives standardization and efficiency
ReCon® technology is a manufacturing proven packaging approach:
Broad coverage
Lower cost
Better performance
Scalable
CONCLUSIONS
Resulting in smarter, more efficient IoT, wearable and global networking solutions
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ACKNOWLEDGEMENT
Package Engineering, Operations and Central Engineering
Broadband Connectivity Group
Infrastructure Networking Group
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THANK YOU
