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ing the directionality or anisotropy of a surface and for making the surface specular on a substrate material consisting of aluminum or an aluminum alloy, which compris- es chemically etching the substrate material; subjecting the etched substrate material to electrochemi- cal polishing by using a solution; and subjecting the substrate mate- rial to a new chemical etching and electrochemical polishing, wherein the substrate of the substrate material is not exposed to air between the etching and the elec- trochemical polishing. AIRFOIL STRIPPING SYSTEM US. Patent 6,428,683. Aug. 6,2002 M.R. Jaworowski, et al., assignors to United Technologies Corp., Hartford, Ct. A coating removal system com- prising a stripping tank contain- ing an electrolyte bath for remov- ing a coating from at least one workpiece while a controlled absolute electrical potential is maintained; a rinse tank; and a distillation unit for receiving elec- trolyte from the stripping tank containing dissolved metals, and returning the electrolyte in a puri- fied form to the stripping tank. ETCHING PROCESS TO SELECTIVELY REMOVE COPPER US. Patent 6,428,719. Aug. 6,2002 X. Wu, et al, assignors to Headway Technologies Inc., Milipitas, Calif: A process for etching copper in the presence of nickel-iron com- prising providing a body of nickel iron and a layer of copper in the vicinity of the nickel-iron such that there is contact between the copper and the nickel-iron; and immersing the layer of copper and the body of nickel-iron in an aque- ous etching solution of ammoni- um persulfate, at a first concen- tration, to which has been added 1,4,8,11 tetraazundecane at a sec- ond concentration, whereby the copper layer is removed and the nickel-iron is unaffected. RECYCLING POWDER / COATING WASTE US. Patent 6,428,843. Aug. 6,2002 R. Graewe and A. Rettig, assignors to E.I. du Pont de Nemours & Co., Wilmington, Del. A process for recycling polymeric powder coating wastes compris- ing intimately contacting the powder coating wastes with poly- meric powder coating chips to that are at least partially covered with the powder coating wastes; and bonding the powder coating wastes to the powder coating chips by heating. Circle 046 on reader information card or go to www.thru.to/webconnect September 2003 73
