Referierte Zeitschriften 1 "Electromigration Induced Transgranular Slit Failures in Near Bamboo Al and Al-2% Cu Thin Film Inte Applied Physics Letters 61, 3121-3123 1992 J.E. Sanchez Jr., O. Kraft and E. Arzt 2 "Electromigration Failure by Shape Change of Voids in Bamboo Lines" Journal of Applied Physics 76, 1563-1571 1994 E. Arzt, O. Kraft, W.D. Nix and J.E. Sanchez Jr. 3 "Shape Changes of Voids in Bamboo Lines: A New Electromigration Failure Mechanism" Quality and Reliability Engineering International 11, 279-283 1995 O. Kraft, U.E. Möckl and E. Arzt 4 "Numerical Simulation of Electromigration-Induced Shape Changes of Voids in Bamboo Lines" Applied Physics Letters 66, 2063-2065 1995 O. Kraft and E. Arzt 5 „Metalle unter Extrembedingungen" Physikalische Blätter 52, 227-231 1996 E. Arzt, O. Kraft and U.E. Möckl 8 "Physical Metallurgy of Electromigration: Failure Mechanisms in Miniaturized Conductor Lines" Zeitschrift für Metallkunde 87, 934-942 1996 E. Arzt, O. Kraft, R. Spolenak and Y.-C. Joo 6 "Quantitative Analysis of Electromigration Damage in Al-based Conductor Lines" Journal of Materials Research 12 2027-2037 1997 O. Kraft, J.E. Sanchez Jr., M. Bauer and E. Arzt 7 "Electromigration Mechanisms in Conductor Lines: Void Shape Changes and Slit-like Failure" Acta Materialia 45, 1599-1611 1997 O. Kraft and E. Arzt 9 "Current Density and Line Width Effects in Electromigration: A New Damage-Based Lifetime Model" Acta Materialia 46 3733-3743 1998 O. Kraft and E. Arzt
Transcript
Referierte Zeitschriften 1 "Electromigration Induced Transgranular Slit Failures in Near Bamboo Al and Al-2% Cu Thin Film Inte Applied Physics Letters 61, 3121-3123 1992 J.E. Sanchez Jr., O. Kraft and E. Arzt 2 "Electromigration Failure by Shape Change of Voids in Bamboo Lines" Journal of Applied Physics 76, 1563-1571 1994 E. Arzt, O. Kraft, W.D. Nix and J.E. Sanchez Jr. 3 "Shape Changes of Voids in Bamboo Lines: A New Electromigration Failure Mechanism" Quality and Reliability Engineering International 11, 279-283 1995 O. Kraft, U.E. Möckl and E. Arzt 4 "Numerical Simulation of Electromigration-Induced Shape Changes of Voids in Bamboo Lines" Applied Physics Letters 66, 2063-2065 1995 O. Kraft and E. Arzt 5 „Metalle unter Extrembedingungen" Physikalische Blätter 52, 227-231 1996 E. Arzt, O. Kraft and U.E. Möckl 8 "Physical Metallurgy of Electromigration: Failure Mechanisms in Miniaturized Conductor Lines" Zeitschrift für Metallkunde 87, 934-942 1996 E. Arzt, O. Kraft, R. Spolenak and Y.-C. Joo 6 "Quantitative Analysis of Electromigration Damage in Al-based Conductor Lines" Journal of Materials Research 12 2027-2037 1997 O. Kraft, J.E. Sanchez Jr., M. Bauer and E. Arzt 7 "Electromigration Mechanisms in Conductor Lines: Void Shape Changes and Slit-like Failure" Acta Materialia 45, 1599-1611 1997 O. Kraft and E. Arzt 9 "Current Density and Line Width Effects in Electromigration: A New Damage-Based Lifetime Model" Acta Materialia 46 3733-3743 1998 O. Kraft and E. Arzt
10 "Measurement of the Lattice Thermal Expansion Coefficient of Thin Films on Substrates" Journal of Applied Physics 83, 3035-3038 1998 O. Kraft and W.D. Nix 11 "Effects of alloying elements on electromigration" Microelectronics Reliability 38, 1015-1020 1998 R. Spolenak, O. Kraft and E. Arzt 12 "Interpretation of x-ray photoelectron spectra of elastic amorphous carbon nitride thin films" Appl. Phys. Lett. 74, 3290-3292 1999 B. Holloway, O. Kraft, D. Shuh, M. Kelly, W.D. Nix, P. Pianetta and S. Hagström 13 "A new method to study cyclic deformation of thin films in tension and compression" J. Mater. Res. 14, 2373-2376 1999 M. Hommel, O. Kraft, and E. Arzt 15 "High cycle fatigue of thin Ag films investigated by dynamic microbeam deflection" Scripta Materialia 41, 823-829 1999 R. Schwaiger and O. Kraft 14 "X-ray diffraction as a tool to study the mechanical behavior of thin films" Materials Science and Engineering A228, 209-216 2000 O. Kraft, M. Hommel and E. Arzt 16 “Mikrostruktureigenschaften von Alporas Schaum in Abhängigkeit von thermisch mechanischer Belastu Materialwissenschaft und Werkstofftechnik 31, 478-480 2000 B. Kriszt, O. Kraft and H. Clemens 20 "The role of delocalized nitrogen in determining the local atomic arrangement and mechanical propertie
nitride thin films" J. Vac. Sci. Tech. A 18 2964-2971 2000 B. Holloway, O. Kraft, D. Shuh, W.D. Nix, M. Kelly, P. Pianetta and S. Hagström, 17 “Fatigue in Thin Films: Lifetime and Damage Formation” Materials Science and Engineering A 319-321, 919-923 2001 O. Kraft, R. Schwaiger and P. Wellner
18 “Mechanical Testing of Thin Films and Small Structures” Advanced Engineering Materials 3, 99-110 2001 O. Kraft and C.A. Volkert 19 “Interface Controlled Plasticity in Metals: Dispersion Hardening and Thin Film Deformation” Progress in Materials Science 46, 283-307 2001 E. Arzt, G. Dehm, P. Gumbsch, O. Kraft and D. Weiss 21 “Quasicrystalline grain-boundary phase in the magnesium die-cast alloy ZA85” Scr. Mater. 45, 517-524 2001 M. Vogel, O. Kraft, G. Dehm and E. Arzt 22 “The effect of temperature and strain rate on the hardness of Al and Al-based foams as measured by nan Z. Metallk. 92, 1068-1073 2001 O. Kraft, D. Saxa, M. Haag and A. Wanner 23 “Deformation behavior of thin copper films on deformable substrates” Acta Mater. 49, 3935-3947 2001 M. Hommel and O. Kraft 24 “3D FIB mapping of nanoindentation zones in a Cu-Ti multilayered coating” Thin Solid Films 413 147-154 2002 T.J. Steer, G. Möbus, O. Kraft, T. Wagner and B.J. Inkson 25 “Dislocation plasticity in thin films” MRS Bulletin 27, No. 1, 30-38 2002 O. Kraft, L.B. Freund, R. Phillips and E. Arzt 26 “Grain-boundary voiding in self-passivated Cu-1at.%Al alloy films” J. Mater. Res. 17, 1363-1370 2002 D. Weiss, O. Kraft and E. Arzt 27 “Microstructural changes in cell walls of a closed-cell Al-foam during creep” Phil. Mag. A 82, 2895-2907 2002 P. Zhang, M. Haag, O. Kraft, A. Wanner and E. Arzt 28 “Fatigue behavior of polycrystalline thin copper films” Z. Metallkd. 93, 392-400
2002 O. Kraft, P. Wellner, M. Hommel, R. Schwaiger and E. Arzt 32 “Hard and elastic amorphous carbon nitride thin films studied by 13C nuclear magnetic resonance spectr Physical Review B 66, 153402 2002 W. J. Gammon, D. I. Malyarenko, O. Kraft, G. L. Hoatson, A. C. Reilly, and B. C. Holloway 29 „Creep behavior of magnesium die-cast alloy ZA85“ Scripta Materialia 48, 985-990 2003 M. Vogel, O. Kraft and E. Arzt 30 „Size effects in the fatigue behavior of thin Ag films“ Acta Materialia 51, 195-206 2003 R. Schwaiger and O. Kraft 31 “Texture Dependence of the Martensitic Transformation in Cobalt Thin Films” Scripta Materialia 48, 1129-1133 2003 H. Th. Hesemann, P. Müllner, O. Kraft, D. Nowak, S.P. Baker, K. Finkelstein, and E. Arzt 33 „Cyclic Deformation of Polycrystalline Cu Films“ Phil. Mag. 83, 693-710 2003 R. Schwaiger, G. Dehm and O. Kraft 35 “Microstructure of Die-Cast Alloys Mg-Zn-Al(-Ca): A Study by Electron Microscopy and Small-Angle Z. Metallkd. 94, 564-571 2003 M. Vogel, O. Kraft, P. Staron, H. Clemens, R. Rauh and E. Arzt 36 “Creep of aluminum-based closed-cell foams” Metallurgical and Materials Transactions 34A, 2809-17 2003 M. Haag, A. Wanner, H. Clemens, P. Zhang, O. Kraft and E. Arzt 37 “Kerbformoptimierung ohne FEM: Ein einfacher Weg um Kerbspannungen abzubauen” Zeitschrift für Materialwissenschaft undWerkstofftechnik 34, 513-515 2003 C. Mattheck, M. Scherrer, I. Tesari, and O. Kraft 38 „Effect of film thickness and grain size on fatigue–induced dislocation structures in Cu thin films“ Phil. Mag. Lett. 83, 477-483 2003 G. P. Zhang, R. Schwaiger, C.A. Volkert and O. Kraft
50 “Nucleation model for hcp martensite: Application to Cu thin films” J. Phys. IV France 112, 107-110 2003 H.Th. Hesemann, P. Müllner, O. Kraft, and E. Arzt 65 “Experimental comparison of N(1s) X-ray photoelectron spectroscopy binding energies of hard and elas
nitride films with reference organic compounds” Carbon 41, 1917-1923 2003 W.J. Gammon, O. Kraft, A.C. Reilly, and B.C. Holloway 39 „Analyzing the mechanical behavior of thin films using nanoindentation, cantilever microbeam deflectio
modeling “ J. Mat. Res. 19, 315-324 2004 R. Schwaiger and O. Kraft 40 „Channel cracking of b-NiAl thin films on Si substrates“ Acta Materialia 52, 2325-2336 2004 P. Wellner, O. Kraft, G. Dehm, J. Andersons, and E. Arzt 41 „Size Effects in the Deformation of NiAl Thin Films“ Zeitschrift für Metallkunde, 95 (2004) 9, S. 769-778, 2004 P. Wellner, G. Dehm, O. Kraft, E. Arzt 43 „In Seilen denken!” Konstruktionspraxis 9, 26-29 2004 C. Mattheck, R. Kappel, I. Tesari, and O. Kraft 44 “Mechanical Behavior of Pt and Pt-Ru Solid Solution Alloy Thin Films” Acta Materialia 52, 4199-4211 2004 S. Hyun, O. Kraft, and R.P. Vinci 45 „Gibt es eine Universalkerbkontur nach dem Vorbild der Natur?“ Materialwissenschaft und Werkstofftechnik. 9, 582-586, 2004 C. Mattheck, K. Bethge, I. Tesari, M. Scherrer, and O. Kraft 48 „Reliability Assessment of a Gas Microsensor” IEEE Transactions on Device and Materials Reliability 4, 549-555 2004 J. Büttner, N. Huber, M. Bruns, and O. Kraft 46 „Geist oder Fleiß- ein praxisgerechter Zugang zur Kerbformoptimierung“ Der Konstrukteur 6, 58-60 2005 C. Mattheck, K. Bethge, I. Tesari, M. Scherrer, and O. Kraft
„Finite Element Based Simulation of Dry Sliding Wear“ 47 Modelling and Simulation in Materials Science and Engineering 13, 57-75 2005 V. Hegadekatte, N. Huber, and O. Kraft “Fatigue failure of coarse-grained alumina under contact loading” 51 Materialwissenschaft und Werkstofftechnik 36, 163-170 2005 T. Fett,O. Kraft, and D. Munz “Damage behavior of 200-nm thin copper films under cyclic loading” 52 Journal of Materials Research 20, 201-207 2005 G.P. Zhang, C.A. Volkert, R. Schwaiger, E. Arzt, and O. Kraft 53 “Inertial effects on dislocation damping under cyclic loading with ultra-high frequencies” Materials Science and Engineering A, 400-401, 397-400 2005 A. Walcker, D. Weygand, and O. Kraft 54 “Advanced probabilistic tools for the uncertainty assessment in failure and lifetime prediction of cerami Materialwissenschaft und Werkstofftechnik 3/4, 171-176 2005 S. Roudi, H. Riesch-Oppermann, and O. Kraft 69 “Effect of Calcuium Additions on the Creep Behavior of Magnesium Die-Cast Alloy ZA85” Metallurgical and Materials Transactions A 36, 1713 2005 M. Vogel, O. Kraft, and E. Arzt 55 “Failure assessment of alumina in unlubricated unidirectional sliding contact” Materialwissenschaft und Wekstofftechnik 3/4 157-162 2005 E. Tyulyukovskiy, N. Huber, and O. Kraft 56 „Der verrammelte Notausgang - Lernen vom Bananenblatt!“ Konstruktionspraxis Spezial II-2005, 50-52 2006 C. Mattheck, R. Kappel, K. Bethge, and O. Kraft 49 „Ultra high-cycle fatigue in pure Al thin films and line structures” Materials Science and Engineering A 421, 68-76 2006 C. Eberl, R. Spolenak, E. Arzt, F. Kubat, A. Leidl, W. Ruile, and O.Kraft 58 “On the analysis of the stress-strain behavior of thin metal films on substrates using nanoidentation” Philosophical Magazine 86, 5505-5519 2006 N. Huber, E. Tyulyukovskiy, and O. Kraft 59 “Modeling and Simulation of Wear in a Pin on Disc Tribometer”
Tribology Letters 24, 51-60 2006 V. Hegadekatte, N. Huber, and O. Kraft 61 “Martensitic Transformation and Microstructure of Sputter-Deposited Ni-Mn-Ga Films” Materials Transactions 47, 619-624 2006 A. V. Chernenko, M. Kohl, V. A. L’vov, V. M. Kniazkyi, M. Ohtsuka, and O. Kraft 63 “Length-scale-controlled fatigue mechanisms in thin copper films” Acta Materialia 54, 3127-39 2006 G.P. Zhang, C.A. Volkert, R. Schwaiger, P. Wellner, E. Arzt, and O. Kraft 64 “Computer aided adhesive and assembly optimization method: Biomimetic optimization of adhesive joi J. Mater. Res. 21, 2011-2017 2006 M. Munzinger, O. Kraft, and C. Mattheck 66 “Damage analysis in Al thin films fatigued at ultrahigh frequencies” J. of Applied Physics 99, 113501-8 2006 C. Eberl, R. Spolenak, O. Kraft, F. Kubat, W. Ruile, and E. Arzt 68 „Lernen vom Bananenblatt“ Konstruktionspraxis, 8-2006, S.16-18 C. Mattheck, R. Kappel, K. Bethge, O. Kraft 67 “Fatigue damage in thin film Al interconnects at ultra high frequency: A finite element analysis approac Thin Solid Films 515, 3291-3297 2007 C. Eberl, R. Spolenak, O. Kraft, W. Ruile, and E. Arzt 70 “Mechanical characterization and modelling of brazed EUROFER-tungsten-joints” Journal of Nuclear Materials 367/70, 1228-1232 2007 T. Chehtov, J. Aktaa, and O. Kraft 57 “Uncertainty analysis of reliability predictions for brittle fracture” Engineering Fracture Mechanics 74, 2933-2942 2007 H. Riesch-Oppermann, S. Scherrer-Rudiy, T. Erbacher, and O. Kraft 62 “3D Dislocation Dynamics Simulation of the Influence of Sample Size on the Stress-Strain Behavior of
pillars” Mat. Science and Eng. A 483-484, 188-190 2008 D. Weygand, M. Poignant, P. Gumbsch, and O. Kraft 71 “A predictive modeling scheme for wear in pin-on-disc and twin-disc tribometers” Tribology International 41, 1020-1031
2008 V. Hegadekatte, S. Kurzenhäuser, N. Huber, and O. Kraft 72 “Effect of length scale on fatigue life and damage formation in thin Cu films” Materials Science & Engineering A (2007) doi:10.1016/j.msea.2007.06.092 2007 D. Wang, C.A. Volkert, and O. Kraft „Rissarrest: Aikido an der Rissspitze“ Konstruktionspraxis 2/2008, 14-17 2008 C. Mattheck, K. Bethge, I. Tesari, C. Wissner, R. Kappel, O. Kraft 74 „Fatigue and Thermal Fatigue Damage Analysis of Thin Metal Films“ Microelectronics Reliability 47, 2007-13 2007 G.P. Zhang, C.A. Volkert, R. Schwaiger, R. Mönig, O. Kraft „Are the Failure Criteria of SIA (Statics Integrated Assessment) and Tree Pulling Tests Wrong?“ 75 Erscheint in Arboricultural Journal, Arbor Italia C. Mattheck, K. Bethge, O. Kraft 76 „A combined microtensile testing and nanoindentation study of the mechanical behavior of nanocrystall Erscheint in Int. J. of Mat. Res. R. Schwaiger, O. Kraft, J. Reszat, J. aktaa, C. Bade 77 „Mechanical Spectroscopy of Nanocrystalline Nickel Near Room Temperature“ Scripta Materialia 59, 467-470 2008 J. Lohmiller, C. Eberl, R. Schwaiger, O. Kraft, and T.J. Balk 78 „Discrete dislocation simulations of the plasticity of micro-pillars under uniaxial loading“ Scripta Materialia 58, 587-590 2008 J. Senger, D. Weygand, P. Gumbsch, and O. Kraft 79 „Three-dimensional dislocation dynamics simulation of the influence of sample size on the stress-strain
crystalline pillars“ Materials Science and Engineering A 483-484, 2008, S. 188-190 D. weygand, M. Poignant, P. Gumbsch, O. Kraft 81 Sind Risse Zipfelmützen? Die „Methode der Schubvierecke“ und die der „Zugdreiecke“ Konstruktionspraxis 5/2008, 16-18 2008 C. Mattheck, K. Bethge, C. Wissner, and O. Kraft 82 „STAU – a weakest link finite element postprocessor with extensive capabilities“ Eingereicht bei Int. Journal of Material Research H. Riesch-Oppermann, M. Härtelt, O. Kraft 83 „Multi time scale simulations for wear prediction in micro-gears“
Eingereicht bei Journal of Micromechanics and Microengineering. V. Hegadekatte, J. Hilgert, O. Kraft, N. Huber 84 „About cracks, jelly bag caps and a new way to stop cracks“ Eingereicht bei Eng. Fracture Mechanics C. Mattheck, K. Bethge, A. Sauer, J. Sörensen, C. wissner, O. Kraft
Bücher
1 Stress Induced Phenomena in Metallization O. Kraft, E. Arzt, C. Volkert, P. Ho and H. Okabayashi (eds.), AIP Symp. Proc. 491, Woodbury NY, US 2 Thin Films - Stresses and Mechanical Properties VIII R.P. Vinci, O. Kraft, N. Moody, P.R. Besser, E. Shaffer (eds.) Materials Research Society Symp. Proc. 5 3 Dislocations and Deformation in Thin Films and Small Structures O. Kraft, K. Schwarz, S.P. Baker, B. Freund, and R. Hull (eds.) Materials Research Society Symp. Proc.
2001 4 Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics - 2003 Andrew J. McKerrow, Jihperng (Jim) Leu, Oliver Kraft, Takamaro Kikkawa (eds.) Materials Research S
766, Pittsburgh, PA, 2003
Konferenz- und Buchbeiträge K1 "Mechanical Behavior and Oxidation Protection of a
Carbon/Carbon Composite with Random Chopped Fibers" in Brittle Matrix Composites 3 edited by A.M. Brandt and I.H.
Marshall (Elsevier Applied Sciences Publishers S. 471-480) 1991 O. Kraft, A. Wanner, K. Kromp, U. Papenburg K2 "Electromigration Resistance and Mechanical Strength: New
Perspectives for Interconnect Materials?" in Thin Films: Stresses and Mechanical Properties III, edited by
W.D. Nix, J.C. Bravman, E. Arzt and L.B. Freund (Materials Research Society Symp. Proc. 239, Pittsburgh, PA) S. 677-682
1992 E. Arzt, O. Kraft, J.E. Sanchez, Jr., S. Bader , W.D. Nix K3 "Microstructural Evolution in Thin Metal Films: Implications for
VLSI Interconnection reliability" in 1st International Workshop on Stress Induced Phenomena in
Metallizations edited by C.-Y. Li, P. Totta and P.S. Ho (American Institute of Physics Conf. Proc. 263, Woodbury, NY) S. 250-265
1992 J.E. Sanchez Jr., O. Kraft, E. Arzt K4 The Influence of Oxygen Ion Implantation on the Mechanical
Strength, Microstructure and Electromigration Resistance of Al Films"
" in the Proceedings of the 3rd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (Schwäbisch-Gmünd) S. 351-354
1992 S. Bader, E. Arzt, O. Kraft, J.E. Sanchez Jr., W.D. Nix K5 "Quantitative Analysis of Electromigration-Induced Damage in Al-
based Interconnects" in Materials Reliability in Microelectronics II edited by J.R. Lloyd
and C.V. Thompson (Materials Research Society Symp. Proc. 265, Pittsburgh, PA) S. 119-124
1992 O. Kraft, J.E. Sanchez Jr., E. Arzt K6 "Morphology and Crystallography of Electromigration Induced
Transgranular Slit Failures in Aluminum Alloy Interconnects" in Submicrometer Metallization : The Challenges, Opportunities,
and Limitations (SPIE, vol. 1805, Bellingham, Washington) S. 222-231
1993 J.E. Sanchez Jr., V. Randle, O. Kraft, E. Arzt K7 "Observation and Modelling of Electromigration-Induced Void
Growth in Al-based Interconnects" in Materials Reliability in Microelectronics III edited by K.P.
Rodbell, W.F. Filter, H.J. Frost and P.S. Ho (Materials Research Society Symp. Proc. 309, Pittsburgh, PA) S. 199-204
1993 O. Kraft, S. Bader, J.E. Sanchez Jr., E. Arzt K8 "Electromigration Damage in Conductor Lines: Recent Progress in
Microscopic Observation and Mechanistic Modelling" in MRS Materials Reliability in Microelectronics IV edited by P.
Børgesen, J.C. Coburn, J.E. Sanchez Jr., K.P. Rodbell and W.F. Filter (Materials Research Society Symp. Proc. 338, Pittsburgh, PA) S. 397-408
1994
E. Arzt, O. Kraft , U.E. Möckl K9 "Detailed Study of Electromigration Induced Damage in Al and
AlCuSi Interconnects" in MRS Materials Reliability in Microelectronics IV edited by P.
Børgesen, J.C. Coburn, J.E. Sanchez Jr., K.P. Rodbell and W.F. Filter (Materials Research Society Symp. Proc. 338, Pittsburgh, PA) S. 373-378
1994 U.E. Möckl, M. Bauer, O. Kraft, J.E. Sanchez Jr., E. Arzt K10 "Electromigration-Induced Voiding Mechanisms in Metallizations" in 3rd International Workshop on Stress Induced Phenomena in
Metallizations edited by P.S. Ho, J.C. Bravman, C.-Y. Li and J.E. Sanchez Jr. (American Institute of Physics Conf. Proc. 373, Woodbury, NY) S. 131-142
1996 O. Kraft, M. Bauer, E. Arzt K11 "Numerical Simulation of Surface Diffusion Controlled Motion and
Shape Change of Electromigration Voids" in Materials Reliability in Microelectronics VI edited by W.F.
Filter, J.J. Clement, A.S. Oates, R. Rosenberg, and P.M. Lenahan (Materials Research Society Symp. Proc. 428, Pittsburgh, PA) S. 161-166
1996 O. Kraft, U.E. Moeckl, E. Arzt K12 "In-situ TEM Investigations During Thermal Cycling of Thin
Copper Films" in Thin Films: Stresses and Mechanical Properties VI edited by
W.W. Gerberich, H. Gao, J.-E. Sundgren, and S.P. Baker (Materials Research Society Symp. Proc. 436, Pittsburgh, PA) S. 221-226
1997 R.-M. Keller, W. Siegle, S.P. Baker, O. Kraft, E. Arzt K13 "Microstructure and Mechanical Properties of Thin AlSiGe Films" in Thin Films: Stresses and Mechanical Properties VI edited by
W.W. Gerberich, H. Gao, J.-E. Sundgren, and S.P. Baker (Materials Research Society Symp. Proc. 436, Pittsburgh, PA) S. 21-26
1997 S. Kirchner, O. Kraft, S.P. Baker, E. Arzt K14 "Alloying Effects in Electromigration: Modeling and Experiments" 4th International Workshop on Stress Induced Phenomena in
Metallizations (American Institute of Physics Conf. Proc. 418, Woodbury, NY) S. 147-158
1997 R. Spolenak, O. Kraft , W.D. Nix , E. Arzt
K15 "Determination of the Temperature Dependent Unstressed Lattice
Spacings in Crystalline Thin Films on Substrates" in Thin Films: Stresses and Mechanical Properties edited by E.
Busso, R. Cammarata, M. Nastasi and W. Oliver (Materials Research Society Symp. Proc. 505, Pittsburgh, PA) S. 527-532
1998 G. Cornella, S.-H. Lee, O. Kraft, W.D. Nix , J.C. Bravman K16 "Thermomoechanical Behavior of Continuous and Patterned Al
Thin Films" in Materials Reliability in Microelectronics VIII edited by J.C.
Bravman, J.R. Lloyd, M. Korhonen, and T. Marieb (Materials Research Society Symp. Proc. 516, Pittsburgh, PA) S. 201-212
1998 O. Kraft, W.D. Nix K17 "Copper versus Magnesium as an Alloying Element in Aluminum
Interconnects: Effects on Electromigration" in Materials Reliability in Microelectronics VIII edited by J.C.
Bravman, J.R. Lloyd, M. Korhonen, and T. Marieb (Materials Research Society Symp. Proc. 516, Pittsburgh, PA) S. 269-274
1998 R. Spolenak, J. Mason, O. Kraft, E. Arzt K18 "Measurement of Mechanical Properties in Small Dimensions by
Microbeam Deflection" in Microelectromechanical Structures for Materials Research
edited by S. Brown, H. Guckel, G. Johnson, J. Gilbert, R. Howe, and P. Krulevitch (Materials Research Society Symp. Proc. 518, Pittsburgh, PA) S. 39-44
1998 O. Kraft, R. Schwaiger ,W.D. Nix K19 "Mechanische Werkstoffprüfung in kleinen Dimensionen" Werkstoffwoche 98 - Band X: Werkstoffprüfung, herausgegeben
von W.J. Muster, J. Ziebs and R. Link (WILEY-VCH, D-69469 Weinheim) 55-64
1999 O. Kraft K20 "Elektromigration in dünnen Aluminiumschichten: das kritische
Produkt aus Stromdichte and Leiterbahnlänge" Werkstoffwoche 98 - Band I: Informationstechnik, herausgegeben
von K. Kempter (WILEY-VCH, D-69469 Weinheim), 53-57 1999 A. Straub,O. Kraft, E. Arzt K21 "Dispersionshärtung in dünnen Schichten" Werkstoffwoche 98 - Band VI: Metalle, herausgegeben von R.
Kopp, P. Beiss, K. Herfurth, D. Böhme, R. Bormann, E. Arzt and
H. Riedel (WILEY-VCH, D-69469 Weinheim) 707-712 1999 D. Weiss, O. Kraft, P. Müllner, E. Arzt K22 "Micro-tensile and fatigue testing of copper thin films on
substrates" in Materials Science of Microelectromechanical System (MEMS)
Devices edited by A.H. Heuer and S.J. Jacobs (Materials Research Society Symp. Proc. 546, Pittsburgh, PA) 133-138
1999 M. Hommel, O. Kraft, S.P. Baker , E. Arzt K23 "Microstructural development of dispersion strengthened Cu thin
films" in Polycrystalline Metal and Magnetic Thin Films edited by D.
Laughlin, K. Rodbell, O. Thomas, B. Zhang (Materials Research Society Symp. Proc. 562 Pittsburgh, PA) 257-262
1999 D. Weiss, O. Kraft, E. Arzt K24 “Measurement of Thin Film Mechanical Properties by Microbeam
Deflection” in Materials Reliability in Microelectronics IX (Materials Research
Society Symp. Proc. Vol. 563, Pittsburgh PA, USA) 231-236 1999 J. Florando, H. Fujimoto, Q. Ma, O. Kraft, R. Schwaiger, W.D. Nix K25 “Alloying Effects in Electromigration: What Controls the
Electromigration Drift?” in: Stress Induced Phenomena in Metallization (AIP Symp. Proc.
491, Woodbury NY, USA) 126-137 1999 R. Spolenak, O. Kraft, E. Arzt K26 “Thin Films: Mechanical Testing” Encyclopedia of Materials: Science and Technology, K.H.J.
Buschow, R.W. Cahn, M.C. Flemings, B. Ilschner, E.J. Kramer, S. Mahajan (Eds.), (Elsevier Science Ltd., Oxford UK ISBN:0-08-0431526), pp. 9257-9262
O. Kraft K27 “Thin Films: Fatigue” Encyclopedia of Materials: Science and Technology, K.H.J.
Buschow, R.W. Cahn, M.C. Flemings, B. Ilschner, E.J. Kramer, S. Mahajan (Eds.), (Elsevier Science Ltd., Oxford UKISBN: 0-08-04321526), pp. 9241-9243
O. Kraft K28 “The effect of film thickness on stress and transformation behavior
in cobalt thin films”
in Stresses and Mechanical Properties VIII edited by R.P. Vinci, P.R. Besser, O. Kraft, N. Moody, E. Shaffer (Materials Research Society Symp. Proc. 594, Pittsburgh, PA) 219-224
2000 H. Hesemann, P. Müllner, O. Kraft, E. Arzt K29 “Fatigue behavior of thin silver films investigated by dynamic
microbeam deflection” in Stresses and Mechanical Properties VIII edited by R.P. Vinci,
P.R. Besser, O. Kraft, N. Moody, E. Shaffer (Materials Research Society Symp. Proc. 594, Pittsburgh, PA) 201-206
2000 R. Schwaiger and O. Kraft K30 “Creep of Mg-Zn-Al Alloys” in Magnesium Alloys and their Application, K.U. Kainer (ed.)
(Wiley-VCH Verlag GmbH, Weinheim, Germany) 693-700 2000 M. Vogel, O. Kraft, E. Arzt, E.D. Reese, R. Rauh K31 “3D FIB and AFM mapping of nanoindenation zones” in Fundamentals of Nanoindentation and Nanotribology II
(Materials Research Society Symp. Proc. Vol. 649, Pittsburgh, PA) Q3.7
2001 T.J. Steer, G. Möbus, O. Kraft, T. Wagner, B.J. Inkson K32 “Solid solution alloy effects on microstructure and indentation
hardness in Pt-Ru thin films” Dislocations and Deformation in Thin Films and Small Strucutres
(Materials Research Society Symp. Proc. Vol. 673, Pittsburgh, PA) P3.2
2001 S. Hyun, O. Kraft, R.P. Vinci K33 “Interconnect failure due to cyclic loading” in: 6th Int. Workshop on Stress Induced Phenomena in
Metallization (AIP Symp. Proc., Woodbury NY, USA in: 6th Int. Workshop on Stress Induced Phenomena in Metallization (AIP Symp. Proc., Woodbury NY, USA, 2002) p. 119-132) p. 119-132
2002 R.R. Keller, R. Mönig, C.A. Volkert, E. Arzt, R. Schwaiger, O.
Kraft K34 “The role of chemical composition for the ductility and
microstructure of thin NiAl films” Thin Films – Stresses and Mechanical PropertiesIX (Materials
Research Society Symp. Proc. Vol. 695, Pittsburgh, PA) L9.6 2002 P. Wellner, O. Kraft, E. Arzt
K35 “Damage formation in Cu thin films due to mechanical fatigue” in: FATIGUE 2002, A. Blom (ed.), (Engineering Materials
Advisory Service, West Midlands, U.K.) 2225-2232 2002 O. Kraft, P. Wellner, R. Schwaiger K37 “Mechanical Testing of Materials in Small Volumes by
Nanoindentation and Microbeam Bending” in Conf. Proc. of ATEM 2003, Nagoya, Japan 2003 O. Kraft, N. Huber, E. Tioulioukovski, Ruth Schwaiger K38 „TEM Investigation of Fatigue Damage in Cu Thin Films and
Interconnects“ Proc. Of the 9th Int. Conf. on the Mechanical Behavior, 2003 G. P. Zhang, R. Mönig, C.A. Volkert, O. Kraft K39 „Innovative stochastische Methodenfür die
Zuverlässigkeitsbewertung keramischer Bauteile“ 2. Statuskolloquium des SFB 483, Tagungsband S. 39-44 2004 S. Roudi, H. Riesch-Oppermann, O. Kraft K40 „Microscopic Investigation of Strain Localization and Fatigue
Damage in Thin Cu Films” PRICM 5, Nov. 2.-7. 2004, Beijing, P.R. China, Abstract No. P-
066 2004 G.P. Zhang, C.A. Volkert, R. Schwaiger, O. Kraft K41 „Zuverlässigkeitsbewertung thermomechanisch belasteter
Mikrobauteile“ Tagungsband zum 5. Statuskolloquium MIKRO, S.153-158 2004 J. Büttner, N. Huber, O. Kraft K42 „3D Analysis of Microstructures by Focused Ion Beam
Microscopy” Proceedings 25th Int. Risk Symposium on Materials Science, 5.-10. September, Roskilde, Denmark 2004 C.A. Volkert, C. Eberl ,R. Mönig, M. Walter, O. Kraft K43 „Ausfallswahrscheinlichkeit keramischer Bauteile unter zyklischer
und gleitender Kontaktbelastung“ 2. Statuskolloquium des SFB 483, Tagungsband S. 45-52 2004 N. Huber, T. Fett, O. Kraft K44 „Reliability Issus in MEMS Related to Cyclic Loading“
Proceedings of ASME International Mechanical Engineering Congress, Anaheim, CA, 14-19 Nov. 2004
2004 O. Kraft, C.A. Volkert K45 „Microscopic Investigation of Strain Localization and Fatigue
Damage in Thin Films” PRIM 5, Nov. 2.-7. 2004, Beijing, P.R. China, Abstract No. P-066 2004 G.P. Zhang, C.A. Volkert, R. Schwaiger, O. Kraft K46 „Crack Nucleation and Propagation During Fatigue of Thin Films” Proceedings Int. Conference on Fracture XI, 20.-25. März O. Kraft, R.Schwaiger, G.P. Zhang, C.A. Volkert K47 A Finite Element Based Method for Wear Simulation in
Microsystems 1st Vienna Int. Conference on Micro-and Nano- Technology, 9.-
11. März 2005, S.181-190 2005 V. HegadekatteN. HuberO. Kraft K49 Deformation Behavior of Nanoporous Au 7th Int. Conference on Nanostructured Materials, 20.-24.June,
Wiesbaden 2004 C.A. VolkertR. Schwaiger, T. Dietz; D.Kramer; J. WeissmüllerO.
Kraft K50 Development of a Simulation Tool for Wear in Microsystems Micro-Engineering in Metals & Ceramics, Advanced Micro and
Nano Systems Vol 3, Willey-VCH Verlag GmbH, Weinheim 2004 V. Hegadekatte, N. Huber, O. Kraft K51 Microstructure and thermo-mechanical behavior of NiAl coatings MRS, Boston, 29.11.-03.12.2004, Vol. 842, pp.1.3.1-1.3.6 2005 G. Dehm, J. Riethmüller, P. Wellner, O. Kraft, H. Clemens, E. Arzt K52 Methoden zur Verschleißbewertung in keramischen Mikrogetrieben SFB-Tagung 2.+3. März 2005, S.142-151, 2005 Hegadekatte, V., Herz, J., Huber, N., Kraft, O., Schneider, J., Zum
Gahr, K.-H. K53 In Seilen denken! Tagungsband 11. VTA-Spezialseminar "Messen und Beurteilen am
Baum", Karlsruhe, 19.-20.04.2005 Mattheck, C., Kappel, R., Tesari, I.,Kraft, O. K54 A Fast Design-Tool for Ceramics under Static and Cyclic Contact
Loading 11th Int. Conference on Fracture, Turin, 20.-25. März 2005, Paper
No. 5700 on CD, 2005 N. Huber, V. Licht, V. Hegadekatte, O. Kraft K55 An Investigation of Non-linear Stress-strain Behavior of Thin
Metal Films Mater. Res. Soc.Symp.Proc. Vol.841, 2005, R12.2.1, 2005 N. Huber, T. Dietz, E. Tyulyuskovskiy B “Measurement of stresses in thin films and their relaxation” erscheint in Diffusion Processes in Advanced Technological
Materials, D. Gupta (ed.) Andrew Williams Co., 368-404 2005 O. Kraft, H. Gao K54 A Finite Element Based Technique for Simulating Sliding Wear World Tribology Congress III, 12.-16. Sept. 2005, Washingt on ,
D.C. V. Hegadekatte, N. Huber, O. Kraft “Microscopic Investigation of Strain Localization and Fatigue
Damage in Thin Cu Films” Materials Science Forum, Vol. 475-479 (ISSN: 0255-5476), 3647 2005 G.P. Zhang, C.A. Volkert, R. Schwaiger, O. Kraft
K58 Biaxial Fatigue Testing of thin Films AIP Conference Proceedings: Vol 817, Stress Induced Phenomena
in Matallization, S. 92-97, 12.-14.Sept. 2005 S. Eve, N. Huber, E. Ernst, A. Last, M. Schlagenhof, O. Kraft K59 Die Ca3O - Methode - Optimierung von Klebeverbindungen 38. Tagung des Arbeitskeis Bruchvorgänge},pages={267-276}
publisher={Deutscher Verband für Materialforschung und -prüfung e.V.year={2006}
M. Munzinger, C. Mattheck, O. Kraft K60 Reliability studies of micro-optical components in NEMO Proc. of SPIE Vol. 6193,61930A-1, 2006 France F. Bergmans, M.Van Uffelen, S. Eve, E. ernst, A. Last, D.
Rabus,N. Huber,O. Kraft, K57 Fatigue and Thermal Fatigue Damage Analysis of Thin Metal
Films IEEE Proceedings 2006 G.P. Zhang, C.A. Volkert, R. Schwaiger, R. Mönig, O. Kraft K61 Modeling and simulation of dry rolling/sliding wear Tribology Gordon Research Conference, 18.-23. Juni 2006,
Waterville, Maine V. Hegadekatte, N. Huber, O. Kraft K62 Modeling and Simulation of wear in Micro Gears Multiscale Materials Modeling, 18.-22.Sept. 2006, Freiburg N. Huber, V. Hegadekatte, O. Kraft K63 Lifetime prediction for ceramic components under cyclic tensile
and torsional loading
10th Internat. Conference of the European Ceramic Society,17.-21.06.07, Berlin
M. Härtelt, H. Riesch-Oppermann, T. Schwind, O. Kraft
K64 Lebensvorhersage für keramische Bauteile bei zyklischer
Ermüdung
3.Statuskolloquium des SFB 483 am 18.10.07 in Karlsruhe, S.129-136
M. Härtelt, H. Riesch-Oppermann, T. Schwind, O. Kraft K65 Prozessketten des Urformens für metallische und keramische
Mikrobauteile - der Sonderforschungsbereich 499
Kolloquium Mikroproduktion: Fortschritte,Verfahren, Anwendungen, Karlsruhe 22.-23. Nov. 2007, S. 7-11
O. Kraft, J. Haußelt, R. Ruprecht K66 Modeling and Simulation of wear in Micro-machines
DGM-Conferece, Aachen am 9.-11.April 2008
V. Hegadekatte, O. Kraft, N. huber K67 Fail safe design with crack stoppers and warners
Design and nature IV - Comparing Design in Nature with Science and Engineering, WIT Press, Southampton, S.71-77
C. Mattheck, Ch. Wissner, K. Bethge, O. Kraft K68 A simple graphic way to reduce stress concentrations by growth
Design and nature IV - Comparing Design in Nature with Science and Engineering, WIT Press, Southampton, S.79-85
C. Mattheck, I. Tesari, A. Sauer, O. Kraft
K69 „Die Methode der Zugdreiecke“ Erscheint in Sonderausgabe der VDI-Nachrichten zur Hannover-
Messe 2008 C. Mattheck, I. Tesari, K. Bethge, C. Wissner, A. Sauer; J.
Sörensen, R. Kappel, O. Kraft K70 „Sind die Kriterien falsch?“ DEGA, 12/2008, S.26+27 C. Mattheck, K. Bethge, O. Kraft
Eingeladene Vorträge (internationale Tagungen) "Modelling of Electromigration-Induced Void Shape Changes"
im Rahmen des internationalen Workshop Micromechanisms in Stressed Conductor Lines and Thin Films, Schloß Ringberg am Tegernsee
27. Juni-1. Juli 1994
"Schädigung von Aluminiumleiterbahnen durch Elektromigration"
im Arbeitskreis der DGM Dünne Schichten in der industriellen Anwendung, Regensburg
3. März 1995
"Observation and Simulation of Electromigration Damage"
im Rahmen des Workshops The Early Resistance Change Technique: A New Tool for Characterization of on Chip Metal Reliability, Diepenbeek, Belgien
30.-31. März 1995
"Electromigration-Induced Voiding Mechanisms in Metallizations"
Third International Workshop on Stress-Induced Phenomena in Metallizations, Stanford, Kalifornien, USA
21.-23. Juni 1995
"Alloying Effects on the Electromigration Behavior in Narrow Al Interconnects"
Materials Science of Contacts and Metallization and Interconnects, 125th TMS Annual Meeting and Exhibition, Anaheim, Kalifornien, USA
4.-8. Februar 1996
"The Role of Mechanical Properties and Microstructure in the Reliability of Advanced Microelectronic Interconnect Systems"
P.R. Besser, O. Kraft, J.E. Sanchez, Tutorial gehalten im Rahmen des Spring Meeting 1997 der Materials Research Society, San Francisco, USA, 1997
"Alloying Effects in Electromigration: Modelling and Experiments"
Fourth International Workshop on Stress-Induced Phenomena in Metallizations, Tokio, Japan
4.-6. Juni 1997
"Thermomechanical Behavior of Continuous and Patterned Al Thin Films"
im Symposium Materials Reliability in Microelectronics VIII im Rahmen des Spring Meeting 1998 der Materials Research Society, San Francisco, USA
1998
"Mechanische Werkstoffprüfung in kleinen Dimensionen"
Übersichtsvortrag im Symposium 13a der Werkstoffwoche 1998, München
12.-15.10.1998
"Mechanische Festigkeit dünner Metallschichten unter monotoner und zyklischer Beanspruchung"
Hauptvortrag in der Frühjahrstagung des Arbeitskreises Festkörperphysik der DPG, Münster
22.-26.03.1999
"X-ray diffraction as a tool to study the mechanical behavior of thin films"
im Symposium Strain in Materials: Analysis, Relaxation & Properties, Spring Meeting der E-MRS, Strasburg, Frankreich
1.-4.6.1999
"Mechanics and Design of Small-Scale Materials and Systems"
Organisatoren: E. Arzt (MPI Stuttgart), O. Kraft (MPI Stuttgart), W.D. Nix (Stanford University, USA) and F. Prinz (Stanford University, USA), auf Schloß Ringberg, Tegernsee
15. bis 18. Juni 1998
"Fifth International Workshop on Stress-Induced Phenomena in Metallization"
Organisatoren: E. Arzt (MPI Stuttgart), P.S. Ho (University of Texas, Austin, USA), O. Kraft (MPI Stuttgart) and H. Okabayashi (NEC, Tsukuba, Japan), Stuttgart, Germany
23. bis 25. Juni 1999
"Thin Films: Stresses and Mechanical Properties VIII"
Symposium im Rahmen des MRS Fall Meetings 1999, Organisatoren: R.P. Vinci (Lehigh Univ., Bethlehem, USA), N. Moody (Sandia National Lab, Albuquerque, USA), P.R. Besser (Advanced Micro Devices, Sunnyvale, USA), O. Kraft (MPI Stuttgart) and E. Shaffer (Dow Chemicals, Midland, USA) Boston, USA
29. Nov.- 3. Dez. 1999
"Dislocations and Deformation Mechanisms in Thin Films and Small Structures"
Symposium im Rahmen des MRS Spring Meetings 2001 San Francisco, USA, Organisatoren: K. Schwarz (IBM, Yorktown Heights, USA), O. Kraft (MPI Stuttgart), S.P. Baker (Cornell Univ., USA), B. Freund (Brown Univ., USA) and R. Hull (Univ. of Virginia, USA)
2001
"Thin Film Plasticity"
bei der EURESCO Konferenz Plasticity of Materials, Acquafredda di Maratea, Italien
16.-21.9.2000
“Fatigue in Thin Metal Films”
at the Sixth International Workshop on Stress-Induced Phenomena in Metallizations, Cornell, USA
23.-25. Juli 2001
“Small-scale Plasticity: Experiments and Modelling”
2001 ASME International Mechanical Engineering Congress, 2001 ASME International Mechanical Engineering Congress, , New York, USA, New York, USA, 11.-16. November 2001
“Size Effects in Materials for MEMS due to Microstructural and Dimensional Constraints”
Materials Science of MEMS Devices at the MRS Fall Meeting 2001, Boston, MA, USA
26.-30. November 2001
MEMS: Materials Issues Workshop, MRS Workshop Series, San Francisco, CA USA
05.-06. April 2002
“How to determine the yield strength of a metal thin film (on a substrate)?”
Gordon Conference on Thin Film Mechanical Behavior, Williams College, MA, USA
14.-19.Juli 2002
“Size Effects on the Mechanical Properties of Materials for MEMS”
M&M Workshop on Evaluation of Micro/Nano-Sized Materials, Yamaguchi University, Ube, Yamaguchi, Japan
14. October 2002
“Mechanical Testing of Thin Films: Experiments and Analysis”
AVS 2002, Denver, USA
04.-09. November 2002
“The influence of Grain Size on the Fatigue Behavior of Thin Polycrystalline Films”
Mechanical Properties Derived from Nanostructuring Materials at the MRS Spring Meeting 2003, San Francisco, CA, USA
21.-25. April 2003
“The effect of grain size and film thickness on cyclic deformation and fatigue in thin films”
European Office of Aerospace Research & Development, Breitnau, 29.07.2003
28.-30. Juli 2003
“Mechanical Testing of Materials in Small Volumes“
ATEM 2003 International Conference on Advanced Technology in Experimental Mechanics, Nagoya, Japan
10.-12. September 2003
“Fatigue in Thin Polycrystalline Films: Experiments and Modelling”
Symposium on Thin Films-Stresses and Mechanical Properties X, MRS Fall Meeting, Boston USA
1.-5. Dezember 2003
"Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics"
Symposium im Rahmen des MRS Spring Meetings 2003 San Francisco, USA, Organisatoren: Jihperng (Jim) Leu (Intel Corp., USA), Andrew McKerrow, (Texas Instruments, USA) O. Kraft (Forschungszentrum Karlsruhe), Takamaro Kikkawa (Hiroshima Univ., Japan)
2003
“Cyclic Deformation and fatigue in thin metal films on substrates”
Symposium on Synchrotron Radiation for Advanced Materials Analysis and Processing, ICMAT 2003, Singapore
2003
Constrain Effects of Film Thickness and Grain Size in Fatigued Metal Thin Films
14th Colloquium on Fundamental Fatigue Mechanics, Dresden 2003
“The Role of Precipitates for the Creep Behavior of Magnesium Die-Cast Alloys”
Symposium on Phase Transformations and Deformation in Magnesium Alloys, TMS 2004 Annual Meeting, Charlotte USA
14.-18. März 2004
Ultra high-cycle fatigue in pure Al thin films
MRS Fall Meeting , Boston, 29.11.-03.12.04
“Cyclic Deformation and Fatigue in Thin Metal Films”
Symposium on Internal Stresses and Thermo-Mechanical Behavior in Multi-Component Materials Systems, TMS 2004 Annual Meeting, Charlotte USA
14.-18. März 2004
“Deformation and fatigue in polycrystalline metallic thin films”
Second Korean-Germany Symposium on Interfaces in Solids, RWTH Aachen,
O. Kraft
22.-23.03.2004
„Fatigue of thin films“
Nanomaterials - Science and Engineering, International Max Planck Research School for Advanced Materials, Stuttgart
27.-29. September 2004
“Electromigration in Thin Film Cu and Al Interconnects“
Int. Workshop on Energy Dissipation at Surfaces, Uni Duisburg-Essen
27.-30.09.2004
“Reliability Issuses in MEMS Related to Cyclic Loading Conditions”
ASME International Mechanical Engineering Congress, Anaheim, CA
14.-19.November 2004
“nanoindenTOR - von Netzen, Latten und Pfosten“
Festkolloquium anlässlich 65. Geb. Prof. Dr. P. Grau, Max-Planck-Institut für Mikrostrukturphysik, Halle, am 10.12.2004
“Fatigue Failure of Metal Thin Films in MEMS”
Symposium on Mechanical Behavior of Thin Films and Small Structures, TMS 2005 Annual Meeting, San Francisco USA
13.-17. Februar 2005
„Crack Nucleation and Propagation During Fatigue of Thin Films”
Int. Conference on Fracture XI
20.-25. März 2005
“Reliability of MEMS: Experiments and Modelling”
Sandia National Lab., Livermore, CA, USA, 21.Feb. 2005
“Zuverlässigkeit in der Mikrosystemtechnik: Experiment und Modellierung”
