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(RRJoESA)
September–December 2016
Research & Reviews
Journal of Embedded
System & Applications
ISSN 2395-6712 (Online)
ISSN 2321-8533 (Print)
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It is my privilege to present the print version of the [Volume 4 Issue 3] of Journal of Research &
Reviews:A Journal of Embedded System & Applications, 2016.The intension of RRJoESA is to
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Applications.
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I hope you will enjoy reading this issue and we welcome your feedback on any aspect of the Journal.
Dr. Archana Mehrotra
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Director's Desk
STM JOURNALS
1. Automatic Farming using Soil Moisture Sensor and PIC Microcontroller Akshay Saini, Saket Kumar, Gautam Chutani 1
2. Performance and Degradation Analysis of Poly-Crystalline PV Modules Installed in Tropical Conditions P. Greeshma, N. Ramchander 5
3. Wireless Charging of Electric VehiclesS.Priya 11
4. A Review on Minimization of Makespan of Flow Shop Scheduling ProblemAnand N. Barai, Manhar S. Kagthara 16
5. A Review on Project Information System for Improving Efficiency of Project Development CycleSagar S. Mehta, Prasad S. Puranik, Satish B. Sharma 22
6. Design and Development of Metallic Isolators for Wedge Lock Mounted Printed Circuit Boards (PCBs)P. Anil Kumar, P. Bangaru Babu 27
ContentsResearch & Reviews: Journal of Embedded System & Applications
RRJoESA (2016) 1-4 © STM Journals 2016. All Rights Reserved Page 1
Research & Reviews: A Journal of Embedded System & Applications ISSN: 2395-6712(online), ISSN: 2321-8533(print)
Volume 4, Issue 3
www.stmjournals.com
Automatic Farming using Soil Moisture Sensor and PIC
Microcontroller
Akshay Saini, Saket Kumar, Gautam Chutani Department of Computer Science Engineering, Dronacharya College of Engineering, Farrukhnagar,
Gurgaon, Haryana, India
Abstract Water must be properly utilized as it is a very precious resource. Agriculture is one of those
areas which consume a lot of water. Irrigation is a time consuming process and must be done
on a timely basis. Our objective is to develop an auto-irrigation system which measures the
moisture of the soil and automatically turns on or off the water supply system. Once installed
this project requires very less human involvement. The circuit is based on PIC microcontroller
and also a soil moisture sensor. Up to 60 percent of water used in irrigation can be saved
using proper configured soil moisture sensor. The designed system can be used in turf grass
or with small garden plants.
Keywords: Auto-irrigation, moisture sensor, water pump, PIC microcontroller
INTRODUCTION The automatic irrigation system of this system
uses soil moisture sensor to detect the moisture
level and 44 keypad for various crops
control. When the moisture content of the soil
is reduced then the sensor sends detected value
to the microcontroller. Then the water pump is
automatically ON according to the moisture
level. The main aim of this paper is to reduce
the human intervention for farmers and use
solar energy for irrigation purpose. The entire
system controlled by the PIC microcontroller.
The proper methodology is to be enforced for
the irrigation system owing to lack of rain and
insufficiency of water in soil. Agricultural
field continuously desires and depends on the
water level of the soil. Planned irrigation
system ought to be followed to avoid the
matter of decrease in wetness level of soil by
continuous extraction of water from soil. And
improper use of water ends up in wastage of
great quantity of water.
For this purpose, automatic plant irrigation
system is meant victimization wetness device
and alternative energy. The planned system
derives power from daylight through photo-
voltaic cells. Hence, the system cannot rely
upon the electricity. During this planned
model by exploitation daylight energy, power
the irrigation pump. The circuit includes of
soil wetness detector square measure inserted
within the soil to sense whether or not the soil
is wet or dry. A PIC microcontroller is
employed to manage the full system. Once the
wetness level of the soil is low then the
detector detects the soil condition and offers
condition to the relay unit connected to the
switch of the motor. It'll ON in dry condition
and throw the motor once the soil is in wet
condition.
The wetness level of the soil is detected by the
detector inserted into the soil which provides
signal to the microcontroller whether or not
the land wants water or not. The signal from
the detector received through the output of the
comparator and it's preceded with instruction
from the program keep within the
microcontroller.
Once the soil is dry motor ON and in wet
condition motor is OFF. This condition of
motor ON and OFF is displayed on a 162
liquid crystal display. A PV cell solar cell may
be a system converts light-weight energy into
electricity. Solar cell is otherwise called “solar
cells”. This is often utilized in straightforward
and complex application. The only system of
RRJoESA (2016) 5-10 © STM Journals 2016. All Rights Reserved Page 5
Research & Reviews: A Journal of Embedded System & Applications ISSN: 2395-6712(online), ISSN: 2321-8533(print)
Volume 4, Issue 3
www.stmjournals.com
Performance and Degradation Analysis of Poly-
Crystalline PV Modules Installed in Tropical
Conditions
P. Greeshma*, N. Ramchander Department of Electrical and Electronics Engineering, B.V. Raju Institute of Technology, Narsapur,
Telangana, India
Abstract In this paper, practical field performance of poly-crystalline solar photovoltaic (PV) modules,
which were installed at rooftop of the department of electrical engineering BVRIT, has been
studied and the correlation between efficiency, temperature and degradation rate of modules
as per STC conditions has been presented. The nominal output power of the PV module
considered for the study is 240 Wp and the panel is compressed of 60 cells in a 10×6 matrix
connected in series. After few operation years under tropical environment, the degradation
rate of electrical characteristics such as I-V and P-V curves, open-circuit voltage (Voc), short-
circuit current (Isc), maximum output current (Imax), maximum output voltage (Vmax), maximum
power output (Pmax) and fill factor (FF) are evaluated at standard test conditions (STC).
Through this study, it has been noticed that the efficiency of solar panel is linearly inversely
proportional to temperature and degradation rate in a linear fashion.
Keywords: Open-circuit voltage, short-circuit current, maximum output voltage, maximum
power output, fill factor, efficiency, degradation rate
INTRODUCTION Practical field study of performances of three
identical monocrystalline solar modules, single
power of 60 W, with different inclinations
(horizontal, optimally inclined oriented toward
South and vertically oriented toward South) in
real meteorological conditions, in Nis, Serbia
are presented. The efficiency, performance
ratio and fill factors are measured and
compared [1].
Two identical BP-SX320 panels with poly-
crystalline silicon cells with nominal output
power of 20 W, and each of the panels is
comprised of 36 cells in a 49 matrix
connected in series. The efficiency of the solar
panel is inversely proportional to temperature
in a linear fashion and the decrease rate of
efficiency per temperature increase is
determined as 0.0024 (%/°C) [2].
The effects of temperature and radiation
intensity on the parameters of a copper indium
diselenide (CIS) photovoltaic module have
been studied. An outdoor experimental setup is
installed to carry out a series of I-V curve
measurements under different irradiance and
temperature conditions for the module [3].
NREL study suggests that a more reasonable
thumb of rule will be degradation less than
0.5% per year. The quality of module is of
immense importance. It is safe to assume no
degradation for the first three years and then a
maximum of 0.5% per year over the life of
modules [4].
In this paper, the performance of a single
polycrystalline PV module is studied under
outdoor (tropical condition) installation. The
performance parameters include the efficiency
and degradation rate of module. Here, the
study period is considered from April 2013 to
June 2015.
By considering open circuit voltage (Voc),
short circuit current (Isc), solar irradiance and
module temperature, the degradation rate of
polycrystalline module is calculated. The
irradiance is measured using the pyranometer.
RRJoESA (2016) 11-15 © STM Journals 2016. All Rights Reserved Page 11
Research & Reviews: A Journal of Embedded System & Applications ISSN: 2395-6712(online), ISSN: 2321-8533(print)
Volume 4, Issue 3
www.stmjournals.com
Wireless Charging of Electric Vehicles
S. Priya* Department of Electrical and Electronics Engineering, Jeppiaar Institute of Technology,
Chennai, Tamil Nadu, India
Abstract The embedded technology plays a vital role in present world of electronics Applications.
Embedded system is a computer system, made from a combination of hardware and software
that is used to perform a specific task. This paper aims to reduce the manpower, less
operating time & more efficient without the use of man power. This paper puts forth the first
step in achieving the desired target. With the advent in technology, the existing systems are
developed to have in built intelligence. Using WPT (Wireless Power Transfer) we can charge
a battery employed in the vehicle up to 12 V, at a distance of 5–10 cm distance between the
transmitter and the receiver. This is a very prospective technology which can soon replace
diesel run vehicles.
Keywords: Electric vehicle, wireless power transfer, microcontroller
*Author for Correspondence E-mail: [email protected]
INTRODUCTION The mere development of the Plug-in electric
vehicle brought about a sudden revolution in
the world of transport. Applying electricity
replacing the diesel power can revolutionize
the transport and energy utilisation. Plugged in
vehicles involve manual interruption and so
replacing it by wireless charging can bring
about a great automation in the field of
transport and recharging vehicles [1]. We use
stationary wireless charging employing
primary side power flow controller using PIC
microcontroller for controlling the
communication part. We employ inductive
coupling for implementing the wireless
charging [2].
In the proposed system, we are using PIC
microcontroller which is interfaced with 2-axis
robot and LCD. Here, we use wireless
transmitter which is used to transfer the supply
from one node to another node as shown in
Figure 1. In the vehicle section, the receiver
module will be present. When the
communication should happen between
transmitter and receiver led will be indicating
the battery charging. These transfer distance
may be 5 to 10 cm, because of coil cost may
high. Also Vehicle control through keys. We
can monitor the status on the LCD [3-4]. It is
shown in Figure 2.
BLOCK DIAGRAM
Fig. 1: Bus STOP Section.
Fig. 2: Vehicle Section.
Power Supply Unit
The supply of 5V DC is given to the system
which is converted from 230V AC supply.
Firstly, the step down transformer will be used
here for converting the 230V AC into 12V
AC. The microcontroller will support only the
DC supply, so the AC supply will be
converted into DC using the bridge rectifier.
The output of the rectifier will have ripples so
we are using the 2200uf capacitor for filtering
those ripples. The output from the filter is
Power
Supply Wireless
Transmitter
Research & Reviews: A Journal of Embedded System & Applications
Volume 4, Issue 3
ISSN: 2395-6712(online), ISSN: 2321-8533(print)
RRJoESA (2016) 11-15 © STM Journals 2016. All Rights Reserved Page 12
RRJoESA (2016) 16-21© STM Journals 2016. All Rights Reserved Page 16
Research & Reviews: A Journal of Embedded System & Applications ISSN: 2395-6712(online), ISSN: 2321-8533(print)
Volume 4, Issue 3
www.stmjournals.com
A Review on Minimization of Makespan of Flow Shop
Scheduling Problem
Anand N. Barai*, Manhar S. Kagthara Department of Mechanical Engineering, Atmiya Institute of Technology and Science,
Rajkot, Gujarat, India
Abstract When in real world, a large number of jobs and machines are taken into consideration, at that
time the proper scheduling plays a vital role. Most of the industries are facing problems
regarding proper scheduling. In this review paper, there are different techniques suggested
for minimization of makespan for flow shop scheduling problem. Makespan is the total length
of the scheduling when all jobs are done. Dispatching rule is better approach to solve the flow
shop scheduling problem.
Keywords: Scheduling, flow shop scheduling, Gantt chart, makespan
INTRODUCTION Nowadays, most of industries are facing
problems related to scheduling. Scheduling is
a term used in our day to day life; although we
may not always have a good definition of the
term in our mind. A schedule is a tangible plan
or document such as bus schedule, production
schedule, class schedule etc. Schedule shows
us a plan for the timing of certain activities
and answers the question, “If all goes well,
when will a particular event take place?” [1].
Scheduling is a decision-making process that
concerns the allocation of limited resources to
a set of tasks with the view of optimizing one
or more objectives (Figure 1). In today’s world
of global competition, effective scheduling has
become vital in order to meet customer
requirements as promptly as possible while
maximizing the profits. Hence, it plays an
important role in most manufacturing and
production system as well as in most
information processing environments [1]. The
purposes of scheduling are to maximize the
efficiency of the operation, minimize the
production time and reduce the costs. Suppose
that, there are “m” number of machines Mj
(j=1, 2, 3…, m) which have to process n jobs
Ji (i=1, 2, 3…, n). A schedule is for each job
an allocation of one or more time interval to
one or more machines. Schedules may be
represented by Gantt chart as shown in
Figure 2. Gantt charts may be machine
oriented or job oriented.
RRJoESA (2016) 22-26 © STM Journals 2016. All Rights Reserved Page 22
Research & Reviews: A Journal of Embedded System & Applications ISSN: 2395-6712(online), ISSN: 2321-8533(print)
Volume 4, Issue 3
www.stmjournals.com
A Review on Project Information System for Improving
Efficiency of Project Development Cycle
Sagar S. Mehta1,*, Prasad S. Puranik
1, Satish B. Sharma
2
1Department of Mechanical Engineering, Atmiya Institute of Technology and Science, Rajkot,
Gujarat, India 2Sci/Engr SD’, Space Application Centre, Indian Space Research Organization, Ahmedabad, Gujarat,
India
Abstract Project information system (PIS) is commonly viewed as a consequential implement for
project management. Project management is characterized as an effort that results from the
utilization of knowledge, skills, tools and techniques applied to set project activities in order
to meet project objectives. Their main purpose is to manage different projects throughout
their life cycle. The system supports, all the application processes for incentive programs as
well as the documentation and procedures required, and avails to manage the project itself
when it is approved. Project information systems (PIS) are software applications that avail
managers to track projects from their conception to their execution. They provide them with
pertinent information and collaborative implements.
Keywords: Project information system, project development life cycle
INTRODUCTION In particular, industries share a common
tendency to issue hard copy documentation for
recording purposes. This makes
communication and coordination even more
complicated and burdensome due to the
necessity of completing whole cycles of
amendments, revisions, confirmations and
acknowledgments (Alshawi and Ingirige,
2003). Attention is therefore shifting towards
the need to manage the flow of activities
throughout the whole life cycle and, in
particular, those that actually add value
(Alshawi and Ingirige, 2003).
In particular, PIS can help practitioners to
detect latent issues before they occur, meet
deadlines, and collaborate more easily and at a
greater extent. A good number of project
managers use PIS, but most of them are yet
unaware of the potential benefits they could
bring in. This is mainly due to a lack of an
understanding of what such software really is
and how it can influence projects from their
conception to their completion (Archibald,
1992). The present work presents an integrated
solution that tries to give answers to most of
the above mentioned issues within inter-
organizational processes or, in other words,
the extended enterprise (Dyer, 2000).
The potential gain in efficiency can lead to
consequential cost savings. In brief, PIS are
proposed to help administrators, managers and
specialists in defining, characterizing and
finishing projects, reverencing deadlines and,
last but not least, collaborating. They also keep
involved people apprised, assuring that they
know what the others are doing at any given
time and allowing appropriate
countermeasures in the case of failures or
delays.
This lets project managers effectively delegate
tasks, monitor progress and assess the overall
risk. Conclusively, they avail managers create
working profiles and work-packages to assign
the right task to the right person by denotes of
an effective resource management.
A salient aspect in this context regards the data
management feature. At present, most firms
use different tools, such as spreadsheets and
paper based data collection, which are
certainly not intended for dealing with the
advancement of complex tasks.
RRJoESA (2016) 27-34 © STM Journals 2016. All Rights Reserved Page 27
Research & Reviews: A Journal of Embedded System & Applications ISSN: 2395-6712(online), ISSN: 2321-8533(print)
Volume 4, Issue 3
www.stmjournals.com
Design and Development of Metallic Isolators for Wedge
Lock Mounted Printed Circuit Boards (PCBs)
P. Anil Kumar1,*, P. Bangaru Babu
2
1Department of Mechanical Engineering, SDAT Division, Directorate of ENTEST, Research Centre
Imarat, Defense Research Development Organization, Hyderabad, Telangana, India 2Department of Mechanical Engineering, National Institute of Technology, Warangal, Telangana,
India
Abstract Wedge lock interfaces are preferred for mounting printed circuit boards (PCBs) in electronic
packages of air borne vehicles. Merits of this particular mounting configuration are high
mounting stiffness, high vibration dissipation and low thermal interface resistance. However,
good amount of vibration dissipation occurs only in the close vicinity of wedge locks provided
integral to PCBs; because of which electronic components can be mounted only near the
wedge locks on PCB. This practical constraint doesn’t allow the electronics designer to aim
for high population density of electronic components over PCB. To overcome this limitation, a
metallic isolator is designed, developed and experimentally evaluated in random vibration
environment. Proposed metallic isolator is configured such that it replaces existing wedge
locks one to one without seeking for additional space. Further, this isolator ensures vibration
levels within limits everywhere on PCB. With this isolator, designer can use almost entire
space on PCB effectively for populating electronic components.
Keywords: Electronic packaging, finite element analysis of chassis, chassis boundary
conditions
INTRODUCTION It is proposed to design a metallic isolator for
electronic package consisting of PCBs
mounted in wedge lock configuration which is
experiencing vibration response higher than
qualification limit as shown in Figure 1.
Fig. 1: Package with PCB Mounted in Wedge
Lock Configuration.
For better understanding, PCB with
components along with wedge lock are shown
in Figure 2. Wedge lock is preferred for
mounting PCBs because it provides more
damping in vibration.
From the measured vibration levels at different
locations on PCB during test, it is observed
that vibration levels are within the allowable
limits (i.e. <30 gm) only, in the vicinity of
wedge locks on PCB due to the damping
provided by wedge locks (Safe). But away
from wedge locks, vibration levels are
observed to be high on PCB (Unsafe).
Hence, very little space only is permitted for
mounting components on a wedge lock
mounted PCB which is not in favour of the
designer. Ideal choice for the designer would
be utilization of entire space on PCB for
mounting components which seeks for some
modification that result into complete safe
zone on PCB.