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RTC 4-Page Media Kit

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4 Page Media Kit for RTC Magazine
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Solve The Puzzle media kit 2009 The guide for decision makers in the embedded, real-time and open systems computer industry The magazine of record for the embedded computing industry
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Page 1: RTC 4-Page Media Kit

Solve The Puzzlemedia kit 2009

The guide for decision makers in the embedded, real-time and open systems computer industry

The magazine of record for the embedded computing industry

Page 2: RTC 4-Page Media Kit

CIRCULATION

EDITORIAL SECTIONStechnology in contextRTC covers cutting-edge technology in real-world applications, including medicine, communications, aerospace, industrial automation, and control. The Technology in Context sections looks at the impact of embedded technology in these major application areas. Our editors strategically select key technologies where the solutions outlined and information provided are highly applicable and transferable.

solutions engineeringRTC focuses on how OEMs can achieve solutions within the standards-based environment. Solutions Engineering covers the impact of standards such as ATCA and IPv6 and issues such as

EMI and SAF specifications for systems that are built and deployed to address real-world situations.

industry insightOur editors compile and consider different approaches to a technology

sector, helping the reader ready their product for market. This includes such issues as updates on industry standards,

advances in semiconductors, development tools, connectors, RTOSs, and networking

infrastructure.

system integrationRTC magazine devotes an entire section each month to the latest developments in real-time operating systems, development, and analysis tools and standards, as well as the latest verification and debug strategies. Our editors are the most experienced in the technical publishing industry on embedded software, and our readers confidently open them for insight and expertise.

products and technologyThe design community turns to RTC magazine for the latest product developments.

EDITORIAL THAT MATTERSRTC reaches critical decision makers and will continue to break new ground as technologies emergeRTC magazine plays the leadership role in the industry. It is the first place engineers turn for in-depth coverage of the latest developments in embedded technology.

READERS’ END USE FUNCTION

CO

MM

UN

ICAT

ION

S12

%

AUTOMATION& CONTROL

26%

MEDICAL12%MILITARY

12%

RETAIL/POS7%

TRANSPORTATION9%

SECURITY15%

OT

HE

R3

%

TES

T & M

EA

SU

RE

ME

NT

6%

0 5 10 15 20 25 30

AREAS OF ENGINEERING DEVELOPMENTCONNECTIVITY30%

14%

14%

10%

25%

22%

16%

SIGNAL PROCESSING

BLADE SERVER PROCESSING

BLADE SERVER SWITCHING

CONTROL FUNCTIONS

POS/RETAIL TERMINAL

SAFETY/PROTECTION

0 5 10 15 20 25 30 35

JOB TITLES

34%

26%

2%

17%

19%

2%

ENGINEERING MANAGER/PROGRAM MANAGER

HARDWARE ENGINEER/DESIGNER

BUSINESS DEVELOPMENT

DESIGN TEAM LEADER

EXECUTIVE MANAGEMENT

OTHER

total circulation 37,000 • 20,000 print circulation in

the usa • 17,000 digital circulation

Worldwide

CIRCULATION THAT COUNTSRTC has mastered the circulation puzzle. Through our regional events, participation with industry exhibitions and continual circulation development, we have created the most focused and unique circulation in the industry.

INFORMATION

RTC’s Readers are the most active participants in the industry: 82% of the magazine’s subscribers have attended an embedded industry conference or exhibition within the last 12 months.

Page 3: RTC 4-Page Media Kit

rate comBinationsRates for COTS Journal, RTC, PKG and Portable Design can be combined to give you the maximum discount. Use the pricing schedule for the total number of pages in all four publications in your annual contract. Discounts may also be applicable if you purchase RTECC shows or take advantage of additional online advertising opportunities; contact your sales representative for more information.

technology in context

solutions engineering

industry insight

system integration

promotional opportunities

January Microcontrollers Bring Big Power to Small Places

Wireless Sensors: Mini-Networks Stretch into the Real World

Interconnect Wars: Sorting Out the Survivors

Machine to Machine: Small Modules Make Big Systems

COM Express Showcase

FPGA Board Showcase

FeBruary COMs vs. SBCs: Trade-offs and Pitfalls

FPGA Board Solutions: Multiple Personalities Trim System Costs

Ruggedization: Making Rugged That Which Was Not

CompactPCI ExpressBonus Distribution: Embedded World

Multicore Board Showcase

marchMulticore Processors: Making Progress on the Promise

10 Gbit Ethernet Aims at 100 Gbit

I/O Subsystems: Standard, Custom, or Modular?

Real Time or Real Time Enough? Match System Requirements to CPU Speed

Bonus Distribution: ECS West

Small Form Factor SIG Showcase

april Small Form Factor Developments and Trends

Fire It Up! The Perils of Powering Up COM-I/O Board Combos

LPC Bus: Why It’s Needed and Where It Fits

Green Engineering: Spreading Intelligence to Save Power

ATCA Showcase

may MicroTCA and 3U cPCI in Control

The Incredible Shrinking Blade Server

USB Stakes Its Claim in the Embedded World

Multicore CPUs Marry Windows with RTOSs

USB Module Showcase

PC/104 Express Showcase

June COM Modules Bring CPUs to More Specialized Apps

Intelligent Power Management with ACPI and More

Managing Small Modules with I2C

Motion Control: Combining Vision with Control

Ethernet Boards Showcase

Industrial Box PC Showcase

JulyLow-Power Processors Deliver High-Power Performance

Data Acquisition with Small Modules

Security for Wireless Networking

Human/Machine Interfaces Large and Small Rugged SBC Showcase

august ATCA: Growing in Telecom and Growing Beyond

PCI Express Enters the Second Generation

Mobile Robotics: Small Boards Behind the Bars

Industrial Networks: Is It IP All the Way? 3U CompactPCI Showcase

septemBer Non-PCs: Challenging x86 in Small Modules?

High Temp in Small Spaces: Thermal Management for Small Form Factors

Small DSP Boards for Sensing and Control

Rails and Boxes: Snap-Together Solutions for Industrial Control

Bonus Distribution: ESC Boston and ATCA Summit San Jose

octoBer Developments in VME Solid-State Drives: Options for Storage and Safety

Rugged Apps: It’s Small, but Can It Take It?

Small Modules Power Medical Devices

Solid-State Drives Showcase

AMC Board Showcase

noVemBer PMC/PrPMC, XMC: New Directions for Mezzanines?

MicroTCA in Communications

High Reliability and Safety-Critical Systems for the Next Generation

Java and Linux Span the Embedded Space

PMC/XMC Board Showcase/Data Acquisition Showcase

decemBer WiFi and GSM: Where They Fit and Where They Can Go

Fault Management and Hot-Swapping on the Small

Standards Update: Update on the Latest Industry Standards

Operating Systemsand Tools for Multicore Development

2-Fer and Editorial Index

2009 EDITORIAL CALENDAR

PRICINGprint adVertising

1X 2X 3X 4X 6X 8X 12X 18X 24X

TWO-PAGE SPREAD $6,772 $6,416 $6,030 $5,672 $5,530 $5,275 $5,165 $4,988 $4,630

FULL PAGE $4,516 $4,278 $4,020 $3,782 $3,686 $3,517 $3,444 $3,326 $3,088

2/3 PAGE $4,194 $3,980 $3,737 $3,500 $3,427 $3,307 $3,202 $3,080 $2,9061/2 PAGE $3,012 $2,857 $2,684 $2,566 $2,463 $2,379 $2,300 $2,212 $2,0861/3 PAGE $2,200 $2,086 $1,960 $1,903 $1,796 $1,760 $1,680 $1,588 $1,5231/4 PAGE $1,666 $1,580 $1,485 $1,428 $1,360 $1,309 $1,273 $1,224 $1,155

Due to unexpected or unusual increases in postage associated with fuel costs, The RTC Group reserves the right to revise rates throughout the year. Check with your sales representative for current rates.

Page 4: RTC 4-Page Media Kit

905 Calle Amanecer, Suite 250, San Clemente, CA 92673 949.226.2000 949.226.2050 fax www.rtcmagazine.com

The Final Piece of the Puzzle: maximize your company branding and technical web presence visit www.rtcmagazine.com for online advertising opportunities.

FULL PAGE8-1/2” X 11-1/8”

2-PAGE SPREAD17” X 11-1/8”

2/3 PAGE7-3/8” X 6-3/8”

1/2 PAGE V3-1/2” X 9-7/8”

1/2 PAGE H7-3/8” X 4-3/4”

1/2 PAGE ISLAND7-3/8” X 4-3/4”

1/4 PAGE H7-3/8” X 2-3/8”

1/3 PAGE V2-1/4” X 9-7/8”

1/3 PAGE H7-3/8” X 3-3/8”

1/3 PAGE SQUARE4-3/4” X 4-3/4”

1/4 PAGE V3-1/2” X 4-3/4”

MATERIAL INSTRUCTIONSAll advertising must be submitted as a high-resolution PDF (PDF/X-1a). Four-color images must be CMYK; minimum resolution 300 dpi; tiff or eps are preferred; line art a minimum of 1200 dpi. Only full-page ads require a bleed of 1/8” (4 mm).

Full-page live area is 1/2” (13 mm) from trim on all sides. For all other ad sizes, all live content should stay 1/4” from the edge of the ad space.

Please submit PDFs via The RTC Group’s FTP site:

http://upload.rtcgroup.com

To submit new product announcements, send e-mail versions of the release to the editors. The more technical the information, the more useful it is to our readers. Each product announcement should include a press release, product datasheet and pricing. Digital files, such as PDF documents and digital graphics, should be sent only through prior arrangements with an editor. Published image resolutions need to be at least 300 dpi.

PRESS RELEASE SUbMISSIONS

Editorial TeamSales Teamtom WilliamsEditor-in-Chief 831.335.1509 [email protected]

Warren andreWsEditorial Director/Associate Publisher 239.992.4357 [email protected]

marina tringaliAd Traffic/Managing Editor 949.226.2020 [email protected]

colin mccracken & paul rosenfeldContributing Editors Small Form Factor Forum Column (SF3) [email protected]

stacy manniKWestern Regional Sales Manager 949.226.2024 (tel) 949.274.6134 (mobile) [email protected]

lauren trudeauWestern Regional Sales Manager 949.226.2014 (tel) 949.554.9742 (mobile) [email protected]

shandi ricciotti Eastern Regional Sales Manager 949.226.2000 (tel) 949.573.7660 (mobile) [email protected]

SPECIFICATIONS

The magazine of record for the embedded computing industry


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