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Ruggedized Camera ModuleP13571 Project Review

May 10, 2013

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lop Project Description

Design and develop a camera system that can capture, package, and transmit image data in a small form factor which may be subjected to adverse conditions.

Mechanicals Electrical Computer

Jose Portugal Stephen Brown Stephen Goss

Cameron Staunch Andy Anthony Peter Hood

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lop Customer Needs

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lop Engineering Specifications

Spec. # Importance Source Specification (metric)Unit of

MeasureMarginal

ValueIdeal Value Comments/Status

EnclosureS1 3 CN1 The enclosure shall be a 1.2" x 1.2" x N package. Length of N is negotiable Inches 1 in3

S2 3 CN2 The enclosure shall be water resistant. Connector and lens excluded. IP64 IP67S3 2 CN2 The enclosure shall be impact resistant. Drop Height 2 ft - 3 ft > 2ftS4 2 CN17 The enclosure shall be oil resistant. UL Oil Res II

S53 The enclosure shall withstand temperatures relevant to the electronics. Co -40 to 85 Beyond

rangemax. temp inside 125 C

S16 2 CN19 Camera needs to have front, back, and side-mount capabilities. Yes/NoConnector

S6 2 The connector shall be type that supports CoaXPress. Yes/NoLens

S17 CN8 The system shall support an M12 lens. Yes/NoS18 3 CN18 The system shall support a C-mount lens. Yes/NoS7 3 CN9 The system shall support an M3F focus module. Yes/No

CableS8 3 CN13 The system shall use coaxial cable. Yes/NoS9 3 CN11 The cable shall be capable of reaching 3-6 meters in length. MetersS10 3 CN12 The cable shall provide power to camera unit. Volts

S111 Implied The cable should be flexible. Bend Radius

(in)2 to 5 IN 2 IN

S122 CN9 The cabling shall be ruggedized.

Crush Resistance

(lb/in)100 lbf/in >175 lbf/in IP64

Image SensorS13 2 CN15 The system shall support the Omnivision OV14810 14MP image sensor. Yes/No

Interface ChipsetS14 3 CN15 The interface shall support speeds of at least 2.1 Gbps. bits/sec 2.1 Gbps

S15 3 CN13 The interface shall be capable of serializing 12-bit parallel data from image sensor.

Yes/No

The system shall be capable of interfacing with MIPI-CSI2 data format of image sensor. Yes/No

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lop Concept Summary

•Heat Dissipation•IP64 weatherproofing•Ruggedized

Mechanical Engineers

•High-Speed Printed Circuit Board Design•System Integration•Physical Layer Implementation

Electrical Engineers

•FPGA Programming•Frame Grabber•CoaXPress Implementation

Computer Engineers

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lop Electrical System Architecture

Image Sensor•Image Data Capture

FPGA•Transceiver Architecture

Power•Power Management

Coax•Data Transmitter

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lop Mechanical System Architecture

Heat Dissipation•Cold Finger•Fins•Aluminum Body

Water Tight Seal•O-ring Seals•Flat Gasket

Ruggedized•Anodized•Gorilla® Glass

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lop Software Architecture

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Pixel Capture

Synthetic Data Working

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lop Transmitter Working

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lop Future Stage 1 Implementation

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lop Electrical Design Summary

System Testing Results • Voltage and Short Checks

• Short on FPGA-to-Power Board connector• Power over CoaXPress• JTAG functionality• Flash programmable• I2C communication with sensor

• I2C clock on input pin• Transceiver signal integrity

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lop Mechanical Design Summary

Testing ResultsAssembly- Material Selection for high temperatures/oil temp.- PCBs and Hardware assemble together without

interference.- Thermal pads compress effectively reducing contact

resistance .- Tolerance Analysis provided an effective connector

engagement.Thermal- Experimental Data was 20% lower than Simulated- Factor of safety of 1.0- Connecting to a stand of any type allows conduction and only increases F.S.Sealing- Distributor provided CAD was not exact, o-rings under compressed (Lens Holder)- O-rings designed to 20 - 40% compression, difficult to assembly- Updated CAD provides up to 15% compression and used measured dimensions from Lens Holder

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lop Software Design Summary

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p Objective Project EvaluationSuccesses Assembly fits together

with no interference Properly sinks heat Imager works Programmed FPGA Transceiver works

Remaining Image display Frame grabber

implementation Verification of transceiver

signal integrity

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lop Opportunities / Suggestions For Future Work

• Finish CoaXPress protocol • Design frame grabber system• Upgrade FPGA to Cyclone V GX• Auto-focus capability using M3F Focus Module• CNC current release of CAD with tighter tolerance

and modified O-ring grooves• Different housing designs (UAV application)• Incorporate video analytics • Include image processing filter on FPGA

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lop Acknowledgments

D3 Engineering (sponsor)• Scott Reardon• Jason Enslin• Jim McGarvey• Alex Sojda• Ben McGee• David Collins

Lightforce Technology• Peter Hammond

Dr. Antonio Mondragon Altera Corporation

• Bill Jenkins• Bob Spurr

Arrow Electronics, Inc.• Gary Fredericks

RIT Machine Shop Personnel