RW1500 - CDME · leads and PCB pads • Independent upper and lower LED lighting adjustments for...

Manncorp1610 Republic Road

Huntingdon Valley, PA 19006215-830-1200

West Coast Office858-490-6266

www.manncorp.com© 2015 Manncorp

SMT/BGA Rework StationRW1500

For service & support, contact: East Coast: 215.830.1200 / West Coast: 858.490.6266 / Email: [email protected] / Web: www.manncorp.com

Intended UseUse of Manncorp equipment in ways other than those described in the documentation supplied with the equipment may result in injury to persons or damage to property. Some examples of unintended use of equipment include:

• Using incompatible materials • Making unauthorized modifications • Removing or bypassing safety guards or interlocks • Using incompatible or damaged parts • Using unapproved auxiliary equipment • Operating equipment in excess of maximum ratings • Operating equipment in an explosive atmosphere

Regulations and ApprovalsMake sure all equipment is rated and approved for the environment in which it is used. Any approvals obtained for Manncorp equipment will be voided if instructions for installation, operation and service are not followed.

Qualified PersonnelEquipment owners are responsible for making sure that Manncorp equipment is installed, operated and serviced by qualified personnel. Qualified personnel are those employees or contractors who are trained to safely perform their assigned tasks. They are familiar with all relevant safety rules and regulations and are physically capable of performing their assigned tasks.

IMPORTANT

RW1500 SMT/BGA Rework Station © 2015 Manncorp Page 1 East Coast: 215.830.1200 / West Coast: 858.490.6266 / Email: [email protected] / Web: www.manncorp.com

Table of Contents1 FEATURES & SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.1 RW1500 SpecificationS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21.2 RW1500 featuReS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2 INSTALLATION AND GENERAL SAFETY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52.1 inStallation RequiRementS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52.2 GeneRal Safety infoRmation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52.3 machine oveRvieW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62.4 machine StaRt-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3 TOUCH SCREEN OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .103.1 Set up mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

3.1.1 Set Up Mode Main Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113.1.2 Profile Check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .123.1.3 Temperature Setting Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

3.2 opeRation mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .163.2.1 Temperature Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .173.2.2 Selecting Programs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

4 BASIC OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .194.1 deSoldeR function. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194.2 place function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .204.3 SoldeR function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

5 TEMPERATURE SETTING RECOMMENDATIONS . . . . . . . . . . . . . . . . . . . . . . . . . .225.1 leaded SoldeRinG/deSoldeRinG pRoceSSeS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

5.1.1 IC/BGA size: 41*41 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .225.1.2 IC/BGA size: 38*38 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .225.1.3 IC/BGA size: 31*31 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22

5.2 lead-fRee SoldeRinG/deSoldeRinG pRoceSSeS . . . . . . . . . . . . . . . . . . . . . . . . . . . .235.2.1 IC/BGA size: 41*41 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .235.2.2 IC/BGA size: 38*38 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .235.2.3 IC/BGA size: 31*31 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23


1 Features & Specifications

1.1 RW1500 SpecificationsPCB Specifications

PCB Size (Minimum) 15 mm x 20 mm (0.6" x 0.79")

PCB Size (Maximum) 470 mm x 550 mm (18.5" x 21.6")

PCB Thickness 0.8 mm - 3 mm (0.032" to 0.12")

Component Specifications

Component Size (Minimum) 2 mm x 2 mm (0.08" x 0.08")

Component Size (Maximum) 80 mm x 80 mm (3.15" x 3.15")

Minimum BGA Ball/QFP Lead Pitch 0.3 mm (0.012")

Placement Accuracy ±0.01 mm (0.0004")

Heating System

Component Heater (Top Side) Hot Air (800 W)

Component Heater (Bottom Side) Hot Air (800 W)

Under-Heater Rapid IR (5000 W)

Temperature Control K-Type Thermocouple; Closed Loop PID

Temperature Accuracy Within ±3˚

Utility/Facility RequirementsMain Power Source 220 V ± 10%/ Single Phase, 50/60 Hz

Total Power Consumption 6.6 KW Max.

Machine Dimensions 760 mm L x 850 mm W x 950 mm H (30” L x 33.5” W x 37.4” H)

Compressed Air 90 psi (~5 cfm)


1.2 RW1500 FeaturesIndependent Heaters (Top, Bottom, Rapid IR Underheaters)• The air supply for the top and bottom heaters is from an external pressurized air or nitrogen

supply. The air and nitrogen sources can be switched instantly via a selection in the RW1500 software.

• The top and bottom ceramic honeycomb heaters feature an integrated design with high-efficiency heat conduction.

• The Rapid IR Underheater prevents board warpage and reduces stress on components and solder joints adjacent to the rework site. It also reduces overall cycle times and maximum temperature exposure and consists of 5 separate zones that, based on PCB size, can be switched on or off to conserve power.

• Heaters feature high-precision K-type thermocouple and closed-loop, self-tuning PID temperature control with ± 3 C accuracy.

• Thermal profiles divisible into as many as seven segments for both top and bottom heating with programmable heating rate, target temperature, dwell time, and cooling. On board storage of up to 50 programs.

• Four integrated thermocouple inputs for real-time temperature recording, profile analysis, and fine-tuning

High-Definition, Split-Vision Optics• 1.3 million pixel, split-vision CCD camera with 230x, push-button zoom and focus• 15” 1080p LCD display with HDMI input for simultaneous, superimposed viewing of component

leads and PCB pads• Independent upper and lower LED lighting adjustments for component and PCB• High-precision, drift-free camera calibration translates to a positional/placement accuracy of

±0.01 mm between component alignment position (pickup head raised in Z-axis) and component placement position (pickup head lowered in Z-axis).

• Joystick-controlled camera X-Y motion for convenient viewing of component leads to pads. X-Y control allows zooming and panning of different parts of the device and board and one-touch “Reset” button returns camera to home position.

Easy Operation Through Functional Design• Convenient LCD touch screen controller and user interface that, when not being used, slides into

the system’s base for safe storage• Password protected user privileges that separate operator and administrative/programming

functions• High-precision, leadscrew-driven Z-axis motion controlled by Panasonic servo drive• Versatile board holding system accommodates virtually any surface mount or mixed technology

PCB assembly up to 550 mm x 470 mm (21.6” x 18.5”). • Moveable X-Y gantry for heater and camera assemblies allows easy positioning above

component without having to adjust PCB holder. Locks securely when position is attained. Integrated top and bottom heater assemblies allow simultaneous positioning in seconds with the aid of a built-in laser pointer.


• Screen printing functions via USB port for job/lot traceability• Full range of heater nozzles available to solder/desolder components from 2 mm x 2 mm to 80

mm x 80 mm (0.08” x 0.08” to 3.15” x 3.15”)

Superior Safety Functions• CE certification, emergency stop switch, and built n safeguards to automatically cut power, in the

event of abnormal conditions, to protect both operator and equipment• End of cycle alarms for soldering and desoldering functions• Double over-temperature protection• Password protected user privileges to prevent arbitrary changes by untrained or unauthorized

personnel


2 Installation and General Safety

2.1 Installation RequirementsTo ensure operator safety and prevent possible damage, the rework station must be installed in compliance with the following conditions:• Keep machine away from flammable, explosive, or corrosive gas or liquid.• Avoid moist locations—humidity should be below 90%.• Ambient temperature should be between 60˚F and 104˚F (15˚C and 40˚C).• Machine should be kept out of direct sunlight and out of the direct airflow path from air

conditioners, heaters, or fans.• Area should be free of dust, fibers, and metal particles.• Installation surface must be flat, vibration-free, and able to support the machine’s weight.• The installation surface should be at least 36” x 36” (900 x 900 mm) with a relative level height of

29.5” to 33.5” (750 to 850 mm)• Leave at least 1 foot (30 cm) between the back of the machine and the wall or other obstructions

to allow for proper heat dissipation.• Do not place heavy objects on top of the machine.• Make sure that any pre-wiring and connection of the equipment is performed by a qualified electrician.• Prepare a properly grounded, 220V, single-phase power supply. The total power consumption is

6800W. • Switch off power after use. If the machine will not be used for a long period of time, disable the power.

2.2 General Safety InformationThe RW1500 rework station uses 220V AC power and can achieve operating temperatures as high as 400˚C. To prevent operator injury or equipment damage, please abide by the following when operating the unit:• Do not allow fans or other air currents to be aimed directly at the equipment as they may distort

the temperature control systems and cause overheating.• Keep all flammable gases and liquids far away from the machine due to risk of fire or explosion.• To avoid burns, do not touch heater nozzles, the board holder, or other machine components

in high temperature areas of the machine either during or shortly after soldering or desoldering operations. Use heat insulated gloves if necessary.

• PCBs and components will still be warm when the rework process is completed; use necessary protective measures when handling the board or components.

• Do not touch the touch screen surface with metal or sharp objects.• Do not block the top and bottom hot air nozzles as it will cause overheating and damage to the

heaters and temperature control systems.• After use, allow the unit to cool for at least 5 minutes before switching the machine off.

RW1500 SMT/BGA Rework Station © 2015 Manncorp Page 6East Coast: 215.830.1200 / West Coast: 858.490.6266 / Email: [email protected] / Web: www.manncorp.com

• If liquid or foreign materials spill into the machine during operation, power the machine off immediately. Unplug the machine from power and let the machine cool completely. Once the machine has reached room temperature, clean up the spill or remove the debris. Make sure the machine is completely dry before reconnecting power.

2.3 Machine Overview

08 E-Stop

01 Pickup Tray

31 Touch Screen

12 USB Port

11 Lighting

09 Start

02 LCD Display

03 PCB Holder 05 Y Axis Micrometer

06 Component Lighting

07 PCB/Pad Lighting

26 N2 Input

24 Thermocouples25 Pressure Regulator

28 Bottom Nozzle Pressure

27 Top Nozzle Pressure

16 Cooling Fan

10 MainPower


18 Bottom Heater

13 Top Heater/Placement Head

29 Top Nozzle Flowmeter

14 Positioning Handle

15 Vacuum Nozzle

19 Joystick

21 Focus-

20 Focus+

23 Zoom In

22 Zoom Out30 Bottom Nozzle Flowmeter

17 IR Preheaters

04 X Axis Micrometer

32 Process Camera

No. Name Function

01 Pickup Tray Pickup components from this location prior to alignment and placement

02 LCD Display Provides simultaneous, superimposed views of component leads and PCB pads

03 PCB Holder Supports the PCB during rework operations

04 X-Axis Micrometer Adjusts the position of the PCB (pads) in the X-axis.

05 Y- Axis Micrometer Adjusts the position of the PCB (pads) in the Y-axis.

06 Component Lighting Component lighting, brightness adjustment

07 PCB/Pad Lighting PCB/Pad lighting, brightness adjustment

08 E-Stop Emergency stop button; cuts power to heaters, motors, displays

32 Theta Axis Adjust CW/CCW

RW1500 SMT/BGA Rework Station © 2015 Manncorp Page 8East Coast: 215.830.1200 / West Coast: 858.490.6266 / Email: [email protected] / Web: www.manncorp.com

09 Start Must be depressed to start running the machine

10 Main power Main power on/off switch

11 Lighting Turns utility lighting on/off

12 USB Port Use to connect flash drive for data import/export

13 Top Heater/Placement Head

Housing containing top heater assembly and vacuum pickup/placement head

14 Positioning Handle Used to move the top heater/placement head into position in the X- and Y- axes over the component; locking/unlocking mechanism built-in

15 Vacuum Nozzle Used to pick up and place the component (heater nozzle not shown)

16 Cooling Fan Blows cool air across the PCB after soldering

17 IR Preheaters Preheats entire PCB to prevent warpage and reduce cycle times; 4 switches activate/deactivate heater zones

18 Bottom Heater Applies bottom heating when soldering/desoldering components

19 Joystick Moves CCD camera for viewing of component and leads

20 Focus+ Adjusts the display focus (increases focal length)

21 Focus- Adjusts the display focus (decreases focal length)

22 Zoom out Zoom out to view larger area of the component package

23 Zoom in Zoom in to see more detail of pads and leads

24 Thermocouple Inputs Connect up to four external thermocouple probes and measure the actual temperature at different locations on the board or component; view recorded temperature profiles on the LCD touchscreen

25 Pressure Regulator For connection of clean, dry air supply (approx. 90 psi, 70-140 L/M)

26 N2 Input For connection of high-purity N2 supply (approx. 90 psi, 70-140 L/M)

27 Top Nozzle Air/N2 Pressure

Regulator and gauge used to control top nozzle air or nitrogen supply pressure

28 Bottom nozzle Air/N2 Pressure

Regulator and gauge used to control bottom nozzle air or nitrogen supply pressure

29 Top Nozzle Air/N2 flowmeter

Controls flow rate of air or nitrogen through top nozzle

30 Bottom Nozzle Air/N2 flowmeter

Controls flow rate of air or nitrogen through bottom nozzle

31 Touch Screen LCD touchscreen control panel

32 Theta Axis Adjust CW/CCW

Rotates the component clockwise or counter clockwise

33 Process Camera (optional)

Used to project magnified view of rework site on LCD display


2.4 Machine Start-Up1. Turn on the main power switch on the left side of the machine.

2. Make sure the Emergency Stop button is in its raised position.

3. Open the drawer on the front of the unit to access the touchscreen.

4. The joystick is used to move the camera when aligning the component. It is used in conjunction with the zoom and focus buttons to view different parts of the component and to obtain close-up views of leads and pads. On the top of the joystick, there is a reset button that will return the camera to its home position.


3 Touch Screen OperationWhen the RW1500 is first powered on, the Startup screen will display.

The RW1500 has two modes: Operation and Set Up.

Operation Program files can be selected and the machine can be run, but program parameters cannot be changed or edited.

Set Up Program parameters can be set/changed.

3.1 Set Up ModeTo enter Set Up mode, touch the Set Up button, then input the default password: 8888 on the virtual keypad that appears.


3.1.1 Set Up Mode Main ScreenUpon entering the Set Up mode, the Set Up Mode Main Screen is displayed.

Back Press to return back to the startup screen.Start Press to automatically begin operation according to the selected

working mode (either “Solder,” “Place,” or “Desolder”).Stop Press to stop and return to the origin.Hold Press to keep heating at current temperature.Alignment Position Displays the Z-axis position of the pickup head (relative to the home

position) at which the head picks up the component from the pickup tray for alignment.

Mounting Position Displays the Z-axis position of the pickup head (relative to the home position) at which the component is placed on the pads on the PCB.

Profile check Press to enter the screen “Profile Check”. Please see the details in Section 3.1.2 “ Profile check”.

Temp. Setting Press to enter the screen for temperature parameters setting. Please see the details in Section 5 “Temp. Setting”.

Control Press to enter “Control Setting”. Please see the details in section 6 “Control Setting”.

Air (N2): Displays which gas source (Air or N2) has been selected. Pressing this button switches the source.

“T”: Displays the name of the current program.Solder (Place, Desolder): Displays the chosen working mode; either “Solder,” “Place,” or

“Desolder.” Please see the details in Section 7 “Working Modes Introduction”.


Height Displays the current Z-axis position of the pickup head (relative to home position).

Top Temperature Displays the real-time temperature measured by the thermocouple for the top heater. Also displayed in red on the graph.

Bottom Temperature Displays the real-time temperature measured by the thermocouple for the bottom heater. Also displayed in yellow on the graph.

IR Temperature Displays the real-time temperature profile measured by the thermocouple for the IR preheater. Also displayed in green on the graph.

Top Setting Displays the set temperature of the top heater.Bottom Setting Displays the set temperature of the bottom heater.Run Time Time elapsed from the start of the process. Time accrues until either

the process completes or the operator presses Stop.Save to USB When a USB device is attached to the connector on the front of the

touchscreen drawer, pressing this button will allow a screenshot to be saved to the attached device.

3.1.2 Profile CheckTo obtain the best soldering quality and to prevent damage to the PCB or components, you can use thermocouples to measure temperatures at various locations around the rework site. The RW1500 can read temperatures from up to four thermocouples connected to the inputs on the front control panel. The data from the thermocouple inputs can be viewed and analyzed using the Profile Check screen.To access the Profile Check screen, press the Profile Check button on the Main Screen.


To view profile data points, simply touch the screen at the desired location and the data from the selected time and temperature coordinates will be displayed in the temperature indicator fields described belowTop Displays the temperature measured by the thermocouple for the top heater

(displayed in red on the graph) at the selected time.Bottom Displays the temperature measured by the thermocouple for the bottom

heater (displayed in yellow on the graph) at the selected time.TC1 Displays the temperature measured by the thermocouple connected to

thermocouple input #1 (displayed in green on the graph) at the selected time.TC2 Displays the temperature measured by the thermocouple connected to

thermocouple input #2 (displayed in light-blue on the graph) at the selected time.TC3 Displays the temperature measured by the thermocouple connected to

thermocouple input #3 (displayed in purple on the graph) at the selected time.TC4 Displays the temperature measured by the thermocouple connected to

thermocouple input #4 (displayed in orange on the graph) at the selected time.Preheat 1 The temperatures (in °C) entered in the two dark blue boxes to the right of

“Preheat1” define the range within which the thermocouple temperatures will be timed. For example, if 150°C to 180°C is entered, the colored “Time” boxes to the right will display the length of time (in seconds) that the temperature (at the thermocouple of the corresponding color) was within that temperature range. Note: This function can also be used to measure soak temperatures or any other important temperature range.

Soldering The temperatures (in °C) entered in the two dark blue boxes to the right of “Soldering” define the range within which the thermocouple temperatures will be timed. For example, if 220°C to 230°C is entered, the colored “Time” boxes to the right will display the length of time (in seconds) that the temperature (at the thermocouple of the corresponding color) was within that temperature range. Note: This function can also be used to measure time above liquidus, maximum component temperature or any other important temperature range.

(Preheat) Time Displays the time duration (in seconds) that the temperature (at the thermocouple of the corresponding color; either TC1, TC2, TC3, or TC4) was within the specified temperature range.

(Soldering) Time Displays the time duration (in seconds) that the temperature (at the thermocouple of the corresponding color; either TC1, TC2, TC3, or TC4) was within the specified temperature range.

Air (N2): Displays the gas source (Air or N2) that is being used. Save to USB When a USB device is attached to the connector on the front of the

touchscreen drawer, pressing this button will allow a screenshot to be saved to the attached device.

Excel When a USB device is attached to the connector on the front of the touchscreen drawer, pressing this button will allow the data to be saved in .csv format that will allow importing into Excel or other spreadsheet software.

Back Press to return back to the Main Screen.


3.1.3 Temperature Setting ScreenPressing the “Temp. Setting” button on the Main Screen will cause the Temperature Setting screen to be displayed as shown below.

Temperature settings for the top and bottom hot air heaters and the IR underheater are entered in this screen. Each set of temperature settings for different rework operations can be divided into as many as six different segments. Each segment is assigned a column of the table and at the top of each column, these are labeled: Preheat1, Preheat2, Soak, Soldering1, Soldering2, and Cooling. The various data entry fields, controls, and displays of the Temperature Setting screen are described below:Top Temp. The top heater’s set temperature during each segment of the program.Top Time Once the set temperature for the top heater is reached in a segment, this is

the duration that temperature will be held.Top Rate The rate at which the temperature of the top heater increases to reach the

set temperature for each segment. 3˚C/sec is recommended.Bottom Temp. The bottom heater’s set temperature during each segment of the program.Bottom Time Once the set temperature for the bottom heater is reached in a segment, this

is the duration the bottom heater will be held at that temperature.Bottom Rate The rate at which the temperature of the bottom heater increases to reach

the set temperature for each segment. 3˚C/sec is recommended.IR Temp. The set temperature for the IR preheater during each segment of the

program.Alignment Position The set height, relative to the home position, at which the head goes to pick

up the component from the pickup tray for alignment.


Mounting Position The set height, relative to the home position, at which the head places the component on the PCB pads.

BGA X Size The component width. By entering this value, the RW1500 knows the offset from the home position to the center of the component package in the X-axis.

BGA Y Size The component length. By entering this value, the RW1500 knows the offset from the home position to the center of the component package in the Y-axis.

Prog. No. The RW1500 holds up to 50 programs (sets of temperature settings) in its internal memory. This number represents the position number that the program occupies.

Name Shows the name of the current program.Save Clicking this button saves the current program and any changes that have

been made to internal memory.+ Pressing this button causes the temperature settings for the next program in

memory to be displayed.Select The temperature settings for the displayed program, will not be loaded for

use until this button is pressed. When a program is selected, its Program Name will appear in the yellow field on the Main Screen.

- Pressing this button causes the temperature settings for the previous program in memory to be displayed.

Motion On/Off Activates or deactivates head up/down motion. High/Low The “High” speed and “Low” speed up and down controls are used to

program the Alignment Position and the Mounting Position.Height Displays the current height of the head relative to the home position.Back Returns you to the main Set Up screen.

Setting or Changing ParametersTo set or change parameters (temperature, time, rate, etc.), press the blue box for the desired parameter. The virtual keyboard will appear on the screen. Type the value you want and press OK to input the data.Note 1: The total run time for each program is determined by the sum of the durations for the top heater and supersede the durations of the bottom and IR heaters. Even if the duration of the bottom and IR heaters is longer than the top heater, the process cycle will end when the total run time of the top heater has elapsed. Note 2: Section ? of this manual includes recommended leaded and lead-free soldering and desoldering parameter settings for some sample component sizes. Please note that these are for reference only and are only to be used as a starting point for developing custom programs suited to your own applications. The use of thermocouples to test the actual temperatures of the PCB and components (using test samples) is always recommended. Warning: Manncorp is not responsible for damage to PCBs and components resulting from the use of these temperature settings!


3.2 Operation ModeTo enter Operation Mode, touch the Operation button on the Startup Screen. The Operation Mode Main Screen will be displayed. No password input is required for Operation Mode.

The Operation Mode Main Screen is almost identical to the Set Up Mode Main Screen except that the “Temp. Setting” button changes to “Temp. Parameter” and a “Select Prog.” button appears below the “Hold” button on the right side of the screen. The Temperature Parameter and Select Program screens are described in the sections that follow. All other functions in the Operation Mode Main Screen are the same as those described in Section 3.1 for the Set Up Mode Main Screen. Note: In Operation Mode, the user can view, select, and load programs for use, but cannot change temperature settings.


3.2.1 Temperature Parameters

To access the Temperature Parameters screen, press the “Temp. Parameter” button on the Operation Mode Main Screen. The Temperature Parameters screen will be displayed as shown below.

The Temperature Parameters screen displays the program number, name, and the parameter settings for each of the heaters and each segment of the currently loaded program. It also displays the alignment position, mounting position, and size of the component. It is almost identical to the Temperature Setting screen, but does not allow the settings to be changed. The ability to view the parameters is useful to ensure the proper program has been selected and loaded. Pressing the “Back” button returns the operator to the Operation Mode Main Screen.


3.2.2 Selecting Programs

When the “Select Prog.” button is pressed, a screen showing a listing of all the saved program files is displayed as shown below. Each Program Name has an associated number.

The “PgDn” and “PgUp” buttons can be used to scroll through the list of programs. To load a program, simply press the number of the desired program and it will be loaded for use. Press the “Back” button to exit the program selection function and go back to the Operation Mode Main Screen. The name of the selected (and now loaded) program will appear in the yellow field on the Main Screen.


4 Basic Operation

4.1 Desolder Function

To desolder a component:1. Place the PCB securely in the board holder.2. Using the zone switches on the right side of the IR underheater, make sure the zones that will

provide adequate heating to the underside of the PCB are active. 3. Make sure the vacuum pickup nozzle installed is of a size that will provide adequate vacuum to

lift the component when it has been desoldered.4. Install the desired hot air nozzle onto the magnetic collar on the bottom of the upper heater

assembly.5. Grasp the handle on the left side of the upper heater assembly. When grasping the handle,

notice that a pressure switch built into the handle will both unlock the entire heater assembly and will switch on the laser pointer.

6. While still grasping the handle and using the laser pointer as a guide, position the upper heater assembly over the center of the component to be desoldered. Make sure the pointer is aimed as close to the precise center of the device as possible.

7. Release the handle to lock the position of the heater assembly. The bottom heater is automatically positioned below the component underneath the board.

8. Make sure the proper program containing the proper time and temperature settings has been loaded.

9. Press the function button (Solder/Place/Desolder) on the Main Screen until “Desolder” is visible. 10. Make sure the camera is in the home position. If it is not, press “Stop” on the Main Screen so

that it goes to the home position. 11. Click “Start” on the Main Screen to desolder the component. The machine will automatically

lower the upper heater to the proper position above the component and the desoldering process will begin. At the end of the cycle, the component will automatically be lifted from the PCB and placed in the pickup tray


4.2 Place Function

The Place Function is used to automatically pick up a component from the pickup tray, subsequently pause to allow the operator to align the component leads to the pads on the PCB, and then resume to automatically place and solder the component on the PCB. To align, place, and solder a component using the Place Function:

1. Make sure the PCB is held securely in the board holder and that the component pads have been properly cleaned and prepared for placement and soldering of the component.

2. Using the zone switches on the right side of the IR underheater, make sure the zones that will provide adequate heating to the underside of the PCB are active.

3. Make sure the vacuum pickup nozzle installed is of a size that will provide adequate vacuum to lift the component from the pickup tray, hold it while it is being aligned, and then continue holding it until it is placed on the PCB.

4. Install the desired hot air nozzle onto the magnetic collar on the bottom of the upper heater assembly.

5. Grasp the handle on the left side of the upper heater assembly. When grasping the handle, notice that a pressure switch built into the handle will both unlock the entire heater assembly and will switch on the laser pointer.

6. While still grasping the handle and using the laser pointer as a guide, position the upper heater assembly over the center of the rework site on the PCB. Make sure the pointer is aimed as close to the center of the component footprint as possible.

7. Release the handle to lock the position of the heater assembly. The bottom heater is automatically positioned below the rework site underneath the board.


9. Press the function button (Solder/Place/Desolder) on the Main Screen until “Place” is visible. 10. Press “Start” on the Main Screen so that the camera and pickup tray move out to the pickup

position. 11. Place the component in the proper orientation into the guides on the pickup tray.12. Press the Set/Reset button on the joystick to pick up the component from the pickup tray. After

the component is picked up, the tray will retract to its starting position and the component will be positioned over the alignment camera.

13. Adjust the top and bottom lighting as necessary to obtain the best view of the component leads and the pads on the PCB.

14. Use the X- and Y-axis micrometers on the PCB holder and the theta-axis controls on the control panel to align the component leads to the pads on the PCB. Use the joystick to move the camera, and the zoom and focus adjustments on the control panel, to examine the four corners of the component and the PCB footprint to ensure precise alignment.

15. When satisfied with the alignment of the component, press the Set/Reset button on the joystick. The camera will retract to its starting position, the upper heater assembly will lower the component and place it on the PCB, and the soldering process will begin. When soldering is complete, the alarm will sound and the upper heater assembly will return to its home position.


4.3 Solder Function

The Solder Function is used when you wish to selectively solder a component that has already been placed on the PCB. To Solder a component:

1. Place the PCB securely in the board holder.2. Using the zone switches on the right side of the IR underheater, make sure the zones that will

provide adequate heating to the underside of the PCB are active. 3. Install the desired hot air nozzle onto the magnetic collar on the bottom of the upper heater

assembly.4. Grasp the handle on the left side of the upper heater assembly. When grasping the handle,

notice that a pressure switch built into the handle will both unlock the entire heater assembly and will switch on the laser pointer.

5. While still grasping the handle and using the laser pointer as a guide, position the upper heater assembly over the center of the component to be soldered. Make sure the pointer is aimed as close to the precise center of the device as possible.

6. Release the handle to lock the position of the heater assembly. The bottom heater is automatically positioned below the component underneath the board.


8. Press the function button (Solder/Place/Desolder) on the Main Screen until “Solder” is visible. 9. Make sure the camera is in the home position. If it is not, press “Stop” on the Main Screen so

that it goes to the home position. 10. Click “Start” on the Main Screen to Solder the component. The machine will automatically lower

the upper heater to the proper position above the component and the soldering process will begin. When soldering is complete, the alarm will sound and the upper heater assembly will return to its home position.


5 Temperature Setting RecommendationsNote: This section includes recommended leaded and lead-free soldering and desoldering parameter settings for some sample component sizes. Please note that these are for reference only and are only to be used as a starting point for developing custom programs suited to your own applications. The use of thermocouples to test the actual temperatures of the PCB and components (using test samples) is always recommended. Warning: Manncorp is not responsible for damage to PCBs and components resulting from the use of these temperature settings!

5.1 Leaded Soldering/Desoldering Processes

5.1.1 IC/BGA size: 41*41

Preheat 1 Preheat 2 Soak Soldering 1 Soldering 2 CoolingTop Temp. 160 185 210 235 240 225 Time 30 30 35 40 20 15Bottom Temp. 160 185 210 235 240 225Time 30 30 35 40 20 15Top/Bottom Rate 3.0 3.0 3.0 3.0 3.0 3.0IR 180

5.1.2 IC/BGA size: 38*38

Preheat 1 Preheat 2 Heating Welding 1 Welding 2 CoolingTop Temp. 160 185 210 225 235 215Time 30 30 35 40 20 15Bottom Temp. 160 185 210 225 235 215Time 30 30 35 40 20 15Top/Bottom Rate 3.0 3.0 3.0 3.0 3.0 3.0IR 185

5.1.3 IC/BGA size: 31*31

Preheating Insulation Heating Welding 1 Welding 2 CoolingTop Temp. 160 180 200 215 225 215Time 30 30 35 40 20 15Bottom Temp. 160 180 200 215 225 215Time 30 30 35 40 20 15Top/Bottom Rate 3.0 3.0 3.0 3.0 3.0 3.0IR 180


5.2 Lead-Free Soldering/Desoldering Processes

5.2.1 IC/BGA size: 41*41

Preheat 1 Preheat 2 Soak Soldering 1 Soldering 2 CoolingTop Temp. 165 190 225 245 255 240Time 30 30 35 55 25 15Bottom Temp. 165 190 225 245 255 240Time 30 30 35 55 25 15Top/Bottom Rate 3.0 3.0 3.0 3.0 3.0 3.0IR 210

5.2.2 IC/BGA size: 38*38


5.2.3 IC/BGA size: 31*31


Date post:	24-Jun-2020
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