Microsoft PowerPoint - S03_03_Wegleitner.pptDaniel Fresquez, Eddie McClanahan and Al Wegleitner Texas Instruments, Dallas, TX
June 11th 2006
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Background
Phase 4 automotive factory was experiencing significant bond pad damage yield loss issues between testers and devices Phase 5 to ramping ~ 150 systems migrating to automotive 3 insertion test methodology Customer requirements were limiting BPD to 50%
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Problem Statement
Factory was experiencing significant yield loss issues between testers and devices during 3 insertion probing sequence at different temps BPD fails were causing significant yield loss at final inspection Traditional probing solutions were ineffective
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Objective
Show the effects of 125C at probe Review the potential sources of bond pad damage at 125C Review design/hardware procedures needed to manage high temp probing Share key learning's – the journey
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Bond Pad Surface
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0.00%0.00%0.20%0.60%4.10%5.30%0.00%0.00%0.20%0.70%4.10%5.30%
VLCLT: Dual
VLCLT: Dual (30C)Titan Pkg
0.00%0.30%1.00%1.30%7.30%1.00%0.00%0.10%1.00%0.80%7.30%1.00%
VLCLT: Dual
% No
%
Fusion: Dual
%
%
21.20 %
AVI Yield LossNet Yield LossTest Logpoints
Device
0.00%0.00%0.20%0.60%4.10%5.30%0.00%0.00%0.20%0.70%4.10%5.30%
VLCLT: Dual
VLCLT: Dual (30C)Titan Pkg
0.00%0.30%1.00%1.30%7.30%1.00%0.00%0.10%1.00%0.80%7.30%1.00%
VLCLT: Dual
% No
%
Fusion: Dual
%
%
21.20 %
AVI Yield LossNet Yield LossTest Logpoints
Device
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SensArray Integrated Wafer
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SensArray Integrated Wafer
Enabled 17 sensors Set sample rate at 1/sec after a 3 min delay Started the data collection sequence Loaded the wafer on the chuck for approx. 7 min
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Thermocouple Setup & Location
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ºC
60
50
40
30
20
Position 0 Position 45 Position 90 Position 135 Position 180 Position 225 Position 270 Position 315
30 Minute
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ºC
60
50
40
30
20
Position 0 Position 45 Position 90 Position 135 Position 180 Position 225 Position 270 Position 315
30 Minute Soak
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ºC
60
50
40
30
20
Position 0 Position 45 Position 90 Position 135 Position 180 Position 225 Position 270 Position 315
Beginning of wafer
Wafer Start Chuck
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ºC
60
50
40
30
20
Position 0 Position 45 Position 90 Position 135 Position 180 Position 225 Position 270 Position 315
TKB 197 Thermal Profile Standard Steel VLCT Ring
Middle of wafer
Wafer Middle Chuck
180
90
0
270
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ºC
60
50
40
30
20
Position 0 Position 45 Position 90 Position 135 Position 180 Position 225 Position 270 Position 315
TKB 197 Thermal Profile Standard Steel VLCT Ring
90
0
180
End of wafer
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ºC
85
70
55
40
25
Position 0 Position 45 Position 90 Position 135 Position 180 Position 225 Position 270
Position 315
TKB 195 Thermal Profile Standard VLCT Ring with Ceramic Pan
Center of Wafer Position 90 & 270 Temperature Track
~14 deg max delta from the left to right side of Pan during probe.
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-80
-60
-40
-20
0
20
40
60
80
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
410 (no pockets U F3000) A lum ina R ASP 8" (U F3000) N atvie B lue R ing (U F3000) A lum ina (Pockets 8" U F200) A lum ina (Pockets 12" U F200)
A ll test were ran w ith C E 8" U PP8M eg probe card except for A lum ina 12" U F200 where a non-h igh tem p leveling card was used.
T est ran w ith no h igh tem p soak .
5 m inute im age d isp lay cool down.
N ote: B lue R ing has an 8" pan. A ll o thers were w ith an 12" pan.
Interface Movements
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Auto-Z Movement @ 125
-160
-140
-120
-100
-80
-60
-40
-20
0
20
40
60
80
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
5 Minute Interval
ro ns A2 (1) RASP 8"
410 (no pockets) Natvie Blue Ring 303 SS Alumina RASP 8" A2 HT 2 Piece
= 5 minute cool down
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TKB 195 Thermal Profile Standard VLCT Ring with Ceramic Pan
Thermocouple Setup & Location
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ºC
85
70
55
40
25
Position 0 Position 45 Position 90 Position 135 Position 180 Position 225 Position 270
Position 315
30 Minute
TKB 195 Thermal Profile Standard VLCT Ring with Ceramic Pan
Wafer 50% Complete
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min:s -2:30 2:30 5:00 7:30 10:00 15:00 20:00 25:00 30:00 35:00
ºC
85
70
55
40
25
Position 0 Position 45 Position 90 Position 135 Position 180 Position 225 Position 270
Position 315
TKB 195 Thermal Profile Standard VLCT Ring with Ceramic Pan
(13.5) deg drop in 3 minutes Chuck under alignment bridge.
75.06 Deg
67.18 Deg
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ºC
85
70
55
40
25
Position 0 Position 45 Position 90 Position 135 Position 180 Position 225 Position 270
Position 315
TKB 195 Thermal Profile Standard VLCT Ring with Ceramic Pan
180
90270
(~145 Seconds)
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ºC
85
70
55
40
25
Position 0 Position 45 Position 90 Position 135 Position 180 Position 225 Position 270
Position 315
TKB 195 Thermal Profile Standard VLCT Ring with Ceramic Pan
Middle of wafer
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ºC
85
70
55
40
25
Position 0 Position 45 Position 90 Position 135 Position 180 Position 225 Position 270
Position 315
TKB 195 Thermal Profile Standard VLCT Ring with Ceramic Pan
Position 0
Position 180
Chuck Position
(40) deg delta from the top to bottom of Pan at wafer end.
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TKB 196 Sensor Positions
Pan Position 90Position 270
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Part# HK5556R97.4L36B
120 VAC, Max 3 Amps
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ºC
70
58
45
33
20
of VLCT pan to 65C.
Controller goes into an on/off mode about 2-3 deg below set temp until stable
Temperature stabilizing at 2’25”
Controller turned off.
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ºC
90.0 85.0 80.0 75.0 70.0 65.0 60.0 55.0 50.0 45.0 40.0 35.0 30.0 25.0 20.0
Pan 0 Pan 90 Pan 180 Pan 270 Ring 0 Ring 90
Ring 180 Ring 270
Complete Wafer Probe
System Still Stabilizing
Final 2/3rds Of Wafer
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ºC
90.0 85.0 80.0 75.0 70.0 65.0 60.0 55.0 50.0 45.0 40.0 35.0 30.0 25.0 20.0
Pan 0 Pan 90 Pan 180 Pan 270 Ring 0 Ring 90
Ring 180 Ring 270
Complete Wafer Probe
Pan Temperature Still
Begin
Wafer
Test
End
Wafer
Test
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ºC
90.0 85.0 80.0 75.0 70.0 65.0 60.0 55.0 50.0 45.0 40.0 35.0 30.0 25.0 20.0
Pan 0 Pan 90 Pan 180 Pan 270 Ring 0 Ring 90
Ring 180 Ring 270
Complete Wafer Probe
Max output for this setup.
Cleaning Cycle Executed
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Utility to view results.
This tester aligned 10 times on the edge of the pads. A PE redid the setup and verified that there was a problem. EE corrected the problem based on PE input and data. (Focal X beam position had values corrected).
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Camera Calibration
Needles were landing on the edge of the pad on initial setup.
Marks after initial setup
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Q1Q2
Q3
Q4
Center
Intra-group Rule 1: If PMI passes for a site, then the PMI for the
group passes; Else inspect the next site within the group
Rule 2: If PMI fails for all sites within the group, then PMI for the group fails.
Center Group Rule 3: If all dies in the group in the Center fail (ie.
rule 2), then the Probe-PMI fails immediately. If Center passes, then inspect the next 2 opposing quadrants.
Group-to-Group Rule 4: If two opposite Quadrants fail, then Probe-
PMI fails immediately. Rule 5: If any 2 of the 4 Quadrants fail, then Probe-
PMI fails; For Probe-PMI to pass, only 1 quadrant must fail.site
pass
fail
linked
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PMI Forces Stop
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Automated Outgoing Inspection
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Thermal Controls Used
Requires dedicated high temp setups Requires minimum of two calibration tables for the prober Requires 30 minute pre-soak 15 minute realignment needed Contact soak needed if > 5 minute interruption Forced operator inspection points
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Conclusion Thermal instability is a major contributor to BP damage and mis-alignment related issues Managing thermal losses requires multiple approaches Customers are driving to <35% total area BP damage Vertical probe solutions can mitigate the thermal budget and BP damage problem
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Acknowledgements Steve Martinez Maverick Brown Iguichi Eddie McClanahan Daniel Fresquez John Wolfe Mike Harris
Steve Austin Kelly Daughtry Sid Gibson Frank Mesa Brett Brackett Robert Davis Kevin Carlisle PE Techs
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