SAM DA1 Datasheet• Flexible end-point configuration and management with dedicated DMA channels •...

SAM DA1 32-bit ARM-Based Microcontrollers

Introduction

The SAM DA1 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®-M0+ processor,and ranging from 32- to 64-pins with up to 64KB Flash, 8KB of SRAM and up to 2KB Read-While-Write(RWW) Flash section. The SAM DA1 operate at a maximum frequency of 48MHz and reach 2.46CoreMark®/MHz. They are designed for simple and intuitive migration with identical peripheral modules,hex compatible code, identical linear address map and pin compatible migration paths between alldevices in the product series. All devices include intelligent and flexible peripherals, Event System forinter-peripheral signaling, and support for capacitive touch button, slider and wheel user interfaces.

Features

• Processor– ARM Cortex-M0+ CPU running at up to 48MHz

• Single-cycle hardware multiplier• Micro Trace Buffer (MTB)

• Memories– 16/32/64KB in-system self-programmable Flash– 0.5/1/2KB Read-While-Write (RWW) Flash section– 4/4/8KB SRAM memory

• System– Power-on reset (POR) and brown-out detection (BOD)– Internal and external clock options with 48MHz Digital Frequency Locked Loop (DFLL48M)

and 48MHz to 96MHz Fractional Digital Phase Locked Loop (FDPLL96M)– External Interrupt Controller (EIC)– 16 external interrupts– One non-maskable interrupt– Two-pin Serial Wire Debug (SWD) programming, test and debugging interface

• Low Power– Idle and standby sleep modes– SleepWalking peripherals

• Peripherals– 12-channel Direct Memory Access Controller (DMAC)– 12-channel Event System– Up to five 16-bit Timer/Counters (TC), configurable as either:

• One 16-bit TC with two compare/capture channels• One 8-bit TC with two compare/capture channels• One 32-bit TC with two compare/capture channels, by using two TCs

© 2017 Microchip Technology Inc. Datasheet Complete 40001895A-page 1

– Three 24-bit Timer/Counters for Control (TCC), with extended functions:• Up to four compare channels with optional complementary output• Generation of synchronized pulse width modulation (PWM) pattern across port pins• Deterministic fault protection, fast decay and configurable dead-time between

complementary output• Dithering that increase resolution with up to 5 bit and reduce quantization error

– 32-bit Real Time Counter (RTC) with clock/calendar function– Watchdog Timer (WDT)– CRC-32 generator– One full-speed (12Mbps) Universal Serial Bus (USB) 2.0 interface controller

• Device 2.0 and reduced-host low speed and full speed• Flexible end-point configuration and management with dedicated DMA channels• On-chip transceivers including pull-ups and serial resistors• Crystal-less operation in device mode

– Up to six Serial Communication Interfaces (SERCOM), each configurable to operate as either:• USART with full-duplex and single-wire half-duplex configuration• I2C up to 3.4MHz• SPI

– One two-channel Inter-IC Sound (I2S) interface– One 12-bit, 350ksps Analog-to-Digital Converter (ADC) with up to 20 channels

• Differential and single-ended input• 1/2x to 16x programmable gain stage• Automatic offset and gain error compensation• Oversampling and decimation in hardware to support 13-, 14-, 15- or 16-bit resolution

– 10-bit, 350ksps Digital-to-Analog Converter (DAC)– Two Analog Comparators (AC) with window compare function– Peripheral Touch Controller (PTC)

• 256-Channel capacitive touch and proximity sensing• I/O

– Up to 52 programmable I/O pins• Packages

– 64-pin TQFP– 48-pin TQFP, QFN– 32-pin TQFP, QFN

• Operating Voltage– 2.7V - 3.63V

• Temperature range– -40°C to +105°C

SAM DA1


Table of Contents

Introduction......................................................................................................................1

Features.......................................................................................................................... 1

1. Description...............................................................................................................11

2. Configuration Summary...........................................................................................12

3. Ordering Information................................................................................................143.1. Device Variant A.........................................................................................................................143.2. Device Variant B.........................................................................................................................153.3. Device Identification................................................................................................................... 17

4. Block Diagram......................................................................................................... 18

5. Pinout...................................................................................................................... 205.1. SAM DA1J - TQFP64.................................................................................................................205.2. SAM DA1G - QFN48 / TQFP48................................................................................................. 215.3. SAM DA1E - QFN32 / TQFP32..................................................................................................22

6. Signal Descriptions List........................................................................................... 23

7. I/O Multiplexing and Considerations........................................................................257.1. Multiplexed Signals.................................................................................................................... 257.2. Other Functions..........................................................................................................................27

8. Power Supply and Start-Up Considerations............................................................ 308.1. Power Domain Overview............................................................................................................308.2. Power Supply Considerations.................................................................................................... 308.3. Power-Up................................................................................................................................... 328.4. Power-On Reset and Brown-Out Detector.................................................................................32

9. Product Mapping..................................................................................................... 34

10. Automotive Quality Grade....................................................................................... 35

11. Data Retention.........................................................................................................36

12. Memories.................................................................................................................3712.1. Embedded Memories................................................................................................................. 3712.2. Physical Memory Map................................................................................................................3712.3. NVM Calibration and Auxiliary Space........................................................................................ 38

13. Processor And Architecture.....................................................................................4113.1. Cortex M0+ Processor............................................................................................................... 4113.2. Nested Vector Interrupt Controller..............................................................................................4213.3. Micro Trace Buffer......................................................................................................................44


13.4. High-Speed Bus System............................................................................................................ 4513.5. AHB-APB Bridge........................................................................................................................ 4713.6. PAC - Peripheral Access Controller........................................................................................... 48

14. Peripherals Configuration Summary........................................................................60

15. DSU - Device Service Unit...................................................................................... 6215.1. Overview.................................................................................................................................... 6215.2. Features..................................................................................................................................... 6215.3. Block Diagram............................................................................................................................6315.4. Signal Description...................................................................................................................... 6315.5. Product Dependencies...............................................................................................................6315.6. Debug Operation........................................................................................................................6415.7. Chip Erase..................................................................................................................................6615.8. Programming..............................................................................................................................6615.9. Intellectual Property Protection.................................................................................................. 6715.10. Device Identification...................................................................................................................6815.11. Functional Description................................................................................................................6915.12. Register Summary..................................................................................................................... 7515.13. Register Description...................................................................................................................77

16. Clock System...........................................................................................................9916.1. Clock Distribution....................................................................................................................... 9916.2. Synchronous and Asynchronous Clocks..................................................................................10016.3. Register Synchronization......................................................................................................... 10016.4. Enabling a Peripheral...............................................................................................................10516.5. Disabling a Peripheral.............................................................................................................. 10516.6. On-demand, Clock Requests................................................................................................... 10516.7. Power Consumption vs. Speed................................................................................................10616.8. Clocks after Reset....................................................................................................................106

17. GCLK - Generic Clock Controller.......................................................................... 10717.1. Overview.................................................................................................................................. 10717.2. Features................................................................................................................................... 10717.3. Block Diagram..........................................................................................................................10717.4. Signal Description.................................................................................................................... 10817.5. Product Dependencies.............................................................................................................10817.6. Functional Description..............................................................................................................10917.7. Register Summary....................................................................................................................11417.8. Register Description................................................................................................................. 115

18. PM – Power Manager............................................................................................12618.1. Overview.................................................................................................................................. 12618.2. Features................................................................................................................................... 12618.3. Block Diagram..........................................................................................................................12718.4. Signal Description.................................................................................................................... 12718.5. Product Dependencies.............................................................................................................12718.6. Functional Description..............................................................................................................12918.7. Register Summary....................................................................................................................136

SAM DA1


18.8. Register Description.................................................................................................................136

19. SYSCTRL – System Controller............................................................................. 15019.1. Overview.................................................................................................................................. 15019.2. Features................................................................................................................................... 15019.3. Block Diagram..........................................................................................................................15219.4. Signal Description.................................................................................................................... 15219.5. Product Dependencies.............................................................................................................15219.6. Functional Description..............................................................................................................15419.7. Register Summary....................................................................................................................17019.8. Register Description.................................................................................................................172

20. WDT – Watchdog Timer........................................................................................ 20720.1. Overview.................................................................................................................................. 20720.2. Features................................................................................................................................... 20720.3. Block Diagram..........................................................................................................................20820.4. Signal Description.................................................................................................................... 20820.5. Product Dependencies.............................................................................................................20820.6. Functional Description..............................................................................................................20920.7. Register Summary....................................................................................................................21420.8. Register Description.................................................................................................................214

21. RTC – Real-Time Counter.....................................................................................22021.1. Overview.................................................................................................................................. 22021.2. Features................................................................................................................................... 22021.3. Block Diagram..........................................................................................................................22121.4. Signal Description.................................................................................................................... 22121.5. Product Dependencies.............................................................................................................22121.6. Functional Description..............................................................................................................22321.7. Register Summary....................................................................................................................22821.8. Register Description.................................................................................................................231

22. DMAC – Direct Memory Access Controller........................................................... 25522.1. Overview.................................................................................................................................. 25522.2. Features................................................................................................................................... 25522.3. Block Diagram..........................................................................................................................25722.4. Signal Description.................................................................................................................... 25722.5. Product Dependencies.............................................................................................................25722.6. Functional Description..............................................................................................................25822.7. Register Summary....................................................................................................................27822.8. Register Description.................................................................................................................27922.9. Register Summary - SRAM......................................................................................................30422.10. Register Description - SRAM................................................................................................... 304

23. EIC – External Interrupt Controller.........................................................................31123.1. Overview...................................................................................................................................31123.2. Features................................................................................................................................... 31123.3. Block Diagram.......................................................................................................................... 31123.4. Signal Description.................................................................................................................... 312

SAM DA1


23.5. Product Dependencies.............................................................................................................31223.6. Functional Description..............................................................................................................31323.7. Register Summary....................................................................................................................31723.8. Register Description.................................................................................................................318

24. NVMCTRL – Non-Volatile Memory Controller....................................................... 32724.1. Overview.................................................................................................................................. 32724.2. Features................................................................................................................................... 32724.3. Block Diagram..........................................................................................................................32724.4. Signal Description.................................................................................................................... 32824.5. Product Dependencies.............................................................................................................32824.6. Functional Description..............................................................................................................32924.7. Register Summary....................................................................................................................33624.8. Register Description.................................................................................................................336

25. PORT - I/O Pin Controller......................................................................................34625.1. Overview.................................................................................................................................. 34625.2. Features................................................................................................................................... 34625.3. Block Diagram..........................................................................................................................34725.4. Signal Description.................................................................................................................... 34725.5. Product Dependencies.............................................................................................................34725.6. Functional Description..............................................................................................................34925.7. Register Summary....................................................................................................................35425.8. Register Description.................................................................................................................356

26. EVSYS – Event System........................................................................................ 37226.1. Overview.................................................................................................................................. 37226.2. Features................................................................................................................................... 37226.3. Block Diagram..........................................................................................................................37226.4. Signal Description.................................................................................................................... 37326.5. Product Dependencies.............................................................................................................37326.6. Functional Description..............................................................................................................37426.7. Register Summary....................................................................................................................37926.8. Register Description.................................................................................................................379

27. SERCOM – Serial Communication Interface.........................................................39127.1. Overview.................................................................................................................................. 39127.2. Features................................................................................................................................... 39127.3. Block Diagram..........................................................................................................................39227.4. Signal Description.................................................................................................................... 39227.5. Product Dependencies.............................................................................................................39227.6. Functional Description..............................................................................................................394

28. SERCOM USART – SERCOM Universal Synchronous and Asynchronous Receiverand Transmitter......................................................................................................40028.1. Overview.................................................................................................................................. 40028.2. USART Features...................................................................................................................... 40028.3. Block Diagram..........................................................................................................................401

SAM DA1


28.4. Signal Description.................................................................................................................... 40128.5. Product Dependencies.............................................................................................................40128.6. Functional Description..............................................................................................................40328.7. Register Summary....................................................................................................................41528.8. Register Description.................................................................................................................415

29. SERCOM SPI – SERCOM Serial Peripheral Interface..........................................43229.1. Overview.................................................................................................................................. 43229.2. Features................................................................................................................................... 43229.3. Block Diagram..........................................................................................................................43329.4. Signal Description.................................................................................................................... 43329.5. Product Dependencies.............................................................................................................43329.6. Functional Description..............................................................................................................43529.7. Register Summary....................................................................................................................44429.8. Register Description.................................................................................................................445

30. SERCOM I2C – SERCOM Inter-Integrated Circuit................................................ 45830.1. Overview.................................................................................................................................. 45830.2. Features................................................................................................................................... 45830.3. Block Diagram..........................................................................................................................45930.4. Signal Description.................................................................................................................... 45930.5. Product Dependencies.............................................................................................................45930.6. Functional Description..............................................................................................................46130.7. Register Summary - I2C Slave.................................................................................................47930.8. Register Description - I2C Slave...............................................................................................47930.9. Register Summary - I2C Master...............................................................................................49330.10. Register Description - I2C Master............................................................................................ 494

31. I2S - Inter-IC Sound Controller..............................................................................51031.1. Overview.................................................................................................................................. 51031.2. Features................................................................................................................................... 51031.3. Block Diagram.......................................................................................................................... 51131.4. Signal Description.................................................................................................................... 51231.5. Product Dependencies.............................................................................................................51231.6. Functional Description..............................................................................................................51431.7. I2S Application Examples......................................................................................................... 52531.8. Register Summary....................................................................................................................52831.9. Register Description.................................................................................................................529

32. TC – Timer/Counter...............................................................................................54232.1. Overview.................................................................................................................................. 54232.2. Features................................................................................................................................... 54232.3. Block Diagram..........................................................................................................................54332.4. Signal Description.................................................................................................................... 54332.5. Product Dependencies.............................................................................................................54432.6. Functional Description..............................................................................................................54532.7. Register Summary....................................................................................................................55732.8. Register Description.................................................................................................................559

SAM DA1


33. TCC – Timer/Counter for Control Applications...................................................... 57533.1. Overview.................................................................................................................................. 57533.2. Features................................................................................................................................... 57533.3. Block Diagram..........................................................................................................................57633.4. Signal Description.................................................................................................................... 57633.5. Product Dependencies.............................................................................................................57733.6. Functional Description..............................................................................................................57833.7. Register Summary....................................................................................................................61133.8. Register Description.................................................................................................................613

34. USB – Universal Serial Bus...................................................................................65034.1. Overview.................................................................................................................................. 65034.2. Features................................................................................................................................... 65034.3. USB Block Diagram..................................................................................................................65134.4. Signal Description.................................................................................................................... 65134.5. Product Dependencies.............................................................................................................65134.6. Functional Description..............................................................................................................65334.7. Register Summary....................................................................................................................67134.8. Register Description.................................................................................................................675

35. ADC – Analog-to-Digital Converter........................................................................72735.1. Overview.................................................................................................................................. 72735.2. Features................................................................................................................................... 72735.3. Block Diagram..........................................................................................................................72835.4. Signal Description.................................................................................................................... 72835.5. Product Dependencies.............................................................................................................72935.6. Functional Description..............................................................................................................73035.7. Register Summary....................................................................................................................73935.8. Register Description.................................................................................................................740

36. AC – Analog Comparators.....................................................................................75736.1. Overview.................................................................................................................................. 75736.2. Features................................................................................................................................... 75736.3. Block Diagram..........................................................................................................................75836.4. Signal Description.................................................................................................................... 75836.5. Product Dependencies.............................................................................................................75836.6. Functional Description..............................................................................................................76036.7. Register Summary....................................................................................................................77036.8. Register Description.................................................................................................................770

37. DAC – Digital-to-Analog Converter........................................................................78137.1. Overview.................................................................................................................................. 78137.2. Features................................................................................................................................... 78137.3. Block Diagram..........................................................................................................................78137.4. Signal Description.................................................................................................................... 78137.5. Product Dependencies.............................................................................................................78137.6. Functional Description..............................................................................................................78337.7. Register Summary....................................................................................................................787

SAM DA1


37.8. Register Description.................................................................................................................787

38. PTC - Peripheral Touch Controller.........................................................................79538.1. Overview.................................................................................................................................. 79538.2. Features................................................................................................................................... 79538.3. Block Diagram..........................................................................................................................79638.4. Signal Description.................................................................................................................... 79638.5. Product Dependencies.............................................................................................................79638.6. Functional Description..............................................................................................................798

39. Electrical Characteristics....................................................................................... 80039.1. Disclaimer.................................................................................................................................80039.2. Absolute Maximum Ratings......................................................................................................80039.3. Supply Characteristics..............................................................................................................80039.4. Maximum Clock Frequencies...................................................................................................80139.5. Power Consumption.................................................................................................................80339.6. Peripheral Power Consumption................................................................................................80539.7. I/O Pin Characteristics..............................................................................................................80839.8. Injection Current.......................................................................................................................81239.9. Analog Characteristics............................................................................................................. 81339.10. NVM Characteristics................................................................................................................ 82239.11. Oscillators Characteristics........................................................................................................82239.12. PTC Typical Characteristics.....................................................................................................83139.13. USB Characteristics.................................................................................................................83339.14. Timing Characteristics..............................................................................................................834

40. Packaging Information...........................................................................................84140.1. Thermal Considerations........................................................................................................... 84140.2. Package Drawings................................................................................................................... 84240.3. Soldering Profile.......................................................................................................................848

41. Schematic Checklist.............................................................................................. 84941.1. Introduction...............................................................................................................................84941.2. Power Supply........................................................................................................................... 84941.3. External Analog Reference Connections................................................................................. 85041.4. External Reset Circuit...............................................................................................................85141.5. Clocks and Crystal Oscillators..................................................................................................85241.6. Unused or Unconnected Pins...................................................................................................85641.7. Programming and Debug Ports................................................................................................85641.8. USB Interface...........................................................................................................................859

42. Errata.....................................................................................................................86142.1. Die Revision E..........................................................................................................................86142.2. Die Revision F..........................................................................................................................866

43. Conventions...........................................................................................................87043.1. Numerical Notation...................................................................................................................87043.2. Memory Size and Type.............................................................................................................87043.3. Frequency and Time.................................................................................................................870

SAM DA1


43.4. Registers and Bits.................................................................................................................... 871

44. Acronyms and Abbreviations.................................................................................872

45. Datasheet Revision History................................................................................... 87545.1. Revision B - 03/2017................................................................................................................87545.2. Revision A - 04/2016................................................................................................................876

The Microchip Web Site.............................................................................................. 877

Customer Change Notification Service........................................................................877

Customer Support....................................................................................................... 877

Product Identification System......................................................................................878

Microchip Devices Code Protection Feature............................................................... 878

Legal Notice.................................................................................................................879

Trademarks................................................................................................................. 879

Quality Management System Certified by DNV...........................................................880

Worldwide Sales and Service......................................................................................881

SAM DA1


1. DescriptionThe SAM DA1 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®-M0+ processor,and ranging from 32- to 64-pins with up to 64KB Flash, 8KB of SRAM and up to 2KB Read-While-Write(RWW) Flash section. The SAM DA1 operate at a maximum frequency of 48MHz and reach 2.46CoreMark/MHz. They are designed for simple and intuitive migration with identical peripheral modules,hex compatible code, identical linear address map and pin compatible migration paths between alldevices in the product series. All devices include intelligent and flexible peripherals, Event System forinter-peripheral signaling, and support for capacitive touch button, slider and wheel user interfaces.

The SAM DA1 provide the following features: In-system programmable Flash, 12-channel direct memoryaccess (DMA) controller, 12-channel Event System, programmable interrupt controller, up to 52programmable I/O pins, 32-bit real-time clock and calendar, up to five 16-bit Timer/Counters (TC) andthree 24-bit Timer/Counters for Control (TCC), where each TC can be configured to perform frequencyand waveform generation, accurate program execution timing or input capture with time and frequencymeasurement of digital signals. The TCs can operate in 8- or 16-bit mode, selected TCs can be cascadedto form a 32-bit TC, and three timer/counters have extended functions optimized for motor, lighting andother control applications. The series provide one full-speed USB 2.0 embedded host and deviceinterface; up to six Serial Communication Modules (SERCOM) that each can be configured to act as anUSART, UART, SPI, I2C up to 3.4MHz, SMBus, PMBus, and LIN slave; two-channel I2S interface; up totwenty-channel 350ksps 12-bit ADC with programmable gain and optional oversampling and decimationsupporting up to 16-bit resolution, one 10-bit 350ksps DAC, two analog comparators with window mode,Peripheral Touch Controller supporting up to 256 buttons, sliders, wheels and proximity sensing;programmable Watchdog Timer, brown-out detector and power-on reset and two-pin Serial Wire Debug(SWD) program and debug interface.

All devices have accurate and low-power external and internal oscillators. All oscillators can be used as asource for the system clock. Different clock domains can be independently configured to run at differentfrequencies, enabling power saving by running each peripheral at its optimal clock frequency, and thusmaintaining a high CPU frequency while reducing power consumption.

The SAM DA1 have two software-selectable sleep modes, idle and standby. In idle mode the CPU isstopped while all other functions can be kept running. In standby all clocks and functions are stoppedexpect those selected to continue running. The device supports SleepWalking. This feature allows theperipheral to wake up from sleep based on predefined conditions, and thus allows the CPU to wake uponly when needed, e.g. when a threshold is crossed or a result is ready. The Event System supportssynchronous and asynchronous events, allowing peripherals to receive, react to and send events even instandby mode.

The Flash program memory can be reprogrammed in-system through the SWD interface. The sameinterface can be used for non-intrusive on-chip debug of application code. A boot loader running in thedevice can use any communication interface to download and upgrade the application program in theFlash memory.

The SAM DA1 microcontrollers are supported with a full suite of program and system development tools,including C compilers, macro assemblers, program debugger/simulators, programmers and evaluationkits.

SAM DA1


2. Configuration SummarySAM DA1J SAM DA1G SAM DA1E

Pins 64 48 32

General Purpose I/O-pins(GPIOs)

52 38 26

Flash 64/32/16KB 64/32/16KB 64/32/16KB

RWW Flash section 2KB/1KB/512B 2KB/1KB/512B 2KB/1KB/512B

SRAM 8/4/4KB 8/4/4KB 8/4/4KB

Timer Counter (TC)instances

5 3 3

Waveform output channelsper TC instance

2 2 2

Timer Counter for Control(TCC) instances

3 3 3

Waveform output channelsper TCC

8/4/2 8/4/2 6/4/2

DMA channels 12 12 12

USB interface 1 1 1

Serial CommunicationInterface (SERCOM)instances

6 6 4

Inter-IC Sound (I2S)interface

1 1 1

Analog-to-Digital Converter(ADC) channels

20 14 10

Analog Comparators (AC) 2 2 2

Digital-to-Analog Converter(DAC) channels

1 1 1

Real-Time Counter (RTC) Yes Yes Yes

RTC alarms 1 1 1

RTC compare values One 32-bit value or

two 16-bit values

One 32-bit value or

two 16-bit values

One 32-bit value or

two 16-bit values

External Interrupt lines 16 16 16

Peripheral Touch Controller(PTC) X and Y lines

16x16 12x10 10x6

Maximum CPU frequency 48MHz

SAM DA1


SAM DA1J SAM DA1G SAM DA1E

Packages TQFP QFN

TQFP

QFN

TQFP

Oscillators 32.768kHz crystal oscillator (XOSC32K)

0.4-32MHz crystal oscillator (XOSC)

32.768kHz internal oscillator (OSC32K)

32KHz ultra-low-power internal oscillator (OSCULP32K)

8MHz high-accuracy internal oscillator (OSC8M)

48MHz Digital Frequency Locked Loop (DFLL48M)

96MHz Fractional Digital Phased Locked Loop (FDPLL96M)

Event System channels 12 12 12

SW Debug Interface Yes Yes Yes

Watchdog Timer (WDT) Yes Yes Yes

SAM DA1


3. Ordering Information SAM D A1 E 14 A - A B T

Product FamilySAM D = Baseline Cortex-M0+ MCU

A1 = Automotive basic feature set + DMA,

E = 32 PinsG = 48 PinsJ = 64 Pins

T = Tape and Reel

B = -40OC - 105OC Matte Sn Plating (only DA1)

A = TQFPM = QFN Wettable Flanks

Adv Timers, USB, I2S, PTC

Product Series

Flash Memory Density

Device VariantA = Silicon revision E (Initial revision)B = Silicon revision F

Pin Count

Package Carrier

Package Grade

16 = 64KB15 = 32KB 14 = 16KB

Package Type

3.1 Device Variant A

3.1.1 SAM DA1E

OrderingCode

Flash(Bytes)

SRAM(Bytes)

Package Carrier Type Temp.Grade PTC, USB,I2S

ATSAMDA1E14A-ABT(1)

16K 4K TQFP32 Tape andReel

-40°C to+105°C

Yes

ATSAMDA1E14A-MBT(1)

16K 4K QFN32 Tape andReel

-40°C to+105°C

Yes

ATSAMDA1E15A-ABT(1)


-40°C to+105°C

Yes

ATSAMDA1E15A-MBT(1)


-40°C to+105°C

Yes

ATSAMDA1E16A-ABT(1)


-40°C to+105°C

Yes

ATSAMDA1E16A-MBT(1)


-40°C to+105°C

Yes

1. Contact your local sales representative for availability.

SAM DA1


3.1.2 SAM DA1G

OrderingCode

Flash(Bytes)

SRAM(Bytes)


ATSAMDA1G14A-ABT(1)


-40°C to+105°C

Yes

ATSAMDA1G14A-MBT(1)


-40°C to+105°C

Yes

ATSAMDA1G15A-ABT(1)


-40°C to+105°C

Yes

ATSAMDA1G15A-MBT(1)


-40°C to+105°C

Yes

ATSAMDA1G16A-ABT(1)


-40°C to+105°C

Yes

ATSAMDA1G16A-MBT(1)


-40°C to+105°C

Yes


3.1.3 SAM DA1J

OrderingCode

Flash(Bytes)

SRAM(Bytes)


ATSAMDA1J14A-ABT(1)


-40°C to+105°C

Yes

ATSAMDA1J15A-ABT(1)


-40°C to+105°C

Yes

ATSAMDA1J16A-ABT(1)


-40°C to+105°C

Yes


3.2 Device Variant B

3.2.1 SAM DA1E

OrderingCode

Flash(Bytes)

SRAM(Bytes)


ATSAMDA1E14B-ABT(1)


-40°C to+105°C

Yes

ATSAMDA1E14B-MBT(1)


-40°C to+105°C

Yes

ATSAMDA1E15B-ABT(1)


-40°C to+105°C

Yes

SAM DA1


OrderingCode

Flash(Bytes)

SRAM(Bytes)


ATSAMDA1E15B-MBT(1)


-40°C to+105°C

Yes

ATSAMDA1E16B-ABT(1)


-40°C to+105°C

Yes

ATSAMDA1E16B-MBT(1)


-40°C to+105°C

Yes


3.2.2 SAM DA1G

OrderingCode

Flash(Bytes)

SRAM(Bytes)


ATSAMDA1G14B-ABT(1)


-40°C to+105°C

Yes

ATSAMDA1G14B-MBT(1)


-40°C to+105°C

Yes

ATSAMDA1G15B-ABT(1)


-40°C to+105°C

Yes

ATSAMDA1G15B-MBT(1)


-40°C to+105°C

Yes

ATSAMDA1G16B-ABT(1)


-40°C to+105°C

Yes

ATSAMDA1G16B-MBT(1)


-40°C to+105°C

Yes


3.2.3 SAM DA1J

OrderingCode

Flash(Bytes)

SRAM(Bytes)


ATSAMDA1J14B-ABT(1)


-40°C to+105°C

Yes

ATSAMDA1J15B-ABT(1)


-40°C to+105°C

Yes

ATSAMDA1J16B-ABT(1)


-40°C to+105°C

Yes


SAM DA1


3.3 Device IdentificationThe DSU - Device Service Unit peripheral provides the Device Selection bits in the Device Identificationregister (DID.DEVSEL) in order to identify the device by software. The SAM DA1 variants have a resetvalue of DID=0x1001drxx, with the LSB identifying the die number ('d'), the die revision ('r') and thedevice selection ('xx').

Table 3-1. SAM DA1 Device Identification Values

Device Variant DID.DEVSEL Device ID (DID)

Reserved 0x00 - 0x28

SAMDA1J16A 0x29 0x10011429

SAMDA1J15A 0x2A 0x1001142A

SAMDA1J14A 0x2B 0x1001142B

SAMDA1G16A 0x2C 0x1001142C

SAMDA1G15A 0x2D 0x1001142D

SAMDA1G14A 0x2E 0x1001142D

SAMDA1E16A 0x2F 0x1001142F

SAMDA1E15A 0x30 0x10011430

SAMDA1E14A 0x31 0x10011431

Reserved 0x32 - 0x63

SAMDA1J16B 0x64 0x10011564

SAMDA1J15B 0x65 0x10011565

SAMDA1J14B 0x66 0x10011566

SAMDA1G16B 0x67 0x10011567

SAMDA1G15B 0x68 0x10011568

SAMDA1G14B 0x69 0x10011569

SAMDA1E16B 0x6A 0x1001156A

SAMDA1E15B 0x6B 0x1001156B

SAMDA1E14B 0x6C 0x1001156C

Reserved 0x6D - 0xFF

Note: The device variant (last letter of the ordering number) is independent of the die revision(DSU.DID.REVISION): The device variant denotes functional differences, whereas the die revision marksevolution of the die. The device variant denotes functional differences, whereas the die revision marksevolution of the die.

Related LinksDID

SAM DA1


4. Block Diagram

6 x SERCOM

8 x Timer Counter

REAL TIME COUNTER

AHB-APB BRIDGE C

M

MHIGH SPEED BUS MATRIX

POR

T

PO

RT

WATCHDOG TIMER

SERIAL WIRESWDIO

S

CORTEX-M0+ PROCESSOR Fmax 48 MHz

SWCLK

DEVICE SERVICE

UNIT

AHB-APB BRIDGE A

20-CHANNEL 12-bit ADC 350KSPS

AIN[19..0]

VREFA

AIN[3..0]

S

SRAM CONTROLLER

8/4/4KB RAM

M

RESET CONTROLLER

SLEEP CONTROLLER

CLOCK CONTROLLER

POWER MANAGER

RESETN

5 x TIMER / COUNTER

EVE

NT

SYST

EM

S

6 x SERCOM

2 ANALOG COMPARATORS

SYSTEM CONTROLLER

XOUT XIN

XOUT32 XIN32

OSC32K

OSC8M

DFLL48M

BOD33

XOSC32K

XOSC

VREF

X[15..0]

Y[15..0]

PERIPHERAL TOUCH

CONTROLLER

PERIPHERAL ACCESS CONTROLLER

AHB-APB BRIDGE B

VREFA

VOUT

10-bit DAC

EXTERNAL INTERRUPT CONTROLLER



EXTINT[15..0] NMI

GCLK_IO[7..0]

S

PAD0

WO1

PAD1PAD2PAD3

WO0

VREFB

64/32/16KB NVM

NVM CONTROLLER

Cache

S

DMA

USB FSDEVICE

MINI-HOST

DP

DM

3x TIMER / COUNTERFOR CONTROL

WOn

IOBUS

FDPLL96MDMA

DMA

DMA

DMA

DMA

MCK[1..0]SCK[1..0]INTER-IC

SOUND CONTROLLER

SD[1..0]FS[1..0]

DMA

MIC

RO

TRAC

E BU

FFER

SOF 1KHZ

WO0WO1

(2)

GENERIC CLOCKCONTROLLER

CMP[1..0]

2KB/1KB/512B RWW Flash Section

OSCULP32K

1. Some products have different number of SERCOM instances, Timer/Counter instances, PTCsignals and ADC signals. Refer to the Configuration Summary for details.

SAM DA1


2. The three TCC instances have different configurations, including the number of Waveform Output(WO) lines. Refer to the TCC Configuration for details.

Related LinksConfiguration SummaryTCC Configurations

SAM DA1


5. Pinout

5.1 SAM DA1J - TQFP64

PA00 1PA01 2PA02 3PA03 4PB04 5PB05 6

GNDANA 7VDDANA 8

PB06 9PB07 10PB08 11PB09 12PA04 13PA05 14PA06 15PA07 16

PA08

17PA

0918

PA10

19PA

1120

VDD

IO21

GN

D22

PB10

23PB

1124

PB12

25PB

1326

PB14

27PB

1528

PA12

29PA

1330

PA14

31PA

1532

VDDIO48GND47PA2546PA2445PA2344PA2243PA2142PA2041PB1740PB1639PA1938PA1837PA1736PA1635VDDIO34GND33

PB22

49PB

2350

PA27

51R

ESET

52PA

2853

GN

D54

VDD

CO

RE

55VD

DIN

56PA

3057

PA31

58PB

3059

PB31

60PB

0061

PB01

62PB

0263

PB03

64

DIGITAL PINANALOG PINOSCILLATORGROUNDINPUT SUPPLY REGULATED OUTPUT SUPPLYRESET PIN

SAM DA1


5.2 SAM DA1G - QFN48 / TQFP48

PA21

PA00 1PA01 2PA02 3PA03 4

GNDANA 5VDDANA 6

PB08 7PB09 8PA04 9PA05 10PA06 11PA07 12

PA08

13PA

0914

PA10

15PA

1116

VDD

IO17

GN

D18

PB10

19PB

1120

PA12

21PA

1322

PA14

23PA

1524

VDDIO36GND35PA2534PA2433PA2332PA2231

30PA2029PA1928PA1827PA1726PA1625

PB22

37PB

2338

PA27

39R

ESET

40PA

2841

GN

D42

VDD

CO

RE

43VD

DIN

44PA

3045

PA31

46PB

0247

PB03

48

DIGITAL PINANALOG PINOSCILLATORGROUNDINPUT SUPPLYREGULATED OUTPUT SUPPLYRESET PIN

SAM DA1


5.3 SAM DA1E - QFN32 / TQFP32

PA00 1PA01 2PA02 3PA03 4PA04 5PA05 6PA06 7PA07 8

VDD

ANA

9G

ND

10PA

0811

PA09

12PA

1013

PA11

14PA

1415

PA15

16

PA2524PA2423PA2322PA2221PA1920PA1819PA1718PA1617

PA27

25R

ESET

26PA

2827

GN

D28

VDD

CO

RE

29VD

DIN

30PA

3031

PA31

32

DIGITAL PINANALOG PINOSCILLATORGROUNDINPUT SUPPLYREGULATED OUTPUT SUPPLYRESET PIN

SAM DA1


6. Signal Descriptions ListThe following table gives details on signal names classified by peripheral.

Signal Name Function Type Active Level

Analog Comparators - AC

AIN[3:0] AC Analog Inputs Analog

CMP[:0] AC Comparator Outputs Digital

Analog Digital Converter - ADC

AIN[19:0] ADC Analog Inputs Analog

VREFA ADC Voltage External Reference A Analog

VREFB ADC Voltage External Reference B Analog

Digital Analog Converter - DAC

VOUT DAC Voltage output Analog

VREFA DAC Voltage External Reference Analog

External Interrupt Controller

EXTINT[15:0] External Interrupts Input

NMI External Non-Maskable Interrupt Input

Generic Clock Generator - GCLK

GCLK_IO[7:0] Generic Clock (source clock or generic clock generatoroutput)

I/O

Inter-IC Sound Controller - I2S

MCK[1:0] Master Clock I/O

SCK[1:0] Serial Clock I/O

FS[1:0] I2S Word Select or TDM Frame Sync I/O

SD[1:0] Serial Data Input or Output I/O

Power Manager - PM

RESETN Reset Input Low

Serial Communication Interface - SERCOMx

PAD[3:0] SERCOM I/O Pads I/O

System Control - SYSCTRL

XIN Crystal Input Analog/ Digital

XIN32 32kHz Crystal Input Analog/ Digital

XOUT Crystal Output Analog

XOUT32 32kHz Crystal Output Analog

SAM DA1


Signal Name Function Type Active Level

Timer Counter - TCx

WO[1:0] Waveform Outputs Output

Timer Counter - TCCx

WO[1:0] Waveform Outputs Output

Peripheral Touch Controller - PTC

X[15:0] PTC Input Analog

Y[15:0] PTC Input Analog

General Purpose I/O - PORT

PA25 - PA00 Parallel I/O Controller I/O Port A I/O



PB17 - PB00 Parallel I/O Controller I/O Port B I/O



Universal Serial Bus - USB

DP DP for USB I/O

DM DM for USB I/O

SOF 1kHz USB Start of Frame I/O

SAM DA1


7. I/O Multiplexing and Considerations

7.1 Multiplexed SignalsEach pin is by default controlled by the PORT as a general purpose I/O and alternatively it can beassigned to one of the peripheral functions A, B, C, D, E, F, G or H. To enable a peripheral function on apin, the Peripheral Multiplexer Enable bit in the Pin Configuration register corresponding to that pin(PINCFGn.PMUXEN, n = 0-31) in the PORT must be written to one. The selection of peripheral functionA to H is done by writing to the Peripheral Multiplexing Odd and Even bits in the Peripheral Multiplexingregister (PMUXn.PMUXE/O) in the PORT.

This table describes the peripheral signals multiplexed to the PORT I/O pins.

Table 7-1. PORT Function MultiplexingPin I/O Pin Supply A B(1)(2) C D E F G H

SAMDA1E SAMDA1G SAMDA1J EIC REF ADC AC PTC DAC SERCOM(1)(2) SERCOM-ALT TC(3)

/TCC

TCC COM AC/

GCLK

1 1 1 PA00 VDDANA EXTINT[0] SERCOM1/PAD[0]

TCC2/WO[0]

2 2 2 PA01 VDDANA EXTINT[1] SERCOM1/PAD[1]

TCC2/WO[1]

3 3 3 PA02 VDDANA EXTINT[2] AIN[0] Y[0] VOUT

4 4 4 PA03 VDDANA EXTINT[3] ADC/VREFADAC/

VREFA

AIN[1] Y[1]

5 PB04 VDDANA EXTINT[4] AIN[12] Y[10]




7 11 PB08 VDDANA EXTINT[8] AIN[2] Y[14] SERCOM4/PAD[0]

TC4/WO[0]


TC4/WO[1]

5 9 13 PA04 VDDANA EXTINT[4] ADC/VREFB

AIN[4] AIN[0] Y[2] SERCOM0/PAD[0]

TCC0/WO[0]

6 10 14 PA05 VDDANA EXTINT[5] AIN[5] AIN[1] Y[3] SERCOM0/PAD[1]

TCC0/WO[1]


TCC1/WO[0]


TCC1/WO[1] I2S/SD[0]

11 13 17 PA08 VDDIO NMI AIN[16] X[0] SERCOM0/PAD[0]

SERCOM2/PAD[0]

TCC0/WO[0] TCC1/WO[2]

I2S/SD[1]

12 14 18 PA09 VDDIO EXTINT[9] AIN[17] X[1] SERCOM0/PAD[1]

SERCOM2/PAD[1]


I2S/MCK[0]


SERCOM2/PAD[2]


I2S/SCK[0]

GCLK_IO[4]


SERCOM2/PAD[3]


I2S/FS[0] GCLK_IO[5]

19 23 PB10 VDDIO EXTINT[10] SERCOM4/PAD[2]

TC5/WO[0] TCC0/WO[4]

I2S/MCK[1]

GCLK_IO[4]



I2S/SCK[1]

GCLK_IO[5]

25 PB12 VDDIO EXTINT[12] X[12] SERCOM4/PAD[0]





GCLK_IO[7]


TC5/WO[0] GCLK_IO[0]

SAM DA1


Pin I/O Pin Supply A B(1)(2) C D E F G H

SAMDA1E SAMDA1G SAMDA1J EIC REF ADC AC PTC DAC SERCOM(1)(2) SERCOM-ALT TC(3)

/TCC

TCC COM AC/

GCLK



21 29 PA12 VDDIO EXTINT[12] SERCOM2/PAD[0]

SERCOM4/PAD[0]


AC/CMP[0]

22 30 PA13 VDDIO EXTINT[13] SERCOM2/PAD[1]

SERCOM4/PAD[1]


AC/CMP[1]

15 23 31 PA14 VDDIO EXTINT[14] SERCOM2/PAD[2]

SERCOM4/PAD[2]


GCLK_IO[0]


SERCOM4/PAD[3]


GCLK_IO[1]

17 25 35 PA16 VDDIO EXTINT[0] X[4] SERCOM1/PAD[0]

SERCOM3/PAD[0]


GCLK_IO[2]


SERCOM3/PAD[1]


GCLK_IO[3]


SERCOM3/PAD[2]


AC/CMP[0]


SERCOM3/PAD[3]


I2S/SD[0] AC/CMP[1]

39 PB16 VDDIO EXTINT[0] SERCOM5/PAD[0]


I2S/SD[1] GCLK_IO[2]



I2S/MCK[0]

GCLK_IO[3]

29 41 PA20 VDDIO EXTINT[4] X[8] SERCOM5/PAD[2]

SERCOM3/PAD[2]


I2S/SCK[0]

GCLK_IO[4]

30 42 PA21 VDDIO EXTINT[5] X[9] SERCOM5/PAD[3]

SERCOM3/PAD[3]




SERCOM5/PAD[0]


GCLK_IO[6]


SERCOM5/PAD[1]


USB/SOF1kHz

GCLK_IO[7]

23 33 45 PA24(5) VDDIO EXTINT[12] SERCOM3/PAD[2]

SERCOM5/PAD[2]


USB/DM

24 34 46 PA25(5) VDDIO EXTINT[13] SERCOM3/PAD[3]

SERCOM5/PAD[3]


USB/DP





25 39 51 PA27 VDDIO EXTINT[15] GCLK_IO[0]

27 41 53 PA28 VDDIO EXTINT[8] GCLK_IO[0]


TCC1/WO[0] SWCLK GCLK_IO[0]


TCC1/WO[1] SWDIO(4)





61 PB00 VDDANA EXTINT[0] AIN[8] Y[6] SERCOM5/PAD[2]

TC7/WO[0]

62 PB01 VDDANA EXTINT[1] AIN[9] Y[7] SERCOM5/PAD[3]

TC7/WO[1]


TC6/WO[0]


TC6/WO[1]

1. All analog pin functions are on peripheral function B. Peripheral function B must be selected todisable the digital control of the pin.

2. Only some pins can be used in SERCOM I2C mode.

SAM DA1


3. Note that not all TC6 and TC7 waveform outputs are available on SAM DA1E and G devices butmay still be used for internal counting/timing applications.

4. This function is only activated in the presence of a debugger.5. If the PA24 and PA25 pins are not connected, it is recommended to enable a pull-up on PA24 and

PA25 through input GPIO mode. The aim is to avoid an eventually extract power consumption(

7.2.4 GPIO ClustersTable 7-5. GPIO Clusters

PACKAGE CLUSTER GPIO SUPPLIESPINSCONNECTEDTO THECLUSTER

64pins 1 PB31 PB30 PA31 PA30 VDDINpin56/GNDpin54

2 PA28 PA27 PB23 PB22 VDDINpin56/GNDpin54 andVDDIO pin48/GND pin47

3 PA25 PA24 PA23 PA22 PA21 PA20 PB17 PB16 PA19 PA18 PA17 PA16 VDDIO pin48/GND pin47and VDDIOpin34/GNDpin33

4 PA15 PA14 PA13 PA12 PB15 PB14 PB13 PB12 PB11 PB10 VDDIO pin34/GND pin33and VDDIOpin21/GNDpin22

5 PA11 PA10 PA09 PA08 VDDIOpin21/GNDpin22

6 PA07 PA06 PA05 PA04 PB09 PB08 PB07 PB06 VDDANA pin8/GNDANApin7

7 PB05 PB04 PA03 PA02 PA01 PA00 PB03 PB02 PB01 PB00 VDDANA pin8/GNDANApin7

48pins 1 PA31 PA30 VDDINpin44/GNDpin42

2 PA28 PA27 PB23 PB22 VDDINpin44/GNDpin42 andVDDIOpin36/GNDpin35

3 PA25 PA24 PA23 PA22 PA21 PA20 PA19 PA18 PA17 PA16 PA15 PA14 PA13 PA12 PB11 PB10 VDDIOpin36/GNDpin35 andVDDIOpin17/GNDpin18

4 PA11 PA10 PA09 PA08 VDDIOpin17/GNDpin18

5 PA07 PA06 PA05 PA04 PB09 PB08 VDDANA pin6/GNDANA pin5

6 PA03 PA02 PA01 PA00 PB03 PB02 VDDANA pin6/GNDANA pin5

32pins 1 PA31 PA30 VDDINpin30/GND pin28

SAM DA1


PACKAGE CLUSTER GPIO SUPPLIESPINSCONNECTEDTO THECLUSTER

2 PA28 PA27 PA25 PA24 PA23 PA22 PA19 PA18 PA17 PA16 PA15 PA14 PA11 PA10 PA09 PA08 VDDINpin30/GND pin28 andVDDANApin9/GNDpin10

3 PA07 PA06 PA05 PA04 PA03 PA02 PA01 PA00 VDDANApin9/GNDpin10

7.2.5 TCC ConfigurationsThe SAM DA1 has three instances of the Timer/Counter for Control applications (TCC) peripheral, ,TCC[2:0]. The following table lists the features for each TCC instance.

Table 7-6. TCC Configuration Summary

TCC# Channels(CC_NUM)

WaveformOutput

(WO_NUM)

Countersize

Fault Dithering Outputmatrix

Dead TimeInsertion

(DTI)

SWAP Patterngeneration

0 4 8 24-bit Yes Yes Yes Yes Yes Yes

1 2 4 24-bit Yes Yes Yes

2 2 2 16-bit Yes

Note: The number of CC registers (CC_NUM) for each TCC corresponds to the number of compare/capture channels, so that a TCC can have more Waveform Outputs (WO_NUM) than CC registers.

SAM DA1


8. Power Supply and Start-Up Considerations

8.1 Power Domain Overview

VOLTAGEREGULATOR

VDD

IN

VDD

CO

RE

GN

DADC

AC

DAC

PTC

XOSC32K

OSC32K

VDD

ANA

GN

DAN

A

PA[7:2]

PB[9:0]

PA[1:0]

Digital Logic(CPU, peripherals)

DFLL48M

VDD

IO

OSC8M

XOSC

OSCULP32K

PA[31:16]

PB[31:10]

PA[15:14]

BOD33

POR

PA[13:8]BOD12

FDPLL96M

8.2 Power Supply Considerations

8.2.1 Power SuppliesThe device has several different power supply pins:

• VDDIO: Powers I/O lines, OSC8M and XOSC. Voltage is 2.7V to 3.63V.• VDDIN: Powers I/O lines and the internal regulator. Voltage is 2.7V to 3.63V.• VDDANA: Powers I/O lines and the ADC, AC, DAC, PTC, OSCULP32K, OSC32K, XOSC32K.

Voltage is 2.7V to 3.63V.• VDDCORE: Internal regulated voltage output. Powers the core, memories, peripherals, FDPLL96M,

and DFLL48M. Voltage is 1.2V.

The same voltage must be applied to both VDDIN, VDDIO and VDDANA. This common voltage isreferred to as VDD in the datasheet.

The ground pins, GND, are common to VDDCORE, VDDIO and VDDIN. The ground pin for VDDANA isGNDANA.

SAM DA1


For decoupling recommendations for the different power supplies. Refer to Schematic Checklist fordetails.

Related LinksSchematic Checklist

8.2.2 Voltage RegulatorThe voltage regulator has two different modes:

• Normal mode: To be used when the CPU and peripherals are running• Low Power (LP) mode: To be used when the regulator draws small static current. It can be used in

standby mode

8.2.3 Typical Powering SchematicsThe device uses a single main supply with a range of 2.7V - 3.63V.

The following figure shows the recommended power supply connection.

Figure 8-1. Power Supply Connection

(2.7V — 3.63V)Main Supply VDDIO

VDDANA

VDDIN

VDDCORE

GND

GNDANA

DEVICE

8.2.4 Power-Up Sequence

8.2.4.1 Minimum Rise RateThe integrated power-on reset (POR) circuitry monitoring the VDDANA power supply requires a minimumrise rate. Refer to the Electrical Characteristics for details.

Related LinksElectrical Characteristics

8.2.4.2 Maximum Rise RateThe rise rate of the power supply must not exceed the values described in Electrical Characteristics.Refer to the Electrical Characteristics for details.

SAM DA1


Related LinksElectrical Characteristics

8.3 Power-UpThis section summarizes the power-up sequence of the device. The behavior after power-up is controlledby the Power Manager. Refer to PM – Power Manager for details.

Related LinksPM – Power Manager

8.3.1 Starting of ClocksAfter power-up, the device is set to its initial state and kept in reset, until the power has stabilizedthroughout the device. Once the power has stabilized, the device will use a 1MHz clock. This clock isderived from the 8MHz Internal Oscillator (OSC8M), which is divided by eight and used as a clock sourcefor generic clock generator 0. Generic clock generator 0 is the main clock for the Power Manager (PM).

Some synchronous system clocks are active, allowing software execution.

Refer to the “Clock Mask Register” section in PM – Power Manager for the list of default peripheral clocksrunning. Synchronous system clocks that are running are by default not divided and receive a 1MHz clockthrough generic clock generator 0. Other generic clocks are disabled except GCLK_WDT, which is usedby the Watchdog Timer (WDT).

Related LinksPM – Power Manager

8.3.2 I/O PinsAfter power-up, the I/O pins are tri-stated.

8.3.3 Fetching of Initial InstructionsAfter reset has been released, the CPU starts fetching PC and SP values from the reset address, whichis 0x00000000. This address points to the first executable address in the internal flash. The code readfrom the internal flash is free to configure the clock system and clock sources. Refer to PM – PowerManager, GCLK – Generic Clock Controller and SYSCTRL – System Controller for details. Refer to theARM Architecture Reference Manual for more information on CPU startup (http://www.arm.com).

Related LinksPM – Power ManagerSYSCTRL – System ControllerClock System

8.4 Power-On Reset and Brown-Out DetectorThe SAM DA1 embeds three features to monitor, warn and/or reset the device:

• POR: Power-on reset on VDDANA• BOD33: Brown-out detector on VDDANA• BOD12: Voltage Regulator Internal Brown-out detector on VDDCORE. The Voltage Regulator

Internal BOD is calibrated in production and its calibration configuration is stored in the NVM UserRow. This configuration should not be changed if the user row is written to assure the correctbehavior of the BOD12.

SAM DA1


http://www.arm.com

8.4.1 Power-On Reset on VDDANAPOR monitors VDDANA. It is always activated and monitors voltage at startup and also during all thesleep modes. If VDDANA goes below the threshold voltage, the entire chip is reset.

8.4.2 Brown-Out Detector on VDDANABOD33 monitors VDDANA. Refer to SYSCTRL – System Controller for details.

Related LinksSYSCTRL – System Controller

8.4.3 Brown-Out Detector on VDDCOREOnce the device has started up, BOD12 monitors the internal VDDCORE.

SAM DA1


9. Product MappingFigure 9-1. Atmel SAM DA1 Product Mapping

Code

SRAM

Undefined

Peripherals

Reserved

Undefined

Global Memory Space0x00000000

0x20000000

0x20008000

0x40000000

0x43000000

0x60000000

Internal SRAM

SRAM

AHB-APB Bridge A

AHB-APB Bridge B

AHB-APB Bridge C

AHB-APB

Code

0x20000000 0x20007FFF

0x40000000

0x41000000

0x42000000

0x42FFFFFF

Reserved

PAC0

PM

SYSCTRL

GCLK

WDT

RTC

EIC

AHB-APB Bridge A0x40000000

0x40000400

0x40000800

0x40000C00

0x40001000

0x40001400

0x40001800

0x40FFFFFF 0x40001C00

AHB-APB Bridge B

Reserved

PAC1 DSU

NVMCTRL PORT

0x41000000 0x41002000 0x41004000 0x41004400

0x41FFFFFF 0x41007000

SERCOM5

PAC2

EVSYS

SERCOM0

SERCOM1

SERCOM2

SERCOM3

SERCOM4

AHB-APB Bridge C

TC7

TCC0

TCC1

TCC2

TC3

TC4

TC5

TC6

ADC

AC

0x42000000

0x42000400

0x42000800

0x42000C00

0x42001000

0x42001400

0x42001800

0x42002000

0x42001C00

0x42003000

0x42003400

0x42003800

0x42003C00

0x42004000

0x42004400

0x42004800

Reserved

0x60000200

0xFFFFFFFF

Reserved

System

0xE0000000

DAC0x42004C00

0x42002400

0x42002800

0x42002C00

PTC

0x42005400

0x42005000I2S

DMAC

USB

MTB

0x41004800 0x41005000 0x41006000

0xE0000000 0xE000E000 0xE000F000 0xE00FF000 0xE0100000 0xFFFFFFFF

System

Reserved SCS

Reserved

ROMTable Reserved

Internal Flash

Internal RWW section

0x42FFFFFF

0x00400000

0x00000000

0x1FFFFFFF

This figure represents the full configuration of the SAM DA1 with maximum flash and SRAM capabilitiesand a full set of peripherals.

SAM DA1


10. Automotive Quality GradeThe SAM DA1 have been developed and manufactured according to the most stringent requirements ofthe international standard ISO-TS 16949. This data sheet contains limit values extracted from the resultsof extensive characterization (temperature and voltage). The quality and reliability of the SAM DA1 havebeen verified during regular product qualification as per AEC-Q100 grade 1.

As indicated in the ordering information paragraph, the product is available in only one temperaturegrade. Refer to the table below.

Table 10-1. Temperature Grade Identification for Automotive Products

Temperature Temperature Identifier Comments

-40°C to +105°C B Full automotive temperaturerange.

Related LinksOrdering Information

SAM DA1


11. Data RetentionReliability qualification results show that the projected data retention failure rate is much less than 1 PPMover 20 years at 105°C or 100 years at 25°C.

SAM DA1


12. Memories

12.1 Embedded Memories• Internal high-speed flash with Read-While-Write (RWW) capability on section of the array.• Internal high-speed RAM, single-cycle access at full speed

12.2 Physical Memory MapThe High-Speed bus is implemented as a bus matrix. All High-Speed bus addresses are fixed, and theyare never remapped in any way, even during boot. The 32-bit physical address space is mapped asfollow:

Table 12-1. Physical memory map(1)

Memory Start address Size

SAMDA1x16 SAMDA1x15 SAMDA1x14

Internal Flash 0x00000000 64Kbytes 32Kbytes 16Kbytes

Internal RWW section 0x00400000 2Kbytes 1Kbytes 512bytes

Internal SRAM 0x20000000 8Kbytes 4Kbytes 4Kbytes

Peripheral Bridge A 0x40000000 64Kbytes 64Kbytes 64Kbytes

Peripheral Bridge B 0x41000000 64Kbytes 64Kbytes 64Kbytes

Peripheral Bridge C 0x42000000 64Kbytes 64Kbytes 64Kbytes

1. x = G, J or E.

Table 12-2. Flash memory parameters(1)

Device Flash size Number of pages Page size

SAMDA1x16 64Kbytes 1024 64 bytes



1. x = G, J or E.2. The number of pages (NVMP) and page size (PSZ) can be read from the NVM Pages and Page

Size bits in the NVM Parameter register in the NVMCTRL (PARAM.NVMP and PARAM.PSZ,respectively). Refer to NVM Parameter (PARAM) register for details.

Table 12-3. RWW section parameters

Device Flash size Number of pages Page size



SAMDA1x14 512 bytes 8 64 bytes

SAM DA1


Related LinksPARAMOrdering Information

12.3 NVM Calibration and Auxiliary SpaceThe device calibration data are stored in different sections of the NVM calibration and auxiliary spacepresented in Figure.Calibration and Auxiliary Space.

Figure 12-1. Calibration and Auxiliary Space

0x00800000

AUX0 offse t address

Automatic ca libra tion row Calibra tion and auxilia ry

space address offse t

AUX0 – NVM User Row

AUX1

0x00804000

0x00806000 AUX1 offse t address

0x00806000

Area 3 offse t address

Area 1: Reserved (64 bits )

Area 2: Device configura tion a rea (64 bits )

Area 1 address offse t

Area 2 offse t address

Area 3: Reserved (128bits )

Area 4: Software ca libra tion a rea (256bits )

0x00806008

0x00806010

0x00806020 Area 4 offse t address

AUX10x00806040

0x00000000

NVM base address + NVM s ize

NVM main address space

NVM Base Address

Calibra tion and auxilia ry space

0x00800000

NVM base address + 0x00800000

The values from the automatic calibration row are loaded into their respective registers at startup.

12.3.1 NVM User Row MappingThe NVM User Row contains calibration data that are automatically read at device power on.

The NVM User Row can be read at address 0x804000.

To write the NVM User Row refer to NVMCTRL – Non-Volatile Memory Controller.

Note that when writing to the user row the values do not get loaded by the other modules on the deviceuntil a device reset occurs.

Table 12-4. NVM User Row Mapping

Bit Position Name Usage

2:0 BOOTPROT Used to select one of eight different bootloader sizes. Refer toNVMCTRL – Non-Volatile Memory Controller. Default value = 7except for WLCSP (Default value = 3).

3 Reserved

SAM DA1


Bit Position Name Usage

6:4 EEPROM Used to select one of eight different EEPROM sizes. Refer toNVMCTRL – Non-Volatile Memory Controller. Default value = 7.

7 Reserved

13:8 BOD33 Level BOD33 Threshold Level at power on. Refer to SYSCTRL BOD33register.Default value = 7.

14 BOD33 Enable BOD33 Enable at power on . Refer to SYSCTRL BOD33 register.Default value = 1.

16:15 BOD33 Action

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SAM DA1 Datasheet• Flexible end-point configuration and management with dedicated DMA channels •...

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