SATHYABAMA UNIVERSITYfiles.sathyabamauniversity.ac.in/syllabus/2010 PG SYLLABUS PDF C… ·...

SATHYABAMA UNIVERSITY (Established under section 3 of UGC Act, 1956)

Declared Category “A” by MHRD

Jeppiaar Nagar, Rajiv Gandhi Salai,

Chennai - 6 0 0 119.

CENTRE FOR NANOSCIENCE AND NANOTECHNOLOGY

SYLLABUS

MASTER OF ENGINEERING

IN

MATERIALS SCIENCE & ENGINEERING

(4 SEMESTERS) REGULATIONS 2010

SATHYABAMA UNIVERSITY CENTRE FOR NANOSCIENCE AND NANOTECHNOLOGY

II

M.E (MATERIAL SCIENCE & ENGINEERING)

REGULATIONS 2010

Masters in Materials Science and Engineering (M.E degree )

The course provides a broad coverage of subject areas of man-made materials, characterization of materials and materials processes and will provide students with the ideal background to pursue a career in Materials Science and Engineering within either an industrial or an academic environment. This Masters Programme will provide a deeper understanding of the structure of materials from the macro-scale down to the atomic level. The courses will enable students with science background to tailor the properties and fabrication processes of materials in order to create new and innovative products used in domains as varied as energy, aerospace, biotechnology, transport, infrastructures etc. Why Study Materials Science and Engineering? A Masters Degree in Materials Science and Engineering gives access to careers in a wide variety of industries ranging from the production of materials to the manufacture of finished products - such as aeronautics, food industry, metallurgy, automobile industry, electronics, and multimedia. There is also a high demand for materials scientists in government research laboratories and with specialised consultancies.

Why Study Materials Science and Engineering at Sathyabama University ?

The Sathyabama University has a long established national reputation for its research and teaching in engineering. The University houses an INTERNATIONAL RESEARCH CENTRE where the Centre for Nanoscience and Nanotechnology functions since 2006. The Centre has commissioned several world class materials processing facilities including Ball Milling, Thermal evaporation, Radio Frequency and Direct Current magnetron sputtering, Electron Beam Evaporation, Thermal Chemical Vapour Deposition (CVD), Pulsed Laser Deposition and Spin coating. Additionally, the state–of-art characterization techniques such as Field emission scanning electron microscopy (FESEM), Atomic force microscopy (AFM), Rotating anode X-ray diffraction (XRD) with high temperature attachment, epi-fluoresence microscopy and optical microscopy are available at the Centre. These facilities ensure that students will learn Materials Science and Engineering from a team of experts working at the cutting edge of science and technology. What does the Course content provide?

The course provides core modules in the following 10 subjects relevant to the future :

Thermodynamics of Materials

Principles of Materials Engineering

Fundamentals of Nanoscience and Nanotechnology

Materials Characterization

Materials and Corrosion

Surface Engineering

Advanced Metallic Materials and Processes

Materials for Energy

Polymers and Composites

Ceramics and Bio-materials

Additionally, Students have to choose 5 out of 15 optional subjects as Elective papers.

Students also have to undertake a research project in the Centre for Nanoscience and Nanotechnology or in any reputed Research Institute or in Industry. Whilst the majority of research projects involve significant amounts of


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REGULATIONS 2010

hands-on experimental work in the Centre for Nanoscience and Nanotechnology, the Department of Mechanical Engineering also offers research projects.

Entry requirements

Post graduate degree or equivalent in Materials Science, Physics, Chemistry or a graduate degree in Metallurgy or Materials science from an approved institution. Aims All our courses aim to give:

In-depth technical knowledge and advanced expertise in the chosen materials field Excellent analytical and research skills Enhanced project planning and management capabilities and experience

Assessment

Written examinations on course modules at the end of each semester. Continuous assessment associated with specific courses. Essay on specialised topic; dissertation based on individual research project, which may be experimental,

theoretical or industrial based.

Most of the courses are assessed by written examination but there is some continuous assessment associated with specific courses. This may include essays on specialised topics or problems exercises. All students produce a 15,000-word dissertation based on their individual research project, which may be experimental, theoretical or industrial based. Most of the projects will be carried out the Centre for Nanoscience and Nanotechnology, Sathyabama University, while Industrially-based research topics are normally suggested by an industrial organisation, and may involve close co-operation with that organization and the supervisor.


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REGULATIONS 2010

SATHYABAMA UNIVERSITY REGULATIONS – 2010

Effective from the academic year 2014-2015 and applicable to the students admitted to the Master of Engineering in Materials Science (Four Semesters). 1. Structure of Programme

1.1 Every Programme will have a curriculum with syllabi consisting of theory and practical courses such as: (i) General core courses in Materials Science, Physics, Chemistry, Nanoscience

(ii) Core course of Engineering / Technology / Science

(iii) Elective course for specialization in related fields (iv) Workshop practice, Computer Practice, Laboratory Work, Industrial Training, Seminar Presentation,

Project Work at Centre for Nanoscience and Nanotechnology, Educational Tours, Camps etc. 1.2 Each semester curriculum shall normally have a blend of lecture course not exceeding 5 and practical course not exceeding 4.

1.3 The medium of instruction, examinations and project report will be English.

2. Duration of the Programme A student is normally expected to complete the M.E Programme in 4 semesters but in any case not

more than 8 consecutive semesters from the time of commencement of the course. The Head of the

Department shall ensure that every teacher imparts instruction as per the number of hours specified in the

syllabus and that the teacher teaches the full content of the specified syllabus for the course being

taught.

3. Requirements for Completion of a Semester A candidate who has fulfilled the following conditions shall be deemed to have satisfied the requirement for

completion of a semester. 3.1 He / She secures not less than 90% of overall attendance in that semester.

3.2 Candidates who do not have the requisite attendance for the semester will not be permitted to write the University Exams.

4. Examinations The examinations shall normally be conducted between October and December during the odd semesters

and between March and May in the even semesters. The maximum marks for each theory and practical

course (including the project work and Viva Voce examination in the Fourth Semester) shall be 100 with the

following breakup.

(i) Theory Courses Internal Assessment : 20 Marks

University Exams : 80 Marks

(ii) Practical courses

Internal Assessment : - - University Exams

: 100 marks

5. Passing requirements

(i) A candidate who secures not less than 50% of total marks prescribed for the course (For all


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REGULATIONS 2010

courses including Theory, Practicals and Project work) with a minimum of 40 marks out of 80 in

the University Theory Examinations, shall be declared to have passed in the Examination.

(ii) If a candidate fails to secure a Pass in a particular course, it is mandatory that he/she shall

reappear for the examination in that course during the next semester when examination is

conducted in that course. However the Internal Assessment marks obtained by the candidate

in the first attempt shall be retained and considered valid for all subsequent attempts.

6. Eligibility for the Award of Degree

A student shall be declared to be eligible for the award of the M.E degree provided the student has

successfully completed the course requirements and has passed all the prescribed examinations in all the

4 semesters within the maximum period specified in clause 2.

7. Award of Credits and Grades

All assessments of a course will be done on absolute marks basis. However, for the purpose of

reporting the performance of a candidate, Letter Grades will be awarded as per the range of total

marks (out of 100) obtained by the candidate as given below:

RANGE OF MARKS FOR GRADES

Range of Marks Grade Grade Points (GP)

90-100 A++ 10

80-89 A+ 9

70-79 B++ 8

60-69 B+ 7

50-59 C 6

00-49 F 0

ABSENT W 0

C U M U L A T I V E G R A D E P O I N T A V E R A G E C A L C U L A T I O N

The CGPA calculation on a 10 scale basis is used to describe the overall performance of a

student in all courses from first semester to the last semester. F and W grades will be excluded

for calculating GPA and CGPA.

CGPA i Ci Gpi

i C i

where Ci - Credits for the subject

GPi - Grade Point for the subject

i - Sum of all subjects successfully cleared during all the semesters

8. Classification of the Degree Awarded 1 A candidate who qualifies for the award of the Degree having passed the examination in all the courses

of all the semesters in his/her first appearance within a maximum period of 4 consecutive semesters after


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REGULATIONS 2010

commencement of study securing a CGPA not less than 9.0 shall be declared to have passed the

examination in First Class – Exemplary.

2. A candidate who qualifies for the award of the Degree having passed the examination in all the courses

of all the semesters in his/her first appearance within a maximum period of 4 consecutive semesters after

commencement of study, securing a CGPA not less than 7.5 shall be declared to have passed the

examination in First Class with Distinction.

3. A candidate who qualifies for the award of the Degree having passed the examination in all the courses

of all the semesters within a maximum period of 4 consecutive semesters after commencement of

study securing a CGPA not less than 6.0 shall be declared to have passed the examination in First

Class.

4 All other candidates who qualify for the award of the Degree having passed the examination in all the

courses of all the 4 semesters within a maximum period of 8 consecutive semesters after his/her

commencement of study securing a CGPA not less than 5.0 shall be declared to have passed the

examination in Second Class.

5 A candidate who is absent in semester examination in a course/project work after having registered for

the same, shall be considered to have appeared in that examination for the purpose of

classification of degree. For all the above mentioned classification of Degree, the break of study during

the programme, will be counted for the purpose of classification of degree.

6 A candidate can apply for revaluation of his/her semester examination answer paper in a theory course, within 1 week from the declaration of results, on payment of a prescribed fee along with prescribed application to the Controller of Examinations through the Head of Department. The Controller of Examination will arrange for the revaluation and the result will be intimated to the candidate concerned through the Head of the Department. Revaluation is not permitted for practical courses and for project work.

Final Degree is awarded based on the following :

CGPA 9.0 - First Class - Exemplary

CGPA 7.50 < 9.0 - First Class with Distinction CGPA

6.00 < 7.50 - First Class

CGPA 5.00 < 6.00 - Second Class

Minimum CGPA requirements for award of Degree is 5.0 CGPA.

9. Discipline

Every student is required to observe disciplined and decorous behaviour both inside and outside the University and not to indulge in any activity which will tend to bring down the prestige of the University. If a student indulges in malpractice in any of the University theory / practical examination, he/she shall be liable for punitive action as prescribed by the University from time to time.

10. Revision of Regulations and Curriculum The University may revise, amend or change the regulations, scheme of examinations and syllabi from time to

time, if found necessary.


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REGULATIONS 2010

M.E - MATERIALS SCIENCE AND ENGINEERING REGULATIONS 2010 – CURRICULUM

SEMESTER– I

Sl.No. SUBJECT CODE SUBJECT TITLE L T P C Page No.

THEORY

1 MSEC01 Thermodynamics of Materials 3 1 0 4 1

2 MSEC02 Principles of Materials Engineering 3 1 0 4 2

3 MSEC03 Fundamentals of Nanoscience 3 0 0 3 3 and Nanotechnology

4 MSEC04 Materials Characterization 3 0 0 3 4

5 Elective I 3 0 0 3

PRACTICAL

6 MSEP01 Microstructural Charaterisation Lab 0 0 4 2 31

TOTAL CREDITS: 19

SEMESTER – II


THEORY

1 MSEC05 Materials and Corrosion 3 0 0 3 5

2 MSEC06 Surface Engineering 3 0 0 3 7

3 MSEC07 Advanced Metallic Materials and Processes 4 0 0 4 8

4 Elective-II 3 0 0 3

5 Elective-III 3 0 0 3

PRACTICAL

6 MSEP02 Thin film deposition Lab 0 0 4 2 32

TOTAL CREDITS: 18

SEMESTER-III


THEORY

1 MSEC 08 Materials for Energy 4 0 0 4 9

2 MSEC 09 Polymers and Composites 3 0 0 3 10

3 MSEC 10 Ceramics and Bio-materials 3 0 0 3 12


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REGULATIONS 2010

4 Elective-III 3 0 0 3

5 Elective-IV 3 0 0 3

PRACTICAL

6 MSEP03 Powder Metallurgy & Metallography 0 0 4 2 32 TOTAL CREDITS: 18

SEMESTER – IV

Sl.No. SUBJECT CODE SUBJECT TITLE L T P C

1 MSEVV Project Viva-voce 0 0 30 15

TOTAL CREDITS: 15

TOTAL CREDITS FOR THE COURSE: 70

LIST OF ELECTIVE SUBJECTS

Sl.No. SUBJECT CODE SUBJECT TITLE

L T P C Page No.

1 MSEE01 Physics of Materials 3 0 0 3 13

2 MSEE02 Properties of Materials 3 0 0 3 15

3 MSEE03 Chemical Synthesis of Materials 3 0 0 3 16

4 MSEE04 Mechanical and High Temperature

Behaviour of Materials

3 0 0 3 17

5 MSEE05 Numerical Methods for Materials science 3 0 0 3 18

6 MSEE06 Metallurgical Processing 3 0 0 3 20

7 MSEE07 Technology of Semiconductors 3

0 0 3 21

8 MSEE08 Ceramic Science and Technology 3 0 0 3 22

9 MSEE09 Polymer and Composite Materials 3 0 0 3 23

10 MSEE10 Nanoscale Fabrication and Measurement

Techniques

3 0 0 3 25

11 MSEE11 Non-Destructive Testing 3 0 0 3 26 23

12 MSEE12 Biomaterials 3 0 0 3 27 24

13 MSEE13 Smart Materials 3 0 0 3 29 25

14 MSEE14 Superconducting Materials and Applications 3 0 0 3 30 26

15 MSEE15 Industrial Tribology 3 0 0 3 31 27 L – Lecture hours; T – Tutorial hours; P – Practical hours; C – Credits


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REGULATIONS 2010 M.E (MATERIAL SCIENCE & ENGINEERING)

MSEC01

THERMODYNAMICS OF MATERIALS

L T P Credit

3 1 0 4

(48 hours) Unit I

Kinetic Theory and Gas Laws: Kinetic Theory of Matter, Different States of Matter, Concept of Ideal or Perfect Gas, Kinetic Theory of Gases, Expression for the Pressure of a Gas, Kinetic interpretation of Temperature. Unit II

Equation of State : Derivation of Gas Equation, Derivation of Gas Laws, Avogadro's Hypothesis, Graham's Law of Diffusion of Gases, Degree of Freedom & Maxwell's Law of Equi-partition of Energy, Mean Free Path, Van-der Waals Equation of State, Critical Constants, Corresponding States, Critical Coefficient.

Unit III

Laws of Thermodynamics : Thermal Equilibrium Concept of Temperature (Zeroth Law of Thermodynamics), Concept of Heat and work, Comparison of Heat and Work - First Law of Thermodynamics, Isothermal Process, Adiabatic Process, Isobaric Process, Isochoric Process, Second Law of Thermodynamics, Entropy, Third Law of Thermodynamics.

Unit IV

Statistical Thermodynamics : Statistical Mechanics, Statistical Equilibrium, Statistical definition of entropy, Gibbs Paradox-Probability Theorems, Statistical Thermodynamics, Maxwell-Boltzmann Distribution Law Maxwell-Boltzmann Distribution & Ideal Gas, Quantum Statistics, Phase Space, Fermi-Dirac Distribution Law, Electron Gas, Bose-Einstein Distribution Law, Photon Gas, Theories of simple liquids-Monte-Carlo Molecular dynamics simulations-Reaction dynamics from microscopic viewpoint.

Unit V

Applications of Statistical Mechanics, Planck‟s Radiation law- Stefan-Boltzmann law, Einstein model of a solid, Bose condensation, Classical partition function and classical ideal gas, Equipartition theorem, Semiconductor statistics, Statistical equilibrium of electrons in semiconductors. Reference Books

1. Richard E. Sonntag and Claus Borgnakke, Introduction to Engineering Thermodynamics, Wiley; 2 edition (March 3, 2006), ISBN-10: 0471737593.

2. Ken A. Dill and Sarina Bromberg, Molecular Driving Forces: Statistical Thermodynamics in Chemistry and Biology Garland Science. (Taylor & Francis Group), 2003.

3. M.C.Gupta. Statistical Thermodynamics. Wiley Eastern Ltd., New Delhi, 1993 4. T.Engel and P.Reid. Thermodynamics, Statistical Thermodynamics & Kinetics, Pearson Education , Inc.

2006. 5. H.B.Callen. Thermodynamics. John Wiley and Sons, New York 1960. 6. H.Goldstein, C.P.Poole and J.Safko. Classical Mechanics. Pearson Education, Inc. 2011. 7. J.P.Holman. Heat transfer. Tata McGraw Hill, New Delhi, 2008. 8. F.Reif Fundamentals of Statistical and Thermal Physics. McGraw Hill, 1995. 9. N.C.Rana and P.S.Joag. Classical Mechanics.Tata McGraw Hill, New Delhi,2008.


M.E (MATERIAL SCIENCE & ENGINEERING) REGULATIONS 2010

2

UNIVERSITY EXAM QUESTION PAPER PATTERN

Max. Marks: 80 Exam Duration: 3 hrs.

Part A: 6 Questions of 5 marks each – No choice 30 marks

Part B: 2 Questions from each unit of internal choice, each carrying 10 marks. 50 marks

MSEC02

PRINCIPLES OF MATERIALS ENGINEERING

L T P C

3 1 0 4

( 48 hours) Unit I Introduction : Solid Engineering Materials- their classification and characteristic properties. Structure of solids: crystal systems/lattices, crystal structure, crystallographic planes and directions, interstitial sites, crystallinity in metals, ceramics, semiconductors and polymers. Microstructures and metallography. amorphous or glassy state. Properties of materials: Definition, units and common tests conducted to evaluate important engineering properties like physical, mechanical, chemical, electrical, magnetic, semi/super-conducting, optical, and thermal properties in engineering materials Unit II Solidification of pure metal : homogeneous and heterogeneous nucleation processes, cooling curve, concept of supercooling microstructure of pure metals. Defects in solids – point, line, planar and volume. Fundamentals of plastic deformation of metals, deformation by slip and twin, plastic deformation in polycrystalline metals, concept of cold working, preferred orientation. Annealing: Recovery, recrystallization and grain growth, hot working. Unit III Concept of formation of alloys : Types of alloys, solid solutions, factors affecting solid solubility,. Binary phase diagrams: isomorphous, eutectic, peritectic, eutectoid and peritectoid systems, effect of non equilibrium cooling, coring and homogenization. Phase diagrams and kinetics -Iron-carbon diagrams. Microstructure, and properties of different alloys in steel and cast iron, types of cast iron, their microstructures and typical uses. Heat treatment: T-T-T and C-C-T diagrams, concept of heat treatments of steel annealing, normalizing, hardening and tempering; Effect of common alloying elements in steel, Concept of hardenability, and strengthening mechanisms Common alloy steels, stainless steel, tool steel, high speed steel, high strength low alloy steel, microalloyed steel, specifications of steels. Physical metallurgy of common non-ferrous alloys: Cu-,Al- and Ni- based alloys. Microstructures and heat treatment of common alloys of these systems. Unit IV Phase transformations : Types of phase changes, Fick‟s laws of diffusion in solids, the Kirkendall effect, Nucleation and growth, solidification, pearlitic transformations, martensitic transformations – kinetics of transformation, precipitation and age hardening. Unit V Mechanical properties : Factors affecting mechanical properties, mechanical tests, tensile, hardness, impact, creep and fatigue, Plastic deformation by slip, shear strength, work hardening and recovery, fracture, Griffith's theory, slip and twinning, creep resistant materials diffusion – Fick‟s law.



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Reference Books 1) F.H Norton, Elements of Ceramics, Addison-Wesley Press (1974)

2) M.W. Barsoum, Fundamentals of Ceramics, McGraw-Hill (2003)

3) Smallman R. E., „Modern Physical Metallurgy‟, 4th Edition, Butterworths, 1985

4) Avner, S. H., “Introduction to Physical Metallurgy”, second edition, McGraw Hill, 1985.

5) Raghavan, V., “Physical Metallurgy”, Prentice Hall of India, 1985





MSEC03

FUNDAMENTALS OF NANOSCIENCE AND NANOTECHNOLOGY

L T P C

3 0 0 3

(48 hours )

Unit I

Introduction to nanotechnology basics : Definition, History of nanotechnology. Nanotechnology in relation to other branches of science. Structure of solids crystalline and non-crystalline. Types of common materials and advanced materials inorganics, organics, biological. Types of nanomaterials depending upon their properties, semiconductors, superconductors, superionic, magnetic, optic, opto-electronics, spintronics, lasers, photonics, ceramics, bioceramics, biomedical, biosensors, bioimagers, photocatalysts, quantum dots. Unit II

Size effect of materials on properties. Quantization effect on the properties of materials with examples. Nanocomposites and their applications in modern technology. Nanotubes carbon nanotubes and other nanotubes. Nanomaterials natural and synthetic. Nanocomposites and Nanohybrid materials. Unit III

Nanomaterials synthesis techniques nanoengineering of materials : Bottom up and Top down routes. Solution, Melt and Gas Processing of nanomaterials. Nature inspired processes. Nanotechnology in modern technology in relation to electronic, biological, consumer and domestic applications. Applied nanobiotechnology and nanobiomedical science drug delivery, drug targeting, biosensors, bioimaging, neutron capture therapy Unit IV

Silicon Processing methods : Clean room classification, Cleaning /Etching, Oxidation, Getttering, Doping, Epitaxy Top down approach to nanolithography, Immersion lithography, UV photolithography, Phase lithography, Including Plasma X-ray sources, E-Beam Lithography, Principle of dip pen lithography, Focused Ion beams, Laser micro/nano patterning.



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Unit V

Semiconductor device roadmap, Silicon insultaor technology, Gate of high K dielectrics, Thermal manufacturing, Beyond CMOS. Applications of nanoparticles, quantum dots, nanotubes and nanowires for nanodevice fabrication, Single electron transistors, coulomb blockade effects in ultra-small metallic tunnel junctions, nanoparticles based solar cells and quantum dots based white LEDs, CNT based transistors. Reference Books

1) Bharath Bhusan, Springer Handbook of Nanotechnology, 3rd edition, Springer-Verlag (2009)

2) CNR Rao and T. Cheetham, Chemistry of Nanomaterials : Synthesis, Properties and Applications, Wiley & Sons

(2005)

3) Hari Singh Nalwa, Encyclopedia of Nanotechnology, American Scientific Publishers (2004)

4) K. Byrappa and M. Yoshimura, Handbook of Hydrothermal Technology, 2nd edition, Elsevier (2012)

5) K. Byrappa and T. Adschiri, Hydrothermal Technology for Nanotechnology, Progress in Crystal Growth and

Characteriation of Materials, Volume 53 (2007) pp.117-166.

6) K. Byrappa and M. Yoshimura (Editors): Special Edition of Journal of Materials Science, Volume 41, No.6 (2006).

7) K. Byrappa and T. Adschiri (Editors), Special Edition of Journal of Materials Science, Volume 43, No.7 (2008).

8) Charles P. Poole Jr. and Franks J. Qwens, Introduction to Nanotechnology, Wiley & sons (2003).





MSEC04

MATERIALS CHARACTERIZATION

L T P Credit

3 0 0 3

(48 hours) Unit-I

Crystal structure and Crystallography, X-ray diffraction : reciprocal lattice, Powder, rotating crystal and Laue methods, accurate lattice parameter measurement, phase identification, crystal structure analysis, qualitative and quantitative phase analysis – indexing - ICDD powder diffraction file – uses. The Rietveld method - Principles and fundamentals - peak shapes – profile fitting - structure refinement: procedures adopted – R factors – auto indexing - structure determination from powder data, residual stress measurement, texture. Unit II Optical and electron imaging techniques, Numerical aperture, limit of resolution, depth of field and depth of focus, lens defects and correction, bright field and dark field illumination, polarised light, phase contrast, interference contrast, hot-stage, in-situ techniques, quantitative metallography, Construction and operation and applications of SEM and FESEM, elemental analysis by WDS and EDS systems, Construction and operation and applications of TEM and high resolution TEM, specimen preparation techniques, Scanning probe microscopy, Working principles and applications of AFM and STM.



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Unit III

Thermal analysis ; TGA, DTA, DSC, dilatometry, (Thermal expansion), Instrumentation, Principles and

applications.

Unit IV

Particle size analysis : surface area measurement, DC polarization, AC impedance and four probe measurements, conductivity measurements, particle size analysis; zeta potential. Unit V

Raman spectroscopy : UV-Visible spectroscopy, Photoluminescence, Positron Annihilation Lifetime Spectroscopy, Auger spectroscopy and X-ray photoelectron spectroscopy. Mechanical properties, Tensile and Fatigue strength, Fracture toughness, Microhardness, and Nanoindentation measurements. Reference Books

1) Smallman R. E., „Modern Physical Metallurgy‟, 4th Edition, Butterworths, 1985

2) Philips V. A., „Modern Metallographic Techniques and their Applications‟, Wiley Interscience, 1971

3) Sam Zhang, Lin Li and Ashok Kumar, Materials Characterization Techniques, CRC Press, (2008) .

4) Cullity B. D., „Elements of X-ray Diffraction‟, 4th Edition, Addison Wiley, 1978

5) Loretto M. H., „Electron Beam Analysis of Materials‟, Chapman and Hall, 1984

6) Yang Leng, Materials Characterization: Introduction to Microscopic and Spectroscopic Methods, Wiley & Sons

(2008).

7) Elton N. Kaufmann, Characterization of Materials, Vol.1, Wiley & Sons (2003).

8) R.A. Laudise, Growth of Single Crystals, Prentice Hall, (1973).

9) G. Dhanaraj, K. Byrappa, V. Prasad and M. Dudley (Eds.), Springer Handbook of Crystal Growth, Springer-Verlag

(2010).

10) Peter E.J. Flewitt and R.K. Wild, Physical Methods of Materials Characterization, 2nd Edition, Taylor & Francis

(2003).





MSEC05

MATERIALS AND CORROSION

L T P Credit

3 0 0 3

(48 hours) Unit I

Basics of Corrosion : Different forms of Corrosion, electrochemical corrosion, thermodynamic principles of electrochemical reactions, Electromotive Force Series, Pourbaix Diagrams, Evans Diagrams, Mixed Potential Theory, Passivity.



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Unit II

Electrochemical methods to Measure Corrosion : DC Polarization, AC Impedance, Environmentally Induced Cracking, Corrosion Fatigue, Hydrogen Induced Cracking, Application of Fracture mechanics. Unit III

Atmospheric Corrosion : Oxidation in Gaseous Environments, Ellingham Diagrams, Role of Protective Scale, Scale growth kinetics and mechanisms, Wagner‟s parabolic scale growth process, other types of kinetic laws and mechanisms, morphological aspects in the growth of thick scales, corrosion product evaporation, analyses of kinetic data, alloy oxidation, kinetics, mechanisms, morphology; binary and ternary alloys in single oxidant and in mixed environments, internal oxidation examples, hot corrosion of metals and alloys-mechanisms and examples. Molten Salt Corrosion, Environmental degradation of ceramics, Degradation of Polymeric Materials, Microbial corrosion, Corrosion of Bio-Implants, Corrosion Prevention methods. Unit IV Coating applications : Abrasive, erosive and sliding wear, The interaction between wear and corrosion, Coating systems for corrosion and wear protection, new coating concepts including multi-layer structures, functionally gradient materials, intermetallic barrier coatings and thermal barrier coatings for corrosion prevention. Unit V

Environmental effects from chemical processes : industry infrastructure and transportation industry Atmospheric Corrosion, Corrosion in Automobiles, Corrosion in Soils, Corrosion of Steel in Concrete, Corrosion in Water, Microbiologically Induced Corrosion, Corrosion in the Body, Corrosion in the Petroleum Industry, Corrosion in the Aircraft Industry, Corrosion in the Microelectronics,. References

1) D. A. Jones: Principles and Prevention of Corrosion, Macmillan Publ. Co. (1996). 2) C. Scully: The Fundamental of Corrosion, 2nd ed., Pergamon Press: E. E.Stansbury and R. A. Buchanan,

Fundamentals of Electrochemical Corrosion, ASM International (2000) 3) M.G. Fontana: Corrosion Engineering, 3rd. Ed., McGraw Hill. (1986) 4) J. M. West: Electrodeposition and Corrosion Control, J. Wiley W. Revie (ed.): Corrosion Handbook,

Electrochemical Society Series, John Wiley and Sons (2000). 5) W. Revie (ed.): Corrosion Handbook, Electrochemical Society Series, John Wiley and Sons, 2000: Metals

Handbook, Vol. 13: Corrosion, ASM International 6) D.A.Jones. Principles and Prevention of Corrosion. Macmillan Publishing Co., 1995. 7) J.O.M.Bockris, B.E.Conway, E.Yeager and White. Electrochemical Materials Science in Comprehensive

Treatise of Electrochemistry, Volume 4. Plenum press, 2001. 8) M.G.Fontanna and N.D.Greene. Corrosion Engineering, McGraw-Hill publishing, 1978. 9) I.M.Hutchings. Tribology: Friction and Wear of Engineering Materials. CRC press, Boca Raton, 1992. 10) D.O. Sprowds. Corrosion Testing and Evaluation. Corrosion Metals Hand book, Vol. 13, 1986.







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MSEC06

SURFACE ENGINEERING

L T P Credit

3 0 0 3

(48 hours) Unit I

High vacuum production and measurement : Mechanical pumps, Diffusion pump, turbomolecular pumps, production of ultra high vacuum, thin film vacuum coating unit, substrate cleaning, Thermocouple gauges- pirani, Penning Hot ionization gauges, Capacitance gauges, Basic principles.

Unit II

Surface engineering : classification, Physical methods, thermal evaporation, vapour sources, Wire, crucible and electron beam gun, sputtering mechanism and DC&RF magnetron methods, Pulsed laser deposition (PLD),CVD,), Chemical methods, chemical vapour deposition (CVD)and chemical solution deposition techniques, Plasma enhanced CVD, spray pyrolysis, spin coating. Thickness measurement by Multiple beam interference, quartz crystal, ellipsometric, stylus techniques. Calowear. Growth and structure of films, General features, Nucleation theories, Post-nucleation growth, Thin film structures, Structural defects. Unit III Biological synthesis ; Electrochemistry, Multi-energy processing, Mechano-Chemical, Sono-Chemical, Photo-Chemical and Bio-Chemical.

Unit IV

Surface treatment processes : Necessity for surface modification surface cladding, surface alloying, hard facing, shock hardening, conventional methods, carburizing, nitriding, cyaniding, advantages of laser surface treatment over conventional methods, typical laser variables used in surface alloying, laser cladding- experimental set up. Unit V Applications of thin films and Coatings ; Optical - reflection and anti-reflection coatings, interference filters, thin film solar cells, electrophotography, Electrical and dielectric behaviour of thin films, components, thin film diode and transistor, strain gauges and gas sensors, Anisotropy in magnetic films, domains in films, computer memories, superconducting thin films, SQUID, mechanical properties, testing methods, adhesion, surface and tribological coatings.

REFERENCES

1. M. Ohring. The Materials Science of Thin Films. Academic Press, 2001. 2. D. L.Smith. Thin-Film Deposition: Principles and Practice. McGraw-Hill, 1995. 3. K.L. Chopra, Thin Film Phenomena, McGraw-Hill, 1969. 4. K.L. Chopra and I.J. Kaur, Thin Film Device Applications, Plenum Press, London, 1983.

5. L.I. Maissel and R. Glang (Eds.), Handbook of Thin film Technology, McGraw- Hill, 1970. 6. R.W. Berry, P.M. Hall and M.T. Harris, Thin Film Technology, Von Nostrand,1968. 7. George Hass, Physics of Thin Films: Volumes 1 -12, Academic Press



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MSEC07

ADVANCED METALLIC MATERIALS AND PROCESSES

L T P Credit

4 0 0 4

( 48 hours) Unit I Advanced Al Alloys : High temperature and high strength Al alloys such as Al-Fe-V-Si, nanocrystalline Al alloys, etc., Ti based Alloys, Advances in Ti based Alloys, Unit II Superalloys and intermetallics : Ni base and Co base superalloys, Shape Memory Alloys, physical metallurgy, properties, etc. Advanced Composites, nanocomposites, etc., Aluminides, Silicides, borides, Nitrides and Carbides. Synthesis, Structure and Properties. Unit III Amorphous Materials ; Metallic glasses, Glass forming ability, Thermodynamics and kinetics of glass formation, Bulk Metallic Glasses, Properties, Quasicrystalline Materials, Structure, Synthesis, Properties; Unit V

Fundamental analysis of Manufacturing processes, casting, casting processes, forging, methods of forging, extrusion, rolling, spinning, turning, and shaping, milling, grinding. Production of powders, powder mixing, compacting, types of presses, sintering, soaking, finishing process, limitations and advantages of powder metallurgy and applications. Unit V Advanced Processes : Rapid solidification processing, Laser surface Modification, plasma processing of materials, plasma nitriding, carburizing, Mechanical Alloying, Rapid prototyping, Self propagating High temperature synthesis, inert gas condensation etc.

REFERENCES

1) M.K.Muralidhara. Materials Science and Processes. Dhanpat Rai Publishing Co., New Delhi, 1998.

2) R.B.Gupta. Materials Science and Processes. Satya Prakashan, New Delhi, 1995

3) M.Steen William. Laser Material Processing. Springer, 2008

4) W.T.Rhodes, W.R.Callen and D.C.O‟Shea. An Introduction to Lasers and their Applications. Addison Wesley

Professional, 1977.

5) V.Raghavan, Materials Science and Engineering: A first Course. PHI Learning,2009.

6) S.O.Kasap. Principles of Electronic Materials and Devices. Tata McGraw-Hill,New Delhi, 2007.



9

7) C.Suryanarayana and A.Inoue. Bulk Metallic Glasses, CRC Press, 2011.

8) K.Otsuka and C.M.Wayman. Shape Memory Materials, Cambridge University Press, 1





MSEC08

MATERIALS FOR ENERGY

L T P Credit

4 0 0 4

(48hours)

Unit I Approach to the challenge of energy-efficient technology : concept of materials energy content (production, processing, use and recycling, introduction to conventional and renewable forms of energy, solar cells, nuclear materials, hard materials for oil/gas recovery, composites for wind energy, thermoelectrics. Energy transformation (e.g., fuel cells, light emitting diodes, engines and turbines) and energy storage (e.g., hydrogen storage, phase change materials). Finally, materials enabling energy-efficient transportation and housing will be discussed. Unit II

Solar Photo Voltaic (PV) cells : Single and multi-crystalline silicon solar cells, amorphous silicon, thin film; Cd-Te, CIGS, CZTS, nano, micro, poly-Si. Transparent conducting coating, Multi-junction, solar PV concentrator, flexible solar cells, Emerging PV; dye sensitized, other organic, and quantum dot cells. Nano-engineered materials. Unit III

Materials for Concentrated Solar Power (CSP) : Reflector materials, glass, metal, polymer and film, Receiver and collectors; absorptive coating and anti-reflective coating. Materials and shapes for thermal storage, Lithium ion Batteries. Unit IV

Fuel cells ; materials and construction; PEM Fuel Cell (FC), AFC, PAFC, MCFC, SOFC. Catalysts for electro catalysis, fuel reformer and water splitting. Unit V Nuclear Materials ; Types of fission-distribution of fission products, fissile and fertile materials, neutron emission in fission, spontaneous fission, Bohr, Wheeler theory, chain reaction, four factor formula, criticality condition, materials for fuels, moderator, coolants, and shielding.



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Reference Books 1) Vielstich, W., et al. (eds.) (2009). Handbook of fuel cells: advances in electrocatalysis, materials, diagnostics and

durability. 6 vol. Hoboken: Wiley, 2009

2) Francis de Winter, Solar Collectors, Energy Storage, and Materials (Solar Heat Technologies), MIT Press, USA (1991)

3) David S. Ginley, David Cahen, Fundamentals of Materials for Energy and Environmental Sustainability, Cambridge

University Press (2011)

4) Materials, Electronics, and Renewable Energy Part III Physics, Small lecture theatre, Cavendish Laboratory lecturers:

David MacKay and Neil Greenham

5) Fuel Cell Handbook,

6) Introduction to Fuel Cell Technology

7) Evans, Atomic Physics, Tata McGraw Hill, New Delhi, 1986.

8) S.Glasstone. Principles of Nuclear Reactor Engineering. Van Nostrand Co, Inc., New York, 1985.

9) R.R.Roy and B.P.Nigam. Nuclear Physics. Wiley Easter, New Delhi, 1985.

10) D.S.Tayal. Nuclear Physics. Himalaya Publishers, Bombay, 1998





MSEC09

POLYMERS AND COMPOSITES

L T P Credit

3 0 0 3

(48hours) Unit I

Classification of polymers : copolymers, tacticity, geometric isomerism, molecular weight distribution and averages, Measurement of molecular weight, synthesis of polymers, step growth polymerization, chain growth polymerization, polymerization techniques, Polymer conformation and chain dimensions, Freely jointed chains-Gaussian model, introduction to rubber elasticity amorphous state, glass transition temperature, the crystalline state, ordering of polymer chains, crystalline melting temperature, techniques to determine crystallinity. Unit II

Mechanical properties ; Introduction to viscoelasticity, dynamic mechanical analysis, mechanical models of viscoelastic behavior, Boltzmann superposition principle. Unit III

Basic processing operations : extrusion, molding, calendaring, coating, Introduction to polymer rheology, non-Newtonian flow, analysis of simple flows, rheometry, capillary rheometer, Couette rheometer, cone and plate rheomete, applications, conducting polymers, biopolymers, liquid crystal polymers, photonic polymers, high temperature polymers.



11

Unit IV

Types of composite materials : the concept of load transfer, matrix materials, polymers, metals and ceramics, fibers, glass, boron, carbon, organic and metallic fibers, fiber packing arrangements, particle reinforced composites, fibre reinforced composites, interface region bonding mechanisms, mechanical behavior of composites. Unit V

Processing : Thermoplastic, Thermosets, etc., Types of methods, Processing conditions, advantages and disadvantages, Polymer matrix composites, liquid resin impregnation routes, pressurized consolidation of resin pre-pregs, consolidation of resin moulding compounds, injection moulding of thermoplastics, hot press moulding of thermoplastics, metal composites, squeeze infiltration, stir casting, spray deposition, powder blending and consolidation, diffusion bonding of foils, physical vapour deposition, ceramic composites, powder based routes, reactive processing, layered ceramic composites, carbon/carbon composites, Application of Composites, Aerospace, Transport, marine, Structural, Chemical and Corrosion resistant products, sports, electrical, Electronic, Communication, Biomedical Applications, Repairs and maintenance, etc., Nanocomposites, Types, preparation, characterization and applications. REFERENCE BOOKS

1) Joel R.Fried, Polymer Science and Technology, Phi Learning Pvt. Ltd., 2009.

2) V.R. Gowarikar, N.V.Viswanathan & J.Sreedhar, Polymer Science, New Age International, 2011.

3) R.J.C.Crawford, Plastics Engineering, Butterworth-Heinemann, 1998.

4) D.Hull & T.W.Clyne, An Introduction to Composite Materials, Cambridge University Press, 2008.

5) K.K.Chawla, Composite Materials: Science and Engineering, Springer-Verlag, New York, 2010.

6) P.K.Mallick, Fiber-Reinforced Composites: Materials, Manufacturing and Design, CRC Press, Boca Raton, 2008.

7) Handbook of Composites by G. Lubin, Van Nostrand, New York, 1982.

8) Polymers and Polymer Composites in Construction L.C. Holleway,1990

9) Engineering plastics and Composites by John C.Bittence,1990

10) Handbook of Plastics, Elastomers and Composites by Charles A Harper,1975

11) Hand Book of Plastics Testing Technology Vishu Shah, John Wiley & Sons, Inc NY. (1998)







12

MSEC10

CERAMICS AND BIOMATERIALS

L T P Credit

3 0 0 3

(48 hours) Unit I

Definition & scope of ceramic materials : Examples of ceramic crystals, short-range and long-range order, imperfections, polymorphism. Ceramic Binary and ternary systems, ceramic microstructures. Crystallization of glass and glass-ceramics. Thermal, electrical, magnetic and optical properties of ceramics and application. Classification of ceramic materials conventional and advanced, Areas of applications. Unit II

Conventional Ceramics and processes : Refractories, Classification of Refractories, manufacturing process technology, Flow diagram of steps necessary for manufacture, Whitewares, Classification and type of Whitewares, Elementary idea of manufacturing process technology including body preparation, basic properties and application areas. Ceramic Coatings, Types of glazes and enamels, Process of enameling & glazing and their properties. Glass, Definition of glass, glass manufacturing process, Different types of glasses, Application of glasses. Cement & Concrete, Manufacturing process, Compound formation, setting and hardening. Tests of cement and concrete. Raw materials clays and their classification, Quartz, Polymorphism of quartz, Feldspar and its classification, Talc, Steatite and Mica. Fabrication methods, Packing of Powders, Unit III Classification and scope of various fabrication methods, Dry and semi dry pressing, Extrusion, Jiggering & jollying, Slip casting HP & HIP. Drying & Firing of ceramics: fast firing technology, action of heat on triaxial body, Elementary ideas of various furnaces used is ceramic industries. Theoretical and empirical models for powder packing and compaction including disctete element modelling (DEM). Sintering mechanisms (metal, ceramics, influence of the microstructure, simulation) Unit IV Introduction : Natural biological materials: structure and properties (bone, skin and other elastic tissues). Biocompatibility: tissue response to biomaterials; corrosion. Testing of biomaterials: Metallic materials in medical application: Stainless steel, cobalt based alloys, titanium based alloys (including shape memory alloys). Ceramics and glasses-bioceramics: nearly inert ceramics, bio-reactive glasses and glass ceramics, porous ceramics; Calcium phosphate ceramics: grafts, coatings Physico-chemical surface modification of materials used in medicine. Composites, reinforcing systems, fabrication, mechanical properties, absorbable matrix composites, non-absorbable matrix composites, Implants: internal fracture fixation. joint replacement, shape memory alloys. inflammatory process, coagulation and hemolysis, approaches to thrombo resistant materials development. UNIT V Orthopaedic materials - Bone composition and properties, temporary fixation devices, joint replacement, biomaterials used in bone and joint replacement: metals and alloys, ceramics, bioactive calcium phosphates, bioglass and glass ceramics, polymers- PMMA, UHMWPE/HDPE, PTFE, bone cement, composites. Cardiovascular materials, the heart, aorta and valves, geometry of blood circulation vascular implants, vascular graft, cardiac valve prostheses, cardiac pacemakers, blood substitutes, extracorporeal blood circulation devices. Dental materials- Teeth composition and mechanical properties, impression materials, bases, liners and varnishes for cavities, fillings and restoration materials, materials for oral and maxillofacial



13

surgery, dental cements and dental amalgams, dental adhesives. Biomaterials in ophthalmology, viscoelastic solutions, contact lenses, intraocular lens materials, tissue grafts, skin grafts, connective tissue grafts, suture materials, tissue adhesives, drug delivery, methods and materials, selection, performance and adhesion of polymeric encapsulants for implantable sensors REFERENCE BOOKS

1) F.H Norton, Elements of Ceramics, Addison-Wesley Press (1974) 2) M.W. Barsoum, Fundamentals of Ceramics, McGraw-Hill (2003) 3) W.D Kingery, Introduction to Ceramics, Wiley & Sons (1976). 4) Lawrence H. Van Vlack, Physical Ceramics for Engineers, Addison-Wesley Publishing (1964). 5) F. Singer and S.J. Singer, Industrial Ceramics, Chapman & Hall, UK (1963) 6) S. V. Bhat. Biomaterials, Narosa Publication House, New Delhi, 2010. 7) J.Park & R.S.Lakes. Biomaterials: An Introduction. Springer, 2007. 8) J. Black. Biological Performance of Materials: Fundamentals of Biocompatibility, Marcel Dekker Inc, New

York, 1992. 9) D.F.Williams (editor). Materials Science and Technology: A Comprehensive treatment, Volume 14.

Medical and Dental Materials, VCH Publishers Inc, New York, 1992. 10) L.L.Hench and E.C.Ethridge. Biomaterials: An Interfacial Approach, Academic Press, 1982.





ELECTIVE SUBJECTS

MSEE01

PHYSICS OF MATERIALS

L T P Credit

3 0 0 3

( 45 hours ) Unit I

Quantum mechanics ; Applications to materials and engineering, Band structures and cohesive energy, thermal behavior, electrical conduction, semiconductors, amorphous semiconductors, magnetic behavior of materials, liquid crystals. Quantum Theory, Schrödinger Equation, One-Dimensional Time-Independent Potentials, Three-Dimensional Time-Independent Potentials, Hydrogen Atom and Periodic Table, Bonding, Quantum Statistical Mechanics, Free Electron Theory of Metals, Beyond the Free Electron Theory of Metals, Band Theory of Solids, Unit II

Energy band diagrams, nature of chemical bonds and their relation to crystal structure of semiconductors - elemental and compound semiconductors. Band gap, Fermi level carrier mobility and scattering; temperature dependent conductivity - intrinsic and extrinsic (doped) semiconductors; preparation and doping techniques of elemental and compound semiconductors and their characterization; narrow and wide band gap



14

semiconductors; Hall Effect, thermo-electric, magnetic and optical properties; different types of semiconductors and their application in commercial devices: Ge, Si, GaAs, InP, PbS, HgxCd1-xTe. Unit III

Physical properties of materials Conductivity : specific heat, Heat capacity, Mechanical properties, yield strength, tensile strength, ductility, fatique, creep, fracture, Optical, Magnetic, Electronic, Semiconducting, Superconducting, Thermal, Electro-optic, Thermo-optic, Superionic, insulator properties of materials.

Unit IV

Physical properties of nanomaterials, particle size, particle shape, melting point, surface tension, wettability, specific surface area and pore size, Reason for change in optical properties, electrical properties, and mechanical properties. Unit V

Principles: Models and phenomena underlying semiconductor processing, topics to be covered include defects, diffusion, ion implantation, epitaxy, thermal oxidation, plasma processing, thin films, semi conductor devices, very-large-scale integration (VLSI) processes and nanoelectronic devices. REFERENCES

1. Pillai, Solid State Physics, Narosa Publication, India (2007) 2. J.I. Gersten and F.W. Smith, The Physics and Chemistry of Materials, Wiley & Sons (2001). 3. M.A.Wahab. Solid State Physics: Structure and Properties of Materials. Narosa Book Distributors Pvt.

Ltd., 2009. 4. S.L.Gupta and V.Kumar. Solid State Physics. K.Nath & Co.,1995. 5. M.Ali Omar. Elementary Solid State Physics. Pearson Education, 2002. 6. M.S.Rogalski and S.B.Palmer. Solid State Physics. Gordon Breach Science Publishers, 2000. 7. N.W.Ashcroft and N.D.Mermin. Solid State Physics, Cengage Learning, 2003. 8. A.J Dekker. Solid State Physics. Macmillan, 2000. 9. Navrotsky, Physics and Chemistry of Earth Materials, 6th Edition, (1995) Cambridge Series. 10. Nanomaterials Synthesis, properties and applications”, Editor:- A.S Edelstein, IOP Publishing, UK (1996). 11. “Hand book of Nanostructured Materials and Technology‟‟, Vol.1-5, Editor:- Hari Singh Nalwa; Academic Press,

USA (2000).







15

MSEE02

PROPERTIES OF MATERIALS

L T P Credit

3 0 0 3

(48 hours) UNIT I Mechanical Properties : Factors affecting mechanical properties, mechanical tests, tensile, hardness, impact, creep and fatigue, Plastic deformation by slip, shear strength, work hardening and recovery, fracture, Griffith's theory, slip and twinning, creep resistant materials, diffusion – Fick‟s law. UNIT II Dielectric Properties : Dielectric constant and polarizability, different kinds of polarization, Internal electric field in a dielectric, Clausius, Mossatti equation, dielectric in a ac field, dielectric loss, ferroelectric, types and models of ferro electric transition, electrets and their applications, piezoelectric and pyroelectric materials. UNIT III Magnetic Properties : Classification dia, para, ferro, antiferro and ferrimagnetism, Langevin and Weiss theories, exchange interaction, magnetic aniostrophy, magnetic domains, molecular theory, hysterisis, hard and soft magnetic materials, ferrite structure and uses, magnetic bubbles, magnetoresistance, GMR materials, dilute magnetic semiconductor (DMS) materials. UNIT IV Optical Properties : Optical absorption in insulators, semiconductors and metals, band to band absorption, luminescence, photoconductivity. Injection luminescence and LEDs, LED materials, superluminescent LED materials, liquid crystals, properties and structure, liquid crystal displays, comparison between LED and LC displays. UNIT V Thermal properties : Electron transport, electrical conductivity, specific heat, heat capacity, diffusion and laws of diffusion, Concept of solid state ionics, Importance of super-ionic materials and structures, Classification of Superionic solids, Experimental probes pertaining to solid state ionics, Theoretical models of fast ion transport, Applications of fast ionic solids, Hydrogen storage materials, Nano -ionic materials.

REFERENCES:

1. V.Raghavan, Materials Science and Engineering: A first Course. PHI Learning,2009.

2. S.O.Kasap. Principles of Electronic Materials and Devices. Tata McGraw-Hill, New Delhi, 2007.

3. C.Suryanarayana and A.Inoue. Bulk Metallic Glasses, CRC Press, 2011.

4. K.Otsuka and C.M.Wayman. Shape Memory Materials, Cambridge University Press, 1998.



16





MSEE03

CHEMICAL SYNTHESIS OF MATERIALS

L T P Credit

3 0 0 3

( 45 hours ) Unit I

Nanomaterials : Defining nanodimensional materials, Size effects in Nanomaterials, Application and technology development, Supramolecular machines, Fundamentals of energy transfer and photon motion manipulation, Solar energy harvesting, Fundamentals of electron motion manipulation, Electron pumping and molecular wires, General methods available for the synthesis of nanomaterials, Manipulation o Nanopartices, Nanofabrication, Methods, Bottom up methods, Photolithography, Scanning probe methods, Soft lithography, Biosynthesis, Recombinant DNA, Solid phase synthesis of peptides and nucleic acids, vapor phase synthesis (electronic materials) Gas phase reactions , Chemical vapor deposition, Molecular beam epitaxy Unit II

Fundamentals of molecular : self-assembly, Self-assembling monolayers, The nanoscale and colloidal systems, Supramolecular self-assembly, Gels, 3D self-assembly, Fundamentals of Surface and interfacial chemistry, Surface tension and Wettability, Insoluble monolayers, Surface Chemistry and monolayers, Electrostatic interactions in self assembling systems, Self-Assemble of amphiphiles, Monolayers, Micelles and microemulsions, the Structure and properties of Micelles

Unit III

Gelation, Classes of gels: physical gels, chemical gels, Theory of Gelation. Hydrogels: Types of hydrogels, Application of hydrogels, Formation of hydrogels, Processing of hydrogels, Types of colloids and their formation, Forces between colloidal particles. Assembly and phase behavior, Charges and stabilization, Kinetics, Defects in assembly, Approaches to control long range order. Characterization. Applications of colloids, especially in photonics and optoelectronics.

Unit IV

Polymers : polymerization: Polycondensations, Addition chain growth, Copolymerization . Living polymerizations, Hyperbranching The interaction of polymers with surfaces, Polyelectrolyte multilayer assemblies, The application of electrostatic self-assembly to construct multilayers, Fabrication methods including self assembly.



17

Unit V

Functionalization and applications of Nanomaterials : Chemical functionalization, Recent advances in Thiol-Au and Silane Chemistry, Layer-by-Layer synthesis of multilayer assemblies Applications, Quantum dots, nanocores and applications, Detailed description of the fabrication of functinalised Gold Nanocores and their application in cancer therapy. References

1. The chemistry of nanomaterials Volume 1, Synthesis, Properties and Applications: Edited by CNR Rao, A Muller, A K Cheetham; (2005) John-Wiley and Sons, Inc, ISBN:3-527- 30686-2

2. The chemistry of nanomaterials Volume 2, Synthesis, Properties and Applications: Edited by CNR Rao, A Muller, A K Cheetham; (2005) John-Wiley and Sons, Inc, ISBN:3-527- 30686-2





MSEE04 MECHANICAL AND HIGH TEMPERATURE BEHAVIOUR OF MATERIALS

L T P Credit

3 0 0 3

( 45 hours )

Unit I Factors influencing functional life of components at elevated temperatures, definition of creep curve, various stages of creep, metallurgical factors influencing various stages, effect of stress, temperature and strain rate, Design of transient creep, time hardening, strain hardening, expressions for rupture life for creep. Unit II Ductile and brittle materials, Monkman - Grant relationship, Various types of fracture, brittle to ductile from low temperature to high temperature, cleavage, ductile fracture due to microvoid coalescence - diffusion controlled void growth, fracture maps for different alloys and oxides. Unit III Strengthening mechanisms, solid solution, strengthening, precipitation hardening by gamma prime, grain boundary strengthening, TCP phase - embrittlement, solidification of single crystals. Unit IV

Fatigue: Stress cycles, S-N curves, Effect of mean stress, Factors affecting Fatigue, Structural changes accompanying fatigue, Cumulative damage, HCF / LCF, thermomechanical fatigue, application of fracture mechanics to fatigue crack propagation, fatigue testing machines- Pari‟s Equation, Residual life prediction under Fatigue.



18

Unit V

Oxidation, Pilling-Bedworth ratio, kinetic laws of oxidation - defect structure and control of oxidation by alloy additions - sulphation, hot gas corrosion deposit, modified hot gas corrosion, effect of alloying elements on hot corrosion, Iron base, nickel base and cobalt base superalloys, composition control.

References 1. Courtney T.H, „Mechanical Behaviour of Materials‟, McGraw Hill, 1990 2. Raj R, „Flow and Fracture at Elevated Temperatures‟, American Society for Metals, 1985 3. Hertzberg R. W, „Deformation and Fracture Mechanics of Engineering Materials‟, 4th 4. Edition, John Wiley, 1996. 5. Dieter, G. E., “Mechanical Metallurgy”, McGraw-Hill Co., SI Edition, 1995. 6. Davis, H. E., Troxell G. E. and Hauck, G. E. W., “The Testing of Engineering Materials”, McGraw-Hill, 1982. 7. Wulff, “The Structure and Properties of Materials, Vol. III - Mechanical Behaviour of Materials”, John Wiley and

Sons, New York, USA, 1983. 8. Honeycombe R. W. K., “Plastic Deformation of Materials”, Edward Arnold Publishers, 1984. 9. Suryanarayana, A. V. K., “Testing of Metallic Materials”, Prentice Hall India, New Delhi, 1979. 10. Prashant Kumar, “Elements of Fracture Mechanics”, McGraw-Hilll, 2009.





MSEE05

NUMERICAL METHODS FOR MATERIALS

SCIENCE

L T P Credit

3 0 0 3

( 45 hours )

UNIT I

MATLAB/SCILAB PROGRAMMING : Overview of Matlab, data types and variables, operators, flow control, functions, input-output, array manipulation, writing and running programs, plotting, overview of simulink environment. UNIT II

System of equations Linear equations : Introduction, linear systems, Gaussian elimination, singular systems, Jacobi iteration, Gauss-Seidel iteration, Nonlinear equations, Introduction, bisection method, rule



19

of false position, Secant method, Newton-Raphson method, Comparison of methods for a single equation, Seidel and Newton‟s methods for systems of nonlinear equations. UNIT III

INTERPOLATION & CURVE FITTING AND ERROR ANALYSIS : Polynomial interpolation theory, Newton's forward and backward interpolation formulae, Lagrange's method, Lagrange's inverse interpolation, piecewise linear interpolation, interpolation with cubic spline, least-squares line, curve fitting, Fourier series and trigonometric polynomials. UNIT IV

NUMERICAL DIFFERENTIATION AND INTEGRATION : Numerical differentiation, Finite difference approximations, Richardson extrapolation, derivatives by interpolation, Numerical integration, introduction to quadrature, composite Trapezoidal and Simpson‟s rule, recursive rules and Romberg integration, Gaussian integration. UNIT V DIFFERENTIAL EQUATIONS SOLVING AND STATISTICS : Initial value problems, Euler method, Taylor series method, Runge-Kutta methods, stability and stiffness, adaptive Runge-Kutta method, Predictor- corrector method, system of differential equations, phase-plane analysis, chaotic differential equations, Boundary value problems, finite difference method, Statistics, random variable, frequency distribution, expected value, average and mean, variance and standard deviation, covariance and correlation. Generating random numbers, Monte Carlo integration, Finite difference scheme for elliptic, parabolic, and hyperbolic partial differential equations. Introduction to Finite Element Method, Rules for forming interpolation functions, Shape functions, Application to fluid flow and heat transfer problems. REFERENCES 1. A. Kharab and R.B. Guenther. An Introduction to Numerical Methods: A MATLAB Approach. CRC Press, Boca Raton,

2012. 2. J. H. Mathews and K. D. Fink. Numerical Methods using MATLAB. Pearson, New Delhi, 2006. 3. C. Woodford and C. Phillips. Numerical Methods with worked examples: MATLAB edition. Springer, Berlin, 1997.

4. M.K.Venkatraman, Numerical Methods in Science and Engineering. National Publishing Company, Madras, 1997. 5. S.S.Sastry. Introductory Methods of Numerical Analysis. Prentice Hall of India, New Delhi, 1992. 6. Elsegolts, L., Differential Equations and the Calculus of Variations, Mir Publishers. 7. Grewal, B.S., Higher Engineering Mathematics, Khanna Publishers.







20

MSEE06

METALLURGICAL PROCESSING

L T P Credit

3 0 0 3

( 45 hours ) UNIT I

Basic manufacturing processes : Fundamental analysis of Manufacturing processes, casting, casting processes, forging, methods of forging, extrusion, rolling, spinning, turning, planning and shaping, milling, grinding. UNIT II Surface treatment processes : Necessity for surface modification, surface cladding, surface alloying, hard facing, shock hardening, conventional methods, carburising, nitriding, cyaniding, advantages of laser surface treatment over conventional methods, typical laser variables used in surface alloying, laser cladding, experimental set up. UNIT III Welding processes : Various processes of welding, fusion welding, pressure welding, oxyacetelene welding, resistance welding, spot welding, thermit welding, projection welding, seam welding, butt welding, thermal effects of welding, effects on grain size and microstructure, internal stresses effect, corrosion effect, high energy beam welding, laser beam and electron beam welding, key hole effect. UNIT IV Mechanical working of metals : Hot working, cold working, normalising, full annealing, tempering, theory of tempering, effect of tempering temperature on mechanical properties of carbon steels, different tempering process, deformation of metals, elastic deformation, plastic deformation, slip, twinning. UNIT V Powder metallurgical process : Production of powders, powder mixing, compacting, types of presses, sintering, soaking, finishing process, limitations and advantages of powder metallurgy, applications , production of cemented carbide cutting tools, self lubricating bearings, magnets, cermets, ultrasonic ceramic transducers.

REFERENCES

1. T.V.Rajan, C.P.Sharma and A. Sharma. Heat treatment-Principles and Techniques. Prentice Hall of India Pvt. Ltd. New Delhi, 1995.

2. M.K.Muralidhara. Materials Science and Processes. Dhanpat Rai Publishing Co., New Delhi, 1998. 3. Rykalin, Uglov A, Kokona, A Laser and Electron beam material processing hand book, MIR Publishers, 1987.

4. R.B.Gupta. Materials Science and Processes. Satya Prakashan, New Delhi, 1995.



21





MSEE07

TECHNOLOGY OF SEMICONDUCTORS

L T P Credit

3 0 0 3

( 45 hours ) Unit I Introduction, metals, insulators and semiconductors - crystal structure and bonding, concepts of electron energy bands and electrical conductivity; classification of semiconductors, narrow and wide band-gap semiconductors, quantum well lasers, current transport and electronic properties of interfaces-effect of alloying, UNIT II Unipolar devices: Metal-Semiconductor contacts - Energy - Band Relation - Schottky Effect - Characterization of Barrier Height - Device Structure - Ohmic Contact - JFET and MESFET - basic device characteristic - general characteristic - Microwave performance - related field-effect devices - MIS diode - Si-SiO2 MOS diode - Charge-Coupled Device - MOSFET - basic device characteristic – Non-uniform doping and buried-channel devices - short-channel effect - MOSFET Structures - Nonvolatile memory devices. Bipolar transistor - Static characteristics - microwave transistor - power transistor - switching transistor - related device structures - Thyristors - basic characteristics - Schottky diode - Three terminal thyristor - related power thyristor - Unijunction transistor and trigger thyristor - Field-controlled thyristor. Unit III Fundamental principles (nucleation and growth, diffusion and mass transport) and techniques of processing semiconductor devices and heterostructures - nucleation and growth of thin films, modern epitaxial methods, structure of interfaces, types of defects, thin film deposition methods, ion implantation, rapid thermal processing, fundamentals of microfabrication, etc. Unit IV Deposition, Epitaxy and Chemical Vapour Deposition. Thermodynamics and other theoretical aspects, Metal Organic Vapour Phase Epitaxy – Principles and process design. Metal organic source molecules, Kinetics Liquid Phase Epitaxy, Chloride Based Epitaxy, Selective Area Growth, Heteroepitaxy Molecular Beam Epitaxy, In situ characterization of epitaxial films. Defects in epitaxial films, Heteroepitaxy, Epitaxy and applications of nanostructures, Epitaxy and applications of GaN, AlGaN etc.strained-layer super lattices, misfit dislocations and critical thickness concepts,

Unit V Photonic Devices : Light Emitting diodes, LED for fiber optics, LED performance, reliability, Semiconductor Laser, Lasers for optical communication system, future trends in Fiber optic communications, Photodetectors, Photoconductor, Photodiode, Avalanche Photodiode, Phototransistor, Solar cells, sensors and MEMs, Thin



22

film solar cells, solid state sensors, optical Sensors, optoelectronic components, dilute magnetic semiconductors and spintronics. References 1. S.M.Sze. Physics of Semiconductor devices (2nd edition). Wiley Eastern Ltd., New Delhi,1981. 2. S.P.Keller. Handbook on Semiconductors, Vol. 1-4. T.S.Moss, Ed., North-Holland, Amsterdam, 1980. 3. C.M.Wolfe, J.R.N.Holonyak and G.E.Stillman. Physical Properties of Semiconductors. Prentice Hall International Inc.,

London, 1989.

4. P.N.Butcher, N.H.March and M.P.Tosi. Crystalline Semiconducting materials and devices. Plenum Press New York and London, 1986.

5. D.A.Fraser. The Physics of Semiconductor devices. Clarendon Press, Oxford, 1986.

6. D. K.Schroder. Semiconductor Material and Device Characterization. John Wiley & Sons Inc., New York,1990.

7. D. L. Pulfrey and N.Garry Tarr. Introduction to Microelectronic Devices. Prentice -Hall international editions, New Delhi,1989.

8. P. Gise & R. Blanchard. Modern Semiconductor Fabrication Technology. Prentice-Hall, New Jersey, 1986.





MSEE08

CERAMIC SCIENCE AND TECHNOLOGY

L T P Credit

3 0 0 3

( 45 hours ) Unit I Review of bonding types in ceramics – calculation of percentage ionic character. Types of ceramcis, Ceramic crystal structures: Sodium chloride, cesium chloride, alumina, spinel and lf uorite structures - examples. Co-ordination number and ionic radius ratio - Pauling‟s Rules. Simple problems involving Packing Fraction, critical radius ratio and density. Ceramic Materials : Definition, classification, Defects: point, surfaces, interfaces and non-equilibrium structure short-range and long-range order, imperfections, polymorphism. Ceramic Binary and ternary systems, ceramic microstructures. Crystallization of glass and glass-ceramics. Thermal, electrical, magnetic and optical properties of ceramics and application. Classification of ceramic materials conventional and advanced, areas of applications.

Unit II Sintering and microstructure of ceramics Thermodynamics and kinetics : experimental aspects of sintering, Interface effects, Matter transport, Ceramic Forming Processes Solid phase sintering, Sintering with liquid phase: vitrification, Sintering additives, Pressure sintering and hot isostatic pressing, Ceramic powders: different route for synthesis, Ceramic particle suspensions, Casting, Pressing, Extrusion-injection molding, Extraction of organic shaping additives, Deposition techniques.



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Unit III Important ceramics : Alumina, Mullite and Spinel, Zirconia, Non-oxide Ceramics, Mechanical Properties of Ceramics, Materials for Cutting, Drilling and Tribology, Ceramics for Electronics: Conductors and insulators, Dielectrics, Magnetic materials, Electronic properties of surfaces and interfaces in semi-conductor ceramic materials, Influence of microstructure on electrical properties, Ceramic components in electronics, Unit IV Bioceramics : Biomedical ceramics and their field of use, Biological properties, Processing of bioceramics, Nuclear Ceramics: Fuels, Absorbers and Inert Matrices, Fuel element, Absorptive ceramics, Inert matrix ceramics, Sol-gel Methods and Optical Properties. Unit V Property evaluation, Rupture strength, fracture Toughness, Elastic Constants, Hardness, Creep, Thermal Property-Coefficient of thermal expansion, Electronic Property, Measurement of electro-optic properties-Weibull Statistics of Strength Data for Fine Ceramics. Reference

1) F.H Norton, Elements of Ceramics, Addison-Wesley Press (1974) 2) M.W. Barsoum, Fundamentals of Ceramics, McGraw-Hill (2003) 3) W.D Kingery, Introduction to Ceramics, Wiley & Sons (1976). 4) Lawrence H. Van Vlack, Physical Ceramics for Engineers, Addison-Wesley Publishing (1964). 5) F. Singer and S.J. Singer, Industrial Ceramics, Chapman & Hall, UK (1963) 6) Michael Barsoum, “Fundamentals of Ceramics”, Mc Graw Hill Publishing Co., INC, 1997. 7) William F.Smith, “Foundations of Materials Science and Engineering”, Second Edition, McGraw - Hill Inc,

New York, 1993. 8) VanVlack K H, “Physical Ceramics for Engineers”, Addison Wesley, 1964. 9)





MSEE09

POLYMER AND COMPOSITE MATERIALS

L T P Credit

3 0 0 3

( 45 hours ) Unit I Introduction to Polymers : Classification of polymers, copolymers, tacticity, geometric isomerism, molecular weight distribution and averages, Measurement of molecular weight, synthesis of polymers, step growth polymerization, chain growth polymerization, polymerisation techniques.



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Unit II Properties of Polymers : Polymer conformation and chain dimensions, Freely jointed chains, Gaussian model, introduction to rubber elasticity amorphous state, glass transition temperature, the crystalline state, ordering of polymer chains, crystalline melting temperature, techniques to determine crystallinity, Mechanical properties, Introduction to viscoelasticity, dynamic mechanical analysis, mechanical models of viscoelastic behavior, Boltzmann superposition principle Unit III Polymer Processing, Rheology and Applications : Basic processing operations, extrusion, molding, calendaring, coating, Introduction to polymer rheology, non-Newtonian flow, analysis of simple flows, rheometry, capillary rheometer, Couette rheometer, cone and plate rheomete-applications-conducting, polymers-biopolymers, liquid crystal polymers-photonic, polymers-high temperature polymers. Unit IV Introduction to Composites : Types of composite materials, the concept of load transfer, matrix materials, polymers, metals and ceramics, fibers, glass, boron, carbon, organic and metallic fibers-fiber packing arrangements, particle reinforced composites, fibre reinforced composites, interface region bonding mechanisms, mechanical behavior of composites. Unit V Fabrication of Composites : Polymer matrix composites, liquid resin impregnation routes, pressurized consolidation of resin pre-pregs, consolidation of resin moulding compounds, injection moulding of thermoplastics, hot press moulding of thermoplastics, metal composites, squeeze infiltration, stir casting, spray deposition, powder blending and consolidation, diffusion bonding of foils, physical vapour deposition, ceramic composites, powder based routes, reactive processing, layered ceramic composites, carbon/carbon composites.

REFERENCES

1. Joel R.Fried, Polymer Science and Technology, Phi Learning Pvt. Ltd., 2009.

2. V.R. Gowarikar, N.V.Viswanathan & J.Sreedhar, Polymer Science, New Age International, 2011.

3. R.J.C.Crawford, Plastics Engineering, Butterworth-Heinemann, 1998.

4. D.Hull & T.W.Clyne, An Introduction to Composite Materials, Cambridge University Press, 2008.

5. K.K.Chawla, Composite Materials: Science and Engineering, Springer-Verlag, New York, 2010.

6. P.K.Mallick, Fiber-Reinforced Composites: Materials, Manufacturing and Design, CRC Press, Boca Raton,.







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MSEE10

NANOSCALE FABRICATION AND MEASUREMENT TECHNIQUES

L T P Credit

3 0 0 3

( 45 hours ) Unit I Miniaturization Quantum phenomena in nano-systems : photonic band gap structure, quantum states in nano-sized structures, quantum transport. Spintronics: Injection, spin relaxation and spin dephasing, Spintronic devices and applications, spin filters, spin diodes, spin transistors. Unit II Preparation techniques Basic micro- and nano-fabrication techniques : thin film deposition, sputtering, Chemical vapour deposition and its variants, ion implantation, diffusion, oxidation, surface micromachining, LIGA process, Packaging, die preparation, surface bonding, wire bonding, sealing, assembly Measurement techniques, Thickness measurements, scanning tunneling microscope, atomic force microscope, focused ion beam technique, nanoindentation, nanotribometer, scratch indentation. Unit III Nano-fabrication : Need for a clean room, Types of clean rooms, maintenance of different types of clean rooms, oxidization and metallization, masking and patterning, Etching technologies, wet and dry etching, photolithography, Drawbacks of optical lithography for nanofabrication, electron beam lithography, io n beam lithography, strain-induced self-assembly for Nanofabrication of quantum dots and molecular architectures, Polymer processing for biomedical applications. Unit IV Applications and devices Mechanics for micro- and nano-systems : bending of membrane and cantilever, resonance vibration, fracture, stress, nano Tribology, Fluid dynamics for micro and nano- systems surface tension, viscosity, continuity equation laminar fluid flow, fluid flow in submicron and nanoscale, Surface acoustic wave (SAW) devices, microwave MEMS, field emission display devices, nanodiodes, nanoswitches, molecular switches, nano-logic elements, Super hard nanocomposite coatings and applications in tooling, Biochemistry and medical applications: lab-on-a-chip systems. Unit V Surface characterization techniques; UV and X-ray photoelectron spectroscopy (UPS, XPS); Auger electron pectroscopy (AES); low energy electron diffraction and reflection high energy electron diffraction (LEED, RHEED) secondary ion mass spectrometry (SIMS); Rutherford backscattering (RBS); Medium energy ion scattering (MEIS); Electron energy loss spectroscopy (EELS) and highresolution EELS(HREELS) REFERENCES

1) T.R.Hsu. MEMS & Microsystems Design and Manufacture.McGraw Hill, 2002.

2) Sadamichi Maekawa, "Concepts in Spintronics", Oxford University Press, 2006.

3) S.E.Lyshevski. Nano- and microelectromechanical systems. Boca Raton, CRC Press, 2001.

4) R.Waser (ed.). Nanoelectronics and Information Technology. Aachen, Wiley-VCH, 2003.

5) B.Bhushan. Springer Handbook of Nanotechnology. Springer-Verlag, 2004.

6) J.A.Pelesko and D.H.Bernstein. Modeling MEMS and NEMS. Boca Raton, Chapman &Hall/CRC, 2003.



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7) Woodruff D.P. and Delchar T.A., "Modern techniques of surface science", Cambridge University Press,

Cambridge, 1994.

8) 8 Mark J Jackson, Micro and Nanomanufacturing , Springer; First Edition, (2006) ISBN-10:038725744

9) Dieter K, Schroder, Semiconductor Material and Device Characterization, Wiley-IEEE Press, 3rd Edition,

(2006) ISBN-10:0471739065

10) L. B. Freund and S Suresh, Thin film materials: Stress, Defect formation and surface Evolution, Cambridge

University Press, (2004) ISBN-10:0521822815

11) Zheng Cui, Micro-nanofabrication: Technologies and Applications, Springer First Edition (2006), ISBN-

10:3540289224





MSEE11

NON-DESTRUCTIVE TESTING

L T P Credit

3 0 0 3

( 45 hours ) Unit I

Introduction and Surface NDT Methods : Definition of terms, discontinuities and defects/flaws, fracture mechanics concept of design and the role of NDT, life extension and life prediction, penetrant testing and magnetic particle testing, basic principle of penetrant testing, limitations and advantages, basic principle involved in magnetic particle testing, development and detection of large flux, longitudinal and circular magnetization, demagnetization. Unit II

Radiographic Testing : Electromagnetic spectrum, X-ray and gamma ray sources, X-ray generation, The spectrum of X-rays, Equipment controls, gamma ray sources, properties of X-rays and gamma rays, attenuation and differential attenuation, interaction of radiation with matter, Principle of radiographic testing and recording medium, films and fluorescent screens, nonimaging detectors, film radiography, calculation of exposure for X-ray and gamma rays, quality factors, Image quality indications and their use in radiography. Unit III

Ultrasonic Testing : Ultrasonic waves, velocity, period, frequency and wavelength, reflection and transmission, near and far field effects and attenuation, generation, piezoelectric and magnetostriction methods, normal and angle probes, methods of Ultrasonic testing, Principle of pulse echo method, Equipment, examples, rail road inspection, wall thickness measurement, range and choice of frequency.



27

Unit IV

Eddy Current Testing : Introduction, Principles of eddy current inspection, conductivity of a material, magnetic properties, coil impedance, lift off factor and edge effects, skin effect, inspection frequency, coil arrangements, inspection probes, types of circuit, Reference pieces, phase analysis, display methods, typical applications of eddy current techniques. Unit V

Other Methods : Imaging, principle and applications, testing of composites, acoustic emission testing, application of AET, on-line monitoring or continuous surveillance and applications in materials science, Optical methods of NDT, photo elasticity, evaluation procedure, Holographic NDT procedure, speckle phenomenon, speckle interferometry, speckle shear interferometry, Fourier optics, Fourier filtering techniques for non-destructive testing.

REFERENCES

1. B.Hull and V.John. Nondestructive Testing. Mc Millan Education Ltd., London, 1988. 2. Metals Hand Book, Vol.2, 8th Edition, ASTM, Metals Park, Ohio. 3. Dainty, Laser Speckle & Related Phenomena, Springer-Verlag, New York, 1984. 4. Mc Gonnagle, W.J. Non-destructive testing methods, Mc Graw Hill Co., NY, 1961. 5. S.M.Sze. Physics of Semiconductor devices (2nd edition). Wiley Eastern Ltd., New Delhi,1981. 6. S.P.Keller. Handbook on Semiconductors, Vol. 1-4. T.S. Moss, Ed., North-Holland, Amsterdam, 1980. 7. C.M.Wolfe, J.R.N.Holonyak and G.E.Stillman. Physical Properties of Semiconductors. Prentice Hall International Inc.,

London, 1989. 8. P.N.Butcher, N.H.March and M.P.Tosi. Crystalline Semiconducting materials and devices. Plenum Press New York and

London, 1986. 9. D.A.Fraser. The Physics of Semiconductor devices. Clarendon Press, Oxford, 1986. 10. D. K.Schroder. Semiconductor Material and Device Characterization. John 11. Wiley & Sons Inc., New York,1990. 12. D. L. Pulfrey and N.Garry Tarr. Introduction to Microelectronic Devices. Prentice-Hall international editions, New

Delhi,1989. 13. P. Gise & R. Blanchard. Modern Semiconductor Fabrication Technology. Prentice-Hall, New Jersey, 1986







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MSEE12

BIOMATERIALS

L T P Credit

3 0 0 3

( 45 hours ) Unit I Biological Performance of Materials : Biocompatibility, inflammatory process, coagulation and hemolysis, approaches to thrombo, resistant materials development. Unit II Orthopaedic Materials : Bone composition and properties, temporary fixation devices, joint replacement, biomaterials used in bone and joint replacement: metals and alloys, stainless steel, cobalt based alloys, titanium based materials, ceramics, carbon, alumina, zirconia, bioactive calcium phosphates, bioglass and glass ceramics, polymers: PMMA, UHMWPE/HDPE, PTFE, bone cement, composites. Unit III Cardiovascular Materials : Blood clotting, blood rheology, blood vessels, the heart, aorta and valves, geometry of blood circulation, the lungs, vascular implants, vascular graft, cardiac valve prostheses, cardiac pacemakers, blood substitutes, extracorporeal blood circulation devices Unit IV Dental Materials : Teeth composition and mechanical properties, impression materials, bases, liners and varnishes for cavities, fillings and restoration materials, materials for oral and maxillofacial surgery, dental cements and dental amalgams, dental adhesives. Unit V Other Materials : Biomaterials in ophthalmology, viscoelastic solutions, contact lenses, intraocular lens materials, tissue grafts, skin grafts, connective tissue grafts, suture materials, tissue adhesives, drug delivery, methods and materials, selection, performance and adhesion of polymeric encapsulants for implantable sensors

REFERENCES

1. S. V. Bhat. Biomaterials, Narosa Publication House, New Delhi, 2010. 2. J.Park & R.S.Lakes. Biomaterials: An Introduction. Springer, 2007. 3. J. Black. Biological Performance of Materials: Fundamentals of Biocompatibility, Marcel Dekker Inc, New York,

1992. 4. D.F.Williams (editor). Materials Science and Technology: A Comprehensive treatment, Volume 14. Medical and

Dental Materials, VCH Publishers Inc, New York, 1992. 5. L.L.Hench and E.C.Ethridge. Biomaterials: An Interfacial Approach, Academic Press, 1982.







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MSEE13

SMART MATERIALS

L T P Credit

3 0 0 3

( 45 hours ) Unit I

Smart Materials and Structural Systems : Classes of materials and their usage, Intelligent /Smart materials, Evaluation of materials Science, Structural material, Functional materials, Polyfunctional materials, Generation of smart materials, Diverse areas of intelligent materials, Primitive functions of intelligent materials, Examples of intelligent materials, structural materials, Electrical materials, Intelligent biological materials, Biomimetics, Wolff‟s law, Technological applications of Intelligent materials.

Unit II

Sensors : Sensing technologies, Micro sensors, Intelligent systems, Hybrid smart materials, An algorithm for synthesizing a smart material, Passive sensory smart structures, Reactive actuator based smart structures, Active sensing and reactive smart structures, Smart skins, Aero elastic tailoring of airfoils, Synthesis of future smart systems.

Unit III

Piezoelectric Smart Materials Background: Electrostriction, Pyroelectricity, Piezoelectricity, Industrial piezoelectric materials, PZT, PVDF, PVDF film, Properties of commercial piezoelectric materials, Properties of piezoelectric film (explanation), Smart materials featuring piezoelectric elements, smart composite laminate with embedded piezoelectric actuators, SAW filters. Unit IV

Shape, Memory Alloys : Background on shape, memory alloys (SMA) Nickel, Titanium alloy (Nitinol), Materials characteristics of Nitinol, Martensitic transformations, Austenitic transformations, Thermoelastic martensitic transformations, Cu based SMA, chiral materials, Applications of SMA, Continuum applications of SMA fasteners, SMA fibers, reaction vessels, nuclear reactors, chemical plants, etc. Micro robot actuated by SMA, SMA memorization process, SMA blood clot filter, Impediments to applications of SMA, SMA plastics, primary molding, secondary molding, Potential applications of SMA plastics.

Unit V

Technological Materials : Metallic glasses, preparation, properties and applications, rheological fluids, CCD device materials and applications, surface acoustic wave and sonar transducer materials and applications, nanophase materials and their properties.

REFERENCES:

1. M.V.Gandhi and B.S.Thompson, Smart Materials and Structures. Chapman and Hall, London, First Edition, 1992

2. T.W. Deurig, K.N.Melton, D.Stockel and C.M.Wayman, Engineering aspects of Shape Memory alloys, Butterworth –Heinemann, 1990

3. C.A.Rogers, Smart Materials, Structures and Mathematical issues, Technomic Publising Co., USA, 1989.



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MSEE14

SUPERCONDUCTING MATERIALS AND APPLICATIONS

L T P Credit

3 0 0 3

( 45 hours ) Unit I

Basic Experimental Aspects : Zero electrical resistance, Meissner effect, a.c. diamagnetic susceptibility, heat capacity, optical absorption by superconductor, entropy change, thermal conductivity, destruction of superconductivity by external magnetic fields, type I and type II materials, superconducting behaviour under high pressures, flux quantization, normal and Josephson tunneling. Unit II

Superconducting Materials ; Elemental superconductors, superconducting compounds and its alloys, A-I5 compounds, chevral phase compounds. Unit III

High Temperature Superconductors : La-Ba-Cu-O, Y-Ba-cu-O, Bi-Sr-Ca-Cu-O and new systems and their crystal structures, Experimental studies on the new materials, organic superconductors, fullerenes. Unit IV

Theoretical Aspects : Isotope effect, BCS theory, Role of electrons and phonons, applications of electron band structure results to calculate electron-phonon coupling constant McMillan‟s formula, GLAG theory, recent theories on high Tc materials, Coherence length, expression for critical temperature Tc, critical field Hc, critical current Jc, heavy fermion superconductivity. Unit V

Applications ; Superconducting magnets, power generators, motors, transformers, power storage, power transmission, Josephson junction devices, IR sensors, SQUIDS, SLUGS, magnetically levited trains, computer storage elements.

REFERENCES

1. A.V.Narlikar and Ekbote. Introduction to Superconductivity. South Asia publishers, 1983. 2. D.R.Tilley and Tilley. Superfluidity and Superconductivity. Adam Hilger, 1986.



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3. H.S.Kowk and D.T.Shaw (Eds.). Superconductivity and its Applications. Elsevier Science Publishing, 1988.

4. A.V.Narlikar. Studies on High temperature superconductors- Advances in research and applications. Nova Scientific, New Delhi, 1990.





MSEE15

INDUSTRIAL TRIBOLOGY

L T P Credit

3 0 0 3

( 45 hours ) Unit I Friction and Wear: Laws of friction, types, friction coefficient, wear, types, control of wear.Lubrication: Mechanism, boundary, Hydrodynamic & Hydrostatic lubrication, Reynolds equation in 2D and 3D flow, solid, liquid and gas lubricants, types and application. Unit II Tests and Instrumentation in Tribology: Sliding friction and wear abrasion test, solid particle and erosion test, scratch indentation test, calowear, Pin-on disc-tribometer. Unit III Micro/Nano-tribology and applications – Tribology for MEMS, wear resistant coatings - New industrial applications of tribology – Nano scale wear, Micro scale scratching and Micro scale wear - Wear mapping and Nano lubrication and specialized materials selection for Nano Tribology, Nanoindentaion measurements. Unit IV Case studies in automotive, chemical industry, marine, microelectronics, Basics test (mechanisms, modeling) - Lab and industrial - Prevention, monitoring and environmental effects Unit V Characterizing techniques, optical microscopy, scanning electron microscopy/EDX, atomic force microscopy, roughness measurements, X-ray diffraction, Raman spectroscopy. TEXT BOOKS

1. Gwidon W Stachowiak, Andrew W. Batchelor, Engineering Tribology , Elsevier, 3rd Edition, 2005 2. Bharat Bhushan, Principles and Applications of Tribology, John Wiley & Sons Inc., 1999. 3. Summers Denis J., and Smith., An Introductory guide to Industrial Tribology, Mechanical Engineering

Publications Limited, London , 1994.



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MSEP01 Practicals for Microstructural Characterization Lab

1) Preparation of materials by different techniques.

2) Phase identification by X-ray diffraction of materials.

3) Accurate lattice parameter determination by XRD

4) High temperature XRD diffraction of materials

5) Glancing angle incidence X-ray diffraction of thin films for phase identification.

6) Optical microscopy of bulk metallic materials

7) Epifluorescence microscopy of biomaterials

8) Morphological studies of prepared materials by FESEM.

9) Morphological studies and surface roughness changes in materials by atomic force microscope.

MSEP02 Practicals for Thin Film Deposition Lab

1. Thermal evaporation of metallic materials

2. Electron beam evaporation of ceramic materials

3. DC magnetron sputtering of pure materials

4. Reactive DC sputtering of metallic materials

5. Preparation of nitride thin films by magnetron sputtering



33

6. Bilayer deposition of materials by magnetron sputtering

7. Substrate and target preparation for sputtering

8. Spin coating of materials

MSEP03 Powder Metallurgy and Metallography Lab

1. Preparation of nanopowders by ball milling

2. Pelletzing of nano and micron sized powders

3. Sintering of pellets in vacuum and atmospheric conditions

4. Cutting, polishing and etching of metallic materials

5. Density measurements of pellets by size and weight change

6. XRD of sintered and powder materials

7. FESEM of metallographically prepared samples.

8. Optical microscopy of metallographically prepared sintered pellet.

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