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Brain Machine Interface : Bioelectronics
Based on 3D Chip Stacking
-- Research and Applications --
Page 2
Neuroscience High accuracy investigation tools are neededto study neural activity underlying cognitivefunctions and pathologies.
Neural Prosthetics Intracortical stimulation forvision recovery Neuro-motor prosthesis: paralysis, physical
impairments.
Mind driven rehabilitation systems.
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Sensing and subsequent treatment-- Neurons, regions, and neural coding --
Page 3
Primary Sensoryand motor cortex
Primary visual
cortex
Kandel et al., Principles of
neural science, 4ed
A. Sensory map B. Motor map
t
t
CodingIntents
Sensations
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Page 4
Medical Microsystems for the Recovery of Vital Neural Functions-- Main projects in our Polystim Laboratory --I. Sensors and sensor network (e-Health)
Sensors (pressure, volume, ENG, etc..) design and implementation
II. Vision for blinds Modeling & devices : Recording, monitoring and electrical stimulation
III. Bladder control Recuperate bladder functions : Sensing and electrical stimulation
IV. Respiration and gastric functions Catheters and signal processing
V. Optic and Ultrasound based medical devices Non-invasive diagnostic tools
VI. Laboratory-on-chip Diagnostic tools (neurotransmitter detection) and drug delivery.
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Smart medical devices-- Typical topology --
Modulator
Demodu-lator
Externalcontroller
Dataprocessing
Receiver
AC/DCSupply
Backtelemetry
Measure&
digitize
MUX
DeMUX
MainController
Stimuligenerator
Currentsources
Teststimuli
ElectrodesSkin
Page 5
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Brain Machine Interface : Bioelectronics Based on 3D
Chip Stacking
-- Outline --Introduction
I. Parallel sensing from the cortex Multi-channel multi-chip neural sensors Microelectrodes arrays & Integration/assembly
II. Microstimulation and Monitoring (treatment example) Intracortical visual implant
III. Efficient energy delivery and bidirectional data transfer
IV. Other project Lab-on-chip - based devices for better diagnostics
V. Research team, labs & facilities (Polystim & ReSMiQ)
Summary
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Parallel recording from the cortex-- Multichannel Implantable neural sensors --
Page 7
Ch1
Vertical integration of several ASICs
implementing different processing layers
Post-processing of the array base withphotolithography and wet etching
Cr-Au layer for contacts and metalpaths.
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Parallel recording from the cortex (Contd)
-- Design challenges and bottlenecks --
Data transmission bandwidth through tissues
Present low-power telemetry allows around 2 Mb/s
Energy transfer through tissues
Thermal effects start to appear near 50 mW/cm2
Size of implants
Very small leaving tissues untouched at implantation.
Design challenges are multidimensional
Power consumption, frequency band allocations and standards,testability and fault detection, SNR (noise considerations), etc.
Page 8
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Parallel recording from the cortex (Contd)
-- Design challenges : Noise considerations --
Time (s)
Raw neural signal
Action potentials
Time (s)Needs to measure very low-voltages.Very Sensitive to Noise !
Voltage(V)
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Multi-channel neural recording interface-- Mounted ASICs: Mixed-signal front-end --
Mixed-signal front-end
Digita
lreadout
Micro-electrodes
array
Page 10
Conditioning: Amplification & FilteringConsumption : < 12 W
Digitization: 8 bits, 30 ksps/Ch.Consumption : 7.4 W
LN bioamplifier & dc
suppression SA
ADC
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Digital ASIC
-- On-chip AP detection and buffering --
Page 11
Absolute value detector and on-chip SRAM
Serial
bus
On-line AP detection & buffering(bandwidth reduction Strategy = up
to 48 times):
Absolute value detector
On-chip SRAM FIFOs and memory buffer
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Multi-chip integration-- Design of microelectrodes array --
Page 12
Medical gradestainless-steel
Electro-polishing
Epoxy basebuilding
Grinding ofthe baseandelectrodesinsulation
2mm
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Multi-chip integration(Contd)-- Chip stacking and bonding --
Page 13
Conductive tracesare developed onthe back side
Contacts are
rerouted in anyconfiguration
Wedge / ballbonders are usedfor connecting
ASICs
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Measured performances-- Mixed-Signal ASIC (CMOS 0.18 m)--
Page 14
100 Hz 9.2 kHzBandwidth
2.304 mm2
( 0.25 x 0.39 mm2/ch.)
Die size
680 WPower consump.
7 bitsENOB
< LSBINL, DNL
8 bitsResolution
30 kSps/chSampling rate
5.4 VrmsInput-ref. noise
72 dBMid-band gain
Summary of characteristicsMicrophotograph of the 16-channel chip
4 x 4 channels
sensor
Mult iplexing,
bias and test
circuits
1 mixed-
s igna l
c ha nne lBias circuits
Clock and con trol
signals generator
Test ing analog
mult iplexer
Digital multiplexers
Bioamplifier
Filter, amplifier,
ADC
-124 dB32 kHz 64 kHz
96 kHz
Inter-channel cross-talk < -57 dBbetween adjacent channels (< -67
dB between opposite sides.
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Measured performances (Contd)-- Low-power low-noise Bioamplifier --
Page 15
Summary of bioamplifercharacteristicsAnticipatedvalue Measuredvalue
52 dB V
10 kHz
Parameters
1.8 Vupplyvoltage
GainBandwidth
51.5 dB V
9.6 kHz
5.6 Vrmsnput refer-red noise
CMOS 0.18 mechnology260 m x 190 mrea size
5.0 Vrms
GOSSELIN,SAWAN, CHAPMAN,A Low-Power IntegratedBioamplifier With a New DC Rejection Scheme, IEEE Trans. onBiomedical Circuits & Systems, Vol. 1, No. 3,Sept.2007, pp. 184-192.
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Page 16
CMOS 0.18 mProcess
1.856 mm2Die size
64 bytes per ch.Output memory size
1.53 mW(96.5 W/ch)
Power consump.
16 MHzRef. clock freq.
5.1 to 51 kbits per
channel
Neural data rate
with BW reduction
1.25 kB (69% ofchip area)
Total on-chip SRAM
16 bytes per ch.Input FIFO depth
Microphotograph of the digital integrated
circuit
Summary of characteristics
Measured performances (Contd)-- Digital ASIC --
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Page 17
In vivo recording in the visual cortex of a rat
In vivo validation (Acute exp.)-- Performance of the Bioamplifier (contd) --
In vivo neural recording with rats
Anesthetised animal
Recording from 16 sites in theprimary visual cortex
Dept. of Psychology, Concordia and Montreal Universities, Montreal
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Stimulation Module (4x4) CMOS 0.18 m, ~60 000 Gates
Downlink
> 1 Mbps @ 13.56 MHz, D = 67%
Uplink : 200 kb/s
Power: 100 mW load; P (err) < 10-6
Downlink
Monitoring
CTRL
TEST
structures
MONITORING
R2R AMP
ELECTRODES
CONN / CTRL
DACs
BIAS
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The visual intracortical stimulator-- Implementation results --
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Brain Machine Interface : Bioelectronics Based on 3D
Chip Stacking
-- Outline --IntroductionI. Parallel sensing from the cortex
Multi-channel, multi-chip neural sensors Microelectrodes arrays & Integration/assembly
II. Microstimulation and Monitoring (treatment example) Intracortical visual implant
III. Efficient energy delivery and bidirectional data transfer
IV. Other project Lab-on-chip - based devices for better diagnostics
V. Research team, labs & facilities (Polystim & ReSMiQ)
Summary
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Wireless inductive link-- Power transfer efficiency --
VDC
LOAD
* *R1 MC1
L1 L2 C2
VsC3
~
V recVoltage
regulator
R2
Inductive link Rectifier
Linear
regulator
regulatorrectifierrflinktotal
= ~ 12 % Page 21
)2(2
1
21
2
2
11
222
DC
DC
VVVCkPCR
CVk
dioderecload
total
++
=
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Power transfer-- Efficiency & safety --
External Controller Implant
Switching
Regulator
ASK Demodulator /
DAC/Decoder
Data
ModulatorPA
Battery
Vdd Shuntregulator
Rectifier
LoadShiftKey(LSK)ASK/PSK Demodulator
Encoder
L2
C2
C1
L1
To/From
Other
parts
Skin
Page 22
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Wireless dedicated links-- The external interface --
Switching power amplifier (AP)
Modulator Demodulator
Power link
&
bi-directional
data
transfer
by
externalinductor
(antenna)
Control unit
- Power supply management
- PA calibration- Inductive link coupling
- Resonance frequency
- Extensive data processing
Frequency
generator
Power
source
UserInterface
Page 23
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Wireless dedicated links-- The internal interface --
Shuntregulator
Rectifier LDO Reg 1SwitchedCapacitorDC/DC
LoadShiftKey(LSK)ASK/PSKDemodulator
ADCncoder MUX
Controller/Stimulator
VDD1
VDD2
VDDn
AnalogFront-Ends(1..n) Ts
ucoas
Ofchpno
LDO Reg 2
LDO Reg n
Start-upCircuit
ProtectionCircuit
Clock GeneratorCircuit
Page 24
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RF LINK to Transfer Data
-- BPSK demodulation --
Hard-limited Costas loop circuit
Coherent : recover carrier / data
in the same loop
VCOLow Pass
Filter
Data
Out
Data In
Phase
Shifter 90
I branch
Q branch
Arm
LP Filter
m(t) sin(w1t+q1)
m(t) = 1 or 1
2 sin(w1t+q2)
2 cos (w1t+q2)m(t) sin(q1-q2)
m(t) cos(q1-q2)
sin 2(q1-q2)m(t)
2
Gilbert multiplier
Gilbert multiplier
Gilbert
multiplier
Arm
LP Filter
Page 25
VCOuadraturesignalgenerator
LoopFilter
Arm Filter
Arm FilterReceivercoil
I branch
Q branch
ClkDout
Data in
Choppermultiplier
Digital domain Analog domain
Requirements: 1) Fully integrated,2) Low power consumption, 3) Fully
differential
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Page 26
0.76 mW
at 4Mbps
4Mbps*
2.2 Mbps**
8Mbps***
13.56
MHz
CMOS
0.18m
QPSK
*Postlayout
**Measured
***Matlab
LPF
)sin( 21 qwt+ -+
Vd(t)
)cos( 21 qwt+
VCO
InputSignal
Vs(t)
90 -Phase Shifter
Data Out A
Data Out B
LPF
LPF
Voltage Controlled Oscillator Comparator
540 um
0.61 mW**
1.6 Mbps*
1.2 Mbps**
13.56
MHz
CMOS
0.18m
BPSK
BPSK QPSK
QPSK
Parallel recording from the cortex (Contd)
-- Results : High data rate wireless link --
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Page 27
Testing Challenges-- Engineering and Medical Validations --
Functional tests (electrical, mechanical, ..)
Circuits, Package, Heat, Reliability, Toxicity, .
Self-test and fault detection after implantation
Noise considerations and grounding (multichannel aspect)
Analog/digital blocks, Scan and BIST, overhead resources power/area
In vivo measurement and validation
Humidity, temperature, Ion concentration, pH, interface to tissues,
Experiments in animals and humans: spontaneous or evoked activity
Ethics, experimental protocol and approvals.
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Page 28
Polystim neurotechnologies Laboratory
-- http: //www.polystim.ca -- Founded in 1994 Completed Degrees
70 M.R. & 17 Ph.D. Currently supervised students
12 M.R. (30% with scholarships), and 8 Ph.D. (50% with scholarships). Invited researchers, postdoctoral and research assistants 1 Technician & 1 Secretary Collaborators (Colleagues from)
Several medical institutes and research centers in hospitals Sciences and applied sciences programs
Support: NSERC, CIHR, FQRNT, CMC systems, CRC - DMI, FCI-DMI
Industry: Victhom HB, INLB, DALSA Semiconductor, Scanview, Biophage, etc.
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Design, tests, assembly, packaging and in vitro
validation facilities
Page 29
-- http://www.polymtl.ca/lasem --
CFI Room A345
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Un courant porteur pour le Qubec
Universit de MontralMcGill UniversityUniversit du Qubec Montralcole Polytechnique de Montralcole de technologie suprieureConcordia UniversityUniversit LavalUniversit du Qubec ChicoutimiUniversit du Qubec Trois-Rivires
http://www.ttp://www.resmiqesmiq.orgorgMohamad Sawan, Director
June 2009
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Un courant porteur pour le Qubec
Fabrication,integration,Prototyping &validationTest, diagnostic,verification &characterization
Specification,Designoptimization& simulationDesign methods,implementation,modeling
EmergingTechnologies &standards
LoC:Microfluidi
c,optic,
etc
Micro&nano-electronics
IndustrialControl
MedicalDevices Telecom.
optic&Wireless
Security,Mult
imediaRFIDSoC,Analog&Mixed-ignalPlatforms
TechnologiesRFIC,MEMS,Data
Convertors,etc.Net
works
Sensors
,
Actuator
sVideo&
audioApplictions
SignalProcessing
Algorithms,architectures,synthesis &co-design
Int.N
EWCAS
Conf.
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Multi-chip multi-channel 3D neural sensing from the cortex
Low-power, chip area, vertical integration and packaging
Test challenges: Noise, design ofin vivo experiments
Reliability and safety are important facts.
Typical SMD involve multi-disciplinary team : engineers, physicians,surgeons, health care professionals, etc;
Challenges at the level of intracortical microsystems are all important(power issues, assembly, microelectrodes);
Monitoring and recording permit to understand the accurate
functions at the CNS; Technology progresses will allow the creation of many more reliable
implantable devices;
Diagnostic tools based on LoC (neurotransmitters detection) anddrug delivery.
Summary
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Brain Machine Interface : Bioelectronics Based on 3D ChipStacking
Acknowledgments-- http: //www.polystim.ca --
Master & Ph.D. students Collaborators: Colleagues from different research centers Support: NSERC, CIHR, FQRNT, CMC systems, CRC-DMI, FCI-DMI Industry: Victhom, INLB, DALSA, Scanview, Clarovita.
Thank You