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SEMCO Polymer Tantalum
1. Overview
2. Feature of Tantalum
3. Strength of Polymer Tantalum
4. Core Technology
5. Roadmap
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[ Figure T1. Schematic structure of Tantalum Capacitor ]
Cathode: Pellet Anode: Ta Wire
Lead Frame
Mold Epoxy Lead Frame
C ε d S
∝
[Anode]
Ta wire / powder
[Dielectrics]
Ta2O5
[Cathode]
Polymer or MnO2
0
0
0
0
Polymer
Or MnO2
Ta Powder
Ta2O5
Ta Wire
Polymer or MnO2
Carbon Silver
Ta
Powder
Ta2O5
Inner: Porous
Structure(Conventional Type)
Constitution of Ta Capacitor
- Ta2O5 dielectrics, Ta anode and Polymer(/MnO2) cathode
1. Overview
Porous structure to
increase surface area
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Pellet
x100K x1K x50
Granule(10~200) Primary particle(sub )
[ Figure T2. Schematic structure of Tantalum Capacitor ]
Structure(Internal)
Ta Capacitor should increase surface area for high capacitance
due to low permittivity compared to MLCC
1. Overview
Anode : Ta metal
Dielectrics : Ta2O5
Cathode : Polymer or MnO2
Anode : Ta wire
Tantalum
Polymer/MnO2
Carbon
Silver
Ta2O5
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Porous structure
Anode : Ta metal
Dielectrics: Ta2O5
Cathode: MnO2
Cathode: Polymer
Fracture surface after sintering of Ta metal Fracture surface after dielectrics formation
Fracture surface after making MnO2
Fracture surface after making polymer
Structure(making Internal cathode) 1. Overview
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[ Figure T3. Schematic diagram using electrode of tantalum capacitor]
Product Type
Dividing into MnO2 type and Polymer type
according to the material used for its cathode
1. Overview
MnO2
(+) (-)
Ta2O5 (Dielectric)
Carbon
Ag
Ta (Anode)
(+) (-)
Ta2O5 (Dielectric)
Carbon
Ag
Ta (Anode)
Polymer
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Process flow 1. Overview
Powder
mixing 1
Pressing 2
Sintering 3
Pellet
welding 4
Formation
(Ta2O5) 5
MnO2 or
Polymer 6
Carbon
coating 7
8
Middle
inspection 9
Leadframe
welding
Molding
Marking 12
11
10
Silver
coating
13 Aging
14 Testing
15 Taping
16 Final
inspection
17 Outgoing
inspection
18 Packing
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Characteristics : DC bias VS Cap 2. Feature of Tantalum
[Figure T4. Capacitance change of tantalum capacitor by DC-bias]
0 1 2 3 4 5 6-80
-70
-60
-50
-40
-30
-20
-10
0
10
MLCC 1608, 1.0Tmax
, 10V22F
Polymer Ta 1608, 1.0Tmax
, 6.3V22F
Ca
pacit
an
ce c
han
ge / %
DC Voltage / V
Polymer 1608 1.0t 6.3V22uF
Measurement conditions
Frequency range : 120Hz
Voltage : 1.0Vrms @ 25oC
DC bias : 0 ~ 6V
Tantalum Cap has no significant change of Capacitance unlikely MLCC.
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Characteristics : Temp VS Cap 2. Feature of Tantalum
[Figure T5. Capacitance change of tantalum capacitor by Temperature]
Polymer 1608 1.0t 6.3V22uF
-55 25 105-50
-40
-30
-20
-10
0
10
20
30
40
50 MLCC 1608, 1.0T
max, 10V-22F
Polymer Ta 1608, 1.0Tmax
, 6.3V22F
Cap
acit
an
ce c
han
ge / %
Temperature / C
Measurement conditions
Frequency range : 120Hz
Voltage : 1.0Vrms @25oC
DC bias : 0V
Temperature : -55oC ~ +105oC
Tantalum Cap has no capacitance drop at high temperature unlikely MLCC.
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Characteristics : Time VS Cap 2. Feature of Tantalum
[Figure T6. Capacitance change of tantalum capacitor by Time]
Polymer 1608 1.0t 6.3V22uF
Measurement conditions
Frequency range : 120Hz
Voltage : 1.0Vrms @25oC
DC bias : 0V
Time : ~84hr
0.1 1 10 100-10
-8
-6
-4
-2
0
2
4
6
8
10 MLCC 1608, 1.0T
max, 10V-22F
Polymer Ta 1608, 1.0Tmax
, 6.3V22F
Cap
acit
an
ce c
han
ge / %
Time / Hr
Tantalum Cap has no capacitance drop by time unlikely MLCC.
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Characteristics : Acoustic noise 2. Feature of Tantalum
[Figure T7. Acoustic noise by Frequency]
Tantalum Cap has no piezoelectric property. So there is no acoustic noise.
Polymer 1608 1.0t 6.3V22uF
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High conductivity 3. Strength of Polymer Tantalum
[Figure T8. Conductivity by materials ]
102
101
100
10-1
Conductive
Polymer
Electrolytic
Capacitor
MnO2
Conductivity
10 to 100 times up
100 times up
Conductivity
/ S
/cm
Conductivity of Polymer is higher than that of MnO2.
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Low ESR 3. Strength of Polymer Tantalum
[Figure T9. ESR Curve versus Frequency]
Manganese
10V47uF
Polymer
6.3V47uF
Frequency / Hz
ES
R / m
Ω
728mΩ
87mΩ
Measurement conditions
Frequency range : 100 ~ 2MHz
@100kHz, 25oC
Rip
ple
curr
ent
/ A
rms
[Figure T10. Allowable ripple current comparison]
Polymer MnO2
ESR value relates to heat generation,
so allowable ripple current is different.
I r = (P max / ESR)1/2
ESR of Polymer is lower than that of MnO2. (Polymer has high allowable ripple current.)
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[ Figure T13. Simulation of Output Voltage in DC-DC Converter(47) ]
Excellent noise removal
Noise removal of Polymer is better than that of MnO2
3. Strength of Polymer Tantalum
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Excellent noise removal
Noise removal of Polymer is better than that of MnO2
3. Strength of Polymer Tantalum
[ Figure T14. Simulation of Ripple Voltage in Power Line(47) ]
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No ignition 3. Strength of Polymer Tantalum
Ta Ta2O5 MnO2
(+) (-)
1. Crack initiates
current & heat.
Q = I2×R×t
2. MnO2 conversion
and O2 generation.
2MnO2 → Mn2O3 + ½ O2 O2
3. Rapid combine
: Ta and O2
→ IGNITION !
Ta : MnO2 Type
4Ta + 5O2 2Ta2O5 + Q kcal – Oxygen supply from MnO2 decomposition : 2MnO2 Mn2O3 + ½ O2
Ta : Polymer Type
4Ta + 5O2 2Ta2O5 + Q kcal – No Oxygen supply
[Figure T. example of burnt
failure for MnO2 Ta cap.]
[Figure T12. Burnt mechanism of MnO2 Ta cap.]
Polymer has no oxygen source. So there is no burnt failure. (MnO2 can be burnt because it has oxygen source.)
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Low voltage derating 3. Strength of Polymer Tantalum
SSST(Surge Step Stress Test)
MnO2
(27Batches)
Polymer
VR>10VDC
Polymer
VR<=10VDC
100PPM FR / % VRated 68% 126% 197%
@50% Vrated / FR(PPM) 9 0 0
@80% Vrated / FR(PPM) 458 4 1
@90% Vrated / FR(PPM) 1,700 12 2
@100% Vrated / FR(PPM) 6,310 35 8
Ref. CARTS Europe 2004: 18th Annual Passive Components Conference, October 18-21, 2004
Looking across the first row of value, the 100-PPM failure rates are projected to be at 68% of rated voltage(VR)
for the Ta-MnO2, at 126% of for the higher voltage Ta-polymer devices, 197% of VR for the lower voltage
Ta-polymer devices.
The failure rate projection is 9PPM for the Ta-MnO2 product at 50% VR, and this is nearly equal to the higher voltage
Ta-polymer’s projected failure rate of 4 PPM at 80% VR, and 2 PPM at 90% VR for the lower voltage Ta-polymers.
General voltage derating recommendation : Polymer 0.8×Vrated / MnO2 0.5×Vrated
Reliability of polymer product applying 0.8Vrated is similar to that of MnO2 product
using 0.5Vrated.
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3. Strength of Polymer Tantalum Low stress
Ref. CARTS Europe 2004: 18th Annual Passive Components Conference, October 18-21, 2004
Polymer - a soft, elastic material.
Process involves conversion at room Temperature.
MnO2 - a hard, crystalline material.
process involves dip at +25 and conversion at
+250 to +270.
MnO2 Ta Polymer Ta
Stress of Polymer induced by respectively different CTE btw materials is insignificant
comparing to Manganese.
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4. Core Technology Market’s Needs & Samsung’s Reply
Technical Trend Needs Solutions
• High performance
• High mobility
• Ultra slim
& portable
• High capacitance
• High efficiency
• LOW ESR
• No Acoustic Noise
• Down sizing &
Low profile
• High CV Powder
• Volume efficiency
• Conductive polymer
Ultra low ESR, Small size
Polymer tantalum capacitor
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4. Core Technology Q
(CV
) p
er
vo
lum
e
Year 2010 2012 2013
25.2
123.4
231.3
3528 6.3V47F 1.2Tmax
Powder : 70kCV
100
200
300 2012 6.3V47F 1.0Tmax
Powder : 150kCV
1608 6.3V47F 1.0Tmax
Powder : 200kCV 400
Q per volume(based on 47) : 25.2 (‘10) 123.4(’12) 231.3(’13)
Q per volume = C(capacitance)ⅹV(Voltage) / chip volume
Volume efficiency
(Technological achievement)
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4. Core Technology Low ESR
(Technological achievement)
ESR level : 35m (Dec.’11) 9m (2Q.’13) 6m(4Q.’13)
2010 2011 2012 2013
ES
R
35m
75m
6.3V150F
25m
15m
9m 6m 4m
6.3V150F
2.5V330F
2.5V330F 2.5V470F
2.5V680F
6.3V150F
High-conductive polymer synthesis
LF mat’l change
Seed polymer quantity control
Fine carbon application
Polymer thickness control
Seed polymer quality up
Oligomer removal tech.
Polymer orientation up
Polymer surface modification
hybrid carbon application
Multi-pellet structure
Multi-lead structure Year
3528 size
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Inner
structure
Representative
Model
(1608-1.0Tmax) 6.3V 10F, 500m 6.3V 47F, 150m
Volume
Efficiency * 22%
36%
(1.6 times)
50%
(2.3 times)
6.3V 22F, 300m
6.3V 33F, 200m
PC* series
(Normal)
PCF series
(Face-down)
PFL series
(Frameless)
4. Core Technology Downsizing & High Cap
(Volume efficiency)
For high capacitance,
developed new inner structure with high volume efficiency
※ Volume efficiency = pellet volume
chip volume × 100%
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500nm 500nm
※ CV : capacitance voltage
100kCV 200kCV 300kCV
Conventional ’10 ’14
Powder
’12
High CV powder = high specific area powder
ACV;d
AC ro
ro
o : permittivity of vacuum
r : relative permittivity of Ta2O5
A : specific surface area, d : Ta2O5 layer thickness
: anodization constant, VF : formation voltage
Year ’10 ’12 ’13 ’14
Powder 150kCV 200kCV 250kCV 300kCV
BET / m2/g 3.3 4.4 5.5 6.6
Particle size / nm ~ 90 ~ 68 ~55 ~45
150kCV
500nm 500nm
4. Core Technology Downsizing & High Cap
(High CV powder)
High capacitance : High CV powder application
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1. R (Ta wire) + R(Ta metal )
2. R (polymer)
3. Ri (polymer/carbon)
4. R (carbon)
5. Ri (carbon/silver)
6. R (silver)
Ta (anode)
Wire + Porous Ta Ta2O5
(dielectrics)
Cathode, polymer
Carbon
Silver
ESR Resistance of component materials
Interfacial resistance
Focusing on
1) outer polymer layer and 2) interface between polymer and carbon
4. Core Technology Low ESR
(Conductive cathode)
Factors determining ESR
[ Figure T11 Schematic of Tantalum capacitor device]
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5. Roadmap Polymer Tantalum
(3216 and 3528 size)
* PFL (Frameless type) 1. Figure in the box : ESR(mΩ)
Size Rated V 6.8F 15F 33F 47F 100F 150F 220F 330F 470F
3216-1.8T
2.5 35
6.3 35 35/25
3528-2.0T
2.5 35/25 15 15 9 6*
6.3 70/40/35 70/40/35 70/35/25 35/25 25/15
10 70/35 70/35
16 70
25 90 90
’13. 2Q Developed MP ’13. 3Q ’13. 4Q
World 1st product
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5. Roadmap Polymer Tantalum
(Small size and low profile)
1. Figure in the box : ESR(mΩ)
Size Rated V 2.2F 4.7F 10F 22F 33F 47F 100F 150F 220F
1608
1.0T
6.3 500 500 300 200 200*
10 500 500
0.8T 6.3 300 200* 200*
2012
1.2T 10 1000
1.0T 6.3 200/150 150 *
0.8T 6.3 200 200
3216-1.0T 6.3 100* 100/70*
3528
1.5T 6.3 70/35 200 70/35
1.2T 6.3 70/35 70/35
1.0T 6.3 70/35*
* PFL (Frameless type)
World 1st product
’13. 2Q Developed MP ’13. 3Q ’13. 4Q
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Appendix
Series Description Identifier
PCS
Polymer type
Normal structure
General/Small/High Cap
Lead-free/Conform to RoHS
TCPCSxxxxxxxxxxxxx
2012 / 3216 / 3528 size
PCL
Polymer type
Normal structure
Low Profile
Lead-free/Conform to RoHS
TCPCLxxxxxxxxxxxxx
3216 / 3528 size
PCM
Polymer type
Normal structure
Miniaturization
Lead-free/Conform to RoHS
TCPCMxxxxxxxxxxxxx
1608 size
PCF
Polymer type
Facedown structure
Small size/Low profile/High Cap
Lead-free/Conform to RoHS
TCPCFxxxxxxxxxxxxx
1608 / 2012 size
PFL
Polymer type
Frameless structure
Small size/Low profile/High Cap
Lead-free/Conform to RoHS
TCPFLxxxxxxxxxxxxx
1608 / 2012 / 3216 size
Polymer product line
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Appendix Line-Up
(3528 size)
P/N
Dimension Rated Capacitance DF ESR LC
(L*W*H,mm) Voltage @120,25 @120,25 @100,25 (uA,Max)
(V) (uF,±20%) (%,Max) (mΩ,Max)
TCPCS0E227MBAR0035
3528 2.0t
2.5
220
8 35 55.0
TCPCS0E227MBAR0025 8 25 55.0
TCPCS0E227MBAR0015 8 15/300kHz 55.0
TCPCS0E337MBAR0015 330
8 15/300kHz 82.5
TCPMS0E337MBAR0009 8 9/300kHz 165.0
TCPCS0J476MBAR0070
6.3
47
8 70 29.6
TCPCS0J476MBAR0040 8 40 29.6
TCPCS0J476MBAR0035 8 35 29.6
TCPCS0J107MBAR0070
100
8 70 63.0
TCPCS0J107MBAR0045 8 45 63.0
TCPCS0J107MBAR0040 8 40 63.0
TCPCS0J107MBAR0035 8 35 63.0
TCPCS0J157MBAR0070
150
8 70 94.5
TCPCS0J157MBAR0035 8 35 94.5
TCPCS0J157MBAR0025 8 25 94.5
TCPCS0J227MBAR0035 220
8 35 139.0
TCPCS0J227MBAR0025 8 25 139.0
TCPCS1A336MBAR0070
10
33 8 70 33.0
TCPCS1A336MBAR0035 8 35 33.0
TCPCS1A476MBAR0070
47
8 70 47.0
TCPCS1A476MBAR0040 8 40 47.0
TCPCS1A476MBAR0035 8 35 47.0
Sample available
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Appendix Line-Up
(Small size & Low Profile)
P/N
Dimension Rated Capacitance DF ESR LC
(L*W*H,mm) Voltage @120,25 @120,25 @100,25 (uA,Max)
(V) (uF,±20%) (%,Max) (mΩ,Max)
TCPCS0J476MLAR0070
3528 1.5t 6.3
47
8 70 29.6
TCPCS0J476MLAR0040 8 40 29.6
TCPCS0J476MLAR0035 8 35 29.6
TCPCS0J157MLAR0200
150
10 200 94.5
TCPCS0J157MLAR0070 8 70 94.5
TCPCS0J157MLAR0035 8 35 94.5
TCPCL0J476MTAR0070
3528 1.2t 6.3
47
8 70 29.6
TCPCL0J476MTAR0040 8 40 29.6
TCPCL0J476MTAR0040 8 35 29.6
TCPCL0J107MTAR0070 100
8 70 63.0
TCPCL0J107MTAR0035 8 35 63.0
TCPFL0J107MAAR101S 3216 1.0t 6.3 100 10 100 126.0
TCPCS1A475MPAR1000 2012 1.2t 10 4.7 6 1000 5.0
TCPCF0J476MRAR0200
2012 1.0t 6.3 47
10 200 59.2
TCPCF0J476MRAR0150 10 150 59.2
TCPFL0J107MPAR151S 100* 10 150 126.0
TCPCM0J475MJAR0500
1608 1.0t 6.3
4.7 6 500 10.0
TCPCM0J106MJAR0500 10
6 500 10.0
TCPCM0J106MJAR0300 6 200 10.0
TCPCF0J226MJAR0300 22 10 300 27.7
TCPCF0J336MJAR0300 33* 10 200 41.6
TCPFL0J476MJAR201S 47* 10 200 59.2
TCPCM1A475MJAR0500 10 4.7 6 500 10.0
TCPCM1A225MKAR0500 1608 0.9t 10 2.2 6 500 2.2
Sample available * world first
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Thank you