China 14%
Europe
14%
India 1%
Japan
22%
Korea
10%
Americas 26%
Singapore 2%
Taiwan 11%
1’926 Members As of June 2012
Location of SEMI Member
Total Members by Size
Under $5 M
67%$1B - $2B
1%
$500M - $1B
1%
$100M - $500M
3%
Over $2.5B
>1%
$25M - $100M
6%
$5M - $25M
22%
Global presence:
Offices in Silicon Valley, Washington D.C., Belgium, China, France, Germany, India, Japan, Korea, Russia, Singapore and Taiwan
Mike Allison
Managing Dir
Edwards
Alain Astier
Group VP
STMi
Heinz M. Esser
CEO
R&R Ortner
Gilbert Declerck
Board Member
IMEC
Rob Hartman
VP,
ASML
Volker Braetsch
VP Marketing
Siltronic
André Auberton
CEO,
Soitec
Michael Hummel
General Manager
Texas Instruments
Eric Maiser
Sector Head
VDMA
Eicke Weber
President
ISE
Paul Hyland
CEO,
Aixtron
Steenkamp
COO
Centrotherm
Andreas Dill
CEO, Oerlikon
Advanced Tech.
Gabriel Crean
VP
CEA / Letî
Frank Averdung
CEO
Suss MicroTec
Alain Jarre
CEO
Recive Techn.
SEMI Europe Advisory Board
7 7
European Advisory Board • Mike Allison, Edwards
• Alain Astier, STMicroelectronics • André-Jacques Auberton-Hervé, Soitec
• Harald Binder
• Volker Braetsch, Siltronic • Gilbert Declerck, IMEC
• Heinz-Martin Esser, Roth&Rau
• Rob Hartman, ASML • Michael Hummel, Texas Instruments
• Eric Maiser, VDMA Productronic
• Gerhard Rauter • Franz Richter, Thin Materials
• Andreas Dill, Oerlikon
• Eicke Weber, FhG ISE
Russian Advisory Committee • Alain Astier, ST Microelectronics
• Martin Beigl, M+W Group
• Jacques Berg, Tokyo Electron • Alois Brandner, Applied Materials
• Jarek Dolak, SVCS
• Valery Dshkhunyan, Angstrem • Andrey Golushko, Mikron
• Andrey Kotenko, NITOL Solar
• Igor Kucheryavy, Tronic Pte. (chairman) • Alexander Kurliandsky, Electronintorg SP
• Michael Lev, Camtek
• Elena Lysyak, Centrotherm SiTec GmbH • Hermann Marsch, Maicom Quartz
• Anatoly Sukhoparov, Angstrem T
• Manfred Schroeder, EBARA • Torsten Thieme, Memsfab
• Dagmar Vogt, Vogt Group SE
SEMI PV Group Europe Committee • Harald Binder • Jim Thompson, Executive Vice President Sales & Marketing, Oerlikon Solar
• Andreas Guenther, President, Linde Nippon Sanso Europe
• Dagmar Vogt, Managing Director, ibVogt Group • Dieter Manz, CEO, Manz Automation
• Horst Reichardt, CEO & President, DAS
• Jürgen Gutekunst, CEO, Rena • Lutz Redmann, Jonas & Redmann
• Prof. Eicke Weber, Fraunhofer ISE
• Louis Shaffer, Edwards Vacuum • Karl Hesse, Director Process Design, Wacker
• Manfred Schröder, President, Ebara Europe
• Mr. Roth, Founders, Roth & Rau • Peter Abel, CEO, PVA TePla
• Peter Pauli, CEO, Meyer Burger
Semiconductor Technology Conferences • Wolfgang Arden, Infineon
• Michael Arnold, PEER Group • Livio Baldi, Numonyx
• Prof. J.W. BarthaJohann Bartha, Technical University Dresden
• Tom Beens, Umicore • Jacques Berg, Tokyo Electron
• Alain Brochet, STMicroelectronics
• Roger de Keersmaecker, IMEC • Guy Dubois
• Bruno Ghyselen, Soitec
• Mart Graef, TU Delft (chairman) • Martin Heerschop, GE Capital
• Didier Louis, CEA-Leti
• Martin McCallum, Nikon • Richard Oechsner, Fraunhofer IISB
• Lothar Pfitzner, Fraunhofer IISB
• Ivo Raaijmakers, ASM International • Peter Schaeffler, Texas Instruments
• Karsten Schneider, Applied Materials
• Francis Taroni, Altis Semiconductor
Manufacturing Test Conference • Davide Appello, STMicroelectronics
• Roger Barth, Numonyx
• Stefan Eichenberger, NXP • Stefan Gasteiger, Advantest
• Michael Goldbach, LTX
• Klaus-Detlef Paesch, GlobalFoundries • Chris Portelli-Hale, STMicroelectronics (co-chair)
• Ulrich Schoettmer, Verigy
• Martin Stadler, Teradyne (co-chair) • René Segers
MEMS Conference • Jérémie Bouchaud, iSuppli
• Jean-Christophe Eloy, Yole Développement • Markus Gabriel, Suss MicroTec
• Erik Jung, Fraunhofer IMZ
• Gerhard Lammel, Bosch (chairman)
• Paul Lindner, EVG • Mikko Montonen, Okmetic
• Felix Rudolf, Colibrys
• Christian Schaefer, PVA Tepla • Uwe Schwarz, X-Fab
Advanced Packaging Conference • Rolf Aschenbrenner, Fraunhofer IZM
• Eef Bagerman, NXP • Eric Beyne, IMEC
• Andreas Dill, Oerlikon
• Andreas Fischer, Bosch • Philip Homami, F+K Delvotec
• Andy Longford, PandA Europe (chairman)
• Jens Mueller, IMAPS Europe Chapter • Graham Jones, Henkel
• Steffen Kroehnert, Nanium
• Thomas Oppert, PAC TECH • Klaus Pressel, Infineon
• Mark Shaw, STMicroelectronics
• Ignas van Dommelen, Sencio
ISS Conference • Alain Astier, STMicroelectronics • Paul Boudre, Soitec
• David Brough, Tokyo Electron
• Cor Claeys, IMEC (chairman) • Peter Connock, memstar® Technology
• Horst Gant, Infineon
• Maurice Geraets, NXP • Bernd Haeuser, Bosch
• Leonard Hobbs, Intel
• Hans Richter, IHP • Gerd Teepe, GlobalFoundries
SEMI International Standards Program • Werner Bergholz, University of Bremen (chairman)
• Roland Bindemann, Freiberger Compound Materials • Massimo Carrubba, Numonyx
• Jean-Marie Collard, Solvay (chairman)
• Gummaar De Vos, FFEM • Gordon Ferrier, Air Products
• Alfred Honold, InReCon
• Wolfgang Jantz, SemiMap • Andy Longford, PandA Europe
• Frank Petzold, Trustsec IT Solution
• Lothar Pfitzner, Fraunhofer IISB • Bert Planting, ASML
• Peter Wagner
• Arnd-Dietrich Weber, SiCrystal
IP Committee • Brandon Clark, Air Liquide
• Menso Hendriks, ASM
• Erik Johannesson, Micronic Laser Systems • Gerhard Kontrus, LAM
• Cees Lanting, CSEM
• Michael Lev, Camtek • Jan Halbe Lunshof, MAPPER
• Thomas Renner, Siltronic
• Vincent Ryckaert, IMEC • Gerd Strauch, Aixtron
• Thierry Sueur, Air Liquide
• Dieter Franke, SCHOTT Solar • Geert Defieuw, Umicore
• Véronique Robert-Dussouillez, CEA
• Joerg Baur, Oerlikon • Robert Harrison, 24 IP Law Group
• Ton van Hoef, ASML
SEMI European Award • Brendan Bold, X-Fab • Michel Brillouet, CEA-LETI
• Elmar Cullmann, Suss MicroTec
• Giorgio De Santi, Numonyx • Mart Graef, TU Delft (chairman)
• Jean-Pierre Joly, INES
• Peter Kuecher, Fraunhofer CNT • Klaus-Dieter Lang, Fraunhofer IZM
• Lode Lauwers, IMEC
• Heiner Ryssel, Fraunhofer IISB
150 SEMI Europe Experts
Sales Trend by Unit
10
Source: SEMI World Fab Forecast, August 2012
Installed Capacity by Region
$0
$5
$10
$15
$20
$25
$30
$35
$40
$45
$50
Wafer Process Assembly & Pack. Test Other
Other 2.00 1.11 1.98 2.07 2.19 3.03
Test 3.45 1.55 4.14 3.77 3.78 3.99
Assembly & Pack. 2.04 1.41 3.88 3.34 3.37 3.48
Wafer Process 22.03 11.84 29.91 34.34 33.04 36.21
2008 (A) 2009 (A) 2010 (A) 2011 (A) 2012 (F) 2013 (F)
US
$ B
illi
on
s
Totals may not add due to rounding
Source: SEMI, July 2012
SEMI Equipment Forecast
$0$5
$10$15$20$25$30$35$40$45$50
N. America Japan Taiwan Europe S.Korea China ROW
ROW 2.61 1.44 3.84 3.41 2.43 3.04
China 1.89 0.94 3.68 3.65 3.10 3.92
S.Korea 4.89 2.60 8.63 8.66 11.48 12.14
Europe 2.45 0.97 2.33 4.22 3.20 3.29
Taiwan 5.01 4.35 11.25 8.52 9.26 9.16
Japan 7.04 2.23 4.44 5.81 4.35 5.03
N. America 5.63 3.39 5.75 9.26 8.56 10.13
2008 (A) 2009 (A) 2010 (A) 2011 (A) 2012 (F) 2013 (F)
Source: SEMI, July 2012 Totals may not add due to rounding
US
$ B
illi
on
s
SEMI 2012 Equipm. Forecast
Source: Rose Associates 1978 to 1995; SEMI SMG 1995 to 2011; SEMI
0
500
1'000
1'500
2'000
2'500
3'000
3'500
4'000
4'500
5'000
5'500
6'0001
97
81
97
91
98
01
98
11
98
21
98
31
98
41
98
51
98
6
19
87
19
88
19
89
19
90
19
91
19
92
19
93
19
94
19
95
19
96
19
97
19
98
19
99
20
00
20
01
20
02
20
03
20
04
20
05
20
06
20
07
20
08
20
09
20
10
20
11
20
12
F2
01
3F
Millio
ns
of
Sq
ua
re In
ch
es
75 mm
100 mm 150 mm
125 mm
200 mm
300 mm
Includes polished and epi wafers. Excludes reclaim, non polished, and SOI.
Wafer Diameter Trend
LED Epitaxy capacity (4” equivalent per month)
Source: SEMI Opto/LED Fab Forecast, August 2012
World LED Capacity Trend
Material Market
Europe7%
Japan20%
North America
10%
Korea15%
Taiwan21%
China10%
ROW17%
Totals may not add due to rounding 2011 = $47.9 Billion
2011 2012F %
$B $B Change
Europe 3.38 3.46 2%
China 4.87 5.17 6%
North America 4.92 5.01 2%
South Korea 7.15 7.46 4%
Southeast Asia 8.17 8.39 3%
Japan 9.34 9.50 2%
Taiwan 10.04 10.27 2%
Total Regions 47.86 49.26 3%
Region
Source: SEMI Materials Market Data Subscription, July 2012
Regional Materials Markets
Source: SEMI Silicon Manufacturers Group, July 2012
Worldwide Wafer Area Shipment Index
(Three-month moving average)
50
70
90
110
130
150
170
190
210
230
250
Jan
-03
May-0
3
Sep
-03
Jan
-04
May-0
4
Sep
-04
Jan
-05
May-0
5
Sep
-05
Jan
-06
May-0
6
Sep
-06
Jan
-07
May-0
7
Sep
-07
Jan
-08
May-0
8
Sep
-08
Jan
-09
May-0
9
Sep
-09
Jan
-10
May-1
0
Sep
-10
Jan
-11
May-1
1
Sep
-11
Jan
-12
May-1
2
Silicon Area Shipment Index
Source: LINX-Consulting (www.linx-consulting.com)
TSV Materials Forecast
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