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IMAGINE Higher Reliability. Better Thermal Performance. More Versatility. Semiconductor Packaging Materials Selection Guide
IMAGINEHigher Reliability.
Better Thermal Performance. More Versatility.
Semiconductor Packaging Materials Selection Guide
Dow Corning Electronics is a leading supplier of silicon-based materials for wire bond, flip chip and advanced packaging applications. In addition to our current product line of encapsulants, die attach adhesives, lid seal adhesives and thermal interface materials, Dow Corning is investing in the development of new materials technology to meet the challenging needs of emerging applications.
Dow Corning leads by delivering innovative products, application technologies and a reliable global supply chain and technical support, making it easy to do business and win in your markets.
This materials selection guide is intended to provide information on wire bond, flip chip and wafer level packaging materials from Dow Corning.
We encourage you to contact our sales and service experts for any additional information at [email protected]. You can also learn more at dowcorning.com/electronics.
Improve the performance and reliability of integrated circuits.
for Semiconductor Assembly and Packaging
SOLUTIONSDOW CORNING® brand
1 Thermally conductive adhesives for structural bonding
2 Thermally conductive gels for better stress compliance in high-performance applications
3 Standard and snap-cure sealants for lid attach
4 Stress-relieving encapsulants for ICs and MEMS sensors
5 Performance die attach adhesives for ICs and MEMS sensors
1 2
3
3 5
4
SOLUTIONS
Product Description Application Method1 or 2 Part
Mixing Ratio(s)
Typical Cure Process(es)
PROPERTIES BEFORE CURE PHYSICAL PROPERTIES AFTER CURE ELECTRICAL PROPERTIES AFTER CURE
Col
or
Low
Ioni
c Im
purit
y
(Na+
, K+,
Cl-)
Spe
cific
Gra
vity
Vis
cosi
ty, c
P o
r mP
a•s
Mod
ulus
, MP
a
CTE
, ppm
/°C
Har
dnes
s, D
urom
eter
S
hore
Elo
ngat
ion
at B
reak
, %
Die
lect
ric S
treng
th,
kV/m
m
Die
lect
ric C
onst
ant
Volu
me
Res
istiv
ity,
ohm
-cm
Dis
sipa
tion
Fact
or
DIE ENCAPSULANTS AND COATINGS
Dow Corning® ME-6820 Microelectronic Encapsulant
Die encapsulant for wire bond packaging Automatic or manual needle dispense 1 NA Black YES 1.3 64,400 60 min @
150° C 1.6 225 54 A 40 18.0 4.0 @ 0.1 MHz 3.20 x 1015 0.002 @
0.1 MHz
HIPEC® Q1-4939 Semiconductor Protective Coating
Die coating for wire bond packaging Meter mix dispense 2
1:1, 2:1, 5:1, 8:1,
10:1Clear YES 1.0 4,900–
5,800120 min @
150° C Varies 260 44 A at 1:1 95 19.0 2.7 @
0.1 MHz 1.00 x 1015 0.0002 @ 0.1 MHz
HIPEC® R 6101 Semiconductor Protective Coating
Die coating for wire bond packaging Automatic or manual needle dispense 1 NA Clear YES 1.0 6,575 120 min @
150° C 0.7 350 31 A 250 18.7 2.8 @ 0.1 MHz 1.50 x 1015 NA
HIPEC® R 6102 Semiconductor Protective Coating
Die coating for wire bond packaging Automatic or manual needle dispense 1 NA Black YES 1.1 4,970 120 min @
150° C 0.7 325 33 A 140 20.3 2.8 @ 0.1 MHz 1.40 x 1015 NA
Dow Corning® 4195 Low Visc Diode Coating
Die coating for wire bond packaging Automatic or manual needle dispense 1 NA White YES 1.2 4,075 60 min @
150° C NA NA 50 A 55 19.0 3.0 @ 0.1 MHz 4.20 x 1014 0.0002 @
0.1 MHz
Dow Corning® JCR 6110 A/B Die coating for wire bond packaging Meter mix dispense 2 100:1 Clear YES 1.0 2,000 60 min @
150° C NA NA Gel Gel 18.0 2.7 @ 1 MHz 4.00 x 1014 1E-04 @
1 MHz
DIE ATTACH ADHESIVES
Dow Corning® 7920 Die Attach Adhesive
Die attach adhesive for wire bond packaging Automatic or manual needle dispense 1 NA Black YES 1.2 21,000 30 min @
150° C 14 240 74 A 25 19.1 2.8 @ 0.1 MHz 2.10 x 1015 0.0002 @
0.1 MHz
Dow Corning® 7920 LV Die Attach Adhesive
Die attach adhesive for wire bond packaging Needle or jet dispense 1 NA Black YES 1.2 14,500 60 min @
150° C 6.8 240 70 A 120 21 3.0 @ 1 MHz 1.70 x 1015 0.0019 @
1 MHz
Dow Corning® DA-6633 Die Attach Adhesive
Die attach adhesive for wire bond packaging Screen or stencil printing 1 NA White YES 1.2 156,200 60 min @
150° C 3.9 275 66 A 160 19.0 3.0 @ 0.1 MHz 2.90 x 1014 0.0002 @
0.1 MHz
Dow Corning® DA 6501 Adhesive
Die attach adhesive for wire bond packaging Automatic or manual needle dispense 1 NA Translucent YES 1.0 7,300 60 min @
150° C 0.9 300 31 A 240 25.0 2.8 @ 1 MHz 3.00 x 1016 0.0008 @
1 MHz
Dow Corning® DA 6503 Adhesive
Die attach adhesive for wire bond packaging Automatic or manual needle dispense 1 NA Translucent YES 1.0 7,300 60 min @
150° C 1.1 330 33 A 240 27.0 2.7 @ 1 MHz 4.00 x 1016 0.0005 @
1 MHz
Dow Corning® OE-8001 Die Attach Adhesive
Die attach adhesive for wire bond packaging Automatic or manual needle dispense 1 NA Translucent NA 1.1 8,400 60 min @
150° C 620 NA 61 D NA NA NA NA NA
Dow Corning® EA-6410 Low Viscosity Microelectronics Adhesive
Die attach adhesive for wire bond packaging Automatic or manual needle dispense 1 NA Black YES 1.5 13,800 60 min @
150° C 13.9 180 80 A 15.2 20.0 3.3 @ 0.1 MHz 2.80 x 1015 0.001 @
0.1 MHz
SILICON-BASED MATERIALS FOR WIRE BOND PACKAGING APPLICATIONS
DIE ATTACH ADHESIVESUBSTRATE
EPOXY MOLDING COMPOUND DIE COATING
Product Description Application Method1 or 2 Part
Mixing Ratio(s)
Typical Cure Process(es)
PROPERTIES BEFORE CURE PHYSICAL PROPERTIES AFTER CURE ELECTRICAL PROPERTIES AFTER CURE
Col
or
Low
Ioni
c Im
purit
y
(Na+
, K+,
Cl-)
Spe
cific
Gra
vity
Vis
cosi
ty, c
P o
r mP
a•s
Mod
ulus
, MP
a
CTE
, ppm
/°C
Har
dnes
s, D
urom
eter
S
hore
Elo
ngat
ion
at B
reak
, %
Die
lect
ric S
treng
th,
kV/m
m
Die
lect
ric C
onst
ant
Volu
me
Res
istiv
ity,
ohm
-cm
Dis
sipa
tion
Fact
or
DIE ENCAPSULANTS AND COATINGS
Dow Corning® ME-6820 Microelectronic Encapsulant
Die encapsulant for wire bond packaging Automatic or manual needle dispense 1 NA Black YES 1.3 64,400 60 min @
150° C 1.6 225 54 A 40 18.0 4.0 @ 0.1 MHz 3.20 x 1015 0.002 @
0.1 MHz
HIPEC® Q1-4939 Semiconductor Protective Coating
Die coating for wire bond packaging Meter mix dispense 2
1:1, 2:1, 5:1, 8:1,
10:1Clear YES 1.0 4,900–
5,800120 min @
150° C Varies 260 44 A at 1:1 95 19.0 2.7 @
0.1 MHz 1.00 x 1015 0.0002 @ 0.1 MHz
HIPEC® R 6101 Semiconductor Protective Coating
Die coating for wire bond packaging Automatic or manual needle dispense 1 NA Clear YES 1.0 6,575 120 min @
150° C 0.7 350 31 A 250 18.7 2.8 @ 0.1 MHz 1.50 x 1015 NA
HIPEC® R 6102 Semiconductor Protective Coating
Die coating for wire bond packaging Automatic or manual needle dispense 1 NA Black YES 1.1 4,970 120 min @
150° C 0.7 325 33 A 140 20.3 2.8 @ 0.1 MHz 1.40 x 1015 NA
Dow Corning® 4195 Low Visc Diode Coating
Die coating for wire bond packaging Automatic or manual needle dispense 1 NA White YES 1.2 4,075 60 min @
150° C NA NA 50 A 55 19.0 3.0 @ 0.1 MHz 4.20 x 1014 0.0002 @
0.1 MHz
Dow Corning® JCR 6110 A/B Die coating for wire bond packaging Meter mix dispense 2 100:1 Clear YES 1.0 2,000 60 min @
150° C NA NA Gel Gel 18.0 2.7 @ 1 MHz 4.00 x 1014 1E-04 @
1 MHz
DIE ATTACH ADHESIVES
Dow Corning® 7920 Die Attach Adhesive
Die attach adhesive for wire bond packaging Automatic or manual needle dispense 1 NA Black YES 1.2 21,000 30 min @
150° C 14 240 74 A 25 19.1 2.8 @ 0.1 MHz 2.10 x 1015 0.0002 @
0.1 MHz
Dow Corning® 7920 LV Die Attach Adhesive
Die attach adhesive for wire bond packaging Needle or jet dispense 1 NA Black YES 1.2 14,500 60 min @
150° C 6.8 240 70 A 120 21 3.0 @ 1 MHz 1.70 x 1015 0.0019 @
1 MHz
Dow Corning® DA-6633 Die Attach Adhesive
Die attach adhesive for wire bond packaging Screen or stencil printing 1 NA White YES 1.2 156,200 60 min @
150° C 3.9 275 66 A 160 19.0 3.0 @ 0.1 MHz 2.90 x 1014 0.0002 @
0.1 MHz
Dow Corning® DA 6501 Adhesive
Die attach adhesive for wire bond packaging Automatic or manual needle dispense 1 NA Translucent YES 1.0 7,300 60 min @
150° C 0.9 300 31 A 240 25.0 2.8 @ 1 MHz 3.00 x 1016 0.0008 @
1 MHz
Dow Corning® DA 6503 Adhesive
Die attach adhesive for wire bond packaging Automatic or manual needle dispense 1 NA Translucent YES 1.0 7,300 60 min @
150° C 1.1 330 33 A 240 27.0 2.7 @ 1 MHz 4.00 x 1016 0.0005 @
1 MHz
Dow Corning® OE-8001 Die Attach Adhesive
Die attach adhesive for wire bond packaging Automatic or manual needle dispense 1 NA Translucent NA 1.1 8,400 60 min @
150° C 620 NA 61 D NA NA NA NA NA
Dow Corning® EA-6410 Low Viscosity Microelectronics Adhesive
Die attach adhesive for wire bond packaging Automatic or manual needle dispense 1 NA Black YES 1.5 13,800 60 min @
150° C 13.9 180 80 A 15.2 20.0 3.3 @ 0.1 MHz 2.80 x 1015 0.001 @
0.1 MHz
Product Description Application Method
PROPERTIES BEFORE CURE
Typical Cure Process(es)
PROPERTIES AFTER CURE
Col
or
Low
Ioni
c Im
purit
y
(Na+
, K+,
Cl-)
Spe
cific
Gra
vity
Visc
osity
, cps
or m
Pa•
s
Thix
otro
py R
atio
Ther
mal
Con
duct
ivity
, W
/m•K
Mod
ulus
, MP
a
CTE
, ppm
/°C
Har
dnes
s, D
urom
eter
S
hore
A
Elo
ngat
ion
at B
reak
, %
Goo
d A
dhes
ion
LID SEAL ADHESIVES
Dow Corning® EA-6700 Microelectronic Adhesive Lid seal adhesive for flip chip packaging Automatic or manual needle
dispense Black YES 1.3 304,500 3.6 60 min @ 150° C 0.3 3.9 275 69 145 Ni, Al, Laminate
Dow Corning® EA-6900 Adhesive Lid seal adhesive for flip chip packaging and Pb-free solder ball reflow conditions
Automatic or manual needle dispense Black YES 1.3 405,600 2.6 60 min @ 150° C 0.2 3.9 260 65 190 Ni, Al, Laminate
Dow Corning® EA-6299 Microelectronics Adhesive Snap cure microelectronics adhesive Automatic or manual needle
dispense Black YES 1.2 480,000 4.6 <1 min @ 150° Cplus post-cure 0.2 5 250 70 130 Ni, Al, Laminate
THERMAL INTERFACE MATERIALS
Dow Corning® DA-6534 Adhesive Thermal interface material for flip chip packaging
Automatic or manual needle dispense Gray YES 4.4 100,000 2.0 120 min @ 150° C 6.8 100 100 92 75 Ni, Al, Laminate
Dow Corning® DA 6523 Adhesive Thermal interface material for flip chip packaging
Automatic or manual needle dispense Gray YES 3.6 22,400 4.6 60 min @ 150° C 1.8 20 150 90 30 Ni, Al, Laminate
Dow Corning® 1-4173 Thermally Conductive Adhesive
Thermal interface material for flip chip packaging
Automatic or manual needle dispense Gray NA 2.7 64,300 3.8 20 min @ 150° C or
30 min @ 125° C 1.8 30 125 92 20 Ni, Al, Laminate
Dow Corning® SE 4450 Thermally Conductive Adhesive
Thermal interface material for flip chip packaging
Automatic or manual needle dispense Gray NA 2.7 66,400 NA 60 min @ 150° C 1.9 NA 120 94 45 Ni, Al, Laminate
Dow Corning® TC-3040 Thermally Conductive Gel
Thermal interface material for flip chip packaging
Automatic or manual needle dispense Gray YES 2.4 90,000 2.5 60 min @ 150° C
or lower 4.3 0.018 NA NA 70 NA
SILICON-BASED MATERIALS FOR
FLIP CHIPPACKAGING APPLICATIONS
LID SEAL ADHESIVESUBSTRATE
HEAT SPREADER
TIM 1
Product Description Application Method
PROPERTIES BEFORE CURE
Typical Cure Process(es)
PROPERTIES AFTER CURE
Col
or
Low
Ioni
c Im
purit
y
(Na+
, K+,
Cl-)
Spe
cific
Gra
vity
Visc
osity
, cps
or m
Pa•
s
Thix
otro
py R
atio
Ther
mal
Con
duct
ivity
, W
/m•K
Mod
ulus
, MP
a
CTE
, ppm
/°C
Har
dnes
s, D
urom
eter
S
hore
A
Elo
ngat
ion
at B
reak
, %
Goo
d A
dhes
ion
LID SEAL ADHESIVES
Dow Corning® EA-6700 Microelectronic Adhesive Lid seal adhesive for flip chip packaging Automatic or manual needle
dispense Black YES 1.3 304,500 3.6 60 min @ 150° C 0.3 3.9 275 69 145 Ni, Al, Laminate
Dow Corning® EA-6900 Adhesive Lid seal adhesive for flip chip packaging and Pb-free solder ball reflow conditions
Automatic or manual needle dispense Black YES 1.3 405,600 2.6 60 min @ 150° C 0.2 3.9 260 65 190 Ni, Al, Laminate
Dow Corning® EA-6299 Microelectronics Adhesive Snap cure microelectronics adhesive Automatic or manual needle
dispense Black YES 1.2 480,000 4.6 <1 min @ 150° Cplus post-cure 0.2 5 250 70 130 Ni, Al, Laminate
THERMAL INTERFACE MATERIALS
Dow Corning® DA-6534 Adhesive Thermal interface material for flip chip packaging
Automatic or manual needle dispense Gray YES 4.4 100,000 2.0 120 min @ 150° C 6.8 100 100 92 75 Ni, Al, Laminate
Dow Corning® DA 6523 Adhesive Thermal interface material for flip chip packaging
Automatic or manual needle dispense Gray YES 3.6 22,400 4.6 60 min @ 150° C 1.8 20 150 90 30 Ni, Al, Laminate
Dow Corning® 1-4173 Thermally Conductive Adhesive
Thermal interface material for flip chip packaging
Automatic or manual needle dispense Gray NA 2.7 64,300 3.8 20 min @ 150° C or
30 min @ 125° C 1.8 30 125 92 20 Ni, Al, Laminate
Dow Corning® SE 4450 Thermally Conductive Adhesive
Thermal interface material for flip chip packaging
Automatic or manual needle dispense Gray NA 2.7 66,400 NA 60 min @ 150° C 1.9 NA 120 94 45 Ni, Al, Laminate
Dow Corning® TC-3040 Thermally Conductive Gel
Thermal interface material for flip chip packaging
Automatic or manual needle dispense Gray YES 2.4 90,000 2.5 60 min @ 150° C
or lower 4.3 0.018 NA NA 70 NA
How Can We Help You Today?Tell us about your performance, design and manufacturing challenges. Let us put our silicon-based materials expertise, application knowledge and processing experience to work for you. For more information about our materials and capabilities, visit dowcorning.com/electronics. To discuss how we could work together to meet your specific needs, email [email protected] or go to dowcorning.com/ContactUs for a contact close to your location. Dow Corning has customer service teams, science and technology centers, application support teams, sales offices and manufacturing sites around the globe.
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The information contained herein is offered in good faith and is believed to be accurate. However, because conditions and methods of use of our products are beyond our control, this information should not be used in substitution for customer’s tests to ensure that our products are safe, effective and fully satisfactory for the intended end use. Suggestions of use shall not be taken as inducements to infringe any patent.
Dow Corning’s sole warranty is that our products will meet the sales specifications in effect at the time of shipment.
Your exclusive remedy for breach of such warranty is limited to refund of purchase price or replacement of any product shown to be other than as warranted.
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SAC6221 Form No. 11-2062D-01
