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SEMIPACK ®  1

Rectifier Diode Modules

SKKD 46

Features

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Typical Applications*

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SKKD 46 THYRISTOR BRIDGE,SCR,BRIDGE

1 21-09-2005 HER © by SEMIKRON

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Fig. 11L Power dissipation per diode vs. forward current Fig. 11R Power dissipation per diode vs. ambient temperature

Fig. 12L Power dissipation of two modules vs. direct current Fig. 12R Power dissipation of two modules vs. case temperature

Fig. 13L Power dissipation of three modules vs. direct current Fig. 13R Power dissipation of three modules vs. case temperature

RECTIFIER,DIODE,THYRISTOR,MODULE

2 21-09-2005 HER © by SEMIKRON

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Fig. 14 Transient thermal impedance vs. time Fig. 15 Forward characteristics

Fig. 16 Surge overload current vs. time

SKKD 46 THYRISTOR BRIDGE,SCR,BRIDGE

3 21-09-2005 HER © by SEMIKRON

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Dimensions in mm

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* The specifications of our components may not be considered as an assurance of component characteristics.Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRONproducts in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. Wetherefore strongly recommend prior consultation of our personal.

RECTIFIER,DIODE,THYRISTOR,MODULE

4 21-09-2005 HER © by SEMIKRON