IPC Fall STANDARDS DEVELOPMENTCommittee Meetings
ON-SITE GUIDE
September 24–30, 2016Rosemont, Illinois
Co-located with
Stop by IPC Booth #245 to learn about recently released publications, including
IPC-A-600J; IPC-1601A; IPC-6012DA; North American PCB Market Report; IPC’s new
online learning platform, IPC EDGE; IPC’s Validation Services program; and more!
North Ballroom Foyer
South Ballroom Foyer
Skybridge to Parking Garage, Hotel Sofitel & Doubletree Hotel
IPC Committee Refreshment BreaksSaturday In meeting room
Sunday 7:30 am North Ballroom Foyer 10:00 am North Ballroom Foyer 3:00 pm North Ballroom Foyer
Monday 7:30 am North & South Ballroom Foyers 10:00 am North & South Ballroom Foyers 3:00 pm North & South Ballroom Foyers
Tues–Wed 7:30 am North & South Ballroom Foyers 10:00 am North Ballroom Foyer 3:00 pm North Ballroom Foyer
Thursday 7:30 am North Ballroom Foyer 10:00 am North Ballroom Foyer 3:00 pm North Ballroom Foyer
Skybridge to Hyatt Regency
Regist
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Event Code Time Chair/Moderator Room
SUMMARY AT A GLANCE
Saturday, September 24, 2016
J-STD-001 Task Group 5-22A 8:00 am–5:00 pm Cochair: Daniel Foster, CIT, Missile Defense Agency Cochair: Kathy Johnston, MIT, Raytheon Missile Systems
21
Sunday, September 25, 2016
Terms and Definitions Committee
2-30 8:00 am–9:00 am Cochair: Steven Bowles, L-3 Fuzing and Ordnance Systems, Cincinnati Cochair: Vicka Hammill, Honeywell Inc. Air Transport Systems
22
IPC-A-610 Task Group 7-31B 8:00 am–3:00 pm Cochair: Constantino Gonzalez, MIT, ACME Training & Consulting Cochair: Mary Muller, Crane Aerospace & Electronics
21
Joint Meeting — Printed Electronics Design Subcommittee and Printed Electronics Final Assembly Subcommittee
D-61/ D-64
8:00 am–5:00 pm Chair: Alan Burk, ALMAX Vice Chair: Richard Snogren, CID, Bristlecone LLC Cochair: Jeff Shubrooks, Raytheon Company Cochair: Michael Jawitz
34
Joint Meeting — IPC-A-600 and Rigid Printed Board Performance Specifications Task Groups
7-31A/ D-33A
9:00 am–4:30 pm Cochair: Mark Buechner, BAE Systems Cochair: Randy Reed, R. Reed Consultancy LLC
22
Assembly & Joining Committee 5-20 3:00 pm–4:30 pm Cochair: Daniel Foster, CIT, Missile Defense Agency Cochair: Leo Lambert, MIT, EPTAC Corporation Vice Chair: Karen Tellefsen, Ph.D., Alpha
21
Committee Chairman Council (By Invitation)
CCC 4:30 pm–6:00 pm Chair: David Bergman, IPC 21
Chairman Reception (By Invitation)
6:00 pm–7:00 pm South Ballroom Foyer
Monday, September 26, 2016
Joint Meeting — Printed Electronics Design Subcommittee and Printed Electronics Final Assembly Subcommittee
D-61/ D-64
8:00 am–8:45 am Chair: Alan Burk, ALMAX Vice Chair: Richard Snogren, CID, Bristlecone LLC Cochair: Jeff Shubrooks, Raytheon Company Cochair: Michael Jawitz
59
By Invitation Only: Product Assurance Committee
7-30 8:00 am–9:00 am Chair: Robert Cooke, NASA Johnson Space Center Vice Chair: Debbie Wade, MIT, Advanced Rework Technology-A.R.T
21
Component and Wire Solderability Specification Task Group
5-23B 8:00 am–10:00 am Chair: David Hillman, Rockwell Collins Vice Chair: Dennis Fritz, MacDermid-Enthone Electronics Solutions
33
Critical Components Traceability Task Group
2-19A 8:00 am–10:00 am Chair: Cameron Shearon, AT&T Services, Inc Vice Chair: Michael Ford, Mentor Graphics Corporation
50
Product Data Description and Electronic Documentation
2-16/ 2-40
8:00 am–10:00 am Chair: Karen McConnell, CID, Northrop Grumman Corporation Chair: Gary Carter, ThingWeaver Solutions Vice Chair: Jimmy Baccam, CID+, Lockheed Martin Missiles & Fire Control
60
Laminate/Prepreg Materials Subcommittee
3-11 8:00 am–12:00 pm Chair: Tony Senese, Panasonic Industrial Devices Sales Company of America (PIDSA) Vice Chair: Doug Sober, Essex Technologies
34
Stencil Cleaning Task Group 5-31G 8:00 am–12:00 pm Cochair: Greg Wade, Indium Corporation Cochair: Mike Bixenman, DBA, Kyzen Corporation
23
Supplier Declaration Subcommittee
2-18 8:00 am–12:00 pm Chair: Forrest Christian, Innovation Machine Ltd. 45
2
Event Code Time Chair/Moderator Room
SUMMARY AT A GLANCE
Printed Electronics Base Material/Substrates Subcommittee
D-62 8:45 am–9:30 am Chair: Scott Gordon, DuPont Teijin Films Vice Chair: Neil Bolding, MacDermid Autotype Inc
59
Solder Stencil Task Group 5-21E 9:00 am–10:00 am Chair: Jeff Schake, ASM Assembly Systems Vice Chair: William Kunkle, MET Stencil
21
Printed Electronics Functional Materials Subcommittee
D-63 9:30 am–10:15 am Chair: Josh Goldberg, Taiyo America Inc. Vice Chair: Anirban Basu, Sabic Innovative Plastics USA LLC
59
Printed Electronics Terms and Definitions Task Group
D-64A 10:15 am–11:00 am Chair: Ken Gann, Lab Tech 59
IPC/WHMA-A-620 Space Electronic Assemblies Addendum Task Group
7-31FS 10:15 am–12:00 pm Chair: Garry McGuire, NASA Marshall Space Flight Center Vice Chair: Kathy Johnston, MIT, Raytheon Missile Systems
50
J-STD-001/Conformal Coating Material & Application Industry Assessment Working Group
5-22 ARR
10:15 am–12:00 pm Chair: David Hillman, Rockwell Collins Vice Chair: Jason Keeping, Celestica Vice Chair: Linda Woody
21
Printed Board Process Capability, Quality and Relative Reliability Benchmark Test Subcommittee
D-36 10:15 am–12:00 pm Chair: Al Block, National Instruments Vice Chair: Michael Miller, NSWC Crane
22
Printed Circuit Board Solderability Specifications Task Group
5-23A 10:15 am–12:00 pm Chair: Gerard O’Brien, Solderability Testing and Solutions, Inc. Vice Chair: Michah Pledger, Vivint, Inc.
33
Test Methods Subcommittee 7-11 10:15 am–12:00 pm Chair: Joseph Russeau, Precision Analytical Laboratory, Inc. Vice Chair: Debora Obitz, MIT, NTS - Anaheim
32
Printed Electronics Test Method Development and Validation Subcommittee
D-65 11:00 am–11:45 am Cochair: Neil Bolding, MacDermid Autotype Inc Cochair: Weifeng Liu, Ph.D., Flextronics International
59
Printed Electronics Processes Subcommittee
D-66 1:00 pm–2:00 pm Chair: Neil Bolding, MacDermid Autotype Inc. 59
Data Connect Factory Subcommittee
2-17 1:00 pm–5:00 pm Chair: Jason Spera, Aegis Software Cochair: Mahi Duggirala, Flextronics International Cochair: Marc Peo, Heller Industries Inc.
45
SIR and Electrochemical Migration Task Group
5-32B 1:30 pm–3:00 pm Chair: Keith Sellers, NTS - Baltimore Vice Chair: Graham Naisbitt, Gen3 Systems Limited Vice Chair: Russell Shepherd, MIT, NTS - Anaheim
23
Test Coupon and Artwork Generation Task Group
1-10C 1:30 pm–3:00 pm Chair: Philip Henault, Raytheon Company Vice Chair: Nicholas Meeker, CAT, Inc.
22
Woven Glass Reinforcement Task Group
3-12D 1:30 pm–3:00 pm Chair: Mike Bryant, BGF Industries 32
High Speed/High Frequency Design Subcommittee
D-21 1:30 pm–5:00 pm Chair: Scott Bowles, L-3 Fuzing and Ordnance Systems, Cincinnati Vice Chair: Dana Korf, Multek Electronics Limited
33
Laboratory Report Declaration Task Group
2-18J 1:30 pm–5:00 pm Chair: JB Hollister, Apple Computer Inc. Cochair: Jason Gooden, Anthesis
50
Joint Meeting — J-STD-001 & IPC-A-610 Task Groups
5-22A/ 7-31B
1:30 pm–5:00 pm Cochair: Constantino Gonzalez, MIT, ACME Training & Consulting Cochair: Daniel Foster, CIT, Missile Defense Agency Cochair: Kathy Johnston, MIT, Raytheon Missile Systems Cochair: Mary Muller, Crane Aerospace & Electronics
21
Printed Electronics Committee D-60 2:00 pm–5:00 pm Cochair: Daniel Gamota Cochair: Neil Bolding, MacDermid Autotype Inc
59
3
Event Code Time Chair/Moderator Room Event Code Time Chair/Moderator Room
SUMMARY AT A GLANCE
Base Materials Roundtable Task Group
3-12E 3:15 pm–5:00 pm Chair: Terry Fischer, Hitachi Chemical Co. America, Ltd. 32
Cleaning Compatibility Task Group
5-31J 3:15 pm–5:00 pm Chair: Eddie Hofer, Rockwell Collins Vice Chair: Mike Bixenman, DBA, Kyzen Corporation
23
Current Carrying Capacity Task Group
1-10B 3:15 pm–5:00 pm Chair: Michael Jouppi, Thermal Man Inc. 22
Low Pressure Molding Task Group
5-33G 3:15 pm–5:00 pm Chair: Russell Steiner, Allegion Vice Chair: Eric Camden, Foresite, Inc.
60
Technical Activities Executive Committee (By Invitation)
TAEC 5:00 pm–7:00 pm Chair: Chris Mahanna, Robisan Laboratory 21
Tuesday, September 27, 2016
Bottom Termination Components Test Methods Task Group
5-22K 8:00 am–10:00 am Chair: Dan Stein, Dell Inc. Vice Chair: Ray Prasad, Ray Prasad Consultancy Group
33
High Frequency Signal Loss Test Methods Task Group
D-24D 8:00 am–10:00 am Chair: Xiaoming Ye, Intel Corporation Vice Chair: Brian Butler, Introbotix Corporation
50
Metallic Foil Task Group 3-12A 8:00 am–10:00 am Chair: Rolland Savage, Savage Consulting 52
Plated-Through Via Reliability-Accelerated Test Methods Task Group
6-10C 8:00 am–10:00 am Chair: Randy Reed, R. Reed Consultancy LLC 32
All Training Committees — Focus is training in general, all committees, all subjects.
ALL TRAINING CMTE
8:00 am–11:00 am 34
Conflict Minerals Data Exchange Task Group
2-18H 8:00 am–12:00 pm Cochair: Aidan Turnbull, Ph.D., BomCheck Cochair: Eric Straw, Rockwell Collins
53
Conformal Coating Task Group 5-33A 8:00 am–12:00 pm Chair: John Waryold, HumiSeal Division of Chase Corporation Vice Chair: Debora Obitz, MIT, NTS - Anaheim
21
DFX Standards Subcommittee 1-14 8:00 am–12:00 pm Cochair: Dock Brown, DfR Solutions Cochair: Karen McConnell, CID, Northrop Grumman Corporation
59
IPC-HDBK-620 Handbook Task Groups
7-31K 8:00 am–12:00 pm Chair: Robert Cooke, NASA Johnson Space Center Vice Chair: Sean Keating, CIT, Amphenol Limited (UK)
23
IPC-A-630 Task Group 7-31J 8:00 am–5:00 pm Cochair: Eddie Hofer, Rockwell Collins Cochair: Richard Rumas, Honeywell Canada Vice Chair: Dave Harrell, CIT, Via Sat Inc.
22
Bereskin Test Method Task Group
D-24B 10:15 am–12:00 pm Chair: David Wynants, Taconic Advanced Dielectric Division 50
Halogen-Free Materials Subcommittee
4-33 10:15 am–12:00 pm Chair: Doug Sober, Essex Technologies Group Inc. 52
Thermal Stress Test Methods Subcommittee
D-32 10:15 am–12:00 pm Chair: James Monarchio, TTM Technologies, Inc. Vice Chair: Jerry Magera, Motorola Solutions Vice Chair: Jose Rios, Massachusetts Institute of Technology
32
Conductive Anodic Filament (CAF) Task Group
5-32E 10:15 am–12:00 pm Chair: Karl A. Sauter, Oracle America, Inc. Vice Chair: Russell Shepherd, MIT, NTS - Anaheim Vice Chair: Graham K. Naisbitt, Gen3 Systems Limited
33
IPC-6012 Technical Training Committee
D-33AT 11:00 am–12:00 pm Chair: Don Dupriest, Lockheed Martin Missiles & Fire Control 34
Embedded Devices Process Implementation Subcommittee
D-55 1:30 pm–3:00 pm Chair: Rajesh Kumar, TTM Technologies Vice Chair: Bruce Hughes, AMRDEC MS&T EPPT
59
Flux Specifications Task Group 5-24A 1:30 pm–3:00 pm Chair: Brook Sandy-Smith, Indium Corporation Vice Chair: Keith Sellers, NTS - Baltimore
21
4
Event Code Time Chair/Moderator Room
SUMMARY AT A GLANCE
High Frequency Test Methods Task Group: Frequency-Domain Methods
D-24C 1:30 pm–3:00 pm Chair: Glenn Oliver, DuPont - RTP Vice Chair: John Coonrod, Rogers Corporation
32
IPC-A-610 Telecom Addendum 7-31BC 1:30 pm–3:00 pm Chair: Darrin Dodson, Nokia 52
Solder Mask Performance Task Group
5-33B 1:30 pm–3:00 pm Chair: Damon Rachell, CIT, NTS - Anaheim Vice Chair: Elizabeth Allison, CIT, NTS - Baltimore Vice Chair: Fonda Wu, Raytheon Company
34
Conflict Minerals Due Diligence Committee
E-30 1:30 pm–5:00 pm Cochair: John A. Ciba Cochair: David Carnevale, Dolby Laboratories
53
Fiber Optic Cable Acceptability Task Group
7-31M 1:30 pm–5:00 pm Chair: Robert Cooke, NASA Johnson Space Center Vice Chair: Sean Keating, CIT, Amphenol Limited (UK)
23
IPC-2221/2222 Task Group D-31B 1:30 pm–5:00 pm Chair: Gary Ferrari, MIT, FTG Circuits Vice Chair: Clifford Maddox, Boeing Company
33
IPC-A-610 Technical Training Committee
7-31BT 3:00 pm–4:00 pm Chair: Mary Muller, Crane Aerospace & Electronics Vice Chair: Helena Pasquito, MIT, EPTAC Corporation
34
Flip Chip Mounting Task Group 5-21G 3:15 pm–5:00 pm Chair: Vern Solberg, Solberg Technical Consulting 59
Ion Chromatography/Ionic Conductivity Task Group
5-32A 3:15 pm–5:00 pm Chair: John Radman, NTS - Denver Vice Chair: Joseph Russeau, Precision Analytical Laboratory, Inc.
32
Solder Alloy Task Group 5-24C 3:15 pm–5:00 pm Chair: Jennie Hwang, H-Technologies Group Vice Chair: David Adams, Rockwell Collins
21
UL/CSA Task Group 3-11F 3:15 pm–5:00 pm Chair: Doug Sober, Essex Technologies Group Inc. 52
J-STD-001 Technical Training Committee
5-22BT 4:00 pm–5:00 pm Chair: Daniel Foster, CIT, Missile Defense Agency Vice Chair: Zenaida Valianu, MIT, Celestica
34
Wednesday, September 28, 2016
Conformal Coating Requirements Working Group
5-33 AWG
8:00 am–10:00 am Chair: Douglas Pauls, Rockwell Collins Vice Chair: Jason Keeping, Celestica
22
Flexible Circuits Test Methods Subcommittee
D-15 8:00 am–10:00 am Chair: Russell Shepherd, MIT, NTS - Anaheim 23
High Speed/High Frequency Board Performance Subcommittee
D-22 8:00 am–10:00 am Chair: Lance Auer, Raytheon Missile Systems Vice Chair: Mahendra Gandhi, Northrop Grumman Aerospace Systems
32
Solder Paste Task Group 5-24B 8:00 am–10:00 am Cochair: Karen Tellefsen, Alpha Vice Chair: Bev Christian, ABC Electronics Manufacturing Consulting
53
Thermal Profiling Guide Task Group
5-22H 8:00 am–10:00 am Chair: Ray Prasad, Ray Prasad Consultancy Group Vice Chair: Robert Rowland, Axiom Electronics, LLC
59
7711/21 Training Committee 7-34T 8:00 am–12:00 pm Chair: Daniel Foster, CIT, Missile Defense Agency Vice Chair: Zenaida Valianu, MIT, Celestica
34
IPC/WHMA-A-620 Task Group 7-31F 8:00 am–5:00 pm Cochair: Brett Miller, USA Harness, Inc. Cochair: Richard Rumas, Honeywell Canada Vice Chair: Bud Bowen, Winchester Electronics Division Vice Chair: George Millman, Jr., MIT, Raytheon Missile Systems
21
Materials Declaration Task Group
2-18B 8:00 am–5:00 pm Cochair: Aidan Turnbull, Ph.D., BomCheck Cochair: Mark Frimann, Texas Instruments Inc.
33
IPC-HDBK-001 Task Group 5-22F 10:00 am–12:00 pm Chair: Daniel Foster, CIT, Missile Defense Agency Vice Chair: Kathy Johnston, MIT, Raytheon Missile Systems
32
Declaration of Shipping, Pack and Packing Materials Task Group
2-18F 10:15 am–12:00 pm Cochair: John Ciba, Jr. 34
5
Event Code Time Chair/Moderator Room Event Code Time Chair/Moderator Room
SUMMARY AT A GLANCE
Ball Grid Array Task Group 5-21F 10:15 am–12:00 pm Chair: Ray Prasad, Ray Prasad Consultancy Group 59
Flexible Circuits Specifications Subcommittee
D-12 10:15 am–12:00 pm Chair: Nick Koop, CID, TTM Technologies Vice Chair: Mahendra Gandhi, Northrop Grumman Aerospace Systems
23
Plating Processes Subcommittee
4-14 10:15 am–12:00 pm Cochair: George Milad, Uyemura International Corp. Cochair: Gerard O’Brien, Solderability Testing & Solutions, Inc.
53
Bottom Termination Components (BTC) Task Group
5-21H 1:30 pm–3:00 pm Cochair: Ray Prasad, Ray Prasad Consultancy Group Cochair: Vern Solberg, Solberg Technical Consulting
59
Flexible Circuits Design Subcommittee
D-11 1:30 pm–3:00 pm Chair: William Ortloff, Sr., Raytheon Company Vice Chair: Mark Finstad, CID, Flexible Circuit Technologies, Inc.
23
High Speed/High Frequency Base Materials Subcommittee
D-23 1:30 pm–3:00 pm Chair: Ed Sandor, Taconic Advanced Dielectric Division Vice Chair: Dan Welch, Rogers Corporation
53
Repairability Subcommittee 7-34 1:30 pm–3:00 pm Chair: Daniel Foster, CIT, Missile Defense Agency Vice Chair: Bruce Hughes, AMRDEC MS&T EPPT
34
Land Pattern Subcommittee 1-13 1:30 pm–5:00 pm Chair: Karen McConnell, CID, Northrop Grumman Corporation Vice Chair: Gary Ferrari, MIT, FTG Circuits
52
Microsection Subcommittee 7-12 1:30 pm–5:00 pm Chair: Russell Shepherd, MIT, NTS - Anaheim Vice Chair: Randy Reed, R. Reed Consultancy LLC
50
3-D Electronic Packages Subcommittee
B-11 3:15 pm–5:00 pm Cochair: Dudi Amir, Intel Corporation Cochair: Vern Solberg, Solberg Technical Consulting
59
Bare Board Cleanliness Assessment Task Group
5-32C 3:15 pm–5:00 pm Chair: David Lober, Kyzen Corporation Vice Chair: Joseph Russeau, Precision Analytical Laboratory, Inc.
22
Flexible Circuits Base Materials Subcommittee
D-13 3:15 pm–5:00 pm Chair: Clark Webster, ALL Flex LLC 23
Thursday, September 29, 2016
Corrosion of Metal Finishes Task Group
3-11G 8:00 am–10:00 am Chair: Bev Christian, ABC Electronics Manufacturing Consulting Vice Chair: Helen Holder, Hewlett-Packard Company
23
Requirements for Military Systems Working Group
5-22AD 8:00 am–10:00 am Chair: Gary Latta, SAIC Vice Chair: Daniel Foster, CIT, Missile Defense Agency
21
IPC/WHMA-A-620 Technical Training Task Group
7-31FT 8:00 am–12:00 pm Chair: Debbie Wade, MIT, Advanced Rework Technology-A.R.T Vice Chair: Gregg Owens, CIT, Millennium Space Systems
23
Technology Roadmap Subcommittee
8-41 8:00 am–12:00 pm Cochair: John Fisher, Interconnect Technology Analysis, Inc. Cochair: Michael Carano, RBP Chemical Technology, Inc.
33
Data Exchange for Aerospace and Defense Task Group
2-18K 8:00 am–5:00 pm Chair: N. Nagaraj, Ph.D., Papros, Inc. Cochair: Jean-Pierre Theret, Dassault Systemes Cochair: Rick Shanks, Pratt & Whitney Cochair: Walter Jager, ECD Compliance
22
Printed Board Process Effects Handbook Subcommittee
7-24 1:30 pm–4:00 pm Chair: Michael Carano, RBP Chemical Technology, Inc. 33
Friday, September 30, 2016
Data Exchange for Aerospace and Defense Task Group
2-18K 8:00 am–5:00 pm Chair: N. Nagaraj, Ph.D., Papros, Inc. Cochair: Jean-Pierre Theret, Dassault Systemes Cochair: Rick Shanks, Pratt & Whitney Cochair: Walter Jager, ECD Compliance
22
VOLUNTEER
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IPC Emerging Engineer Program
IPC MENTORS
• Develop your leadership skills by providing guidance to Emerging Engineers new to the industry, demonstrate your technical and organizational expertise.
• Expand your professional network.
• Ensure that your work on IPC programs continues.
JOIN THE IPC MENTORS TEAM
If you have at least 7 years of industry experience, and have worked on IPC programs for at least 5 years.
You can commit to:
• guidance of an IPC Emerging Engineer for the next 3 years.
• inthefirstyear,attendanceatIPCAPEXEXPO.
• forthesecondandthirdyear,attendanceatIPCAPEXEXPOortheFallCommittee Meetings with your Emerging Engineer.
Mentoring responsibilities include: participation in the candidateselectionprocess,briefingyourassignedIPCEmerging Engineer before and after meetings, making introductions to peers, and feedback to IPC twice each year.
Send your professional biography and ideas for this program to: [email protected].
IPC EMERGING ENGINEERS
• Grow your technical knowledge and organizational skills with participation in IPC committees for development of industry standards.
• Build connections for technology interchange.
• Become a valued contributor to the industry — like IPC Mentors.
BECOME AN IPC EMERGING ENGINEER
If you have worked in the industry less than 5 years or are a student in an engineering program at a University, and are ready to invest in your career.* *Up to one University student will be accepted into the 2017 program.
You can commit to:
• participation in IPC committee work on industry standards for the next 3 years.
• inthefirstyear,attendanceatIPCAPEXEXPO.
• for the second and third year, attendance at IPC APEXEXPOortheFallCommitteeMeetingswith your mentor.
Individuals selected as IPC Emerging Engineers will be awardedanAll-AccessPackagetoIPCAPEXEXPO(approximately $1,500 value) to learn about all that IPC has to offer the industry.
Send your resumé to: [email protected].
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