SFH 4776

1 Version 0.0 | 2018-08-28

Pre

limin

ary

data

shee

t ver

sion

Produktdatenblatt | Version 1.1 www.osram-os.com

SFH 4776

SYNIOS® P2720 IR broad band emitter

Applications — Infrared Spectroscopy

Features: — Package: clear silicone

— Corrosion Robustness Class: 3B

— ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

— Spectral range of emission: (typ) 650 ... 1050 nm — Wide viewing angle of 120° — Small outline dimensions — Low thermal resistance (Max. 9 K/W)

Ordering Information

Type Total radiant flux 1) Ordering Codetyp.IF = 350 mA; λ = 600nm - 1050nm; tp = 20ms Φe

SFH 4776 24 mW Q65112A4886

SFH 4776

2 Version 0.0 | 2018-08-28

Pre

limin

ary

data

shee

t ver

sion

Maximum RatingsTA = 25 °C

Parameter Symbol Values

Operating temperature Top min. max.

-40 °C 85 °C

Storage temperature Tstg min. max.

-40 °C 85 °C

Junction temperature Tj max. 125 °C

Forward current IF max. 500 mA

Surge current tp ≤ 2 ms; D = 0.005

IFSM max. 1 A

Reverse current 2) IR max. 200 mA

Power consumption Ptot max. 1900 mW

ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

VESD max. 2 kV

For the forward current and power consumption please see “maximum permissible forward current” diagram

SFH 4776

3 Version 0.0 | 2018-08-28

Pre

limin

ary

data

shee

t ver

sion

CharacteristicsIF = 350 mA; tp = 20 ms; TA = 25 °C

Parameter Symbol Values

Half angle φ typ. 60 °

Forward voltage VF typ. max.

2.95 V 3.5 V

Forward voltage IF = 500 mA; tp = 100 µs

VF typ. max.

3 V 3.8 V

Reverse voltage 2) IR = 20 mA

VR max. 1.2 V

Reverse voltage (ESD device) 2) VR ESD min. 45 V

Radiant intensity λ = 350 - 600 nm

Ie typ. 29 mW/sr

Radiant intensity λ = 600 - 1050 nm

Ie typ. 8 mW/sr

Total radiant flux 1) λ = 350 - 600 nm

Φe typ. 90 mW

Total radiant flux 1) λ = 600 - 1050 nm

Φe typ. 24 mW

Spectral flux λ = 750 nm

Φe,λ typ. 70 µW/nm

Spectral flux λ = 850 nm

Φe,λ typ. 75 µW/nm

Spectral flux λ = 950 nm

Φe,λ typ. 60 µW/nm

Thermal resistance junction solder point real 3) RthJS max. 9.0 K / W

SFH 4776

4 Version 0.0 | 2018-08-28

Pre

limin

ary

data

shee

t ver

sion

Relative Spectral Emission 4), 5) Irel = f (λ); IF = 350 mA; tp = 10 ms

-90°

-80°

-70°

-60°

-50°

-40°

-30°

-20°-10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90°

φ [ ]

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

Radiation Characteristics 4), 5) Irel = f (φ)

SFH 4776

5 Version 0.0 | 2018-08-28

Pre

limin

ary

data

shee

t ver

sion

Relative Total Radiant Flux 4), 5)

Φe/Φe(350mA) = f (IF); single pulse; tp = 100 µs

Forward current 4), 5)

IF = f (VF); single pulse; tp = 100 µs

10-5 10-4 10-3 0.01 0.1 1 10 100[ ]

0.0

0.2

0.4

0.6

0.8

1.0[ ]

: D = 1: D = 0,5: D =0,2: D =0,1: D =0,05: D =0,02: D =0,01: D =0,005

Permissible Pulse Handling CapabilityIF = f (tp); duty cycle D = parameter; TS = 85°C

0 20 40 60 80[ ]

0.0

0.1

0.2

0.3

0.4

0.5[ ]

Max. Permissible Forward CurrentIF,max = f (TS); RthJS = 9.0 K / W

SFH 4776

6 Version 0.0 | 2018-08-28

Pre

limin

ary

data

shee

t ver

sion

Dimensional Drawing 6)

Approximate Weight: 12.0 mg

Package marking: Cathode

Corrosion test: Class: 3B Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter then IEC 60068-2-43)

ESD advice: The device is protected by ESD device which is connected in parallel to the Chip.

SFH 4776

7 Version 0.0 | 2018-08-28

Pre

limin

ary

data

shee

t ver

sion

Dimensions in mm (inch).

Recommended Solder Pad 6)

Reflow Soldering ProfileProduct complies to MSL Level 2 acc. to JEDEC J-STD-020E

00

s

OHA04525

50

100

150

200

250

300

50 100 150 200 250 300t

T

˚C

St

t

Pt

Tp240 ˚C

217 ˚C

245 ˚C

25 ˚C

L

SFH 4776

8 Version 0.0 | 2018-08-28

Pre

limin

ary

data

shee

t ver

sion

Profile Feature Symbol Pb-Free (SnAgCu) Assembly UnitMinimum Recommendation Maximum

Ramp-up rate to preheat*)

25 °C to 150 °C2 3 K/s

Time tSTSmin to TSmax

tS 60 100 120 s

Ramp-up rate to peak*)

TSmax to TP

2 3 K/s

Liquidus temperature TL 217 °C

Time above liquidus temperature tL 80 100 s

Peak temperature TP 245 260 °C

Time within 5 °C of the specified peaktemperature TP - 5 K

tP 10 20 30 s

Ramp-down rate*TP to 100 °C

3 6 K/s

Time25 °C to TP

480 s

All temperatures refer to the center of the package, measured on the top of the component* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

Taping 6)

SFH 4776

9 Version 0.0 | 2018-08-28

Pre

limin

ary

data

shee

t ver

sion

Tape and Reel 7)

D0

2P

P0

1P

WFE

Direction of unreeling

N

W1

2W

A

OHAY0324

Label

Leader:Trailer:

13.0

Direction of unreeling

±0.2

5

min. 160 mm *min. 400 mm *

*) Dimensions acc. to IEC 60286-3; EIA 481-D

Reel dimensions [mm]A W Nmin W1 W2 max Pieces per PU

180 mm 8 + 0.3 / - 0.1 60 8.4 + 2 14.4 2000

SFH 4776

10 Version 0.0 | 2018-08-28

Pre

limin

ary

data

shee

t ver

sion

Barcode-Product-Label (BPL)

Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.

Dry Packing Process and Materials 6)

OHA00539

OSRAM

Moisture-sensitive label or print

Barcode label

Desiccant

Humidity indicator

Barcode label

OSRAM

Please check the HIC immidiately afterbag opening.

Discard if circles overrun.Avoid metal contact.

WET

Do not eat.

Comparatorcheck dot

parts still adequately dry.

examine units, if necessary

examine units, if necessary

5%

15%

10%bake units

bake units

If wet,

change desiccant

If wet,

Humidity IndicatorMIL-I-8835

If wet,

Mois

ture

Level 3

Flo

or tim

e 168 H

ours

Mois

ture

Level 6

Flo

or tim

e 6

Hours

a) H

umid

ity In

dicato

r C

ard is

> 1

0% w

hen read a

t 23 ˚

C ±

5 ˚C

, or

reflo

w, v

apor-phase r

eflow

, or equiv

alent p

rocessin

g (peak p

ackage

2. Afte

r th

is b

ag is o

pened, devic

es that w

ill b

e subje

cted to

infrare

d

1. Shelf

life in

seale

d bag: 2

4 month

s at <

40 ˚

C a

nd < 9

0% rela

tive h

umid

ity (R

H).

Mois

ture

Level 5

a

at facto

ry c

onditions o

f

(if b

lank, s

eal date

is id

entical w

ith d

ate c

ode).

a) M

ounted w

ithin

b) S

tore

d at

body tem

p.

3. Devic

es require

bakin

g, befo

re m

ounting, i

f:

Bag s

eal date

Mois

ture

Level 1

Mois

ture

Level 2

Mois

ture

Level 2

a4. If b

aking is

require

d,

b) 2a o

r 2b is

not m

et.

Date

and ti

me o

pened:

refe

rence IP

C/J

ED

EC

J-S

TD

-033 fo

r bake p

rocedure

.

Flo

or tim

e see b

elow

If bla

nk, see b

ar code la

bel

Flo

or tim

e > 1

Year

Flo

or tim

e 1

Year

Flo

or tim

e 4

Weeks10%

RH

.

_<

Mois

ture

Level 4

Mois

ture

Level 5

˚C).

OPTO

SEM

ICO

NDUCTORS

MO

ISTURE S

ENSITIV

E

This b

ag conta

ins

CAUTION

Flo

or tim

e 72 H

ours

Flo

or tim

e 48 H

ours

Flo

or tim

e 24 H

ours

30 ˚C

/60%

RH

.

_<

LE

VE

L

If bla

nk, see

bar code la

bel

SFH 4776

11 Version 0.0 | 2018-08-28

Pre

limin

ary

data

shee

t ver

sion

Transportation Packing and Materials 6)

OHA02044

PACKVAR:

R077Additional TEXT

P-1+Q-1

Multi TOPLED

Muste

r

OSRAM Opto

Semiconductors

(6P) BATCH NO:

(X) PROD NO:

10

(9D) D/C:

11(1T) LOT NO:

210021998

123GH1234

024 5

(Q)QTY: 2000

0144

(G) GROUP:

260 C RT240 C R

3

220 C R

MLBin3:Bin2: Q

-1-20

Bin1: P-1-20

LSY T6762

2a

Temp ST

R18DEMY

PACKVAR:

R077Additional TEXT

P-1+Q-1

Multi TOPLED

Muste

r

OSRAM Opto

Semiconductors

(6P) BATCH NO:

(X) PROD NO:

10

(9D) D/C:

11(1T) LOT NO:

210021998

123GH1234

024 5

(Q)QTY: 2000

0144

(G) GROUP:

260 C RT240 C R

3

220 C R

MLBin3:Bin2: Q

-1-20

Bin1: P-1-20

LSY T6762

2a

Temp ST

R18DEMY

OSRAM

Packing

Sealing label

Barcode label

Mois

ture

Level 3

Flo

or tim

e 168 H

ours

Mois

ture

Level 6

Flo

or tim

e 6

Hours

a) H

umid

ity In

dicato

r C

ard is

> 1

0% w

hen read a

t 23 ˚

C ±

5 ˚C

, or

reflo

w, v

apor-phase r

eflow

, or e

quivale

nt pro

cessing (p

eak package

2. Afte

r th

is b

ag is o

pened,

devices th

at will

be s

ubjecte

d to in

frare

d

1. Shelf

life in

seale

d bag: 2

4 month

s at <

40 ˚

C a

nd < 9

0% rela

tive h

umid

ity (R

H).

Mois

ture

Level 5

a

at facto

ry c

onditions o

f

(if b

lank, s

eal date

is id

entical w

ith d

ate c

ode).

a) M

ounted w

ithin

b) S

tore

d at

body te

mp.

3. Devic

es require

bakin

g, befo

re m

ounting, i

f:

Bag s

eal date

Mois

ture

Level 1

Mois

ture

Level 2

Mois

ture

Level 2

a4. If b

aking is

require

d,

b) 2a o

r 2b is

not m

et.

Date

and ti

me o

pened:

refe

rence IP

C/J

ED

EC

J-S

TD-0

33 for bake p

rocedure

.

Floor

time s

ee belo

w

If bla

nk, see b

ar code la

bel

Flo

or tim

e > 1

Year

Floor

time

1 Y

ear

Flo

or tim

e 4

Weeks10%

RH

.

_<

Mois

ture

Level 4

Mois

ture

Level 5

˚C).

OPTO

SEM

ICONDUCTO

RS

MO

ISTURE S

ENSITIV

E

This b

ag conta

ins

CAUTION

Flo

or tim

e 72 H

ours

Flo

or tim

e 48 H

ours

Flo

or tim

e 24 H

ours

30 ˚C

/60%

RH

.

_<

LE

VE

L

If bla

nk, see

bar code la

bel

Barcode label

Dimensions of transportation box in mmWidth Length Height

200 ± 5 mm 195 ± 5 mm 30 ± 5 mm

SFH 4776

12 Version 0.0 | 2018-08-28

Pre

limin

ary

data

shee

t ver

sion

NotesThe evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class moderate risk (exposure time 0.25 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye ex-ists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoy-ance, visual impairment, and even accidents, depending on the situation.

Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There-fore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810.

For further application related informations please visit www.osram-os.com/appnotes

SFH 4776

13 Version 0.0 | 2018-08-28

Pre

limin

ary

data

shee

t ver

sion

Disclaimer

OSRAM OS assumes no liability whatsoever for any use of this document or its content by recipient includ-ing, but not limited to, for any design in activities based on this preliminary draft version. OSRAM OS may e.g. decide at its sole discretion to stop developing and/or finalising the underlying design at any time.

DisclaimerLanguage english will prevail in case of any discrepancies or deviations between the two language word-ings.

Attention please!The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances.For information on the types in question please contact our Sales Organization.If printed or downloaded, please find the latest version in the OSRAM OS Webside.

PackingPlease use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.

Product safety devices/applications or medical devices/applicationsOSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices.In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi-nate the customer-specific request between OSRAM OS and Buyer and/or Customer.

SFH 4776

14 Version 0.0 | 2018-08-28

Pre

limin

ary

data

shee

t ver

sion

Glossary1) Total radiant flux: Measured with integrating sphere.2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera-

tion is not allowed.3) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g.

metal block)4) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-

es, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could dif-fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.

5) Testing temperature: TA = 25°C6) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and

dimensions are specified in mm.7) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.

SFH 4776

15 Version 0.0 | 2018-08-28

Pre

limin

ary

data

shee

t ver

sion

Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.