78
Shenzhen Institute of Wide Bandgap Semiconductors （WinS） 2019/06/10
Shenzhen Institute of Wide Bandgap
Semiconductors
（WinS）
2019/06/10
2
Organizational Structure
Non-governmental Innovation Institute
▪ Non-governmental Innovation Institute
▪ Platform (Open, international, full industry chain)
▪ National Innovation Center in Advanced Semiconductor
▪ Becoming One of the Leading Global Centers
▪ Establishing an oversea innovation center on IOT/Industry 4.0,
based in Turin, and covering whole Europe.
3
Main Goals
▪ “One Center”
Technology and Industry Innovation Center
▪ “Two R & D resources”
Inner R&D team
Outer networks
▪ “Three Capabilities”
Advanced original research
Key Common technology development
Industrial pilot support
▪ “Four Platforms”
Material device (6-8”SiC/GaN)
Advanced package
Material testing, reliability and certification
Technological service
▪ “Four Key Applications”
New Energy Vehicle
5G Network and IoT
Consumer Electronics and Industrial engineering
Optoelectronics and Display4
Key Goals
5
1. Collaboration with global universities and industries;
2. Multi-support on hardware and infrastructure;
3. R&D based on industry needs；
4. Open international cooperation platform；
5. Leading role on national research program；
6. Commercialization and market transformation；
7. Industry partnerships & joint development；
8. Attractive policies/incentives on world-class research teams.
Operation Mode
WinS Talent Pool
▪ Distinguished scientific and technological talents；
▪ Cooperation with global universities and industries;
▪ Flexible working environment in WinS;
▪ Planning for around 450 talents recruited in 5 years.
6
ScientistsTechnological
talents
Open Innovation
▪ Shared multi-level
resources
▪ Shared facilities;
▪ Shared IP and
knowledges.
▪ Shared market
resources
7
Cooperation
▪ International universities,
institutes and companies；
▪ Oversea branches;
▪ International networks.
Concluding Remarks
8
1. Empowering globalized business cooperation from global partners
(Institutes, MNCs and SMEs) .
2. Accessing to complimentary competencies, infrastructure, eco-system
and resources.
3. Strengthening mutual understanding and trust.
4. Developing a solid foundation for future strategic innovation .
Partnership.
5. From R&D alone to the whole innovation value chain: incubation,
demonstration, business development etc.
Welcome to join us to make a better world!
Thank you！
Laboratory IntroductionAdvanced Semiconductor Packaging Technology
➢General introduction of the Laboratory
Assembly
Testing & Reliability
Packaging
Printer Vacuum Reflow Fully auto-moldFlux Cleaner Auto-singulation Laser Marking
Final Packaging system Tape&Reel system
Surge Current Testing System
Rapid TemperatureChange chamber
Temperature Humidity Test chamber
Temperature Humidity Vibration Three Integrated Test Chamber
High temperature test chamber
The lab can be mainly divided into three parts:
1 ASSY SMT, Reflow,molding,singulation and laser technology develop
2 Testing & Reliability
Latest testing and reliability technology
3 Packaging Aiming to develop packing technology for SMD parts
➢Main process and machine introduction
• Vacuum reflow oven
• Printer
➢Main process and machine introduction
• Auto sigulation system
• Auto-molding system
➢Main process and machine introduction
• Temperature Humidity Vibration Three Integrated Test Chamber
• High temperature test chamber
➢Main process and machine introduction
• Tape & Reel system
• Final Packaging system
The Rise of Chinese semiconductor manufacturing equipment Industry
Tech generation
Undertaking a National 863 project
Semiconductor Manufacturing Equipment technology advancement of Naura
Blank period Catch-up period
Supported by National 863 program, The semiconductor equipment technology of Naura rapidly reached international level.
International
Naura
China semiconductor manufacturing equipment industry is taking shape
Naura
Note: Show major semiconductor equipment manufactures only.
China semiconductor manufacturing equipment industry is taking shape
Note: Show major semiconductor equipment manufactures only.
Dielectric Etching Equipment
Si Etching Equipment
AMEC
Naura
PVD Equipment Naura
Single wafer anneal Equipment
Cleaning Tool
Naura
Naura
Cleaner equipmentACM (Shanghai), Inc.
Vertical Furnace Naura
Ion implanter Beijing Zhongkexin
Optical measuring machine Raintree Scientific instruments Corporation
PECVD Piotech co.,LTD
Mask Cleaner REC
HWATSINGChemical mechanical polish
No.
Category Company Key data Technology
Customer acceptance is increasing- some Chinese 12inch equipment achieve mass production and enter market.
Status
Purchased > 50
Purchased > 50
Purchased > 50
Purchased > 50
Purchased > 50
Purchased > 50
Purchased > 50
Purchased > 50
Purchased > 50
Purchased > 50
Purchased > 50
Purchased > 50
China semiconductor manufacturing equipment industry is taking shape
Naura
Naura
Naura
Naura
Naura
Naura
AMEC
Raintree Scientific instruments Corporation
ACM (Shanghai), Inc
TechnologyCompanyCategoryNo.
Si Etching Equipment
HM PVD
Single wafer anneal Equipment
LP CVD
AI PVD
ALD
Dielectric Etching Equipment
Optical measuring machine
Cleaner equipment
Customer acceptance is increasing- some Chinese 14nm equipment enter production line and is ready for test
Currently, 9 types of 14nm equipment is taking test, and 6 of them is belong to Naura
China semiconductor manufacturing equipment industry is taking shape
Customer acceptance is increasing- some Chinese 14nm equipment enter production line and is ready for test Customer acceptance is increasing- some Chinese equipment enter international market
Customer acceptance is increasing- some Chinese 14nm equipment enter production line and is ready for test
NAURA—List of products
IC Craft equipment solution
14nm Logic Equipment and Process Solutions
28/65nm Logic Equipment and Process Solutions
Memory Equipment and Process Solutions
8/12 inch Advanced Packaging Equipment and Process Solutions
8 inch Logic/Power IC Equipment and Process Solutions
6/8 inch Compound Equipment and Process Solution
6/8/12 inch Silicon Material Equipment and Process Solutions
14nm Logic Equipment and Process Solutions
28/65nm Logic Equipment and Process Solutions
Memory Equipment and Process Solutions
8/12 inch Advanced Packaging Equipment and Process Solutions
8 inch Logic/Power IC Equipment and Process Solutions
6/8 inch Compound Equipment and Process Solution
6/8/12 inch Silicon Material Equipment and Process Solutions
June, 2019
新型显示技术 New display technology
新型显示技术全景图 Panorama of new display technology
TFT Core Technology:High Migration Rate / High Stability / Printable
Light-emitting device materialsReflective materials
⚫ Electrophoresis
⚫ Electrowetting
Flexible technology
andMaterials
Equip
ment
+
Integra
tion
Circuit
泛在显示：显示技术 + 柔性技术 + Micro-SystemUbiquitous Display ：Display technology+Flexible technology+Micro-System
key material
Common foundation
Display tech
⚫ OLED
⚫ Laser
⚫ LED
⚫ QLED/Perovskite
3D/Holographic
VR/AR/transpa
rent
Reflection displ
ay
typographical display
Laser displ
ay
Mini/Micro-
LED
LCDdisplay
Juhua typographical display platform is the only platform in display innovation center in China andhave an international first-class typographical display experimental platform.
研发平台 Research and development platformTypographical display devices and materials experimental platform
G4.5 Typographical displaypilotscale experiment platform
200x200Fully automatic prodution platform
200x200 Dry film formingEvaporation platform
Typographical displayInk preparation equipment firm comprehensive test room
G4.5 Organic/metal evaporated line
G4.5Display panel production line
Display panel life test system
G4.5 panel defect detection line
Measuring System for Display panel in brightness efficiencyand chromaticity film forming test equipment
Ink viscosity/surface tension meter
Quantum dot equipment and material experimental platform
1200m2 Quantum dot material Developmentand synthesis platforms
600m2 Kilo scale super clean Quantum dotDevice develop and prepare platform
synthesizingfume hoods
Water-free, oxygen-free synthesis platform
synthesizingSchlenk system
Atmosphere processing platform
Device preparation platform
vacuum coater
Device spin coating Glove Box
Automatic glue dispenser
LJV device test system
test and calibration system
Optical microscope
Device performancetest platform
Material performance testing platform
Fluorescence Spectrometer
UV Vis absorption Fluorescence spectrometer
potential analyzer
研发平台 Research and development platform
Technology can be applied to TCL's display panels, smart TVs, smartphones, home appliances, smart homes
and TCL intelligent manufacturing systems.
可落地的产品 Commerciable products
研发平台
人才团队 TEAM
• New display tech: TCL has research and development centers in Shenzhen, Guangzhou and Wuhan, with a world-
class research and development team, 4 innovation team and 3 National Distinguished Experts, 52 overseas Doctor.
• Artificial intelligence: TCL has research and development centers in the United States, Poland, Hong Kong, Xi'an,
Wuhan and Shenzhen, establishing a team of highly qualified with about 200 outstanding AI-related engineers.
Shenzhen Huaxing Research and Development
Center
HK Research and Development
Center
Wuhan Research and Development
Center
U.S. (Silicon Valley) Institute
xi'an Research and Development
Center
Euro Research and Development
Center
Guangdong Juhua Typographical
Display Technology Co., Ltd. (National Typographical and
Flexible Display Innovation Center)
Wuhan Huaxing Research and
Development Center
研发平台
THANK YOU!
www.tcl.com@TCL创意感动生活
INTRODUCTION TO CHANGELIGHT
COMPANY PROFILE0 1
1 COMPANY PROFILE
Listed CompanyChangelight went IPO at Shenzhen Stock
Exchange (China) on August 12th, 2010
(Stock name / code: Changelight / 300102)
3000+ Employees Broad Product PortfolioIndependent, full scale operations with dedicated
facilities, experienced management team, and
3000+ full time employees
Featured products: full-color LED wafers / chips,
Mini & Micro LEDs, Laser chips, high-performance
GaAs solar cells, etc
Founded in 2006
Xiamen Changelight Co., Ltd.
Full Spectrum Coverage Quick ResponseUV, Blue, Green, Yellow, Red, Infrared……suitable for diverse applications
Market Demands
Quick response to customer demands, flexible to adjust product portfolio
Focusing on
Persistent R&D and Innovation with strong R&D teams and favorable platforms
Cost Effectiveness
Annual production capacity is expected to reach 29 Million pcs epitaxial wafers (2-inch equivalent)
Research & Innovation LargeProductionCapacity
1 COMPANY PROFILE
Dedicated to customers with
excellent products and services,
Changelight is recognized as a
leading LED chip company in
China.
1 COMPANY PROFILE
Yangzhou Manufacturing Base
The Largest Manufacturer of GaAs LED Chips
in China SINCE 2009
Red/Yellow/Infrared LED chipsSolar cells/Laser/VCSEL chipsAnnual production capacity: 4.8 Million wafers (est.)
Nanchang Manufacturing Base
Under Construction (GaN based)
Mass Production in 2019
Blue/Green LED chipsAnnual production capacity: 20 Million wafers (est.)
Xiamen Manufacturing Base
SINCE 2006
Blue/Green LED chipsAnnual production capacity: 4.8 Million wafers
Headquarter located in Xiamen city (China)
Three manufacturing bases in Xiamen/Yangzhou/Nanchang city
Several wholly owned and share-participation subsidiaries
Product sales network spreads over China, Southeast Asia, etc.
Sales office runs across key vigorous economic regions
Such as Shanghai/Shenzhen/Beijing/Zhongshan city, etc
Headquarter
AlGaInN AlGaInP AlGaInAs
2006.2
Foundation of
Changelight
2010.8
IPO/Listed
Core Business of ROY LED Chips
2009.2
Foundation of Yangzhou
Manufacturing Base
The Largest GaAs Manufacturing Base of ROY LED Chips in China
2011.1
Honored as the Most
Potential Company
Rank in Forbes as One of the Most Potential Enterprises in China
Went IPO at Shenzhen Stock Exchange (China)
Stock code: 300102
2013.8
Research Center/
Technology Park
Establishment of National Postdoc Research CenterEstablishment of ChangelightTechnology Park
1 COMPANY PROFILE---Development History
2014.6 2017.5
2017.3
Invest in Yangzhou
Manufacturing Base
ROY LED Manufacturing Capacity Increased by 2X
2017.7
Foundation of Xiamen Changelight
Semiconductor Co., Ltd.
Explore Micro-LED, VCSEL, etc
2018.7
Recognized as National
Technology Center
Full Color
Coverage
Start Manufacturing of GaN LED Chips
Foundation of Nanchang
Manufacturing Base
GaN LED Manufacturing Capacity Increased by 4X
The Highest Level Technology Center Recognized by the Government
1 COMPANY PROFILE---Development History
1 COMPANY PROFILE---Development History
202020192018201720162015
0.61
1.15
Revenue
Currency: Billion RMB / Year
1.13
Financial Performance
202020192018201720162015
8.4
29
2.44.8
7.2
19.2
Production Capacity (2-Inch Equivalent)
To be released0.0
Unit: Million pcs / Year
Capacity Expansion Plan
In 2017, Changelight launches 0.73 Billion RMB (Yangzhou base/GaAs) and 5
Billion RMB (Nanchang base/GaN) expansion plans, respectively
Changelight gains a sound financial performance with the net
profit of 0.21 Billion RMB in 2017
Estimated
20182017201620152014
49.0
32.0
54.6
72.6
R&D Investment
Currency: Million RMB
1 COMPANY PROFILE---R&D/Innovation
Investment in R&D
Patent Application
25.32% 72.4%2.34% 470 Patents Filed
47.93% 47%5.07% 217 Patents Granted
Invention PatentUtility PatentDesign Patent
201820172016201520142013Patent Application
20
18
H1
20
18
H2
14
58 63
122
91
Estimated
Unit: pcs
Continuous focus on research and innovation has led to product
improvements and new technology advancement, with better performance
and quality, cost effectiveness and further value added for Changelight to
win the market and drive a sustainable growth
Estimated
1 COMPANY PROFILE---R&D/Innovation
03
Research
Team
Number: 237
TEAM
Expert
Team
Young
Talents
Domestic and overseas Ph.D. / Master
with Semiconductor/ Electronic / Optical
and related background
Number: 53
Ph.D./Master
Sr. technical experts and specialists with
plenty of mass production and R&D
experience from United States, Europe,
Taiwan and China
2016 “Annual Most Influential Enterprise” by China Optoelectronic Institute
2011 Ranked in the Forbes List of Most Potential Enterprises in China
1 COMPANY PROFILE---Honors and Awards (Selected)
2015 High-Tech Enterprise of National Torch Plan
As a High-Tech enterprise, Changelight has won numerous honors and awards
2018 Recognized as “National Technology Center”
2013 Establishment of National Post-Doc Scientific Research Station
PRODUCTS & CLIENTS0 2
2 PRODUCTS AND CLIENTS
Lateral
Flip chip
Vertical
High
Voltage
Diversified
Structure
Customized Design
Quality
Control
Continuous Product Optimization and
Performance Improvement
Chip-Scale Solution Provider and Chip ManufacturerBEYOND ILLUMINATION
450 nm 500 nm 550 nm 600 nm 650 nm 800 nm 1000 nm
AlGaInN AlGaInP AlGaInAs
General Lighting 447.5-457.5 nmBacklight 447.5-452.5 nm
Display 460-470 nm Display 515-530 nm Display/Digital 565-640 nm
Horticulture 660 nm Laser/VCSEL 850/940 nm
Mini LED Red/Green/Blue
IRED 845-855/940-955 nm
Micro LED Red/Green/Blue
2 PRODUCTS AND CLIENTS---Full Spectrum Coverage
2 PRODUCTS AND CLIENTS
CO-Development with ClientsBEYOND ILLUMINATION
StandardTechnical Market Product Service
2 PRODUCTS AND CLIENTS---Clients
CO-Development with ClientsBEYOND ILLUMINATION
Changelight Services All the Top 10 Packaging Companies in China for Years
Changelight Services Most of the Top Leading Packaging Companies in Taiwan for Years
MANUFACTURING EQUIPMENT0 3
4 MANUFACTURING EQUIPMENT
COATER STEPPER ALIGNER DEVELOPER
4 MANUFACTURING EQUIPMENT
ICP PECVDMETAL
sputter
4 MANUFACTURING EQUIPMENT
SPUTTER E BEAMDBR
deposition
4 MANUFACTURING EQUIPMENT
SORTING MACHINE TESTERAOI
Probe card
is needed to
test small
chip
Need high-
sensitivity & high-
speed inspection
Xiamen Changelight Co., Ltd.
Suggestions and Comments are Highly Appreciated.
Add: No. 259-269, Xiang Tian Road, Xiamen Torch (Xiang An) Industrial Park, Xiamen, Fujian Province, China; T: 86-592-7615555; F: 86-592-7615556; Website: www.changelight.com.cn
THANK YOU
华腾半导体设备有限公司Huateng Semiconductor Equipment Co., Ltd.
公司简介Company Profile
目录 / CONTENTS
01 / 关于我们 About Us
02 / 企业文化 Corporate Culture
03 / 产品与服务 Product & Service
About Us
PART 01
Company Introduction
Shenzhen Huateng SemiconductorEquipment Co., Ltd. was established on May19, 2008. The company is a national high-t e c h e n t e r p r i s e w h i c h d e v e l o p ssemiconductor device test sorter, testpackaging machine and other products, andprovides a complete set of automatic control.
Huateng is a semiconductor lightingpackaging core equipment enterprise. Nowit has completely completed importsubstitution. Initially, the market share ofJapanese enterprises reached 90%. Japanesecompetitors Kada and Shibuya, TaiwanJianding has basically withdrawn from themainland market.
Company Introduction
LED测试仪LED tester
测试分选机test handler
划片机Dicing machine
测试编带机Test Tape Knitting Machine
点测机Point measuring machine
芯片分选机die sorter
1
3
5 6
4
2
Oursproduct
The Position
Here we are Building A, Guancheng Low CarbonIndustrial Park, Liantang Industrial City,Gongming Street, Guangming New District,Shenzhen
Branch
01
Located in Suzhou, responsible forcustomer order purchase and after-salesservice in Zhejiang and Shanghai.
East China Office
02
Located in Xiamen, responsible for orderpurchase and after-sales service forcustomers in Fujian and Jiangxi.
West Coast Office
03
Headquartered in Shenzhen, Shenzhen isa key supporting leading enterprise.
Huateng Headquarters
01
02
03
01
05
04
04
05
Changsha Officev
Anshan Fangteng
Located in Changsha, Hunan Province,responsible for the development andproduction of slicing machine.
Located in Anshan, Liaoning Province, it isthe main producer of chip sorting andprocessing.
Company Honor
Product & Service
PART 02
The Main Business
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半导体封装
深圳华腾业务主要包括芯片设计、芯片制造、芯片封装以及封装测试
Chip sorting
点测/分选代工
长沙华腾Changsha Huateng (Branch) independently produces cutting equipment to help customers solve the problem of bead cutting.
半导体封装
Independent research and development ofsemiconductor device test sorter, test tapemachine and other products, to provide customers with professional customized products and services.
Precision Cutting
Fangteng (Branch) as the representative factory of spot test and sorting of LED chips, provides more professional services for customers.
Chip Packaging
Main Products
➢ Full Bin automatic pop-up
feeding box, anti-stupor
feeding, alarm with wrong
feeding barrel, automatic
GRR, proofreading function
Sorter
➢ Independently developed
software control system and
visual processing system,
ingenious structural design, so
that it has high speed, high
precision, high stability.
Applicable chip range: 4 *4 (mil)
~ 80 *80
➢ Dual image system
integrated voltage tester
integrated industrial
computer, rewinding
feeding and rewinding back
pumping mechanism,
vacuum damage turntable
structure
➢ The equipment adopts HT-1210
software control system, with
single/two-way cutting mode,
according to channel/workpiece
cutting mode, can complete
rectangular and circular workpiece
cutting.
Tape Knitting Machine
die sorter
Dicing machine
Product Features
high speed
The processing cycle time of a single chip is less than 100 ms.
Stable and
durable
Vibrating disk feeder, motor and sensor are imported products.
easy operation
PLC control, full color LCD touch screen, friendly man-machine interface, Chinese and English display.
Easy to maintain
Mechanical stability, reasonable layout, error alarm and automatic indication of position.
Service Process
Receiving orders Customization Service Scheme
Supply chain
After-sales Service
Improvement System
Quality restriction
Input into production
1 2 3
6 5 4
Our Advantage
Industry Leadership
R&D Enterprises
Good reputation
A number of invention patents
Strategic Partner
Thank you for watching!
