Signal Integrity for PCB Design - Keysight · PDF fileSignal Integrity for PCB Design Lin,...

Signal Integrity for PCB Design Lin, Ming Chih

Sep 17, 2014

Page Agenda

– What does PCB matters for Signal Integrity?

– Impedance, Loss and Delay of Transmission Line

• TDR, TDT and S parameters

• Impulse Response and ISI

– Signal Integrity

• Transmission Line Models

• SI Simulation

Customizable in

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PCB is a key factor for HSD transmission

Customizable in

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5Gbps 10Gbps

Page

What characteristics that might degrade SI?

– PCB Materials

• Dk and Df

• Conductivity

– PCB Layout

• Stack-up

• Layout

• Drills

– PCB Manufacturing

• Roughness

• Etching

Customizable in

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Page Agenda

– What do PCB matters for Signal integrity?






• SI Simulation

Customizable in

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Measurement

Customizable in

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TDR, TDT and S parameters

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S Parameters

Customizable in

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Dielectric Loss and Conductor Loss

Customizable in

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Symbol Response in Time and Frequency Domain

Customizable in

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Inter Symbol Interference (ISI)

Customizable in

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Non-ideal transmission lines

Customizable in

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Open Stub of PTH VIA

Customizable in

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Open stub leds to high frequency resonance

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Delata-L proposed by Intel™

Customizable in

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Intel’s Delta-L Methodology for Electrical

Characterization, Rev. 330223-001

Page Agenda

– What do PCB matters for Signal integrity?






• SI Simulation

Customizable in

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SI Design Flow

Customizable in

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Simulation

Analyses Correlation

Modeling

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Three Types of Channel Modeling

Customizable in

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Equation Modeling

•For Pre-simulation

•Model is equation based

•Easy to setup

•Limited structure

•Optimizable

•Less accuracy

•For simple topology

EM Modeling

•Generate S Parameter for Post-Simulation

•Extracted by EM solver

•Accurate structure dimension and material parameter are needed

•EM solver is structure dependent

VNA Modeling

•Generate S Parameter for Post-Simulation

•Calibration and de-embed is necessary

•Most accurate

•Full channel can be modeled one time

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Transmission Line Model based on Formula

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Ideal Transmission Line Models

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𝐸

𝐻

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Transmission Line Model based on EM Solvers

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Channel Simulation

Customizable in

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EM

Solver

Simplified PCB

Routing S Parameter

Page

S Parameters Simulation

Customizable in

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Insertion

Loss

Far End

Crosstalk

Near End

Crosstalk

Page

Mixed Mode S Parameters Simulation

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Design Vias TDR Simualtion

Customizable in

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Discontinuity in Current Path

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Simulation & Measurement Correlation

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Simulation Measurement

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Summary

– SI is inevitable in all modern electronics system design. PCB

design is an important factor for Signal Integrity

– Simulation is useful for SI designers to check their PCB

design in advance. And it can help designers to debug a

system.

– Correlation is important to improve simulation and

measurement.

Customizable in

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Challenges to Obtain Measurement Accuracy and Correlation for PCB Impedance Measurements

Hidekazu Manabe （眞鍋秀一）

Application Expert

Marketing

Component Test Division-Kobe

Keysight Technologies

September 17, 2014

Page

Agenda

2

•PCB Market Overview

•Challenges to Obtain Measurement Accuracy and Correlation

•E5063A ENA Series PCB Analyzer Introduction

•Summary

PCB Analyzer

Introduction

Page

•Parameters = Impedance (SE & DIFF)

•Required Tolerance = ±10%

Traditional PCB Measurements

test coupon

•Test Coupon Example: Test Region

(typ 30 to 70% of trace length)

•L1/50 trace measurement example

15cm (typ)

3

PCB Analyzer

Introduction

Page

PCB Market Trends and Forecast

• PCB market expected to grow at 5% per year from 2012 to 2017. Growth

drivers are mobile phones (8% annual rate) and IC packages (6% annual

rate).

4

PCB Analyzer

Introduction

Page

PCB Market Trends and Forecast by Type

• Significant growth is expected for flexible PCBs (FPC) (7% annual rate)

and IC package substrates (6% annual rate).

PCB Analyzer

Introduction 5

Page

FPC Market Forecast

PCB Analyzer

Introduction 6

• FPC market is expected to grow at an average rate of 7% per year. The

growth drivers are multilayer FPC, which account for more than 40% in

volume (8% annual rate) and double-sided FPC, accounting for nearly

20% in volume (11% annual rate).

• Production volume is expected to increase for mobile phone, tablet, and

mobile electronics applications. Other applications areas expected to

have minimal growth.

Page

FPC Types and Applications

Single-sided FPC Double-sided FPC

Multi-layer FPC Rigid-Flex

FPC Types FPC Applications

• Camera module

• LCD module

• Touch sensor panel

• Antenna

PCB Analyzer

Introduction 7

Measurement Requirements:

• FPC trace is measured, rather than coupon. Since trace length is short,

higher response resolution is required.

• Due to increase in data rates, tighter impedance control requirements

are increasing. (± 10% => ± 5 ~ 8%).

• S-parameter required for FPC antenna. VSWR (S11) measured in

production. In addition, impedance and isolation (S21) are typically

measured in QA.

Page

Agenda

8


•Challenges to Obtain Measurement Accuracy and

Correlation


•Summary

PCB Analyzer

Introduction

Page

PCB Analyzer

Introduction 9

1. Inadequate measurement accuracy

2. Measurement results can differ between channels

or instruments

Problems with TDR Oscilloscopes

Page

PCB Analyzer

Introduction 10

Measurement Accuracy Verification

Impedance Tolerance

+/- 10 % +/- 5%

Page

PCB Analyzer

Introduction 11

TDR Oscilloscope

25Ω Airline

50Ω Airline

Reference for error compensation

Measurement Cables

NIST Traceable Standards

Blue

Purple Device for measurement result comparison

Measurement Setup

Page

PCB Analyzer

Introduction 12

Measurement Accuracy with TDR Oscilloscopes

1. Offset Error Measurement

2. Device Measurement (25 Ω Airline)

Page

PCB Analyzer

Introduction 13

50 Ω airline

Channel 1

Measurement Setup

Page

PCB Analyzer

Introduction 14

51.8 Ω

Offset error is +1.8 Ω

40Ω

50 Ω

60 Ω

(airline)

Offset Error Measurement at Channel 1

Page

PCB Analyzer

Introduction 15

Offset Error Measurement at Channel 2

50.2 Ω

Offset error is +0.2 Ω

40Ω

50 Ω

60 Ω

(airline)

Page

PCB Analyzer

Introduction 16


1. Offset Error Measurement

2. Device Measurement (25 Ω Airline)

Page

PCB Analyzer

Introduction 17


Considerations for Offset Compensation

Page

Agenda

18




•Summary

PCB Analyzer

Introduction

Page

•More Accuracy and R&R*

•More Languages Supported

•More ESD Robustness

* Repeatability & Reproducibility

… also the lowest cost solution in the industry.

E5063A ENA Series PCB Analyzer The Best Solution for PCB Manufacturing Test

What is E5063A ENA Series PCB Analyzer?

19

www.keysight.com/find/ena-pcb PCB Analyzer

Introduction

Page


20


Introduction

Page 21

Dedicated GUI for PCB Manufacturing Test Similar look-and-feel to traditional solutions

PCB Analyzer

Introduction

Page

Test File (Instrument

configuration, test list,

limits, etc …)

Modes of Operation Edit Test Mode

•Integrated test file editor allows test engineers to create files

with just a few mouse clicks

Test engineer

determines

measurement

requirements.

Operator recalls

test setup file

and executes

test.

PASS / FAIL

Execute Test Mode

•Simple and intuitive GUI for non-technical operators

22

PCB Analyzer

Introduction

Page 23

Edit Test Mode

Setup and Error Correction Wizards

Intuitive and error free setup, error

correction, and measurements.

Dedicated controls for common

adjustments

Test limits can be

defined as a

percentage of the

DUT length.

The DUT

Length Wizard

automatically

measures the

length of the

DUT.

Intuitive setup flow allows

for simple and intuitive

operation

PCB Analyzer

Introduction

Page 24

Execute Test Mode

Operator Instructions

Customize operator prompts as

appropriate for your application.

Saving Test Results

All test results are displayed on screen

in waveform and statistical format for

real-time analysis. Results can also be

saved to file for later inspection.

PCB Analyzer

Introduction

Page

More Accuracy and R&R (Repeatability & Reproducibility)

25

(Source: IPC-TM-650 Number 1.9 Measurement Precision Estimation for Variables Data)

PCB Analyzer

Introduction

Page

PCB Analyzer

Introduction 26

Accuracy Verification (Measurement Setup)

Page

PCB Analyzer

Introduction 27

Electronic

Calibration

module (ECal)

Calibration

Wizard

Accuracy Verification (Performing Full Calibration)

Page

PCB Analyzer

Introduction 28

25 Ω airline

Channel 1

Accuracy Verification (Performing Measurements)

Page

PCB Analyzer

Introduction 29

25 Ω Airline after Full Calibration (Channel 1)

25.3 Ω

Page

PCB Analyzer

Introduction 30

25 Ω Airline after Full Calibration (Channel 2)

25.3 Ω

Page

PCB Analyzer

Introduction 31

Measurement Accuracy after Full Calibration

Z = 25.2 Ω

Z = 50.5 Ω

Z = 75.2 Ω ケーブル

25 Ω 50 Ω 75 Ω Standards of Different Impedance in Series Connection

Page

Accuracy Verification using a NIST Traceable Standard

32

DUT: 25 ohm airline

(85052B Verification Kit)

The verification kit includes

measurement data and uncertainties

which are traceable to National

Institute of Standards and

Technology (NIST).

Measurement results are

within 0.1 ohm of 25 ohm

airline standard.

PCB Analyzer

Introduction

Page 33

Single-ended Differential

R&R 0.010 ohm 0.020 ohm

Test Conditions

•3 operators

•7 DUTs

•3 measurements on each DUT

•Average impedance within 30-70%

of the DUT length used for R&R

calculations

DUT Length = 22 cm

DUT: R&R Evaluation Board

(unused ports left open)

Single-ended 50 ohm trace

Differential 100 ohm trace

PCB Analyzer

Introduction

R&R Evaluation (Average and Range Method)

Page

Why Error Correction?

34

mismatch

loss

delay

DIFF

probe

SE

probe(s)

USB

footswitch

Measure your device, not your

measurement system.

Cables, probes, switches, and

fixtures are no longer ideal at

today’s data rates.

To get the most accurate information

about the device under test, you

must account for errors introduced

by your measurement system, such

as delay, loss, and mismatch.

PCB Analyzer

Introduction

Page

delay

Two common types of error correction methods:

Error Correction Method Comparison

mismatch loss

delay mismatch loss

Deskew

•Commonly used in time domain instruments

•Simple to perform

•Only corrects for delay

Full calibration (ECal)

•Commonly used in frequency domain instruments

•Requires more standards

•Accounts for all major sources of error

35

PCB Analyzer

Introduction

Page

30 cm test cable 150 cm test cable

Accuracy Considerations

Z(avg) = 27.9 Ω Z(avg) = 25.9 Ω

test cable

Same DUT with different test cable lengths,

results in very different impedance values.

85053B NIST Traceable 25Ω Airline

Deskew Deskew

E5063A PCB Analyzer

36

PCB Analyzer

Introduction

Page

PCB Analyzer

Introduction 37


test cable

E5063A PCB Analyzer

Cable loss affects measurement results.

30 cm test cable 150 cm test cable Rise Time Insertion Loss Rise Time Insertion Loss

Rise Time = 35 ps

・Actual rise time：58.5 ps

・Insertion Loss： -4.4 dB


・Insertion Loss： -1.9 dB

Page

PCB Analyzer

Introduction 38


test cable

E5063A PCB Analyzer

Cable loss is removed by calibration.

30 cm test cable 150 cm test cable Rise Time Insertion Loss Rise Time Insertion Loss

Rise Time = 35 ps


・Insertion Loss： 0 dB


・Insertion Loss： 0 dB

Page

Z(avg) = 25.2 Ω Z(avg) = 25.2 Ω

Error correction is essential to measure the

true performance of the device.

ECal ECal


30 cm test cable 150 cm test cable

test cable

85053B NIST Traceable 25Ω Airline

E5063A PCB Analyzer

39

PCB Analyzer

Introduction

Page

More Languages Supported An analyzer that speaks your language

40

PCB Analyzer

Introduction

Page

TDR Scopes

Difficult to implement protection circuits inside the

instrument without sacrificing performance.

“In addition, protection diodes cannot be placed in

front of the sampling bridge as this would limit the

bandwidth. This reduces the safe input voltage for a

sampling oscilloscope to about 3 V, as compared to 500 V

available on other oscilloscopes. “

Tektronix ApNote “XYZ of Oscilloscopes”, p17 (02/09, 03W-8605-3)

External ESD protection module (80A02) available, but rise time is degraded.

•Rise time degradation from 28ps to 37ps with 80E04 TDR module.

•Single-channel protection, but only four slots are available.

•Additional cost of $4K/module.

More ESD Robustness

41

PCB Analyzer

Introduction

Page

ESD protection

circuits inside the

instrument

Higher robustness against ESD,

because protection circuits are

implemented inside the instrument for all

ports, while maintaining excellent RF

performance.

Proprietary ESD protection chip

significantly increase ESD robustness,

while at the same time maintaining

excellent RF performance (24.8 ps

rise time for 18 GHz models).

To ensure high robustness against ESD,

E5063A PCB Analyzer is tested for

ESD survival according to IEC801-2

Human Body Model (150 pF, 330Ω).

RF Output Center pins tested to 3000 V,

10 cycles.

E5063A PCB Analyzer

More ESD Robustness

42

PCB Analyzer

Introduction

Page

Note: Option 011 is a superset of Option 010. Option 010 is not available separately.

Model/Option Description

E5063A ENA Series Network Analyzer

Test set options (choose one):

E5063A-245 2-port test set, 100 kHz to 4.5 GHz

E5063A-285 2-port test set, 100 kHz to 8.5 GHz

E5063A-2H5 2-port test set, 100 kHz to 18 GHz

Software option (mandatory):

E5063A-011 Time Domain Analysis / Test Wizard

Configuration

43

E5063A PCB Analyzer = E5063A + Option 011 •E5063A => frequency domain

•Option 011 => time domain and PCB GUI

PCB Analyzer

Introduction

Page

DIFF

probe

SE

probe(s)

Typical Configuration

44

•ENA Mainframe •E5063A-245: 100 kHz to 4.5 GHz, 2P

•E5063A-285: 100 kHz to 8.5 GHz, 2P

•E5063A-2H5: 100 kHz to 18 GHz, 2P

•Time Domain / Test Wizard Option

(E5063A-011)

•U1810B USB Coaxial Switch, DC to 18

GHz, SPDT

•ECal Module

•N4431B for E5063A-245/285

•N4433A for E5063A-2H5

•Third Party Solutions

•TDR Passive Probes (*1)

•USB Footswitch

•USB Barcode Reader

USB

footswitch

(*1) Any TDR passive probe can be used with the PCB

Analyzer. PCB Analyzer

Introduction

Page

Agenda

45




•Summary

PCB Analyzer

Introduction

Page

•More Accuracy and R&R*

•More Languages Supported

•More ESD Robustness

* Repeatability & Reproducibility

… also the lowest cost solution in the industry.

E5063A ENA Series PCB Analyzer The Best Solution for PCB Manufacturing Test


46


Introduction

Page

PCB Analyzer

Introduction 47

Users need to make sure measurement devices and measurement standards for

compensation have the same impedance value

If the above condition is not satisfied,…

1. measurement errors cannot be properly compensated resulting measurement inaccuracy

2. measurement results between channels or TDR instruments can differ from each other

TDR Oscilloscopes with Offset Compensation Method

Keysight E5063A PCB Analyzer

Measurement errors can be completely removed with full calibration for…

1. accurate measurements

2. measurement correlation between different channels and instruments

Summary

Page 48

PCB Analyzer

Introduction

台灣是德科技股份有限公司以是為本以德致遠專注量測75載

Breakthrough Developments in TDR/TDT Measurement Technology TDR/TDT信號完整性量測新進展蔡怡杏 Flory Tsai

Page


Agenda

• Introduction 5 min

• TDR/TDT and S-parameters 15 min

• Hot TDR Measurements 10 min

• Intel® Delta-L 5 min

• Q&A 5 min

2

Page


As data rates increase:

• Design margins decrease:

• inter-symbol interference (ISI)

increases due to

channel/interconnect losses and

reflections

Characterize signal integrity issues using Scope and Vector

Network Analyzer (VNA) based TDR/TDT Solutions

Introduction

• Trend toward parallel/multi-lane

architectures

• increases crosstalk concerns

3

Page


Demanding Applications for TDR/TDT Measurements

SI Lab

(PCBs,

interconnects,

connectors…)

Production Test

of cables,

connectors,

interconnects

S-Parameter

generation for

de-embedding

Active Device

Characterization

Research

•Fast edge and high

BW to isolate

impedance issues

•Easy to use.

•Many channels

•Low capital cost

•High accuracy

•Fast calibration

•Fast to program

•Compliance

Applications

•Easy to generate S-

parameter files •Hot TDR

measurements

•High accuracy (fast

step, high BW)

•Flexibility

Targ

et

applic

ations

Measure

ment

needs

4

Page


VNAs vs TDR Oscilloscopes ENA-TDR is a great solution for <20 GHz

Best dynamic range compared to TDR

faster acquisition time

ESD robustness

Ideal for “Hot TDR”

5

PNA provides the highest performance S-Parameter measurements PNA is the “Gold Standard” for S-Parameter measurements

superior dynamic range vs TDR (from any vendor)

(especially important for low levels of crosstalk,

but ultra-low sensitivity is often not required for digital designs)

preferred by RF/Microwave engineers

TDR/TDT very intuitive and easy-to-use, preferred by many digital designers

useful for quick troubleshooting, fault location analysis

measures closer to DC (vs 10 MHz)

less expensive than NA having similar BW

As a bonus it is a scope too!

Complement

each other

(not compete).

Most SI labs have

both solutions.

Keysight can address the

needs of all your

customers (offer both NA

and TDR solutions)

http://cp.home.agilent.com/agilent7/s7viewers/flash/genericzoom.swf?logo2=false&serverUrl=/agilent7/is/image/&contentRoot=/agilent7/skins/&locale=en&config=Agilent/AGILENT-IMGSET&image=Agilent/PROD-2001985-IS

http://cp.home.agilent.com/agilent7/s7viewers/flash/genericzoom.swf?logo2=false&serverUrl=/agilent7/is/image/&contentRoot=/agilent7/skins/&locale=en&config=Agilent/AGILENT-IMGSET&image=Agilent/PROD-810708-IS

Page


Agenda





• Q&A 5 min

6

Page


Quick Review – TDR Time Domain Reflectometry (TDR)

• Impedance measurements

• Locate the position and nature of each

discontinuity

• Propagation/Time delay

• Excess Reactance

(Capacitance or Inductance)

• Effective dielectric constant

TDR (Impedance Profile)

S-parameters (Return Loss) FFT

1

2

3 4

5 6

1. Reference Plane 2. Connector Launch 3. Uncoupled TX Line 4. Coupled Diff TX Line 5. Connector 6. Open Circuit

7

Page


Quick Review – TDT

Time Domain Transmission

(TDT)

• Step Response

• Propagation/Time delay

• Propagation velocity

• Rise time degradation

• Near-end crosstalk (NEXT)

• Far-end crosstalk (FEXT)

• Skew

TDT (Step Response) S-parameters (Insertion Loss)

FFT

8

Page


S-Parameters and TDR/TDT

Return Loss or TDR

Insertion Loss or TDT

Near End Crosstalk (NEXT)

Far End Crosstalk (FEXT)

Four-port single-ended device

Port 1

Port 3

Port 2

Port 4

Frequency Domain Parameters Time Domain Parameters FFT

IFFT

9

Page


Together, TDR/TDT and S-Parameters provide

tremendous insight

TDR

Z profile

TDT

Step Response

S11

Return Loss S21

Insertion Loss

TDR and S21 are most intuitive, insightful.

10

Page


Edge speed determines two important parameters:

1. TDR Resolution: The faster the edge, the closer two impedance

discontinuities can be identified as separate events on the TDR trace.

What TDR edge speed should I use?

2. Max S-parameter frequency

A step with a fast edge has higher

frequency content and enables S-

parameter testing to a higher frequency.

•

• Ɛ = dielectric constant of the transmission

system

• c = speed of light in a vacuum.

Dmin=

For Ɛ = 4 and system rise time of 8

ps, Dmin < 1mm.

D D

11

Page


What TDR edge speed should I use? Select a solution based on your application:

• Too fast: you’ll see impedance discontinuities that will not affect the real

signals in your design (you’ll waste time fixing things that do not matter)

• Too slow: discontinuities are masked

Choose your TDR edge speed:

1. Full Characterization “Rule of

Thumb”: use TDR edge speeds

that are minimum 2x faster than

the rise times of your design

2. Compliance Test: use 20%-80%

TDR edge speed specified by

Standard

25ps

100ps

500ps

200ps

12

Page


TDR Two-Event Resolution (Spatial-Resolution )

–To increase the two-event resolution of the TDR

system, three items are considered:

1. Increase the speed of the step generator

2. Increase the bandwidth of the oscilloscope

3. Minimize the bandwidth-limiting effects of the test system

- minimize use of adapters, cabling

- use good quality fixturing

- compensate for losses using TDR

calibration (de-embedding)

13

Page


• Electronic Calibration (ECal)

DC-67 GHz module support

N1055A Bandwidth

• 35 GHz (2.92mm)*

• 50 GHz (1.85mm)

• Fastest TDR Edge Speed

Up to 8 ps (typ) 50 GHz, yields highest

TDR resolution.

N1055A Connector Type

• Male

• Female

• Highest Channel Count - Up to

16 channels per mainframe.

• Single-ended and

Differential Device Testing

(True-Mode Stimulus)

• High-Bandwidth Oscilloscope

N1055A operates in receiver-only mode.

• Built-in Electrostatic

Discharge (ESD) Protection

• Calibrated impedance

and S-parameter results

displayed in real-time

• Adjustable TDR Edge

Speed

• Calibration Made Easy

using ECal modules or

mechanical SOLT standards.

86100D DCA-X with N1055A 35/50 GHz TDR/TDT Modules A fully integrated TDR/TDT/S-parameter measurement system that provides calibrated impedance and S-

parameter analysis on up to 16 channels in real-time.

N1055A Channel Count

• 2 Channels per module*

• 4 channels per module

• Ultra-thin remote heads

- minimize adapters/cables

* upgradeable

N1055 A Options:

14

Page


86100D DCA-X with N1055A 35/50 GHz TDR/TDT Modules Performance & Accuracy: Compare the Steps:

Keysight Calibrated Step, risetime = 8.4

ps

Keysight Raw Step, risetime = 9.5 ps

Keysight Calibrated Step, risetime = 11.6 ps

15

Page


TDR Resolution < 1mm

25 GHz Bandpass Filter

1.1 mm

1

1 2

2

3

3

4 5 6

4 5 6

7

7

Zoom

Bandpass Filter

S-parameters

Impedance Profile

• Point 3 = taper

• Points 4, 5, 6 = 3 capacitors spaced by < 1mm

All features visible!

TDR resolution < 1mm

16

Page


86100D DCA-X New Software “FlexDCA” Demo

17

Page


Agenda





• Q&A 5 min

18

Page


Why Measure Hot TDR?

TDR(Time Domain)

OFF

1333Mbps (active)

334Mbps (active)

ohm

dB

1G 2G 3G 4G 5G 6G

freq(Hz) 666M

•Hot TDR measurement is the impedance analysis of active devices under

actual operation conditions.

•Typically, impedance of the device in the OFF state and ON state (Hot

TDR) is significantly different. Impedance may vary with the data rate as

well.

Return Loss (Freq Domain)

19


2. Partial reflection

from Rx due to

impedance

mismatches …

Eye

Degradation

Channel Tx Rx

1. Signal transmitted from Tx …

3. Re-reflection

from Tx due to

impedance

mismatches ...

Multiple Reflections

Page 20


Source Impedance Matched Source Impedance NOT Matched

Source Termination Effects

Page 21


Many Standards Require Hot TDR Measurements

Page 22


MFTP from Tx

7.4.13 Return Loss and Impedance Balance

Transmitters (Tx):

When measuring output impedance of transmitters the operating condition

shall be during transmission of MFTP. This is to assure the measurement

is performed during a mode of operation that represents normal operation.

How to avoid effects of the

transmitter signal on

measurements?

Measurement Challenge

Serial ATA

Page 23


t

freq fc

•wideband receiver captures all of the

signal energy from the transmitter

time

Extensive averaging is

necessary to obtain a stable

waveform.

fc

freq

•narrowband receiver minimizes the effects

of the data signal from the transmitter

time

In many cases, averaging is

not necessary to obtain a

stable waveform.

t t

t

t

t

Tx Tx

Minimizing Errors from the Transmitter Signal TDR Scopes VNA

Page 24


Spurs due to Tx signal Fluctuations due to Tx signal

Avoid Spurious Feature

TDR(Time Domain) Return Loss (Freq Domain)

Page 25


From the data rate (user input), spurious

frequencies are determined and

automatically avoided during the sweep.

TDR(Time Domain) Return Loss (Freq Domain)

1-click

Operation

Avoid Spurious Feature

Page 26


Frequency Domain Time Domain 3 Breakthroughs

for Signal Integrity Design and Verification

Eye Diagram

ESD protection inside

Simple and Intuitive Operation

High ESD Robustness

Fast and Accurate Measurements

The ENA Option TDR is an application software embedded on the

ENA, which provides an one-box solution for high speed serial

interconnect analysis.

What is ENA Option TDR?

www.keysight.com/find/ena-tdr

Page 27


•Multiple reflections due to

impedance mismatches

significantly impact signal integrity.

•Typically, impedance of the device

in the OFF state and ON state (Hot

TDR) is significantly different.

Impedance may vary with the data

rate as well. Therefore it is essential

to characterize the device under

actual operating conditions.

www.keysight.com/find/ena-tdr

Summary of Hot TDR

Page 28

Page


Agenda





• Q&A 5 min

29

Page


Intel® Delta-L A new VNA-based solution to effectively move the Via effect for PCB diff. trace insertion loss

characterization

❶ 4-port E5071C

❷ Intel Test Coupon

❸ Probes & S/W

Total Solution Issue & Methodology

• How to De-embedding the Via?

• Delta-L Loss Characterization

Intel Web: http://www.intel.com/content/www/us/en/processors/xeon/delta-l-methodology-for-electrical-characterization-guide.html

Video On-line: http://youtu.be/RHqWqi_-5Kk

30

http://www.intel.com/content/www/us/en/processors/xeon/delta-l-methodology-for-electrical-characterization-guide.html














http://youtu.be/RHqWqi_-5Kk




Page 31

High-Frequency Material Measurement Techniques

Kenny Liao 廖康佑

資深專案經理

是德科技

Sep. 17, 2014

Confidential 1

Page Agenda

• What are we measuring

• What are the applications

• What are our solutions

• PCB Materials Test

2

Page

Permittivity and Permeability Definitions

–interaction of a material in the presence

of an external electric field.

"'

0rr j

"'

0

rrrj

interaction of a material in the presence of an external magnetic field.

Permittivity (Dielectric Constant)

Permeability

Dk

Page

"'rrr j "'

rrr j

Electromagnetic Field Interaction

Electric Magnetic

Permittivity Permeability

Fields Fields

STORAGE

LOSS

MUT

STORAGE

LOSS

Page

Loss Tangent

Df

'

"

tanr

r

CycleperStoredEnergy

CycleperLostEnergy

QD

1tan

Dissipation Factor D Quality Factor Q

r

'

r

''

r

Page

Relaxation Constant t

–t = Time required for 1/e

of an aligned system to

return to equilibrium or

random state, in seconds.

cc ft

2

11

t

j

s

1

)( :equation Debye

1 1

10

100

10 100

Water at 20o C

f, GHz

most energy is lost at 1/t

'r

"r

Page

Applications for Materials Measurement

7

Industry Applications / Products

Electronics Capacitor, substrates, PCB, antenna, ferrites, magnetic recording

heads, absorbers, SAR phantom materials, sensor

Aerospace/Defense Stealth, RAM (Radiation Absorbing Materials), radomes

Industrial materials Ceramics and composites: IC package, aerospace and automotive

components, cement, coatings, bio-implants

Polymers and plastics: fibers, substrates, films, insulation materials

Hydrogel: disposable diaper, soft contact lens

Liquid crystal: displays

Rubber, semiconductors and superconductors

Other products containing these materials: tires, paint, adhesives, etc.

Food & Agriculture Food preservation (spoilage) research, food development for

microwave, packaging, moisture measurements

Forestry & Mining Moisture measurements in wood or paper, oil content analysis

Pharmaceutical &

Medical

Drug research and manufacturing, bio-implants, human tissue

characterization, biomass, chemical concentration, fermentation

Page

Industry Applications / Products

Electronics Capacitor, substrates, PCB, antenna, ferrites, magnetic recording

heads, absorbers, SAR phantom materials, sensor

Aerospace/Defense Stealth, RAM (Radiation Absorbing Materials), radomes

Industrial materials Ceramics and composites: IC package, aerospace and automotive

components, cement, coatings, bio-implants

Polymers and plastics: fibers, substrates, films, insulation materials

Hydrogel: disposable diaper, soft contact lens

Liquid crystal: displays

Rubber, semiconductors and superconductors

Other products containing these materials: tires, paint, adhesives, etc.

Food & Agriculture Food preservation (spoilage) research, food development for

microwave, packaging, moisture measurements

Forestry & Mining Moisture measurements in wood or paper, oil content analysis

Pharmaceutical &

Medical

Drug research and manufacturing, bio-implants, human tissue

characterization, biomass, chemical concentration, fermentation

Applications for Materials Measurement

8

Page

9

85071E-Exx

Frequency

Material

types

Liquid

1 GHz 20 GHz 50 GHz 100 GHz 10 GHz 1 MHz 1 kHz DC

Solid

Semi-solids

(Powder)

Gel

Substrate

85071E

Dielectric test fixture

Dielectric probe

Materials measurement software

Liquid test fixture

Magnetic material test fixture

16451B 16453A

16452A

Toroidal core 16454A

10 GHz split

cylinder resonator

Split post dielectric resonators (SPDR)

85072A

85070E

Probe Kit / Fixture Portfolio

Page

Lots of methods. Which is Best? –It Depends… on:

• Frequency of interest

• Form of material (i.e., liquid, powder, solid, sheet)

• Expected value of εr and μr

• Required measurement accuracy

• Material properties (i.e., homogeneous, isotropic)

• Sample size restrictions

• Destructive or non-destructive

• Contacting or non-contacting

• Temperature

Page

LCR and Impedance Analyzer Solutions

High

Loss

Liquid

Solid

Low

Loss

1KHz 1 MHz 10 MHz 1Ghz 3 Ghz

16454A

Magnetic Test Fixture

16452A Liquid Fixture (Parallel Plate)

16451B

Parallel Plate

85070E Dielectric Probe Kit

16453A

Parallel Plate

Page

Parallel Plate Solutions

16452A Liquid Test Fixture

16451B

E4990A

E4991B with

option 002

16453A

Page

Inductance Solutions

Page

Network Analyzer Solutions

High

Loss

Liquid

Solid

Low

Loss

200MHz --1 GHz 20GHz 50Ghz 110GHz 1.1 THz

85070E Dielectric Probe Kit

85071E Transmission Line

85071E-100 Free Space

Open Resonator

(KeyCom)

85071E-300

Resonant Cavity

Page

Coaxial Probe System

Network Analyzer

(or E4991A Impedance Analyzer)

85070E

Dielectric Probe

GP-IB, LAN or USB

85070E Software

(included in kit)

Calibration is required

Computer

(Optional for PNA or ENA)

Page

Material assumptions:

• effectively infinite thickness

• non-magnetic

• isotropic

• homogeneous

• no air gaps or bubbles

Coaxial Probe

11

Reflection

(S )

r

Page

Three Probe Designs

High Temperature Probe

•0.200 – 20GHz (low end

0.01GHz with impedance

analyzer)

•Withstands -40 to 200

degrees C

•Flanged design allows

measuring flat surfaced

solids

Slim Form Probe

•0.500 – 50GHz

•Low cost consumable

design

•Fits in tight spaces,

smaller sample sizes

•For liquids and soft semi-

solids only

Performance Probe

•0.500 – 50GHz

•Withstands -40 to 200

degrees C

•Hermetically sealed on

both ends, OK for

autoclave

•Food grade stainless

steel

Page

Coaxial Probe Example Data

Page


Page


Page

Martini Meter!

80 85 90 95 100

Measured Y

80

85

90

95

100

Pre

d C

al

100 real

96.6 real

80.0 real

98.0 real

90.9 real

99.5 real

96.2 real

97.6 real

87.0 real

99.0 real

95.7 real

97.1 real

83.3 real

98.5 real

95.2 real

5

Infometrix, Inc.

Page

Transmission Line System

Network Analyzer

Sample holder

connected between coax cables

85071E Materials

Measurement

Software

Calibration is required

Computer


GP-IB, LAN or USB

Page

Transmission Line Sample Holders

Waveguide

Coaxial

Page

Transmission Line

l

Reflection

(S ) 11

Transmission

(S ) 21


• sample fills fixture cross section

• no air gaps at fixture walls

• flat faces, perpendicular to long axis

• Known thickness > 20/360 λ

r and r

Page

Transmission Example Data

Page

Transmission Example Data

Page

Transmission models in the 85071E Software

Algorithm Measured S-parameters Output

Nicolson-Ross S11, S21, S12, S22 εr and μr

NIST Precision S11, S21, S22 εr

Fast Transmission S21, S12 εr

Poly Fit 1 S11, S21, S12, S22 εr and μr

Poly Fit 2 S12, S21 εr

Stack Two S21, S12 (2 samples) εr and μr

Page

Reflection models in the 85071E Software

Algorithm Measured S-parameters Output

Short Backed S11 εr

Arbitrary Backed S11 εr

Single Double Thickness S11 (2 samples) εr and μr

Page

85071E Materials

Measurement

Software

Transmission Free-Space System

Network Analyzer

Sample holder

fixtured between two antennae Calibration is required

Computer


GP-IB, LAN or USB

Page

Non-Contacting method for High or Low Temperature Tests.

Free Space with Furnace

Page

Transmission Free-Space


• Flat parallel faced samples

• Sample in non-reactive region

• Beam spot is contained in sample

• Known thickness > 20/360 λ

l

Reflection

(S11 )

Transmission

(S21 )

r and r

Page

Free Space Example Data

Page

Free Space Example Data

Page

Resonant Cavity System

Resonant Cavity with sample

connected between ports.

Network Analyzer

GP-IB or LAN

Computer


Resonant Cavity

Software

No calibration required

Page

Resonant Cavity Fixtures

Agilent Split Cylinder Resonator IPC

TM-650-2.5.5.5.13

Split Post Dielectric

Resonators from QWED

ASTM 2520 Waveguide

Resonators

Page

Resonant Cavity Technique

00313.011

4

2.3032

1

css

cr

ss

sccr

QQV

V

fV

ffV

f f c

Q c

empty cavity

fc = Resonant Frequency of Empty Cavity

fs = Resonant Frequency of Filled Cavity

Qc = Q of Empty Cavity

Qs = Q of Filled Cavity

Vs = Volume of Empty Cavity

Vc = Volume of Sample

ASTM 2520

S21

Page


00313.011

4

2.3032

1

css

cr

ss

sccr

QQV

V

fV

ffV

Q

f s f f c

s Q c

empty cavity

sample inserted fc = Resonant Frequency of Empty Cavity






ASTM 2520

S21

Page


00313.011

4

2.3032

1

css

cr

ss

sccr

QQV

V

fV

ffV

Q

f s f f c

s Q c

empty cavity

sample inserted fc = Resonant Frequency of Empty Cavity






ASTM 2520

S21

Page

Resonant Cavity Example Data

Page

Resonant vs. Broadband Transmission Methods

Resonant Broadband

Low Loss materials Yes

er” resolution ≤10-4

No

er” resolution ≥10-2

Thin Films and Sheets

Yes

10GHz sample thickness <1mm

No

10GHz optimum thickness ~ 5-10mm

Calibration Required No Yes

Measurement Frequency Coverage

Single Frequency Broadband or Banded

Page

Model Number Description

85070E

020

030

050

400

Dielectric Probe Kit

High Temperature Probe

Slim Form Probe

Performance Probe

Advanced Functionality

85071E

100

200

300

400

Materials Measurement Software

Free Space Calibration

Arch Reflectivity Software

Resonant Cavity Software

Advanced Functionality

85072A 10GHz Split Cylinder Resonant Cavity

Microwave Materials Measurement Products

Page

Materials Ordering Convenience Specials

Model Number Description

85071E

E19

E03

E04

E15

E07

Split Post Dielectric Resonators from QWED

1.1GHz

2.5GHz

5GHz

15GHz

22GHz

85071E

E02

E01

E22

E18

E24

Quasi-optical products from Thomas Keating Ltd.

60-90GHz – Quasi-optical Table

75-110GHz – Quasi-optical Table

90-140GHz – Additional set of horns for above tables



Page

Summary of methods

Page

44

Resources Websites

• Materials Test Equipment webpsite

Application notes

• Basics of Measuring the Dielectric Properties of Materials (5989-2589EN, Aug 2013)

• Solutions for Measuring Permittivity and Permeability with LCR Meters and Impedance Analyzers

(5980-2862EN, Sep 2013)

• Split Post Dielectric Resonators for Dielectric Measurements of Substrates (5989-5384EN, Jul 2006)

Tech overviews, brochures and selection guides

• Measuring Dielectric Properties using Agilent’s Materials Measurement Solutions - Brochure (5991-

2171EN, Apr 2013)

• Choosing the Optimal Method for Testing Dielectric Properties of Materials - Application brief (5991-

2599EN, Jun 2013)

• 85070E Dielectric Probe Kit (5989-0222EN, Jun 2012)

• 85071E Materials Measurement Software (5988-9472EN, Jun 2012)

• 85072A 10-GHz Split Cylinder Resonator (5989-6182EN, May 2012)

• LCR Meters, Impedance Analyzers and Test Fixtures Selection Guide (5952-1430E, Apr 2012)

Videos

• PNA Demo videos > Materials Measurements

• YouTube (external Agilent)

85070E dielectric probe with FieldFox (2009)

85072A 10 GHz Split Cylinder Resonator (2009)

Customer viewable training slides

• Microwave Dielectric Spectroscopy Workshop (2004)

• Free Space Materials Measurement Seminar (Jun 2005)

http://www.agilent.com/find/materials



http://cp.literature.agilent.com/litweb/pdf/5989-2589EN.pdf
























http://cp.literature.agilent.com/litweb/pdf/5952-1430E.pdf



http://wireless.agilent.com/networkanalyzers/pnademo.htm

http://www.youtube.com/watch?v=2BbrvIXnCbQ



http://www.youtube.com/watch?v=1eZoqqV5nAY

http://www.home.agilent.com/upload/cmc_upload/All/MWDielectricSpectroscopyWS.pdf

http://www.home.agilent.com/upload/cmc_upload/All/MWDielectricSpectroscopyWS.pdf

http://www.home.agilent.com/upload/cmc_upload/All/FreeSpaceSeminarRev2.pdf

PCB Materials Test

Page

Available Measurement Methods

46

PCB Dk/Df Characterization

Methods Typical frequency range

Parallel plate Up to 1 GHz

Transmission line 100 MHz to 110 GHz

Resonant cavity 1 GHz to 40 GHz

Parallel plate Transmission line Resonant cavity

Dk: Dielectric constant (Relative permittivity)

Df: Dissipation factor (Loss tangent)

www.keysight.com/find/materials

http://www.keysight.com/find/materials

Page

Resonant Cavity Method with SPDR Fixture

– Key Features

• Superior accuracy to measure

lower loss materials

• Convenient and fast

measurement of substrates,

PCB and thin films

• Non-destructive and non-

contacting measurement (Just

insert your MUT into the slit of

the fixture)

• Enable to measure multi-layer

PCB

47

SPDR fixture

ENA/PNA Network Analyzer

with Materials Measurement Software

E5063A

Sample

SPDR: Split Post Dielectric Resonator

(SPDR supplier: QWED)

Page

Cross-Section of SPDR fixture

48

Dielectric Resonator

Sample Dielectric Resonator

z Metal Enclosure

hG

h

l

Coupling Loop

SPDR Performance (QWED) • Nominal freq. of the basic line of SPDRs: 1.1/1.9/2.45/3.2/5/10/15 GHz

(Customization is possible)

• Uncertainty of the real permittivity (typical): ±1 %

(Providing that the average thickness of MUT is measured with accuracy

±0.7 % or better; Δε/ε = ±(0.15+Δh/h) %) • Uncertainty of tan δ (typical): ±3 %

• Resolution of tan δ: 2 x 10-5

• Operational temperature range: -200℃ ~ +110℃

Page

RF Solution (1 MHz to 1 GHz)

Permittivity Evaluation

LF/HF Solution (20 Hz to 30 MHz)

Parallel Plate Method

16451B 16451B

E4990A E4991B with

option 002

16453A

49

Page

Appendix

50

Page

SPDR (for 10 GHz)

51

Page

SPDR (Split Post Dielectric Resonator)

52

SPDR Resonators for different frequencies

Page

Cp G

Equivalent Circuit

Thickness = t

Electrodes (Area=A)

Co : Air Capacitance

00

0C

Gj

C

CCj

CjGY

p

p

00

*

C

Gj

C

C p

r

tan.0

0

rr

p

r

A

Gt

A

Ct

Parallel Plate Method

53

Page

Materials Measurement Methods

54

Transmission

Line

Resonant

Cavity

Free Space

Coaxial

Probe

Parallel Plate

(Capacitance)

Inductance

85070E

85072A

16451B/53A

16454A

Thank You

Confidential 55

Page

References

R N Clarke (Ed.), “A Guide to the Characterisation of Dielectric Materials at RF and Microwave Frequencies,” Published by

The Institute of Measurement & Control (UK) & NPL, 2003

J. Baker-Jarvis, M.D. Janezic, R.F. Riddle, R.T. Johnk, P. Kabos, C. Holloway, R.G. Geyer, C.A. Grosvenor, “Measuring the

Permittivity and Permeability of Lossy Materials: Solids, Liquids, Metals, Building Materials, and Negative-Index Materials,”

NIST Technical Note 15362005

“Test methods for complex permittivity (Dielectric Constant) of solid electrical insulating materials at microwave frequencies

and temperatures to 1650°, ” ASTM Standard D2520, American Society for Testing and Materials

Janezic M. and Baker-Jarvis J., “Full-wave Analysis of a Split-Cylinder Resonator for Nondestructive Permittivity

Measurements,” IEEE Transactions on Microwave Theory and Techniques vol. 47, no. 10, Oct 1999, pg. 2014-2020

J. Krupka , A.P. Gregory, O.C. Rochard, R.N. Clarke, B. Riddle, J. Baker-Jarvis, “Uncertainty of Complex Permittivity

Measurement by Split-Post Dielectric Resonator Techniques,” Journal of the European Ceramic Society

No. 10, 2001, pg. 2673-2676

“Basics of Measureing the Dielectric Properties of Materials”. Agilent application note. 5989-2589EN

AM. Nicolson and G. F. Ross, "Measurement of the intrinsic properties of materials by time domain techniques," IEEE Trans.

Instrum. Meas., IM-19(4), pp. 377-382, 1970.

Improved Technique for Determining Complex Permittivity with the Transmission/Reflection Method, James Baker-Jarvis et

al, IEEE transactions on microwave Theory and Techniques vol 38, No. 8 August 1990

P. G. Bartley, and S. B. Begley, “A New Technique for the Determination of the Complex Permittivity and Permeability of

Materials Proc. IEEE Instrument Meas. Technol. Conf., pp. 54-57, 2010.

LiTek’s PCB Delta-L Measurement Solution

Presented by

厘科科技 (LiTek Technologies)

Leo Lee (李文福)

By 2014

Background of PCB Delta-L Measurement

. Triggered by Intel

. Remove the via effect that not included in our measurement

. Use a easy way to implement (Delta of Loss)

. Suitable for any layers in the PCB

. Real Differential Loss Measurement

Page 2

Page 3

Page 4

LiTek’s PCB Delta-L Solution

E5071C, 20G TpNA software

Agilent E-Cal

LiTek’s PCB Probe

PCB (DUT)

Page 5

Guide Pin Information

Page 6

Why TpNA for PCB Delta-L Measurement?

• A PC based GUI Software, friendly control interface.

• Help to finish all steps including: >>Perform E-Cal

>>Setup all features for SDD21 measurement (optional including Time-Domain Differential Impedance)

>>Recording all layers, Reference and Longer Length PCB’s insertion loss in the TpNA.

>>Auto Calculating Delta-L result in the TpNA

>>Easily export a result by just one button press

• Who can finish these jobs One who can use a PC and without the knowledge to use ENA.

Page 7

How to do the measurement 當TpNA開啟後,建立一個PCB for Delta-L的專案.

使用者將E-Cal分別與ENA的4個埠連接後,按下TpNA的”執行E-Cal”按鈕,TpNA就會完成所有的E-Cal校正

Page 8

How to do the measurement

Page 9


Page 10


當Reference Length及DUT Length的Insertion Loss量測完畢,TpNA就會自動的計算Delta-L

Page 11


在報表頁中,使用者按下”輸出報表”的按鈕,TpNA就會完成一份Excel格式的報表

Page 12

E5063A Application

1

Agenda

2

• E5063A Introduction

• Option 011(Start up Time Domain)

• Option PIC TDR /SET2DIL Software

外觀介紹

硬體按鍵

USB接孔

測試孔(N-Type)

設備電源開關

接地端口 SSD

GPIB

24 Bit I/O Port

外部觸發輸入端子

參考訊號端子

設備電源開關

設備電源接孔

USB接孔

網路接孔

瑩幕輸入孔

USB488外部控制

設備序號標籤

設備校正標籤

LCD觸碰瑩幕

3

Agenda




4

Main Frame

支持五國語言：英文、繁體中文、簡體中文、韓文、日文。

5

Prepared to Start

開始設定

6

點選進階模式

步驟一，儀器組態設定

7

外接二個U1810B，故選擇此項

選擇單端與差分量測


8

Port1 &2 ; Port3皆選擇Deskew校正並按下執行按鈕進行校正程序

步驟二，誤差校正

Open Thru Load

Load Thru Open 9

步驟三，測試流程設定

10

步驟四，測試清單列表

3

1

步驟1: 可無限制增加量測的參數

步驟2: 選擇編輯的項目

步驟3: 點選「編輯」來進行細項的設定, 記得每一組項目都需執行編輯中的測試待測物長度

2

11

步驟五，編輯量測

開路定義: 差分線長測試開路定義: 單動線長測試

12

步驟六，編輯限制值

13

步驟七，開始量測及結果儲存

14

Agenda




15


由外部控制(儀測軟件)控制

選擇差分量測

16

選擇「Deskew與振幅;損失校正」並按下執行按鈕進行校正程序

步驟二，誤差校正

Open Thru Load

17

1. 點選桌面「TDR2.2.5.0」的軟件

2. 執行「TDR Automation Test」程式

步驟三，開啟儀測TDR軟件

18

步驟三，開啟儀測TDR軟件

19

功能說明-File

刪除量測資料

20

選擇軟體的語系(中/英文)

選擇測量的功能(阻抗/損失)

查看軟件資訊

功能說明-System

21

1. 設定產品資訊

2. 設定量測儲存資訊

3. 設定單分/差動測試 4. 設定量測的誤差值

6. 結果判定依據

設定說明:

5. 設定板材

1. 設定產品量測資料, 以便於產生報告時可以使用

2. 設定量測存資訊, 可在量測時同步記錄曲線資料及圖形

3. 設定量測類別, 開路位置及量測範圍 4. 設定量測結果的允收值(多數以百分比) 5. 設定板材(目前並無使用) 6. 設定量測結果的判定依據(多數以平均

值為標準)

功能說明-測試參數

22

1. 設定取樣資料 2. 設定觸發方式 3. 設定測試程序 4. 設定顯示單位 5. 操作畫面設定

6. 設定待測物序號

設定說明:

1. 設定取樣資料, 無需設定 2. 設定觸發方式, 可設定鍵盤及腳踏開開觸發量測 3. 設定測試程序, 即設定若多量數據量測時, 切換

下一個量測程序的判斷條件: a.過關: 量測值若符合設定值即繼續量測下一點 b.手動: 由人工切換至下個量測點 c.下一步: 無論量測數據為何, 量測後繼續量測下一點

d.過關記錄: 量測合格後才記錄 4. 設定量顯示單位: (多數以”英吋”表示) 5. 操作畫面設定, 無需設定 6. 設定待測物序號: 此設定目的為多組阻抗量測時, 可自動於報告上顯示時, 產生這些數據資料 7. 開路定義程序: 請選用「依自動判定」

功能說明-操作設定

7. 開路定義程序

23

1.開新檔 2.編輯 3.存檔 4.確認 5.離開

步驟四-測試參數

24

步驟五-操作設定

25

此範例為兩筆量測數據: 第一組為單端阻抗; 第二組為差分阻抗探頭不要連接任何待測

物

第一筆量測:連接探頭至待測物

第二筆量測:連接探頭至待測物

步驟六-開路定義

26

步驟七-開始量測

27

SET2DIL measure mode

請選擇SET2DIL模式

28

1 4 3 2

Step1: 開啟第一組測試條件 Step2: 新增欲測試的項目 Step3: 點選測試項目並按編輯修改如下參數 Step4:設定完畢後, 請記得儲存後再離開這個畫面

軟件主頁面

離開

Intel Defination

內、外層量測選擇

點選「測試參數, 以進入設定畫面

步驟一，設定測試參數

29

步驟二，執行校正

30

步驟三，開始測量

31

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Date post:	17-Feb-2018
Category:	Documents
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