1
SIS 300 Dipole Low Loss Wire and Cable
J Kaugerts GSI
TAC Subcommittee on
Superconducting Magnets
Nov15-16 2005
2
Collider vs Fast-Ramped Synchrotron Operation
bull For beam colliders such as RHIC magnet AC losses were not an important consideration given low magnet ramp rate (0042 Ts) and infrequent ramps
bull For fixed target fast-ramping synchrotrons such as GSIlsquos SIS 200 at 4 T ( and now SIS 300 at 6T) the ramp rate is high (1Ts) and ramps are frequent so AC loss reduction is an important consideration
3
Conductor Losses
bull Wire losses1) Filament hysteresis
Pf = (4df3 ) int dB Jc(T B )
bull Coupling (eddy) current lossvolume Pw
Pw = 20 (dB dt)2 = (02 ρet )(p2)2 ~ coupling current time constant ρet~ transverse resistivity p~ filament twist pitch Cable losses (scale with Rc amp Ra )1) Crossover strand resistance Rc
2) Adjacent strand resistance Ra
bull
4
Dipole GSI 001
bull A 1m long dipole was built and tested at BNL for the earlier ( 4T 1 Ts) SIS 200 synchrotron design which was updated to the 6 T 1 Ts present SIS 300
5
GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
ramping mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crsover 161048 32206 920
transvse adjacent 1069 214 06
parallel adjacent 016 03 00
filament coupling 11194 2239 64
hysteresis 1555 311 09
delta hysteresis 134 27 01
total hysteresis 1689 338 10
total magnet 175016 34999 1000
Rc =8μΩ no coreRa =64μΩ13 mm fil twist pitch
6
GSI 001 Dipole Calculated Conductor Loss (as built)
ramping mean loss fraction
power power cyclem of total
Watts Watts Joules
transvse crsover 021 04 05
transvse adjacent 1069 214 277
parallel adjacent 016 03 04
filament coupling 1060 212 275
hysteresis 1555 311 403
delta hysteresis 134 27 35
total hysteresis 1689 338 438
total magnet 3854 771 1000
SS core in cableRc =625 mΩRa =64 μΩFil twist pitch=4 mm
7
SIS 300 Dipole Loss Reduction
bull Previous slide shows that Ra coupling currents and filament hysteresis constitute major loss sources for cored cable conductor
bull Loss reduction
bull 1) increase Ra
bull 2) Increase matrix resistivity to reduce coupling currentsbull 3) decrease filament diameter to reduce hysteresis loss
8
Ra Loss Reduction
bull Ra can be increased by heating cable in air
bull Ra increase may reduce current sharing capability of wire and decrease conductor stability No quantitative data are available to my knowledge
9
Higher resistance wire matrixbull Cold working the copper in the wire during itlsquos
production can provide a higher resistivity wire matrix but cable heat treatment due to coil curing or heat treatment to increase Ra will reduce this resistivity again
bull High resistivity barriers (such as CuNi) around filaments or filament regions increase the effective or transverse resistivity of the wire
bull A Cu05-06 Mn interfilamentary matrix also increases the transverse resistivity and is unaffected by cable curing or heat treatment
10
Small filament wire
bull Below about 35 micrometer filament size proximity coupling again increases filament hysteresis loss in an all-copper matrix wire ( keeping sd constsnt) s~filament spacing d~fil dia
bull Use of a CuMn interfilamentary matrix eliminates proximity coupling effects for filament sizes down to around 1 micrometer
11
SIS 300 Dipole Wire Parameters(with Cu matrix wire)
bull Strand diameter 0825 mmbull Filament diameter 35 micrometers bull Filament twist pitch 5 mm bull MatrixNbTi ratio 14 (15)bull Strand transverse resistivity et (4 + 09 B)10-10 Ohm m (goal)bull Strand transverse resistivity et (14 +09B)10-10 Ohm m (calculated with all-copper matrix 15 CuSC ratio) Present EAS wire with 43 micrometer filaments 175 CuSC ratio
has measured et =(058+09B)10-10 Ohm-mbull Wirebull Strand coating Sn Ag (Stabrite)bull Critical current density Jc 2700 Amm2 ( 5 T 42 K) bull Critical current density Jc 2130 Amm2 ( 6T 42 K)
12
SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
bull Global matrix ratio 17bull Filament number22686bull Filament diameter 263 μmbull Wire twist pitch 125 mmbull Transverse resistivity ρet = (415 + 19B)bull10-10 Ωm ( For RHIC wire ρet = (124 + 09B)bull10-10 Ωm)bull Wire diameter 0651 mmbull Jc =2760 Amm2 ( 5 T 42 K) ( best value achieved)
Made for possible use in the SSC High Energy Booster (HEB) using a double stacking production method and tested for GSI at Twente TU
13
Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
IGC fabricated a 309 mm billet into wire of 26 micron filament diameter with a Cu-06Mn interfilamentary matrix using a patented single stack approach also for SSC use
Further parameters areFilament number 38663Matrix to NbTi ratio 15Wire diameter 0808 mm
Jc = 2753 Asqmm at 5T 42 K ( best value achieved)Such a conductor requires scaling up by a factor of 102 in
diameter for application in the SIS 300 dipole
Calculated value for transverse resistivity ρet =34bull10-10 ΩmCoupling current time constant =117 msec for 5 mm fil twist
pitch
14
SIS 300 dipole Losscycle-m with Cu matrix
rampg mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crosr 036 32 40
transvse adjnt 121 107 132
parallel adjacent 001 01 01
filnt coupling 236 208 257
hysteresis 512 450 557
delta hysteresis 012 10 13
total hysteresis 524 461 570
total magnet 930 808 1000
Rc=20 mΩSS core in cableRa=200 μΩ5 mm fil Twist pitch35 μm filaments
15
SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix
rampg mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crosr 036 32 57
transvse adjnt 121 107 190
parallel adjacent 001 01 02
filnt coupling 105 93 165
hysteresis 366 322 573
delta hysteresis 008 07 13
total hysteresis 374 329 586
total magnet 638 562 1000
Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments
16
Loss Reduction with CuMn interfilamentary matrix
Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix
17
Tested Wires
140 094 092 115 110 123
2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn
Ratio JcmJt
double stacked
single stacked
single stacked
double stacked
doublestacked
tripleextrudeddouble stackedWire ID
18
Single stacked wire
19
Filament Distortion Effects
Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires
20
Other Interfilamentary Matrix Materials
bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands
21
Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
Case No
Interfil
Matrix mat
Barrier
Mat
Filament
Diam df
(m)
(msec)
et
-10
m)
Notes
1 Cu none 35 278 143 RRRCu =278
RRRCuint=25
2 Cu-05wtMn
none 25 134 297 CuMn=250
3 Cu-
05wtMnnone 25 107 372 RRRCu=220
(this case only)
4 Cu-
05wtMn
Cu-
10wtNi25 048 837 CuNi
=1400
5 Cu-10wtNi
Cu-10wtNi
25 044 900
6 Cu-10wtNi
none 25 1309 304
7 Cu-30wtNi
none 25 1304 305 cuNi =
3640
22
CuMn versus CuNi Interfilamentary matrix
bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn
bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss
bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss
bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases
23
Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
24
Switch wire performance conclusions
Short samples instabilitiesbull Inception of instabilities at low field
depending on wire diameter dbull Self field instabilitybull Virtually independent of
Filament size
CuNi composition (between CuNi 30 and CuNi10)
Stability limit Jc bulld ~ 2000 Amm
25
Low Loss Wire Conclusion
bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss
bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length
26
Present Wire Status
bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2
bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of
wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire
bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order
27
Problem
bull We need to order more wire to build SIS 300 model or prototype dipoles
bull Lead time between wire RFQ and wire receipt is 9-12 months
Solutionbull Make two 200 kg billets First one with 25
micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters
28
Cable Ra amp Rc
bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)
bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC
amp 15-70 MPa (BNL tests) Need more statistics
2
Collider vs Fast-Ramped Synchrotron Operation
bull For beam colliders such as RHIC magnet AC losses were not an important consideration given low magnet ramp rate (0042 Ts) and infrequent ramps
bull For fixed target fast-ramping synchrotrons such as GSIlsquos SIS 200 at 4 T ( and now SIS 300 at 6T) the ramp rate is high (1Ts) and ramps are frequent so AC loss reduction is an important consideration
3
Conductor Losses
bull Wire losses1) Filament hysteresis
Pf = (4df3 ) int dB Jc(T B )
bull Coupling (eddy) current lossvolume Pw
Pw = 20 (dB dt)2 = (02 ρet )(p2)2 ~ coupling current time constant ρet~ transverse resistivity p~ filament twist pitch Cable losses (scale with Rc amp Ra )1) Crossover strand resistance Rc
2) Adjacent strand resistance Ra
bull
4
Dipole GSI 001
bull A 1m long dipole was built and tested at BNL for the earlier ( 4T 1 Ts) SIS 200 synchrotron design which was updated to the 6 T 1 Ts present SIS 300
5
GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
ramping mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crsover 161048 32206 920
transvse adjacent 1069 214 06
parallel adjacent 016 03 00
filament coupling 11194 2239 64
hysteresis 1555 311 09
delta hysteresis 134 27 01
total hysteresis 1689 338 10
total magnet 175016 34999 1000
Rc =8μΩ no coreRa =64μΩ13 mm fil twist pitch
6
GSI 001 Dipole Calculated Conductor Loss (as built)
ramping mean loss fraction
power power cyclem of total
Watts Watts Joules
transvse crsover 021 04 05
transvse adjacent 1069 214 277
parallel adjacent 016 03 04
filament coupling 1060 212 275
hysteresis 1555 311 403
delta hysteresis 134 27 35
total hysteresis 1689 338 438
total magnet 3854 771 1000
SS core in cableRc =625 mΩRa =64 μΩFil twist pitch=4 mm
7
SIS 300 Dipole Loss Reduction
bull Previous slide shows that Ra coupling currents and filament hysteresis constitute major loss sources for cored cable conductor
bull Loss reduction
bull 1) increase Ra
bull 2) Increase matrix resistivity to reduce coupling currentsbull 3) decrease filament diameter to reduce hysteresis loss
8
Ra Loss Reduction
bull Ra can be increased by heating cable in air
bull Ra increase may reduce current sharing capability of wire and decrease conductor stability No quantitative data are available to my knowledge
9
Higher resistance wire matrixbull Cold working the copper in the wire during itlsquos
production can provide a higher resistivity wire matrix but cable heat treatment due to coil curing or heat treatment to increase Ra will reduce this resistivity again
bull High resistivity barriers (such as CuNi) around filaments or filament regions increase the effective or transverse resistivity of the wire
bull A Cu05-06 Mn interfilamentary matrix also increases the transverse resistivity and is unaffected by cable curing or heat treatment
10
Small filament wire
bull Below about 35 micrometer filament size proximity coupling again increases filament hysteresis loss in an all-copper matrix wire ( keeping sd constsnt) s~filament spacing d~fil dia
bull Use of a CuMn interfilamentary matrix eliminates proximity coupling effects for filament sizes down to around 1 micrometer
11
SIS 300 Dipole Wire Parameters(with Cu matrix wire)
bull Strand diameter 0825 mmbull Filament diameter 35 micrometers bull Filament twist pitch 5 mm bull MatrixNbTi ratio 14 (15)bull Strand transverse resistivity et (4 + 09 B)10-10 Ohm m (goal)bull Strand transverse resistivity et (14 +09B)10-10 Ohm m (calculated with all-copper matrix 15 CuSC ratio) Present EAS wire with 43 micrometer filaments 175 CuSC ratio
has measured et =(058+09B)10-10 Ohm-mbull Wirebull Strand coating Sn Ag (Stabrite)bull Critical current density Jc 2700 Amm2 ( 5 T 42 K) bull Critical current density Jc 2130 Amm2 ( 6T 42 K)
12
SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
bull Global matrix ratio 17bull Filament number22686bull Filament diameter 263 μmbull Wire twist pitch 125 mmbull Transverse resistivity ρet = (415 + 19B)bull10-10 Ωm ( For RHIC wire ρet = (124 + 09B)bull10-10 Ωm)bull Wire diameter 0651 mmbull Jc =2760 Amm2 ( 5 T 42 K) ( best value achieved)
Made for possible use in the SSC High Energy Booster (HEB) using a double stacking production method and tested for GSI at Twente TU
13
Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
IGC fabricated a 309 mm billet into wire of 26 micron filament diameter with a Cu-06Mn interfilamentary matrix using a patented single stack approach also for SSC use
Further parameters areFilament number 38663Matrix to NbTi ratio 15Wire diameter 0808 mm
Jc = 2753 Asqmm at 5T 42 K ( best value achieved)Such a conductor requires scaling up by a factor of 102 in
diameter for application in the SIS 300 dipole
Calculated value for transverse resistivity ρet =34bull10-10 ΩmCoupling current time constant =117 msec for 5 mm fil twist
pitch
14
SIS 300 dipole Losscycle-m with Cu matrix
rampg mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crosr 036 32 40
transvse adjnt 121 107 132
parallel adjacent 001 01 01
filnt coupling 236 208 257
hysteresis 512 450 557
delta hysteresis 012 10 13
total hysteresis 524 461 570
total magnet 930 808 1000
Rc=20 mΩSS core in cableRa=200 μΩ5 mm fil Twist pitch35 μm filaments
15
SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix
rampg mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crosr 036 32 57
transvse adjnt 121 107 190
parallel adjacent 001 01 02
filnt coupling 105 93 165
hysteresis 366 322 573
delta hysteresis 008 07 13
total hysteresis 374 329 586
total magnet 638 562 1000
Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments
16
Loss Reduction with CuMn interfilamentary matrix
Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix
17
Tested Wires
140 094 092 115 110 123
2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn
Ratio JcmJt
double stacked
single stacked
single stacked
double stacked
doublestacked
tripleextrudeddouble stackedWire ID
18
Single stacked wire
19
Filament Distortion Effects
Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires
20
Other Interfilamentary Matrix Materials
bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands
21
Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
Case No
Interfil
Matrix mat
Barrier
Mat
Filament
Diam df
(m)
(msec)
et
-10
m)
Notes
1 Cu none 35 278 143 RRRCu =278
RRRCuint=25
2 Cu-05wtMn
none 25 134 297 CuMn=250
3 Cu-
05wtMnnone 25 107 372 RRRCu=220
(this case only)
4 Cu-
05wtMn
Cu-
10wtNi25 048 837 CuNi
=1400
5 Cu-10wtNi
Cu-10wtNi
25 044 900
6 Cu-10wtNi
none 25 1309 304
7 Cu-30wtNi
none 25 1304 305 cuNi =
3640
22
CuMn versus CuNi Interfilamentary matrix
bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn
bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss
bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss
bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases
23
Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
24
Switch wire performance conclusions
Short samples instabilitiesbull Inception of instabilities at low field
depending on wire diameter dbull Self field instabilitybull Virtually independent of
Filament size
CuNi composition (between CuNi 30 and CuNi10)
Stability limit Jc bulld ~ 2000 Amm
25
Low Loss Wire Conclusion
bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss
bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length
26
Present Wire Status
bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2
bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of
wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire
bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order
27
Problem
bull We need to order more wire to build SIS 300 model or prototype dipoles
bull Lead time between wire RFQ and wire receipt is 9-12 months
Solutionbull Make two 200 kg billets First one with 25
micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters
28
Cable Ra amp Rc
bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)
bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC
amp 15-70 MPa (BNL tests) Need more statistics
3
Conductor Losses
bull Wire losses1) Filament hysteresis
Pf = (4df3 ) int dB Jc(T B )
bull Coupling (eddy) current lossvolume Pw
Pw = 20 (dB dt)2 = (02 ρet )(p2)2 ~ coupling current time constant ρet~ transverse resistivity p~ filament twist pitch Cable losses (scale with Rc amp Ra )1) Crossover strand resistance Rc
2) Adjacent strand resistance Ra
bull
4
Dipole GSI 001
bull A 1m long dipole was built and tested at BNL for the earlier ( 4T 1 Ts) SIS 200 synchrotron design which was updated to the 6 T 1 Ts present SIS 300
5
GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
ramping mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crsover 161048 32206 920
transvse adjacent 1069 214 06
parallel adjacent 016 03 00
filament coupling 11194 2239 64
hysteresis 1555 311 09
delta hysteresis 134 27 01
total hysteresis 1689 338 10
total magnet 175016 34999 1000
Rc =8μΩ no coreRa =64μΩ13 mm fil twist pitch
6
GSI 001 Dipole Calculated Conductor Loss (as built)
ramping mean loss fraction
power power cyclem of total
Watts Watts Joules
transvse crsover 021 04 05
transvse adjacent 1069 214 277
parallel adjacent 016 03 04
filament coupling 1060 212 275
hysteresis 1555 311 403
delta hysteresis 134 27 35
total hysteresis 1689 338 438
total magnet 3854 771 1000
SS core in cableRc =625 mΩRa =64 μΩFil twist pitch=4 mm
7
SIS 300 Dipole Loss Reduction
bull Previous slide shows that Ra coupling currents and filament hysteresis constitute major loss sources for cored cable conductor
bull Loss reduction
bull 1) increase Ra
bull 2) Increase matrix resistivity to reduce coupling currentsbull 3) decrease filament diameter to reduce hysteresis loss
8
Ra Loss Reduction
bull Ra can be increased by heating cable in air
bull Ra increase may reduce current sharing capability of wire and decrease conductor stability No quantitative data are available to my knowledge
9
Higher resistance wire matrixbull Cold working the copper in the wire during itlsquos
production can provide a higher resistivity wire matrix but cable heat treatment due to coil curing or heat treatment to increase Ra will reduce this resistivity again
bull High resistivity barriers (such as CuNi) around filaments or filament regions increase the effective or transverse resistivity of the wire
bull A Cu05-06 Mn interfilamentary matrix also increases the transverse resistivity and is unaffected by cable curing or heat treatment
10
Small filament wire
bull Below about 35 micrometer filament size proximity coupling again increases filament hysteresis loss in an all-copper matrix wire ( keeping sd constsnt) s~filament spacing d~fil dia
bull Use of a CuMn interfilamentary matrix eliminates proximity coupling effects for filament sizes down to around 1 micrometer
11
SIS 300 Dipole Wire Parameters(with Cu matrix wire)
bull Strand diameter 0825 mmbull Filament diameter 35 micrometers bull Filament twist pitch 5 mm bull MatrixNbTi ratio 14 (15)bull Strand transverse resistivity et (4 + 09 B)10-10 Ohm m (goal)bull Strand transverse resistivity et (14 +09B)10-10 Ohm m (calculated with all-copper matrix 15 CuSC ratio) Present EAS wire with 43 micrometer filaments 175 CuSC ratio
has measured et =(058+09B)10-10 Ohm-mbull Wirebull Strand coating Sn Ag (Stabrite)bull Critical current density Jc 2700 Amm2 ( 5 T 42 K) bull Critical current density Jc 2130 Amm2 ( 6T 42 K)
12
SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
bull Global matrix ratio 17bull Filament number22686bull Filament diameter 263 μmbull Wire twist pitch 125 mmbull Transverse resistivity ρet = (415 + 19B)bull10-10 Ωm ( For RHIC wire ρet = (124 + 09B)bull10-10 Ωm)bull Wire diameter 0651 mmbull Jc =2760 Amm2 ( 5 T 42 K) ( best value achieved)
Made for possible use in the SSC High Energy Booster (HEB) using a double stacking production method and tested for GSI at Twente TU
13
Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
IGC fabricated a 309 mm billet into wire of 26 micron filament diameter with a Cu-06Mn interfilamentary matrix using a patented single stack approach also for SSC use
Further parameters areFilament number 38663Matrix to NbTi ratio 15Wire diameter 0808 mm
Jc = 2753 Asqmm at 5T 42 K ( best value achieved)Such a conductor requires scaling up by a factor of 102 in
diameter for application in the SIS 300 dipole
Calculated value for transverse resistivity ρet =34bull10-10 ΩmCoupling current time constant =117 msec for 5 mm fil twist
pitch
14
SIS 300 dipole Losscycle-m with Cu matrix
rampg mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crosr 036 32 40
transvse adjnt 121 107 132
parallel adjacent 001 01 01
filnt coupling 236 208 257
hysteresis 512 450 557
delta hysteresis 012 10 13
total hysteresis 524 461 570
total magnet 930 808 1000
Rc=20 mΩSS core in cableRa=200 μΩ5 mm fil Twist pitch35 μm filaments
15
SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix
rampg mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crosr 036 32 57
transvse adjnt 121 107 190
parallel adjacent 001 01 02
filnt coupling 105 93 165
hysteresis 366 322 573
delta hysteresis 008 07 13
total hysteresis 374 329 586
total magnet 638 562 1000
Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments
16
Loss Reduction with CuMn interfilamentary matrix
Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix
17
Tested Wires
140 094 092 115 110 123
2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn
Ratio JcmJt
double stacked
single stacked
single stacked
double stacked
doublestacked
tripleextrudeddouble stackedWire ID
18
Single stacked wire
19
Filament Distortion Effects
Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires
20
Other Interfilamentary Matrix Materials
bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands
21
Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
Case No
Interfil
Matrix mat
Barrier
Mat
Filament
Diam df
(m)
(msec)
et
-10
m)
Notes
1 Cu none 35 278 143 RRRCu =278
RRRCuint=25
2 Cu-05wtMn
none 25 134 297 CuMn=250
3 Cu-
05wtMnnone 25 107 372 RRRCu=220
(this case only)
4 Cu-
05wtMn
Cu-
10wtNi25 048 837 CuNi
=1400
5 Cu-10wtNi
Cu-10wtNi
25 044 900
6 Cu-10wtNi
none 25 1309 304
7 Cu-30wtNi
none 25 1304 305 cuNi =
3640
22
CuMn versus CuNi Interfilamentary matrix
bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn
bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss
bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss
bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases
23
Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
24
Switch wire performance conclusions
Short samples instabilitiesbull Inception of instabilities at low field
depending on wire diameter dbull Self field instabilitybull Virtually independent of
Filament size
CuNi composition (between CuNi 30 and CuNi10)
Stability limit Jc bulld ~ 2000 Amm
25
Low Loss Wire Conclusion
bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss
bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length
26
Present Wire Status
bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2
bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of
wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire
bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order
27
Problem
bull We need to order more wire to build SIS 300 model or prototype dipoles
bull Lead time between wire RFQ and wire receipt is 9-12 months
Solutionbull Make two 200 kg billets First one with 25
micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters
28
Cable Ra amp Rc
bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)
bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC
amp 15-70 MPa (BNL tests) Need more statistics
4
Dipole GSI 001
bull A 1m long dipole was built and tested at BNL for the earlier ( 4T 1 Ts) SIS 200 synchrotron design which was updated to the 6 T 1 Ts present SIS 300
5
GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
ramping mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crsover 161048 32206 920
transvse adjacent 1069 214 06
parallel adjacent 016 03 00
filament coupling 11194 2239 64
hysteresis 1555 311 09
delta hysteresis 134 27 01
total hysteresis 1689 338 10
total magnet 175016 34999 1000
Rc =8μΩ no coreRa =64μΩ13 mm fil twist pitch
6
GSI 001 Dipole Calculated Conductor Loss (as built)
ramping mean loss fraction
power power cyclem of total
Watts Watts Joules
transvse crsover 021 04 05
transvse adjacent 1069 214 277
parallel adjacent 016 03 04
filament coupling 1060 212 275
hysteresis 1555 311 403
delta hysteresis 134 27 35
total hysteresis 1689 338 438
total magnet 3854 771 1000
SS core in cableRc =625 mΩRa =64 μΩFil twist pitch=4 mm
7
SIS 300 Dipole Loss Reduction
bull Previous slide shows that Ra coupling currents and filament hysteresis constitute major loss sources for cored cable conductor
bull Loss reduction
bull 1) increase Ra
bull 2) Increase matrix resistivity to reduce coupling currentsbull 3) decrease filament diameter to reduce hysteresis loss
8
Ra Loss Reduction
bull Ra can be increased by heating cable in air
bull Ra increase may reduce current sharing capability of wire and decrease conductor stability No quantitative data are available to my knowledge
9
Higher resistance wire matrixbull Cold working the copper in the wire during itlsquos
production can provide a higher resistivity wire matrix but cable heat treatment due to coil curing or heat treatment to increase Ra will reduce this resistivity again
bull High resistivity barriers (such as CuNi) around filaments or filament regions increase the effective or transverse resistivity of the wire
bull A Cu05-06 Mn interfilamentary matrix also increases the transverse resistivity and is unaffected by cable curing or heat treatment
10
Small filament wire
bull Below about 35 micrometer filament size proximity coupling again increases filament hysteresis loss in an all-copper matrix wire ( keeping sd constsnt) s~filament spacing d~fil dia
bull Use of a CuMn interfilamentary matrix eliminates proximity coupling effects for filament sizes down to around 1 micrometer
11
SIS 300 Dipole Wire Parameters(with Cu matrix wire)
bull Strand diameter 0825 mmbull Filament diameter 35 micrometers bull Filament twist pitch 5 mm bull MatrixNbTi ratio 14 (15)bull Strand transverse resistivity et (4 + 09 B)10-10 Ohm m (goal)bull Strand transverse resistivity et (14 +09B)10-10 Ohm m (calculated with all-copper matrix 15 CuSC ratio) Present EAS wire with 43 micrometer filaments 175 CuSC ratio
has measured et =(058+09B)10-10 Ohm-mbull Wirebull Strand coating Sn Ag (Stabrite)bull Critical current density Jc 2700 Amm2 ( 5 T 42 K) bull Critical current density Jc 2130 Amm2 ( 6T 42 K)
12
SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
bull Global matrix ratio 17bull Filament number22686bull Filament diameter 263 μmbull Wire twist pitch 125 mmbull Transverse resistivity ρet = (415 + 19B)bull10-10 Ωm ( For RHIC wire ρet = (124 + 09B)bull10-10 Ωm)bull Wire diameter 0651 mmbull Jc =2760 Amm2 ( 5 T 42 K) ( best value achieved)
Made for possible use in the SSC High Energy Booster (HEB) using a double stacking production method and tested for GSI at Twente TU
13
Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
IGC fabricated a 309 mm billet into wire of 26 micron filament diameter with a Cu-06Mn interfilamentary matrix using a patented single stack approach also for SSC use
Further parameters areFilament number 38663Matrix to NbTi ratio 15Wire diameter 0808 mm
Jc = 2753 Asqmm at 5T 42 K ( best value achieved)Such a conductor requires scaling up by a factor of 102 in
diameter for application in the SIS 300 dipole
Calculated value for transverse resistivity ρet =34bull10-10 ΩmCoupling current time constant =117 msec for 5 mm fil twist
pitch
14
SIS 300 dipole Losscycle-m with Cu matrix
rampg mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crosr 036 32 40
transvse adjnt 121 107 132
parallel adjacent 001 01 01
filnt coupling 236 208 257
hysteresis 512 450 557
delta hysteresis 012 10 13
total hysteresis 524 461 570
total magnet 930 808 1000
Rc=20 mΩSS core in cableRa=200 μΩ5 mm fil Twist pitch35 μm filaments
15
SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix
rampg mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crosr 036 32 57
transvse adjnt 121 107 190
parallel adjacent 001 01 02
filnt coupling 105 93 165
hysteresis 366 322 573
delta hysteresis 008 07 13
total hysteresis 374 329 586
total magnet 638 562 1000
Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments
16
Loss Reduction with CuMn interfilamentary matrix
Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix
17
Tested Wires
140 094 092 115 110 123
2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn
Ratio JcmJt
double stacked
single stacked
single stacked
double stacked
doublestacked
tripleextrudeddouble stackedWire ID
18
Single stacked wire
19
Filament Distortion Effects
Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires
20
Other Interfilamentary Matrix Materials
bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands
21
Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
Case No
Interfil
Matrix mat
Barrier
Mat
Filament
Diam df
(m)
(msec)
et
-10
m)
Notes
1 Cu none 35 278 143 RRRCu =278
RRRCuint=25
2 Cu-05wtMn
none 25 134 297 CuMn=250
3 Cu-
05wtMnnone 25 107 372 RRRCu=220
(this case only)
4 Cu-
05wtMn
Cu-
10wtNi25 048 837 CuNi
=1400
5 Cu-10wtNi
Cu-10wtNi
25 044 900
6 Cu-10wtNi
none 25 1309 304
7 Cu-30wtNi
none 25 1304 305 cuNi =
3640
22
CuMn versus CuNi Interfilamentary matrix
bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn
bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss
bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss
bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases
23
Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
24
Switch wire performance conclusions
Short samples instabilitiesbull Inception of instabilities at low field
depending on wire diameter dbull Self field instabilitybull Virtually independent of
Filament size
CuNi composition (between CuNi 30 and CuNi10)
Stability limit Jc bulld ~ 2000 Amm
25
Low Loss Wire Conclusion
bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss
bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length
26
Present Wire Status
bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2
bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of
wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire
bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order
27
Problem
bull We need to order more wire to build SIS 300 model or prototype dipoles
bull Lead time between wire RFQ and wire receipt is 9-12 months
Solutionbull Make two 200 kg billets First one with 25
micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters
28
Cable Ra amp Rc
bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)
bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC
amp 15-70 MPa (BNL tests) Need more statistics
5
GSI 001 Dipole Lossescyclem assuming RHIC wire amp cable (1 Ts ramp)
ramping mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crsover 161048 32206 920
transvse adjacent 1069 214 06
parallel adjacent 016 03 00
filament coupling 11194 2239 64
hysteresis 1555 311 09
delta hysteresis 134 27 01
total hysteresis 1689 338 10
total magnet 175016 34999 1000
Rc =8μΩ no coreRa =64μΩ13 mm fil twist pitch
6
GSI 001 Dipole Calculated Conductor Loss (as built)
ramping mean loss fraction
power power cyclem of total
Watts Watts Joules
transvse crsover 021 04 05
transvse adjacent 1069 214 277
parallel adjacent 016 03 04
filament coupling 1060 212 275
hysteresis 1555 311 403
delta hysteresis 134 27 35
total hysteresis 1689 338 438
total magnet 3854 771 1000
SS core in cableRc =625 mΩRa =64 μΩFil twist pitch=4 mm
7
SIS 300 Dipole Loss Reduction
bull Previous slide shows that Ra coupling currents and filament hysteresis constitute major loss sources for cored cable conductor
bull Loss reduction
bull 1) increase Ra
bull 2) Increase matrix resistivity to reduce coupling currentsbull 3) decrease filament diameter to reduce hysteresis loss
8
Ra Loss Reduction
bull Ra can be increased by heating cable in air
bull Ra increase may reduce current sharing capability of wire and decrease conductor stability No quantitative data are available to my knowledge
9
Higher resistance wire matrixbull Cold working the copper in the wire during itlsquos
production can provide a higher resistivity wire matrix but cable heat treatment due to coil curing or heat treatment to increase Ra will reduce this resistivity again
bull High resistivity barriers (such as CuNi) around filaments or filament regions increase the effective or transverse resistivity of the wire
bull A Cu05-06 Mn interfilamentary matrix also increases the transverse resistivity and is unaffected by cable curing or heat treatment
10
Small filament wire
bull Below about 35 micrometer filament size proximity coupling again increases filament hysteresis loss in an all-copper matrix wire ( keeping sd constsnt) s~filament spacing d~fil dia
bull Use of a CuMn interfilamentary matrix eliminates proximity coupling effects for filament sizes down to around 1 micrometer
11
SIS 300 Dipole Wire Parameters(with Cu matrix wire)
bull Strand diameter 0825 mmbull Filament diameter 35 micrometers bull Filament twist pitch 5 mm bull MatrixNbTi ratio 14 (15)bull Strand transverse resistivity et (4 + 09 B)10-10 Ohm m (goal)bull Strand transverse resistivity et (14 +09B)10-10 Ohm m (calculated with all-copper matrix 15 CuSC ratio) Present EAS wire with 43 micrometer filaments 175 CuSC ratio
has measured et =(058+09B)10-10 Ohm-mbull Wirebull Strand coating Sn Ag (Stabrite)bull Critical current density Jc 2700 Amm2 ( 5 T 42 K) bull Critical current density Jc 2130 Amm2 ( 6T 42 K)
12
SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
bull Global matrix ratio 17bull Filament number22686bull Filament diameter 263 μmbull Wire twist pitch 125 mmbull Transverse resistivity ρet = (415 + 19B)bull10-10 Ωm ( For RHIC wire ρet = (124 + 09B)bull10-10 Ωm)bull Wire diameter 0651 mmbull Jc =2760 Amm2 ( 5 T 42 K) ( best value achieved)
Made for possible use in the SSC High Energy Booster (HEB) using a double stacking production method and tested for GSI at Twente TU
13
Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
IGC fabricated a 309 mm billet into wire of 26 micron filament diameter with a Cu-06Mn interfilamentary matrix using a patented single stack approach also for SSC use
Further parameters areFilament number 38663Matrix to NbTi ratio 15Wire diameter 0808 mm
Jc = 2753 Asqmm at 5T 42 K ( best value achieved)Such a conductor requires scaling up by a factor of 102 in
diameter for application in the SIS 300 dipole
Calculated value for transverse resistivity ρet =34bull10-10 ΩmCoupling current time constant =117 msec for 5 mm fil twist
pitch
14
SIS 300 dipole Losscycle-m with Cu matrix
rampg mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crosr 036 32 40
transvse adjnt 121 107 132
parallel adjacent 001 01 01
filnt coupling 236 208 257
hysteresis 512 450 557
delta hysteresis 012 10 13
total hysteresis 524 461 570
total magnet 930 808 1000
Rc=20 mΩSS core in cableRa=200 μΩ5 mm fil Twist pitch35 μm filaments
15
SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix
rampg mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crosr 036 32 57
transvse adjnt 121 107 190
parallel adjacent 001 01 02
filnt coupling 105 93 165
hysteresis 366 322 573
delta hysteresis 008 07 13
total hysteresis 374 329 586
total magnet 638 562 1000
Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments
16
Loss Reduction with CuMn interfilamentary matrix
Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix
17
Tested Wires
140 094 092 115 110 123
2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn
Ratio JcmJt
double stacked
single stacked
single stacked
double stacked
doublestacked
tripleextrudeddouble stackedWire ID
18
Single stacked wire
19
Filament Distortion Effects
Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires
20
Other Interfilamentary Matrix Materials
bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands
21
Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
Case No
Interfil
Matrix mat
Barrier
Mat
Filament
Diam df
(m)
(msec)
et
-10
m)
Notes
1 Cu none 35 278 143 RRRCu =278
RRRCuint=25
2 Cu-05wtMn
none 25 134 297 CuMn=250
3 Cu-
05wtMnnone 25 107 372 RRRCu=220
(this case only)
4 Cu-
05wtMn
Cu-
10wtNi25 048 837 CuNi
=1400
5 Cu-10wtNi
Cu-10wtNi
25 044 900
6 Cu-10wtNi
none 25 1309 304
7 Cu-30wtNi
none 25 1304 305 cuNi =
3640
22
CuMn versus CuNi Interfilamentary matrix
bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn
bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss
bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss
bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases
23
Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
24
Switch wire performance conclusions
Short samples instabilitiesbull Inception of instabilities at low field
depending on wire diameter dbull Self field instabilitybull Virtually independent of
Filament size
CuNi composition (between CuNi 30 and CuNi10)
Stability limit Jc bulld ~ 2000 Amm
25
Low Loss Wire Conclusion
bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss
bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length
26
Present Wire Status
bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2
bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of
wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire
bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order
27
Problem
bull We need to order more wire to build SIS 300 model or prototype dipoles
bull Lead time between wire RFQ and wire receipt is 9-12 months
Solutionbull Make two 200 kg billets First one with 25
micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters
28
Cable Ra amp Rc
bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)
bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC
amp 15-70 MPa (BNL tests) Need more statistics
6
GSI 001 Dipole Calculated Conductor Loss (as built)
ramping mean loss fraction
power power cyclem of total
Watts Watts Joules
transvse crsover 021 04 05
transvse adjacent 1069 214 277
parallel adjacent 016 03 04
filament coupling 1060 212 275
hysteresis 1555 311 403
delta hysteresis 134 27 35
total hysteresis 1689 338 438
total magnet 3854 771 1000
SS core in cableRc =625 mΩRa =64 μΩFil twist pitch=4 mm
7
SIS 300 Dipole Loss Reduction
bull Previous slide shows that Ra coupling currents and filament hysteresis constitute major loss sources for cored cable conductor
bull Loss reduction
bull 1) increase Ra
bull 2) Increase matrix resistivity to reduce coupling currentsbull 3) decrease filament diameter to reduce hysteresis loss
8
Ra Loss Reduction
bull Ra can be increased by heating cable in air
bull Ra increase may reduce current sharing capability of wire and decrease conductor stability No quantitative data are available to my knowledge
9
Higher resistance wire matrixbull Cold working the copper in the wire during itlsquos
production can provide a higher resistivity wire matrix but cable heat treatment due to coil curing or heat treatment to increase Ra will reduce this resistivity again
bull High resistivity barriers (such as CuNi) around filaments or filament regions increase the effective or transverse resistivity of the wire
bull A Cu05-06 Mn interfilamentary matrix also increases the transverse resistivity and is unaffected by cable curing or heat treatment
10
Small filament wire
bull Below about 35 micrometer filament size proximity coupling again increases filament hysteresis loss in an all-copper matrix wire ( keeping sd constsnt) s~filament spacing d~fil dia
bull Use of a CuMn interfilamentary matrix eliminates proximity coupling effects for filament sizes down to around 1 micrometer
11
SIS 300 Dipole Wire Parameters(with Cu matrix wire)
bull Strand diameter 0825 mmbull Filament diameter 35 micrometers bull Filament twist pitch 5 mm bull MatrixNbTi ratio 14 (15)bull Strand transverse resistivity et (4 + 09 B)10-10 Ohm m (goal)bull Strand transverse resistivity et (14 +09B)10-10 Ohm m (calculated with all-copper matrix 15 CuSC ratio) Present EAS wire with 43 micrometer filaments 175 CuSC ratio
has measured et =(058+09B)10-10 Ohm-mbull Wirebull Strand coating Sn Ag (Stabrite)bull Critical current density Jc 2700 Amm2 ( 5 T 42 K) bull Critical current density Jc 2130 Amm2 ( 6T 42 K)
12
SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
bull Global matrix ratio 17bull Filament number22686bull Filament diameter 263 μmbull Wire twist pitch 125 mmbull Transverse resistivity ρet = (415 + 19B)bull10-10 Ωm ( For RHIC wire ρet = (124 + 09B)bull10-10 Ωm)bull Wire diameter 0651 mmbull Jc =2760 Amm2 ( 5 T 42 K) ( best value achieved)
Made for possible use in the SSC High Energy Booster (HEB) using a double stacking production method and tested for GSI at Twente TU
13
Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
IGC fabricated a 309 mm billet into wire of 26 micron filament diameter with a Cu-06Mn interfilamentary matrix using a patented single stack approach also for SSC use
Further parameters areFilament number 38663Matrix to NbTi ratio 15Wire diameter 0808 mm
Jc = 2753 Asqmm at 5T 42 K ( best value achieved)Such a conductor requires scaling up by a factor of 102 in
diameter for application in the SIS 300 dipole
Calculated value for transverse resistivity ρet =34bull10-10 ΩmCoupling current time constant =117 msec for 5 mm fil twist
pitch
14
SIS 300 dipole Losscycle-m with Cu matrix
rampg mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crosr 036 32 40
transvse adjnt 121 107 132
parallel adjacent 001 01 01
filnt coupling 236 208 257
hysteresis 512 450 557
delta hysteresis 012 10 13
total hysteresis 524 461 570
total magnet 930 808 1000
Rc=20 mΩSS core in cableRa=200 μΩ5 mm fil Twist pitch35 μm filaments
15
SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix
rampg mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crosr 036 32 57
transvse adjnt 121 107 190
parallel adjacent 001 01 02
filnt coupling 105 93 165
hysteresis 366 322 573
delta hysteresis 008 07 13
total hysteresis 374 329 586
total magnet 638 562 1000
Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments
16
Loss Reduction with CuMn interfilamentary matrix
Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix
17
Tested Wires
140 094 092 115 110 123
2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn
Ratio JcmJt
double stacked
single stacked
single stacked
double stacked
doublestacked
tripleextrudeddouble stackedWire ID
18
Single stacked wire
19
Filament Distortion Effects
Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires
20
Other Interfilamentary Matrix Materials
bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands
21
Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
Case No
Interfil
Matrix mat
Barrier
Mat
Filament
Diam df
(m)
(msec)
et
-10
m)
Notes
1 Cu none 35 278 143 RRRCu =278
RRRCuint=25
2 Cu-05wtMn
none 25 134 297 CuMn=250
3 Cu-
05wtMnnone 25 107 372 RRRCu=220
(this case only)
4 Cu-
05wtMn
Cu-
10wtNi25 048 837 CuNi
=1400
5 Cu-10wtNi
Cu-10wtNi
25 044 900
6 Cu-10wtNi
none 25 1309 304
7 Cu-30wtNi
none 25 1304 305 cuNi =
3640
22
CuMn versus CuNi Interfilamentary matrix
bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn
bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss
bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss
bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases
23
Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
24
Switch wire performance conclusions
Short samples instabilitiesbull Inception of instabilities at low field
depending on wire diameter dbull Self field instabilitybull Virtually independent of
Filament size
CuNi composition (between CuNi 30 and CuNi10)
Stability limit Jc bulld ~ 2000 Amm
25
Low Loss Wire Conclusion
bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss
bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length
26
Present Wire Status
bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2
bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of
wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire
bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order
27
Problem
bull We need to order more wire to build SIS 300 model or prototype dipoles
bull Lead time between wire RFQ and wire receipt is 9-12 months
Solutionbull Make two 200 kg billets First one with 25
micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters
28
Cable Ra amp Rc
bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)
bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC
amp 15-70 MPa (BNL tests) Need more statistics
7
SIS 300 Dipole Loss Reduction
bull Previous slide shows that Ra coupling currents and filament hysteresis constitute major loss sources for cored cable conductor
bull Loss reduction
bull 1) increase Ra
bull 2) Increase matrix resistivity to reduce coupling currentsbull 3) decrease filament diameter to reduce hysteresis loss
8
Ra Loss Reduction
bull Ra can be increased by heating cable in air
bull Ra increase may reduce current sharing capability of wire and decrease conductor stability No quantitative data are available to my knowledge
9
Higher resistance wire matrixbull Cold working the copper in the wire during itlsquos
production can provide a higher resistivity wire matrix but cable heat treatment due to coil curing or heat treatment to increase Ra will reduce this resistivity again
bull High resistivity barriers (such as CuNi) around filaments or filament regions increase the effective or transverse resistivity of the wire
bull A Cu05-06 Mn interfilamentary matrix also increases the transverse resistivity and is unaffected by cable curing or heat treatment
10
Small filament wire
bull Below about 35 micrometer filament size proximity coupling again increases filament hysteresis loss in an all-copper matrix wire ( keeping sd constsnt) s~filament spacing d~fil dia
bull Use of a CuMn interfilamentary matrix eliminates proximity coupling effects for filament sizes down to around 1 micrometer
11
SIS 300 Dipole Wire Parameters(with Cu matrix wire)
bull Strand diameter 0825 mmbull Filament diameter 35 micrometers bull Filament twist pitch 5 mm bull MatrixNbTi ratio 14 (15)bull Strand transverse resistivity et (4 + 09 B)10-10 Ohm m (goal)bull Strand transverse resistivity et (14 +09B)10-10 Ohm m (calculated with all-copper matrix 15 CuSC ratio) Present EAS wire with 43 micrometer filaments 175 CuSC ratio
has measured et =(058+09B)10-10 Ohm-mbull Wirebull Strand coating Sn Ag (Stabrite)bull Critical current density Jc 2700 Amm2 ( 5 T 42 K) bull Critical current density Jc 2130 Amm2 ( 6T 42 K)
12
SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
bull Global matrix ratio 17bull Filament number22686bull Filament diameter 263 μmbull Wire twist pitch 125 mmbull Transverse resistivity ρet = (415 + 19B)bull10-10 Ωm ( For RHIC wire ρet = (124 + 09B)bull10-10 Ωm)bull Wire diameter 0651 mmbull Jc =2760 Amm2 ( 5 T 42 K) ( best value achieved)
Made for possible use in the SSC High Energy Booster (HEB) using a double stacking production method and tested for GSI at Twente TU
13
Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
IGC fabricated a 309 mm billet into wire of 26 micron filament diameter with a Cu-06Mn interfilamentary matrix using a patented single stack approach also for SSC use
Further parameters areFilament number 38663Matrix to NbTi ratio 15Wire diameter 0808 mm
Jc = 2753 Asqmm at 5T 42 K ( best value achieved)Such a conductor requires scaling up by a factor of 102 in
diameter for application in the SIS 300 dipole
Calculated value for transverse resistivity ρet =34bull10-10 ΩmCoupling current time constant =117 msec for 5 mm fil twist
pitch
14
SIS 300 dipole Losscycle-m with Cu matrix
rampg mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crosr 036 32 40
transvse adjnt 121 107 132
parallel adjacent 001 01 01
filnt coupling 236 208 257
hysteresis 512 450 557
delta hysteresis 012 10 13
total hysteresis 524 461 570
total magnet 930 808 1000
Rc=20 mΩSS core in cableRa=200 μΩ5 mm fil Twist pitch35 μm filaments
15
SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix
rampg mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crosr 036 32 57
transvse adjnt 121 107 190
parallel adjacent 001 01 02
filnt coupling 105 93 165
hysteresis 366 322 573
delta hysteresis 008 07 13
total hysteresis 374 329 586
total magnet 638 562 1000
Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments
16
Loss Reduction with CuMn interfilamentary matrix
Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix
17
Tested Wires
140 094 092 115 110 123
2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn
Ratio JcmJt
double stacked
single stacked
single stacked
double stacked
doublestacked
tripleextrudeddouble stackedWire ID
18
Single stacked wire
19
Filament Distortion Effects
Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires
20
Other Interfilamentary Matrix Materials
bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands
21
Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
Case No
Interfil
Matrix mat
Barrier
Mat
Filament
Diam df
(m)
(msec)
et
-10
m)
Notes
1 Cu none 35 278 143 RRRCu =278
RRRCuint=25
2 Cu-05wtMn
none 25 134 297 CuMn=250
3 Cu-
05wtMnnone 25 107 372 RRRCu=220
(this case only)
4 Cu-
05wtMn
Cu-
10wtNi25 048 837 CuNi
=1400
5 Cu-10wtNi
Cu-10wtNi
25 044 900
6 Cu-10wtNi
none 25 1309 304
7 Cu-30wtNi
none 25 1304 305 cuNi =
3640
22
CuMn versus CuNi Interfilamentary matrix
bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn
bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss
bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss
bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases
23
Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
24
Switch wire performance conclusions
Short samples instabilitiesbull Inception of instabilities at low field
depending on wire diameter dbull Self field instabilitybull Virtually independent of
Filament size
CuNi composition (between CuNi 30 and CuNi10)
Stability limit Jc bulld ~ 2000 Amm
25
Low Loss Wire Conclusion
bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss
bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length
26
Present Wire Status
bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2
bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of
wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire
bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order
27
Problem
bull We need to order more wire to build SIS 300 model or prototype dipoles
bull Lead time between wire RFQ and wire receipt is 9-12 months
Solutionbull Make two 200 kg billets First one with 25
micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters
28
Cable Ra amp Rc
bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)
bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC
amp 15-70 MPa (BNL tests) Need more statistics
8
Ra Loss Reduction
bull Ra can be increased by heating cable in air
bull Ra increase may reduce current sharing capability of wire and decrease conductor stability No quantitative data are available to my knowledge
9
Higher resistance wire matrixbull Cold working the copper in the wire during itlsquos
production can provide a higher resistivity wire matrix but cable heat treatment due to coil curing or heat treatment to increase Ra will reduce this resistivity again
bull High resistivity barriers (such as CuNi) around filaments or filament regions increase the effective or transverse resistivity of the wire
bull A Cu05-06 Mn interfilamentary matrix also increases the transverse resistivity and is unaffected by cable curing or heat treatment
10
Small filament wire
bull Below about 35 micrometer filament size proximity coupling again increases filament hysteresis loss in an all-copper matrix wire ( keeping sd constsnt) s~filament spacing d~fil dia
bull Use of a CuMn interfilamentary matrix eliminates proximity coupling effects for filament sizes down to around 1 micrometer
11
SIS 300 Dipole Wire Parameters(with Cu matrix wire)
bull Strand diameter 0825 mmbull Filament diameter 35 micrometers bull Filament twist pitch 5 mm bull MatrixNbTi ratio 14 (15)bull Strand transverse resistivity et (4 + 09 B)10-10 Ohm m (goal)bull Strand transverse resistivity et (14 +09B)10-10 Ohm m (calculated with all-copper matrix 15 CuSC ratio) Present EAS wire with 43 micrometer filaments 175 CuSC ratio
has measured et =(058+09B)10-10 Ohm-mbull Wirebull Strand coating Sn Ag (Stabrite)bull Critical current density Jc 2700 Amm2 ( 5 T 42 K) bull Critical current density Jc 2130 Amm2 ( 6T 42 K)
12
SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
bull Global matrix ratio 17bull Filament number22686bull Filament diameter 263 μmbull Wire twist pitch 125 mmbull Transverse resistivity ρet = (415 + 19B)bull10-10 Ωm ( For RHIC wire ρet = (124 + 09B)bull10-10 Ωm)bull Wire diameter 0651 mmbull Jc =2760 Amm2 ( 5 T 42 K) ( best value achieved)
Made for possible use in the SSC High Energy Booster (HEB) using a double stacking production method and tested for GSI at Twente TU
13
Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
IGC fabricated a 309 mm billet into wire of 26 micron filament diameter with a Cu-06Mn interfilamentary matrix using a patented single stack approach also for SSC use
Further parameters areFilament number 38663Matrix to NbTi ratio 15Wire diameter 0808 mm
Jc = 2753 Asqmm at 5T 42 K ( best value achieved)Such a conductor requires scaling up by a factor of 102 in
diameter for application in the SIS 300 dipole
Calculated value for transverse resistivity ρet =34bull10-10 ΩmCoupling current time constant =117 msec for 5 mm fil twist
pitch
14
SIS 300 dipole Losscycle-m with Cu matrix
rampg mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crosr 036 32 40
transvse adjnt 121 107 132
parallel adjacent 001 01 01
filnt coupling 236 208 257
hysteresis 512 450 557
delta hysteresis 012 10 13
total hysteresis 524 461 570
total magnet 930 808 1000
Rc=20 mΩSS core in cableRa=200 μΩ5 mm fil Twist pitch35 μm filaments
15
SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix
rampg mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crosr 036 32 57
transvse adjnt 121 107 190
parallel adjacent 001 01 02
filnt coupling 105 93 165
hysteresis 366 322 573
delta hysteresis 008 07 13
total hysteresis 374 329 586
total magnet 638 562 1000
Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments
16
Loss Reduction with CuMn interfilamentary matrix
Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix
17
Tested Wires
140 094 092 115 110 123
2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn
Ratio JcmJt
double stacked
single stacked
single stacked
double stacked
doublestacked
tripleextrudeddouble stackedWire ID
18
Single stacked wire
19
Filament Distortion Effects
Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires
20
Other Interfilamentary Matrix Materials
bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands
21
Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
Case No
Interfil
Matrix mat
Barrier
Mat
Filament
Diam df
(m)
(msec)
et
-10
m)
Notes
1 Cu none 35 278 143 RRRCu =278
RRRCuint=25
2 Cu-05wtMn
none 25 134 297 CuMn=250
3 Cu-
05wtMnnone 25 107 372 RRRCu=220
(this case only)
4 Cu-
05wtMn
Cu-
10wtNi25 048 837 CuNi
=1400
5 Cu-10wtNi
Cu-10wtNi
25 044 900
6 Cu-10wtNi
none 25 1309 304
7 Cu-30wtNi
none 25 1304 305 cuNi =
3640
22
CuMn versus CuNi Interfilamentary matrix
bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn
bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss
bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss
bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases
23
Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
24
Switch wire performance conclusions
Short samples instabilitiesbull Inception of instabilities at low field
depending on wire diameter dbull Self field instabilitybull Virtually independent of
Filament size
CuNi composition (between CuNi 30 and CuNi10)
Stability limit Jc bulld ~ 2000 Amm
25
Low Loss Wire Conclusion
bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss
bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length
26
Present Wire Status
bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2
bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of
wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire
bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order
27
Problem
bull We need to order more wire to build SIS 300 model or prototype dipoles
bull Lead time between wire RFQ and wire receipt is 9-12 months
Solutionbull Make two 200 kg billets First one with 25
micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters
28
Cable Ra amp Rc
bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)
bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC
amp 15-70 MPa (BNL tests) Need more statistics
9
Higher resistance wire matrixbull Cold working the copper in the wire during itlsquos
production can provide a higher resistivity wire matrix but cable heat treatment due to coil curing or heat treatment to increase Ra will reduce this resistivity again
bull High resistivity barriers (such as CuNi) around filaments or filament regions increase the effective or transverse resistivity of the wire
bull A Cu05-06 Mn interfilamentary matrix also increases the transverse resistivity and is unaffected by cable curing or heat treatment
10
Small filament wire
bull Below about 35 micrometer filament size proximity coupling again increases filament hysteresis loss in an all-copper matrix wire ( keeping sd constsnt) s~filament spacing d~fil dia
bull Use of a CuMn interfilamentary matrix eliminates proximity coupling effects for filament sizes down to around 1 micrometer
11
SIS 300 Dipole Wire Parameters(with Cu matrix wire)
bull Strand diameter 0825 mmbull Filament diameter 35 micrometers bull Filament twist pitch 5 mm bull MatrixNbTi ratio 14 (15)bull Strand transverse resistivity et (4 + 09 B)10-10 Ohm m (goal)bull Strand transverse resistivity et (14 +09B)10-10 Ohm m (calculated with all-copper matrix 15 CuSC ratio) Present EAS wire with 43 micrometer filaments 175 CuSC ratio
has measured et =(058+09B)10-10 Ohm-mbull Wirebull Strand coating Sn Ag (Stabrite)bull Critical current density Jc 2700 Amm2 ( 5 T 42 K) bull Critical current density Jc 2130 Amm2 ( 6T 42 K)
12
SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
bull Global matrix ratio 17bull Filament number22686bull Filament diameter 263 μmbull Wire twist pitch 125 mmbull Transverse resistivity ρet = (415 + 19B)bull10-10 Ωm ( For RHIC wire ρet = (124 + 09B)bull10-10 Ωm)bull Wire diameter 0651 mmbull Jc =2760 Amm2 ( 5 T 42 K) ( best value achieved)
Made for possible use in the SSC High Energy Booster (HEB) using a double stacking production method and tested for GSI at Twente TU
13
Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
IGC fabricated a 309 mm billet into wire of 26 micron filament diameter with a Cu-06Mn interfilamentary matrix using a patented single stack approach also for SSC use
Further parameters areFilament number 38663Matrix to NbTi ratio 15Wire diameter 0808 mm
Jc = 2753 Asqmm at 5T 42 K ( best value achieved)Such a conductor requires scaling up by a factor of 102 in
diameter for application in the SIS 300 dipole
Calculated value for transverse resistivity ρet =34bull10-10 ΩmCoupling current time constant =117 msec for 5 mm fil twist
pitch
14
SIS 300 dipole Losscycle-m with Cu matrix
rampg mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crosr 036 32 40
transvse adjnt 121 107 132
parallel adjacent 001 01 01
filnt coupling 236 208 257
hysteresis 512 450 557
delta hysteresis 012 10 13
total hysteresis 524 461 570
total magnet 930 808 1000
Rc=20 mΩSS core in cableRa=200 μΩ5 mm fil Twist pitch35 μm filaments
15
SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix
rampg mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crosr 036 32 57
transvse adjnt 121 107 190
parallel adjacent 001 01 02
filnt coupling 105 93 165
hysteresis 366 322 573
delta hysteresis 008 07 13
total hysteresis 374 329 586
total magnet 638 562 1000
Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments
16
Loss Reduction with CuMn interfilamentary matrix
Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix
17
Tested Wires
140 094 092 115 110 123
2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn
Ratio JcmJt
double stacked
single stacked
single stacked
double stacked
doublestacked
tripleextrudeddouble stackedWire ID
18
Single stacked wire
19
Filament Distortion Effects
Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires
20
Other Interfilamentary Matrix Materials
bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands
21
Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
Case No
Interfil
Matrix mat
Barrier
Mat
Filament
Diam df
(m)
(msec)
et
-10
m)
Notes
1 Cu none 35 278 143 RRRCu =278
RRRCuint=25
2 Cu-05wtMn
none 25 134 297 CuMn=250
3 Cu-
05wtMnnone 25 107 372 RRRCu=220
(this case only)
4 Cu-
05wtMn
Cu-
10wtNi25 048 837 CuNi
=1400
5 Cu-10wtNi
Cu-10wtNi
25 044 900
6 Cu-10wtNi
none 25 1309 304
7 Cu-30wtNi
none 25 1304 305 cuNi =
3640
22
CuMn versus CuNi Interfilamentary matrix
bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn
bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss
bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss
bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases
23
Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
24
Switch wire performance conclusions
Short samples instabilitiesbull Inception of instabilities at low field
depending on wire diameter dbull Self field instabilitybull Virtually independent of
Filament size
CuNi composition (between CuNi 30 and CuNi10)
Stability limit Jc bulld ~ 2000 Amm
25
Low Loss Wire Conclusion
bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss
bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length
26
Present Wire Status
bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2
bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of
wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire
bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order
27
Problem
bull We need to order more wire to build SIS 300 model or prototype dipoles
bull Lead time between wire RFQ and wire receipt is 9-12 months
Solutionbull Make two 200 kg billets First one with 25
micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters
28
Cable Ra amp Rc
bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)
bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC
amp 15-70 MPa (BNL tests) Need more statistics
10
Small filament wire
bull Below about 35 micrometer filament size proximity coupling again increases filament hysteresis loss in an all-copper matrix wire ( keeping sd constsnt) s~filament spacing d~fil dia
bull Use of a CuMn interfilamentary matrix eliminates proximity coupling effects for filament sizes down to around 1 micrometer
11
SIS 300 Dipole Wire Parameters(with Cu matrix wire)
bull Strand diameter 0825 mmbull Filament diameter 35 micrometers bull Filament twist pitch 5 mm bull MatrixNbTi ratio 14 (15)bull Strand transverse resistivity et (4 + 09 B)10-10 Ohm m (goal)bull Strand transverse resistivity et (14 +09B)10-10 Ohm m (calculated with all-copper matrix 15 CuSC ratio) Present EAS wire with 43 micrometer filaments 175 CuSC ratio
has measured et =(058+09B)10-10 Ohm-mbull Wirebull Strand coating Sn Ag (Stabrite)bull Critical current density Jc 2700 Amm2 ( 5 T 42 K) bull Critical current density Jc 2130 Amm2 ( 6T 42 K)
12
SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
bull Global matrix ratio 17bull Filament number22686bull Filament diameter 263 μmbull Wire twist pitch 125 mmbull Transverse resistivity ρet = (415 + 19B)bull10-10 Ωm ( For RHIC wire ρet = (124 + 09B)bull10-10 Ωm)bull Wire diameter 0651 mmbull Jc =2760 Amm2 ( 5 T 42 K) ( best value achieved)
Made for possible use in the SSC High Energy Booster (HEB) using a double stacking production method and tested for GSI at Twente TU
13
Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
IGC fabricated a 309 mm billet into wire of 26 micron filament diameter with a Cu-06Mn interfilamentary matrix using a patented single stack approach also for SSC use
Further parameters areFilament number 38663Matrix to NbTi ratio 15Wire diameter 0808 mm
Jc = 2753 Asqmm at 5T 42 K ( best value achieved)Such a conductor requires scaling up by a factor of 102 in
diameter for application in the SIS 300 dipole
Calculated value for transverse resistivity ρet =34bull10-10 ΩmCoupling current time constant =117 msec for 5 mm fil twist
pitch
14
SIS 300 dipole Losscycle-m with Cu matrix
rampg mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crosr 036 32 40
transvse adjnt 121 107 132
parallel adjacent 001 01 01
filnt coupling 236 208 257
hysteresis 512 450 557
delta hysteresis 012 10 13
total hysteresis 524 461 570
total magnet 930 808 1000
Rc=20 mΩSS core in cableRa=200 μΩ5 mm fil Twist pitch35 μm filaments
15
SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix
rampg mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crosr 036 32 57
transvse adjnt 121 107 190
parallel adjacent 001 01 02
filnt coupling 105 93 165
hysteresis 366 322 573
delta hysteresis 008 07 13
total hysteresis 374 329 586
total magnet 638 562 1000
Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments
16
Loss Reduction with CuMn interfilamentary matrix
Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix
17
Tested Wires
140 094 092 115 110 123
2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn
Ratio JcmJt
double stacked
single stacked
single stacked
double stacked
doublestacked
tripleextrudeddouble stackedWire ID
18
Single stacked wire
19
Filament Distortion Effects
Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires
20
Other Interfilamentary Matrix Materials
bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands
21
Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
Case No
Interfil
Matrix mat
Barrier
Mat
Filament
Diam df
(m)
(msec)
et
-10
m)
Notes
1 Cu none 35 278 143 RRRCu =278
RRRCuint=25
2 Cu-05wtMn
none 25 134 297 CuMn=250
3 Cu-
05wtMnnone 25 107 372 RRRCu=220
(this case only)
4 Cu-
05wtMn
Cu-
10wtNi25 048 837 CuNi
=1400
5 Cu-10wtNi
Cu-10wtNi
25 044 900
6 Cu-10wtNi
none 25 1309 304
7 Cu-30wtNi
none 25 1304 305 cuNi =
3640
22
CuMn versus CuNi Interfilamentary matrix
bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn
bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss
bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss
bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases
23
Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
24
Switch wire performance conclusions
Short samples instabilitiesbull Inception of instabilities at low field
depending on wire diameter dbull Self field instabilitybull Virtually independent of
Filament size
CuNi composition (between CuNi 30 and CuNi10)
Stability limit Jc bulld ~ 2000 Amm
25
Low Loss Wire Conclusion
bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss
bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length
26
Present Wire Status
bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2
bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of
wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire
bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order
27
Problem
bull We need to order more wire to build SIS 300 model or prototype dipoles
bull Lead time between wire RFQ and wire receipt is 9-12 months
Solutionbull Make two 200 kg billets First one with 25
micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters
28
Cable Ra amp Rc
bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)
bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC
amp 15-70 MPa (BNL tests) Need more statistics
11
SIS 300 Dipole Wire Parameters(with Cu matrix wire)
bull Strand diameter 0825 mmbull Filament diameter 35 micrometers bull Filament twist pitch 5 mm bull MatrixNbTi ratio 14 (15)bull Strand transverse resistivity et (4 + 09 B)10-10 Ohm m (goal)bull Strand transverse resistivity et (14 +09B)10-10 Ohm m (calculated with all-copper matrix 15 CuSC ratio) Present EAS wire with 43 micrometer filaments 175 CuSC ratio
has measured et =(058+09B)10-10 Ohm-mbull Wirebull Strand coating Sn Ag (Stabrite)bull Critical current density Jc 2700 Amm2 ( 5 T 42 K) bull Critical current density Jc 2130 Amm2 ( 6T 42 K)
12
SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
bull Global matrix ratio 17bull Filament number22686bull Filament diameter 263 μmbull Wire twist pitch 125 mmbull Transverse resistivity ρet = (415 + 19B)bull10-10 Ωm ( For RHIC wire ρet = (124 + 09B)bull10-10 Ωm)bull Wire diameter 0651 mmbull Jc =2760 Amm2 ( 5 T 42 K) ( best value achieved)
Made for possible use in the SSC High Energy Booster (HEB) using a double stacking production method and tested for GSI at Twente TU
13
Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
IGC fabricated a 309 mm billet into wire of 26 micron filament diameter with a Cu-06Mn interfilamentary matrix using a patented single stack approach also for SSC use
Further parameters areFilament number 38663Matrix to NbTi ratio 15Wire diameter 0808 mm
Jc = 2753 Asqmm at 5T 42 K ( best value achieved)Such a conductor requires scaling up by a factor of 102 in
diameter for application in the SIS 300 dipole
Calculated value for transverse resistivity ρet =34bull10-10 ΩmCoupling current time constant =117 msec for 5 mm fil twist
pitch
14
SIS 300 dipole Losscycle-m with Cu matrix
rampg mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crosr 036 32 40
transvse adjnt 121 107 132
parallel adjacent 001 01 01
filnt coupling 236 208 257
hysteresis 512 450 557
delta hysteresis 012 10 13
total hysteresis 524 461 570
total magnet 930 808 1000
Rc=20 mΩSS core in cableRa=200 μΩ5 mm fil Twist pitch35 μm filaments
15
SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix
rampg mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crosr 036 32 57
transvse adjnt 121 107 190
parallel adjacent 001 01 02
filnt coupling 105 93 165
hysteresis 366 322 573
delta hysteresis 008 07 13
total hysteresis 374 329 586
total magnet 638 562 1000
Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments
16
Loss Reduction with CuMn interfilamentary matrix
Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix
17
Tested Wires
140 094 092 115 110 123
2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn
Ratio JcmJt
double stacked
single stacked
single stacked
double stacked
doublestacked
tripleextrudeddouble stackedWire ID
18
Single stacked wire
19
Filament Distortion Effects
Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires
20
Other Interfilamentary Matrix Materials
bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands
21
Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
Case No
Interfil
Matrix mat
Barrier
Mat
Filament
Diam df
(m)
(msec)
et
-10
m)
Notes
1 Cu none 35 278 143 RRRCu =278
RRRCuint=25
2 Cu-05wtMn
none 25 134 297 CuMn=250
3 Cu-
05wtMnnone 25 107 372 RRRCu=220
(this case only)
4 Cu-
05wtMn
Cu-
10wtNi25 048 837 CuNi
=1400
5 Cu-10wtNi
Cu-10wtNi
25 044 900
6 Cu-10wtNi
none 25 1309 304
7 Cu-30wtNi
none 25 1304 305 cuNi =
3640
22
CuMn versus CuNi Interfilamentary matrix
bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn
bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss
bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss
bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases
23
Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
24
Switch wire performance conclusions
Short samples instabilitiesbull Inception of instabilities at low field
depending on wire diameter dbull Self field instabilitybull Virtually independent of
Filament size
CuNi composition (between CuNi 30 and CuNi10)
Stability limit Jc bulld ~ 2000 Amm
25
Low Loss Wire Conclusion
bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss
bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length
26
Present Wire Status
bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2
bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of
wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire
bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order
27
Problem
bull We need to order more wire to build SIS 300 model or prototype dipoles
bull Lead time between wire RFQ and wire receipt is 9-12 months
Solutionbull Make two 200 kg billets First one with 25
micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters
28
Cable Ra amp Rc
bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)
bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC
amp 15-70 MPa (BNL tests) Need more statistics
12
SSC Cu-06Mn Interfilamentary matrix 25 micron filament wire
bull Global matrix ratio 17bull Filament number22686bull Filament diameter 263 μmbull Wire twist pitch 125 mmbull Transverse resistivity ρet = (415 + 19B)bull10-10 Ωm ( For RHIC wire ρet = (124 + 09B)bull10-10 Ωm)bull Wire diameter 0651 mmbull Jc =2760 Amm2 ( 5 T 42 K) ( best value achieved)
Made for possible use in the SSC High Energy Booster (HEB) using a double stacking production method and tested for GSI at Twente TU
13
Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
IGC fabricated a 309 mm billet into wire of 26 micron filament diameter with a Cu-06Mn interfilamentary matrix using a patented single stack approach also for SSC use
Further parameters areFilament number 38663Matrix to NbTi ratio 15Wire diameter 0808 mm
Jc = 2753 Asqmm at 5T 42 K ( best value achieved)Such a conductor requires scaling up by a factor of 102 in
diameter for application in the SIS 300 dipole
Calculated value for transverse resistivity ρet =34bull10-10 ΩmCoupling current time constant =117 msec for 5 mm fil twist
pitch
14
SIS 300 dipole Losscycle-m with Cu matrix
rampg mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crosr 036 32 40
transvse adjnt 121 107 132
parallel adjacent 001 01 01
filnt coupling 236 208 257
hysteresis 512 450 557
delta hysteresis 012 10 13
total hysteresis 524 461 570
total magnet 930 808 1000
Rc=20 mΩSS core in cableRa=200 μΩ5 mm fil Twist pitch35 μm filaments
15
SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix
rampg mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crosr 036 32 57
transvse adjnt 121 107 190
parallel adjacent 001 01 02
filnt coupling 105 93 165
hysteresis 366 322 573
delta hysteresis 008 07 13
total hysteresis 374 329 586
total magnet 638 562 1000
Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments
16
Loss Reduction with CuMn interfilamentary matrix
Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix
17
Tested Wires
140 094 092 115 110 123
2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn
Ratio JcmJt
double stacked
single stacked
single stacked
double stacked
doublestacked
tripleextrudeddouble stackedWire ID
18
Single stacked wire
19
Filament Distortion Effects
Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires
20
Other Interfilamentary Matrix Materials
bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands
21
Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
Case No
Interfil
Matrix mat
Barrier
Mat
Filament
Diam df
(m)
(msec)
et
-10
m)
Notes
1 Cu none 35 278 143 RRRCu =278
RRRCuint=25
2 Cu-05wtMn
none 25 134 297 CuMn=250
3 Cu-
05wtMnnone 25 107 372 RRRCu=220
(this case only)
4 Cu-
05wtMn
Cu-
10wtNi25 048 837 CuNi
=1400
5 Cu-10wtNi
Cu-10wtNi
25 044 900
6 Cu-10wtNi
none 25 1309 304
7 Cu-30wtNi
none 25 1304 305 cuNi =
3640
22
CuMn versus CuNi Interfilamentary matrix
bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn
bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss
bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss
bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases
23
Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
24
Switch wire performance conclusions
Short samples instabilitiesbull Inception of instabilities at low field
depending on wire diameter dbull Self field instabilitybull Virtually independent of
Filament size
CuNi composition (between CuNi 30 and CuNi10)
Stability limit Jc bulld ~ 2000 Amm
25
Low Loss Wire Conclusion
bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss
bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length
26
Present Wire Status
bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2
bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of
wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire
bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order
27
Problem
bull We need to order more wire to build SIS 300 model or prototype dipoles
bull Lead time between wire RFQ and wire receipt is 9-12 months
Solutionbull Make two 200 kg billets First one with 25
micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters
28
Cable Ra amp Rc
bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)
bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC
amp 15-70 MPa (BNL tests) Need more statistics
13
Another Possible CuMn Interfilamentary Matrix Wire for SIS 300
IGC fabricated a 309 mm billet into wire of 26 micron filament diameter with a Cu-06Mn interfilamentary matrix using a patented single stack approach also for SSC use
Further parameters areFilament number 38663Matrix to NbTi ratio 15Wire diameter 0808 mm
Jc = 2753 Asqmm at 5T 42 K ( best value achieved)Such a conductor requires scaling up by a factor of 102 in
diameter for application in the SIS 300 dipole
Calculated value for transverse resistivity ρet =34bull10-10 ΩmCoupling current time constant =117 msec for 5 mm fil twist
pitch
14
SIS 300 dipole Losscycle-m with Cu matrix
rampg mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crosr 036 32 40
transvse adjnt 121 107 132
parallel adjacent 001 01 01
filnt coupling 236 208 257
hysteresis 512 450 557
delta hysteresis 012 10 13
total hysteresis 524 461 570
total magnet 930 808 1000
Rc=20 mΩSS core in cableRa=200 μΩ5 mm fil Twist pitch35 μm filaments
15
SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix
rampg mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crosr 036 32 57
transvse adjnt 121 107 190
parallel adjacent 001 01 02
filnt coupling 105 93 165
hysteresis 366 322 573
delta hysteresis 008 07 13
total hysteresis 374 329 586
total magnet 638 562 1000
Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments
16
Loss Reduction with CuMn interfilamentary matrix
Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix
17
Tested Wires
140 094 092 115 110 123
2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn
Ratio JcmJt
double stacked
single stacked
single stacked
double stacked
doublestacked
tripleextrudeddouble stackedWire ID
18
Single stacked wire
19
Filament Distortion Effects
Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires
20
Other Interfilamentary Matrix Materials
bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands
21
Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
Case No
Interfil
Matrix mat
Barrier
Mat
Filament
Diam df
(m)
(msec)
et
-10
m)
Notes
1 Cu none 35 278 143 RRRCu =278
RRRCuint=25
2 Cu-05wtMn
none 25 134 297 CuMn=250
3 Cu-
05wtMnnone 25 107 372 RRRCu=220
(this case only)
4 Cu-
05wtMn
Cu-
10wtNi25 048 837 CuNi
=1400
5 Cu-10wtNi
Cu-10wtNi
25 044 900
6 Cu-10wtNi
none 25 1309 304
7 Cu-30wtNi
none 25 1304 305 cuNi =
3640
22
CuMn versus CuNi Interfilamentary matrix
bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn
bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss
bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss
bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases
23
Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
24
Switch wire performance conclusions
Short samples instabilitiesbull Inception of instabilities at low field
depending on wire diameter dbull Self field instabilitybull Virtually independent of
Filament size
CuNi composition (between CuNi 30 and CuNi10)
Stability limit Jc bulld ~ 2000 Amm
25
Low Loss Wire Conclusion
bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss
bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length
26
Present Wire Status
bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2
bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of
wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire
bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order
27
Problem
bull We need to order more wire to build SIS 300 model or prototype dipoles
bull Lead time between wire RFQ and wire receipt is 9-12 months
Solutionbull Make two 200 kg billets First one with 25
micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters
28
Cable Ra amp Rc
bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)
bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC
amp 15-70 MPa (BNL tests) Need more statistics
14
SIS 300 dipole Losscycle-m with Cu matrix
rampg mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crosr 036 32 40
transvse adjnt 121 107 132
parallel adjacent 001 01 01
filnt coupling 236 208 257
hysteresis 512 450 557
delta hysteresis 012 10 13
total hysteresis 524 461 570
total magnet 930 808 1000
Rc=20 mΩSS core in cableRa=200 μΩ5 mm fil Twist pitch35 μm filaments
15
SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix
rampg mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crosr 036 32 57
transvse adjnt 121 107 190
parallel adjacent 001 01 02
filnt coupling 105 93 165
hysteresis 366 322 573
delta hysteresis 008 07 13
total hysteresis 374 329 586
total magnet 638 562 1000
Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments
16
Loss Reduction with CuMn interfilamentary matrix
Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix
17
Tested Wires
140 094 092 115 110 123
2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn
Ratio JcmJt
double stacked
single stacked
single stacked
double stacked
doublestacked
tripleextrudeddouble stackedWire ID
18
Single stacked wire
19
Filament Distortion Effects
Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires
20
Other Interfilamentary Matrix Materials
bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands
21
Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
Case No
Interfil
Matrix mat
Barrier
Mat
Filament
Diam df
(m)
(msec)
et
-10
m)
Notes
1 Cu none 35 278 143 RRRCu =278
RRRCuint=25
2 Cu-05wtMn
none 25 134 297 CuMn=250
3 Cu-
05wtMnnone 25 107 372 RRRCu=220
(this case only)
4 Cu-
05wtMn
Cu-
10wtNi25 048 837 CuNi
=1400
5 Cu-10wtNi
Cu-10wtNi
25 044 900
6 Cu-10wtNi
none 25 1309 304
7 Cu-30wtNi
none 25 1304 305 cuNi =
3640
22
CuMn versus CuNi Interfilamentary matrix
bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn
bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss
bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss
bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases
23
Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
24
Switch wire performance conclusions
Short samples instabilitiesbull Inception of instabilities at low field
depending on wire diameter dbull Self field instabilitybull Virtually independent of
Filament size
CuNi composition (between CuNi 30 and CuNi10)
Stability limit Jc bulld ~ 2000 Amm
25
Low Loss Wire Conclusion
bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss
bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length
26
Present Wire Status
bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2
bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of
wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire
bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order
27
Problem
bull We need to order more wire to build SIS 300 model or prototype dipoles
bull Lead time between wire RFQ and wire receipt is 9-12 months
Solutionbull Make two 200 kg billets First one with 25
micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters
28
Cable Ra amp Rc
bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)
bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC
amp 15-70 MPa (BNL tests) Need more statistics
15
SIS 300 Dipole Losscycle-mwith CuMn interfilamentary Matrix
rampg mean loss fraction
power power cycle of total
Watts Watts Joules
transvse crosr 036 32 57
transvse adjnt 121 107 190
parallel adjacent 001 01 02
filnt coupling 105 93 165
hysteresis 366 322 573
delta hysteresis 008 07 13
total hysteresis 374 329 586
total magnet 638 562 1000
Rc=20 mΩ SS core in cableRa=200 μΩ5 mm fil Twist pitch25 μm filaments
16
Loss Reduction with CuMn interfilamentary matrix
Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix
17
Tested Wires
140 094 092 115 110 123
2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn
Ratio JcmJt
double stacked
single stacked
single stacked
double stacked
doublestacked
tripleextrudeddouble stackedWire ID
18
Single stacked wire
19
Filament Distortion Effects
Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires
20
Other Interfilamentary Matrix Materials
bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands
21
Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
Case No
Interfil
Matrix mat
Barrier
Mat
Filament
Diam df
(m)
(msec)
et
-10
m)
Notes
1 Cu none 35 278 143 RRRCu =278
RRRCuint=25
2 Cu-05wtMn
none 25 134 297 CuMn=250
3 Cu-
05wtMnnone 25 107 372 RRRCu=220
(this case only)
4 Cu-
05wtMn
Cu-
10wtNi25 048 837 CuNi
=1400
5 Cu-10wtNi
Cu-10wtNi
25 044 900
6 Cu-10wtNi
none 25 1309 304
7 Cu-30wtNi
none 25 1304 305 cuNi =
3640
22
CuMn versus CuNi Interfilamentary matrix
bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn
bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss
bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss
bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases
23
Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
24
Switch wire performance conclusions
Short samples instabilitiesbull Inception of instabilities at low field
depending on wire diameter dbull Self field instabilitybull Virtually independent of
Filament size
CuNi composition (between CuNi 30 and CuNi10)
Stability limit Jc bulld ~ 2000 Amm
25
Low Loss Wire Conclusion
bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss
bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length
26
Present Wire Status
bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2
bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of
wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire
bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order
27
Problem
bull We need to order more wire to build SIS 300 model or prototype dipoles
bull Lead time between wire RFQ and wire receipt is 9-12 months
Solutionbull Make two 200 kg billets First one with 25
micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters
28
Cable Ra amp Rc
bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)
bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC
amp 15-70 MPa (BNL tests) Need more statistics
16
Loss Reduction with CuMn interfilamentary matrix
Higher transverse resistivity and smaller filament size give 32 loss reduction over all-cu matrix
17
Tested Wires
140 094 092 115 110 123
2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn
Ratio JcmJt
double stacked
single stacked
single stacked
double stacked
doublestacked
tripleextrudeddouble stackedWire ID
18
Single stacked wire
19
Filament Distortion Effects
Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires
20
Other Interfilamentary Matrix Materials
bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands
21
Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
Case No
Interfil
Matrix mat
Barrier
Mat
Filament
Diam df
(m)
(msec)
et
-10
m)
Notes
1 Cu none 35 278 143 RRRCu =278
RRRCuint=25
2 Cu-05wtMn
none 25 134 297 CuMn=250
3 Cu-
05wtMnnone 25 107 372 RRRCu=220
(this case only)
4 Cu-
05wtMn
Cu-
10wtNi25 048 837 CuNi
=1400
5 Cu-10wtNi
Cu-10wtNi
25 044 900
6 Cu-10wtNi
none 25 1309 304
7 Cu-30wtNi
none 25 1304 305 cuNi =
3640
22
CuMn versus CuNi Interfilamentary matrix
bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn
bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss
bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss
bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases
23
Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
24
Switch wire performance conclusions
Short samples instabilitiesbull Inception of instabilities at low field
depending on wire diameter dbull Self field instabilitybull Virtually independent of
Filament size
CuNi composition (between CuNi 30 and CuNi10)
Stability limit Jc bulld ~ 2000 Amm
25
Low Loss Wire Conclusion
bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss
bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length
26
Present Wire Status
bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2
bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of
wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire
bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order
27
Problem
bull We need to order more wire to build SIS 300 model or prototype dipoles
bull Lead time between wire RFQ and wire receipt is 9-12 months
Solutionbull Make two 200 kg billets First one with 25
micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters
28
Cable Ra amp Rc
bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)
bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC
amp 15-70 MPa (BNL tests) Need more statistics
17
Tested Wires
140 094 092 115 110 123
2A12 3N7 RHIC K2 001T4 G2 001T6 SSC CuMn
Ratio JcmJt
double stacked
single stacked
single stacked
double stacked
doublestacked
tripleextrudeddouble stackedWire ID
18
Single stacked wire
19
Filament Distortion Effects
Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires
20
Other Interfilamentary Matrix Materials
bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands
21
Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
Case No
Interfil
Matrix mat
Barrier
Mat
Filament
Diam df
(m)
(msec)
et
-10
m)
Notes
1 Cu none 35 278 143 RRRCu =278
RRRCuint=25
2 Cu-05wtMn
none 25 134 297 CuMn=250
3 Cu-
05wtMnnone 25 107 372 RRRCu=220
(this case only)
4 Cu-
05wtMn
Cu-
10wtNi25 048 837 CuNi
=1400
5 Cu-10wtNi
Cu-10wtNi
25 044 900
6 Cu-10wtNi
none 25 1309 304
7 Cu-30wtNi
none 25 1304 305 cuNi =
3640
22
CuMn versus CuNi Interfilamentary matrix
bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn
bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss
bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss
bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases
23
Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
24
Switch wire performance conclusions
Short samples instabilitiesbull Inception of instabilities at low field
depending on wire diameter dbull Self field instabilitybull Virtually independent of
Filament size
CuNi composition (between CuNi 30 and CuNi10)
Stability limit Jc bulld ~ 2000 Amm
25
Low Loss Wire Conclusion
bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss
bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length
26
Present Wire Status
bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2
bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of
wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire
bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order
27
Problem
bull We need to order more wire to build SIS 300 model or prototype dipoles
bull Lead time between wire RFQ and wire receipt is 9-12 months
Solutionbull Make two 200 kg billets First one with 25
micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters
28
Cable Ra amp Rc
bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)
bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC
amp 15-70 MPa (BNL tests) Need more statistics
18
Single stacked wire
19
Filament Distortion Effects
Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires
20
Other Interfilamentary Matrix Materials
bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands
21
Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
Case No
Interfil
Matrix mat
Barrier
Mat
Filament
Diam df
(m)
(msec)
et
-10
m)
Notes
1 Cu none 35 278 143 RRRCu =278
RRRCuint=25
2 Cu-05wtMn
none 25 134 297 CuMn=250
3 Cu-
05wtMnnone 25 107 372 RRRCu=220
(this case only)
4 Cu-
05wtMn
Cu-
10wtNi25 048 837 CuNi
=1400
5 Cu-10wtNi
Cu-10wtNi
25 044 900
6 Cu-10wtNi
none 25 1309 304
7 Cu-30wtNi
none 25 1304 305 cuNi =
3640
22
CuMn versus CuNi Interfilamentary matrix
bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn
bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss
bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss
bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases
23
Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
24
Switch wire performance conclusions
Short samples instabilitiesbull Inception of instabilities at low field
depending on wire diameter dbull Self field instabilitybull Virtually independent of
Filament size
CuNi composition (between CuNi 30 and CuNi10)
Stability limit Jc bulld ~ 2000 Amm
25
Low Loss Wire Conclusion
bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss
bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length
26
Present Wire Status
bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2
bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of
wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire
bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order
27
Problem
bull We need to order more wire to build SIS 300 model or prototype dipoles
bull Lead time between wire RFQ and wire receipt is 9-12 months
Solutionbull Make two 200 kg billets First one with 25
micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters
28
Cable Ra amp Rc
bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)
bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC
amp 15-70 MPa (BNL tests) Need more statistics
19
Filament Distortion Effects
Wires made with a double stacking process show a greater filament distortion than wires made with a single stacking process as shown by the difference in magnetization amp transport current densities for the preceding wires
20
Other Interfilamentary Matrix Materials
bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands
21
Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
Case No
Interfil
Matrix mat
Barrier
Mat
Filament
Diam df
(m)
(msec)
et
-10
m)
Notes
1 Cu none 35 278 143 RRRCu =278
RRRCuint=25
2 Cu-05wtMn
none 25 134 297 CuMn=250
3 Cu-
05wtMnnone 25 107 372 RRRCu=220
(this case only)
4 Cu-
05wtMn
Cu-
10wtNi25 048 837 CuNi
=1400
5 Cu-10wtNi
Cu-10wtNi
25 044 900
6 Cu-10wtNi
none 25 1309 304
7 Cu-30wtNi
none 25 1304 305 cuNi =
3640
22
CuMn versus CuNi Interfilamentary matrix
bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn
bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss
bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss
bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases
23
Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
24
Switch wire performance conclusions
Short samples instabilitiesbull Inception of instabilities at low field
depending on wire diameter dbull Self field instabilitybull Virtually independent of
Filament size
CuNi composition (between CuNi 30 and CuNi10)
Stability limit Jc bulld ~ 2000 Amm
25
Low Loss Wire Conclusion
bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss
bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length
26
Present Wire Status
bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2
bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of
wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire
bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order
27
Problem
bull We need to order more wire to build SIS 300 model or prototype dipoles
bull Lead time between wire RFQ and wire receipt is 9-12 months
Solutionbull Make two 200 kg billets First one with 25
micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters
28
Cable Ra amp Rc
bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)
bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC
amp 15-70 MPa (BNL tests) Need more statistics
20
Other Interfilamentary Matrix Materials
bull Aside from Cu-05wt Mn Cu-10wtNi and Cu-30wtNi have been used to reduce eddy current losses in low loss strands
21
Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
Case No
Interfil
Matrix mat
Barrier
Mat
Filament
Diam df
(m)
(msec)
et
-10
m)
Notes
1 Cu none 35 278 143 RRRCu =278
RRRCuint=25
2 Cu-05wtMn
none 25 134 297 CuMn=250
3 Cu-
05wtMnnone 25 107 372 RRRCu=220
(this case only)
4 Cu-
05wtMn
Cu-
10wtNi25 048 837 CuNi
=1400
5 Cu-10wtNi
Cu-10wtNi
25 044 900
6 Cu-10wtNi
none 25 1309 304
7 Cu-30wtNi
none 25 1304 305 cuNi =
3640
22
CuMn versus CuNi Interfilamentary matrix
bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn
bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss
bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss
bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases
23
Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
24
Switch wire performance conclusions
Short samples instabilitiesbull Inception of instabilities at low field
depending on wire diameter dbull Self field instabilitybull Virtually independent of
Filament size
CuNi composition (between CuNi 30 and CuNi10)
Stability limit Jc bulld ~ 2000 Amm
25
Low Loss Wire Conclusion
bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss
bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length
26
Present Wire Status
bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2
bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of
wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire
bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order
27
Problem
bull We need to order more wire to build SIS 300 model or prototype dipoles
bull Lead time between wire RFQ and wire receipt is 9-12 months
Solutionbull Make two 200 kg billets First one with 25
micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters
28
Cable Ra amp Rc
bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)
bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC
amp 15-70 MPa (BNL tests) Need more statistics
21
Wire Coupling Current for SIS 300 Wire with Various Interfilamentary Matrices and Barriers
Case No
Interfil
Matrix mat
Barrier
Mat
Filament
Diam df
(m)
(msec)
et
-10
m)
Notes
1 Cu none 35 278 143 RRRCu =278
RRRCuint=25
2 Cu-05wtMn
none 25 134 297 CuMn=250
3 Cu-
05wtMnnone 25 107 372 RRRCu=220
(this case only)
4 Cu-
05wtMn
Cu-
10wtNi25 048 837 CuNi
=1400
5 Cu-10wtNi
Cu-10wtNi
25 044 900
6 Cu-10wtNi
none 25 1309 304
7 Cu-30wtNi
none 25 1304 305 cuNi =
3640
22
CuMn versus CuNi Interfilamentary matrix
bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn
bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss
bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss
bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases
23
Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
24
Switch wire performance conclusions
Short samples instabilitiesbull Inception of instabilities at low field
depending on wire diameter dbull Self field instabilitybull Virtually independent of
Filament size
CuNi composition (between CuNi 30 and CuNi10)
Stability limit Jc bulld ~ 2000 Amm
25
Low Loss Wire Conclusion
bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss
bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length
26
Present Wire Status
bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2
bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of
wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire
bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order
27
Problem
bull We need to order more wire to build SIS 300 model or prototype dipoles
bull Lead time between wire RFQ and wire receipt is 9-12 months
Solutionbull Make two 200 kg billets First one with 25
micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters
28
Cable Ra amp Rc
bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)
bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC
amp 15-70 MPa (BNL tests) Need more statistics
22
CuMn versus CuNi Interfilamentary matrix
bull Cu-10wtNi is about 6 times more resistive than Cu-05wtMn
bull For stability reasons avoid making matrix more resistive than needed to reduce AC loss
bull Cu-05Mn is as effective as Cu-10wtNi in reducing strand eddy current loss
bull CuNi contains 015-10 Mn so the ldquo active ingredientldquo for proximity effect suppression appears to be Mn is both cases
23
Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
24
Switch wire performance conclusions
Short samples instabilitiesbull Inception of instabilities at low field
depending on wire diameter dbull Self field instabilitybull Virtually independent of
Filament size
CuNi composition (between CuNi 30 and CuNi10)
Stability limit Jc bulld ~ 2000 Amm
25
Low Loss Wire Conclusion
bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss
bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length
26
Present Wire Status
bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2
bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of
wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire
bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order
27
Problem
bull We need to order more wire to build SIS 300 model or prototype dipoles
bull Lead time between wire RFQ and wire receipt is 9-12 months
Solutionbull Make two 200 kg billets First one with 25
micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters
28
Cable Ra amp Rc
bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)
bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC
amp 15-70 MPa (BNL tests) Need more statistics
23
Jc (Amm2 vs B (T) for pure CuNi matrix switch wire
24
Switch wire performance conclusions
Short samples instabilitiesbull Inception of instabilities at low field
depending on wire diameter dbull Self field instabilitybull Virtually independent of
Filament size
CuNi composition (between CuNi 30 and CuNi10)
Stability limit Jc bulld ~ 2000 Amm
25
Low Loss Wire Conclusion
bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss
bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length
26
Present Wire Status
bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2
bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of
wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire
bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order
27
Problem
bull We need to order more wire to build SIS 300 model or prototype dipoles
bull Lead time between wire RFQ and wire receipt is 9-12 months
Solutionbull Make two 200 kg billets First one with 25
micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters
28
Cable Ra amp Rc
bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)
bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC
amp 15-70 MPa (BNL tests) Need more statistics
24
Switch wire performance conclusions
Short samples instabilitiesbull Inception of instabilities at low field
depending on wire diameter dbull Self field instabilitybull Virtually independent of
Filament size
CuNi composition (between CuNi 30 and CuNi10)
Stability limit Jc bulld ~ 2000 Amm
25
Low Loss Wire Conclusion
bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss
bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length
26
Present Wire Status
bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2
bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of
wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire
bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order
27
Problem
bull We need to order more wire to build SIS 300 model or prototype dipoles
bull Lead time between wire RFQ and wire receipt is 9-12 months
Solutionbull Make two 200 kg billets First one with 25
micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters
28
Cable Ra amp Rc
bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)
bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC
amp 15-70 MPa (BNL tests) Need more statistics
25
Low Loss Wire Conclusion
bull A Cu-05-06Mn interfilamentary matrix wire with fine ( 25 μm or less) filaments made by a double stacking process ( assembly easier amp better stability) appears to give a wire with the lowest loss
bull Jc above 3200 Amm2 has been achieved for commercially available CuMn interfilamentary matrix wires with 53 micron filaments and Jc above 2700 Amm2 has been achieved for 25 micron filament conductor but RampD is probably required to optimize Jc amp piece length
26
Present Wire Status
bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2
bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of
wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire
bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order
27
Problem
bull We need to order more wire to build SIS 300 model or prototype dipoles
bull Lead time between wire RFQ and wire receipt is 9-12 months
Solutionbull Make two 200 kg billets First one with 25
micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters
28
Cable Ra amp Rc
bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)
bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC
amp 15-70 MPa (BNL tests) Need more statistics
26
Present Wire Status
bull EAS has produced 846 kg of 0825 mm dia wire with 12318 filaments of 43 μm diameter Cusc ratio of 175 and Jc ( 5 T 42 K) in the range 2711-2752 Amm2
bull The wire has been sent to Alstom for cablingbull A 1m long model magnet would require at least 55 kg of
wire (341 m of cable) A 2908 m ( eff length) prototype magnet would require 160 kg of wire
bull Alstom can provide 300 m of cable ( 0825mm dia Wire) with19200 35 μm filaments ( single stacked) Cusc ratio of 19 3-4 months after order
27
Problem
bull We need to order more wire to build SIS 300 model or prototype dipoles
bull Lead time between wire RFQ and wire receipt is 9-12 months
Solutionbull Make two 200 kg billets First one with 25
micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters
28
Cable Ra amp Rc
bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)
bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC
amp 15-70 MPa (BNL tests) Need more statistics
27
Problem
bull We need to order more wire to build SIS 300 model or prototype dipoles
bull Lead time between wire RFQ and wire receipt is 9-12 months
Solutionbull Make two 200 kg billets First one with 25
micron filament wire During fabrication of this wire determine possible Jc degradation with further filament decrease and determine minimum filament twist pitch before Jc decreases Make second billet with optimum parameters
28
Cable Ra amp Rc
bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)
bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC
amp 15-70 MPa (BNL tests) Need more statistics
28
Cable Ra amp Rc
bull Rcgt 100 mΩ for cables heat treated at 200C for 4 hours ( IHEP tests on cored LHC outer layer cable)
bull Ra ~ 200-300 μΩ for 8 hour bare cable heat treatment at 200 oC amp 30 minute cure cycle of polyimide tape insulated samples at 195 oC
amp 15-70 MPa (BNL tests) Need more statistics