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Components for Aerospace
and Defense Presented by
Dr. Bob Froelich of
Besser Associates, Inc.
www.BesserAssociates.com
Sponsored by: National Instruments (formerly AWR Corp.)
online at www.ni.com/awr
ni.com/awr
AWR Is Now NI
NI AWR Design Environment
Product Line Overview Presentation
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NI AWR Design Environment - At a Glance
Software Product Portfolio
Microwave Office - MMIC, RF PCB and module circuit design
Visual System Simulator - Wireless communications/radar systems design
AXIEM - 3D planar electromagnetic (EM) analysis
Analyst - 3D finite element method (FEM) EM analysis
Analog Office - Analog/RFIC circuit design
Global Presence (sales & support office locations)
California, Wisconsin, Colorado
United Kingdom, Finland, France and Germany
Japan, Korea, Taiwan, China and Australia
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Microwave Office -
RF and Microwave Design
Application Areas:
MMICs (III-V compound semiconductors)
RF PCBs and modules
Product Strengths:
Electrical/physical concurrent design
RF-aware layout
Tuning, optimization, yield analysis
Circuit design thru to EM analysis
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Learn More
Online
ni.com/awr
awr.tv
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Components for Aerospace
and Defense
Presented by
Dr. Bob Froelich of
Besser Associates, Inc.
www.BesserAssociates.com
www.BesserAssociates.com
Outline
Market Comparison
Standards
Material and Process Limitations in Defense
Microwave Applications in Defense
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Defense and Space vs Commercial
The Commercial environment: Anything goes within legal limits on safety, use of IP, etc. The market place picks the winning product.
Defense: A raft of preconditions Reliability and lifetime in harsh environments Maintainability and compatibility with other equipment Training requirements Use of strategic materials Business is won in advance of full production.
Space: Reliability is paramount Material and process characteristics strictly enforced. High MTBF and avoidance of stress limits. Business is won by prototypes and proposals.
Most real world situations fall on a continuum among these.
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Standards
In an enormous number of areas, its better not to reinvent the wheel with every new design. Examples are
Compositions of materials, e.g. metal alloys Part sizes for screws, drills, wire, etc. Documentation practices Human safety Definitions of operating and storage environments (temperature, humidity, etc.) Purchasing and manufacturing processes Units and measurements (Ohms, Volts, cm, return loss, degrees, gallons,
hardness, transparency, smoothness, r, , etc, etc)
Reference to predetermined standards saves tremendous time and labor. There are thousands of documents describing standards of all kinds. Organizations that issue and maintain standards documents include
Government Military Space agencies Industry groups (EIA, ISO, IPC, JEDEC) Professional organizations (ASME, ASTM, IEEE, ASCE)
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Types of US Defense Standards
MIL-HBK: Handbook containing guidance and information on materials, design and processes in a given area.
MIL-SPEC: Specification of technical requirements for purchased material or products.
MIL-STD: Standard for processes and procedures.
MIL-PRF: Performance specification that states required results without dictating the methods to achieve them.
MIL-DTL: Detail specification on how a requirement is to be achieved.
Copies of many standards are available from http://www.everyspec.com
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Some Standards that Apply to
Microwave Electronics for Defense
IPC/EIA J-STD-001: Standard requirements for soldering.
MIL-PRF-19500 : General specification for semiconductor devices.
MIL-PRF-38534: General specification for hybrid microcircuits.
MIL-STD-461: Control of EMI characteristics. MIL-STD-810: Environmental test methods. MIL-STD-883: Microelectronics test methods. MIL-HDBK-217: Reliability prediction of electronic
equipment.
MIL-HBK-454: Standard requirements for electronic equipment.
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Tin and Lead
In 2003 the EU adopted the Restriction of Hazardous Substances Directive (RoHS) Most notably, it forbids the use of lead. Most of the commercial electronics industry has converted to
Lead-free solders and lead-free plating on package leads. Often the plating is pure tin.
Problem: Tin-plated surfaces often grow whiskers, i.e. small metal wires, that result in short circuits or arcing. See picture gallery at
http://nepp.nasa.gov/WHISKER/photos/index.html
Most military and space programs forbid the use of pure tin plating. MIL-PRF1900 calls for 3% lead by mass, minimum, in tin-based plating.
This can greatly complicate procurement of parts!
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Plastic and Hermetic Packages
Plastic packages
Industry standard for most ICs
Not hermetic (work with LCP has been promising)
Reliability problems:
Moisture promotes chemical reactions.
Frost can do physical damage below freezing.
Steam can explode a package during solder reflow.
Hermetic packages
Ceramic or metal with chip and wire assembly inside.
Usually much more expensive.
Compromise: Conformal coating of PCBA
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Military Applications of Microwaves
Communication Data or voice
Real time or not real time
Long- or short-distance, covert or open
Radar Ground based, ship based, air based
Target ID, tracking, proximity, avoidance, mapping
ECM Signal intercept and identification
Disruption
Applications range from very specific and narrow bandwidth to very general and very wide bandwidth.
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RADAR
Objects detected by reflecting EM energy back to the source.
Easy for the target to detect!
General requirements High power
Highly directional antenna
Sensitive receiver with high dynamic range
Microwave bandwidth usually narrow or moderate.
Signal processing to extract info on range, velocity, identity, etc.
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Radar Components
Antennas Mechanically Scanned Phased array (electronically scanned)
Example: AEGIS system
Multiple pattern Example: Airborne slot array
http://www.rantecantennas.com/antennas
Transmitters Pulsed (fixed frequency or modulated) Continuous (CW or FM) Very high power (~106 W) in some systems.
Receivers High sensitivity High dynamic range Survival at high input power levels
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Radar System Example
Transmitter
Sum
Receiver
Elevation
Receiver
Azimuth
Receiver
High Power
Circulator
Limiter
Limiter
Limiter
Array
Antenna
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ECM Receivers
Detect and identify incident energy.
Very low emissions to stay hidden.
Wide microwave tuning range, e.g. 0.5 to 18 GHz.
Wide instantaneous bandwidth, e.g. 1GHz
High dynamic range so that
Weak signals are not drowned out by noise and interference.
Strong signals do not generate false responses.
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Receiver Components
Filters Pre-selector filters reject interfering signals. Channel filter sets instantaneous bandwidth. Group delay, bandwidth and out-of-band rejection can all be important.
Amplifiers Various combinations of low noise figure, high bandwidth, and high
linearity.
Mixers High linearity High isolation
Local oscillator/synthesizer Fast tuning Accuracy Low phase noise
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ECM Receiver Example
Multi -
Throw
Switch
Pre-selector, band 1
Pre-selector, band N
Multi -
Throw
Switch
..
...
Channel
Filter
LO
Synthesizer
Ant
Broad Band
LNA
Single-Band
LNAs
IF Amplifier
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Thank you for Attending ! For more information on this subject and more,
please consider enrolling in:
RF Design: Applied Techniques
September 14 to 18, 2015, San Jose, CA
Contact us at [email protected] for details.
Please visit www.BesserAssociates.com for a complete course listing.
Sponsored by: National Instruments (formerly AWR Corp.)
online at www.ni.com/awr