smartmux description EN - TTC HOLDING, a.s.

sm@rtMUX

Product Description

TTC TELEKOMUNIKACE, s.r.o

TTC MARCONI s.r.o. Třebohostická 5, 100 00 Praha 10

sm@rtMUX

Compact Transmission System

Product Description

TTC TELEKOMUNIKACE, s.r.o Třebohostická 5, 100 00 Praha 10 431S289.951.14.N00 Date 22/9/2004 Phone: +420 234 052 111 Fax: +420 234 052 991 Email: [email protected]

sm@rtMUX - Product Description

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Contents

1 Introduction ................................................................................................................................................4 2 sm@rtMUX - System Description..............................................................................................................5

2.1 The sm@rtMUX Kit - Basic Module ..................................................................................................5 2.2 Submodules - Types and Locations..................................................................................................6 2.3 sm@rtMUX System Configuration Possibilities - Multiplex...............................................................7 2.4 Software Options...............................................................................................................................8 2.5 Application Examples........................................................................................................................8

3 Technical Specifications of the sm@rtMUX Device ................................................................................10 3.1 The RM1 Interface ..........................................................................................................................10 3.2 The RM2 Interface ..........................................................................................................................10 3.3 The RM3 Interface ..........................................................................................................................11 3.4 The OLR2 Interface.........................................................................................................................11 3.5 The OLR3 Interface.........................................................................................................................12 3.6 The SHDSL Interface ......................................................................................................................12 3.7 The V/X Data Interface....................................................................................................................13 3.8 The 10/100BaseT Interface.............................................................................................................13 3.9 The Local Control Interface.............................................................................................................13 3.10 The EOC Data Channel ..................................................................................................................14 3.11 Power Supply ..................................................................................................................................14 3.12 Reliability .........................................................................................................................................14 3.13 Environmental Conditions ...............................................................................................................14 3.14 Electromagnetic Compatibility.........................................................................................................15 3.15 Safety ..............................................................................................................................................15 3.16 Dimensions (h x w x d)....................................................................................................................15

4 Hardware Description ..............................................................................................................................16 4.1 The OS1 Submodule.......................................................................................................................18 4.2 The SHL1 Submodule.....................................................................................................................18 4.3 The SRV35 Submodule ..................................................................................................................19 4.4 The SB4E1 Submodule...................................................................................................................19 4.5 The SB1E3 Submodule...................................................................................................................20 4.6 The EB10T Submodule...................................................................................................................20

5 Electric Functions.....................................................................................................................................21 5.1 Motherboard....................................................................................................................................22 5.2 The OS1 Submodule.......................................................................................................................22 5.3 The SHL1 Submodule.....................................................................................................................22 5.4 The SB4E1 Submodule...................................................................................................................22 5.5 The SB1E2 Submodule...................................................................................................................23 5.6 The SB1E3 Submodule...................................................................................................................23 5.7 The EB10T Submodule...................................................................................................................23

6 Alarms and Signalling ..............................................................................................................................23 7 Management and Control ........................................................................................................................25

7.1 Basic Control Option - The Doris Control System, FT1.2 Protocol.................................................26 7.2 Optional Control - using the RS232/TC/IP Adaptor ........................................................................26 7.3 Connection of the Control Station using a Modem and the Switched Telephone Network ............27 7.4 Connecting the Control Station using the EB10T Module ..............................................................27

8 Ordering Information................................................................................................................................28


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1 Introduction

The sm@rtMUX system is a transmission device based on the PDH technology up to the 3rd order for

optical networks, also enabling E1 signal transmission over single-pair metallic lines using the SHDSL technology. Contributory signals may be in the E1 (G.703), E2 (G.703 or optical), Ethernet 10/100BaseT, or Nx64 kbit/s (V/X) format.

As far as application is concerned, the sm@rtMUX system is an E1 transmission system for access and transport networks. It adds to the TTC range of transmission technologies a device suitable for applications where an SDH solution would be too expensive, with transport capacity of 16 x E1 being suitable even for future expansion. With the 3rd order PDH capacity (16 x E1), the sm@rtMUX with a double optical transport in the stop dropping mode may be run for approximately half the cost of in comparison with the minimum possible SDH solution with a capacity of 32 x E1. Unlike classic transmission systems, the PDH enables sm@rtMUX to apply basic transmission protection principles used by the SDH - backup of multiplex section and backup of paths.

The sm@rtMUX system is intended for use on corporate linear network structures (for example motorways, railways). Together with the sm@rteX (TTC2000C) small communication system, it provides a solution capable of covering almost all requirements on transmission and processing of narrow and broadband services in the most economical package. Both systems may be applied separately (sm@rtMUX as a transmission system, sm@rteX as a communication system), or as one solution to solve comprehensive communication needs. sm@rtMUX may be used as a transmission device in linear networks, circular networks, and/or simpler polygonal networks with tie-lines. Functionally, sm@rtMUX may be used as a terminal or a stop dropping muldex of upper orders. It is a transmission system in which Contributory signals are transmitted in a transparent way, or are re-routed into cross-connects E0, E1 or E2. It supports internal transfer of non stop dropped E1 or E2 signals, Nx64 kbit/s transmissions, or Ethernet 10/100BaseT service.


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2 sm@rtMUX - System Description

2.1 The sm@rtMUX Kit - Basic Module The basic module board and its individual versions are ready to be fitted in the most common sm@rtMUX applications that are with 16xE1, 8xE1, or 4xE1 interfaces. This structure may be extended by one layer of four submodules, which enable the system to be flexibly extended – see Fig. 1. Basic submodule types are shown in Table 2. The B-layer is an interconnection field to terminate the E1 interface on the front panel. Three types of connectors supplied with the motherboards are possible – see Table 1:

♦ RJ16E – for 16 x E1 ♦ RJ8E – for 8 x E1 ♦ RJ4E – for 4 x E1

Fig. 1 sm@rtMUX unit configuration The following table shows the basic types of motherboards to be installed in different hardware and functional systems.

Table 1 - Motherboard overview

Code Description MPS0W1 Motherboard kit MPS0W a RJ16E, plus connection parts - for SKRP1, SKRP2 MPS2W Motherboard kit MPS2W and RJ8E, plus connection parts - for SKRP1, SKRP2 MPS3W Motherboard kit MPS3W and RJ16E, plus connection parts - for SKRP1, SKRP2 MPS4W Motherboard kit MPS4W and RJ4E, plus connection parts - for SKRP1, SKRP2 MPS2R1 Motherboard kit MPS2R and RJ8E, plus connection parts for R1U MPS3R1 Motherboard kit MPS3R and RJ16E, plus connection parts for R1U MPS4R1 Motherboard kit MPS4R and RJ4E, plus connection parts for R1U MPS2M2 The MPS2M motherboard with 8 RM1- for BKE3, BKE9 MPS5M3 The MPS5M motherboard with 16 RM1- for BKE3, BKE9 MPS6M4 The MPS6M motherboard with 4 RM1- for BKE3, BKE9

1 The MPS0W motherboard does not have (unlike other motherboards) any onboard temperature metering or backup of power sources, it may have a maximum of two submodules OS1 ( A3, A4) 2 For the MPS2M board, the B layer from Fig. 1 is not used. 3 For the MPS5M board, the B layer from Fig. 1 is not used. 4 For the MPS6M board, the B layer from Fig. 1 is not used.

Mother board

Submodule 1-4

16/8/4 E1Layer B2


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2.2 Submodules - Types and Locations

Table 2 - Submodules

Submodule

Interface Connector Maximum number of submodules

OS1 1x OLR (all purpose. 2nd - 3rd order) 2x FC/PC 3 SRV35 1x V.35/X21 (for Nx64 kbit/s) 1x D-SUB26 2 SHL1 1x G.SHDSL with wetting current 1x RJ45 4

SB1E2 1x RM2 (ITU-T G.703) 2x SMA 2 SB1E3 1x RM3 (ITU-T G.703) 2x SMA 2 EB10T 2x ETHERNET 10/100BaseT 2x RJ45 2 SB4E1 4x RM1 (ITU-T G.703) 1x D-SUB26 2

Table 3 - Possible locations for submodules

Position 1 B1 Position 2 B2 Position 3 B3 Position 4 B4 RJ 4E

RJ 8E RJ16E

Position 5 A1 Position 6 A2 Position 3 A3 Position 4 A4

SB1E3 SB1E3 SRV35 SRV35 SB4E1 SB4E1

OS1 OS1 OS1 EB10T EB10T

SB1E2 SB1E2 SB1E2 SHL1 SHL1 SHL1 SHL1


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2.3 sm@rtMUX System Configuration Possibilities - Multiplex

Contributory side Pos A1, A2

Network side Pos A3, A4

sm@rt MUX

Interface

4 x E1 G.703

2 x10/100 BaseT

1 x V/X

1 x SHDSL

Max.number of submodules

2

2

2

2

Submodule

SB4E1

EB10T

SRV35

SHL1

1 x E2 G.703 1 SB1E2

16 x E1 on the motherboard (position B)

1 x OPTO E2 1 OS1

1 x OPTO E2, E32 OS1

Interface Maximum number of

Submodule

1 x E3 G.7032 SB1E3

1 x E2 G.7032 SB1E2

1 x SHDSL 2 SHL1

Fig. 2 The sm@rtMUX system configuration possibilities The figure shows the capacity possibilities of the sm@rtMUX system with regards to individual submodules. Overall, the system may have up to four submodules of the type listed in Table 2. The figure shows the possibilities of their location in correspondence to Table 3. The system is intended to be applied especially as a Stop dropping Muldex in linear and circular networks. For this reason, positions A3 and A4 are intended for network side submodules, working in order E2 or E3, with metallic interface (G.703), optical interface E2, E3, or the E1/SHDSL interface.

However, other applications of the sm@rtMUX system are possible - see the following description:

2.3.1 Stop Dropping Muldex, Terminal Muldex with Backup These submodules may be installed to positions A3 and A4 in any combination. This configuration is also used for terminal muldexes with transmission path backup. The A1 and A2 positions on the contributory side may be combined as desired. Submodules SHDSL, E2 (G.703) or E2 (OPTO) may be used as contributory submodules in such case. The third optical interface is only contributory, not a network interface with tie-line topology enabled.

2.3.2 Terminal Muldex When using the sm@rtMUX as a terminal muldex without backup, the network module is installed into position A4 and the remaining positions, A1 - A3, may be used for any combination of the remaining modules - see Table 2.

2.3.3 SHDSL E1 Access - Last Mile The sm@rtMUX may also be used as a converter of the E1/SHDSL interface for "last mile" access solutions over metallic cables. All positions, A1 to A4 may then be used to install submodules SHL1 for E1 (G.703)/SHDSL conversion, or, for OPTO/SHDSL conversion, A4 may be used to install the OS1 submodule and A1 -A3 to install SHL1 submodules.


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2.4 Software Options The sm@rtMUX transmission functions depend on the software option supplied for the device.

2.4.1 SW-MPS0V1 431C276 Software Option Enables the drop insert function from the 2x E3 group signal with a maximum termination of 24E1. Other functions include hot backup with switching at the contributory streams E1 level when the main group stream fails. It also includes cross-connect of E2 streams and a partial cross-connect of E1 streams.

2.4.2 SW-MPS0V2 431C277 Software Option Enables drop insert from the 2x E3 +1xE2 group signal (optional 3x OS1) with a maximum termination of 16E1. Other functions include backup operation for linear and circular networks. It also includes cross-connect of E2 streams and a partial cross-connect of E1 streams.

2.4.3 SW-MPS0V3 431C278 Software Option Enables the drop insert function from the 2x E2 group signal with a maximum termination of 8E1, transfer of unstructured E1 streams, simple interface converters. Includes partial cross-connect of E1 streams.

2.4.4 SW-MPS0V4 431C308 Software Option Enables the function of drop insert from the 2x E2 group signal, includes channel cross-connect for 8xE1 and partial cross-connect of E1 streams.

2.5 Application Examples In the following application examples, optical E3 or E2 transmissions are used as the transmission medium for group signal, but external transport system may also be used for E2, E3.

2.5.1 P-P Multiplex Transmission with Possible Backup of Group Signal

Fig. 3 Terminal muldex with backup of group signal

2.5.2 Linear Structure with Stop Dropping Muldexes The system enables any integration/stop dropping of the contributory signal into the group stream up to the maximum transmission capacity.

Fig. 4 Linear structure with stop dropping muldexes

E1 (G.703) E2 (G.703) E1 (SHDSL) 10/100BaseT Nx64kbit/s






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2.5.3 Contributions Path Backup in a Circular Network

Fig. 5 Contributions path backup in a circular network In circular-type networks (simple circles, or networks with tie-lines), the system enables a backup outgoing path for all Contributory signals E1 and E2 and their equivalents. Pos.: The control channel is transmitted via service channels using the group optic signal bits and the status of its transmission is monitored by the service bits. When the control channel is interrupted, it is automatically redirected so that the outgoing path control is maintained.

2.5.4 Cross-connect Function in Access Networks

Fig. 6 The Cross-connect function Fig. 6 shows sm@rtMUX acting as a cross-connect in the access section of a SDH network:

1. for rearranging of E1 streams from subscriber sides (grooming, routing) 2. for switching of E1 streams from the SDH side. For example a link to sm@rtMUX's connected to

the SDH network in other locations - for example in a cascade setup. 3. for switching of E1 streams from the access (sm@rtMUX) network side. For example an end-to-

end connection directly at the access layer - for example a direct link between PBX's.

-- “ -- -- “ --




sm@ rt

M UX

SM@ RT M U XSD H

NxE

12 3

DXCFE1

V/X

sm@ rt

M UX

FE1

V/X

DXC

E1

V/X

sm@ rt

M U X

E1

V/X

sm@ rt

M UX

PBX

PBX


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3 Technical Sspecifications of the sm@rtMUX Device

3.1 The RM1 Interface ♦ Maximum number of interfaces: 4, 8, 16 (depending on the motherboard)

24 (extension using two SB4E1 submodules) ♦ Electric interface E12 specified in keeping with the ITU-T G.703

recommendation ♦ Frame structure a) unframed signal

b) ITU- T G.704 (CCS signalling) ITU- T G.706 (CRC4)

♦ Input, output impedance switched 120 Ω (symmetrical) / 75 Ω (asymmetrical) ♦ Interface Code HDB3 ♦ Jitter ITU-T G.823 ♦ Connector RJ45 or

D-SUB26 D-SUB44 Alarms monitored LOS

BER > 10-5 (10-6) BER > 10-3 AIS

Loss of alignment of frame synchronisation Loss of opposite alignment of frame synchronisation slip

♦ Status indicated local loop closed remote loop closed control code 215-1 transmission

♦ Diagnostic commands local loop remote loop Test signal transmission Switching of interface to „power down“ mode

3.2 The RM2 Interface ♦ Number of interfaces 1, 2 (using submodules) ♦ Electric interface E22 specified in keeping with the ITU-T G.703

recommendation ♦ Frame structure ITU- T G.742 ♦ Input, output impedance 75 Ω (asymmetric) ♦ Interface Code HDB3 ♦ Jitter ITU-T G.823 ♦ Connector 2x SMDA ♦ Alarms monitored LOS

BER > 10-5(10-6) BER > 10-3

AIS Loss of alignment of frame synchronisation

Loss of opposite alignment of frame synchronisation ♦ Status indicated local loop closed

remote loop closed ♦ Diagnostic commands local loop

remote loop


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3.3 The RM3 Interface ♦ Number of interfaces 1, 2 (using submodules) ♦ Electric interface E31 specified in keeping with the ITU-T G.703

recommendation ♦ Frame structure ITU- T G.751

♦ Input, output impedance 75 Ω (asymmetric) ♦ Interface Code HDB3 ♦ Jitter ITU-T G.823 ♦ Connector 2x SMDA ♦ Alarms monitored LOS

BER > 10-5(10-6) BER > 10-3

AIS Loss of alignment of frame synchronisation

Loss of opposite alignment of frame synchronisation ♦ Status indicated local loop closed


remote loop

3.4 The OLR2 Interface ♦ Number of interfaces 1, 2, or 3 (using submodules) ♦ Transmission speed 16,896 kbit/s ♦ Transmission medium a) 2 fibres SM (ITU- T G.652)

b) 2 fibres MM (ITU-T G.651) c) one fibre (external coupler used)

♦ Optical connectors FC/PC ♦ Wave length range 1,270 to 1,330 nm ♦ Code type MCMI ♦ Transmitter type DFB laser diode ♦ Receiver type PIN TIA ♦ Attenuation span 32 dB ♦ Receiving level range -5 to –41 dBm ♦ System redundancy 4 dB ♦ Alarms monitored LOS

BER > 10-5(10-6) BER > 10-3

AIS receipt of own transmitted signal

♦ Status indicated local loop closed remote loop closed switching off of ALS for optical transmitter

♦ Diagnostic commands local loop remote loop permanent switching on of laser


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3.5 The OLR3 Interface ♦ Number of interfaces 1, 2 (using submodules) ♦ Transmission speed 68.736 kbps ♦ Transmission medium a) 2 fibres SM (ITU- T G.652)

b) 2 fibres MM (ITU-T G.651) c) one fibre (external coupler used)

♦ Optical connectors FC/PC ♦ Wave length range 1,270 to 1,330 nm ♦ Code type MCMI ♦ Transmitter type DFB laser diode ♦ Receiver type PIN TIA ♦ Attenuation span 29 dB ♦ Receiving level range -5 to -38 dBm ♦ System redundancy 4 dB ♦ Alarms monitored LOS

BER > 10-5(10-6) BER > 10-3

AIS receipt of own transmitted signal

♦ Status indicated local loop closed remote loop closed switching off of ALS for optical transmitter

♦ Diagnostic commands local loop remote loop permanent switching on of laser

3.6 The SHDSL Interface ♦ Number of interfaces 12, 3, or 4 (using submodules) ♦ Complies with standard ETSI TS 101 524, ITU-T G.991-2 ♦ Transfer environment 1 metallic pair ♦ Transfer method 2 x full duplex with echo suppression ♦ Linear code TC-PAM ♦ Transmission speed Nx64 kbit/s (for N = 3 to 32) ♦ Nominal impedance 135 Ω (symmetric) ♦ Maximum attenuation span 40 dB/150 kHz ♦ Maximum 5range 7 to 3.6 km for ∅0.5 and transmission speed of 192 to 2048

kbit/s ♦ Connector RJ-45 ♦ Protection CRC-6 ♦ Alarms monitored LOS

BER > 10-5, (10-6, 10-7) BER > 10-3

disconnection of cable route

5 The maximum range depends on the type of cable used and number of channels transmitted.


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3.7 The V/X Data Interface ♦ Number of interfaces 1, or 2 (using submodules) ♦ Synchronous data transmission ♦ Interface type X.21, V.35 ♦ Transmission speed Nx64 kbit/s (for N = 1 to 32) ♦ Connector D-SUB 26

3.7.1 The X.21 Interface ♦ Supported interface circuits G, T, R, S ♦ Range 10 to 1,000 m (depending on transmission speed and cable)

3.7.2 The V.35 Interface ♦ Supported interface circuits 102, 103, 104, 106, 114, 115, 140, 141, 142 ♦ Range 10 to 1,000 m (depending on transmission speed and cable) ♦ Status indicated local loop closed


remote loop

3.8 The 10/100BaseT Interface ♦ Number of interfaces 2, or 4 (using submodules) ♦ Connection to data network LAN Ethernet ♦ Transmission characteristics serial, arrhythmic, half-duplex ♦ Transmission speed a)2.048 kbps

b) 8.448 kbps ♦ Code Manchester ♦ Protocol IEEE Std 802.3, access CSMA/CD

IEEE Std 802.1D, bridge IEEE Std 802.1Q IEEE Std 802.1p

♦ Electric parameters IEEE Std 802.3 ♦ Medium twisted metallic double pair ♦ Connector type RJ-45 ♦ Connection range 100 m per segment

3.9 The Local Control Interface ♦ Electric interface RS232/RS485 ♦ Connector RJ45


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3.10 The EOC Data Channel ♦ Number of data channels 1 ♦ Data transmission asynchronous ♦ Interface type RS232/RS485 ♦ Transmission speeds 1200; 2400; 4800; 9600;19200; 38400 bps ♦ Connector RJ45

3.11 Power Supply ♦ Input DC voltage −48 V, −60 V in keeping with ETS 300 132-2 ♦ Input voltage −72 V max. ♦ Input voltage −38.4 V min.

♦ Power consumption (depending on configuration) 14 W/48 V max.

3.12 Reliability ♦ Average Time Between Defects > 32 years

3.13 Environmental Conditions 3.13.1 Storage Conditions

♦ In keeping with the ČSN ETS 300 019-1-1 standard, class 1.2 ♦ Temperature range −25 to +55 °C ♦ Relative air humidity 10 % to 95 %

3.13.2 Transport Conditions ♦ In keeping with the ČSN ETS 300 019-1-2 standard, class 2.3 ♦ Temperature range −40 to +70 °C ♦ Relative air humidity 10 % to 95 %

3.13.3 Operating Conditions ♦ In keeping with the ČSN ETS 300 019-1-3 standard, class 3.1E ♦ Temperature range depending on specifications −5 to +45 °C ♦ Relative air humidity 5 % to 95 %


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3.14 Electromagnetic Compatibility ♦ In keeping with the ČSN ETSI EN 300 386 standard

3.14.1 Resistance – Test Method ♦ In keeping with ČSN EN 61000-4-2

ČSN EN 61000-4-3 ČSN EN 61000-4-4 ČSN EN 61000-4-5

3.14.2 Emissions – Test Method ♦ Emitted field in keeping with ČSN EN 55022 class B ♦ Emitted by convection in keeping with ČSN EN 55022 class B

3.15 Safety ♦ Electric safety ČSN EN 60950

3.16 Dimensions (h x w x d) ♦ sm@rtMUX - Plug-in Module for BKE3, BKE9 35 x 233 x 220 mm ♦ sm@rtMUX in the SKRP1 wall-mounted rack 315 x 380 x 70 mm ♦ sm@rtMUX in the SKRP2 315 wall-mounted rack x 380 x 90 mm ♦ sm@rtMUX in the 19´´ -1U rack 44 x 440 x 315 mm


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4 Hardware Description The sm@rtMUX system is supplied in the following hardware configurations: Configuration Purpose Power

Supply Photo

Rack 19“/ 1U, or a desktop box

Rack-mounted box for one sm@rtMUX unit or as a simple network or subscriber node

2x 48VDC

Rack 19“/3U

Box for max 3 sm@rtMUX units mounted into rack - concentration of access lines at central side

48 VDC

Rack 19“/9U

Box for max 10 sm@rtMUX units mounted into rack - concentration of access lines at central side

48 VDC

Wall-mounted box

wall-mounted box for one sm@rtMUX unit for the customer's premises, subscriber node

230 VAC +

48 VDC or

2x 48VDC

Tab. 1 The sm@rtMUX system hardware options NOTE: See Chapter 2 for maximum capacity of the interface for individual hardware options The motherboard is based on a four-layer printed circuit board, 233x220 mm, using the SMD technology. The fixing points are identical to those of the sm@rteX unit to enable installation into a separate SKRP1 or SKRP2 box.


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Fig. 7 Motherboard

The MPS0W, MPS2W, MPS3W, MPW4W, MPS2R1, MPS3R1 and MPS4R1 front panel is 45 mm wide to accept four A layer submodules and one B-layer interconnection module, see Fig. 8. The MPS2M, MPS5M and MPS6M front panel is 35 mm wide and accepts only four A layer submodules. It does not have the RJ16E, RJ8E, or RJ4E interconnection B-layer module. The front panel includes four universal openings (A1 to A4) for submodule connector installation (FC/PC, D-SUB 26, RJ45, SMA connector), one RJ45 connector for control and management (F/Q), one RJ45 connector for EOC data channel and two openings for the interconnection module connectors, a total of 16 RJ45 terminations. (this interconnection module RJ16E with 16 RJ45 connectors not provided for MPS2M, MPS5M and MPS6M).

Fig. 8 Front Panel The unit may be installed in BKE3, BKE9 blocks (for 35 mm front panel types), or into a SKRP1, SKRP2 box, or a 19´´ 1U rack. The MPS0W, MPS2W, MPS3W, MPW4W, MPS2R1, MPS3R1 and MPS4R1 units have two double line DIN64-type connectors at the back. The MPS2M, MPS5M and MPS6M units have one DIN 64-type and one three-line DIN 96-type connector at the back. The units also contain 4 connectors with 50 pins (for modules with RM1, RM2, RM3, V35, SHDSL, 10/100BaseT Ethernet interface) and three single-line connectors with 15 pins (for the OS1 module). Up to four submodules (3x OS1, 2xSB4E1, 2xSB1E3, 3xSB1E2, 2x SRV35, 4x SHL1, 2xEB10T) may be installed to a unit. The submodules are based on 50x140 mm printed circuit boards, using SMD technology. They are fixed to the motherboard using distancing columns and connected to the 50-pin connector.


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4.1 The OS1 Submodule The OS1 is a submodule containing the ORL optical interface (, ORL2, ORL3) enabling transmission over optical fibres. It is connected to the base unit using the 15-pin connector. It may be installed both on the contribution side (position A2) and on the network side (position A3, A4).

Fig. 9 The OS1 Submodule

4.2 The SHL1 Submodule The SHL1 is a submodule providing the SHDSL interface for transmission over a single metallic pair. It may be installed at any position both on the network and the contribution side.

Fig. 10 The SHL1 Submodule


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4.3 The SRV35 Submodule The SRV35 is a submodule containing either the V.35 or X.21 interface. It is installed on the contribution side only (position A1 or A2).

Fig. 11 The SRV35 Submodule

4.4 The SB4E1 Submodule The SB4E1 is a submodule containing four RM1 interfaces terminated at a D-SUB26 connector. It may be installed on the contribution side.

Fig. 12 The SB4E1 Submodule


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4.5 The SB1E3 Submodule The SB1E3 is a submodule containing one metallic 3rd order E3 interface. It may be installed on the network side.

Fig. 13 The SB1E3 Submodule

4.6 The EB10T Submodule The EB10T is a submodule containing two Ethernet 10/100BaseT interfaces. It connects two up to 8 Mbps data HDLC streams to the motherboard. It is installed on the contribution side (position A1 or A2).

Fig. 14 The EB10T Submodule


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5 Electric Functions

5.1 Motherboard

The core of the entire system is a programmable XILINX field, whose basic version includes 2xMX3, 8xMX2, 2x NRZ/MCMI transducer for OLR of 2nd to 3rd order, signal stream switch from individual submodules of the unit and Xilinx's functional blocks, 2x PECL transducer for the optical submodules, the time base block for creating all necessary frequencies from the 68.736 MHz oscillator, 2x EOC block for management and control transmission via optical interfaces and the selftest block to test the unit's basic functions. The number of individual blocks (their functions) may be altered by changing the Xilinx design, the size being the only limitation. The MX2 block complies with the ITU-T G.742 recommendation, MX3 with ITU-T G.751. The MCMI block (1st to 3rd order) enables full compatibility with two previously produced units, OZ2, OZ3 and their laser versions OME2, OME3, JRO, OM2, OM2L. The TB –Time Base - block enables the VCO to be controlled from the selected signal streams of the individual submodules with varying priorities (up to 5 levels). It also produces, from the oscillator frequency of 68.736 MHz, various other frequencies as needed: 2.048 MHz, 8.448 MHz and 34.368 MHz. The NAP power supply unit converts primary voltage (–48 V to –72 V) to secondary voltages of +1.8 V, +3.3 V and +5 V. The microprocessor coordinates the processes on the unit and communicates with the control and management software (FT12 protocol) - thus replacing the control unit. A RS232 connection is used for local control.

-48V;+5V;+3V Connector 11 15 Connector 10 15 Connector 12 15

XILINX +3.3V

+5V

+1.8V

I2C

Connector 1 50 pins

Connector 2 50 pins

Connector 3 50 pins

Connector 4 50 pins

S W I T C H A

8*E2 2*E3

P I C L

2*MCMI/1st - 3rd order/

VCO 68.736MHz

Time Base+SYNCH

PROCESSOR RAM FLASH SRAM/RTC/

Controlcontrol

RS232/ RS485 F/Q

power supply unit

- 48V

Ident. EEPROM

Upp

er C

onne

ctor

64

pins

Lo

wer

Con

nect

or 6

4/96

pin

s

EOC

SELFTEST

16*E1


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5.2 The OS1 Submodule The optical signal input/output uses the FC/PC optical adaptors on the unit's front panel. The optical receiver is marked blue. The optical transmitter is marked red. From the optical receiver, the symmetric signal is passed through the lower filter into the controlled amplifier and shaper. From the shaper, differential signals of the MCMI code and the Flag in the PECL logic are passed through the connector and into the motherboard for further processing (clock path, the MCMI decoder on the NRZ, extraction of upper layer data channels, PCM demultiplex of the 3rd or 2nd order, evaluation of Code error rate and bite error rate). In the transmission direction, the MCMI code is transferred from the motherboard via the XJ1 connector (the NRZ coder on the MCMI, insertion of upper layer data channels, PCM multiplex of 3rd or 2nd order) through the amplifier and to the laser diode. The transmitted level is monitored by a photodiode and kept at a constant level without influence from temperature and power voltage changes using feedback. The optical output may be set to the desired level.

5.3 The SHL1 Submodule The line connection between the SHDSL interface and the SHL1 unit uses a RJ45 connector. The transmission line is galvanically divided from the device by a transformer, with protective lightning fuses, PTC thermistors and sidactors at the primary side as protection against over-voltage on transmission lines. A single integrated circuit at the board is the functional base for the SHDSL interface. The wetting current and authentication circuits generate wetting current for the line between two SHDSL end devices and ensure the use of active source and receiver of the wetting current to run the authentication protocol. The authentication provides identification of both units for the STU-C and STU-R mode and thus enables their connection. The last function is continuous monitoring of integrity of the connecting lines and initialisation of an alarm when it is interrupted. The SHL1 unit uses two power voltages from the MPS unit: the +5 V and +3,3 V voltage. From the +5 V, a direct alternator produces a floating voltage of +24 V and –24 V for the wetting current source circuit.

5.4 The SB4E1 Submodule To process four E12 interfaces, four interface circuits and eight dividing transformers and integrated protections are used. The interface circuits contain HDB3 codecs and clock paths for individual E12's. Local and remote loops may be closed using the base unit's microprocessor. The input and output data/clock signals in the unipolar format are transmitted for further processing to the motherboard. The bipolar signals in the HDB3 are transmitted from the unit through the D-SUB26 connector on the front panel. The E12 interface circuits serve the purpose of dividing the clock frequency from the incoming signal, reducing jitter and translating the code. The line HDB3 code is used. The electric interface complies with the recommendations of ITU-T G.703 (impedance of 120 Ω). The receiver and transmitter are both galvanically divided using transformers and contain protective circuits against over-voltage.


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5.5 The SB1E2 Submodule The board is based on a core containing the PCM interface for E12 or E22 standards. The Input Signal of the 2nd order interface (E22) is led, via the SMA connector, to the input transformer. The XJ1 and XJ2 jumpers enable connection of the connectors with the mechanical ground. The soldering jumper is used to connect the mechanical and electrical earth.

5.6 The SB1E3 Submodule The submodule is based on a PCM interface of the 3rd order - E31, with the HDB3 signal code. The Input Signal of the 2nd order interface (E31) is led, via the SMA connector, to the input transformer. The XJ1 and XJ2 jumpers enable connection of the connectors with the mechanical ground. The soldering jumper is used to connect the mechanical and electrical earth.

5.7 The EB10T Submodule The submodule is based on a PowerPC Motorola MPC860 processor. On the input EB10T side on the Ethernet side, the submodule contains a three port Ethernet Bridge circuit, with two ports terminated at the outside interface and the third used for communication with the processor to transmit data on the WAN interface. The motherboard processor communicated with the submodule processor using the UART interface. Two HDLC streams of up to 8 Mbps are used as the WAN interface.

6 Alarms and Signalling

Alarms are standards indications used by the internal diagnostics of the transmission system to communicate substantial deviations from normal functionality. LED's on the front panels of the units provide basic information; detailed information is obtained from the local control device.

All alarms contain a heading with the additional information:

♦ Abbreviation of the alarm name, as used in documentation and control programs ♦ category of the alarm ♦ unit (and its functional block) generating the alarm ♦ method of indication on the device ♦ explanation of the alarm's meaning

The alarms are summarised in individual levels of control system views depending on their categories. The alarm categories have the following meaning:

• Urgent Alarm Status

(NAP)

urgent alarm, usually leading to an immediate loss of transmission functions, indicated by red colour on control equipment,

• Non-urgent Alarm

Status (NEP)

non-urgent alarm, usually results in deterioration of transmission parameters or risk of loss of transmission functions, indicated by yellow colour on control equipment,

• Service Alarm Status

(SLP)

Indicated (service) alarm is signalled to a given device from other network nodes


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Table 4 - Coloured signal lights

Diode Event OFF module failure (TST light on) red light urgent alarm green light non-urgent or service alarm not detected red/green flashes

service alarm

red flashes concurrent urgent and service alarm

UA

green flashes OFF urgent alarm not detected

yellow flashes

1sec flashes when transferring to back up operation without a non-urgent alarm 2 times a second flashes when transferring to back up operation and a concurrent non-urgent alarm

NUA

yellow light non-urgent alarm OFF selftest OK

yellow flashes

a) selftest ongoing b) test ongoing c) closed loop d) laser permanently on (safety failure)

TST

yellow light unit failure OFF power failure green light secondary power voltage present PW green flashes OFF interface switched to RS 485 (without transmitted data being present)

yellow flashes interface switched to RS 485 (flashes in the output data frequency) flashes in 1sec frequency when V.110 synchro is lost EOC

yellow light interface switched to RS 232 OFF green light interface switched to Q interface with RS485 red light interface switched to LM interface with RS232

red/green flashes

interface switched to F interface with RS232

red flashes

F/Q

green flashes


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7 Management and Control The sm@rtMUX system can be controlled in several ways. Options are shown on Fig. 15.

Fig. 15 sm@rtMUX System Control Options Table 4 - sm@rtMUX System Control Options

SNMP access point DCN DORIS SNMP agent

DORIS EB10T

1 FT1.2, V/X, LL

FT1.2 over Ethernet

YES YES

2 Ethernet/IP Inband/Outband YES YES (2)

Control Option: 1. The basic control option (see Chapter 7.1) includes the Doris control system with comfortable functions

not only for collection of alarms, but also for configuration of individual network elements. The control system includes extended databases for archival of most events and status of devices. The control system is connected using an asynchronous network interface, which may be connected to individual network elements either by a data channel within the useful band of the given device, or using overlay channels.

2. Alternatively, the control channel may be connected using a TCP/IP network and an adaptor (see Chapter 7.2), or

3. via a switched telephone network and a modem (see Chapter 7.3)

4. When the sm@rtMUX system contains an EB10T modem with relevant software (implemented control functions) at access point number two, the relevant network element may be accessed via the Ethernet interface. Subordinate Network Elements are then linked to it using the proprietary method. Alternatively, local control using the DORIS 2000 SERVICE application my also be used (see Chapter 7.4).

All alternatives are illustrated on the following figures. The Doris control system may also contain a SNMP agent, which is used as an interface toward a master management level (Umbrella Management) over a TCP/IP network. This ensures transfer of alarm messages (trap) and inventory information. The Doris management system is available as a central management solution (Doris 2000 NET, DORIS 2010 SERVER/CLIENT) or as a local maintenance application (DORIS 2000 SERVICE).


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7.1 Basic Control Option - The DORIS Control System, FT1.2 Protocol

Fig. 16 Basic Control Option

7.2 Optional Control - using the RS232/TC/IP Adaptor Control Channel over the RS232/TCP/IP Adaptor

Fig. 17 Control using the RS232/TCP/IP Adaptor

sm@rtMUX sm@rtMUX

Umbrella Management

RS232/RS485

DORIS 2000 NET DORIS 2010 SERVER

sm @ rtM U X

sm @ rtM U X

sm @ rtM U X

A

R S 232

E therne t

A

R S 232

D O R IS 2000 N E T D O R IS 2010 S E R V E R

TC P /IP


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7.3 Connection of the Control Station using a Modem and the Switched Telephone Network

Fig. 18 Connection of the Control Station using a Modem and the Switched Telephone Network

7.4 Connecting the Control Station using the EB10T Module

Fig. 19 Connecting the Control Station using the EB10T Module

sm@rtMUX

sm@rtMUX

sm@rtMUX

JTSJTS

M

M

DORIS 2000 NET DORIS 2000 SERVICE

RS232

RS232

sm@rtMUX

sm@rtMUX

sm@rtMUX

TCP/IP


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8 Ordering Information Table 7 - Motherboards, Submodules, Cables, Package Contents and Firmware Code Ordering Code Description MPS0W 431R241 Motherboard kit MPS0 (431P241) and RJ16E (431N255), plus connection

parts - for SKRP1, SKRP2 MPS2W 431R298 Motherboard kit MPS2W (431P298) and RJ8E (431N301), plus connection



parts - for SKRP1, SKRP2 MPS2R1 431R302 Motherboard kit MPS2R (431P299) and RJ8E (431N301) , plus connection

parts and the R1U rack MPS3R1 431R303 Motherboard kit MPS3R (431P285) and RJ16E (431N255), plus connection

parts and the R1U rack MPS4R1 431R304 Motherboard kit MPS4R (431P286) and RJ4E (431N290), plus connection

parts and the R1U rack MPS2M 431P300 The MPS6M motherboard with 8 RM1- for BKE3, BKE9

MPS5M 431P287 The MPS5M motherboard with 16 RM1- for BKE3, BKE9

MPS6M 431P288 The MPS6M motherboard with 4 RM1- for BKE3, BKE9

OS1 431N226 Submodule with the OLR optical interface SB1E2 431N243 Submodule with the E2 interface SB1E3 431N244 Submodule with the E3 interface SB4E1 431N225 Submodule with 4x RM1 interface SHL1 431N208 Submodule with the SHDSL interface SRV35 431N214 Submodule with the V.35/X21 interface EB10T 431N242 Submodule with the 10BaseT Ethernet interface


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Code Ordering Code Description SKRP1 442R022 Wall-mounted rack (70 mm depth) SKRP2 442R033 Wall-mounted rack (90 mm depth) BKE3 431R012 3U 19“ rack BKE9 431R016 9U 19“ rack SNM 442N008 Power supply unit - 220 V/48 V mains (for SKRPx) F9RJ 431K068 The F cable for connection of local control K-RJE 431K271 Set of RJ 45 connectors for 16x RM1 KE 431K177 Set of RJ 45 connectors for 4x RM1 K-E1 431K272 Set of connectors for SB4*E1 or SRV35 K-S1 431K273 Set of connectors for SHL1 K-EB 431K274 Set of RJ 45 connectors for EB10T KP C413K212 1pc interconnection cable SMA-SMA for RM2 or RM3 (50 cm long) KDB 429K688 Set of connectors for EOC MPS0, MPS2, MPS3, MPS4, MPS5, MPS6 K-NAP 431K275 Set of power connectors for 48 V (SKRPx rack) KBN 431K181 Set of power connectors for 48 V (BKEx rack) KM1 431K175 Set of RM1 connectors (DSUB 44 + RJ45) for MPS6M and MPS5M SW- MPS0V1 431C276 Firmware for MPS0,MPS2, MPS3, MPS4, MPS5, MPS6, functions: 2xOS1

E3 DROPINSERT SW- MPS0V2 431C277 Firmware for MPS2, MPS3, MPS4, MPS5, MPS6, functions: 3xOS1 E3

DROPINSERT SW- MPS0V3 431C278 Firmware for MPS0, MPS2, MPS3, MPS4, MPS5, MPS6, functions: 4x E1

G.704, 2x E2- G.742 SW- MPS0V4 431C308 Firmware for MPS0, MPS2, MPS3, MPS4, MPS5, MPS6, functions: 8x E1,

cross-connect E0, G.704, G.706, 2x E2- G.742 SW- 10BTV1 431C279 Firmware for EB10T, functions: Ethernet bridge SW- 10BTV2 431C280 Firmware for EB10T, functions: Ethernet router

NOTE: Maximum numbers of submodules installed on one motherboard, their locations and allowed combinations are described in Chapter 2 – sm@rtMUX Product Description.

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smartmux description EN - TTC HOLDING, a.s.

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