tion of chromic acid by a reducingagent and the solid particles, saidelectroplating solution being de­void of complexing agents.

MAIlIU.ACTUU O' ....ffnDCIRCUIT BOARDSU.S. Patent 5,869,126. Feb. 9. 1999P. Kukallskis, assignor toMacDermid Inc., Waterbury, Conn.A process for producing printedcircuit boards, which comprisesforming circuitry comprising cir­cuit elements and other featuresselected from the group consistingof lands, tabs, pads, and other ar­eas of connection on a copper-cladlaminate; applying a mask overthe laminate; drilling holes in anarray; activating the holes to ac­cept plating therein; thereafter

stripping the mask; applying aplating mask over the laminate inan imagewise manner such thatat least the holes and some of theother features are not covered bythe mask; cleaning surfaces notcovered by the plating mask; andplating the holes and any otherareas not covered by the platingmask with a metallic coating.

APPARATUS POR PLAnNG PINGRID ARRAY MODULISU.S. Patent 5,869,139. Feb. 9, 1999C.N. Biggs et al., assignors to IBMCorp., Armonk, N. Y.An apparatus for plating pin gridarray modules equipped with apinned surface.

PRnMATMINT TO AcnvAnMIT.... POR SOL..IL COAnNe

U.S. Patent 5,869,140. Feb. 9, 1999K. Y. Blohowiak et al., assignors toThe Boeing Co., SeattleA method for treating a metal sur­face to leave the surface clean andactive for receiving a sol coatingcomprising degreasing the sur­face; cleaning in an alkalinecleaner; etching the cleaned sur­face with an alkaline etchant; anddesmutting using a solution madefrom HN03, H2S04 , and ammo­nium bifluoride, wherein the des­mutted surface is water-break­free for greater than 60 sec.

SOL COAnNG Of MlTAUIU.S. Patent 5.869,141. Feb. 9, 1999K. Y. Blohowiak et al., assignors toThe Boeing Co.• SeattleA method for promoting adhesion

98

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Metal Finishing

between a metal and an organicresin in a metal-resin hybrid lami­nate comprising pretreating themetal to obtain a clean, active sur­face; coating at least a portion ofthe active surface of the metal witha water-based sol initially alcohol­free containing 1% by volume n­alkoxyzirconium sufficient to mini­mize diffusion of oxygen to themetal surface; 2% by volume of areactive organosilane; and an effec­tive amount of glacial acetic acidsufficient to serve both as a catalystand as a zirconium hydrolysis sta­bilizer to produce a sol-gel film onat least a bonding surface of themetal; applying the organic resin,including a functional group for co­valently bonding to the organosi­lane, to the coated bonding surface;

and covalently bonding the or­ganosilane with the resin.

MULnLAYIR eGAn.u.s. Patent 5,869,198. Feb. 9, 1999M. Erne et al., assignors to HerbertsGmbH, Wuppertal, GermanyA process for the multilayer coatingof electrically conductive substratesby the electrophoretic deposition ofa first coating layer comprising anelectrophoretically depositableaqueous coating medium and thesubsequent application of furthercoating layers, wherein a secondcoating layer comprising at leastone of a first color-impartingbasecoating medium and a first ef­fect-imparting basecoating me­dium is applied wet-into-wet to thefirst coating layer obtained by elec-

trophoretic deposition, and the firstand second coating layers thus ob­tained are stoved jointly, where­upon a third coating layer compris­ing at least one of a second color­imparting basecoating mediumand a second effect-impartingbasecoating medium is applied anda fourth coating layer comprising aclear coating medium is appliedwet-inta-wet thereto and the thirdand fourth coating layers arestovedjointly, wherein the total drycoating thickness of the second andthird coating layers produced fromthe basecoating media is between15 and 40 ~m and the proportion ofthe second coating layer is between20 and 50% of the total dry coatthickness of the second and thirdcoating layers.

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November 1999 99