Compression Molding
Solutions for 3D TSV and other advanced packages as well as cost savings for standard package applications
1. Company Introduction
2. Package Development Trend
3. Compression FFT Molding Technology
4. Advantages by Compression FFT Mold
5. Cost reduction by Compression FFT Mold
6. Mass production equipment (PMC1040)
7. LED Lense Compression Molding
8. Summary / Conclusion
2
Source : VLSI Research
• TOWA Europe GmbH has been established in 2004.
• A division of The TOWA Corporation of Japan, founded in
1979. Towa Corporation, a Molding Pioneer
• With a 40% WW market share, Towa is largest supplier of Mold
equipment
• Cooperation with the package/product development centres of
our European customers as well as with European
institutes, enables us to play a leading role in the development
of new products by European companies
• With our Towa Europe PDC (Package Development Center) we
give full support in package development of Semiconductor
and LED packages, from the designing stage to mass
production.
1 Company Introduction
3
1 Company Introduction
4
Former generation New generation
1980 1990 2000
Str
uct
ure
P
ack
ag
e
Tre
nd
A
ssem
bly
Sty
le
SOP/TSOP
DIP
QFP/TQFP
PBGA
FBGA
CSP
FC BGA
WL CSP
Matrix
Cavity
Map
Cavity
Single
Cavity
Matrix
Cavity
Chip stack
Package stack
2014
POP
Single
Cavity
Future
mainstre
am
Large Substrate
Through Silicon Via
High end SIP
Map Unit
Cavity
WL CSP
Large Frame
2 Package Road Map and Towa Mold Solutions
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2 Package Road Map and Towa Mold Solutions
20 18 15 12
DIP
QFP/TQFP
SOP/TSOP PBGA
FBGA CSP
FC BGA
WL CSP
Chip stuck
Single Chip
Matrix Cavity
L/F
Matrix allay
package(MAP)
Year 1990 2000 2014
Mold thickness (mm)
Mold Width (mm)
3 1 0.5 0.4 0.3 0.2
30 50 75 100 120 150
2 5 7 No of stack chip 1
Wire length (mm)
Wire dia (μm)
4 5 6 7 10
Stack Die & long wire
& low loop height
Flow Free Thin Molding ・Fine & Long wire ・Thin Package
・Multi-Stack Die ・Low-K Die
Single Cavity LF
Package stuck
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High Power
UV LED
1st Generation
Mold method
Transfer Single plunger
2.5th Generation
Mold method
Transfer Multi-plunger
with vacuum
3rd Generation
Mold method
Compression FFT molding
8 10 16
8
23
20
2nd Generation
Mold method
Transfer Multi-plunger
6
2 Package Road Map and Towa Mold Solutions
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Advance packaging 2013 =>
Mold compound ( Pellet ) is set in the pot.
Melted compound is transferred
into mold chase.
Upper
Chase
Lower Chase
Transfer Speed
Transfer Pressure
FM Seal
Upper
Lower
MAP Substrate Wafer LED
Mold compound ( Granule / Liquid)
is set in lower chase. Substrate
is slowly “dipped” into melted compound.
Compression Molding Transfer Molding
3 Compression FFT Molding Technology
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・Film Width : 100 ~ 140mm
・Film roll diameter : φ180 MAX.
・Film exchange time : about 10 minute
・Film usage length per shot : length 400mm
Unwind Wind
Upper Mold Die
Release Film
Lower Mold Die
Middle Plate
Ion Blow
3 Compression Molding Technology: Film Handler
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FM Die
Steam
Air in tablet
Packed air
In filling
FM position
STD Molding
FM Molding 1mm
FM unit
◇Feature With vacuum unit, vacuum tank and unique seal enable gas & air inside of tablet or during resin
fusion to deaerate within 1 second just 1mm away from final clamping position.
◇Effect Void free and stable molding.
Adequate to Thin Large Package, Stack Die, Stack Package, Flip Chip,Clear Resin etc…
3 Compression Molding Technology: FM Technology
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Compression
molding
Protect cavities from
contamination and abrasion.
Remove air and out-gas while
molding.
Pressurized encapsulation. Stable molding.
Reduce cleaning or
maintenance process
Release molded products from
mold cavity. No damage caused by
ejection stress.
No ejector pin marks
Set resin into cavity area only. No cull / runner
No voids
No burnt spot caused
by gas or air
-
-
-
-
-
-
-
Fundamentals
Release film
FM
3 Compression FFT Molding Technology
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Transfer molding Compression FFT molding
Compound flow unbalance
Compound flow-free
GATE side
Compression FFT Molding Method is able to minimize resin flow comparing with Transfer
Molding Method. To fill out all part of molding area, Transfer Molding Method takes much
longer time. Compression FFT molding method has an advantage at larger substrate
due to this reason.
Cost reduction by using larger substrate up to 100 x 300 or
Large Panels
4 Advantages: Enlarged substrate Size
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Multi-stack die package
Compression FFT molding
Void
Resin flow
Transfer molding
4 Advantages: High Quality Molding
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Sensitive packaging - Overhanging dies, Low K die, fragile
MEMS can be molded by compression molding by low
encapsulation pressure.
Compression FFT molding
4 Advantages: High Quality Molding
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Wire sweep max. 0.3% Wire sweep max. 5%
Resin : Green compound
Wire diameter : 20 µm
Wire length : 5.5 mm MAX.
Long or fine wire bonded package
Compression FFT molding Transfer molding
4 Advantages: High Quality molding
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With FM Without FM
Flip chip underfill
Comparison picture With/Without FM(Flip chip / Matrix)
Chip size : □7mm、Gap : 70μm
4 Advantages: High Quality molding
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Compression FFT Molding Method enables gold wire to be smaller by
minimized resin flow.
● Mold evaluation example of fine & long Wire
φ25μm ⇒ φ15μm Approx. 64% reduction
φ22μm ⇒ φ15μm Approx. 54% reduction
● Cost down proposal of finer gold wire
※Cross-section ratio
【 MOLDING CONDITION 】 Wire: φ15μm
Wire length 5mm
Fine wire
5 Cost Reduction: Reduction of Gold Wire
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100% resin usage Approx. 40~60% resin
usage
Compression FFT Molding Transfer Molding
Improved resin utilization and reduction of waste
material and disposal cost
5 Cost Reduction: Improved Resin Utalization
Minimum
Mold Gap
over Die
Transfer molding CompressionFFT molding
By reducing CMP, Back grinding process,
Reduction of one process and equipment cost
CMP, Back grinding
process is required
Chip thickness is free so that
CMP, Back grinding process
can be eliminated.
5 Cost Reduction: Reduction CMP / Backgrinding
1.Flexibility to different thickness products a. Available range from initial setting is +0.3mm of
thickness of substrate or package by parameter.
b. No conversion is required.
・Effective usage of chase and parts.
2.Decrease cleaning time of chase with release film.
3. Same Granular Compound can be used for
different package type vs. troublesome pellet
control management
5 Cost Reduction: Progress of productivity and
workability
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PMC1040 appearance
6 Mass Production equipment
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• By using pre-cut release film method, release film usage is improved
• Advanced resin supply accuracy.
• Small foot print by using Hold Frame structure.
• Possible to connect maximum 4 Hold Frame module (= 8 strips) to meet mass production requirement.
• PMC can handle 30% wider substrate (Max 100 x 300mm)
• Possible to detect number of stack chip by Laser scan sensor
• Resin cooling ability.
• Molded substrate warpage compensation function equipped.
Feature of PMC1040-S
6 Mass Production equipment
Silicon lens Die bonding
Silicon, phosphor layer
Compression FFT molding
Conventional package
Pre-molding
Lens shape
Compression
molding
Substrate (ceramics etc.) Epoxy, phosphor layer
Compression FFT molding,
Simplify high power LED manufacturing process
Substrate (ceramics etc.)
Die bonding
No lens misalignment!
7 Led Lense Compression Molding
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1. Improves productivity by molding a lot of LED packages at one time.
2. Enables to miniaturize LED packages as thin package and small dia. Lens can be
molded.
3. Enables to reduce LED package assembly process by making lens shape
simultaneously by compression molding with silicone, instead of mounting
separated lens.
4. Improves effective usage of reisn (over 95%)
5. Enables to encapsulate by phosphor mixed resin.
6. Improve reliability as release agent is not required to add in silicone resin.
7. Contributes improvement of heat radiation by wide substrate material selection
(Ceramics etc.).
8. It's applicable to various lens shape not only dome type. (e.g., to make hollow on
vertex of lens in order to spread light.)
Advantages of LED Compression FFT molding
LED application
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• Larger substrate
• Finer wire
• Effective resin usage
• Cost reduction of CMP and other process
• Progress of productivity and workability
Superiority of Compression FFT Mold
Compression FFT molding method is capable for
molding not only existing packages, but also for
advanced packaging with the most beneficial
cost reduction.
8 Summary and Conclusion
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Semiconductor / IC
LED Mold
Solar Cell Surface protection,
Focus lens Mold Complex
Tooling
MEMS Cavity
TOWA Compression FFT Mold
The solution for difficult-to-mold packages, thin large area molding and automating.
High filler contents, high adhesion,
・Silicone Resin (Heat proof, ultra-violets transit)
・Epoxy Resin ( High Adhesion etc. )
Electric Components
Module
Free from Vibration and
Outer Conditions
Various applications by Compression FFT molding
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8 Summary and conclusion
★Strip Single /Multi Cap
8 Summary and conclusion
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Various assembly style by Compression FFT molding
★Panel Size ★Wafer Level
★LED( Strip and panel size )
Thank you for your attention!
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