Some Approach on CPU Cooling

By Yizhong Wang

ME3007 Presentation by Yizhong Wang

Outline

• Motivation

• Microfluidic Heat Sink

• Nanofluid

• Summary

ME3007 Presentation by Yizhong Wang

Motivation

ME3007 Presentation by Yizhong Wang

Motivation

Intel Dual Core Xeon

Model Clock Speed Power Speed:Power ratio [MHz/W]

5140 2.33 GHz 65 W

5150 2.66 GHz 65 W 41.0

5160 3.00 GHz 80 W 37.5

7120M 3.00 GHz 95 W 31.6

7130M 3.20 GHz 150 W

7140M 3.40 GHz 150 W

7150N 3.50 GHz 150 W 23.3

ME3007 Presentation by Yizhong Wang

Motivation

Passive Heat Sink Cooler (Fin) + Fan -> Forced Convection

ME3007 Presentation by Yizhong Wang

Motivation

Water Cooling in Industry:

Water Intake for Nuclear Power Plant Cooling

ME3007 Presentation by Yizhong Wang

Microfluidic Heat Sink

Air WaterSpecific Heat Capacity

J/(g.K)1.012 4.1813

Density

g/L1.2 1000

Thermal Conductivity

W/(m.K)0.025 0.6

ME3007 Presentation by Yizhong Wang

Microfluidic Heat Sink

ME3007 Presentation by Yizhong Wang

Microfluidic Heat Sink

ME3007 Presentation by Yizhong Wang

Microfluidic Heat Sink

Channel :

L=27mm,

W=100um,

Spacing=40um

H=50um,

64 Channels

ME3007 Presentation by Yizhong Wang

Average

Speed

1.537

m/s

1.662

m/s

1.791

m/s

1.923

m/s

2.057

m/s

2.194

m/s

2.333

m/s

2.474

m/s

2.617

m/s

Flow Rate

cm3/s

0.4917 0.5319

0.5732 0.6153 0.6588 0.7021 0.7466 0.7918 0.8374

Pressure

Change

100K

Pa

100K

Pa

100K

Pa

100K

Pa

100K

Pa

100K

Pa

100K

Pa

100K

Pa

100K

Pa

Re 204 238 277 319 365 416 470 529 591

Heat Transfer

Q (W)

61 78 96 116 137 161 187 215 245

Outlet

Temperature

55 60 65 70 75 80 85 90 95

Microfluidic Heat Sink

ME3007 Presentation by Yizhong Wang

Microfluidic Heat Sink

ME3007 Presentation by Yizhong Wang

Nanofluid

ME3007 Presentation by Yizhong Wang

Nanofluid

ME3007 Presentation by Yizhong Wang

Nanofluid

ME3007 Presentation by Yizhong Wang

Nanofluid

ME3007 Presentation by Yizhong Wang

Nanofluid

ME3007 Presentation by Yizhong Wang

Discussion and Summary

• Air Cooling reaching it limit

• Water (liquid) cooling will be the next generation

• Nanofluid have great potential in cooling

• Particle Deposition

• Evaporation and Refill