SPECIFICATION - TRULY AMERICA · CAMERA MODULE CM9953-B1300BA-E Version :0.1 Sep 1, 2014 TRULY...

CAMERA MODULE CM9953-B1300BA-E Version :0.1 Sep 1, 2014

TRULY OPTO-ELECTRONICS LTD. P.1

SPECIFICATION

Revision: 0.1

CM9953-B1300BA-E TRULY OPTO-ELECTRONICS LTD.: CUSTOMER:

PRODUCT : CAMERA MODULE

MODEL NO. : CM9953-B1300BA-E

SUPPLIER : TRULY OPTO-ELECTRONICS LTD.

DATE : Sep 1, 2014

Approved by: Quality Assurance Department: Technical Department:

Approved by:

If there is no special request from customer, TRULY OPTO-ELECTRONICS LTD. will not reserve the tooling of the product under the following conditions: 1. There is no response from customer in two years after TRULY OPTO-ELECTRONICS LTD. submit the samples; 2. There is no order in two years after the latest mass production. And correlated data (include quality record) will be reserved one year more after tooling was discarded.



REVISION RECORD REV NO. REV DATE CONTENTS REMARKS

0.1 2014-09-01 First release Preliminary



CONTENTS

KEY INFORMATION PIN ASSIGNMENT ELECTRICAL CHARACTERISTICS MECHANICAL DRAWING APPEARANCE SPECIFICATION IMAGE SPECIFICATION PRECAUTIONS FOR USING CCM MODULES PACKAGE SPECIFICATION PRIOR CONSULT MATTER FACTORY CONTACT INFORMATION

WRITTEN BY CHECKED BY APPROVED BY

RAO JING WEI YOU XING LIU TIE NAN



Key Information

Module No. Module Size 8.50mm × 8.50mm × 5.20mm Sensor Type IMX214 Array Size 4208 × 3120

Core 1.00±0.1V Analog 2.7+0.2/-0.1V I/O 1.8±0.1V

Power Supply

AF_VDD 2.8V Lens Size and Structure 1/3.1 inch 5Plastic Lens F.NO 2.0 Lens View Angle 75° IR Cutter 648nm Object Distance 10cm~infinity Input Clock Frequency 6~27MHz Operating Temperature Range -20°C to 60°C Output Formats RAW8 and RAW10，COMP8 and COMP6 OTP Contents ID and AWB

Full resolution @30fps (Nornmal / HDR) 4K2K @30fps (Normal / HDR) Maximum frame Rate 1080p @60fps (Normal / HDR)

Pixel Size 1.12µm × 1.12µm 260.99mW(Active)

Sensor Power Consumption (MAX) 262.23μW(Standby)

IC Package COB Substrate R-FPC Auto-Focus Type VCM (Voice Coil Motor) VCM Driver VM149E Package Antistatic Plastic

CM9953-B1300BA-E



Pin Assignment

No. Name Pin type Description

1 AGND Ground Analog ground 2 AVDD Power Analog power 3 AGND Ground Analog ground 4 AF_VDD Power VCM power 5 DVDD Power Core power 6 DOVDD Power I/O power 7 AF_EN Input Enable pin of VCM driver, active low 8 SDA I/O IIC data 9 SCL Input IIC clock 10 NC - No connect 11 MCLK Input Clock input 12 DGND Ground Digital ground 13 RESET Input Chip clear signal (active low) 14 ID(GND) Output Camera identification, pull down inside of module 15 DGND Ground Digital ground 16 MDP2 Output MIPI TX data lane 2 positive output 17 MDN2 Output MIPI TX data lane 2 negative output 18 DGND Ground Digital ground 19 MDP0 Output MIPI TX data lane 0 positive output 20 MDN0 Output MIPI TX data lane 0 negative output 21 DGND Ground Digital ground 22 MCP Output MIPI TX clock lane positive output 23 MCN Output MIPI TX clock lane negative output 24 DGND Ground Digital ground 25 MDP1 Output MIPI TX data lane 1 positive output 26 MDN1 Output MIPI TX data lane 1 negative output 27 DGND Ground Digital ground 28 MDP3 Output MIPI TX data lane 3 positive output 29 MDN3 Output MIPI TX data lane 3 negative output 30 DGND Ground Digital ground



Electrical Characteristics

1. Absolute Maximum Ratings

2. DC characteristics

Item Symbol Ratings Unit notes

Supply voltage (analog) VANA -0.3 to +3.3 V

refer to Vss level

Supply voltage (digital) VDIG -0.3 to +1.8 V

Supply voltage (interface) VIF -0.3 to +3.3 V

Input voltage (digital) VI -0.3 to +3.3 V

Output voltage (digital) VO -0.3 to +3.3 V

Guaranteed Operating temperature TOPR -20 to +70 ˚C

Guaranteed storage temperature TSTG -30 to +80 ˚C

Guaranteed performance temperature TSPEC -20 to +60 ˚C

Item Pins Symbol Conditions Min. Typ. Max. Unit

Supply voltage

VDDSUBD

VANA 2.6 2.7 2.9 V

VDDHCM1,2

VDDHSN1,2,3

VDDHAN

VDDHCP

VPI1,2 *1)

VDDLCN1,2VDIG 0.9 1 1.15 VVDDLSC1,2,3,4,5,6,7,

8,9,10,11,12,13VDDLIO1,2

VDDMIO1,2,3,4,VDD

MMD1

VIF 1.7 1.8 1.9 V

Digital

input voltage

SDAVIH 0.7VIF 2.9 V

SCL

VIL -0.3 0.3VIF V

Digital input

voltage

XCLR

(XSHUTDOWN)

VIH 0.65VIF VIF + 0.3 V

INCK (EXTCLK) VIL -0.3 0.35VIF V

Digital

output voltage

SDAVOH VIF-0.4 V

SDO

VOL 0.4 VNote: 1) Applies only in case VPI1, 2 are externally applied (register setting is required)



a. Master Clock Waveform Diagram

INCK (EXTCLK) Square Waveform Input Specifications Input specifications are shown below when square-wave si(EXTCLK).

Master Clock Square Waveform Input Characteristics

3. Current consumption and standby current

4. AC Characteristics

(30 frame/s，VANA = 2.7 V，VDIG = 1.0 V，VIF = 1.8 V，Tj = 60 ˚C)

Item Symbol Min. Typ. Max. Unit Remarks

Current consumption(analog) IANA 39.2 44.7 mA

Current consumption(digital) IDIG 76.7 140.3 mA DPC, HDR, LNR, CNR function off

Standby current(analog) ISTBANA 43.1 µA

XCLR (XSHUTDOWN) : Low fixedINCK (EXTCLK) :stop

Standby current(digital) ISTBDIG 58.2 mA

XCLR (XSHUTDOWN) : Low fixedINCK (EXTCLK) :stop

Standby current (IF) ISTBIF 48.7 µAXCLR (XSHUTDOWN) : Low fixedINCK (EXTCLK) :stop

twh

twl

tp

0.5VIF

0.65VIF

0.35VIF

PARAMETER Symbol Min. Typ. Max. Unit

INCK (EXTCLK) clock frequency fSCK 6 27 MHz

INCK (EXTCLK) clock period tp 37 166.7 nsINCK (EXTCLK) low level width twl 0.4tp 0.6tp nsINCK (EXTCLK) high level width twh 0.4tp 0.6tp ns

INCK (EXTCLK) jitter Tjitter 600 ps

INCK (EXTCLK) Sine Waveform Input Specifications

IMX214 does not support the “AC coupled connection”.Therefore, there is no description of AC characteristics



2-wire serial communication block AC specification

2-wire serial communication block specification

b. 2-wire serial communication block characteristics

2-wire serial communication characteristics are shown below.

SDA

SCL

tBUF

tR tF

tLOW

tSUDAT

tHIGH tHDDAT

tHDSTA

tSUSTAtHDSTA

tSUSTO

StopCondition

RepeatedStart

ConditionStart

Condition

Parameter Symbol Conditions Min. Max. Unit

Low level input voltage VIL -0.3 0.3VIF V

High level input voltage VIH 0.7VIF 2.9 V

Low level output voltageVOL1 VIF > 2 V,Sink 3 mA 0 0.4 V

VOL2 VIF < 2 V,Sink 3 mA 0 0.2VIF V

High level output voltage VOH VIF - 0.4 V

Output fall time tofLoad 10 pF – 400 pF,

0.7 VIF→0.3 VIF 250 ns

Input current II 0.1 VIF→0.9 VIF -10 10 μA

SDA I/O capacitance CI/O 8 pF

SCL Input capacitance CI 6 pF

Parameter Symbol Min. Max. UnitSCL clock frequency fSCL 0 400 kHz

Rise time (SDA and SCL) tR ― 300 ns

Fall time (SDA and SCL) tF ― 300 ns

Hold time (start condition) tHDSTA 0.6 ― μs

Setup time (rep.-start condition) tSUSTA 0.6 ― μs

Setup time (stop condition) tSUSTO 0.6 ― μs

Data setup time tSUDAT 100 ― ns

Data hold time tHDDAT 0 0.9 μs

Bus free time between Stop and Start condition tBUF 1.3 μs

Low period of the SCL clock tLOW 1.3 μs

High period of the SCL clock tHIGH 0.6 μs



a. Power on sequence

Start up sequence with 2-wire serial communication (external reset)

Start up sequence timing constraints (2-wire serial communication mode with external reset)

5. Timing Specifications

VANA(2.7V)

CCI

INCK

Streaming (Active)Software StandbyPower OffHardwareStandby

T1

T6

CLK+/-

Data1 +/-

Data2 +/-

LP10

LP10

LP10

LP11

LP11

LP11

T10 T11

T8

VIF(1.8V)

T7 T9

Data3 +/-

Data4 +/-

LP10

LP10

LP11

LP11

VDIG(1.0V)

T2

XCLR(External)

T4

T3

T5

Item Label Min. Max. Unit CommentVANA rising – VANA on T1

VANA and VDIG and VIF may rise in any order.

μs Slew rata of VANA, VDIG and VIF (0%-100%)：max100mv/us

VDIG rising – VDIG on T2 μsVIF rising – VIF on T3 μsVANA and VDIG and VIF rising–XCLR rising T4 0 μs Later of T1, T2, T3

INCK start – XCLR rising T5 0 Μs

XCLR rising till CCI Read Version ID register wait time T6 1 ms

XCLR rising till Send Streaming Command wait time(To complete reading all parameters from NVM)

T7 10.3 ms

T8

3.8 ms + The delay

of the coarseintegration

timevalue +32H

Entering Streaming Mode – First Frame Start Sequence of good quality frame in first powerupincluding initialization delays. All frames outputted shall have good quality.

T9 T8 + 1Frame Frames

DPHY power up T10 1 1,1 ms

DPHY init T11 100 110 us

Note) ◆ XSHUTDOWN needs to be Low until all power supplies complete power-on



Cinstrains of INCK

Constrains of XCLR XCLR must remain low when VIF (IOVDD) is off.

VANA(2.7V)

CCI

INCK

Streaming (Active)Software StandbyPower OffHardwareStandby

T1

CLK+/-

Data1 +/-

Data2 +/-

LP10

LP10

LP10

LP11

LP11

LP11

VIF(1.8V)

Data3 +/-

Data4 +/-

LP10

LP10

LP11

LP11

VDIG(1.0V)

T2

XCLR(External)

T3

T6

T10 T11

T8T7 T9

VANA

XCLR

CCI

INCK

Software StandbyPower Off HardwareStandby

VDIG

VIF

NG

* Power on slew rate of any power line shall not be slower than 7mV/usec if INCK is present during Power Off.



b. Power down sequence Power down sequence with 2-wire serial communication (external reset)

Power down sequence timing constraints (2-wire serial communication mode with external reset)

VANA

XCLR

CCI

INCK

VDIG

CLK+/-

Streaming（Active） Software Standby Power OffHardware Standby

T3

T1 : > 0

T2

LP11

LP11

LP11

LP00

LP00

LP00

Data1 & 2 +/-

Data3 & 4 +/-

VIF

Entering SW-standby*

Item Label Min. Max. Unit CommentInternal POR negedge - VANA (VDIG or VIF) fall T1 0 ns

Sequence free of VANA falling and VDIG falling and VIF falling T2, T3

VANA and VDIG and VIF may fall in any order.

ns

Constrains of XCLR XCLR must remain low when VIF (IOVDD) is low.

VANA

XCLR

CCI

INCK

VDIG

Streaming（Active） Software Standby Power OffHardware Standby

VIF

NG



6. One time programmable memory (OTP) The IMX214 supports a maximum of 8K bits of one-time programmable (OTP) memory to store chip identification and manufacturing information. The concrete contents of OTP include ID, AWB, and LSC. For the detail procedure of load OTP, please contact our FAE for more assistance. Note: For more information of sensor please refer to the IMX214 specification.



7. VCM Specification NO. Item Condition Specification

1 Motor Size Without label & terminal 8.5*8.5*3.6mm

2 Rated Current Nominal ≤100mA

3 Coil Resistance The standard evaluation conditions between two terminal 21ohm±3ohm

4 Rated Stroke 90mA input current and optical axis is upward ≥0.25mm 8. Driver IC Specification a. Absolute maximum ratings



b. Electrical Specification



c. I2C timing



d. I2C device address,Start and Stop condition



Mechanical Drawing

1/1

注

1.带*号尺寸为关键尺寸;

2.IICaddress:0x20(write),0x21(read)；

3.PowerSupply:AVDD----2.7

+0.2-0.1

V，

DOVDD---1.8±

0.1V，

DVDD----1.0

+0.15-0.1

V，

AF_VDD--2.8V；

4.红外截止滤光片采用蓝玻璃材质；

5.DriverIC：AD5823;VCM:ATMC1Z501A

3120

镜头保护膜

+-

弯折区加强胶

0.80

MA

X.

4208

AGND

AVDD

AGND

AF_VDD

DVDD

DOVDD

AF_EN

SDA

SCL

NC(PWDN)

MCLK

DGND

RESET

ID(DGND)

DGND

MDP2

MDN2

DGND

MDP0

MDN0

DGND

MCP

MCN

DGND

MDP1

MDN1

DGND

MDP3

MDN3

DGND

ELCO

14-5804-030-000-829+

（普通拍摄状态）

（微距拍摄状态）

(模组本体高度)

单面带胶导电布

T=0.05mm (含导电布)

弯折区

底部露铜

接地处理



Appearance Specification NO. Item Standard Importance Class

1 Top side of Lens

1.No obvious impurity and No feeling nick defect and oil impurity on the surface of lens within 1/2 area; 2.there is no chip or crack on the lens at another 1/2 area

A

2 Screw glue

Normally screw glue shall be symmetrical distributed around lens circle side. Particular circs, glue distribution must not disturb customer’s assembly operation.

A

3 Sealed glue

Sealed glue distributing between holder and FPC must be symmetrical and smooth. Not allow glue leakage and asymmetric thickness. After holder assembly, the thickness distance between one side and its opposite side shall be less than 0.2mm. Excess glue over the holder shall not make the outside dimension be out of control.

A

4 FPC/PCB

Edge defect limitation: width≤1/2H (H is minimum.)、length≤1mm、defect numbers per edge≤2(No tearing gap inby edge for FPC); Edge outshoot limitation (width≤0.3mm, length≤1mm). No obvious impurity and crease on the surface. If there was shield film on the surface, the spot size of the film shall be less than 0.3mm×1mm and no line is exposed. If it was not be cleaned and did not influence the total thickness, it would be permitted. Label and mark shall be clear enough to be discerned.

A

5 Connector No dust, fingerprint, and not allows to turning colors, distortion; Solder must be well; No open circuit or short circuit.

A

6 Protective film No dust in the glue side. Not allows to float or drop. B



Image Specification NO. Item Standard

1

TV Line

Center≥2000 0.7 viewing field ≥1400

2

Blemish

Full screen IC Blemish: Contrast>10%, Pixel number≤4*4 IR Blemish: Contrast>1.0%, Pixel number≤125*125

3

Distortion

TV Distortion≤2%



Precautions for Using CCM Modules

Handing Precautions —DO NOT try to open the unit enclosure as there is no user-serviceable component inside. To

prevent damage to the camera module by electrostatic discharge, handling the camera module only after discharging all static electricity from yourself and ensuring a static-free environment for the camera module.

—DO NOT touch the top surface of the lens. —DO NOT press down on the lens. —DO NOT try to focus the lens. —DO NOT put the camera module in a dusty environment. —To reduce the risk of electrical shock and damage to the camera module, turn off the power before

connect and disconnect the camera module. —DO NOT drop the camera module more than 60 cm onto any hard surface. —DO NOT expose the camera module to rain or moisture. —DO NOT expose the camera module to direct sunlight. —DO NOT put the camera module in a high temperature environment. —DO NOT use liquid or aerosol cleaners to clean the lens. —DO NOT make any charges or modifications to the camera module. —DO NOT subject the camera module to strong electromagnetic field. —DO NOT subject the camera module to excessive vibration or shock. —DO NOT impact or nip the camera module with speculate things —DO NOT alter, modify or change the shape of the tab on the metal frame. —DO NOT make extra holes on the printed circuit board, modify its shape or change the positions of

components to be attached. —DO NOT damage or modify the pattern writing on the printed circuit board. —Absolutely DO NOT modify the zebra rubber strip (conductive rubber) or heat seal connector —Except for soldering the interface, DO NOT make any alterations or modifications with a soldering

iron. —DO NOT twist FPC of CCM.



Precaution for assemble the module with BTB connector: Please note the position of the male and female connector position, don’t assemble or assemble like

the method which the following picture shows



Precaution for assembling the module to terminal unit The temperature of running module is high base on the high-integrated sensor. In order to enhance the heat dissipation and reduce the noise infection from high temperature, TRULY recommend that the module’s backside should be touched with rigid material directly, like as PCB or metal. If necessary, it’s recommended the module backside is affixed with the materials which can transfer heat, like as electric-fabric, electric-adhesive, or electric-sponge.

Precaution for soldering the CCM:

Manual soldering Machine drag soldering Machine press soldering

Non-RoHS product

290°C ~350°C Time: 3-5s

330°C ~350°C Speed: 4-8mm/s

300°C ~330°C Time: 3-6s Press: 0.8~1.2Mpa

RoHS product

340°C ~370°C Time: 3-5s

350°C ~370°C Speed: 4-8mm/s

330°C ~360°C Time: 3-6s Press: 0.8~1.2Mpa

(1) If soldering flux is used, be sure to remove any remaining flux after finishing to soldering

operation. (This does not apply in the case of a non-halogen type of flux.) It is recommended that you protect the lens surface with a cover during soldering to prevent any damage due to flux spatters.

(2) The CCM module and board should not be detached more than three times. This maximum number is determined by the temperature and time conditions mentioned above, though there may be some variance depending on the temperature of the soldering iron.



Other precautions

For correct using please refer to the relative criterions of electronic products. Limited Warranty Unless agreed between TRULY and customer, TRULY will replace or repair any of its CCM modules which are found to be functionally defective when inspected in accordance with TRULY CCM acceptance standards for a period of one year from date of shipments. Cosmetic/visual defects must be returned to TRULY within 90 days of shipment. Confirmation of such date shall be based on freight documents. The warranty liability of TRULY limited to repair and/or replacement on the terms set forth above. TRULY will not being responsible for any subsequent or consequential events. Return CCM under warranty

No warranty can be granted if the precautions stated above have been disregarded. The typical examples of violations are: -Holder is apart from module. -Holder or Connector is anamorphic. -Connector is turn-up. -FPC is lacerated or discon-nexion, and so on.

Module repairs will be invoiced to the customer upon mutual agreement. Modules must be returned with sufficient description of the failures or defects. Any connectors or cable installed by the customer must be removed completely without damaging the PCB eyelet, conductors and terminals.



Package Specification Packaging Design One

Product No. CM9953-B1300BA-E Release date

Product name Compact Camera Module Releaser

Supplier TRULY OPTO-ELECTRONICS LTD. Recycle □YES ■NO Quantity/ each box TBD Material for box ■paper □plastic

Outer carton box size 405mm*290mm*290mm

Quantity / inner box * Quantity / outer box

TBD

Box type ■new □update

Packing Standards:

Requirements of outer carton box :

1．Weight(Max): TBD Kg 2．Height (Max): 0.29 M 3．Prohibition: Box made by log

Material for Plastic tray

It is made of antistatic polystyrene which has no chemical pollution. Surface resistivity : 106 ohm/sq

There are TBD PCS modules in each plastic plate.

There are TBD

PCS modules in each inner carton box.

There are 4 inner

carton boxes in each outer carton box.



Packaging Design Two

Product No. CM9953-B1300BA-E Release date

Product name Compact Camera Module Releaser

Supplier TRULY OPTO-ELECTRONICS LTD. Recycle □YES ■NO Quantity/ each box TBD Material for box ■paper □plastic

Outer carton box size 405 mm *290 mm *170 mm

Quantity / inner box * Quantity / outer box TBD

Box type ■new □update

Packing Standards:

Requirements of outer carton box :

1．Weight(Max): TBD Kg 2．Height (Max): 0.17 M 3．Prohibition: Box made by log

Material for Plastic tray

It is made of antistatic polystyrene which has no chemical pollution. Surface resistivity : 106 ohm/sq

There are TBD PCS modules in each plastic plate.

There are TBD

PCS modules in each inner carton box.

There are 2 inner

carton boxes in each outer carton box.



Prior Consult Matter 1.①For Truly standard products, we keep the right to change material, process for improving the

product property without notice on our customer. ②For OEM products, if any change needed which may affect the product property, we will consult

with our customer in advance. 2. If you have special requirement about reliability condition, please let us know before you start the

test on our samples. Factory Contact Information FACTORY NAME: TRULY OPTO-ELECTRONICS LTD. FACTORY ADDRESS: Truly Industrial Area, ShanWei City, GuangDong, China URL: http://www.trulyopto.com

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SPECIFICATION - TRULY AMERICA · CAMERA MODULE CM9953-B1300BA-E Version :0.1 Sep 1, 2014 TRULY...

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