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SPICE Analysis of Low-Loss Control IC-Power MOSFET
Chipset for High-Frequency DC-DC Converter Design
Jeff Berwick, John Huang,
Wayne Grabowski and Richard K. WilliamsSiliconix, Inc
Intusoft, IncCharles Hymowitz and Steve Sandler
Overview:
High frequency power supply design Motivation and Challenges Methodology: Having the right tools for the job
Selecting a MHz-range MOSFET Use of the “power loss curve” Performance of the new Si6801 high speed
complementary power MOSFET pair
Overview (Continued) System Modeling in IsSpice
The new Si9145 controller macromodel Detailed modeling example Behavioral modeling example
1MHz Buck simulation schematic
Simulation Results Startup Step Response Efficiency
Conclusions
High Frequency Challenges:
Efficiency Decreases MOSFET selection is more difficult Layout Parasitics are critical Measurements are limited PC Breadboard modifications are difficult
Better Design Tools are Needed
1MHz SMPS Design Tools
Power Loss Curve For MOSFET Selection Gate Charge and RDSON determine efficiency
IsSpice For System Design & Evaluation IsSpice Models for Power FETs, Control IC
PC Breadboarding for Calibration & Tuning
Selecting a MOSFET Power Switch Loss vs. VGS :
P = I2RMS RDS D + QG VGS f
Si6801 Power Loss, QG, RDS vs VGS
0
5
10
15
20
25
30
35
40
0 1 2 3 4 5 6 7VGS
Po
we
r L
os
s (
mW
)
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
RD
S O
N (
Oh
ms
)
RDS ONQG
1MHz
1.4 MHz
500 KHz
Ga
te C
ha
rge
(n
C)
3
0
12
6
9
Si6801 Power Loss, QG, RDS vs VGS
0
5
10
15
20
25
30
35
40
0 1 2 3 4 5 6 7VGS
Po
we
r L
os
s (
mW
)
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
RD
S O
N (
Oh
ms
)
RDS ONQG
1MHz
1.4 MHz
500 KHz
Ga
te C
ha
rge
(n
C)
3
0
12
6
9
MOSFET Loss Comparison
Technology Comparison: 1 MHz Power Loss
10
20
30
40
50
1 2 3 4 5 6 7
VGS
Co
nd
uc
tio
n +
Ga
te C
ha
rge
L
os
s (
mW
)
Si6801: High Frequency
Si6552: Low VT
Si6542: Conventional
Technology Comparison: 1 MHz Power Loss
10
20
30
40
50
1 2 3 4 5 6 7
VGS
Co
nd
uc
tio
n +
Ga
te C
ha
rge
L
os
s (
mW
)
Si6801: High Frequency
Si6552: Low VT
Si6542: Conventional
Si6801 High Frequency MOSFET: Maximum Gate Bussing Reduces Distributed RG
System Modeling in IsSpice
Power MOSFET Models with accurate QG
Pulse-by-pulse Controller Model Detailed models for output stages Behavioral models for digital functions
Passive Component Models Nonlinear Magnetics Capacitors with ESR
PC Board Parasitics: R,L,C
Si9145 Controller Macromodel
BehavioralLogic
Detailed Output Stage
Si9145/Si6801 Pch Switching Speed
2
1
33.50U 33.55U 33.60U 33.65U 33.70U
WFM.1 V(22) vs. time in
6.000
4.000
2.000
0
-2.000
V(2
2) in
V
olts
6.000
4.000
2.000
0
-2.000
V(4
2) in
V
olts
DrainGate
DrainGate
18nS
Measured
Simulated
18nS
Variable Delay Comparator Model
IDEAL COMPARATOR
DIFFERENCE: K(V1 - V2) ABS
VARIABLE RES
VIN
VOUT
IsSpice Results: Delay vs. O.D.
100N 300N 500N 700N 900N
COMP DELAY vs. OVERDRIVE
TIME (SEC.)
0
3V
-VIN
+VIN
VOUT
100mV 10mV500mV
+/- Overdrive:
1MHz Sync Buck Schematic
Non-linear Magnetics
ESR
Input
Output
Si9145
Si6801
IsSpice Transient Simulation Results
Measured vs. Simulated: Startup transient Step response Steady-state efficiency
Si9145 Oscillator Startup
0 100uS 200uS
Measured
Simulated
300mA Load Step Response:
Measured
Simulated
0 100uS50uS
Measured
Simulated
MultilayerCeramic
COUT(25m ESR)
TantalumCOUT
(500m ESR)
Vertical: 100mV/DivHorizontal: 10uS/Div
Steady-State Efficiency AnalysisSi9145/Si6801 Simulated vs. Measured Efficiency @ Vin = 4V
60
65
70
75
80
85
90
95
100
0 200 400 600 800 1000
Output Current (mA)
Eff
icie
ncy
%
IsSpice4
Measured
Simulated Input Power Partitioning % Power loss vs. Input power @ Vin=4V
Conclusions:
High Frequency shifts design challenge MOSFET selection requires RDS and QG Parasitics affect performance critically
Power Loss partitioning depends on ILOAD
Low ILOAD emphasizes gate loss, bias currents High ILOAD emphasizes switch RDS, RWINDING
Pulse-by-pulse simulation is now practical