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spo-comm spo-book RUGGED Q170 Passiv gekühlter Industrie PC // Intel® Core i5 Skylake Passively cooled Industrial PC // Intel® Core i5 Skylake CPU Intel® Core i5-6500TE 4 x 2,3 GHz (max. 3,3 GHz) Chipset Intel® Q170 RAM max. 32768 MB SO-DDRIV RAM GPU Intel® HD Graphics 530 Storage 2 x 2,5‘‘ SATA III HDD or SSD (RAID 0,1) ODD no Expansions W-LAN, 4G-Modul, PoE, 4 x Gigabit LAN, GPS Dimensions (H x W x D) 79 x 240 x 226 mm Weight ca. 4,0 kg Power Consumption Standby: < 1 Watt Idle: ca. 22 Watt Full Load: ca. 70 Watt Power Source externes Netzteil / external power adapter 220V auf 24V / 9,2 A Cooling keine Lüfter / fanless solution VESA / Wall Mount no/yes Material Metall / Metal Availability Langzeitverfügbarkeit / long term availability Application Industrial Control,Vehicle Solutions, Networking Environment -40° C bis 70 ° C at 0%-95% rel. hum. (SSD) Warranty 2 Jahre / years (bis zu / up to 5 Jahre / years) Frontpanel 4 x USB 3.0 4 x Gigabit LAN (PoE optional) 1 x Extension Module, 2 x SIM Card Slot Backpanel 4 x COM (4 x RS-232/422/485) 1 x GPIO 3 x Audio 1 x VGA 2 x DP 1 x external Remote/IGN connector Certificates CE, FCC Website Specification // Technische Daten
