¢ ¢ ¢ ¢ ¢ ¢ ¢ Three indenpentend cuvettes for the work steps „Developing - Rinsing - Etching“ Self-lance motors (DC-motor) for optimum etching Acrylic glass tanks, each of them is emptied individually by drain tabs Adjustable heating element (glass heater), temperature range +36°C - +48°C Adjustable plate holder of plastic rails for receiving the printed circuit boards Control box with power supply for DC-motors at rear side Drip pan mode of PVC plastic, and glass thermometer The spray etching devices extend the range of our etching machines to a device for professional use. Unlike the basic etching machine 1 and 2, the etching liquid is sprayed by spray pipes directly to the board. This achieve a very fast and precise etching. Thus, the device is particularly suitable for laboratory and small batch production. The device consist of a frame which fix three acrylic glass cuvettes. Each cuvette is emptied individually. The different cuvettes are provides for the single work steps „Developing - Rinsing - Etching“ of making PCB boards. For power the DC motors and for control the heater, a separate control box is mounted at the rear side of the device. Due to clear acrylic cuvettes, the etching is always under control. www.gie-tec.de Item no. 141070 0000 141071 0000 Technical data Dimension (WxDxH) 600 x 330 x 420 mm Amount of fluid: Etching cuvette Requirement Sodium Sodium hydroxide PCB dimension max. PCB technology single side double side Heating element Heating time Power supply 6V / 25VA 6V / 40VA Self-lance motors 2x 7W 4x 7W Net weight ca. 11,5 kg ca. 12,0 kg Total weight ca. 30 kg ca. 30 kg Cuvette 1 Cuvette 2 approx. 5 l approx. 5 l approx. 4 l approx. 1000g in 4 liter of water approx. 20 g in 1 liter of water 380 x200 mm 150 W (glass heater) approx. 30 min Spray Etching Device 2 (for double-side etching) Item no.: 141071 0000 Spay Etching Device1 (for single-side etching) Item no.: 141070 0000 Spray Etching Device Reserve technical changes l l l l Gie-Tec GmbH An der Schlierbach 18 D-36132 Eiterfeld Tel.: 0049 6672 869794 30 E-Mail:[email protected]
Transcript
¢
¢
¢
¢
¢
¢
¢
Three indenpentend cuvettes for the work steps „Developing - Rinsing - Etching“
Self-lance motors (DC-motor) for optimum etching
Acrylic glass tanks, each of them is emptied individually by drain tabs
Adjustable heating element (glass heater), temperature range +36°C - +48°C
Adjustable plate holder of plastic rails for receiving the printed circuit boards
Control box with power supply for DC-motors at rear side
Drip pan mode of PVC plastic, and glass thermometer
The spray etching devices extend the range of our etching machines to a device for professional use. Unlike the basic etching machine 1 and 2, the etching liquid is sprayed by spray pipes directly to the board. This achieve a very fast and precise etching. Thus, the device is particularly suitable for laboratory and small batch production.The device consist of a frame which fix three acrylic glass cuvettes. Each cuvette is emptied individually. The different cuvettes are provides for the single work steps „Developing - Rinsing -Etching“ of making PCB boards.For power the DC motors and for control the heater, a separate control box is mounted at the rear side of the device.Due to clear acrylic cuvettes, the etching is always under control.
ww
w.g
ie-t
ec
.de
Item no. 141070 0000 141071 0000
Technical data
Dimension (WxDxH) 600 x 330 x 420 mm
Amount of fluid:
Etching cuvette
Requirement Sodium
Sodium hydroxide
PCB dimension max.
PCB technology single side double side
Heating element
Heating time
Power supply 6V / 25VA 6V / 40VA
Self-lance motors 2x 7W 4x 7W
Net weight ca. 11,5 kg ca. 12,0 kg
Total weight ca. 30 kg ca. 30 kg
Cuvette 1
Cuvette 2
approx. 5 l
approx. 5 l
approx. 4 l
approx. 1000g in 4 liter of water
approx. 20 g in 1 liter of water
380 x200 mm
150 W (glass heater)
approx. 30 min
Spray Etching Device 2(for double-side etching)
Item no.: 141071 0000
Spay Etching Device1(for single-side etching)
Item no.: 141070 0000
Spray Etching Device
Reserve technical changes
l l llGie-Tec GmbH An der Schlierbach 18 D-36132 Eiterfeld Tel.: 0049 6672 869794 30 E-Mail:[email protected]
5
4
7
861 2
3
9
Level of Etchant
ww
w.g
ie-t
ec
.de
The spray etching device is mounted completely by Gie-Tec. Only the top plates has to be mount.Place the spray etching device into the catch basin. Place the device on a horizontal, stable and acid-proof table. The working area should be ventilatable and well illuminated!
1. Start-up1.1 Placement
ATTENTION! DANGER!
1.3 Handling of the board holder
For adjust different board sizes, loosen the screws of the board holder below the handle strip (8). In case of single-side boards, you can double the holding capacity by clambing the boards back-to-back (by using device #141070 0000).
If you do not tighten the screws, you can shift the strips easily without need a tool. For larger boards, remove the middle strip.
8
l
l
l
l
l
l
l
l
l
l
l
The spray eching device can be used for etching printed circuit boards and metal foils of various sizes.Any other use of the device is not permitted.
The device is designed for power supply AC 230V (50- 60Hz) and may used only in perfect technical condition.Using the etching device it is not allowed by children and people which are not instructed.
The basis of the etching device (table, work bench) is supposed to be horizontally, stable, resistant to chemicals and easy to clean.The area in which the devices are used should be well illuminated and ventilatable.Not required tools, devices or components are to be kept away from the working area.
Eating, drinking and smoking are strictly prohibited!
Keep devices and chemicals out of the range of children and foods.Store not required chemicals in the original container in a dry place.
Assembly and using of the device has to be done only according the declaration of conformity.
Carry corresponding protective clothing (acid and alkal-proof protection gloves, protective goggles, overall or apron) when applying the bath or when working with the device.
The device must not exposed to high humidity, strong vibrations or explosive gas.
Keep this manual careful. Personnal working at this equipment has to be instructed about the dangers.If you don´t provide this manual, loss of property or risk of injury may happen.
Pay attention to the disposal remarks for waste materials.
Never pour water on the etching granulate! First fill the cuvettes with water and after add granulate, then mix the liquid.
4 Trip tray (PVC)
5 Glass heater, 150W
6 Self-lance motor
7 Drain cock
1 Developer fluid tank
2 Tank for rinsing water
3 Etching fluid tank
8 PCB fixture
9 Thermometer
l l llGie-Tec GmbH An der Schlierbach 18 D-36132 Eiterfeld Tel.: 0049 6672 869794 30 E-Mail:[email protected]
Reserve technical changes
1.3 Mounting the top plates
1
2
3
4
1 PVC handle bar
2 4 square nut M3
3 PVC plate
4 Screws M3x8
ww
w.g
ie-t
ec
.de
The high-power DC motors do have a high inrush current. To switch ON the DC motors you have to press the „Start“ button for about 5 seconds.
The power supply of the heating element (glass heater) is controlled by the power switch of the DC motors. By this, the heater will be switched ON only, if the self-lance (spray-pipes) motors are ON.
The level of the etching liquids has to be about 10mm above the plastic plate inside the cuvette, at every time.
Make sure, that the glass heater is always below the liquid level. Otherwise the glass heater may burst.
1.4 Power supply of Spray Etching Machine
For power supply the self-lance motors (DC-motor) a primary switched power supply is mounted at the rear side of the device. The plastic housing of the power supply includes further 3x switches and a fuse (primary voltage).
Function of the switches:
Power switch of the self-lance motors
„Start“ switch for starting the DC motors.
Power switch of the glass heater
Main fuse
1
2
3
41 2 3 4
For etching, we recommend only our sodium persulfate. This etching medium is odorless, clear, and pollutes the device only insignificantly.Further sodium persulfate has the positive feature to get blue if solution is saturated. It achives etching times of 6-8 minutes at 40-45°C. The etching speed is between 4 to 7µm/min with a copper reception of approx.: 30g/l.
- Fill the cuvette with water ( about 4 liter) - Add the etching granulate (1000g Sodium persulfate) slowly and stir in the water.
Preparing the etching solution:
The etching device is not suitable for ferrous chloride as an etchant!In case of using other etching chemicals, we can not take over any guarantee for the function of the device since these chemicals may disolve the glue of the glass cuvette and let damage the cuvette.
1.5.1 Etching bath ATTENTION!
Never pour water on the etching granulate! First fill the cuvettes with water and after add granulate, then mix the liquid.
Sodium hydroxide is a heavily caustic lye and reacts under violent heat development if the granulate has contact with water!
Note all safety references and wear protective clothing
ATTENTION!
ATTENTION
Carry corresponding protective clothing (acid and alkal-proof protection gloves, protective goggles, overall or apron) when applying the bath or when working with the device.
At skin contact, rinse immediately with lukewarm water and soap.
A solution of 50g of sodium hydroxide (etching sodium bicarbonate) is needed for delopment in 5 liters of water.Store the prepared solution until the granulate has been completely dissolved. The prepared solution is a soda lye of approx. 1%.
The bath is useless, if a development time of more than 7 minutes is needed, it has to be renewed
1.5.2 Developer bath
l l llGie-Tec GmbH An der Schlierbach 18 D-36132 Eiterfeld Tel.: 0049 6672 869794 30 E-Mail:[email protected]
Reserve technical changes
Reserve technical changes
1. Place the film (layout) on the glass plate of the exposure box (e.g. Gie-Tec #140007), the film shows upwards (avoiding of underexposure).
2. Remove the protection foil from the basic material and place the plate with the photosensitive coated side on the film.
3. Align the board and the film and shut the lid of the exposure box.
4. Start the timer of the exposure box by press the turning knob and wait until the timer is count down to zero.The exposure time is between 1 and 5 minutes (depending on the sensitivity of the photosensitive coating)
2.1 Expose the PCB
ww
w.g
ie-t
ec
.de
Gie-Tec is producing different types of exposure boxes in dimension A4 and A3 and for single-side and double-side exposure.
Using a crystal clear layout foil, the exposure time of 1 minutes leads good results.Pay attention that the film at the glass plate of the exposure box is fixed in that way, the printed side is up and by this near to the photosensitive side of the PCB.This reduce miss exposure (undercut) of very thin line.
For developing the exposed PCB, clamp the board into the board holder and hang in the developer bath (1% soday lye bath). The bath temperature should have a temperature of 20-25°C.You can observe well that the photo-sensitive coating, destroyed by the UV-light, is removed. If you want to accelerate the development, you can move the board at times or work on with a brush.The development procedure is concluted if the exposed areas stand out with the copper brigthly shining (the layout is still covered by the photosensitive coating).
2.3 Developing
1.6 Adjustment of the temperature of the etching bath
The temperature control of the heating element mounted inside the etching cuvette is adjusted at about 45°C.Make sure, that the liquide level always is higher than the plastice plate and by this the glass heater. If you need to change the temperature of the glass heater, you have to emptied the cuvette first. Than please demountthe top plate of the device and take out the plastic plateon which the glass heater is mounted.
To adjust the temperature please turn the knob to maximum (+). While the temperature of the etchant is rising, check the temperature of the etchant.
2. Etching1. Expose PCB 3. 4.2.
5.
Developerbath
Rinsing
Etchant
2 - 3 min approx. 6 - 12 min
Never switch ON the glass heater without the self-lance motors are active. Otherwise the glass heater may damaged (Overtemperatur).
To make sure, that the spray-pipe motors are active before heater will be switched ON, the power switch of the motors “Sprührohrmotoren“ is controlling the power supply for the heater too.
ATTENTION!
Pay attention to the temperature of etching bath. Temperaure higher than +50°C may result in deformation of the acrylic tank and may damage the glass heater.
ATTENTION!
l l llGie-Tec GmbH An der Schlierbach 18 D-36132 Eiterfeld Tel.: 0049 6672 869794 30 E-Mail:[email protected]
Reserved technical changes
ww
w.g
ie-t
ec
.de
Attention!
Make sure that during etching process the cuvette slits always are covered.
Never take away the cuvette slit during etching.
The removing of the copper is performed by using sodium persulfate.The etching fluid is sprayed to the surface of the boards by spray-pipes. Thus a short and precise etching result is given.
The optimum temperature of the etching bath is about 45°C. To heat up the bath, please shut the slot of the top plate of the cuvette and switch the DC motors of the spray-pipes ON and then the glass heater too. Check whether the liquid level is higher then the plastic plate inside the etching cuvette!
As far the bath temperature is reached hang the board holder with circuit boards into the etching cuvette.
You can interrupt the etching process by switching the DC-motors OFF.
With a layer thickness of 35µm and fresh etching bath the removing of the copper lasts approx.: 5 to 10 minutes. Then take the PCB from the bath and rinse thoroughly in the middle cuvette with water.
2.4 Etching
1. Clean the produced boards of the remaining photo-sensitive coating. Therefore you can use a removal solution, 50g of sodium hydroxide per liter of water, or a solvent for this (spirit, acetone etc), or rub it off mechanically using a pot cleaner or a abrasive paper (grain size 240).
2. Rinsing the PCB under flowing water.
3. Finally you can use water-based immersing lacquer to protect the board against corrosion. Furtehr you are able to protect the board against corrosion in an immersing process using chemiacl tin or chemical silver.
2.5 Further handling of the board
2.3 Rinsing
Hang the board holder in the middle cuvette with water in and rinse the board by moving the holder shortly forth and back.
ATTENTION!
Keep away devices and chemical out of reach of children and foods!
The etchant is saturated, if the color of the etchant changes to deep blue and the etching time is more than 30 minutes. It has to be renewed.
The etching liquide can remain in the cuvette without losing it´s effect for a few days. Liquid losses due to evaporation can be compensated by fill with water.
ATTENTION!
According the water law of Germany (BGBI (186/1996) dated 19.04.1996), the remainder content of copper is limited to 0,5mg/l that may be dispose to the seewer.Because of new limits appointed by the goverment, it is suitable to inquire corresponding information of the appropriate government agencies.
Neutralize the sewage with developer remainders by adding sodium-persulfate solution (200g/l). Originally, the ph value of the developer solution is 13. By acidification to ph 11-12 and subsequent separation of their precipitation up to 90% of dissolved organic material of the consumed developer can be removed.
3.1 Sewage treatment of developer solution
The most effective operation for copper precipitation:1. Pour the consumed etching medium into a plastic container that takes about
four and a half times the amount of consumed solution.2. Then, prepare a soda lye (40g of sodium hydroxide/liter of water). Per liter of
consumend etching solution about three liters of soda lye are needed.3. Mix the soda lye slowly with the consumed etching solution until a ph value
of 11 is attained. 4. After about 2 hours rest time, the resulting deposited black mud and can be
filtered using a suitable filter (e. g. coffee filter).
The mud that stays behind the filter paper (copper hydroxide) has be treated as special waste.
3.2 Sewage treatment of etching solution
ATTENTION!
The disposal of the consumed etching solution may be carried out only in well ventilated areas. Use only containers made of PVC plastic or glass. At skin contact, rinse immediately with lukewarm water and soap.
l l llGie-Tec GmbH An der Schlierbach 18 D-36132 Eiterfeld Tel.: 0049 6672 869794 30 E-Mail:[email protected]
5. Spare parts
Glass heater, (150W)Item no.: 411186
Glas-Thermometer (0 - 50°C)Item no.: 411179
PCB holderItem no.: 149170 1000
Acrylic cuvette (small) Item no.: 141070 1001
Äcrylic cuvette (big)Item no.: 141070 1002
ww
w.g
ie-t
ec
.de
Self-lance with Dc-motorItem no.: 141070 1015
The described production of printed circuit boards and the handling of the chemicals corresponds to our best knowledge and should serve for your consultation.Since both the proper handling of the device and the handling of the chemicals is not subject to our influence, we can not take over any responsibility for resulting damages.
According the Machinery Directive (2006/42/EG), the Spray Etching Machine is a machine.Any changes of the device has to be done according the rules of the directive.
5. Conclusion
Trip tray (PVC)Item no.: 149199
Drain tabItem no.: 411199
Use only plastic container for storage etching fluid.
Make sure that no etching fluid get inside the safety valve. Running back etching medium destroys the maembrane pump.
Not required tools, equipment and parts take away from working area.Switch-off the device after use. Cover the cuvette with the board holder.
4. Maintenance and cleaning
According to the application frequency, you should regularly clean the etching device in order to guarantee a perfect working. This specially affects the part pump, connecting tube, board holder etc.
If necessary, remove chemicals residues following each use.
After a cuvette discharge, clean also the intrenal walls in order to keep the transparency of the device.
Before using the device checkthe liquid level of the etching bath.
For cleaning the cuvette you can use a wooden or PVC strip with a foam stripe on top (eg. Tesa Moll).
According the Machinery Directive (2006/42/EU), this device is a machine.
Any change of the device has be done according the rules of the directive.
Reserve technical changes
l l llGie-Tec GmbH An der Schlierbach 18 D-36132 Eiterfeld Tel.: 0049 6672 869794 30 E-Mail:[email protected]
ww
w.g
ie-t
ec
.de
ATTENTION!
Safety and risc!
Switch ON the DC-motors of the spray pipes only, when the unit is fixed in the top plate by the four mounting screws.
Safety:
Switch ON the DC-motors of the spray pipes only after the top plate of the spray etching machine is mounted and the cuvette is closed.
6. Declaration of conformity
Rotating spray lances can lead to injury!
ACHTUNG!
Etchant may escape from the etching tankand will be sprayed intoeyes or skin or clothes.
EC Declaration of Conformityin accordance with Machinery Directive 2006/42/EU
conforms with the requirements of the directive(s)- including any amendments valid at the time of declaration
ISO 9001:2008Quality Systeme:
Manufacturer:
The following harmonizedstandards were used:
..................................................... ..........................................................................Eiterfeld, den 05.01.2015
Place, Date Rainer Giebel, Managing Director, Gie-Tec GmbH
EN 60204-1 2006 Safety of machinery - Electrical equipment of machines
Spray Etching Machine 1Part no. 141070 0000
Reserved technical changes
l l llGie-Tec GmbH An der Schlierbach 18 D-36132 Eiterfeld Tel.: 0049 6672 869794 30 E-Mail:[email protected]
