SSD1000eR0

FILE 1

SERVICE MANUAL

ECHO CAMERA

SSD-1000

Document NumberDocument Revision

: MN2-0218: 0

Copyright

English Edition

1 / 1

MN2-0218SSD-1000 SERVICE MANUAL

1/4

Contents of SSD-1000 SERVICE MANUALPAGE

Section1 How to use this service manual page 1-11-4 (4 pages)

1-1 Service Manual 1- 11-2 Contents of this Service Manual 1- 11-3 Construction of This Service Manual 1- 11-4 Contents of Each Section 1- 2

Section2 PRECAUTIONS (read without fail) page 2-12-4 (4 pages)

2-1 Precautions Against Electrical Hazards to Serviceman 2- 12-2 Precautions Against Mechanical Hazards to Serviceman 2- 12-3 Precautions Against Germ Hazards to Serviceman 2- 12-4 Precautions for Keeping Electrical Safety 2- 22-5 Precautions for Keeping Mechanical Safety 2- 22-6 Precautions for Keeping Chemicals Safety 2- 22-7 Preparation to be Made at Service Center 2- 22-8 Care to be Taken in the Field 2- 32-9 Precaution for Monitor repairing 2- 32-10 Handling of S. M. D. PCBs 2- 4

Section3 BEFORE REPAIRING page 3-13-14 (14 pages)

3-1 Repair work on the description of Service Manual 3- 13-2 Upgrade (Improvement) work on the description of Service Manual 3- 63-3 Massages 3- 12

Section4 PRINCIPLE OF SYTSTEM OPERATION page 4-14-86 (86 pages)

4-1 System Specification 4- 14-2 System Configuration 4- 54-3 System Block Diagram 4- 54-4 Principle of System Operation 4- 11


2/4

4-5 Principle of each PCBs Operation 4- 204-5-1 PROBE SELECTOR 4- 204-5-2 TX / PRE AMP 4- 244-5-3 RX FOCUS 4- 284-5-4 MAIN AMP 4- 324-5-5 GEU I.T.F. 4- 364-5-6 DIU 4- 404-5-7 CPU 4- 504-5-8 CINE MANAGER & CINE MEMORY 4- 544-5-9 MECHA. SERVO 4- 604-5-10MECHA. PROBE SELECTOR 4- 664-5-11PHYSIO. AMP. 4- 704-5-12PHI (PHYSIO. MEMORY) 4- 764-5-13DMS ITF / VOL / SERVO 4- 82

Section5 SCHEMATICS page 5-15-60 (60 pages)

5-1 PSC-129 CABLE CONNECTION 5- 15-2 CBL15 CBL16 5- 35-3 CBL314 CBL317 CBL318 5- 55-4 CBL600 CBL601 5- 85-5 CBL800 CBL801 CBL803 5- 105-6 CBL804 CBL806 CBL807 5- 135-7 CBL301 CBL550 CBL754 5- 165-8 CBL802 5- 195-9 FOOT SWITCH 5- 205-10 L-KEY-64* 5- 215-11 GEU MOTHER BOARD 5- 335-12 DIU MOTHER BOARD 5- 375-13 AC OUTLET JB-212 5- 415-14 AC OUTLET JB-215 5- 425-15 CABLE CONNECTION FOR POWER SUPPLY 5- 435-16 TRANSFORMER UNIT (EU-6024) 5- 445-17 POWER STABILIZING UNIT (EU-6025) 5- 455-18 8 VOLTAGE REGULATOR 5- 465-19 MONITOR IP-1233B* 5- 495-20 PHYSIO UNIT EU-5042 5- 51


3/4

5-21 CABLE752 CABLE750 5- 525-22 CBL756, CBL758 & PHYSIO. PANEL 1 5- 545-23 CBL753 & PHYSIO. PANEL 2 5- 555-24 CBL302 CBL312 CBL320 5- 565-25 CBL805 5- 595-26 POWER CABLE FOR MO DRIVE UNIT 5- 60

Section6 TROUBLE SHOOTING page 6-16-82 (82 pages)

6-1 Introduction 6- 16-2 Precautions 6- 16-3 Tools and Measuring Instruments Required 6- 46-4 Information 6- 5

6-4-1Automatically Setting after Powering On 6- 56-4-2Setting Switches on the PCB 6- 56-4-3Usage of the Functions to be Set by the User 6- 76-4-4Attention of connecting optional units 6- 86-4-5Resetting the Backup Memory (RAM) 6- 96-4-6How to reset Backup RAM 6- 106-4-7Location of PCBs 6- 116-4-8Location of ROMs 6- 126-4-9Correction for fail to start or locking up 6- 156-4-10Minimum Start-up 6- 176-4-11 Preset Data Sheet 6- 20

6-5 Check List Map 6- 356-5-1Flow chart for the usage of Check List Map 6- 356-5-2Phenomenon Code Table 6- 376-5-3MAP 6- 446-5-4PCB Check Procedure 6- 50

6-6 Waveform for Troubleshooting 6- 71

Section7 ADJUSTMENT PROCEDURE page 7-17-4 (4 pages)

7-1 Introduction 7- 17-2 Attention 7- 17-3 Tools and Measuring Instruments 7- 17-4 Adjustment Procedure 7- 2


4/4

Section8 PERFORMANCE CHECK page 8-18-12 (12 pages)

8-1 Introduction 8- 18-2 Precautions 8- 18-3 Making Entries in Repair Report 8- 18-4 Performance check 8- 2

8-4-1Function Check 8- 38-4-2Image Quality Check 8- 88-4-3Safety Check 8- 10

Section9 DISASSEMBLING PROCEDURE page 9-19-42 (42 pages)

9-1 SSD-1000 Disassembling Procedures 9- 19-2 EU-9075 Installation Procedures 9- 299-3 DMS-1000 Installation Procedures 9- 35

Section10PARTS LIST page 10-110-46 (46 pages)

10-1Contents of Parts List 10- 110-2Appliance of Parts List 10- 210-3Outline of Parts List 10- 210-4Explanation of Parts List 10- 310-5Attention 10- 410-6Parts List 10- 5

Section11SERVICE INFORMATION page 11-111-4 (4 pages)

11-1Introduction 11- 111-2Assignment of CTRL key and those usage 11- 111-3A pop-up menu display for probe registration 11- 3

Appendix SSD-1000 SERVICE MANUAL Appendix pageApndx-1Apndx-22 pages

Appendix-1Introduction....................................................................... Apndx- 1

Appendix-2Manual Change Information.............................................. Apndx- 1

MN2-0218SECTION 1 How to use this service manual

1 - 1

1-1 Service Manual

1) This service manual has been prepared for persons in charge of repair at the field.

2) This service manual is compiled according to the following basic principle.For service, pickout a faulty PCB and replace it with a new PCB .

3) Make the best use of this service manual, making also reference to available technical support

information such as Technical Bulletin.

1-2 Contents of this Service Manual

1) The equipment is repaired by PCB replacement. Therefore this service manual does not

include the circuit diagrams of the PCB unit. For the function of each PCBs whose circuit

diagram is not included, refer toSECTION 4 PRINCIPLE OF SYSTEM OPERATION.In SECTION 4, Specification of System, Principle of System, System Block Diagram, PCB

Block Diagram, the explanation of each PCB Block Diagram, and signal list are described.

However, Cable Connection Diagram, Circuit Diagram of PCB equipped with the panelswitches which are easily exchangeable at the field andCircuit Diagram composed ofgeneral circuit such as TV monitor and Power Supply unit are described inSECTION 5SCHEMATICS.

2) For changes and modifications of as well as additions to specifications, if any, prompt

information will be given to you by means ofAPPENDIX Manual Change Information.

IMPORTANT Always observe the manner specified for replacement, addition, ordeletion of Manual Change to prevent missing of necessaryinformation and keeping of erroneous information.

1-3 Construction of This Service Manual

The structure of Service Manual is as follows:

1) Service Instructions................................................................SECTION 13, 59, 112) Principle of Operation............................................................SECTION 4

3) Parts List................................................................................SECTION 10

4) Manual Change Information...................................................APPENDIX


1 - 2

1-4 Contents of Each Section

SECTION 1 How to use this service manual

Describes the purpose of the Service Manual.

SECTION 2 PRECAUTIONS

Describes general precautions and preparations for maintenance service. Be sure to follow working

procedures if mentioned.

SECTION 3 BEFORE REPAIRING

Gives information peculiar to the equipment and care to be taken before starting repair work.

SECTION 4 PRINCIPLE OF SYSTEM OPERATION

Describes Specification of System, Principle of System, System Block Diagram, PCB Block

diagram, the explanation of each PCB Block Diagram, and Signal List. Gives the convenience of

grasping flow of major signals and mutual communication between units in the whole system.

SECTION 5 SCHEMATICS

Gives the cable connection diagram including all cables used, the circuit diagram of PCB equipped

with switches, and the circuit diagram of TV monitor and Power Supply unit.

SECTION 6 TROUBLESHOOTING

Describes precautions on actual repair work and shows the necessary tools and measuring

instruments. Also, includes many hints on primary diagnosis and measures to be taken in the field.


1 - 3

SECTION 7 ADJUSTMENT PROCEDURE

Gives guides of adjustments of PCBs and units which some PCBs need when they are replaced .

SECTION 8 PERFORMANCE CHECK

Describes the procedure of checking for proper operation after repair and provides the forms of

check sheet.

SECTION 9 DISASSEMBLING PROCEDURE

Disassembling Procedure Illustrates the disassembly and assembly of main components. Be sure to

follow working procedures if specified.

SECTION 10 PARTS LIST

Lists the mechanical parts and electrical part which replacement possibility are considered .

SECTION 11 SERVICE INFORMATION

Provides available information about maintenance service.

APPENDIX SERVICE MANUAL Appendix

Manual change information, the revision list of this manual, is filed in this section.


1 - 4

( Blank page )

MN2-0218SECTION 2 PRECAUTIONS

2 - 1

2-1 Precautions Against Electrical Hazards to Serviceman

When disassembling the equipment after checking it for a trouble symptom, give care to the

following:

1) Be sure to unplug the equipment before disassembly.

2) Be sure to turn off the main switch on the equipment when removing electrical parts such as

PCBs, probe, and cable.

3) Safety alert symbols

The indication used on this equipment and in this service manual have the following

meaning.

Indicates a potentially hazardous situation which, if not avoided, may result in minor or

moderate injury.

A caution message is inserted here.

2-2 Precautions Against Mechanical Hazards to Serviceman

When disassembling the equipment, give care to the following to protect serviceman from

hazards :

1) Keep the working environment neat.

Wear working gloves to protect your hands from getting injured by burrs on the unit and

casing.

2) Use only proper tools suited to work being made.

3) Be sure to observe the specified disassembly procedure shown in SECTION 9.

4) Take sufficient care not to damage component with undue load.

2-3 Precautions Against Germ Hazards to Serviceman

1) When it is necessary to touch the equipment, options and/or other peripheral devices at a

customer who uses intracorporeal (transesophageal, transurethral, transvaginal, transrectal)

probes that need sterilization, take special care to protect your hands against germs,

irrespective of the usage of the equipment: whether it is used in the operation room or not.

2) Service tools are subject to germ pollution in hospitals and, therefore, need periodical

sterilization.

3) Be careful not to directly touch anything assumable to have germ pollution. If necessary, ask

the customer for effective protection against germs.


2 - 2

2-4 Precautions for Keeping Electrical Safety

1) Be sure to ground the equipment securely.

2) Perfectness in grounding, screw tightening, and cover installation is essential. Negligence of it

could cause a possibility of leakage current from outer fitting which may lead to serious

damage to a patient being diagnosed.

2-5 Precautions for Keeping Mechanical Safety

Take care to the following to prevent the equipment from being damaged or broken during

disassembly and reassembly work.

1) Be sure to observe the specified disassembly procedure.

2) Take care not to damage component parts by undue load.

3) When reassembling the equipment, carefully check every part for loosening, distortion and

creak.

4) Use only the specified screws and nuts. Using any other screws and/or nuts would affect not

only mechanical performance, but also electrical performance of the equipment.

2-6 Precautions for Keeping Chemicals Safety

Whenever grease, oil or other chemicals is used for maintenance service, options and/or

peripheral devices, be sure to clean the equipment and/or devices after service work.

2-7 Preparation to be Made at Service Center

1) When called by a customer on the telephone, note the followings:

l Name of equipment

l Serial number of equipment

l Name of hospital

l Telephone number

l Name of person in charge

l Detail of trouble symptom as far as possible

l State of connection to optional devices

2) Go over the Technical Bulletin to see whether the complained trouble can be mended bymeans of regular repairing method.


2 - 3

2-8 Care to be Taken in the Field

1) Check for trouble symptoms.

2) Check for connection to optional devices and other peripheral devices.

3) Record the contents of the battery backup memory.

4) After working, restore the equipment according to the above mentioned contents of memory if

necessary.

5) After completion of work, put back the peripheral devices to the original condition.

2-9 Precaution for Monitor repairing

1) Subjecting the unit to strong shocks may result in damage to the CRT or malfunction, therefore

care must be taken when transporting or installing the unit.

2) CRT with the deflecting yoke is already adjusted to the best condition. Do not touch the

deflecting yoke and the magnet of the neck part.

3) Be sure to detach the metallic goods such as a wrist watch from your body before doing the

repair work.

To prevent the secondary damage and the electrical shock, the matters above should be taken

into careful consideration.

DANGER High voltages are present inside the display chassis. Only experiencedtechnicians should touch internal parts.

DANGER The electric charge has remained in CRT after the power switch is turnedoff. Because the high voltage is usually used for CRT. So make the

electric charge escape with a grounding stick which is connected to the

ground of the chassis and through the resistance for high voltage (Approx.

1M) before removing the anode cap.Some electric charge remain in CRT after escaping with a grounding

stick. Do not touch the metallic part of the anode cap with bare hands,

when detaching the anode cap directly.


2 - 4

2-10 Handling of S.M.D. PCBs

It is an Aloka's policy that neither repair nor upgrade (improvement) of PCBs used for S.M.D. is

made in the field as a rule because of the following reasons:

[REMARKS] PCB does not need repairing or modifying in the field as a rule.

When handling a PCB, do not touch the IC unless it is necessary.

IC soiled with workers hands may cause corrosion. Additionally, foreign particles such as fine

solder dust could be the cause of short-circuited IC lead wires whose pitch is smaller than that of

the traditional ones.

Do not give excessively large shocks to the PCB.

When replacing the ROM (Read Only Memory) on the PCB, attempting to force the ROM into

its socket would cause the PCB to be subjected to an undue force, and the following faults may :

1) Damage to PCB intermediate-layer patterns,

2) Peeling of chip devices (resistor, capacitor, diode, etc.)

3) Damage to a junction between electrode and internal element of chip devices,

4) Peeling of patterns (especially those for mounting the parts) together with chip devices since

those patterns are rather fragile compared with PCBs used before now, and

5) Damage to parts on the reverse side in the case of PCBs of both-side mounting type.

Also, a PCB mounted improperly or a warped PCB mounted as it is may cause the chip devices to

come off and the fine patterns to be cut.

Additionally, reuse of chip devices (including resistors, capacitors, diodes, etc.) is strictly

inhibited because of the following reason: Since the chip devices are lacking in lead wires, such

as those found in the traditional component parts, heat given to the PCB will be directly conducted

to the inside of chip devices. As a result, a thermal stress will occur due to a difference in thermal

expansion coefficient between each chip device and PCB, giving rise of the possibility of cracks

inside of or on the surface of chip devices or the possibility of thermal breaking (internal burning).

Very thin wiring patterns require extreme care in handling of the PCB

Be sure to observe the precautions mentioned above also to prevent the secondary accidents.

MN2-0218SECTION 3 BEFORE REPAIRING

3 - 1

3-1 Repair work on the description of Service Manual

The typical processes for the repair work are shown as the Flow Chart on the next page. Do the

repair work according to this procedure. In the case of upgrade (improvement) of the Technical

Bulletin or Upgrade Kit, see the next item 3-2.

Each procedures of flow chart are numbered to refer its detail shown from page 3-3. Furthermore,

the Flow Chart and its explanation show the time when each section of service manual are required

on repair work. This is a guide for the usage of service manual.

The service manual is very important for the repair work, especially readjustment and

performance check after completion of repair work. This is to keep the safety and quality of

equipment. If you make them, you have to describe that the treatment has been done according to

the applied section of service manual, on the repair report or the like.

The circled numbers shown in the Flow Chart on next page, are corresponded to the procedure

number shown from page 3-3.


3 - 2

at customer side

at your site

Yes

No

4

3

2

1

No

Yes

Reception andInvestigation

Selection and order ofrequired part(s)

Preparation

Confirmation

Repair andadjustment

Operation check

Work as normal?

Check by customerFill repair report

Approve by customerRepair again?

Present repair reportDemand to repair the

defective part(s)

Show comments of theprohibition to use on the

equipment

Report to customer

Section 46, 11

Section 6, 10

Technical Bulletin

History

Section 3

Section 2, 6, 9

Section 8

5

6

7

8

9 11

10

12

Demand of repair(START)

Completion(END)


3 - 3

Procedure 1Reception of repair and investigation

Accept the repair request from the customer or distributor. At this time, the following points have

to be confirmed and checked,

l Model name/number, and serial number

l Name of customer, address, phone number, and name of person in charge

l Configuration of the connection of peripheral devices

l Software version or the like shown on the start up display(if possible)

l Detail of phenomenon appeared on the function of equipment

Make an examination what circuit may be defective as the function of equipment based on the

above information. If you need to know about the basic operation and special information for the

maintenance, refer to the following sections, or ask to the Technical Support,

u Section 4 PRINCIPLE OF SYSTEM OPERATION

u Section 5 SCHEMATICS

u Section 6 TROUBLESHOOTING

u Section 11 SERVICE INFORMATION

The reported phenomenon may be the original problem on the equipment. Because, refer to the

Technical Bulletin separately issued to check it whether defectiveness or not. If it has been reported

as the original problem, make a work according to the Technical Bulletin.

Procedure 2Selection of required parts and order

If you find the doubtful circuit, order the necessary parts. Then check the delivery date and decide

the date to visit on the consultation with the customer.

For the selection and order of parts, refer to the following sections,


u Section 10 PARTS LIST

For the electrical parts such as UNIT, check the history information on the HISTORY of this

equipment separately issued.


3 - 4

Procedure 3Preparation of visiting the customer

Check the required tools, measuring devices and parts to be replaced before the visiting the

customer. Then check the special information for the equipment reference with the following

section,

u Section 3 BEFORE REPAIRING

Procedure 4Confirmation of phenomenon

Confirm the appeared phenomenon and condition to happen it with the customer. If you dont

know about the operation of equipment, refer to the Operation Manual attached to the equipment.

Procedure 5Repair and readjustment

Repair the defective circuit with the brought parts. For the repair work, read the following section

carefully,

u Section 2 PRECAUTIONS

And, examine the trouble reason depending on the situation with following section,


The electrical or mechanical readjustment may be requested depending on the replaced parts.

Because, refer to the following section after completion of repair,

u Section 9 ADJUSTMENT

Procedure 6Operation check

Check the system behavior to keep its condition as same as before in trouble, reference with the

following section. Be sure to do according to the description because check items are depending on

the portion to be treated.

u Section 8 PERFORMANCE CHECK


3 - 5

Procedure 7Judgment of the operation quality

If the result of Procedure 6 is passed to the all standards, do the next Procedure 8. On the

other side, if not, make a judgment of Procedure 10.

Procedure 8Confirm by customer, make repair report and approve

Reconfirm the solution of trouble phenomenon with the customer. Then make a repair report and

obtain approval of customer.

The repair report shows not only the treatment but also the method of readjustment and operation

check. If they have been done according to the service manual, the followings have to be shown,

Readjusted according to the Section 9 of service manual.

Checked according to the Section 8 of service manual, and passed.

Procedure 9Presentation of report and order to repair parts

Fill the repair report with necessary item, and present it according to the certain procedure.

If the defective parts that trouble cause included is available to use again by repair, make an order

to do. If you cannot judge whether the part can be used again or not, ask to the Technical Support.

Procedure 10Judgment of possibility to repair again

As the result of judgment on Procedure 7, if the trouble is not solved, judge the possibility to

make the repair work again.

If available, return to Procedure 5 and continue to work.

If unavailable, go to Procedure 11.

Procedure 11Indication of the prohibition to use

As the result of judgment on Procedure 10, if you judge that it is impossible to continue the

repair work at this time, indicate that the equipment is still out of order, and also show the

prohibition to use, on the equipment.

Procedure 12Report to the customer

Report the reason why the trouble cannot be solved to the customer. Then consult about the plan

of next repair work.

And do the same way from Procedure 2.


3 - 6

3-2 Upgrade (Improvement) work on the description of Service Manual

The typical processes for the upgrade (improvement) work are shown as the Flow Chart on the

next page. Do the upgrade (improvement) work according to this procedure. In the case of repair

work, see the previous item 3-1.

Each procedures of flow chart are numbered to refer its detail shown from page 3-8. Furthermore,

the Flow Chart and its explanation show the time when each section of service manual are required

on upgrade (improvement) work. This is a guide for the usage of service manual.

The service manual is very important for the upgrade (improvement) work, especially

readjustment and performance check after completion of upgrade (improvement) work. This is to

keep the safety and quality of equipment.

The circled numbers shown in the Flow Chart on next page, are corresponded to the procedure

number shown from page 3-8.


3 - 7

at customer side

at your site

Yes

No

Yes

4

3

2

1

No

No

Yes

Selection and order ofrequires parts/kits

Preparation

Upgrade (improvement)

Can recover?

5

6

7

8

9

11

12

Operation check

Work as normal?

Do the repair work,according to item 3-1

Operation check

Work as normal?

Check by customer

Consultation withTechnical Support

10

13

14

Demand to upgrade (improvement)(START)

Section 3

Section 8

Upgrade

Upgrade(improvement)

ProcedureSection 8

Tech.BulletinInstllationProcedure

Show comments of theprohibition to use on the

equipment

Report to customer

Return unnecessaryparts, and report of

upgrade (improvement)

Completion(END)


3 - 8

Procedure 1Selection of required parts / kits and order

Accept the upgrade ( improvement) request from the customer, distributor or person in charge of

sales. At this time, the following points have to be confirmed and checked to decide the parts and

kits,

l Document name that announced the upgrade ( improvement) or kit requested


l Name of customer, address, phone number, and name of person in charge


l Software version or the like shown on the start up display

Make an examination what parts or kits are required based on the above information. For the

selection, refer to the following document separately issued, or ask to the Technical Support,

u Technical Bulletin

To confirm the detail of upgrade (improvement), see the Installation Procedure attached with

applied Technical Bulletin.

Depending on the upgrade (improvement), hardware, or software, the other upgrade

(improvement) may be required. Check it with the Technical Bulletin.

Then, confirm the delivery date of required parts or kits, and decide the date to visit on the

consultation with the customer.

Procedure 2Preparation of visiting the customer

Check the required tools, measuring devices and parts or kits to be used before the visiting the

customer. Then check the special information for the equipment reference with the following

section and document,

u Section 3 BEFORE REPAIRING

u Technical Bulletin and/or Installation Procedure


3 - 9

Procedure 3Operation check before upgrade (improvement)

On the basis of work, the upgrade (improvement) to the defective equipment is prohibited.

Because, before upgrade (improvement) work, check the behavior of equipment whether normal or

not according to following section and document,


u Operation Manual



other side, if not, go to Procedure 10.

Procedure 5Upgrade (Improvement) work

Do the upgrade (improvement) work according to the following document,

u Installation Procedure attached with kit or Technical Bulletin

Procedure 6Operation check after upgrade (improvement)

Check the system behavior to keep its condition as same as before the upgrade (improvement),

reference with the following section. Be sure to do according to the description because check

items are depending on the portion to be treated.


u Installation Procedure



other side, if not, make a judgment of Procedure 11.


3 - 10

Procedure 8Confirmation by customer

Reconfirm any functions of equipment with the customer. Then, if need, introduce and explain

about the new functions and specification added by this upgrade (improvement).

Furthermore, if need, make a report to be approved by the customer. The report shows not only

the treatment but also the method of operation check. If it has been done according to the service

manual, the following has to be shown,

Checked according to the Section 8 of service manual, and passed.

Procedure 9Return of unnecessary parts and report of completion

According to the Technical Bulletin, return the unnecessary replaced or unused parts as soon as

possible if suggested.

And, if the report of upgrade (improvement) is suggested on the same document, report it with the

information required.

Procedure 10Work for the abnormal behavior of equipment

On the result of judgment in Procedure 4, if the equipment does not work normal, solve the

problem according to item 3-1 Repair work on the description of service manual shown in this

section.

When the problem is solved, return to Procedure 5 of this item and continue to do the upgrade

(improvement) work.

Procedure 11Judgment of possibility to recover

As the result of judgment on Procedure 7, if the problem has been made by this upgrade

(improvement), judge the possibility to recover it.

If available, return to Procedure 5 and continue to work.

If unavailable, go to Procedure 12.

Procedure 12Indication of the prohibition to use

As the result of judgment on Procedure 11, if you judge that it is impossible to recover at this

time, indicate that the equipment is the out of order, and also show the prohibition to use, on the

equipment.


3 - 11

Procedure 13Report to the customer

Report to the customer that the upgrade (improvement) has not been completed because of the

problem on the upgrade (improvement) work. Then make a schedule to fix and complete it.

Procedure 14Asking to the Technical Support

Report to the Technical Support about the happening of problem on the upgrade (improvement)

work, make an examination to solve and order the additional parts. Before the asking, check the

following points,

l Name of kit, or the issue number of Technical Bulletin showing the upgrade (improvement)



l Software version or the like shown on the start up display

l Indication of equipment such as Upgrade (improvement) or History Label

l Detail of phenomenon appeared on the function of equipment


3 - 12

3-3 Messages

In this equipment, messages are displayed warning that the equipment is malfunctioning or

advising the correct operation method.

There are two types of message, differing according to their content.

1) WARNING

This appears at the center of the screen and an alarm tone is also emitted.

(You can switch over the warning display position at the bottom of screen by selecting

WARNING DISPLAY in Common Preset of PRESET, then selecting BOTTOM.)

2) Assistance Messages

When you use the keyboard to operate a function in a menu, assistance messages appear in

the message area at the bottom of the screen .

Warning Area

Message Area

Fig. Message Areas


3 - 13

1) WARNING

No. Message Cause Treatment

1 Invalid probe connected.A probe was connected not

intended for use with the

equipment.

Connect a suitable probe.

2 Store memory clear

Data in the memory will be deleted.

Press to proceed.

:Quit

The NEW PATIENT switch

was pressed or MEMORY

CLEAR was selected from the

menu.

If it is permissible to erase image

data, press the SET switch. Ifnot, press the M AR K REFswitch.

3 MEMORY FULL

Press key again to clear

old images.

:Quit

You attempted to store a larger

amount of image data than the

remaining capacity of the store

memory.

Delete unwanted images from

the data already stored in the

memory.

2) Assistance Messages


1 Enter data from keyboard.

Then press key.

When the name of the

hospital and the data was

input.

Enter characters from the

keyboard, then press the SETkey.

2 INPUT ERROR

Invalid entry. Enter correct

value.

When incorrect values were

input during input of the data

and time.

Input the appropriate values.

3 the image.

Then try again.

When the PRINT switch onthe operation panel, STOREand REVIEW switches in theMENU were pressed during

freeze or when HISTmeasurement was carried out.

Freeze the image then press the

switch.

4 the image

Then continue measurement.

You attempted to perform an

auto trace without freezing the

image.

Press FREEZE . Then try again.

5 To change frequency or angle ,

press key.

After having changed to a

probe including two vibrator

elements.

Use the ELEMENT SELECTswitch to change the frequency.

6 System AUTO-FREEZE. Press

key to resume.

When panel operation was

not carried out for 20

minutes.

Press the FREEZE switch.

7 USE to

activate zoom.

You pressed the ZOOMswitch.

Turn rotary encoder to perform

a zoom operation.


3 - 14


8 RANGE LIMIT

Selection is not available.

When a setting was made

exceeding the change limit in

case of changing a setting

value with the rotary encoder.

9 USE to move the

mark. Then press key.

You attempt to shift a body

mark.

Shift the body mark with the

trackball.

10 Press key to rotate

Fetus mark.

To display the fetus body

mark.

The fetal rotation function is

activated by the M AR K REFswitch.

11 DETECTION ERROR

R-wave of ECG is not detected

When it is not possible to

detect the R wave of the ECGfor 5 seconds or more.

12 IMAGE stored in memory

frame ##.

When operations were finished

after carrying out store.

13 DATA/image deleted. When there was erasing of 1 or

all images in the store memory.

14 No images have been stored in

memory.

If you attempt to erase an

image when there are no

images in the store memory.

15 Press in the MENU to

display the image to be cleared

from the store memory. Then press

key.

If you attempt to erase an

image in the store memory

when a review image is not

displayed.

Press the REVIEW in theMENU, select the image to be

erased, then erase it.

16 PROCESSING When the histogram is being

calculate.

17 Measurement memory area is full.

To proceed clear measurement,

press key to clear.

You attempt to perform

measurement when the

measurement display area was

empty.

MN2-0218SECTION 4 Principle of System Operation

4 - 1

4-1. System Specifications

Scanning method Electronic linear scanningElectronic convex scanning

Mechanical sector scanning(Requires SCU-1000)

Mechanical radial scanning(Requires SCU-1000)

Simultaneously connectable probes: Electronic scanning probes: 2

Mechanical scanner probes: 2(Requires SCU-1000)

Display modes B, 2B, B/M, M

Line mode (M mode)

Display method ScrollSweep speed 1, 1.5, 2, 3, 4, 6, 8 sec/screenEcho erase Available

Request function Available

Image display magnification (dependent on connected probe)....

Electronic linear probe 4 levels from 3, 4, 5, 6, 8, 10, 12, 15, 17, 19, 21, 24 cmElectronic convex probe 8 levels from 3, 4, 5, 6, 8, 10, 12, 15, 17, 19, 21, 24 cmMechanical scanner 5 through 8 levels from 3, 4, 5, 6, 8, 10, 12, 15, 17, 19,

21, 24cm

Screen display direction Reversible vertically and horizontally (in B modeonly)

Zoom function B scrolling method with write zoomMove position (B mode) AvailableScan area Variable (movable)Positive/negative reverse Available in M mode only


4 - 2

Ultrasound focusing method

Electronic scanning probeTransmit focusingB mode..........4 steps max.

B/M mode......1 of 4 steps

M mode.........1 of 4 steps

Acoustic lens

Receive focusingMax. 16 levels, continuously variable

Acoustic lens

Mechanical scanning probe Concave focusing

Acoustic output control 64-level selective

Image adjustment and processing functions

Gain B mode: Continuously variableM mode: Operates as B-mode compensation value

STC 8 sliding volumesContrast B mode8-level switching

M mode8-level switching

AGC B mode8-level switchingM mode8-level switching

FTC ON/OFF(M mode only)Relief B mode4-level switching

M mode4-level switching

ABC

Automatic B-Gain Control 64-level switchingIPSImage Process Select 8-level switchingVIEW gamma compensation 3 typesPHOTO gamma compensation 3 typesFrame correlation 4-level switching(also, Auto-function for circulatory

system)

Post-processing 5 typesLine density Electronic probe..............2-level switching

Mechanical sector............2-level switching

Mechanical radial............2-level switching

Image select 3 typesPresets 15 types


4 - 3

Measurement functions Basic measurementObstetric measurement (with OB report function)Cardiac function measurement

Annotation function Available

Characters and automatic display ID ..........................14 characters x 1 lineAge........................3 characters x1 line

Heart rate...............5 characters x1 line

Name.....................23 characters x 1 line

Sex.........................1 character x1 line

Hospital name. .......21 characters x 2 lines

Comments.............57 characters x31 lines (NTSC)

...............................57 characters x36 lines (PAL)

Date and time

Probe number

Probe frequency

Image select

Line density

DVA (Drive Voltage Amplitude (%) )

BSA, GA

Plane number for B mode

Frame rate

Depth range

Gain

Contrast

AGC

Graphic display Gray-scale bar...............(64 gradations)Scale mark

Index mark

Focus mark

Scan area mark

Cine/Search mark

M cursor

M time marker

Puncture guide line

Caliper mark

Body mark.............ABDOM

...............................OB/GYN


4 - 4

...............................CARDIO

...............................PV

...............................SMALL PART

...............................Four limbs

Cine memory (optional)

Search function Yes (Max. 32 frames in B mode)Scroll function YesStore function YesReview function YesLoop playback function 4-level switching of playback speed

Physiological signals (optional)

ECG display 1 channel Sensitivity Continuously variable Position B mode.....................Fixed

M mode....................Continuously variable

ECG synchronization Yes (1 channel) R-DELAY 0 to 2.55 sec in 10 msec stepsPCG display 1 channel (only with M mode display) Sensitivity Continuously variable Position Continuously variable

Image display system Black and white composite video signal (NTSC, PAL)

External I/O signal connectors Black and white composite video signal input: 1 lineBlack and white composite video signal output 2 lines

Power supply input voltage 100 to 120 VAC 10%, 200 to 240 VAC10%,50/60 Hz

Power consumption 600VA or less

External dimensions Overall width.......420mmOverall height......1200 - 1335mm

Depth...................630mm

Unit weight Approx. 75 kg


4 - 5

Operating ambient conditions Temperature......10 to 40 Humidity...........30 to 85 %

Barometric pressure..700 to 1060 hPa


4 - 6

4-2. System Configuration

The SSD-1000 ultrasound diagnostic device comprises the following units:

Main unit USI-145

TX/RX partDIU part

Operation panel unit L-KEY-64*

Trackball L-TB-8

Observation TV monitor IP-1233*(NTSC) / IP-1233*V(PAL)

Power supply unit PSU-S1000

Options

Mechanical scanner unit SCU-1000

Physiological signal display unit PEU-1000

Volume mode unit EU-9075

Data management Subsystem DMS-1000

Foot-switch MP-2345

3-way foot-switch MP-2614

Recording device (Black and white printer)

VCR

4-3. System Block Diagrams

Lists of all PCBs mounted in the device (except power supply unit and external options) and

system block diagrams are shown on the following pages.

See Section 4-5 "Principle of PCB Operation" for the PCB block diagrams.

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4 - 7

SSD-1000 PCB LIST(1/2)SSD-1000 Unit PCB model

nameName Description

EP420500 CONNECTOR PANEL Connectors for B/W printer, TV signal for VCR, printer control signalsMai unit PSC-129

EP-3349-4 Connector for foot switch

Operation panel unitL-KEY-64 Operation Panel

Image storage unit USM-23 EP401600 GEU MOTHERBOARD

EP401500 PROBE SELECTOR Two 260-pin connectors, PROBE 1/2 selection, HVS, HVS control, probe codeoutput

EP404400 TX/PRE AMP Transmission trigger signal generation, transmission pulse generation, PRE AMPcircuit, PRE STC signal generation, transmission power supply voltage monitoringcircuit

EP400600 RX FOCUS Delay & addition, electronic/mechanical scanner probe received signal switching,V.B.P.F. circuit, LOG AMP circuit, received signal output

EP401700/EP430900

DIU MOTHER BOARD

EP400700 MAIN AMP Receive dynamic focus selection, gain, AGC, contrast, relief circuit and control signalgeneration

EP395601 GEU I.T.F A/D conversion, frame rate and heart rate calculation, mode control, ultrasoundaddress generation, transmission voltage control, timing signal generation

EP396604/05 DIU D/A conversion, pre-processing, main memory, post-processing, GEU interface,parameter memory, display control, TV timing signal generation

EP399000/EP403502

CPU Overall system control, character and graphic generation

Cine memory unit EU-9056 EP399600 CINE MANAGER Cine memory read/write control

EP399700 CINE MEMORY B/W cine memory

4 - 8

MN2-02

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SSD-1000 PCB LIST(2/2)SSD-1000 Unit PCB model

nameName Description

EP400800 MECH. SERVO Transducer position detection, motor drive signal generation, shaking compensationcircuit, transmission timing signal generation, Tx circuit for mechanical sector andannular array probes, transmission power supply voltage monitoring circuit

Mechanical scanner unitSCU-1000

EP400300 MECH. PROBESELECTOR

Two 60-pin connectors, PROBE 1/2 selection, PRE AMP circuit for mechanical andannular array probes, probe code output

EP401200 PHYSIO. AMP ECG AMP, PCG AMP, R-wave detection, PCG filter circuit, hum filter circuit

EP399500 PHYSIO. MEMORY A/D conversion, interpolation circuit, physiological signal memory, memory control,physiological signal synchronization mark generation

EP420700 PHYSIO. PANEL 1 Adjustment trimmers for ECG and PCG sensitivity and display position

Physiological signalunit

PEU-1000

(EU-5042

EP420600 PHYSIO. PANEL 2 ON/OFF switches for ECG, PCG, ECG SYNC and SOUND

Volume mode unit EU-9075 EP429300 DMS ITF/VOL/SERVODMS interface, Video signal input/output circuit, Volume mode calculating block,motor servo circuit

Data management DMS-1000 DMU-200 Data management unitCPU, VCM board, SCSI card, Ethernet card, Floppy disk drive, Hard disk drive

subsystem EP429301 DMS ITF DMS interface, Video signal input/output circuit

Power supply unit PSU-S1000 +5.1V5V15V+15VTV monitor+24VHVAHVBIP-1233* Black and White TV monitor (NTSC)Observation TV

monitor IP-1233*V Black and White TV monitor (PAL)


4 - 9

5421 3 15421 35421 35421 35421 35421 35421 35421 35421 35421 35421 35421 35421 35421 35421 3K L M N P Q R S T U V W X Y ZO

J12345

I12345

H12345

G12345

F12345

E12345

D12345

C12345

B12345

A5

43

R E

V I

S I

O N

S

SCALE

UNITS mm

DRAWING NO.

MODELTITLE

3RD ANGLE PROJECTION DESINEDDRAWN CHECKED APPD

11

Detector

LPF

EP400700 MAIN AMP

A/DGEU Timing

GEU BUS Window

LineBuffer

FrameMemory

US Interface

GEU Interface

AddressGenerator

DIUMemory

CINEManager

ABC Control

R-DelayControl

R-R

DIU Control Signals

R-Delay GATE

HV CONT

PHYSIOPanel

PHYSIO AMP

EP401200PHYSIO AMP

HUM FilterPCG IN

R-TRIG

DIU Timing

ROMTable

MPU

GDC

EP3990**/EP4305**

CPU

PostProcess

D/A

EP399600CINE MGR

EU-9056(Option)

EP399500

PEU-1000 (Option)PHI

EP3966**DIU

12inchMonitor

VCR(Option)

Printer(Option)

Foot SW (Option)

VIDEO OUT

VIDEO IN

VIDEO OUT

PRINTERCONTROL

VCR

FOOT SWFOOT SW

PRINT

PR

INT

ACOUTLET

To Mother Board

HV CONT

EP3956** GEU ITF

SSD-1000

Main Panel Assembly

L-KEY-64* EP420600 & EP420700PHYSIO PANEL1 & 2

ECG IN

DIU Control

PSU-S1000

Power Supply Unit

SYSTEM BLOCK DIAGRAM

PEU-1000(Option)PSC-129

USM-23

USI-145

EP400800MECHASERVO

SCU-1000 (Option)

MECHATX

MECHASERVO

PRE STCGenerator

PR

OB

E S

ELE

CT

OR

EP401500

Pro

be

Con

nect

or

VBPFCONTROL

US

BLK

etc

.

EXCHANGEV

Contrast

STC

128-32Selector

EP400300

ME

CH

A R

X

MECHAPROBE SELECTOR

SCU-1000(Option)

ME

CH

APro

be

Con

nect

or

MECHA TX

AnnularPREAMP

MECHAPREAMP

Annular RX

Delay& Adder

AnnularDelay&Adder

Delay& Adder

AnnularDelay&Adder

VBPF LOGAMP

VBPF LOGAMP

PRE AMP

Transmitter

EVEN

ODD

TX Trig.Generator

EP400600RX FOCUS

EP400600RX FOCUS

EP404400

TX/PRE AMP

Fo CONT

Fo CONT

MA4-0026

EP399700

EU-9056(Option)DIU MEM

VideoSelector

IP-1233*/IP-1233*V

DMU-200orDMU-201

DMS-1000(Option)

DMS-1000,EU-9075(Option)

DMS ITF/VOL SERVO

EP4293**

PHI

(Gain,STC ,AGC,AAFL)

MechanicalSectorProbe

Linear orConvexProbe

MotorControl

VOLScanner

ServoCPU

A/DVOLGamma

OpacityTable

VOLCalc.

ImageMemory

FrameCorrelation

ImageCont.

Signal Processor

BrightTable

Register

CPU Data Address

(Ver.2.0 onward


4 - 10

(Blank page)


4 - 11

4-4. Principles of System Operation

4-4-1. System Control Unit

Fig. 4-4-1

The system control unit includes the HOST CPU (MC68340) to provide overall system control.The CPU controls all parts of the device based on the software stored in ROM, according to

information from the operation panel.

The local CPU (V50) is mounted in the cine memory unit to provide cine memory control.

CPU

OPERATIONPANEL

GEUBUS WINDOW

GEUI.T.F.

MAINAMP

RXFOCUS

TXPRE AMP

MECH.SERVO

(OPTION)

PROBESELECTOR

MECH. PROBESELECTOR(OPTION)

CPU ADRS. DATA

GEU CPU ADRS. DATA

PANEL CPUADRS. DATA

ARTOP(HD64410)

PHI(OPTION)

CINE MANAGERV50(CPU)(OPTION)

CINEMEMORY(OPTION)

DIU

CPU ADRS. DATA

V50 ADRS. DATA

CPU

(MC68340)

DMS ITF(OPTION)

Data managementsubsystem(OPTION)

DITF ADRS. DATA


4 - 12

4-4-2. TX/RX Unit

The Tx/Rx unit provides functions to generate transmission pulses, conduct analog

processing of received echoes, and transfer ultrasound image data to the DIU.

The transmission pulses are converted to high-voltage in the driver circuit that drives the

oscillator and are then supplied to the selected probe.

The transmission voltage is detected by the transmission power supply voltage monitoring

circuit on the TX / PRE AMP board and this data is sent to the system control unit. The

system control unit immediately stops transmission if it receives abnormal transmission

power supply data.

The electronic scanning probe has a maximum of 128 Tx/Rx lines, allowing it to

simultaneously drive up to 32 transducers. Up to 32 of the 128 Tx/Rx lines can be selected

by the selector circuit, which comprises 16 HVSs (8-channel High Voltage Analog

Switches).

The received echoes are received by the transducers that transmitted and are amplified in

the pre-amp circuit. The received echoes are analog processed after received dynamic

focusing, then A/D converted and transferred to the DIU.

With an electronic probe, phase compensation is conducted in the matrix switch and delay

line because the phases of the echoes received by the multiple transducers are displaced

from each other.

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TX/RX PART BLOCK DIAGRAM 1/1

PRE STCCONT

GEU BUS

MECH.SERVO

MECH. PROBECONNECTOR

A, B, C, Z,MOTOR+

GEU BUSWINDOW

USBLK

USBLK GAINCONTROLLER

OPERATIONPANEL

GEU TIMINGGENE.

GEU BUS

STC

ABC CONT. GAIN,From DSC

CPU BUSMECH.

TX TRIG.

MECH.TX

LOGAMP

LOGAMP

F0 CONT

VBPF

VBPF

F0 CONT

TX TRIG.GENE.

TX

32ch

32ch

PROBECONNECTOR

128-32chSELECTOR

128ch

PRE AMP

32ch

MECH.PRE AMP

DELAY&ADDER

DELAY&ADDER

Annulardelay &adder

Annulardelay &adder

A/DAAF

RELIEFCONT-RAST

AGCGAINCONT.

EXCHANGV

GAIN CONT CONTRAST

3

RELIEF

3

AAF CONT

3

DSC VIDEOAnnularPRE AMP

6

AGC

3


4 - 14

4-4-3. DIU Unit

The DIU uses a high-speed X-Y system.

The ultrasound image data received from the Tx/Rx unit as a digital signal is sent

for pre-processing. Pre-processing involves input selection of the ultrasound image data

sent from the Tx/Rx unit, frame correlation, and storing in frame memory.

Post-processing involves the interpolation and correlation of the B-mode image in the TV

horizontal scan direction, addition of gray-scale bar, characters and graphics, and output to

the D/A conversion circuit. In addition, the DIU unit supplies the ultrasound image data

for ABC (Auto B-Gain Control).

After D/A conversion, TV synchronization and blank signals are added and the signal is

output as a composite video signal.

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DSC PART BLOCK DIAGRAM 1/1

DSC VIDEOFrom TX/RX part

FRAMEMEMORY

D/A

PHI

PREPROCESS

TO / FROMCONNECTORPANEL

CINEMEMORY

CINEMANAGER

TO TV MONITOR/

ABCCONTROL

ABC CONT.

PHYSIO. SIGNALFrom PHYSIO. AMP

CPU BUS

V50 BUS

CPU BUS

M PHYSIO.

B PHYSIO. SIG.

CPU

MEMORYCONTROLLER

USINTERFACE

DIUCONTROL

CMP_BLKCMP_SYN

GRAY

TIMINGGENERATOR

RASCASWEOE

VIDEOSELECTOR

GDC

POSTPROCESS

TO GEU

DMSITF

DITF BUSTO / FROM DMS

CPU BUS

CPU BUS


4 - 16

4-4-4. ABC (Auto B-Gain Control) Function

This function evaluates the brightness from the B-mode ultrasound image data stored in

frame memory and automatically maintains the optimal B-mode gain for MAG etc. ,

regardless of the probe type, frequency, and individual differences between test subjects.

The ABC function can be turned ON or OFF and the ABC level can be set at the operation

panel.

The B-mode ultrasound image data stored in frame memory is sent to the ABC control unit,

which evaluates the brightness and outputs an ABC gain level analog signal according to

the ABC setting on the operation panel. Also, the gain volume setting is output by the

ABC controller as the ABC gain. The ABC gain is added to STC and output to the

MAIN AMP.

Fig. 4-4-2

4-4-5. Cine Memory Unit (Option)

The cine memory unit is made up of two PCBs: the controller unit (CINE MANAGER) and

memory unit (CINE MEMORY). Cine memory is a display memory that can store 32 pre-

frozen screens of ultrasound images (in 1B mode).

The cine memory unit offers search, scroll, store, review, and loop playback functions under

the control of the V50 processor on the CINE MANAGER board.

8

FROMPROBE TO

TV MONITOR

ABCCONTROL

OPERATIONPANEL

GAINCONT.

ABC GAIN

STC

GAIN CNT

8

CPU DATA

MAINAMP

A/D DIU D/A

MAIN AMP

DIU

OPERATIONPANEL

GEU ITF

TO CPU


4 - 17

4-4-6. Mechanical Scanner Unit (Option)

The mechanical scanner unit comprises a controller unit (MECH. SERVO) and selector

unit (MECH. PROBE SELECTOR). The transmission circuit is mounted on the MAIN

AMP board.

The transmission pulses generated by MAIN AMP are converted to high-voltage in the

driver circuit that drives the oscillator and are then supplied to the selected probe.The transmission voltage is detected by the transmission power supply voltage monitoringcircuit on the MAIN AMP board and this data is sent to the system control unit. Thesystem control unit immediately stops transmission if it receives abnormal transmissionvoltage data.The received echoes are amplified by the PRE AMP circuit on MECH. PROBE

SELECTOR and supplied to the RX FOCUS board.

Fig. 4-4-3

MECH.TX

GENE.

SERVOCONT.

RX

FOCUS

PROBE

CONNECTOR

MECHA. SERVO MECHA. PROBE SELECTOR RX FOCUS

TO MAIN AMP

A, B, C, Z,MOTOR+

TX TRIG

GEU BUS PRE

AMP.

ANNULARPREAMP.


4 - 18

4-4-7. Physiological Signal Unit (option)

The physiological signal unit is made up of the physiological amplifier unit (PHYSIO

AMP), physio. panel, and physiological signal memory unit (PHI).

ECG (electrocardiogram) and PCG (phonocardiogram) are input to PHYSIO AMP, where

they are amplified by amplifier circuits with isolated power supplies, and are output by the

photo-couplers as the isolated signals B_ECG, M_ECG, and M_PCG.

For noise elimination, the ECG circuit contains the HUM FILTER (50 Hz/60 Hz) and the

PCG circuit has a three-level PCG FILTER.

In addition, the ECG R-wave detection circuit (R-DETECT) is mounted on PHYSIO AMP.

The PHI board A/D converts the physiological signals.

The B_ECG signal is interpolated and stored in the physiological signal memory. The

stored signal is synchronized with the TV signal, read, added in the DIU post-processing

unit, and displayed on the plane mode (B mode) image.

The M_ECG and M_PCG signals are interpolated, written to the physiological signal

storage area of the DIU display memory, and displayed on the sweep mode (M mode)

image.

Fig. 4-4-4

PHIOPERATION

PANEL

PHYSIO. AMP.

ECGM_ECG

B_ECG

R-GATE TOGEU ITF

TOPHI

LIMITER

R-DETECT.

PHOTO-COUPLER

HUMFILTER

ECGAMP

M_PCGPCG TOPHI

LIMITERPCGFILTER

PHOTO-COUPLER

PCGAMP

HUM FL

PCG FLOPERATION

PANEL

M_ECG

B_ECG

M_PCG

A/D

ECGMEMORY

INTER-POLATION

INTER-POLATION

FRAMEMEMORY

POSTPROCESS

M_PCGM_ECG

B_ECG


4 - 19

4-4-8. Power Supply Unit

The power supply unit comprises a series power supply and switching power supply.

It supplies the power required by the main unit. It also has an isolated power supply for

the optional recording device.The transmission voltage for the electronic scanning probe (HVA), and mechanical scannerprobe (HVB) is controlled by the control signals (HVS DATA0-5) from the main unit.

4-4-9. Volume mode unit (option)

This unit is designed to display Volume mode image on a monitor.

4-4-10. Data Management Subsystem (option)

This unit is for handling DICOM communications and DICOM specification image filing.


4 - 20

4-5. Principles of PCB Operation

4-5-1. PROBE SELECTOR

This board comprises probe connectors, probe select relays, HVS, and the relevant control

circuits.

LIN/CONV CONNECTOR 1

260-pin connector for linear/convex probe.

LIN/CONV CONNECTOR 2

260-pin connector for linear/convex probe.

RELAY

Comprises 64 relays to switch between PROBE 1 and PROBE 2.

HVS

Comprises 16 HVSs (8-channel High Voltage Analog Switches) to select and

switch 32 of 128 channels

CONTROL & PROBE CODE INTERFACE

Comprises ROM (Read-Only Memory), logic circuits, relays, and PLDs

(Programmable Logic Devices). It controls the probe switching relays and HVSs

and outputs probe codes to the data bus.

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TITLEPROBE SELECTOR 1/1

MODEL

EP4015**

RELAY

LIN/CONVCONNECTOR 1

PROBEON1PROBEON2M_E_SELRAMEN

GEU DATA(0-7)

CONTROL &PROBE CODEINTERFACE

TD1(1-128)

GEU ADRS (0-3)EN1EN2EN3READHVDTCLKHVADRS(0-2)

GEU BUS

LIN/CONVCONNECTOR 2

HVS

TD1(1-128)

TD1(128-1)TXRX (1-32)

PROBE CODE1 (0-9)

PROBE CODE2 (0-9)

HV DATA

RSSR

PROBE CODE2 (0-9)


4 - 22

SIGNAL LIST ( PROBE SELECTOR )

J100-1 J100-2


4 - 23

(Blank page)


4 - 24

4-5-2. TX/PRE AMP

This board comprises 32 Tx/Rx circuits and transmission trigger signal generation circuits to

carry out ultrasound Tx/Rx.

TX POWER SUPPLY VOLTAGE DETECTOR

A/D converts the transmission power supply voltage and outputs it to the data bus.

TX

Carries out electronic probe transmission.

(Max. simultaneously driven channels: 32. Max. transmission voltage: 90 V)

TX TRIGGER

Generates the transmission triggers for electronic probes (max. 32 channels).

TX FOCUS CONTROL

Generates the control signals to control electronic transmission trigger generation

for electronic probes, and the PROBE SELECTOR control signals.

PRE STC DRIVER

Converts the STC CNT and GND CNT signals to positive/negative signals and

outputs them to the PRE AMP.

PRE AMP

Conducts first-stage amplification of the received signals from the electronic probes

according to the STC_P and STC_N signals generated by the PRE STC DRIVER.

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1/1MODEL

EP4044**TITLE

TX / PRE AMP

TX TRIGGENE. TX

TX FOCUSCONT.

TXVDETECTOR

TXCLKTXLD_ EN1USADRS EN2GEUDATA READGEUADRS TXFADRSUSBLK BSADRS

STCCNT

USBLKFrom GEU I.T.F.

TP1

32

AXENA1ENA2DSCLKPSTXCLRLDTXCLK1

PRESTCDRIV.

TRIG

32

TXRX

STC_PSTC_N

HHV

GE8GEUDATA

HVLEHVCLKHVDTCLKHVSWCLRHVADRSRESET

From MAIN AMP

From GEU I.T.F.

To GEU I.T.F

To PROBE SELECTOR

PRE AMP32

PRE OUT To RX FOCUS

From MAIN AMP

To PROBE SELECTOR

GEU BUS

GEU BUS


4 - 26

SIGNAL LIST ( TX/PRE AMP )

J101-1 J101-2

J101-3


4 - 27

(Blank page)


4 - 28

4-5-3. RX FOCUS

Two of these boards are used to alternately conduct receive focussing and receive dynamic

focussing.

V/I CONVERTER

Converts the PRE AMP voltage output to a current.

CROSS POINT SWITCH

The CROSS POINT SWITCH connects the received signals (max. 32 channels) to

the optimal delay tap.

DELAY & ADDER

Conducts delay and adding (receive focus) on the received signals (max. 32

channels) and outputs the received signals as one line.

LIN/CONV H.P.F. (High pass Filter)

Allows only the high-frequency component of the received signals to pass when an

electronic high-frequency probe is used.

MECH. H.P.F. (High pass Filter)

Allows only the high-frequency component of the received signals to pass when a

mechanical scanner high-frequency probe is used.

ANALOG SWITCH

Selects the received signals from the electronic or mechanical scanner probe, turns

ON/OFF the Doppler output and H.P.F.

V.B.P.F. (Variable Band Pass Filter)

Allows the optimum frequency signals for the probe frequency and received signal

depth to pass.

LOG. AMP

Comprises two +30 dB amplifiers and LOG ICs to carry out logarithmic

amplification of the received signals.

CROSS POINT SWITCH CONTROL

Generates cross point switch control signals and analog switch control signals

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TITLERX FOCUS 1/1

MODELEP4006**

From TX/PRE AMP

V/I32

PRE OUT DELAY &ADDER

CROSSPOINT SW

CROSSPOINT SW

CONT

F0 CNT

MECH. RX

From MECH.PROBECONNECTOR

H.P.F.

ANALOGSWITCH

H.P.F.

LCOFFHPF ON

To MAIN AMP.

TP5

LOG0* PLOG0*N

LOG AMPV.B.P.F

TP10 TP12/13

AXAYMRSTBCS

From MAIN AMP

FCSE_0 RESETEXCHNG USBLKBSADRS USADRSEN1 GEUDATAEN2 GEUADRSREAD

GEU BUS

MECH. RXANNULAR ANALOG

SWITCHDELAY &ADDERV/I

ANNON


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SIGNAL LIST ( RX FOCUS 1 )

J102-1 J102-2

J102-3


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SIGNAL LIST ( RX FOCUS2 )

J103-1 J103-2

J103-3


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4-5-4. MAIN AMP

This board switches the receive focus, conducts ultrasound analog processing, and generates

the mechanical scanner transmission pulses.

RX EXCHANGE

Receives the received signals from the two RX FOCUS boards while switching the

depth in approximately 1 cm increments. The received signal is switched by

analog ICs on both the rising edge and falling edge of the EXCHANGV signal.

DETECTOR

Detects the received signal and adds the gain signal.

AGC (Automatic Gain Control)

Comprises delay circuits. Subtracts the delayed received signal from the original

received signal. Eight levels can be selected by the AGC 0 to 2 control signals.

CONTRAST

Comprises resistive potential divider circuits to output a potential-divided signal.

Eight levels can be selected.

RELIEF

Comprises differentiation circuits. Adds the differentiated received signal to the

original signal. Eight levels can be selected.

AAF (Anti-Aliasing filter)

Eliminates the aliasing that occurs when monochrome image data is sampled.

GAIN CONTROLER

Generates the gain, F0 (6 types), and PRE STC (6 types) signals.

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33

MN2-02

18

SEC

TIO

N 4

Prin

ciple

of S

ystem

Opera

tion

TITLEMAIN AMP 1/1

MODELEP4007**

USBLK2MCLKREADEN1-3

M

SELECTOR

STC (0-7)

B GAIN

GAINCONTROLLER

GAIN STCDATAGENE.

SELECTOR

A/DA/DA/D

B GAIN. STC 0. DLV.

DVD

TP8

GBS

SOS

DVS

CONFDOP

M SEL

To RX

From DIU From OPERATION PANEL

From GEU I.T.F.

D/A

FO/PRE STCGENE.

D/A

D/APRE STC CONT.

F0 CONT.

TP9 To TX / PRE AMP

From GEU I.T.F.

DETECTOR

AGC

CONTRAST

RELIEF

AAFSELECTOR

3 AGC 3 AAF3 RELF3 CONT

TP1 TP13

TP7

TP3TP5TP4

LOG 01

LOG 02

AAF OUT

From RX FOCUS 1, 2To GEU I.T.F.

GEU DATA (07)

GEU ADRS(03)

GAIN CONT.


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SIGANAL LIST ( MAIN AMP )

J411

1 VIDEO_OUT

2 GND

J104-1 J104-3


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(Blank page)


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4-5-5. GEU I.T.F.

This board generates the control signals for the GEU unit, generates the memory write

control signals for the DIU unit, and opens the bus between the CPU BUS and the GEU

BUS and PANEL BUS.

CPU BUS WINDOW

Controls opening between the CPU BUS and the GEU BUS and PANEL BUS.

PROBE CONNECTOR DETECTOR

Detects whether a probe is connected and outputs this data to the CPU BUS. The 5-

bit data has 2 bits for linear/convex probes, 2 bits for mechanical scanner probes,

and 1 bit for the independent probe. The corresponding data bit becomes LOW

when a probe is connected.

FRAME RATE CALCULATOR

The frame interval is counted from the 100sec clock signal by a 16-bit counterand the result is output to the CPU BUS. When the count is complete, the IRQ/

signal is output to apply an interrupt to the CPU. The CPU calculates the frame

rate from the counted data.

HEART RATE CALUCULATOR

Each time the optional physiological signal unit inputs the R/ signal, the IRQ/ signal

is output to apply an interrupt to the CPU. The CPU calculates the heart rate from

the data.

MODE CONTROL

Generates PROCOD and SCNMOD signals corresponding to the mode when mode

data is sent from the CPU.

PROCOD SCNMODB MODE 0 1M MODE 0 0D MODE 1 0 PROCOD : Process code(Not used) 1 1 SCNMOD : Scan Mode


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BEAM ADDRESS

Outputs addresses in the B mode by counting a clock signal synchronized with an

ultrasound line using a 9-bit counter in which the CPU start and end values can be

set.

HV CONTROL

Generates the HVS DATA 0 to 7 signals from the high-voltage (transmission) data

sent from the CPU. This block also contains a CPU runaway detector circuit,

which sets all the HVS DATA 0 to 7 signals to HIGH level to stop transmission if a

CPU lock-up occurs.

TIMING GENERATOR

Generates all timing signals from the 12 MHz, 1 MHz, and 0.5 MHz clock signals

produced by dividing the 60 MHz/48 MHz clock frequency from the crystal

oscillator, according to the data set by the CPU. Operates at 48 MHz with a 2 MHz

probe but operates at 60 MHz with all other frequency probes.

A/D converter

US video (VIDEO_OUT) signal, which is sent from MAIN AMP board, is

converted into 6 bits of digital signal, and sent to DIU board.

This circuit is also used for A/D convert of VCR playback signal.

MN2-02

18

SEC

TIO

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ciple

of S

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m O

pera

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TX CLK/

US BLK/

DF AREA

OFCENT/

96 PRF

D SMPL

HEARTRATE

CALCULATOR

PROBECONNECTION

DETECTOR

BEAMADDRESS

FRAMERATE

CALCULATOR

MODECONTROL

Line Buffer(FIFO)

A/Dconverter

HVCONTROL

TIMINGGENERATOR

CPU BUS WINDOW

IRQ/R/

0.5M

12M

1M

PROBE ON/

FRMEND/

IRQ/

PROCOD/

SCNMOD

USADRS(0-7)

DSCADRS(0-7)

HVS DATA

GEU BUS

PNL BUS

CPU BUS

TITLEGEU I.T.F. 1/1

MODELEP3956**

US video (VIDEO_OUT)6

ADDAT(0-5)VCR_IN

6

VCR_IN


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SIGNAL LIST ( GEU ITF )

J207-1 J207-2

J207-3

J314

1 VIDEO_IN

2 GND

J315

1 VCR_IN

2 VCR_IN_R

3 NC

4 NC

J316

1 VCR_OUT

2 VCR_OUT_R

3 NC


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4-5-6. DIU

The B/W DIU (Digital Imaging Unit) fetches ultrasound wave digital data coming fromthe GEU in synchronized with the DIU clock, writing ultrasound wave data to the displaymemory in XY writing method, then reading out the ultrasound wave data in synchronizedwith the TV signal. After this, gradation conversion of display data, addition of gray scalebar and other post processing are executed by this block.

In the writing system, ultrasound wave scanning data are thought of as scanning linevectors, and from the starting point indicated by the vector (X0, Y0) and the time it takes topass the boundary (X), (Y), one scanning line can freely be written to main memory.

Also, through the dynamic focus area signal (DFAREA), multi-level dynamic focusedultrasound wave data can be written to memory.

The boundary passing signal (INCX, INCY) is detected by the XY Boundary Calculatorfrom the boundary passing time (X), (Y) in 1 pixel units. If the boundary passing signal isdetected, data are written to the line buffer the following system is used to determine if thesignal is INCX or INCY by the scanning address and register setting.

(a) XY Sampling Writing System (X and Y System)In this system, writing to the line buffer is done each time either INCX or INCY is

generated. This system is used for all scanning lines.

(b) X Sampling, Y Sampling Writing System (X or Y System)In this write system, the line buffer write area (X system) is set when INCX is

generated and the line buffer write area (Y system) is set when INCY is generated.Data are written to the area specified in the X system each time INCX is generated,

while writing is not performed when INCY is generated. INCY information is held untilINCX is generated, then writing of both is done simultaneously. For this reason, thenumber of times INCY is generated must be fewer than the times INCX is generated.Accordingly, the area which can be specified in the X system is limited to 45 or more leftand right. In the same way, the area which can be specified in the Y system is limited to45 or less left and right.

Also, the area setting is stored in X0 and Y0 (16-bit) in the parameter table.The boundary pass signal (INCX, INCY) is written to the line buffer simultaneously

with the ultrasound wave data, and is used to increment the main memory write address.

ABC (Auto B-gain Control)This block generates B_GAIN signal, which controls the gain for B-mode, referring

ultrasound brightness data in the image memory and the Gain Level setting by operationpanel. Then B_GAIN signal is sent to MAIN AMP board, and controls the gain ofreceiving signal. In case ABC off, B_GAIN becomes the signal referring B GAIN knobsetting.

PRE PROCESS

This block is a circuit that executes various types of processing of ultrasound imagedata sent and received at the GEU for writing to MEMORY.

Test Pattern GenerationGenerates the various types of test pattern.


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Echo EraseIn order to make physiological signals easy to see, the bottom portion of ultrasoundM image data is erased. The erased portion of ultrasound image data is written toimage memory as "0" level. This differs from USERASE and ERASE in the pointthat it is executed when ultrasound image data are stored in image memory.

Memory EraseIn order not to display unnecessary data when changing modes, etc., either a portionor all of the image memory is erased. The erased portion of ultrasound image data iswritten to image memory as "0" level.Except in the point that Erase is executed in screen units, which image memory isconfigured into, this function is the same as Echo Erase.

Black and White Frame CorrelationCorrelation between two frames is executed in order to reduce noise.

CPU AccessWhen making a histogram, etc. of ultrasound image data, the CPU can access imagememory. Access by the CPU is limited to times when the ultrasound image isfrozen.

MEMORY

This block is capable of storing enough ultrasound image data for two screens afterthey have been processed by the pre process block.

Scanning conversion in the DIU is executed during writing to or reading from thisblock.

Main memory is used as M image display memory during real operation and as framememory for frame correlation. During B image display and when the image is frozen,CINE memory is used as display memory.

Memory Configuration

2 x 2 pixels is the smallest configuration element and 2 screens of 512 x 512 pixelx 8 bit ultrasound image data are stored.

Black and White Main Memory

bits 0-5 : Black and White Image Data

bit 6 : Organism signal for M

bit 7 : Sync. Mark for M organisms.

Write/Read SpeedWriting to or reading from RAM is carried out by RMW at 320 nsec/1 pixel.

However, by shifting the access cycle one half period, apparently, RMW is done at160 nsec/1 pixel. On the other hand, reading from the SAM block is by serial Readat 160 nsec/1 pixel. By doing 2 pixels simultaneously, apparently, serial read can bedone at 80 nsec/1 pixel.

EraseUsing the Dual-port RAM flash write function, the image memory can be erased.


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Erasing is executed by flash write at 160 nsec/1 Row, but when 4 chips are workingsimultaneously, erasing can be done at high speed, with one 512 x 512 pixel screenerased in approx. 45 sec. Furthermore, since it is not dependent on ultrasoundimage data write operations, it differs from USERASE, ECHO ERASE and MemoryErase.

POST PROCESS

This block carries out various types of processing of ultrasound image data read fromimage memory.

H InterpolationSpaces between lines of ultrasound B image data are interpolated in the TV H

direction. The area which can be interpolated is from 1-11 pixels, and selection ofthe number of pixels to be interpolated is set by the register.

Ordinarily, the linear interpolation method is used. For black and white anddispersion, linear interpolation is used.

Also, since the display area of ultrasound B image data is dependent on thedisplay format, it is controlled by TV synchronized signals.

Furthermore, ultrasound M image data do not pass through this processingsystem.

H CorrelationIn order to show connection of ultrasound image data in the TV H direction

smoothly, the arithmetic sum is taken between pixels in the TV H direction. Thesystem is equipped with independent correlation circuits for ultrasound B image dataand for M image data, with selection of whether these circuits are switched ON orOFF being set by the register. Also, since the display area of ultrasound image datais dependent on the display format, it is controlled by TV synchronization signals.

Gray Scale Bar GenerationA gray scale bar with 64 gradations ranging from the white level to the black level is

generated in the TV V direction. The display width of each gradation is fixed at 16 pixelsx 2 lines. Also, the display position is dependent on the display format, so it is controlledby TV synchronization signals.

View Gamma correction is carried out in accordance with the imaging device's

brightness characteristics. The following three types of gamma curve can beselected.

(1) Standard (Linear)(2) For ABDOM(3) For CARDIAC

There are two types (mainly for ultrasound B image data and for ultrasound Mimage data) which can be held simultaneously. This function shares the Enhance


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RAM, so selection is made by rewriting the Enhance RAM. Furthermore, forultrasound M image data, Standard (Linear) is selected automatically.

This function is implemented for black and white images only.

Overlay displayThis is for displaying character and graphic. Two input circuits of OVL0 and

OVL1 are prepared for character and graphic signals allowing two kinds ofluminance level displaying. ON/OFF of each displaying and luminance level are setby the register. The following shows priority among overlay signals to bedisplayed.

(1) OVL0 High(2) OVL1 |(3) Gray scale bar |(4) Ultrasound image data Low

In case there is no overlapping between OVL0 and OVL1, shadow appears on theright side.

GEU I.T.F.This block generates and controls parameter information for fetching ultrasound

data to the DIU. It also carries out movement control and freeze control.

Parameter ROMContains ultrasound scanning line vector information (parameters) for each probe.

This ROM has a capacity of 512 Kbytes, enough for 42 probes.

Reading and Conversion of Parameters(a) Reading of ROM Data

Ultrasound scanning line vector information (parameters) X0, Y0, WXF,WYF, X and Y, are sent to the control block each time a scanning linewrite start signal (Line Start) arrives.

Data corresponding to DSCADRS (8:0), which are sent from the GEU, areread according to the type of probe and display magnification.

It also performs conversion of parameters for vertical reversal, horizontalreversal, display mode and probe code, in accordance with the read out data.Parameter conversion is accomplished by hardware according to the displaymode and control register in all cases.

(b) Parameter ConversionSince each unit of parameter data is 16 bits in length, the high byte and low

byte are read independently from ROM, then latched and sent to each block.Vertical reversal and horizontal reversal display modes and conversion ofparameters (X0, Y0) in accordance with probe codes is done at this time.

Parameter ROM for SoftwareThe system includes parameter ROM for reference by software. It is

accessible by the CPU at any time.

Scanning Area Display


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This function makes the B image display area narrow and increases theframe rate. This is accomplished by varying BOF/, EOF/ and DSCADRS (8:0)in the GEU. Data from BOF/ to EOF/ are written as DIU.

Freeze FunctionThis function stops the writing of an image to display memory.Freeze is executed by setting the register. In the case of freezing of a real

display simultaneous with B/M, it is necessary to set the Freeze Register inadvance.

Forced Freeze, where writing to memory is forcibly stopped, andsynchronous freeze mode, which is synchronized with the ultrasound writeimage, are also provided.

B image synchronous freeze stops motion after one frame of B image datahas been written. Ordinarily, the sweep image in the B/M sweep motion modeis frozen as a B image. Also, synchronous freeze which is independent of Band sweep can be set. Sweep image synchronous freeze stops motion afterwriting of one line of sweep image data is written. When in the B Mode, theimage is frozen after writing of the B image is completed.

When in the Sweep Mode, the image is frozen when writing of a sweepimage line is completed.

When in the B/M Sweep Mode, B is frozen after writing of one frame, andthe M sweep image is frozen after freezing of B is completed.

WRITE CONTROL

This block is configured from a block which generates write control signals andaddresses when image data read from the line buffer is written to display memory andwhich controls erasing of display memory.

Image data (8-bit) read from the line buffer contain pixel border passing signals (INCX,INCY) in the X and Y directions. Write addresses are generated by operating the addresscounter for each direction by means of this signal. Setting of this address counter's initialvalue and controlling the up-down count makes it possible to control the image direction.

Line Buffer Interface FunctionThis function returns a Write End signal for handshaking in response to

memory write request signals from the line buffer.

Write Control Signal Generator FunctionThis function generates a write memory cycle (Read Modify Write) which

writes ultrasound data sent from the line buffer to memory. There are twosystems which generate this cycle, making it possible to repeat writing of thenext requested pixels in a 160 nsec. cycle. This is accomplished byoverlapping the 320 nsec. cycle of the two Read Modify Write systems by half.

Off Screen FunctionThe write address in both the X and Y directions is 12 bits, and a virtual


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image can be developed in a 4096 x 4096 area, but in reality, the memory areawhere ultrasound data can be written is only 512 x 512 in size. Therefore, thevirtual write area is regarded as off screen area and the writing operation is notperformed. However, since the virtual write area also operates the addresscounter, the XY Boundary Calculator's INCX and INCY are used as is in the offscreen area. After entering the memory area (on screen area), fetching fromline buffer memory begins and writing to actual memory is done, and INCX andINCY, which are added to the memory write data, operate the write addresscounter.

MEMORY CYCLE CONTROL

In this block, control of writing to and reading from memory is executed in accordancewith memory control signals generated by WRITE CONTROL and DISPLAY CONTROL.Also, this block includes the function for reading and writing of display memory data fromthe CPU during a freeze operation, and generates memory cycles and addresses foraccessing direct image memory by the CPU. It sets the X direction address (9 bit) and Ydirection address (9 bit) of the data to be accessed, specifies the surface and setsincrement/decrement. After setting is completed, the CPU can read and write to theaccess data register.

If the CPU is accessing continuous pixels in the vertical direction, the auto incrementfunction, which makes resetting of the address (Y direction) unnecessary after each access,operates. After the initial access address is set, the CPU can read the data for 1 line in thevertical direction continuously.

DISPLAY CONTROLThis block reads image data written in main memory in synch with the TV signal and

carries out TV display.Since main memory uses dual port memory, writing to RAM and reading from SAM is

done asynchronously. Therefore, TV display of image data can be done according to thepredetermined display format, reading of the contents of the SAM block can be executedand can be displayed by Serial Reading.

Display Mode (One Screen Display Function, Complex Display Function)

The following display controls can be performed.

1B2BWide 2B1MLeft-Right B/MWide Left-Right B/M

In the case of one screen display, in accordance with the display address determinedby the display mode, transfer to the SAM block of memory is executed before TV


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display begins, then in accordance with the display area signal, reading of display datafrom the SAM block is carried out.

In the case of complex display, in order to display Left-Right 2 screen mainmemory according to the display format, while TV display of screen 1 is being carriedout, data for display of screen 2 are being transferred to the SAM block (Real TimeRead Transfer) to carry out complex display.

Scroll Display FunctionThis function causes the latest write data of the sweep image to be constantly

displayed at the far right of the TV display screen. The scroll display transferaddress is generated by deleting the value of the TV display width from the sweepimage data's write address, and fetching the data in the resulting address in synchwith the TV field signal (VD).

Request Display FunctionIn the co

Date post:	21-Nov-2015
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