STM-x_win32

STM-x_win32.exe Manualfor use with STM-1 and STM-2

©2008 Sycon Instruments ♦STM-x_win32.exe manual ♦ 08/06/08 ♦ Page 1 of 28 ♦

IntroductionThis manual describes how to operate the STM-1 or STM-2 in conjunction with the

Windows program STM-x_win32.exe.

STM-x_win32.exe is the user interface for the Sycon STM-1 or STM-2. The STM-1 is an RS-232 or RS-485 based QCM, whereas the STM-2 is USB based. Both instruments have the same high accuracy and high speed measurement engine. STM-x_win32.exe is an improvement over the previous generation in the following ways:

● Thickness is accurate even if the STM-1 or STM-2, the host PC, or both reboot. Even if the reboot occurs during a deposition, once the STM and this STM-x_win32.exe are back on-line the thickness will be accurate

● Uses far fewer CPU resources that previous generations, which improves performance

● “instrument finder” allows easy connection to STM-1 or STM-2.

● Built-in materials library for faster and easier setup

Revision HistoryDate Decription2008-08-06 Initial revision2008-09-16 Added details of “# samples” parameter

Minimum System RequirementsProcessor Pentium III/Celeron 866 MHz or equivalent Ram 128 MB Screen 1024 x 768 pixels OS Windows Vista/XP/2000 Disk Space 1M


Table of ContentsIntroduction................................................................................................................................................2Minimum System Requirements................................................................................................................2Typical Vacuum System Installation Diagrams.........................................................................................5Illustration 1: System Diagram using STM-1............................................................................................5Illustration 2: System Diagram using STM-1X.........................................................................................5Illustration 3: System diagram using STM-2 and it's internal oscillator....................................................6Illustration 4: System diagram using STM-2 and external oscillator (OSC-100)......................................6Using STM-x_win32.exe with the STM-1 or STM-2................................................................................7STM-1 and STM-2 LEDs description........................................................................................................8

STA(STM-1) or Power (STM-2)..........................................................................................................8COM(STM-1) or USB(STM-2)............................................................................................................8

Illustration 5: Setup tab..............................................................................................................................9FindInst..................................................................................................................................................9Sim Rate hz/sec.....................................................................................................................................9Display mode.........................................................................................................................................9Multi-layer mode.................................................................................................................................10Run#....................................................................................................................................................10

Datalog controls.......................................................................................................................................10Off/On.................................................................................................................................................10Log period...........................................................................................................................................10Logfile Naming...................................................................................................................................10Delimiter..............................................................................................................................................11Logfile folder.......................................................................................................................................11View Log.............................................................................................................................................11

Illustration 6: Operate tab........................................................................................................................12Zero film Thk......................................................................................................................................12Zero Timer...........................................................................................................................................12Pause....................................................................................................................................................12New Run..............................................................................................................................................13New Layer...........................................................................................................................................13Change Film........................................................................................................................................13Layer Stackup......................................................................................................................................13

Illustration 7: films tab.............................................................................................................................14Description of film parameters.................................................................................................................14

Name...................................................................................................................................................14Density.................................................................................................................................................14Z-ratio..................................................................................................................................................15Tooling................................................................................................................................................15Notes....................................................................................................................................................15

Illustration 8: The film editor...................................................................................................................16Illustration 9: graphs tab..........................................................................................................................17

Autoscale and manual scaling.............................................................................................................17Exporting a picture of the graph..........................................................................................................17

Illustration 10: help/about tab..................................................................................................................18


Location of current logfile...................................................................................................................18(Advanced) Location of config file.....................................................................................................18Com Success........................................................................................................................................18Com Errors..........................................................................................................................................19SVR Build...........................................................................................................................................19#instances............................................................................................................................................19Last Comm (ms)..................................................................................................................................19Last Error.............................................................................................................................................19

Logfile Format.........................................................................................................................................20Calibration and Theory............................................................................................................................22

Thickness Reading Calibration...........................................................................................................22Initial density, Z-ratio settings.............................................................................................................22Initial tooling setting...........................................................................................................................22Empirical Density Determination........................................................................................................23Empirical Z-Factor Determination......................................................................................................23Empirical Tooling Determination.......................................................................................................23

Illustration 11: Empirical Tooling Determination....................................................................................24Materials reference...................................................................................................................................25


Typical Vacuum System Installation Diagrams

Illustration 1: System Diagram using STM-1

Illustration 2: System Diagram using STM-1X


Illustration 3: System diagram using STM-2 and it's internal oscillator

Illustration 4: System diagram using STM-2 and external oscillator (OSC-100)


Using STM-x_win32.exe with the STM-1 or STM-2STM-x_win32.exe is the main user interface for the STM-1 or STM-2 QCM. Below list the

steps required to use STM-x_win32.exe with the STM-1 or STM-2.

● Install the STM-1 or STM-2 as per diagram.

● Install STM-x_win32.exe on the PC

● Run STM-x_win32.exe and press “find inst”. Select your instrument.

At this point, the indicators should start moving and the “com success” counter on the help/about tab should be incrementing. This means you are connected and ready to go

● Program some films. When STM-x_win32.exe is installed, there is only the default film programmed. See the films tab help page for more information

● Set any other controls on the setup tab as required. See the setup tab help page for more information

At this point, you are ready to monitor a deposition

● Go to the operate tab. Most operations that you'll perform during the monitoring of a deposition are done from this tab

● Press “New Run”. Select the appropriate film

● Perform the deposition. You will probably press “zero film” just before you open the source shutter.

● If you are doing a multi-layer deposition, you will press “new layer” when you are finished with one material and are about to deposit the next. STM-x_win32.exe keeps track of the layers and total thickness for you.

● When you are finished with the substrate, you can press “new run” to end the current substrate and start a new one.


STM-1 and STM-2 LEDs description

STA(STM-1) or Power (STM-2)Condition What it means

LED is on solid Basically everything is OK. The STM-1/STM-2 is powered up and is connected to a good crystal, and the host computer has initialized the STM-1/STM-2.

LED is blinking fast (too fast to count) The STM-1/STM-2 is powered up but the crystal is no good.

LED is blinking slow (about once per second) The STM-1/STM-2 is powered up and the crystal is good, but the PC has not initialized the STM-1/STM-2. Once the PC initializes the STM-1/STM-2 the light will go on solid.

LED is OFF STM-1/STM-2 does not have power. Check the power and USB connection

COM(STM-1) or USB(STM-2)Condition What it means

LED is on solid STM-1/STM-2 is connected and communicating to a host PC

LED is blinking or flickering The STM-1/STM-2 is connected and communicating to a host PC, but the communication is erratic. This occurs when the PC is overloaded (running too many other programs)

LED is OFF STM-1/STM-2 is not communicating to the PC at all. Verify the USB or serial connection and use the “find inst” button on the STM-x_win32.exe application to connect to the instrument.

The following sections detail all of the controls of STM-x_win32.exe. Furthermore, information on any of the controls can be displayed by right clicking on the control and selecting “Description and tip...”


Illustration 5: Setup tab

This tab has the controls that set up how STM-x_win32.exe operates, how it connects to an instrument, and how and where it logs the data.

FindInstPress to find an instrument to connect to. STM-x_win32.exe can connect to a STM-1, STM-2, or a simulated instrument. The simulated instrument exactly simulates a STM-2; to provide a rate you need to adjust the "Sim Rate hz/sec" control, which is on the setup tab (and only visible if you are connected to a simulated instrument). See the description of the "Sim Rate hz/sec" control for more information

Sim Rate hz/secThis adjusts the simulated "rate" in Hz per second. A negative value provides a positive thickness/mass accumulation.

Display mode This sets the display mode for the STM-x_win32.exe. In other words, this controls the operative units


for deposition. It is not recommended to change this during a run, as the charts and logfile will contain mixed units.

Mass mode units:Mass in ug/cm² (micrograms per square centimeter)Rate in ug * s/cm² (micrograms per square centimeter per second)

Thickness mode units:Thickness in AngstromsRate in Angstroms per second

Multi-layer modeIf this box is checked, STM-x_win32.exe will operate in "multi-layer" mode, keeping track of substrate thickness across multiple layers. STM-x_win32.exe will keep track of the individual thicknesses of all layers as well as the total substrate thickness

Run#The current run number. Note that you can change the run number, even during a deposition. If you do, STM-x_win32.exe will make a new log which will not contain any information that occurred before the run number was changed.

Datalog controls

Off/OnThis enables or disables logging. You can change this at any time

Log periodThis controls how often a record will be written to disk. Any information captured in between writes to disk is discarded.

Logfile NamingThis controls how the log file will be named.

If you choose "Run#", STM-x_win32.exe will create a new and unique file for each run (named RUN#00001.txt for run 1).

If you choose "STMxlog.txt", STM-x_win32.exe will put information about all runs in the


same log file.

DelimiterThis sets the delimiter for the logfile.

Tab delimiter is recommended because tab delimited files properly open up in Microsoft Excel and OpenOffice Calc without any resistance.

Comma delimited files are available as an option for compatibility with older programs

Logfile folderUse this control to select the folder where the logfile(s) will be placed. Press the folder icon button on the right to launch a browse window.

View LogThis pops open a notepad window of the current log file. Note that you'll only see the file as it looked when you pressed view log; you will not see records go into the file live.


Illustration 6: Operate tab

This tab is used to operate the instrument. Use this tab to perform the operations required during a deposition.

Zero film ThkZeros film Thickness or mass

Zero TimerZeros film timer

PausePauses logging & graphing. The data is still polled from the instrument, however, and displayed in the indicators, but the charts and log file are frozen. The background for runtime data indicators will be red while paused


New RunStarts a new run by1) (Multi-layer mode) Empties the layer stackup2) Zero all thicknesses and timers3) Prompts for a new film3) Increments run#

New LayerAdds a new layer to the substrate by:1) Moves the current film into layer stackup2) Prompts for new film for this layer3) zeros the film thickness and timerNote that this option is only available in multi-layer mode

Change FilmChanges the active film. Pressing this launches a dialog that allows you to choose a film to run. Not that the existing thickness is not zeroed. If using the STM-2, the thickess is re-computed from the new z-ratio and tooling; but if you are using the STM-1 the thickness is not recomputed; the thickness will not change. If you do not see the film you want to run, you will need to add it via the film editor.

Layer StackupThis displays the "stackup" of materials on the current substrate. To add a new layer to the substrate, you click on "New Layer"

The "newest", and therefore current, layer is on the bottom of this table,

You cannot remove layers from this indicator, but you can clear the entire stackup by selecting "New Run"


This page displays all of the films you have created and stored. To edit this list, click on "Edit films" to launch the film editor.

Description of film parameters

NameThe name of the film. You can name the film anything you choose.

DensityThe density of the material being deposited, in gm/cc. This really only matters if you are using the thickness mode. "Bulk" density numbers can be found in the manual for common materials. For uncommon materials, a procedure for empirical determination can be found in the calibration section of this manual.


Illustration 7: films tab

Z-ratioThe Z-ratio of the material being deposited. "Bulk" density numbers can be found in the manual for common materials. For uncommon materials, a procedure for empirical determination can be found in the calibration section of this manual.

ToolingThis is the "tooling" factor and relates to the physical construction of your deposition chamber. A tooling of 100% means that the crystal sensor sees the same amount of material as the substrate. A procedure for empirical determination of tooling can be found in the calibration section of this manual.

#SamplesThis is the number of samples/measurements to place in the measurement filter. The filter is a “boxcar” FIR filter, where the samples are evenly weighted and averaged. More samples means higher rate resolution, so very low rate films will need to average some samples. The downside of averaging is that there is a delay (time constant) introduced by averaging samples. The time constant is

#samples averaged10

seconds and the rate resolution is 0.135 Å/ s

#samples averaged for aluminum (density

= 2.73, zratio = 1.08, xtal life=95%). In general the rate resolution for a new crystal is:0.368 Å / s

#samples averaged∗Density gm/cc

Note: The STM-1 has a fixed averaging (#samples) set at 20, and therefore changing this parameter has no effect.

NotesJust a field that allows you to make notes about a material


The film editor

Illustration 8: The film editor

The film editor allow you to add, delete, and change film programs. The film editor includes a built in materials library simplifying setup.

● To add a pre-pregrammed material, simply press the materials tab.● To delete a film, right click in any cell in the film's row ans select “delete row”● To add a film, you can 'tab' or click to an empty cell and type in the parameters of the new film● To add a film in the middle of the table, right click in a cell and select “add row before”


This pages shows just one of the three graphs. The graphs hold about an hours worth of data, and but the X and Y scales adjust automatically.

Autoscale and manual scalingIf you would rather not have the graph automatically scale the X and/or Y axis, simply right click on the graph and de-select “autoscale x” and/or “autoscale y”. Once autoscaling is turned off, simply click on the scales and change the numbers to the desired range.

Exporting a picture of the graphYou can also export the data from the charts in multiple formats by right-clicking on the chart and selecting “Export Simplified Image” or “Copy Data”


Illustration 9: graphs tab

This page shows some diagnostic information, such as where the logfile is or how well the instrument is communicating with the PC

Location of current logfileShows the current log file being built by STM-x_win32.exe. This log file contains the runtime information like rate, thickness, etc. See a sample of the log file in appendix ss

(Advanced) Location of config fileShows the configuration file in use by STM-x_win32.exe. The configuration file contains all of the settings for the STM-x_win32.exe, including all of the films.

Com SuccessShows how many times STM-x_win32.exe communicated with an instrument successfully.


Illustration 10: help/about tab

Com ErrorsShows how many times STM-x_win32.exe tried to communicate to an instrument and failed

SVR BuildThe build/version of the communication server

#instancesShows how many clients are using the communication server. It is possible to have multiple instances of STM-x_win32.exe are running, and furthermore it is possible to have other programs running that access the same instrument without conflict.

Last Comm (ms)Shows how long it took for the instrument to respond to a command, in milliseconds. This includes the time that it took to receive all of the data.

Last ErrorShows the status of the last communication error. The error code and source describe the error.


Logfile FormatThe log file is a tab (or comma) delimited text file that contains the runtime data and status

information. When the log file is created, a header is placed into the file so that the data in the columns can be identified. Note that if you change the display mode (mass/thickness) during a run, the header is not changed, so the data will not match the header. A record is placed into the log file periodically based on the 'Log Period' control. The logfile is designed to easily import into Microsoft Excel, OpenOffice Calc, and other spreadsheet programs. The following describes the data contained in the log file.

TimestampThe time of the record data in ISO 8601 format. This format was chosed because it readily

imports into all popular spreadsheets and databases, and sorts well.

StatusLineThe status line as it was shown on the screen. This contains:

● The program status, running or paused (see the pause button on the operate tab)● The running film timer● Crystal Life● The run number● The datalogging status (On or off)● The name of the active film

Rate The deposition rate of the current film in Å/S or ug.s/cm²

Thickness/mass The thickness or mass of the current film in Angstroms (Å) or ug/cm²

Substrate thickness/mass The total substrate thickness/mass in Angstroms (Å) or ug/cm². Note that this number is only meaningful in multi-layer mode

Frequency The frequency of the crystal in Hz


Example Logfile (thickness mode)

Timestamp StatusLine Rate (Å/S) Film Thickness (kÅ)

Substrate Thickness (kÅ)

Frequency (Hz)

2008-07-29T21:54:54

RUNNING | 0:00:21 | Life 50% | RUN# 0 | LOGGING OFF | Film DEFAULT

0.35 0.000 0.000 6000000.04

2008-07-29T21:54:55

RUNNING | 0:00:22 | Life 50% | RUN# 0 | LOGGING ON | Film DEFAULT

0.06 0.000 0.000 6000000.02

2008-07-29T21:54:56

RUNNING | 0:00:23 | Life 50% | RUN# 0 | LOGGING ON | Film DEFAULT

-0.13 0.000 0.000 6000000.06

Example Logfile (mass mode)

Timestamp StatusLine Rate (ug.s/cm²)

Film Mass (ug/cm²)

Substrate Mass (ug/cm²)

Frequency (Hz)

2008-08-06T22:36:31

RUNNING | 0:00:03 | Life 50% | RUN# 1 | LOGGING OFF | Film F1

0.01 0.043 0.043 5989938.46

2008-08-06T22:36:36

RUNNING | 0:00:08 | Life 50% | RUN# 1 | LOGGING ON | Film F1

0.01 0.104 0.104 5989888.40

2008-08-06T22:36:37

RUNNING | 0:00:10 | Life 50% | RUN# 1 | LOGGING ON | Film F1

0.01 0.117 0.117 5989878.06

Although it is shown in table format, the log data file is ASCII text, with tab characters separating the table columns and the newline character separating the rows. Also note that the only difference between the two different modes is the header.


Calibration and Theory

Thickness Reading CalibrationInstrument calibration is affected by three different parameters: material density, material Z-Factor, and tooling. Tooling is a deposition system geometry correction (location of sensor relative to substrates). Density and Z-Factor are material factors.

Initial density, Z-ratio settingsFor density and z-ratios, using the bulk values are usually accurate enough. A list of Z-Factor values may be found in the material reference table . For materials not listed in the table, Z-Factor may be calculated by the following formula:

21

ff

qq

UDUD

FactorZ

••

=−

where:

Dq = Density of quartz

Uq = Shear modulus of quartz

Df = Density of film

Uf = Shear modulus of film

Initial tooling settingFor the initial tooling value, use the following formula:

( )( ) 100θcosθcos

ddTooling(%)

vx

vs2

vs

vx ∗

∗

=

where:

dvx = Distance between source and crystal/sensordvs = Distance between source and substrateθvs = Angle of the substrate face off a straight line to the sourceθvx = Angle of the crystal face off a straight line to the source

For the above angles, an angle of 0 means the face of the crystal or substrate points directly toward the source.


Empirical Density DeterminationUse of the material bulk density value will normally provide sufficient film thickness accuracy. If additional accuracy is required, the following procedure may be used: Using a new sensor crystal (this eliminates Z-Factor errors) place a substrate adjacent to the sensor so that both sensor and substrate see the same evaporant stream. Set the instrument density to the bulk value of the material (see the Material Reference Table in section 4.3). Set the Z-Factor to 1.000 and the tooling factor to 100%. Deposit approximately 5000 angstroms of material on the sensor and substrate. After deposition remove the substrate and measure the film thickness with a profilometer or multiple beam interferometer. The correct density value may be determined by the formula:

( ) ( )( )icknessMeasuredTh

ReadingameterDensityParccgmDensity •=

The calculated value may be checked by setting the density parameter to the calculated value and observing that the thickness display shows the corrected reading. Minor value adjustments can be made to make the measurements and calculations exactly equal.

Empirical Z-Factor DeterminationUse the calibrated density value, a Z-Factor of 1.000 and a tooling of 100%. Deposit a thick film using at least 50% of the sensor crystal life. Measure the substrate and then adjust the Z-Factor parameter until the correct thickness is displayed.

Empirical Tooling DeterminationPlace a substrate in the normal holder location and deposit a film of approximately 5000 angstroms using either bulk or calibrated density and Z-Factor values. Make sure that when doing this calibration the tooling is set to 100%. Measure the substrate film thickness as in the density calibration method and determine the correct tooling factor value by the following formula:

( ) ( )( )hicknessDisplayedT

hicknessSubstrateT100%Tooling ∗=


Illustration 11: Empirical Tooling Determination

The calculated value may be checked by setting the tooling parameter to the calculated value and observing that the thickness display shows the corrected reading. Minor value adjustments can be made to make the measurements and calculations exactly equal.


Materials referenceThis table shows the materials that are available in the built-in materials library. Note that

you do not have to enter this information manually; it is already in the program. It is included here for reference.

Material Symbol Density Z-Factor

Aluminum Al 2.73 1.080Aluminum Oxide Al2O3 3.97 --------Antimony Sb 6.62 0.768Arsenic As 5.73 0.966Barium Ba 3.50 2.100Beryllium Be 1.85 0.543Bismuth Bi 9.80 0.790Bismuth Oxide Bi2O3 8.90 --------Boron B 2.54 0.389Cadmium Cd 8.64 0.682Cadmium Selenide CdSe 5.81 --------Cadmium Sulfide CdS 4.83 1.020Cadmium Telluride CdTe 5.85 0.980Calcium Ca 1.55 2.620Calcium Fluoride CaF2 3.18 0.775Carbon (Diamond) C 3.52 0.220Carbon (Graphite) C 2.25 3.260Cerium (III) Fluoride CeF3 6.16 --------Cerium (IV) Oxide CeO2 7.13 --------Chromium Cr 7.20 0.305Chromium (III) Oxide Cr2O3 5.21 --------Cobalt Co 8.71 0.343Copper Cu 8.93 0.437Copper (I) Sulfide (A) Cu2S (A) 5.60 0.690Copper (I) Sulfide (B) Cu2S (B) 5.80 0.670


Material Symbol Density Z-FactorCopper (III) Sulfide CuS 4.60 0.820Dysprosium Dy 8.54 0.600Erbium Er 9.05 0.740Gadolinium Gd 7.89 0.670Gallium Ga 5.93 0.593Gallium Arsenide GaAs 5.31 1.590Germanium Ge 5.35 0.516Gold Au 19.3 0.381Hafnium Hf 13.1 0.360Hafnium Oxide HfO2 9.63 --------Holnium Ho 8.80 0.580Indium In 7.30 0.841Indium Intimonide InSb 5.76 0.769Indium Oxide In2O3 7.18 --------Iridium Ir 22.4 0.129Iron Fe 7.86 0.349Lanthanum La 6.17 0.920Lanthanum Fluoride LaF3 5.94 --------Lanthanum Oxide LaO3 6.51 --------Lead Pb 11.3 1.130Lead Sulfide PbS 7.50 0.566Lithium Li 0.53 5.900Lithium Fluoride LiF 2.64 0.774Magnesium Mg 1.74 1.610Magnesium Fluoride MgF2 3.00 --------Magnesium Oxide MgO 3.58 0.411Manganese Mn 7.20 0.377Manganese (II) Sulfide MnS 3.99 0.940Mercury Hg 13.46 0.740Molybdenum Mo 10.2 0.257Neodynium Fluoride NdF3 6.506 --------Neodynium Oxide Nd2O3 7.24 --------


Material Symbol Density Z-FactorNickel Ni 8.91 0.331Niobium Nb 8.57 0.493Niobium (V) Oxide Nb2O5 4.47 --------Palladium Pd 12.0 0.357Platinum Pt 21.4 0.245Potassium Chloride KCl 1.98 2.050Rhenium Re 21.04 0.150Rhodium Rh 12.41 0.210Rubidium Rb 1.53 2.540Samarium Sm 7.54 0.890Scandium Sc 3.00 0.910Selenium Se 4.82 0.864Silicon Si 2.32 0.712Silicon (II) Oxide SiO 2.13 0.870Silicon Dioxide SiO2 2.20 1.070Silver Ag 10.5 0.529Silver Bromide AgBr 6.47 1.180Silver Chloride AgCl 5.56 1.320Sodium Na 0.97 4.800Sodium Chloride NaCl 2.17 1.570Sulfur S 2.07 2.290Tantalum Ta 16.6 0.262Tantalum (IV) Oxide Ta2O5 8.20 0.300Tellurium Te 6.25 0.900Terbium Tb 8.27 0.660Thallium Tl 11.85 1.550Thorium (IV) Fluoride ThF4 6.32 --------Tin Sn 7.30 0.724Titanium Ti 4.50 0.628Titanium (IV) Oxide TiO2 4.26 0.400Titanium Oxide TiO 4.90 --------Tungsten W 19.3 0.163


Material Symbol Density Z-FactorTungsten Carbide WC 15.6 0.151Uranium U 18.7 0.238Vanadium V 5.96 0.530Ytterbium Yb 6.98 1.130Yttrium Y 4.34 0.835Yttrium Oxide Y2O3 5.01 --------Zinc Zn 7.04 0.514Zinc Oxide ZnO 5.61 0.556Zinc Selenide ZnSe 5.26 0.722Zinc Sulfide ZnS 4.09 0.775Zirconium Zr 6.51 0.600Zirconium Oxide ZrO2 5.6 --------


Date post:	12-Sep-2014
Category:	Documents
Upload:	goldfronts1
View:	103 times
Download:	4 times

STM-x_win32

Documents