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STMicroelectronics Dr. Kaushik Saha Smart Card ICs Smart Card ICs Dr. Kaushik Saha...

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STMicroelectronics Smart Card ICs Dr. Kaushik Saha STMicroelectronics CSME –2002 (Chandigarh, India)
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STMicroelectronics

Smart Card ICs

Dr. Kaushik SahaSTMicroelectronics

CSME –2002 (Chandigarh, India)

ST Products & Solutions

Agenda

� Smart cards market overview

� Issues in the Smartcard Business

� ST Solutions

TAM EvolutionMillion Units

Mobile application - Smart cards IC’s increase.

A second boom –– banking schemes – ID & authentication – Pay-TV

0

100200300

400500

600700

800900

1998 1999 2000 2001 2002

Mobile FinancialPay tv & IT Govern. & IDOthers

E-Purse

Débit/Credit

Multi-appli.

Loyalty

Present Financial Cards market split

� Standard : CEPS NS*• Proprietary : GeldKarte – Proton - Moneo 37

� Standard : EMV - UKis 11� Proprietary: B0' 30

� Standard : Open platform -Multos - WfSC 2� Proprietary : MPCOS - Payflex - TIBC 9

Market split in Mu(%)

� Proprietary solution only 11

NS : Non Significant

Source ST

Multi-application focus

Multi-application means several things :– By segment of market

� Multi-application within the same market� Multi-application inter segment

– Through technical implementation� Application in hardware (ROM)� Download of applet in memory (eeprom / flash)

StandardizationSmart card standardization is driven from two sides:

� the international standards organizations (ISO, ANSI,CEN, etc.).

w the industry based on emerging markets and products.� Eg. Visa, Mastercard and Europay jointly defined standards for

debit/credit applications - EMV standard.� Eg. industry driven standards PC/SC and the OpenCard

Framework � define guidelines and interface definitions for smart card

applications.

Interoperability

Ability to support the same functionality using different smart cards with

� different protocols and� different data organisation.

High-level abstraction of data objects and access mechanisms is required,

� using a common interface and� with card-specific details hidden from application.

� Security of a Smart Card chip results from the combination of :

�Technology

�design (hardware features)

�firmware (embedded software)

�manufacturing environments

�application software

� At each level, the concern is to achieve a maximum level of performance in terms of confidentiality, integrity and availability of confidential information

� The highest level of coherence has to be reached between various security mechanism

Security

Common Technical Standards

XxXxPoorNOMulti-Sourcing

XxxxNONOPost Issuance Writing

XXXNOInteroperability

?XxXxXxxSecurity

xxxXMulti applications

WindowsJava Card 2.1.1MULTOSOS

�Any card project has to be compliant to:–ISO7816 (1 to 4) for contact.–ISO14443 (Part A or B) for Contactless.

Market Requirements for Smart cards

HigherPerformance

IncreasedSecurity

MemoryPartitioning

LargerMemory Sizes

CryptoCapability

Cost effectiveTechnologies

Contact lessSolutions

Secure Single Chip Layout

STM Product Portfolio

� EEPROM: 512B - 16KB� ROM: 6Kb - 22Kb� RAM: 128B - 512B� Crypto, RF

ST16 Family

� EEPROM: 2Kb - 66Kb� ROM: 23Kb - 96Kb� RAM: 1Kb - 4Kb � Crypto, RF, MMU � Custom logic

ST19/X Family

ST22 Family

� 32 bit RISCcore� Direct JAVA byte code interpretation� Fast crypto software computation� RF capability

90 019997 03 05

Performance

Productstailored to market needs

Conventional EDP System architecture

OS Service Calls(OS Specific)

H/W (CPU, Memory, Peripherals

OS Kernel(Win, Unix)

Applications (m/c specific executable code)

•Application must be tailored & targetted to CPU and OS.•Long Development Cycle, Non-Portability, Non-OPEN

JAVA Virtual Machine

OS Service Calls(OS Specific) OS Kernel

Java Apps (m/c independent executable code)

H/W (CPU, Memory, Peripherals

Abstract Virtual MachineGeneric ServiceCalls

Java Benefits and IssuesJava benefits– Application code portability across platforms

Write once, Run everywhere®

– Security mechanisms– Adapted to downloading

• Java issues– Slow execution when implemented fully in

software, 10 to 50 x slower than compiled code– Memory large footprint– Standardisation

ExecutionUnit

SPPC

HSI

JavaCard Runtime Env.

JavaCard API

ClassLoader

GC,…

Java

Car

dVM

NativeDecoder

SmartJ™ JVM

JavaCardDecoder JSP

JPC

LongBytecodeInterpreter

Standard JVM

NativeDecoder SP

ExecutionUnit

HSI

JavaCard Runtime Env.

JavaCardBytecodeInterpreter

PC

JSPJPCJavaCard

Decoder

JavaCard API

ClassLoader

GC,…

HA

RD

WA

RE

Java

Car

dVM

JavaCard™ Hardware Execution

Data

ROM

EEPROM

RAM

ASIISO7816

Native instructions ST22CPU core

MPU

JavaCardDecoder

JavaCard bytecodes

SmartJ™ Architecture

CLOCKMGMT

ST2232-bitCPU

POWERMGMT

MPU

EEPROMROM

ROM BUS

TIM

ER

SE

CU

RIT

Y

RA

ND

OM

CIC

RAM

PERIPHERALS

RAM BUS

AS

I

ISO7816Serial

SmartJ™ FeaturesCPU– 32-bit RISC microprocessor architecture,

24-bit linear memory addressing– Hardware JavaCard™-2.1 execution– 21 MIPS @ 33 MHz

• SECURITY– DES cryptography– RSA and Elliptic Curve cryptography– Memory Protection Unit and instruction-set security

features for code/data firewalling– large ROM up to 128 Kbytes– large EEPROM up to 64 Kbytes

SmartJ™ SecurityIC hardware security– DPA / SPA countermeasures– Memory observation

countermeasures

– Up to 40 MHz on-chip generation internal clock

– Large power supply range with on-chip regulator

• 2.7 to 5.5 V in 0.35 µm process• 1.6 to 5.5 V in 0.18 µm process

– Dual execution mode Supervisor / User– Specific asynchronous reset and clear

all registers instructions


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