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Strained Silicon Technology

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    Strained Silicon Technology

    TANZEEM IQBAL

    M.Tech 3rd SEM.(EC&SD)10LEM301

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    Overview Introduction

    CMOS

    CMOS Scaling

    Strained SiliconWhy Strained Silicon ?

    How does it work ?

    How do we make it ? Drawbacks

    Conclusions

    References

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    Introduction (CMOS History)

    34

    The first ever MOSFET transistor wasdesigned by M. M. Atalla, D. Kahng, andE. Labate in late1959

    first commercially availableintegrated circuit made byFairchild Semiconductor in 1960

    Intel 4004 microprocessor in 1971Intel Pentium 4 released in late

    90s

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    CMOS

    Complementary Metal-oxide-semiconductorfield-effect transistors

    CMOS devices based on sophisticated Si are afundamental building block for mainstreamintegrated circuits

    Technology drivers in the microelectronics

    industry

    Due to excellent scalability and integrationability

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    Moores Law

    More and moretransistors every year

    Higher and higher

    speeds How can we continue

    to innovate and movefaster?

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    CMOS scaling

    Scaling of CMOS devices has reached innanometers

    At nanoscale short channel effects occurs

    SCE will degrade the current drivability andelectron mobility of MOSFET

    Therefore, further improvement is required to goahead in scaling

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    Short Channel Effects

    As the channel length L is reduced to increase both theoperation speed and the number of components perchip, the so-called short-channel effects arise.

    The short-channel effects are attributed to two physicalphenomena:

    1. The limitation imposed on electron drift characteristics inthe channel,

    2. The modification of the threshold voltage due to theshortening channel length.

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    CMOS scaling

    END OF TRADITIONAL SCALING ERA ~ 2003

    Lasted ~40 YEARS

    2X transistors

    every 2 years

    Traditional Scaling Era

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    How scaling reduces Mobility ?

    As gate length reduces vertical electric fieldincreases

    This leads to velocity saturation

    In velocity saturation, drift velocity remainsconstant after a fixed value of electric field

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    Need for High Current drivability

    In highly interconnected integrated circuits, thehigh current drivability of the transistors is veryimportant for the circuit performance

    Circuit speed is dominate charging/dischargingof the load capacitance

    We need mechanism so that we can increasethe current drivability in nanoscale CMOS

    devices

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    How to go ahead with scaling ?

    To follow Moores Law, we will have to innovateand use materials that results in further scalingwithout performance degradation

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    Overview Introduction

    CMOS

    CMOS Scaling

    Strained Silicon

    Why Strained Silicon ?

    How does it work ?

    How do we make it ? Drawbacks

    Conclusions

    References

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    Strained Silicon

    As gate length shrinks, mobility decreases

    Method to increase mobility of electrons andholes in the channel of an FET

    Tensile and compressive strain applied tochannel

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    Strained Silicon

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    Strained Silicon

    Drain Current Improvement

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    Strained silicon

    How does it work?

    Basic idea: Change the lattice constant of thematerial

    Changes energy band structure!

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    Strained Silicon

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    Strained Silicon: Electrons

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    Strained Silicon: Electrons

    Electrical symmetry destroyed by strain Four energy valleys go down in energy, two

    go up

    Change in curvature

    Reduction in effective mass!

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    Strained Silicon: Holes

    What about the holes?

    Uniaxial strain reduces effective mass

    Biaxial Strain splits LH and HH bands, reduces scattering

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    Fabrication of strained silicon

    Effect was noticed in early 1950s

    Generally an effect to be avoided

    In recent years, scaling has become more difficult

    Idea revived at MIT in early 1990s

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    Two types of strain

    Compressive

    Tensile

    Two directions of strain

    Uniaxial

    Biaxial

    Fabrication of strained silicon

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    Biaxial Fabrication

    Biaxial techniques pioneeredfirst

    Method preferred by IBMthough examined by all majorsemiconductor firms

    Graded SixGe1-x layer grown onsilicon substrate

    Si Lattice constant = 5.4309 Ge Lattice constant = 5.6575

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    Biaxial Fabrication

    Additional SixGe1-x grown ontop of graded layer

    Thin layer of siliconepitaxially grown on layer ofSiGe SiGe has larger lattice

    constant than Si (1% larger) Strains the x and y

    directions

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    Strained Silicon on Insulator(SSOI)

    SiGe on insulator, with silicon epitaxiallygrown on SiGe

    Positive benefits of SOI (lower capacitances, faster

    switching, lower leakage) as well as benefits ofstrain

    But wouldnt it be good if we could do

    strained silicon on insulator without SiGeunderlayer?

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    Problems in Biaxial Strain

    It takes high germanium content for high holemobility

    Less throughput as compared to uniaxial strain

    Biaxial strain is not cost effective

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    Uniaxial Strain

    Method preferred by INTEL

    Problems with Biaxial strain

    Reexamine the problem Need strain in the channel of

    the MOSFET

    Tensile strain in NMOS

    Compressive in PMOS

    Strain needed in directionfrom source to drain

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    Uniaxial Strain

    NMOS Standard fabrication

    Cap with SiNx High temperature

    deposition

    Uniaxial Strain Only onedirection

    10% increase in Idsat

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    Uniaxial Strain

    PMOS Remove source and

    drain

    Selectively grow epi-SiGein source and drain

    Nickel Silicide grown onsource, drain and gate

    Improvements in Idsatof 25%-30%

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    Recent Strained Silicon TechnologyNodes

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    Overview Introduction

    CMOS

    CMOS Scaling

    Strained Silicon

    Why Strained Silicon ?

    How does it work ?

    How do we make it ? Drawbacks

    Conclusions

    References

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    Drawbacks

    Strain is always a problem

    Unwanted strain changes wave functions

    Work always done to remove the strain

    Proposals to actually increase the strain instead

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    Conclusions

    Strain in Silicon can increase mobility in NMOS andPMOS FETs

    Biaxial and Uniaxial strain techniques are developed

    In use by major players

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    References

    Alexey G. Shapin, Sergey V. Kalinin Strained Silicon as New High-Speed Technology. 7th International Siberian Workshop And Tutorials,EDM2006

    Zoolfakar A.S, Ahmad A. Holes Mobility Enhancement Using StrainedSilicon,SiGe Technology. 5th International Colloquium on SignalProcessing & Its Application(CSPA)

    Min Chu, Yongke Sun Strain: A Solution for Higher carrier mobility in NanoscaleSilicon Annual Review of Material Research 2009

    K. Mistry, M. Armstrong Delaying Forever: Uniaxial Strained Silicon Transistors ina 90nm CMOS Technology 2004 Symposium on VLSI Technology Digest ofTechnical Papers

    M. Reiche O. Moutanabbir Strained Silicon DevicesSolid State Phenomena Vols.156-158 (2010) pp 61-68

    A.G.ONeill, S H OlsenStrained Silicon Technology, 2006 IEEE Scott E. Thompson, Guangyu Sun Uniaxial-Process-Induced Strained Si:Extending

    the CMOS Roadmap IEEE Transactions on Electron devices, vol. 53, no. 5, May2006

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    THANK YOU


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