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Study of Prompt Dimuon and Charm Productionwith Proton and Heavy Ion Beams at the CERN SPS
The NA60 experiment
Carlos Lourenço and Gianluca Usaion behalf of the NA60 Collaboration
• Reminder of the physics motivation and plans of NA60
• Evolution with respect to the proposal
– Experimental apparatus
– Readout electronics, DAQ and detector control
Excess production of intermediate mass dimuons
NA38+NA50
• The p-A data is properly described by Drell-Yan and charm decays
• The required charm cross-section agrees with previous direct measurements
• In heavy ion collisions the yield of produced dimuons exceeds the expected sources
• The excess increases with the centrality of the nuclear collisions
NA50
Charm enhancement ?
The measured yields can be reproduced by scaling up the expected charm contribution by up to a factor 3
L. Capelli, NA50, at QM2001
Thermal model of Rapp and Shuryak(central collisions only)explicit introduction of a QGP phase
Integration over space-time history :
fireball lifetime : 14 fm/c
initial temperature : Ti = 192 MeV
critical temperature : Tc = 175 MeV
Thermal dimuons production ?
L. Capelli, NA50, at QM2001
The measured yields can also be reproduced by addingthermal radiation to the Drell-Yan and open charm
sources
+
-
Low mass dilepton production
• The p-Be and p-Au data are properly described by the standard cocktail of hadronic decays but there is an excess in the Pb-Au data !
• The excess increases with the square of the charged particle multiplicity and is more pronounced at low pT
• Chiral symmetry restoration ? Better statistics, signal to background ratio and mass resolution are needed !
J/ suppression in S-U and Pb-Pb (1987-1998)
melting of c ? melting of direct J/ ?
Color screening prevents charmonia formation in a deconfined medium. Binding energies :
’ 50 MeV, c 250 MeV, J/ 650 MeV
The thresholds are only visible in the Pb-Pb data !
A new collision system is needed to check onset
PLB 477 (2000) 28
NA50
NA50QM2001
’ suppression in S-U collisions
melting of ’ ?
Drop byfactor ~ 3
The ’ suppression pattern is very different between p-A and S-U data !
Color screening ? If so, what is the ’ melting temperature ( value of Tc ) ?
A new collision system is needed with points below and above L = 4-5 fm
Physics motivation
What is the origin of the intermediate mass dimuon excess ? Thermal dimuons ?
Is the open charm yield enhanced in nucleus-nucleus collisions ?
Is the meson modified by the medium ? observe the reference peak !
What is the physics variable that rules the onset of J/ suppression ?
What is the physical origin of the ’ suppression ? Color screening ?
What fraction of J/ come from c decays ?
What is the nuclear dependence of c production in p-A collisions ?
Detector concept
• Track matching through the muon filter• Improved mass resolution• Improved signal / background ratio (rejection of and K decays)• Improved systematical uncertainties (vertex reconstruction)
• Muon track offset measurement • Separate charm from prompt (thermal) dimuons
D
{offset
vertex
Adding silicon detectors to track the muons before they traverse
the hadron absorber
Improved measurement of prompt dimuon production and
open charm in heavy ion collisions
The silicon vertex spectrometer proposed in P316
• 10 planes• 88 pixel readout chips• 720 000 channels• pixel size : 50425 m2
Silicon pixel telescope
1.7 Tdipole field
• 2 x-y stations of -strip Si detectors at T = 130 K
• ~ 20 m resolution on the transverse coordinates of the beam ions
Beamscope
Dimuon mass resolution : simulation
• Clear improvement in mass resolution and signal / background ratio
M at M = 1 GeV : 70 MeV in NA50 20 MeV in NA60
NA50
NA60
Vertexspectrometer
with pixels
without pixels
J/
’
• 4 “half” planes• 33 LHC1 chips• ~ 60’000 channels
1998 feasibility tests
absorber
target
pixel box
TC8 magnet
1.7 T dipolemagnetic field
Dimuon mass resolution : April 1998 data
• few hours at ~ 10 8 protons / burst on a 10 mm Be target• half acceptance, bump-bonding, radiation damage low detector efficiency• only 600 dimuon events in the final analysis data sample
without pixels
M = 70 MeV
with pixels
M = 20 MeV
Measurement of the muon track offset
Determination of the interaction vertex
Impact parameter of themuon tracks
D+ : c = 317 m
D0 : c = 124 m
D
IMR excess : charm or thermal dimuons ?
• Prompt dimuons selection : events with muon track offset < 90 m
• Charm selection : events with muon track offset
in the range 90 800 m and muons > 180 m away from each other in the transverse plane at zv
c production in p-Be and p-Pb
photon converter
• 4 Be and 1 Pb targets; ~ 30 days of protons• Background subtracted by mixing J/ and
e+e pairs from different events
c e+e
• What fraction of J/ ’s come from c decays ?
• Does it change from p-Be to p-Pb ?
B = 1.7 T
Developments since the proposal
• Offline software advancing well : AliRoot framework, from Fortran to C++
• Beamscope tested in Sept. - Nov. 2000 : 42 days of high intensity Pb beam
• New detector : beamscope for proton running, with new fast amplifier chip
• New target dipole magnet : higher field ; much better integration of detectors
• Better detectors to reject bad triggers : quartz blade, interaction counter, P2
• New gas system for the muon chambers
• New readout electronics and DAQ : increased bandwidth
We benefit from the critical help provided by the ALICE offline software team,the RD39 collaboration and the cryo lab,the EP-MIC group, W. Flegel and F. Bergsma,the LHC gas group (F. Hahn et al.),the EP-ED group and the EP-AID group
Status of the offline software
Detector setup :• The whole detector geometry and materials are described using GEANT
Event generation :• Soft signals with Genesis code (thermal distributions)• Hard processes with PYTHIA• Underlying hadronic background with VENUS
Algorithms :• Trigger logic implemented• Detector response done up to the hit level• Track and vertex reconstruction under development• Everything must be ready for the October 2001 run
The beamscope detector
CryogenicModule
Amplifier Cards
200 mm
Vacuumchamber
CCE (in %)
Heavily irradiated silicon detectors continue working when operated at cryogenic temperatures
beam
Beamscope test in November 1999
Exposed for 3 days to the 40 A GeV Pb beamAverage beam intensity: 5106 ions per 4.5 s burstTotal dose: ~ 1 Grad
Beamscope test in Sept.-Nov. 2000
Exposed 42 days in the NA50 Pb beamAverage beam intensity: 710 7 ions per 4.5 s burstTotal fluence : 5 ± 2 1014 ions / cm2 ( 90 ± 40 Grad )Electronics suffered from radiation in the beam area
Pb ion signal shape
8 Gs/s
time (ns)
amp
litu
de
(mV
)
200 V
2 Gs/s
time (ns)am
pli
tud
e (m
V)
200 V
• Very fast rise time ( < 500 ps)• Long tail (~ 20 ns)• Shaping (signal width ~ 4 ns) improves double-pulse resolution
• Signal is broader• Amplitude ~ 20 times lower
but still visible !
Non-irradiated After ~ 40 Grad
Beam profile and cluster correlations
hit
s (
103
)
strip number
Day 38
1.2 mm
hit
s (
103
)
Time accuracy of thereadout electronics system
integrating all the stripsover several spills
= 1.0 ± 0.1 ns
Day 42
y2 (m)
y 4 (m
)
Correlation of clusters inthe 2 vertical measurements
Beamscope for proton running
Chip CERN_NA60_32_ch• Measuring the interaction point with few prompt tracks• ~ 100 % sub-target reconstruction efficiency• Improved Z and X-Y vertex resolutions
Increased tagging efficiency forD mesons and prompt muons
• New CMOS readout chip for the proton beamscope• 32 channels ; runs at around T = 130 K• Simulated double peak resolution : 10 ns at room T• High gain : 1 mip = 60 mV• Power dissipation = 275 mW• Design submitted for production• Tests and module assembly start mid June• Use on the beam in October 2001
Improvement in the vertex magnet
The new dipole magnet, PT7, has a field of 2.5 T (for I = 900 A).
The mass resolution of the c peak, dominated by the momentum measurement
of the electron and positron tracks, improves from 43 MeV to 25 MeV.The signal to background ratio improves by around factor of 2.The integration of the detectors is much easier than with TC8.
Field along beam axis
NA60 target region
Front view
PT7 Beamscope modulesat 45 degrees
BeOabsorber
The integration and installation studies have started, including mechanical supports, alignment, cooling systems, vacuum, readout cables, etc.Care must be taken with the strong magnetic field and the high radiation load.
Critical concerns
• The NA60 physics program relies heavily on the intermediate mass ion beam
Indium-Indium collisions should be available as soon as possible
• The operation of the muon spectrometer demands the support of IN2P3• The construction of the silicon vertex spectrometer and the successful operation
of NA60 requires a strong CERN participation
The NA60 collaboration is weaker than anticipated one year ago
• Successive time delays in the availability of the Alice1 pixel readout chips• Only around 15 good assemblies are expected per wafer
Silicon pixel telescope will not be ready before the ion run of 2002
Silicon microstrip telescope for proton physics
Each detector is one wafer; inner part = A-D zones; outer part = E-F zonesOnly the ~ 300 m thickness of the sensors on the way of the particlesSmall detectors (only inner part is read) = 384 channels per half planeBig detectors (all strips are read) = 768 channels per half planeOne readout chip, SCTA3, reads 128 stripsFull telescope = 4 small and 3 big X-Y stations = 120 readout chipsOne hybrid (3 or 6 chips) and DAQ adapter card per half plane; total = 2814 ADC cards, 6 channels each (3 ADCs per hybrid)Data rate around 30 Mbyte per burst ; 2 PCI-FLIC cards needed in 1 PCRequires only 28 working pixel chips to build 3 small and 1 big pixel planes
6.5 charged particles per average p-Pb collision : less than 2 or 3 % occupancyResolution in impact parameter of muon tracks is around 25 m
VME readout electronics for pixel telescope
2 VME crates
VME to PCIMXI-2 interface
20 Mbyte/s
721 000 channels
Limitations : required bandwidth beyond VME limit (12 Mbyte/s) number of events / burst limited to 4000 non scalable system bad ratio performance / cost (VME crates) pixel chips readout frequency limited to 10 MHz
64 pixel chips24 pixel chips
VME Pilot board
Zero sup
32 bit FIFO
Hit encoding
20 bitFIFO
VMEVM
E b
us
pixchip pixchip pixchip
Readout of muon chambers and trigger hodoscopes
22 RMH modules / crate
System encoder 16 bit words
To VME buffer 4 Mbyte
Cascaded CAMACcrates
RMH32 hit channels
20 000 channels
Limitations :
memory limit on the RMH to VME interface buffer : 4 Mbyte
slow word transmission protocol (500 ns) number of events / burst < 4000
PCI - FLIC readout electronics
PCI - FLIC card
Mezzanine outline
User connector ;46 signals for pixel data
Pixel Readout Board(PCI mezzanine card)
To / from front-endelectronics (LVDS)
FPGA on PRB
Mezzanine
area
F
I
F
O
32 Mbytespill-buffer
PCI bus 100 Mbyte/s
RAM
Zero suppression & hit encoding -pixel chips readout control
F
I
F
O
PCI readout electronics for the pixel telescope
PCI cards(up to 5 cards perPC motherboard)
Local data concentrators(under DATE software control)
Parallel readoutscalable system
74 Mbyte/s
Linux PCs
Pixel telescope data throughput
10 K x 16 bit words 20 Kbyte / event
PCI :20 Kbyte / event @ 74 Mbyte / s
270 s to acquire one event
VME :20 Kbyte / event @ 20 Mbyte / s 1000 s to acquire one event
Pixel plane number
Ave
rage
hit
nu
mb
erSmall planes
Large planes
Pixel telescope readout performance
Pixel chip :4 Event Buffers
VME :1000 s / event
pixCLK @ 10 MHz
PCI :270 s / eventpixCLK @ 20
MHz
We can take ~ 8000 events on tape / burstwith less than 10 % dead time
MultiEvent Buffer :dead time 1/4 of SingleEvent Buffer
triggers per second
dea
d t
ime
PCI readout electronics for RMH
RMH cable adapter mezzanine
RMH NIM signals
ECL TTL convertersDifferential 2*22 ECL
32 MB spill-buffer
RMH cable handshake
Word cycle 350 ns6 MB/s bandwidth
16 bit word handshake
10..15 sec readout from burst buffer5 sec fill buffer
Muon spectrometer readout performance
320 (16 bit) words / event 0.7 Kbyte / event RMH PCI buffer bandwidth 6 Mbyte / s
NA50
NA60
dea
d t
ime
triggers per second
NA50 : 500 ns/word x 320 words = 160 sone partition : 160 s service time700 triggers/s, with 10 % dead time, spill of 5 s : 3150 events on tape / burst
NA60 : 350 ns/word x 320 words = 100 stwo partitions : 50-60 s service time1800 triggers/s, with 10 % dead time, spill of 5 s : 8000 events on tape / burst
10 %
From VME to PCI detector readout : summary
General : easy readout partitioning (up to 5 PCI cards per PC)
PCI spill-buffer directly mappable into the DAQ software
Pixel detector : PCI cards readout in parallel (sequential readout with VME)
74 Mbyte/s bandwidth (20 Mbyte/s with VME)
pixel chips clocked @ 10 - 20 - 40 MHz (on board PLL)
Muon spectrometer : PCI spill buffer increased to 32 Mbyte (4 Mbyte with VME)
hit readout time 350 ns (500 ns with VME)
The data acquisition system
60 MB/burst 80 MB/burst 1.2 MB/burst 8 MB/burst Total: 150 MB/burst
FastEthernet 11 MB/s
GbitEthernet 110 MB/s
All nodes :Linux/DATE
Run control
Beamarea
LDC pix2
LDC pix10.12 MB/s 0.8 MB/s
8 MB/s
Fast/Gbit switch
3+4 PCI-FLIC/PRB
Online monitoring
GDC
tape
Disk server
LDC BS+ZDC LDC MS
6 MB/s
15 MB/s
15 MB/s
DAQ softwareDATE
The detector control system
Pixelcooling
Tmon(20 chan)
Interlock(2 chan)
Cryoflows
Cryo/pixelcontrol
Gas control
mixer
distributor
Gas PLC
Permanent storage
CAEN SY2527 CAEN SY403
HV, LVpixels
HV, LVbeamscope
HVZDC(2 crates)
HVhodoscopes(14 crates)
CAEN frontend(Linux)
PVSS/SCADA with OPC (WinNT)
Summary
• NA60 will clarify the origin of the intermediate mass dimuon excess and measure the yield of charmed mesons produced in heavy ion collisions.
• Considerable technical improvements were made since the proposal : new detectors, new vertex magnet, new readout electronics and DAQ, etc.
• Severe lack of resources (people and budget) keep the collaboration much weaker than anticipated. Stronger support from CERN and other institutes is mandatory to allow the experiment to take good physics data in 2002.
• Data with good statistics, mass resolution and signal to background ratio will allow to study the production of , and mesons, as well as the charmonia resonances.
The NA60 Collaboration
Brookhaven
R. Arnaldi, A. Baldit, K. Banicz, K. Borer, L. Casagrande, J. Castor, B. Chaurand*, W. Chen, B. Cheynis, P. Chochula, C. Cicalò, M.P. Comets, P. Cortese, V. Danielyan, A. David, A. De Falco, N. De Marco, A. Devaux, B. Dezillie, L. Ducroux, B. Espagnon, P. Force,
E. Gangler, V. Granata, A. Grigorian, S. Grigorian, J.Y. Grossiord, A. Guichard, H. Gulkanian, R. Hakobyan, E. Heijne, M. Hess, P. Jarron, D. Jouan, L. Kluberg*, Y. Le Bornec, B. Lenkeit,
Z. Li, C. Lourenço, M.P. Macciotta, M. Mac Cormick, F. Manso, D. Marras, A. Masoni, S. Mehrabyan, H. Muller, A. Musso, A. Neves, B. Pes, S. Popescu, G. Puddu, P. Ramalhete,
P. Rosinsky, P. Saturnini, E. Scomparin, J. Seixas, S. Serci, R. Shahoyan, E. Siddi, P. Sonderegger, G. Usai, G. Vandoni, H. Vardanyan, N. Willis, H. Wöhri and M. Zagiba
Lisbon
Orsay
CERN Bern
Bratislava
Torino
Yerevan
CagliariLyonClermont
11 institutesbut very few financing agencies
*) personal commitment