lubricating layer, etc., are formed thereon, by which the memory hard disk is produced. Since this Ni-P film is only slightly nodular in such a case, the pol- ishing of the Ni-P film is simplified. The polishing for smoothing is omitted and texturing is only need- ed in some cases.
ELECTROLYTE/ORGANIC A D D I T I V E SEPARATION IN
ELECTROPLATING PROCESSES
US. 2004007473 (Applied Materials Inc.) Yang, M.X. A method and apparatus for plating metals, such as copper, on a substrate. The apparatus generally includes a plating cell having an anolyte compartment containing an anolyte and a catholyte compartment containing a catholyte, an anode disposed in the anolyte compartment, wherein the membrane screens molecules by molecular weight. The method generally includes supplying an electrolyte solution to a copper plating cell, plating copper onto a substrate in the plating cell from the electrolyte solution, and prevent- ing the passage of additives from a catholyte com- partment to an anolyte compartment with an anode disposed therein by providing a dialysis membrane between the anolyte compartment and catholyte com- partment that is selective to molecule size.
I O N I C MOULDS C O N T A I N I N G BORATE OR PHOSPHATE
A N I O N S
US. 2004007693 Moulton, R. Novel ionic liquids comprising a phosphate or borate anion. The ionic liquids may be made via metathesis
or via a reaction between boric or phosphoric acid with metal hydroxide and an alcohol.
ELECTROLESS GOLD PLATING C O M P O S I T I O N
US. 2004009292 (Shipley Co LLC) Kanzler, M.; Toben, M.P. Electroless gold plating bath formulations including one or more water soluble gold compounds, one or more gold complexing agents, one or more organic stabilizer compounds, and one or more carboxylic acid uniformity enhancers. Methods of plating and methods of manufactur ing electronic devices using these compositions are also noted.
SURFACE MODIF IED STAINLESS STEEL
US. 2004009296 (Sandvik AB) Andersson, J.; Cedergren, M. Surface modifications of high temperature resistant alloys, such as FeCrA1 alloys, in order to increase their resistance to corrosion art high temperatures. Coating it with a calcium-containing compound before hea t - t rea t ing builds a continuous uniform and adherent layer on the surface of the alloy, that the a luminum depletion of the FeCrA1 alloy is reduced under cyclic thermal stress. By this surface modification the resistance to high temperature cor- rosion of the FeCrA1 alloy and its lifetime are signif- icantly increased.
THIN FiLM FORMING METHOD U.S. 2004009307 Koh, W.Y.; Lee, C S. Method for forming thin films of a semiconductor
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nozz =p Strippable Plating Mask Kit
Clean, sharp, distinct stop off lines. Kit with I quart pot and 5 Ibs. of Thermo-Cote N-4 strippable coating. Cools fast to give you perfect mask. Non-Contaminat- ing. Peel off and remeit for reuse. Write for detaiJs and
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