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Surface modified stainless steel

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lubricating layer, etc., are formed thereon, by which the memory hard disk is produced. Since this Ni-P film is only slightly nodular in such a case, the pol- ishing of the Ni-P film is simplified. The polishing for smoothing is omitted and texturing is only need- ed in some cases. ELECTROLYTE/ORGANIC ADDITIVE SEPARATION IN ELECTROPLATING PROCESSES US. 2004007473 (Applied Materials Inc.) Yang, M.X. A method and apparatus for plating metals, such as copper, on a substrate. The apparatus generally includes a plating cell having an anolyte compartment containing an anolyte and a catholyte compartment containing a catholyte, an anode disposed in the anolyte compartment, wherein the membrane screens molecules by molecular weight. The method generally includes supplying an electrolyte solution to a copper plating cell, plating copper onto a substrate in the plating cell from the electrolyte solution, and prevent- ing the passage of additives from a catholyte com- partment to an anolyte compartment with an anode disposed therein by providing a dialysis membrane between the anolyte compartment and catholyte com- partment that is selective to molecule size. IONIC MOULDS CONTAINING BORATE OR PHOSPHATE ANIONS US. 2004007693 Moulton, R. Novel ionic liquids comprising a phosphate or borate anion. The ionic liquids may be made via metathesis or via a reaction between boric or phosphoric acid with metal hydroxide and an alcohol. ELECTROLESS GOLD PLATING COMPOSITION US. 2004009292 (Shipley Co LLC) Kanzler, M.; Toben, M.P. Electroless gold plating bath formulations including one or more water soluble gold compounds, one or more gold complexing agents, one or more organic stabilizer compounds, and one or more carboxylic acid uniformity enhancers. Methods of plating and methods of manufacturing electronic devices using these compositions are also noted. SURFACE MODIFIED STAINLESS STEEL US. 2004009296 (Sandvik AB) Andersson, J.; Cedergren, M. Surface modifications of high temperature resistant alloys, such as FeCrA1 alloys, in order to increase their resistance to corrosion art high temperatures. Coating it with a calcium-containing compound before heat-treating builds a continuous uniform and adherent layer on the surface of the alloy, that the aluminum depletion of the FeCrA1 alloy is reduced under cyclic thermal stress. By this surface modification the resistance to high temperature cor- rosion of the FeCrA1 alloy and its lifetime are signif- icantly increased. THIN FiLM FORMING METHOD U.S. 2004009307 Koh, W.Y.; Lee, C S. Method for forming thin films of a semiconductor MANDERSCHEID BUFF RAKES ELIMINATES GLAZE ~' O P E N S BUFF FACE SHAPES BUFFS ECONOMICAL ~ SAFE RAKE FILLER PART NO. 0 2 i SO RAKE HANDLE PART N O 2 I 6BC MANDERSCHEID EQUIPMENT ~ SUPPLY STOCKING SUPPLIER OF 3 M SCOTCH-BRITE ABRASIVE PRODUCTS AND JACKSONLEA BUFFS, COMPOUNDS ~ CLEANERS PHONE 1-800-*~ 73=67 ! 4 ~ FAY / -3 / 2-563- I ~5~ CHICAGO, ]L 60607 E-mail: [email protected] Website: www, m-source,com Circle 042 on reader information card or go to www.thra.to/webconnect nozz =p Strippable Plating Mask Kit Clean, sharp, distinct stop off lines. Kit with I quart pot and 5 Ibs. of Thermo-Cote N-4 strippable coating. Cools fast to give you perfect mask. Non-Contaminat- ing. Peel off and remeit for reuse. Write for detaiJs and 12 eorl{ Hill Road • P.O. Box 365 • Franklin, NJ 07416 Tel: 973-209-6210 • Fax: 973-209-6435 Circle 042 on reader information card or go to www.thru.to/webconnect Circle 042 on reader information card or go to www.thru.to/webconnect July/August 2004 85
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Page 1: Surface modified stainless steel

lubricating layer, etc., are formed thereon, by which the memory hard disk is produced. Since this Ni-P film is only slightly nodular in such a case, the pol- ishing of the Ni-P film is simplified. The polishing for smoothing is omitted and texturing is only need- ed in some cases.

ELECTROLYTE/ORGANIC A D D I T I V E SEPARATION IN

ELECTROPLATING PROCESSES

US. 2004007473 (Applied Materials Inc.) Yang, M.X. A method and apparatus for plating metals, such as copper, on a substrate. The apparatus generally includes a plating cell having an anolyte compartment containing an anolyte and a catholyte compartment containing a catholyte, an anode disposed in the anolyte compartment, wherein the membrane screens molecules by molecular weight. The method generally includes supplying an electrolyte solution to a copper plating cell, plating copper onto a substrate in the plating cell from the electrolyte solution, and prevent- ing the passage of additives from a catholyte com- partment to an anolyte compartment with an anode disposed therein by providing a dialysis membrane between the anolyte compartment and catholyte com- partment that is selective to molecule size.

I O N I C MOULDS C O N T A I N I N G BORATE OR PHOSPHATE

A N I O N S

US. 2004007693 Moulton, R. Novel ionic liquids comprising a phosphate or borate anion. The ionic liquids may be made via metathesis

or via a reaction between boric or phosphoric acid with metal hydroxide and an alcohol.

ELECTROLESS GOLD PLATING C O M P O S I T I O N

US. 2004009292 (Shipley Co LLC) Kanzler, M.; Toben, M.P. Electroless gold plating bath formulations including one or more water soluble gold compounds, one or more gold complexing agents, one or more organic stabilizer compounds, and one or more carboxylic acid uniformity enhancers. Methods of plating and methods of manufactur ing electronic devices using these compositions are also noted.

SURFACE MODIF IED STAINLESS STEEL

US. 2004009296 (Sandvik AB) Andersson, J.; Cedergren, M. Surface modifications of high temperature resistant alloys, such as FeCrA1 alloys, in order to increase their resistance to corrosion art high temperatures. Coating it with a calcium-containing compound before hea t - t rea t ing builds a continuous uniform and adherent layer on the surface of the alloy, that the a luminum depletion of the FeCrA1 alloy is reduced under cyclic thermal stress. By this surface modification the resistance to high temperature cor- rosion of the FeCrA1 alloy and its lifetime are signif- icantly increased.

THIN FiLM FORMING METHOD U.S. 2004009307 Koh, W.Y.; Lee, C S. Method for forming thin films of a semiconductor

M A N D E R S C H E I D B U F F R A K E S

ELIMINATES G L A Z E

~' O P E N S B U F F FACE

S H A P E S B U F F S

E C O N O M I C A L ~ S A F E

RAKE FILLER PART NO. 0 2 i SO RAKE HANDLE PART NO 2 I 6BC

M A N D E R S C H E I D EQUIPMENT ~ SUPPLY

STOCKING SUPPLIER OF 3 M SCOTCH-BRITE ABRASIVE PRODUCTS AND JACKSONLEA

BUFFS, COMPOUNDS ~ CLEANERS

PHONE 1-800-*~ 7 3 = 6 7 ! 4 ~ FAY / -3 / 2 - 5 6 3 - I ~ 5 ~

CHICAGO, ]L 6 0 6 0 7 E-mai l : m-source@m-source .c0m

Website: www, m-source ,com

Circle 042 on reader information card or go to www.thra.to/webconnect

nozz =p Strippable Plating Mask Kit

Clean, sharp, distinct stop off lines. Kit with I quart pot and 5 Ibs. of Thermo-Cote N-4 strippable coating. Cools fast to give you perfect mask. Non-Contaminat- ing. Peel off and remeit for reuse. Write for detaiJs and

12 eorl{ Hill Road • P.O. Box 365 • Franklin, NJ 07416 Tel: 973-209-6210 • Fax: 973-209-6435

Circle 042 on reader information card or go to www.thru.to/webconnect

Circle 042 on reader information card or go to www.thru.to/webconnect

July/August 2004 85

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