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U.S. Philips Corp., New York, N.Y. A blast system for processing components by means of abrasive particles. SURFACE TREATMENT OF COPPER U.S. Patent 6,036,758. Mar. 14, 2000 W.A. Fairweather, assignor to PMD (U.K.) Limited, Coventry, United Kingdom A composition useful for the sur- face treatment of copper compris- ing 0.5 to 5% w/v hydrogen perox- ide and 0.01 to 5% w/v of an aromatic sulfonic acid or a salt thereof. SPUTIrERING APPARATUS U.S. Patent 6,036,821. Mar. 14, 2000 R.A. Warren, assignor to International Business Machines Corp., Armonk, N.Y. An enhanced collimated sputter- ing apparatus. ARC DEPOSITION DEVICE U.S. Patent 6,038,828. Mar. 14, 2000 R.A. Beers and T.E.Royal, assignors to United Technologies Corp., Hartford, Conn. An apparatus for steering the arc in a cathodic arc coater. ELECTROFORMING MANDREL U.S. Patent 6,036,832. Mar. 14, 2000 H.G. Knol et al., assignors to Stork Veco B.V., LB Eerbeek, Netherlands An electroforming method for making metal products having a pattern of openings separated by dikes using an electroforming mandrel in an electroplating bath, wherein metal from the etectroplating bath is deposited on the mandrel. PULSE PLATING OF NICKEL U.S. Patent 6,036,833. Mar. 14, 2000 P.T. Tang et al., Orumsgade, Denmark An electroplating method com- prising forming platings of nickel in a chloride-sulfate-boric acid electrodepositing bath by employ- ing pulse plating with periodic re- verse pulsating current made up of cathodic cycles. MACHINE FOR PARTIALLY PLATING TEST PROBES U.S. Patent 6,036,837. Mar. 14, 2000 D.B. Nau, and J.J. Bellm, assignors to Celex Inc., Gibbon, Minn. w.hen or.oor. Email: [email protected] hendor B.V. N.America: hendor-pe, Inc p.o.box 9, 5530aa Bladel 55 Concourse Way the Netherlands Greer SC 29650 USA tel + 31 (0) 497 386810 fax 381593 tel + 1 864 879 0888 fax 4237 Circle 041 on reader information card Circle 040 on reader information card April 2001 99
