SystemIntegrationManual
{{#unlesspdf-generation}}{{downloadButtonurl="../assets/pdfs/datasheets/e-series-system-
integration-manual.pdf"}}{{/unless}}
ThismanualprovidesthenecessaryguidelinestosuccessfullyintegratetheEseriesmoduleinyour
product.
Forfurtherinformationaboutthismodulepleasereferto:
Datasheet
Firmwaredevelopment
Productmanagement
Eseriesarchitecture:
TheblockdiagrambelowsummarizesthearchitectureoftheEseriesmodule.It'skeycomponents
aretheSTM32F205microcontrollerandtheu-bloxSARAcellularmodem.Inadditiontothat,the
modulehasanonboardpowermanagementIC,3.3VDCregulator,LiPofuelgauge,andan
ParticleembeddedSIMchip.ThereisalsoroomforadditionalSPIbasedFLASHmemory
expansion.
OVERVIEW
PINOUTDIAGRAM
YoucandownloadahighresolutionpinoutdiagraminaPDFversionhere.
# PIN FUNCTION DESCRIPTION
1 VIN POWER
Thispincanbeusedasaninputoroutput.Asaninput,supply5VDCto12VDCtopowertheElectron.WhentheElectronispoweredviatheUSBport,thispinwilloutputavoltageofapproximately4.8VDCduetoareversepolarityprotectionseriesSchottkydiodebetweenVBUSandVIN.Whenusedasanoutput,themaxloadonVINis1Amp.
2 GND POWER Systemground.
3 VBUS POWER ThisisconnectedtotheVBUSpowerpinoftheUSBport.
4 GND POWER Systemground.
5 LiPo POWER Thisisconnectedtothe+LiPoconnector.
6 NC TBD Donotconnect.
7 GND POWER Systemground.
8 PMID POWER ThisisconnectedtothePMIDpinofthePMIC.
9 3V3 POWER Thisistheoutputofthe3V3regulatorontheE0.
10 VDDA POWER ThisistheinputtotheanalogblockoftheSTM32.
11 VBAT POWERSupplytotheinternalRTC,backupregistersandSRAMwhen3V3isnotpresent(1.65to3.6VDC).
12 GND POWER Systemground.
13 USB+ IO Data+pinoftheUSBport.
14 USB- IO Data-pinoftheUSBport.
15 GND POWER Systemground.
16 TX IO PrimarilyusedasUARTTX,butcanalsobeusedasadigitalGPIOorPWM.
17 RX IO PrimarilyusedasUARTRX,butcanalsobeusedasadigitalGPIOorPWM.
18 GND POWER Systemground.
19 WKP IOActive-highwakeuppin,wakesthemodulefromsleep/standbymodes.WhennotusedasaWAKEUP,thispincanalsobeusedasadigitalGPIO,ADCinputorPWM.CanbereferredtoasA7whenusedasanADC.
20 DAC IO12-bitDigital-to-Analog(D/A)output(0-4095),referredtoasDACorDAC1insoftware.CanalsobeusedasadigitalGPIOorADC.CanbereferredtoasA6whenusedasanADC.
21 A5 IO 12-bitAnalog-to-Digital(A/D)inputs(0-4095),andalsodigitalGPIOs.
22 A4 IO 12-bitAnalog-to-Digital(A/D)inputs(0-4095),andalsodigitalGPIOs.
23 A3 IO 12-bitAnalog-to-Digital(A/D)inputs(0-4095),andalsodigitalGPIOs.
24 A2 IO 12-bitAnalog-to-Digital(A/D)inputs(0-4095),andalsodigitalGPIOs.
25 A1 IO 12-bitAnalog-to-Digital(A/D)inputs(0-4095),andalsodigitalGPIOs.
26 A0 IO 12-bitAnalog-to-Digital(A/D)inputs(0-4095),andalsodigitalGPIOs.
27 GND POWER Systemground.
28 B5 IO 12-bitAnalog-to-Digital(A/D)inputs(0-4095),andalsodigitalGPIOs.
29 B4 IO 12-bitAnalog-to-Digital(A/D)inputs(0-4095),andalsodigitalGPIOs.
30 B3 IO 12-bitAnalog-to-Digital(A/D)inputs(0-4095),PWMandalsodigitalGPIOs.
31 B2 IO 12-bitAnalog-to-Digital(A/D)inputs(0-4095),PWMandalsodigitalGPIOs.
32 B1 IO DigitalonlyGPIO,andPWM.
33 B0 IO DigitalonlyGPIO,andPWM.
34 GND POWER Systemground.
35 D7 IO DigitalonlyGPIO.
PINDESCRIPTION
36 D6 IO DigitalonlyGPIO.
37 D5 IO DigitalonlyGPIO.
38 D4 IO DigitalonlyGPIO.
39 D3 IO DigitalonlyGPIO,andPWM.
40 D2 IO DigitalonlyGPIO,andPWM.
41 D1 IO DigitalonlyGPIO,andPWM.
42 D0 IO DigitalonlyGPIO,andPWM.
43 GND POWER Systemground.
44 C5 IO DigitalonlyGPIO,andPWM.
45 C4 IO DigitalonlyGPIO,andPWM.
46 C3 IO DigitalonlyGPIO.
47 C2 IO DigitalonlyGPIO.
48 C1 IO DigitalonlyGPIO.
49 C0 IO DigitalonlyGPIO.
50 NC TBD Donotconnect.
51 GND POWER Systemground.
52 BLU IO BluepinoftheRGBLED.
53 GRN IO GreenpinoftheRGBLED.
54 RED IO RedpinoftheRGBLED.
55 MODE IO ConnectedtotheMODEbuttoninput.
56 RST I Active-lowresetinput.
57 STAT O ConnectedtothechargestatuspinofthePMIC.
58 GND POWER Systemground.
59 GND POWER Systemground.
60 GND POWER Systemground.
61 UB_USB+ IO Data+pinoftheu-bloxUSBport.
62 UB_USB- IO Data-pinoftheu-bloxUSBport.
63 UB_VUSB_DET IOUSBdetectpinoftheu-bloxUSBport.5Vonthispinenablestheu-blox'sUSBinterface.
[1]PWMisavailableonD0,D1,D2,D3,B0,B1,B2,B3,A4,A5,WKP,RX,TXwithacaveat:PWMtimer
peripheralisduplicatedontwopins(A5/D2)and(A4/D3)for11totalindependentPWMoutputs.For
example:PWMmaybeusedonA5whileD2isusedasaGPIO,orD2asaPWMwhileA5isusedas
ananaloginput.HoweverA5andD2cannotbeusedasindependentlycontrolledPWMoutputsat
thesametime.
TechnicalSpecifications
Parameter Symbol Min Typ Max Unit
SupplyInputVoltage VIN-MAX +17 V
SupplyOutputCurrent IIN-MAX-L 1 A
BatteryInputVoltage VLiPo +6 V
SupplyOutputCurrent I3V3-MAX-L 800 mA
StorageTemperature Tstg -30 +75 °C
ESDSusceptibilityHBM(HumanBodyMode) VESD 2 kV
[1]Stressesbeyondthoselistedunderabsolutemaximumratingsmaycausepermanentdamage
tothedevice.Thesearestressratingsonly,andfunctionaloperationofthedeviceattheseorany
otherconditionsbeyondthoseindicatedunderrecommendedoperatingconditionsisnotimplied.
Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability.
Parameter Symbol Min Typ Max Unit
SupplyInputVoltage VIN +3.88[1] +12 V
SupplyOutputVoltage VIN +4.8 V
SupplyOutputVoltage V3V3 +3.3 V
LiPoBatteryVoltage VLiPo +3.6 +4.4 V
SupplyInputVoltage VVBAT +1.65 +3.6 V
SupplyInputCurrent(VBAT) IVBAT 19 uA
OperatingCurrent(uCon,CellularON) IINavg 180 250 mA
PeakCurrent(uCon,CellularON) IINpk 800[2] 1800[3] mA
OperatingCurrent(uCon,CellularOFF) IINavg 47 50 mA
SleepCurrent(4.2VLiPo,CellularOFF) IQs 0.8 2 mA
DeepSleepCurrent(4.2VLiPo,CellularOFF) IQds 110 130 uA
OperatingTemperature Top -20 +60 °C
HumidityRangeNoncondensing,relativehumidity 95 %
Notes:
[1]Theminimuminputvoltageissoftwaredefinedwithauserselectablerangeof3.88Vto5.08Vin
80mVincrements.Outofthebox,theminimuminputvoltageissetto4.36VinorderfortheLiPo
batterytobeabletoproperlycharge.
[2]3Goperation
[3]2Goperation
ABSOLUTEMAXIMUMRATINGS[1]
RECOMMENDEDOPERATINGCONDITIONS
Design
TheEseriesmodulescanbepoweredoverVIN,VBUS,LiPooracombinationofthem.TheVINand
VBUSpinsareconnectedtotheinputofthepowermanagementICwhichhandlesregulation,
chargingandpoweringofsystem.TheVINpinisdirectlyconnectedtotheinputwhileVBUSpin
hasareversepolarityprotectiondiodesothatpoweroverVINdoesnotbackfeedintotheUSB
port.Youwillseeadropof0.43VattheinputwhenpoweredoverUSB.
Tip:MostofthepowerrequirementsoftheEseriesmodulearedictatedbytheu-blox'sSARA
cellularmodem,soitisimportantthatyoualsorefertotheSARA-G3andSARA-U2-seriesSystem
IntegrationManual'ssection1.5.
Poweringusingabattery:
TheEseriesmoduleusesTI'sBQ24195todoallofitspowermanagement.Itisdesignedtochargea
singlecellLi-IonorLi-Polymerbatterywhileintelligentlyswitchingbetweenchargingand
dischargingbasedonthepresenceofanadditionalpowersupply.Youcanpoweryourdesignwith
abatteryaloneoruseitasabackupinadditiontohavingapermanentDCsource.Thetwothings
youneedtokeepinmindwhilechoosingabatteryisitscellchemistryandmaxdischargerate.The
onboardPMIConlysupportssinglecellLiIonandLiPolymer(3.7V)chemistry.Thedischargerate
shouldbeableequaltoorgreaterthat2Atomeetthecellularmodemspeakcurrent
requirements.ThebatteryprovidedwiththeEseriesevaluationkitisratedat1,800mAHanda
dischargerateof1Cwithinternalovercurrentprotection.
PoweringoverVINalongwiththeLiPobattery
POWERSUPPLYINTERFACE
Ifyouareplanningtouseadifferentcellchemistryorvoltage,you'llhavetodesignitscharging
andmanagementseparately.
PoweringusinganexternalDCsource
VIN
TheEseriesmodulecanbepoweredfromanexternalDCsourceviatheVINpin.Thepincan
acceptvoltagesfrom3.88Vto12VDC.Forcontinuousoperationwithoutabattery,pleasespecthe
powersupplyat10Watts.Forexample,ifpoweringat5V,thesupplyshouldbeabletosupply2A
ofcurrent.
LiPo
YoucanalsobypassthePMIC'sinternalregulatorandpowerthemoduledirectlybyconnectingan
externallyregulatedDCsource(3.8Vto4.1V)totheLiPopinaslongastheVINpinisleft
disconnected.ThePMIDinternallyroutespowerfromtheLiPopintothesystemviaaFETwith
minimallosses.
VDDA
Thispinpowerstheanalogblockoftheonboardmicrocontroller.Youcanconnectthisdirectlyto
the3V3pinorpoweritseparatelywithalownoisepowersource.Ineithercase,youneedto
connectittoasourceforthemoduletobootup.
Note:Donotleavethispinunconnected.Forthemoduletobootup,youneedtotiethispinto
systems3V3orother3.3Vsupply.
Usinganexternallow-noisepowersource
VBAT
ThisisthesupplytotheinternalRTC,backupregistersandSRAM.Youcanconnectabackup
batterytoit(1.65to3.6VDC),ifyouwishtoretainRTC/RAMwhensystemsupplyisremovedor
simplytieitupto3V3.
ThefollowingisasampleschematicneededtopowerupandusetheEseriesmodule.Themodule
ispoweredoverVINwithanexternalDCpowersourcealongwithaLiPobatteryusedasabackup.
BASICSETUP
TheRGBLEDprovidesavisualaidetodetectthestateofthemodule.Twobuttons,RESETand
MODEprovidetheabilitytoputthemoduleindifferentmodes.LED1indicatesthechargingstatus
oftheLiPobattery.ThemainUSBportcanbeusedfordebuggingortoupdatethefirmwareon
themodule.
Inadditiontotheseparts,itisalsoencouragedtoaddaUSBinterfacefortheu-bloxmoduleasit
providesadditionaldebuggingchannelandcanbeusedtoupdatethefirmwareofthemodem.
TheJTAG/SWDinterfacecanbeusefultoprovisiontheproductduringmanufacturingorwhen
testing/debuggingthefirmware.
YoucanalsotakealookattheschematicandboardfilesoftheEseriesevaluationkitasa
referencedesignavailablehere.
Electricalparameters
ThesespecificationsarebasedontheSTM32F205RGT6datasheet,withreferencetoEseriespin
nomenclature.
Parameter Symbol Conditions Min Typ Max Unit
StandardI/Oinputlowlevelvoltage VIL -0.30.28*(V3V3-
2)+0.8V
I/OFT[1]inputlowlevelvoltage VIL -0.30.32*(V3V3-
2)+0.75V
StandardI/Oinputhighlevelvoltage VIH0.41*(V3V3-
2)+1.3V3V3+0.3 V
I/OFT[1]inputhighlevelvoltage VIH V3V3>2V0.42*(V3V3-
2)+15.5 V
VIH V3V3≤2V0.42*(V3V3-
2)+15.2 V
StandardI/OSchmitttriggervoltage
hysteresis[2]Vhys 200 mV
GPIOINTERFACE
I/OFTSchmitttriggervoltagehysteresis[2] Vhys 5%V3V3[3] mV
Inputleakagecurrent[4] IlkgGND≤Vio≤V3V3
GPIOs±1 µA
Inputleakagecurrent[4] Ilkg RPUVio=5V,I/O
FT3 µA
Weakpull-upequivalentresistor[5] RPU Vio=GND 30 40 50 kΩ
Weakpull-downequivalentresistor[5] RPD Vio=V3V3 30 40 50 kΩ
I/Opincapacitance CIO 5 pF
DACoutputvoltage(buffersenabledbydefault)
VDAC 0.2 V3V3-0.2 V
DACoutputresistiveload(buffersenabledbydefault)
RDAC 5 kΩ
DACoutputcapacitiveload(buffersenabledbydefault)
CDAC 50 pF
Notes:
[1]FT=Five-volttolerant.InordertosustainavoltagehigherthanV3V3+0.3theinternalpull-up/pull-
downresistorsmustbedisabled.
[2]HysteresisvoltagebetweenSchmitttriggerswitchinglevels.Basedoncharacterization,not
testedinproduction.
[3]Withaminimumof100mV.
[4]Leakagecouldbehigherthanmax.ifnegativecurrentisinjectedonadjacentpins.
[5]Pull-upandpull-downresistorsaredesignedwithatrueresistanceinserieswithswitchable
PMOS/NMOS.ThisPMOS/NMOScontributiontotheseriesresistanceisminimum(~10%order).
PeripheralType Qty Input(I)/Output(O) FT[1]/3V3[2]
Digital 30 I/O FT/3V3
Analog(ADC) 12 I 3V3
Analog(DAC) 2 O 3V3
UART 3 I/O 3V3
SPI 2 I/O 3V3
I2S 1 I/O 3V3
I2C 1 I/O FT
CAN 2 I/O 3V3[4]
USB 1 I/O 3V3
PWM 133 O 3V3
Notes:[1]FT=5.0Vtolerantpins.AllpinsexceptA3andDACare5Vtolerant(whennotinanalog
mode).Ifusedasa5Vinputthepull-up/pull-downresistormustbedisabled.
[2]3V3=3.3Vmaxpins.
[3]PWMisavailableonD0,D1,D2,D3,B0,B1,B2,B3,A4,A5,WKP,RX,TXwithacaveat:PWMtimer
peripheralisduplicatedontwopins(A5/D2)and(A4/D3)for11totalindependentPWMoutputs.For
example:PWMmaybeusedonA5whileD2isusedasaGPIO,orD2asaPWMwhileA5isusedas
ananaloginput.HoweverA5andD2cannotbeusedasindependentlycontrolledPWMoutputsat
thesametime.
[4]Technicallythesepinsare5.0Vtolerant,butsinceyouwouldn'toperatethemwitha5.0V
transceiverit'spropertoclassifythemas3.3V.
AntennainterfaceprovidedviaanIPEXMHF/U.FLreceptacle.TheinterfacehasLCESDprotection
ofXXXKV.
ParticlerecommendstheTaoglasPC104penta-band(850/900/1800/1900/2100MHz)GSMantenna.
Theantennacomeswithanadhesivebackingmakingiteasytomount.Pleaserefertoits
datasheetforfurtherdetailsonpowercharacteristicsandoptimalplacementinaproduct.
AntennaType Manufacturer MFG.Part# Gain
PCBantenna Taoglas PC104.07.0165C 1dBi~2.39dBi
Ifyouarechoosingyourownantennapleasemakesureofthefollowing:
Optimalsupportfortheoperatingfrequencybandsofthemodule.
Selectanantennacablewithminimuminsertionloss.
Selectaconnectorwith50ohmimpedance.
Selecttheantennawithappropriategainfigurethatdoesnotexceedtheregulatory
requirementsinthecountryofoperation.
ESDPrecautions
TheEseriescontainshighlysensitiveelectroniccircuitryandisanElectrostaticSensitiveDevice
(ESD).HandlinganEserieswithoutproperESDprotectionmaydestroyordamageitpermanently.
ProperESDhandlingandpackagingproceduresmustbeappliedthroughouttheprocessing,
handlingandoperationofanyapplicationthatincorporatesthemodule.ESDprecautionsshould
beimplementedontheapplicationboardwheretheEseriesismounted.Failuretoobservethese
precautionscanresultinseveredamagetotheEseries!
Packaging
ANTENNAINTERFACE
HANDLINGANDSOLDERING
DimensionsandWeight
Width=36mm
Height=43mm
Thickness=4.6mm
Weight=8gms
Pickandplace
Fiducials
Youcanusethethreefiducialsonthetoplayerforalignmentduringmachineplacementofthe
module.
Soldering
Werecommendnocleansolderpasteoverwatersolubleasitdoesnotrequireadditionalcleaning
processes.
Alloyspecification
95.5%Sn/3.9%Ag/0.6%Cu(95.5%Tin/3.9%Silver/0.6%Copper)
95.5%Sn/4.0%Ag/0.5%Cu(95.5%Tin/4.0%Silver/0.5%Copper)
Meltingtemperature:217°C
Stencilthickness:150micrometer
Reflow
Werecommendathreephaseconvectionreflowovenprocess.PleaserefertoIPC-7530guidelines
forindepthdetailsonreflowtemperatureprofiles.
TypicalreflowprofileforaPbfreesolderpaste:
RecommendedPCBlandpattern