iNEMIfuturemedical9.10© 2010 TechSearch International, Inc.

Future Vision of Medical Electronics

E. Jan VardamanPresident

TechSearch International, Inc.

www.techsearchinc.com

iNEMIfuturemedical9.10© 2010 TechSearch International, Inc.

The Future: The Bionic Age

• Vision: So that the blind may see

• Hearing: So that the deaf my hear

• Mobility: So that the lame may

walk

• Limb Replacement: So that the

cripple may become whole

iNEMIfuturemedical9.10© 2010 TechSearch International, Inc.

Retinal Implant

• Electronics includes flip chip component

Source: Valtronic

iNEMIfuturemedical9.10© 2010 TechSearch International, Inc.

Second Sight Medical Products

• Video camera sends images to a computer worn on a belt (computerconverts the video to a simplified signal)

• Transmitter send signal wirelessly to implant in the eye

• Receiver send signal to electrode array (1/3-inch wide, 60 electrodes) tostimulate retina

• Optic nerve carries signal from retina to brain which perceives visualpatterns corresponding to the electrodes stimulated

Source: Second Sight Medical Products

iNEMIfuturemedical9.10© 2010 TechSearch International, Inc.

ZyCube Artificial Retnia with 3D TSV

Source: ZyCube

iNEMIfuturemedical9.10© 2010 TechSearch International, Inc.

Artificial Spinal Implant

• Implant used for spinal injury

• Flip chip used for performance reasons

Source: Valtronic

iNEMIfuturemedical9.10© 2010 TechSearch International, Inc.

Future Medical Applications

• Diagnosis

– Camera pill

• Improved treatments for diseases such as cancer

– Drug delivery

• Home Health Care

– Insulin delivery

– Monitor heart rate and blood pressure

• Implantable devices

– Wireless sensing and communication to manage severe chroniccardiovascular diseases such as heart failure and aneurysms

– Implantable devices connected to wireless networks to improvepatient monitoring and care

iNEMIfuturemedical9.10© 2010 TechSearch International, Inc.

Actual images taken from inside the human body using PoP Camera Capsule

ADL Engineering’s Camera Pill

Source: ADL Engineering

iNEMIfuturemedical9.10© 2010 TechSearch International, Inc.

PoP

ADL’s PoP Inside Camera Pill

Source: ADL Engineering

iNEMIfuturemedical9.10© 2010 TechSearch International, Inc.

Controller NAND

ADL’s PoP Technology Used in Camera Pill

Source: ADL Engineering

iNEMIfuturemedical9.10© 2010 TechSearch International, Inc.

Proteus Biomedical’s Ingestible Event Marker

• Management of chronicdiseases (heart failure,infectious disease,psychiatric disorders)

• Digestible sensors(activated by stomachfluids after swallowing)

• Sends signal tomicroelectronicreceiver under patient’sskin storing info aboutthe drug and monitorsbody’s response tomedication

Source: Proteus

iNEMIfuturemedical9.10© 2010 TechSearch International, Inc. 12

Better Cancer Treatments

• Cancer, autoimmune diseases,chronic heart failure, critical limbischemia, metabolic disorders

• Disposable kits for Cell Therapy

• MEMS chips embedded into fulldisposable fluid paths, sterilizedand closed cycle

Stem or modified cellsPatient

MEMS chip

Bone marrow or cord blood

Disposable kit

Sorter

Re-transfusion

Patient

Peripheral blood

Disposable kit

CTC Sorter

PersonalizedCure

SortedCTCs

OptimizeChemotherapy

Sorts rare cells from blood

samples and retain viability

Optimized and personalized

drug(s)

Continued blood sample

monitoring with precise

measurement

Cancer Theragnostics

Cell Therapy

Diagnostics

Rx

Source: IMT

iNEMIfuturemedical9.10© 2010 TechSearch International, Inc.

Implantable Cardioverter Defibrillator

& Pacemaker

• Smaller, less intrusive

applications for

implantable devices

• High density

interconnect substrate

– 8 layers

– 1.2-inch x 0.5-inch &

1.7-inch x 1.6-inch

• October 2008 first

human implant of

Endicott Interconnect

pacemaker

Source: Endicott Interconnect

iNEMIfuturemedical9.10© 2010 TechSearch International, Inc.

• Endicott Interconnect

substrate

• CoreEZ® 2-4-2 substrate

• SiP assembly with flip chip

Medical Imaging: Ultrasound Application

Source: Endicott Interconnect

iNEMIfuturemedical9.10© 2010 TechSearch International, Inc.

Intervascular Ultrasound Catheter

• Flip chip on single layer polyimide

• Finest pitch solder bump flip chip

interconnect

Source: Endicott Interconnect

iNEMIfuturemedical9.10© 2010 TechSearch International, Inc.

Conclusions

• The future for medical electronics is bright

• Improvements in all fields are possible

• Many start-up companies developing new products with new

technologies

• Major opportunities in all areas