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Teknek Limited and... · Teknek Benefits •Teknek technology can now –Remove particles down to...

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Teknek Limited
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Page 1: Teknek Limited and... · Teknek Benefits •Teknek technology can now –Remove particles down to 10 nm (10x10-9m) –From all types of substrates –As thin as 15 microns –In both

Teknek

Limited

Page 2: Teknek Limited and... · Teknek Benefits •Teknek technology can now –Remove particles down to 10 nm (10x10-9m) –From all types of substrates –As thin as 15 microns –In both

Who are we?

• Company formed 1984

• Acquired by ITW (Illinois Tool Works) in July 2011.

- $18billion sales

• Inventors & world leaders in the manufacture & design of roller

contact cleaning systems

• Global footprint

• Distribution world-wide

• Over 20,000 machines manufactured and delivered to diverse range

of industries

• Produces its own cleaning rollers & adhesives

– 10,000 cleaning rollers per year

– Design and Produce in UK, adhesive centres in UK, USA & UK

– Use around 1.2 million sq. metres of adhesive product per year

Page 3: Teknek Limited and... · Teknek Benefits •Teknek technology can now –Remove particles down to 10 nm (10x10-9m) –From all types of substrates –As thin as 15 microns –In both

Contact Cleaning Technology

The Teknek Cleaning Core

PPT 7 / 21

Page 4: Teknek Limited and... · Teknek Benefits •Teknek technology can now –Remove particles down to 10 nm (10x10-9m) –From all types of substrates –As thin as 15 microns –In both

100 75 50 30 25 10 5 1 0.5 0.2

Air Knife

Brush & Vac

High Velocity Vacuum

Ultrasonic

Contact Clean Machine

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

Particle Size, Microns

Efficiency of Cleaning Methods

Comparison of cleaning efficiency's

5/5

Page 5: Teknek Limited and... · Teknek Benefits •Teknek technology can now –Remove particles down to 10 nm (10x10-9m) –From all types of substrates –As thin as 15 microns –In both

Our Capabilities

• Inventors & world leaders in Contact Cleaning

• Unique chemistry and elastomer formulations

• Unique in house Roller & Adhesive facilities– Cleaning rollers up to 4metres

• Roller Production – Semi clean area Facility investment >$1m

– Just ordered new production machine at $160,000

• Research & Development Facilities

• Wide range of external scientific projects

• Most experienced people

• Vacuum Chamber Certified

Page 6: Teknek Limited and... · Teknek Benefits •Teknek technology can now –Remove particles down to 10 nm (10x10-9m) –From all types of substrates –As thin as 15 microns –In both

Contemporary Manufacturing

Page 7: Teknek Limited and... · Teknek Benefits •Teknek technology can now –Remove particles down to 10 nm (10x10-9m) –From all types of substrates –As thin as 15 microns –In both

Teknek Approach

• Partnership Approach

– Develop specific solutions

• We lead, others follow

– Polymers

» After 20 years competitors cannot match our silicone

products

» Nanocleen is still unique

• Machines

– New ideas – fast development

– Competitors – poor copies, no innovation

Page 8: Teknek Limited and... · Teknek Benefits •Teknek technology can now –Remove particles down to 10 nm (10x10-9m) –From all types of substrates –As thin as 15 microns –In both

External R&D

# Project Title PartnersA HiQSurf DuPont Teikin Films, Plastic Logic,

Centre for Process Innovation, Teknek

B Clean4Yield DuPont Teijin Films, Phillips, Horiba, Dr Shenk

GmbH, IBS Precision Engineering, Teknek,

Innophysics BV, Eight19 Ltd,

Thermosensorik GmbH, Orbotech Ltd,

Coatema Coating machinery GmbH

TNO Netherlands, Riso Denmark, TU Delft

Netherlands.

C Cleaning in High Vacuum The Holst Centre Netherlands, Teknek

D Macromolecular and Particle Adsorption on Different Surfaces University of Sheffield, Teknek

E Advanced Organic Polymers Aston University, Teknek

Innovation Partnerships

June 2013

Page 9: Teknek Limited and... · Teknek Benefits •Teknek technology can now –Remove particles down to 10 nm (10x10-9m) –From all types of substrates –As thin as 15 microns –In both

Global Expertise

• Internal R&D

– We know our stuff

• Rollers and Adhesive

– Dr June Calliston, Polymer Expert

– Sheila Hamilton, Engineer and 30 years roller experience

– Steve Mitchell, Managing Director, Physicist and Chemist

• External collaboration

– Teknek works with the best Universities and

companies to develop the science

Page 10: Teknek Limited and... · Teknek Benefits •Teknek technology can now –Remove particles down to 10 nm (10x10-9m) –From all types of substrates –As thin as 15 microns –In both

Scale

• Big is sometimes Beautiful?!

– To supply good rollers you have to MAKE

many not BUY many

• In 2013 will MAKE over 10,000 rollers

– To be able to produce reliable adhesive you

have to Specify the paper, the adhesive, the

production process etc. etc.

• In 2013 we will make around 1.2 million sq. metres

Page 11: Teknek Limited and... · Teknek Benefits •Teknek technology can now –Remove particles down to 10 nm (10x10-9m) –From all types of substrates –As thin as 15 microns –In both

Trust in us – Teknek Brand

• All rollers are made to International

Standard– ISO 6123 Rubber or Plastics covered rollers -Parts 1,2 & 3

– Rollers used above 200 mtrs per min are balanced to ISO 1940-

1:2003 G6.3

• Large rollers now available at G2.5

• We test, everything• Rollers for pick up, leach, straightness, TIR etc.

• Adhesive for pick up, sheer, peel, etc.

– Tested to FTM 1,8,9 &12 (International Standards)

• And we test all competitors the same way

Page 12: Teknek Limited and... · Teknek Benefits •Teknek technology can now –Remove particles down to 10 nm (10x10-9m) –From all types of substrates –As thin as 15 microns –In both

We speak – others Listen

• Teknek is invited to speak at International

conferences on

– Cleaning advanced electronics

– Coating & converting

• Why?

– We have information that scientists and

engineers need

– What we do advances the industry

Page 13: Teknek Limited and... · Teknek Benefits •Teknek technology can now –Remove particles down to 10 nm (10x10-9m) –From all types of substrates –As thin as 15 microns –In both

Technical conferences

# Paper/Workshop Title Conference Organisation1 Short Course Instructor for Ultra Barrier Coatings Flexible and Printed Electronics

Conference

Flextech Alliance

2 Contact Cleaning for Barrier Coatings 18th New Industrial Chemistry and

Engineering Workshop on Barrier

Technologies

Council for Chemical Research

3 Contact Cleaning for Functional Coating in Emerging

Technologies

AIMCAL Fall Conference AIMCAL

4 Improved Yields through Elastomeric Contact Cleaning AIMCAL European Conference AIMCAL

5 Role of Surface Cleanliness in Yield Enhancement European Electronics Assembly

Reliability Summit

6 Reducing Waste in Plastic Electronics LOPEC Organic Electronics Association

7 Improving Yields in High Gloss Laminates Decorative Surfaces Conference TCM

8 Optimising Cleaning Techniques for Increasing

Manufacturing Yields

Think Light Conference Ligna

9 Reducing Waste in Thin Film Manufacture ICE Conference International Converting

Association

UPCOMING

10 Cleaning in a High Vacuum Environment International Meeting Information

Display (Aug 13)

IMID Korea

11 Web cleaning Requirements for Vacuum Coating AIMCAL Fall Conference

(Oct 13)

AIMCAL

Page 14: Teknek Limited and... · Teknek Benefits •Teknek technology can now –Remove particles down to 10 nm (10x10-9m) –From all types of substrates –As thin as 15 microns –In both

What are we saying?

• Cleaning is difficult but we understand it

– The Science of Cleaning

• Contact Cleaning Conceptual Framework

• Model developed by Teknek & University of Sheffield

– Key Scientific Outcomes

» Cleaning efficiency≠ Shore Hardness

» Contact pressure ≠ Cleaning efficiency

» Processing ≠ Cleaning

» More rollers ≠ More Cleaning

Page 15: Teknek Limited and... · Teknek Benefits •Teknek technology can now –Remove particles down to 10 nm (10x10-9m) –From all types of substrates –As thin as 15 microns –In both

What are we saying 2

• Not all cleaning rollers are the same

• Smooth tacky rollers don’t work best

• Our roughest rollers work best – why?

• Using Advanced Scientific Methods* we have

measured roller surface, and the forces to remove

particle from customer sample and roller.

– This allows us to modify roller surfaces and create

unique rollers.

* (Atomic force microscopy (AFM) or scanning force microscopy (SFM)

Page 16: Teknek Limited and... · Teknek Benefits •Teknek technology can now –Remove particles down to 10 nm (10x10-9m) –From all types of substrates –As thin as 15 microns –In both

Innovation 1

• Silicone Free Cleaning Engine

– Silicone free cleaning rollers

– Silicone free adhesive

– Silicone free confirmed by

– FTIR, (Fourier Transform Infra-Red

Spectroscopy)

– Edx (Energy-dispersive X-ray spectroscopy)

– RGA (residual gas analysis)

Page 17: Teknek Limited and... · Teknek Benefits •Teknek technology can now –Remove particles down to 10 nm (10x10-9m) –From all types of substrates –As thin as 15 microns –In both

Innovation 2

• Nanocleen

1.Silicone free

2.Static dissipating NO conductive particles – clever

polymers which are conductive.

3.Surface Energy - contact angle

(Measurements on PET)

• Uncleaned contact angle 71.57, SD +/- 1.49

• Cleaned with Nanocleen 71.80, SD +/- I.46

Page 18: Teknek Limited and... · Teknek Benefits •Teknek technology can now –Remove particles down to 10 nm (10x10-9m) –From all types of substrates –As thin as 15 microns –In both

Innovation 3

• UTF Elastomer

– Surface modified

– High cleaning capacity

– Can clean sheets of film as thin as 15 microns

(15µm)

– Can clean thin copper foil without wrinkles

Page 19: Teknek Limited and... · Teknek Benefits •Teknek technology can now –Remove particles down to 10 nm (10x10-9m) –From all types of substrates –As thin as 15 microns –In both

Innovation 4

• Vacuum Compatibility

– Can be used in high vacuum environments

– No outgassing from elastomer or adhesive

– Silicone free system

– No reduction in cleaning performance

– No detriment to vacuum system

Introduction

Vacuum Process

Teknek Technology

Page 20: Teknek Limited and... · Teknek Benefits •Teknek technology can now –Remove particles down to 10 nm (10x10-9m) –From all types of substrates –As thin as 15 microns –In both

World leader in Contact Cleaning

www.teknek.com

Customer Results 1

16/05/2013 20

Cleaning the edge of polyester web

before coating

Page 21: Teknek Limited and... · Teknek Benefits •Teknek technology can now –Remove particles down to 10 nm (10x10-9m) –From all types of substrates –As thin as 15 microns –In both

World leader in Contact Cleaning

www.teknek.com

Customer Results 2

16/05/2013 21

Cleaning the impression roller in

hot foil coating

Page 22: Teknek Limited and... · Teknek Benefits •Teknek technology can now –Remove particles down to 10 nm (10x10-9m) –From all types of substrates –As thin as 15 microns –In both

Customer ROI: SMT

16/05/2013 22

Page 23: Teknek Limited and... · Teknek Benefits •Teknek technology can now –Remove particles down to 10 nm (10x10-9m) –From all types of substrates –As thin as 15 microns –In both

Environment

Wide web

16/05/2013 23

Ca

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da

rin

g

Sp

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eri

ng

Pri

nti

ng

Co

ati

ng

La

min

ati

on

Se

alin

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Pri

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slit

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ew

ind

Slit

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ew

ma

ch

ine

s o

nly

Em

bo

ss

ing

Ins

pe

cti

on

Ro

ller

cle

an

ing

Film production Cast

Cast/Stretched

Extrusion

co-extrusion

Blown

Label stock production

Siliconising Film Film

Paper

Window tinting film

Packaging Drink

FPD Films Diffuser/Polariser

Battery production Separator film

Cathode/anode

Abrasives

CCL

Paper Technical

co-extruded

Medical Pouch

Blister

Films/tape

Holographic /security

Photo Imagable film Dry film

Filter / screen mesh

Flexible circuits FPCB

Digital

BIB/BIC

Ceramics

Glass

Existing application

Requested Requested

Page 24: Teknek Limited and... · Teknek Benefits •Teknek technology can now –Remove particles down to 10 nm (10x10-9m) –From all types of substrates –As thin as 15 microns –In both

Primary Converting Secondary Converting FPD and BLU Assembly

一次加工 二次加工 组装

www.teknek.com.cn

一次加工 二次加工 アッセンブリー工程

Page 25: Teknek Limited and... · Teknek Benefits •Teknek technology can now –Remove particles down to 10 nm (10x10-9m) –From all types of substrates –As thin as 15 microns –In both

Teknek – Leading SupplierFilms and Conversion

• 3M

• Bayer

• DuPont Teijin

• Nitto Denko

• Sumitomo Bakelite

• Toray TAF

• SKC Group

• Mitsibushi Group

• Sekisui

• Unitika

• COSMO

• Cheil (Samsung Group)

• Innox Group

• Ube

• Solutia

• Tsujiden Group

• Ashai Kasei

• Lintec

• Zeon Optes

Page 26: Teknek Limited and... · Teknek Benefits •Teknek technology can now –Remove particles down to 10 nm (10x10-9m) –From all types of substrates –As thin as 15 microns –In both

Teknek Benefits

• Teknek technology can now

– Remove particles down to 10 nm (10x10-9m)

– From all types of substrates

– As thin as 15 microns

– In both sheet and roll format

– At speeds from 1m/min to 500m/min

– In a high vacuum environment

– Without silicone

– Gives significant yield improvements

Page 27: Teknek Limited and... · Teknek Benefits •Teknek technology can now –Remove particles down to 10 nm (10x10-9m) –From all types of substrates –As thin as 15 microns –In both

27

INTERFACIAL FORCES

Page 28: Teknek Limited and... · Teknek Benefits •Teknek technology can now –Remove particles down to 10 nm (10x10-9m) –From all types of substrates –As thin as 15 microns –In both

28

EXAMPLES OF ADHESION FORCES


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