Telephone Equipment KX-TC2100BXB KX-TC2100BXS KX …1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 4 1.1....

© 2005 Panasonic Communications Co., Ltd. Allrights reserved. Unauthorized copying anddistribution is a violation of law.

KX-TC2100BXBKX-TC2100BXSKX-TC2100BXTKX-TC2100BXWCordless PhoneBlack Version

Silver Version

Metallic Black Version

White Version

(for Asia, Middle Near East and Other Areas)

Telephone Equipment

ORDER NO. KM40507814CE

1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 4

1.1. Suggested PbF Solder 4

1.2. How to recognize that Pb Free Solder is Used 5

2 FOR SERVICE TECHNICIANS 5

3 CAUTION 5

4 OPERATING INSTRUCTIONS 6

4.1. Battery 6

4.2. Location of Controls 7

4.3. Connection 8

4.4. Troubleshooting 9

5 DISASSEMBLY INSTRUCTIONS 10

6 TROUBLESHOOTING GUIDE 12

6.1. Check Power 13

6.2. Bell Reception 14

6.3. Check Battery Charge 15

6.4. Check Link 16

6.5. Check Handset Transmission 17

6.6. Check Handset Reception 18

7 ADJUSTMENTS (BASE UNIT) 19

7.1. Test Mode Flow Chart (Base Unit) 19

7.2. How to change the channel 20

7.3. Adjustment 20

7.4. Adjustment Standard (Base Unit) 21

8 ADJUSTMENTS (HANDSET) 22

8.1. Test Mode Flow Chart (Handset) 22

8.2. How to change the channel 23

8.3. Adjustment 23

8.4. Adjustment Standard (Handset) 24

9 RF SPECIFICATION 25

9.1. Base Unit 25

9.2. Handset 25

10 HOW TO CHECK THE HANDSET SPEAKER 25

11 FREQUENCY TABLE (MHz) 26

12 EXPLANATION OF CPU DATA COMMUNICATION 27

12.1. STAND-BY -> TALK, TALK -> STAND-BY 27

12.2. Ringing 28

12.3. Changing the Channel 29

12.4. Ports for transmitting and receiving of data 30

12.5. Waveform of DATA used for cordless transmission and

reception 30

13 BLOCK DIAGRAM (BASE UNIT) 31

14 CIRCUIT OPERATION (BASE UNIT) 32

14.1. Outline 32

14.2. Power Supply Circuit 33

14.3. Reset Circuit 34

14.4. Charge Circuit 35

14.5. Telephone Line Interface 35

14.6. Transmitter/Receiver 36

15 BLOCK DIAGRAM (HANDSET) 38

16 CIRCUIT OPERATION (HANDSET) 39

16.1. Outline 39

16.2. Reset Circuit 39

16.3. Battery Low / Power Down Detector 40

17 SIGNAL ROUTE 41

18 CPU DATA (Base Unit) 42

18.1. IC201 42

19 CPU DATA (Handset) 43

19.1. IC701 43

20 RF IC (Base Unit and Handset) 44

20.1. Base Unit: IC401, Handset: IC801 44

21 HOW TO REPLACE THE FLAT PACKAGE IC 45

21.1. PREPARATION 45

21.2. FLAT PACKAGE IC REMOVAL PROCEDURE 45

21.3. FLAT PACKAGE IC INSTALLATION PROCEDURE 46

21.4. BRIDGE MODIFICATION PROCEDURE 46

22 CABINET AND ELECTRICAL PARTS (BASE UNIT) 47

23 CABINET AND ELECTRICAL PARTS (HANDSET) 48

24 ACCESSORIES AND PACKING MATERIALS 49

25 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES

50

25.1. Base Unit 50

25.2. Handset 50

26 REPLACEMENT PARTS LIST 51

26.1. Base Unit 51

Note:Because CONTENTS 4 is the extract from the Operating Instructions of this model, it is subject to change without notice. You candownload and refer to the original Operating Instructions on TSN Server for further information.

CONTENTS Page Page

2

KX-TC2100BXB / KX-TC2100BXS / KX-TC2100BXT / KX-TC2100BXW

26.2. Handset 53

26.3. Accessories and Packing Materials 54

27 FOR SCHEMATIC DIAGRAM 57

27.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT)) 57

27.2. Handset (SCHEMATIC DIAGRAM (HANDSET)) 57

28 SCHEMATIC DIAGRAM (BASE UNIT) 58

29 SCHEMATIC DIAGRAM (HANDSET) 59

30 CIRCUIT BOARD (BASE UNIT) 61

30.1. Component View 61

30.2. Flow Solder Side View 62

31 CIRCUIT BOARD (HANDSET) 63

31.1. Component View 63

31.2. Flow Solder Side View 64

3


1 ABOUT LEAD FREE SOLDER (PbF: Pb free)Note:

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder thatcontains lead.

We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),Silver (Ag), and Copper (Cu).

This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repairwork we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.

Caution

• PbF solder has a melting point that is 50°F ~ 70° F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron withtemperature control and adjust it to 700°F ± 20° F (370°C ± 10°C). In case of using high temperature soldering iron, pleasebe careful not to heat too long.

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).

• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possibleand be sure that any remaining is melted prior to applying the Pb solder.

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto theopposite side (See the figure below).

1.1. Suggested PbF SolderThere are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with othermaterials.

The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.

4


(Example: Handset P.C.B.)

1.2. How to recognize that Pb Free Solder is Used

TXPOWER

C852

C865C861

C853R831

R803

IFOUT

C801

C855R836

R830

C854

C802

C870

C857R835

C863

R804

C808

C871R850

R851

RXVCO

R801

C8036

6

44

3

3

11

6

43

1

R834

R802

R833

C856

C805Q801

Q802Q804

C866

R843

DTCOUT

R838C862

R839

C864R837

R848C848

R841C860C858

C832

C831

C836

RE

DIA

L

LED705

LED703

LED704

PbF

LED702

DIRECT

TXVCO

C804

C839

C838

PSAVE

AUTO

TA

LK21 47

50

12

8

69 3

FLA

SH

LED

701

RIN

GE

R

LOU

D

PR

OG

RA

M

MIC

GN

DO

UT

PU

T

PA

US

E

CH #

Q803

C851

GNDANT_TP

NDTC

SP+ SP-

IFGND

1 3

46

C872C873

Marked

Note:

The location of the "PbF" mark is subject to change without notice.

2 FOR SERVICE TECHNICIANSICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.

1. Cover plastic parts boxes with aluminum foil.

2. Ground the soldering irons.

3. Use a conductive mat on worktable.

4. Do not grasp IC or LSI pins with bare fingers.

3 CAUTION 1. Danger of explosion if battery is incorrectly replaced.

2. Replace only with the same or equivalent type recommended by the manufacturer.

3. Dispose of used batteries according to the manufacturer´s Instructions.

5


4 OPERATING INSTRUCTIONS4.1. Battery4.1.1. Recharge

4.1.2. Battery information

4.1.3. Battery Replacement

6


4.2. Location of Controls

4.2.1. Base Unit

4.2.2. Handset

7


4.3. Connection

8


4.4. Troubleshooting

9


5 DISASSEMBLY INSTRUCTIONS

Shown in Fig.- To Remove Remove1 Cabinet Cover Screws (2.6 × 12)............... ........ (A) × 4

Main P.C. Board Main P.C. Board

10


Shown in Fig.- To Remove Remove2 Cabinet Cover Battery compartment cover.3 Screws (2.6 × 12)............... .......(B) × 24 Follow the procedure.5 Main P. C. Board Screw (2.6 × 12)............... .........(C) × 1

Main P. C. Board

11


6 TROUBLESHOOTING GUIDE

Cross Reference:

Check Power (P.13)

Bell Reception (P.14)

Check Battery Charge (P.15)

Check Link (P.16)

Check Handset Transmission (P.17)

Check Handset Reception (P.18)

12


Cross Reference:

Reset Circuit (P.34)

Power Supply Circuit (P.33)

Cross Reference:

Charge Circuit (P.35)

Note:

*CPU: IC201

Note:

*CPU: IC701

6.1. Check Power

*: Each measurement points are shown in CIRCUIT BOARD (BASE UNIT) (P.61) or CIRCUIT BOARD (HANDSET) (P.63)

13


Cross Reference:

Check Link (P.16)

Telephone Line Interface (P.35)

Cross Reference:

Check Link (P.16)

Note:

*CPU: IC201

Note:

*CPU: IC701

6.2. Bell Reception


14


Cross Reference:

Charge Circuit (P.35)

Cross Reference:

Reset Circuit (P.39)

Note:

*CPU: IC201

Note:

*CPU: IC701

6.3. Check Battery Charge


15


**: Refer to Adjustment (P.20) Note:

*CPU: IC201

*RF IC: IC401

6.4. Check Link


16


**: Refer to Adjustment (P.23). Note:

*CPU: IC701

*RF IC: IC801


6.5. Check Handset Transmission

Cross Reference:

SIGNAL ROUTE (P.41)

17


Cross Reference:

SIGNAL ROUTE (P.41)

6.6. Check Handset Reception

18


Note:

**: Refer to the above table.

7 ADJUSTMENTS (BASE UNIT)If your unit has below symptoms, adjust or confirm each item using remedy column from the table.

Symptom Remedy*The base unit does not respond to a call from handset. Make adjustments in item (A)The base unit does not transmit or the transmit frequency is off. Make adjustments in item (B)The transmit frequency is off. Make confirmation in item (C)The transmit power output is low, and the operating distance between the base unit andthe handset is less than normal.

Make adjustments in item (D)

The reception sensitivity of base unit is low with noise. Make confirmation in item (E)The transmit level is high or low. Make confirmation in item (F)The reception level is high or low. Make confirmation in item (G)The unit does not link. Make confirmation in item (H)

*: Refer to Adjustment (P.20).

7.1. Test Mode Flow Chart (Base Unit)The operation-flow of Test mode and main check items are shown below.

19


7.2. How to change the channel

Note:

Refer to Adjustment Standard (Base Unit) (P.21) for connection.

7.3. AdjustmentAdjustment Items Test Mode Adjustment

Point*Procedure Check or

ReplaceParts

(A) RX VCOAdjustment

3ch Talk T404 • Adjust T404 so that the reading of the Digital Voltmeter is 1.5 ± 0.3 V. IC401, T404,C446

(B) TX VCOAdjustment

3ch Talk T402 • Adjust T402 so that the reading of the Digital Voltmeter is 1.5 ± 0.3 V. IC401,DV401,T402

(C) TX FrequencyConfirmation

3ch Talk - • Confirm so that the reading of the frequency counter is 46.670MHz ±700Hz.

IC401, X401,DV401,C440,C441

(D) TX PowerAdjustment

3ch Talk T403 • Adjust T403 so that the reading of the RF VTVM is more than 1dBm. IC401, Q403,Q405, T403,

DPX401(E) RX Sensitivity

Confirmation (2ndIF output)

3ch Talk T401 1. Apply -60dBm output from S.S.G. (modulation frequency 1KHz, dev.0KHz).

2. Confirm that the reading of AF VTVM is the maximum value (more than20mV).

DPX401,T401,

CF401,CF402

(F) Line Output LevelConfirmation

3ch Talk - 1. Apply -60dBm output from S.S.G. (modulation frequency 1KHz, dev.3KHz).

2. Confirm that the reading of AF VTVM is more than 200mV (600Ω load).

IC401, Q304

(G) Line InputModulationConfirmation

3ch Talk - 1. Input via loop simulator 1.0KHz, 55mV (measured at T-R) signal.

2. Apply -60dBm output from S.S.G. (modulation frequency 1KHz, dev.0KHz).

3. Confirm so that the reading of FM Deviation Meter is 2.8 ± 0.5KHz.

IC401,DV401

(H) Noise SquelchConfirmation

3ch Talk - 1. Measure the S.S.G. output level when the noise squelch changes fromLow to High.

2. Confirm that the S.S.G. output level is -95dBm ~ -100dBm.

IC401,DPX401

* : The connections of adjustment equipment are as shown in Adjustment Standard (Base Unit) (P.21).

S.S.G. Frequency: 49.86 MHz

20


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C2

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C2

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C4

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C4

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C4

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C4

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C4

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C4

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C4

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C4

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C4

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C4

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C4

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C4

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C4

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C4

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C4

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C4

58

C4

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9.1

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C4

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C4

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R4

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C4

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C4

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C4

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C4

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C4

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C4

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C4

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C4

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C4

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C4

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C4

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C4

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C4

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C4

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C4

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TP

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C4

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1 6

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1 6

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C4

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C4

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C4

24

C4

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C4

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C2

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C4

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14

15

1

C4

21

C4

20

C4

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C4

53

R4

23

C4

75

C4

41

43

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29

28

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IC4

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R4

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R4

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R3

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C4

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C4

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C4

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C4

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C4

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R2

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R2

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R2

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R4

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R4

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R4

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R4

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R4

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R4

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C3

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C3

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C3

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C3

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C3

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C3

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R3

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R3

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R3

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R3

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R3

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R3

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R3

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R3

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R3

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R1

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R1

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R1

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R4

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R1

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R1

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R3

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R3

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R3

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R3

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R2

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R2

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C3

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C3

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C3

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C1

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R3

12

R4

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Q4

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Q3

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R4

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R4

22

R4

21

R4

24

R4

31

TX

VC

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C4

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R4

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R4

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R4

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R4

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R4

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R4

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21

8 ADJUSTMENTS (HANDSET)If your unit has below symptoms, adjust or confirm each item using remedy column from the table.

Symptom Remedy*The movement of Battery Low Indicator is wrong. Make confirmation in item (A)The base unit does not respond to a call from the handset. Make adjustments in item (B)The base unit does not transmit or the transmit frequency is off. Make adjustments in item (C)The transmit frequency is off. Make confirmation in item (D)The transmit power output is low, and the operating distance between the base unit andthe handset is less than normal.

Make adjustments in item (E)

The reception sensitivity of the handset is low with noise. Make confirmation in item (F)Does not link between the base unit and the handset. Make confirmation in item (G)The reception level is high or low. Make confirmation in item (H)The transmit level is high or low. Make confirmation in item (I)


Unit condition:

1. Remove the antenna lead wire from P.C. Board of the handset.

2. Power Supply: DC 3.9V (DC power supply)

3. Volume: HIGH (When P.C. Board of handset is in test mode, volume condition is medium. Press “LOCATOR” key once.)

4. Speaker Load: 150Ω

CH TX Frequency RX FrequencyCH3 49.860MHz 46.670MHz

8.1. Test Mode Flow Chart (Handset)

Note:

Refer to CIRCUIT BOARD (HANDSET) (P.63)

SIGNAL ROUTE (P.41)

22


8.2. How to change the channel

8.3. AdjustmentAdjustment Items Test Mode Adjustment

Point*Procedure Check or

ReplaceParts

(A) Battery LowConfirmation

3ch Talk - 1. Adjust the power supply voltage to DC 3.60V and confirm so that thereading of oscilloscope is High.

2. Adjust that power supply voltage to DC 3.40V and confirm so that thereading of oscilloscope is Low.

IC801

(B) TX VCOAdjustment

3ch Talk T803 • Adjust T803 so that the reading of the Digital Voltmeter is 1.5 ± 0.3 V. IC801, X801,T803, DV1

(C) RX VCOAdjustment

3ch Talk T804 • Adjust T804 so that the reading of the Digital Voltmeter is 1.0 ± 0.3 V. IC801, X801,T804,C831

(D) TX FrequencyConfirmation

3ch Talk - • Confirm so that the reading of the frequency counter is 49.860MHz ±700Hz.

IC801,DPX1,T802

(E) TX PowerAdjustment

3ch Talk T802 • Adjust T802 so that the reading of the RF VTVM is 1dBm ± 0.5dBm. IC801, Q802,Q804, T802,

DPX1(F) RX Sensitivity

Confirmation(2nd IF output)

3ch Talk T801 1. Apply -60dBm output from S.S.G. (modulation frequency 1KHz, dev.0KHz).

2. Confirm 2nd IF output so that the reading of AF VTVM is the maximumvalue(more than 20mV).

DPX1, T801,CF801,CF802

(G) Noise SquelchConfirmation

3ch Talk - 1. Measure the S.S.G. output level when the noise squelch changes fromLow to High. (modulation frequency 1KHz, dev.3KHz)

2. Confirm that the S.S.G. output level is -103dBm.

IC801, DPX1

(H) SpeakerOutput LevelConfirmation

3ch Talk - 1. Apply -60dBm output from S.S.G. (modulation frequency 1KHz, dev.3KHz).

2. Confirm that the reading of AF VTVM is more than 35mV

(Distortion:less than 7%) (volume High)

IC801

(I) Mic ModulationFactorConfirmation

3ch Talk - 1. Apply a MIC signal (1KHz, 4mV at 600Ω load).

2. Confirmation so that the reading FM Deviation Meter is 2.3 ± 0.5KHz.

IC801, DV1

(J) DataModulationConfirmation

3ch Talk - • Confirm for 4KHz ~ 7KHz FM Deviation Meter reading. Q802, Q804,T802, DV1,

DPX1

*: The connections of adjustment equipment are as shown in Adjustment Standard (Handset) (P.24).

S.S.G. Frequency: 46.67 MHz

23


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C8

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R8

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R8

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C8

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C8

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C8

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R8

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C8

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C8

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C8

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LE

D703

LE

D704

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D702

DIR

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C8

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4

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Sp

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um

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erat

or

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Au

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ferr

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TM

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(HA

ND

SE

T)

(P.2

2)


24

9 RF SPECIFICATION9.1. Base Unit

Item Value Refer to -.* RemarksTX Frequency 46.670 MHz ± 700 Hz ADJUSTMENTS (BASE UNIT) (C) at CH3TX Power more than 1dBm ADJUSTMENTS (BASE UNIT) (D) at CH3Line Modulation factor 2.8 KHz ± 0.5 KHz ADJUSTMENTS (BASE UNIT) (G)Data Modulation factor 5.5 KHz ± 1.5 KHz —Line Output level more than 200 mV —


9.2. HandsetItem Value Refer to -.** Remarks

TX Frequency 49.860 MHz ± 700 Hz ADJUSTMENTS (HANDSET) (D) at CH3TX Power 1.0dBm ± 0.5dBm ADJUSTMENTS (HANDSET) (E) at CH3 (Antenna

soldering point 50ΩLoad)

Data Modulation factor 5.5 KHz ± 1.5 KHz ADJUSTMENTS (HANDSET) (J) at CH3MIC Modulation factor 2.3 KHz ± 0.5 KHz ADJUSTMENTS (HANDSET) (I) at CH3 (MIC terminal

4mV Input)SP Output level more than 35 mV —

**: Refer to Adjustment (P.23).

10 HOW TO CHECK THE HANDSET SPEAKER 1. Prepare the digital voltmeter, and set the selector knob to ohm meter.

2. Put the probes at the speaker terminals as shown below.

25


11 FREQUENCY TABLE (MHz)BASE UNIT HANDSET

Channel Transmit Frequency Receive Frequency Transmit Frequency Receive Frequency1 46.610 49.670 49.670 46.6102 46.630 49.845 49.845 46.6303 46.670 49.860 49.860 46.6704 46.710 49.770 49.770 46.7105 46.730 49.875 49.875 46.7306 46.770 49.830 49.830 46.7707 46.830 49.890 49.890 46.8308 46.870 49.930 49.930 46.8709 46.930 49.990 49.990 46.930

10 46.970 49.970 49.970 46.970

26


12 EXPLANATION OF CPU DATA COMMUNICATION12.1. STAND-BY -> TALK, TALK -> STAND-BY

*: The channel is changed if the noise interferes with the conversation.

27


12.2. Ringing

28


12.3. Changing the Channel

29


Handset:

transmitting (TX) ... 25 Pin

receiving (RX) ... 12 Pin

Base Unit:

transmitting (TX) ... 23 Pin

receiving (RX) ... 10 Pin

12.4. Ports for transmitting and receiving of data

12.5. Waveform of DATA used for cordless transmission and receptionThe DATA which is transmitted from the Handset to the Base Unit is combination of DATA 0, DATA 1, DATA Delimit.

The DATA which is transmitted from the Base Unit to the Handset is combination of DATA 0, DATA 1, DATA Delimit.

12.5.1. Handset

12.5.2. Base Unit

• For example (one of part of data)

30


13 B

LO

CK

DIA

GR

AM

(BA

SE

UN

IT)

RF

ICIC

401

DU

PLE

XE

RD

PX

401

RF

AM

PQ

401,

T40

1

RX

VC

OT

404,

C44

6

1st I

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1st M

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2nd

Mix

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2nd

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Filt

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ET

PR

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MP

EX

PA

ND

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LIN

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MP

DA

TA

AM

P

DA

TA

Filt

er

Filt

er

1st L

ocal

Cry

stal

PLL

Osc

TX

PD

RX

PD

MIC

AM

P

LIM

ITE

R

CO

MP

RE

SS

OR

RE

SE

TP

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DO

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MO

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403,

T40

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TX

AM

PQ

405,

T40

3

RF DATA

RF CLOCK

RF EN

POWER DOWN

RESET

RX DATA

MC

U

CP

UIC

201

TE

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P Q

304

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SW

Q30

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P Q

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TX DATA

Cry

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9 DC

12V

Tra

nsis

tor

Q10

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103

DC

9.1V

DC

5V

LED

201

Q20

1

Cha

rge

Con

trol

Q10

2,Q

103

+ -

Q10

4C

harg

e D

etec

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rge

Con

trol

KX

-TC

2100

BLO

CK

DIA

GR

AM

(B

AS

E U

NIT

)


31

14 CIRCUIT OPERATION (BASE UNIT)14.1. Outline

Base unit consists of the following ICs as shown in BLOCK DIAGRAM (BASE UNIT) (P.31).

• CPU: IC201

− Controlling the whole system

− Forming/analyzing all data signals (ACK, CMD signal etc.)

− All interfaces (ex: LED, Detector Circuit (Charge/ Power Down))

• RF IC: IC401

− PLL Oscillator

− Detection

− Compress/ Expander

− 1st/2nd mixer

− Amplifier for transmission and reception

− DC 5.5V regulator

− Reset Circuit

• Additionally,

− Power Supply Circuit

− Charge Circuit

− Telephone Line Interface Circuit

32


14.2. Power Supply CircuitThe power supply to the CPU and RF IC from AC Adaptor (+12V) is shown in the diagram below.

The base unit power supply is DC12V. The handset power is supplied from DC 3.6V battery (Nickel-Cadmium battery) whichis installed in the handset.

Power supply for transmitter is turned on by pressing "TALK" key on the handset. During the stand-by mode, the unit stops

transmitting but receives the signal.

During on-hook condition (the handset is placed on the base unit), backup power for memory of the last dialed number is

supplied through the battery (DC 3.6V Nickel-Cadmium in the handset). The memory of this unit is not backed up by the currentfrom the telephone line.

The base unit DC power supply is regulated by Q101, D103. The CPU power is supplied from IC401. IC401 detects AC Adaptorpower failure and maintains the unit security code.

<Fig. 1>

33


14.3. Reset CircuitAfter power supply from AC adaptor, the reset signal for CPU is making in IC401. Refer to the below waveform.

<Fig. 2>

<Fig. 3>

34


14.4. Charge CircuitCircuit Operation:

When charging the handset on the base unit, the charge current is as follows;

DC12V → L101 → D102 → L103 → CH+(Base) → +CONTACT J601(Handset) → L602 → D602 → CN1-1 → Battery →

CN1-2 → -CONTACT J602(Handset) → CH-(Base) → L104 → Q102 → R104

In this way, the CPU on both units detects the fact that the battery is charged.

The charge current is controlled by switching Q103 of Base Unit. The battery is charged in normal mode for 9 hours and thenin trickle mode.

14.5. Telephone Line InterfaceFunction:

• Bell signal detection

• ON/OFF hook and pulse dial circuit

• Side tone circuit

Bell signal detection and OFF HOOK circuit:

In the idle mode, Q301 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the Tip (T)

and Ring (R) leads (When the telephone rings), the AC ring voltage is transferred as follows:

• JK1 TIP → P0301 → L301 → R334 → C322 → Q309 → IC201 Pin30

• JK1 RING → L302 → R333 → C321 → C323 → Q309 → IC201 Pin30

When the CPU detects a ring signal and press the “TALK” key on the handset, Q302 turns on and then Q301 turns on,

thus providing an off-hook condition (active DC current flow through the circuit) and the following signal flow is for the loop

current.

• Tip → P0301 → L301 → D303 → Q301 → R303 → Q302 → D306 → L302 → Ring

ON HOOK Circuit:

Q302 is open, Q301 is disconnected as to cut the DC loop current and to cut the voice signal. The unit is consequently in anon-hook condition.

Pulse Dial Circuit:

CPU (Hook) turns Q302 ON/OFF to make the pulse dialing via Q301.

Make/Break ratio when dialing with the Handset 40% : 60%

Side Tone Circuit:

Basically this circuit prevents the TX signal from feeding back to RX signal.

As for this unit, TX signal feed back from Q304 is canceled by the side tone circuit C312, C313, R317, R318 and R319.

35


14.6. Transmitter/ReceiverBase Unit and Handset mainly consist of RF (Radio Frequency) IC and CPU.

Base Unit and Handset transmit/receive voice signal and data signal through the antenna on carrier frequency.

Signal Path:

*Refer to CDL TX/RX in SIGNAL ROUTE (P.41).

14.6.1. Base to Handset

Circuit Operation:

The voice signal input from the TEL LINE interface goes to RF IC as shown in BLOCK DIAGRAM (BASE UNIT) (P.31).

In the talk mode (off-hook) condition, the telephone line voice signal passes through D303, Q301, C313, R320 and C315.

The signal goes through the compressor of RF IC, and it is output to transmitter circuit.

The signal of the data sent to the handset is applied in the anode of the variable capacitor diode (VARICAP : DV401).

The capacitor of VARICAP is changing in accordance with the voice signal from telephone line interface or TX DATA signal from

CPU. Therefore, the carrier frequency which is generated by TX VCO will be changed, and Frequency modulated RF

signal is generated and amplified by RF AMP (Q405, T403). It passes through the Duplexer DPX401 and is radiated fromAntenna.

The signal is transmitted from the base unit and received by the handset antenna and amplified by RF amplifier (Q801) through

DPX1 as shown in BLOCK DIAGRAM (HANDSET) (P.38). And then it is converted to 10.7 MHz and 450 KHz Intermediatefrequency by RF IC and related components.

The demodulated audio signal is output from RF IC (DET OUT) and passed through "Expander" process to reduce noise, then

voice signal amplified by "Receiver amplifier" is output to receiver (REC1).

The receiver loudness is adjustable by using "LOUD" key on the handset.

TX data (to Handset):

CPU (VTX) becomes low to turn on the transmission power transistor Q805, and CPU (TX-data) sends data signal. It is

FM-modulated by TX VCO and driven by RF AMP, then transmitted to the handset.

14.6.2. Handset to Base

Circuit Operation:

The voice signal from the handset user is picked up by the microphone (MIC), then it passes through "Compressor"

process to reduce noise as shown in BLOCK DIAGRAM (HANDSET) (P.38). And the voice is FM-modulated by

VARICAP (DV1).

The carrier frequency is generated by TX VCO. The transmitter power transistor Q805 is turned on/off by CPU (VTX).

The carrier signal is amplified by RF AMP and sent to the handset duplexer and antenna.

The signal of 49 MHz band (49.670~49.990 MHz) which is input from ANT is filtered at DPX401 as shown in

BLOCK DIAGRAM (BASE UNIT) (P.31), then it is input to RF IC.

The signal input to RF IC is converted through Mixer inside of RF IC, RF filter (CF1, CF2) and Expander.

The signal is transmitted from the handset and received by the base unit antenna and amplified by RF amplifier Q401, then

it is converted to10.695 MHz and 455 KHz Intermediate by RF IC. The demodulated audio signal is output from RF IC

(DET OUT) and passed through "Expander" process to reduce noise, then voice signal is led to LINE AMP. The signal passesthrough TELEPHONE INTERFACE and Tel-line.

RX data (from Handset):

The data signal from handset (ex: Talk, ACK, COM) is also included in 49 MHz band same as the voice data. After second if

filter, the data signal is made square shape by data limiting AMP of the RF IC. RX data is output to CPU (RX Data).

36


14.6.3. RF signal operation/control and PLL operation (RF UNIT)

Base unit radio frequency signal received by antenna passes through duplexer (DPX401).

RF signal is amplified by RF AMP. RF signal received from RF IC is mixed with RX local frequency at Mixer to generate

10.695 MHz wide band IF. The reference frequency is generated by X801 10.240 MHz crystal.

The 10.695 MHz is mixed with reference and 455 KHz narrow band IF is generated.

RF IC is controlled by CPU (RF EN, RF DATA, RF CLOCK). The RX local frequency is generated by RX VCO.

37


15 B

LO

CK

DIA

GR

AM

(HA

ND

SE

T)

RF

ICIC

801

DU

PLE

XE

RD

PX

1

RF

AM

PQ

801,

T80

1

RX

VC

OT

804,

C83

1

1st I

FF

ilter

1st M

ixer

2nd

Mix

er

2nd

IFF

ilter

IFF

ilter

DE

T

PR

E A

MP

EX

PA

ND

ER

SP

EA

KE

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DA

TA

AM

P

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TA

Filt

er

Filt

er

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ocal

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stal

PLL

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TX

PD

RX

PD

MIC

AM

P

LIM

ITE

R

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RE

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PO

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MO

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804,

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TX

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802,

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2

RF DATA

RF CLOCK

RF EN

POWER DOWN

RX DATA

MC

U

CP

UIC

701

SP

EA

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TX DATAC

ryst

alB

atte

ry

+ -

Q70

5

Cha

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Det

ectio

n

Key

Mat

rixR

eset

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4

Q70

1,Q

702

Buz

zer

DC

3.9V

KX

-TC

2100

BLO

CK

DIA

GR

AM

(H

AN

DS

ET

)


38

16 CIRCUIT OPERATION (HANDSET)16.1. Outline

Handset consists of the following ICs as shown in BLOCK DIAGRAM (HANDSET) (P.38).

• CPU: IC701

− Forming/analyzing all data signals (ACK or CMD signal)

− All interfaces (ex; LED, Key, Buzzer, Detector Circuit, Charge/Battery Low)

− RAM for keeping the data (CH Number, ID Code, etc.)

• RF IC: IC801

− PLL Oscillator

− Detection

− Compress/Expander

− 1st/2nd mixer

− Amplifier for transmission and reception

16.2. Reset CircuitThe power of handset is supplied by battery.

Whenever the battery is recharged or inserted, the impulse at CHG+ becomes Reset signal through Q704, and it is sent to CPU.

<Fig. 4>

<Fig. 5>

39


16.3. Battery Low / Power Down DetectorCircuit Operation:

“Battery Low” and “Power Down” are detected by RF IC which check the voltage from battery. Shortly, every detected blocksare inside of RF IC. The detected voltage is as follows;

• Battery Low

Battery voltage : V(Batt) < 3.457V

The CPU detects the level and “Recharge battery” LED starts flashing.

• Power Down

Battery voltage : V(Batt) < 3.0V

The output of RF IC (Power Down) becomes low level, then CPU stops working to keep the data (CH number, ID Code, etc.)

<Fig. 6>

40


17 SIGNAL ROUTEEach signal route is as follows.

41


18 CPU DATA (Base Unit)18.1. IC201

42


19 CPU DATA (Handset)19.1. IC701

43


20 RF IC (Base Unit and Handset)20.1. Base Unit: IC401, Handset: IC801

44


21 HOW TO REPLACE THE FLAT PACKAGE ICEven if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount),a soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.

21.1. PREPARATION • PbF (: Pb free) Solder

• Soldering Iron

Tip Temperature of 700°F ± 20°F (370°C ± 10°C)

Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone withless experience could overheat and damage the PCB foil.

• Flux

Recommended Flux: Specific Gravity → 0.82.

Type → RMA (lower residue, non-cleaning type)

Note: See ABOUT LEAD FREE SOLDER (PbF: Pb free) (P.4)

21.2. FLAT PACKAGE IC REMOVAL PROCEDURE 1. Put plenty of solder on the IC pins so that the pins can be completely covered.

Note:

If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.

2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.

3. While the solder melts, remove it together with the IC pins.

When you attach a new IC to the board, remove all solder left on the land with some tools like a soldering wire. If some solder isleft at the joint on the board, the new IC will not be attached properly.

45


21.3. FLAT PACKAGE IC INSTALLATION PROCEDURE 1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.

*Check the accuracy of the IC setting with the corresponding solderingfoil.

2. Apply flux to all pins of the FLAT PACKAGE IC.

3. Solder the pins, sliding the soldering iron in the direction of the arrow.

21.4. BRIDGE MODIFICATION PROCEDURE 1. Lightly resolder the bridged portion.

2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.

46


22 CABINET AND ELECTRICAL PARTS (BASE UNIT)

47


23 CABINET AND ELECTRICAL PARTS (HANDSET)

48


24 ACCESSORIES AND PACKING MATERIALS

49


25 TERMINAL GUIDE OF THE ICs, TRANSISTORS ANDDIODES

25.1. Base Unit

25.2. Handset

50


1. RTL (Retention Time Limited)

Note:

The marking (RTL) indicates that the Retention Time islimited for this item.

After the discontinuation of this assembly in production,the item will continue to be available for a specific periodof time. The retention period of availability is dependanton the type of assembly, and in accordance with thelaws governing part and product retention. After the endof this period, the assembly will no longer be available.

2. Important safety notice

Components identified by the mark indicates specialcharacteristics important for safety. When replacing any ofthese components, only use specified manufacture’s parts.

3. The S mark means the part is one of some identical parts.For that reason, it may be different from the installed part.

4. ISO code (Example: ABS-94HB) of the remarks columnshows quality of the material and a flame resisting gradeabout plastics.

5. RESISTORS & CAPACITORS

Unless otherwise specified;

All resistors are in ohms (Ω) K=1000Ω, M=1000kΩ

All capacitors are in MICRO FARADS (µF)P=µµF

*Type & Wattage of Resistor

26.1. Base Unit

26.1.1. Cabinet and Electrical PartsRef.No.

Part No. Part Name & Description Remarks

1 PQJT10229Z CHARGE TERMINAL

2 PQHR11115Z CASE, CHARGE TERMINAL (forKX-TC2100BXB) (for KX-TC2100BXT)

PS-HB

2 PQHR11115Y CASE, CHARGE TERMINAL (forKX-TC2100BXS) (for KX-TC2100BXW)

PS-HB

3 PQHR11113Z OPTIC CONDUCTIVE PARTS, LEDLENDS

PS-HB

4 PQGT17408Y NAME PLATE (for KX-TC2100BXB)

4 PQGT17772Y NAME PLATE (for KX-TC2100BXS)

Ref.No.


4 PQGT17774Y NAME PLATE (for KX-TC2100BXT)

4 PQGT17770Y NAME PLATE (for KX-TC2100BXW)

5 PQQT22877Z LABEL, CHARGE

6 PQKM10675Z1 CABINET BODY (for KX-TC2100BXB)

PS-HB

6 PQKM10675Y3 CABINET BODY (for KX-TC2100BXS)

PS-HB

6 PQKM10675Y4 CABINET BODY (for KX-TC2100BXT)

PS-HB

6 PQKM10675Z2 CABINET BODY (for KX-TC2100BXW)

PS-HB

7 PQKF10666Z1 CABINET COVER (for KX-TC2100BXB) (for KX-TC2100BXT)

PS-HB

7 PQKF10666Z3 CABINET COVER (for KX-TC2100BXS)

PS-HB

7 PQKF10666Z2 CABINET COVER (for KX-TC2100BXW)

PS-HB

8 PQSA10105Y ANTENNA

9 PQHA10030Z RUBBER PARTS, FOOT RUBBER

10 PQBC10428Z1 LOCATOR BUTTON (for KX-TC2100BXB)

ABS-HB

10 PQBC10428Y3 LOCATOR BUTTON (for KX-TC2100BXS) (for KX-TC2100BXT)

ABS-HB

10 PQBC10428Z2 LOCATOR BUTTON (for KX-TC2100BXW)

ABS-HB

26.1.2. Main P.C.Board PartsRef.No.


PCB1 PQWPC2100BXH MAIN P.C.BOARD ASS´Y (RTL)

(ICs)

IC201 MN101C94AKA IC

IC401 AN6266FA IC

(TRANSISTORS)

Q101 B1AADE000014 TRANSISTOR(SI)



Q104 B1ABDE000020 TRANSISTOR(SI)

Q201 B1GBCFGG0028 TRANSISTOR(SI)


Q301 2SA1625 TRANSISTOR(SI) S

Q302 PQVT2N6517CA TRANSISTOR(SI) S

Q304 B1AAJC000010 TRANSISTOR(SI)




Q402 B1GDCFNN0021 TRANSISTOR(SI)



(DIODES)

D101 MA4300 DIODE(SI) S

D102 B0EAKP000126 DIODE(SI)



D201 B0EAAD000001 DIODE(SI)








DV401 B0CAAB000021 DIODE(SI)

LED201 PQVDSML310MT LED S

(COILS)

L101 G0C100K00039 COIL

L104 PQLQZM100K COIL S

L301 PQLQZK3R3K COIL S



T401 G2BRC0000008 COIL

26 REPLACEMENT PARTS LIST

51


Ref.No.


T402 PQL04B001 COIL


T404 PQL04B002 COIL

(CERAMIC FILTERS)

CF401 J0B1075A0127 CERAMIC FILTER


(IC FILTERS)

DPX401 J0E4675A0001 IC FILTER

(CRYSTAL OSCILLATORS)

X201 H0D795400007 CRYSTAL OSCILLATOR


(JACKS)

JK1 K2LD104A0001 JACK S

(VARISTORS)

SA301 J0LF00000026 VARISTOR (SURGE ABSORBER) S

SA302 J0LF00000026 VARISTOR (SURGE ABSORBER) S

(RESISTORS)

R101 ERDS2TJ221 220

R102 ERJ3GEYJ102 1K

R103 ERJ3GEYJ102 1K

R104 ERDS2TJ151 150

R105 ERJ3GEYJ102 1K

R106 ERJ3GEYJ391 390

R107 PQ4R10XJ101 100 S

R108 PQ4R10XJ270 27 S

R109 ERJ3GEYJ103 10K







R207 ERJ3GEYJ102 1K




R211 ERJ3GEY0R00 0

R215 ERJ3GEYJ472 4.7K



R302 PQ4R10XJ104 100K S

R303 PQ4R10XJ472 4.7K S


R311 PQ4R10XJ821 820 S

R312 PQ4R10XJ103 10K S

R314 ERDS1TJ680 68








R333 PQ4R10XJ104 100K S

R334 PQ4R10XJ104 100K S

R335 PQ4R10XJ472 4.7K S


R337 PQ4R10XJ222 2.2K S




R404 ERJ3GEYJ470 47












Ref.No.








R426 ERJ3GEYJ185 1.8M

R427 ERJ3GEYJ105 1M

R428 ERJ3GEYJ155 1.5M






R434 ERJ3GEYJ102 1K

R435 ERJ3GEYJ330 33




R443 ERJ3GEYJ820 82

R444 ERJ3GEY0R00 0


(CAPACITORS)

C102 ECEA1EKA100 10

C103 ECUV1H103KBV 0.01

C104 ECEA1CK101 100 S


C201 ECUV1H220JCV 22P


C203 ECUV1E223KBV 0.022

C204 ECUV1C393KBV 0.039

C205 ECUV1H392KBV 0.0039


C207 ECUV1C104KBV 0.1


C209 ECEA0JU471 470

C303 ECKD2H681KB 680P S

C304 ECKD2H681KB 680P S

C305 PQCUV1H472KB 0.0047

C308 ECEA1HKS220 22 S

C309 PQCUV1H101JC 100P

C310 PQCUV1H103KB 0.01

C311 ECUV1A105KBV 1

C312 ECEA1HKA3R3 3.3

C313 ECUV1E273KBV 0.027

C314 ECUV1H272KBV 0.0027


C321 PQCUV1H154KR 0.15

C322 PQCUV1H154KR 0.15

C323 PQCUV1A684KB 0.68

C401 ECKERS102MB 0.001 S

C404 ECUV1H100DCV 10P







C413 ECEA1EKA100 10







C420 ECUV1H471JCV 470P S

C421 ECUV1H153KBV 0.015

C422 ECUV1H392KBV 0.0039


C424 ECUV1E223KBV 0.022


C426 ECUV1C473KBV 0.047


52


Ref.No.


C428 ECJ1VC1H271J 270P

C429 ECUV1H152KBV 0.0015


C431 ECEA1CKA470 47



C434 ECUV1C473KBV 0.047

C435 ECEA1CKS220 22 S


C437 ECUV1H562KBV 0.0056



C440 ECUV1H430GCV 43P



C443 ECEA1EKA100 10

C444 ECEA1HKA4R7 4.7





C449 ECUV1H392KBV 0.0039


C451 ECUV1H821KBV 820P

C452 ECUV1H102KBV 0.001



C455 ECJ1VB1H682K 0.0068

C456 ECUV1H040CCV 4P




C460 ECEA1CKS220 22 S

C461 ECUV1H102KBV 0.001

C462 ECEA1CKA470 47




C469 ECEA1CKA470 47



C472 ECUV1H102KBV 0.001

(OTHERS)

SW201 K0H1BB000018 SPECIAL SWITCH

26.2. Handset

26.2.1. Cabinet and Electrical PartsRef.No.


101 PQKM10676Z1 CABINET BODY (for KX-TC2100BXB)

ABS-HB

101 PQKM10676Y3 CABINET BODY (for KX-TC2100BXS)

ABS-HB

101 PQKM10676Y4 CABINET BODY (for KX-TC2100BXT)

ABS-HB

101 PQKM10676Z2 CABINET BODY (for KX-TC2100BXW)

ABS-HB

102 PQGT17409Y NAME PLATE (for KX-TC2100BXB)

102 PQGT17773Y NAME PLATE (for KX-TC2100BXS)

102 PQGT17775Y NAME PLATE (for KX-TC2100BXT)

102 PQGT17771Y NAME PLATE (for KX-TC2100BXW)

103 PQSX10296Z KEYBOARD SWITCH (for KX-TC2100BXB)

103 PQSX10296X KEYBOARD SWITCH (for KX-TC2100BXS)

103 PQSX10296W KEYBOARD SWITCH (for KX-TC2100BXT)

103 PQSX10296Y KEYBOARD SWITCH (for KX-TC2100BXW)

104 PQHR11114Z OPTIC CONDUCTIVE PARTS, LEDLENS

PS-HB

105 PQKF10667Z1 CABINET COVER (for KX-TC2100BXB)

ABS-HB

Ref.No.


105 PQKF10667Y3 CABINET COVER (for KX-TC2100BXS)

ABS-HB

105 PQKF10667Y4 CABINET COVER (for KX-TC2100BXT)

ABS-HB

105 PQKF10667Z2 CABINET COVER (for KX-TC2100BXW)

ABS-HB

106 PQXA36ASVC BATTERY

107 PQKK10589Z1 LID, BATTERY COVER (for KX-TC2100BXB)

ABS-HB

107 PQKK10589Y3 LID, BATTERY COVER (for KX-TC2100BXS)

ABS-HB

107 PQKK10589Y4 LID, BATTERY COVER (for KX-TC2100BXT)

ABS-HB

107 PQKK10589Z2 LID, BATTERY COVER (for KX-TC2100BXW)

ABS-HB

108 PQSA10170Z ANTENNA (for KX-TC2100BXB)(for KX-TC2100BXT)

108 PQSA10170Y ANTENNA (for KX-TC2100BXS)(for KX-TC2100BXW)

109 PQJT10230Z TERMINAL, CHARGE (L)

110 PQJT10231Z TERMINAL, CHARGE (R)

111 L0AD02A00029 SPEAKER

112 PQHE10161Z SPACER

113 PQHS10696Z BUZZER SHEET

114 PQQT22966Z LABEL, CAUTION

26.2.2. Main P.C.Board PartsRef.No.


PCB100 PQWPC2100BXR MAIN P.C.BOARD ASS´Y (RTL)

(ICs)

IC701 MN101C427AP IC

IC801 AN6265FA IC

(TRANSISTORS)

Q701 B1ADDE000022 TRANSISTOR(SI)



Q705 B1GBCFGJ0011 TRANSISTOR(SI)




Q805 B1GDCFNN0021 TRANSISTOR(SI)

(DIODES)

D601 MA8056H DIODE(SI) S


D701 B0ACCL000002 DIODE(SI)

DV1 B0CAAB000021 DIODE(SI)

LED701 PQVDSML310MT LED S

(COILS)



T802 G2AYYYC00058 COIL

T803 PQL04B004 COIL

T804 G2AYYYC00060 COIL

(CERAMIC FILTERS)



(CRYSTAL OSCILLATORS)



(IC FILTERS)

DPX1 J0E4985A0002 IC FILTER

(CONNECTOR AND JACK)

CN1 PQJP2D13Z CONNECTOR S

(RESISTORS)




R705 ERJ3GEYJ102 1K




R710 ERJ3GEY0R00 0

R712 ERJ3GEYJ102 1K

53


Ref.No.









R802 ERJ3GEYJ820 82


R804 ERJ3GEY0R00 0











R820 ERJ3GEYJ102 1K

R821 ERJ3GEY0R00 0













R839 ERJ3GEYJ102 1K



R843 ERJ3GEYJ102 1K

R844 ERJ3GEY0R00 0



R850 ERJ3GEY0R00 0

R851 ERJ3GEY0R00 0


C802 ERJ3GEY0R00 0

C869 ERJ3GEY0R00 0

C874 ERJ3GEYJ562 5.6K

(CAPACITORS)


C701 ECEA0JKA101 100




C705 ECUV1C473KBV 0.047




C803 ECUV1H060DCV 6P S










C814 ECEA1CKA100 10




C818 ECUV1H821KBV 820P

C820 ECUV1C473KBV 0.047

Ref.No.


C821 ECJ1VB1H472K 0.0047



C824 ECUV1C473KBV 0.047












C837 ECST0JY106 10 S





C842 ECUV1H152KBV 0.0015



C845 ECEA1CKA100 10


C847 ECUV1C473KBV 0.047







C859 ECEA1CKA100 10







C866 ECUV1C333KBV 0.033

C867 ECUV1E223KBV 0.022



C872 ECUV1H102KBV 0.001


C876 ECST0JY106 10 S

(OTHERS)

E101 PQEFBDB111GF BUZZER

E102 PQJM122Z MICROPHONE

26.3. Accessories and PackingMaterials

Note:

(*1) You can download and refer to the OperatingInstructions (Instruction book) on TSN Server.

Ref.No.


A1 PQLV16BXX AC ADAPTOR

A2 PQJA10075Z CORD, TELEPHONE

A3 PQQX14692Z INSTRUCTION BOOK (*1)

A4 PQQW14749Z QUICK GUIDE

A5 PQQW14829Z LEAFLET

A6 PQKL10069Z1 STAND, WALL MOUNT (for KX-TC2100BXB) (for KX-TC2100BXT)

A6 PQKL10069Z3 STAND, WALL MOUNT (for KX-TC2100BXS)

A6 PQKL10069Z2 STAND, WALL MOUNT (for KX-TC2100BXW)

P1 PQPP10104Z PROTECTION COVER (for BaseUnit)

54


Ref.No.


P2 PQPP10105Z PROTECTION COVER (forHandset)

P3 PQPP10092Z PROTECTION COVER

P4 PQPK14627Z GIFT BOX

55


Memo

56


27 FOR SCHEMATIC DIAGRAM27.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT)) 1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.

2. The schematic diagrams and circuit board may be modified at any time with the development of new technology.

Important Safety Notice:Components identified by mark have special characteristics important for safety. When replacingany of these components, use only the manufacturer´s specified parts.

27.2. Handset (SCHEMATIC DIAGRAM (HANDSET)) 1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.

2. The schematic diagrams and circuit board may be modified at any time with the development of new technology.

57


28 S

CH

EM

AT

ICD

IAG

RA

M(B

AS

EU

NIT

)

KX

-TC

2100

SC

HE

MA

TIC

DIA

GR

AM

(B

ase

Uni

t)

NC

: N

o C

ompo

nent

s


58

29 S

CH

EM

AT

ICD

IAG

RA

M(H

AN

DS

ET

)

KX

-TC

2100

SC

HE

MA

TIC

DIA

GR

AM

(H

ands

et)

NC

: N

o C

ompo

nent

s


59

Mem

o


60

30 C

IRC

UIT

BO

AR

D(B

AS

EU

NIT

)30

.1.

Co

mp

on

ent

Vie

w

L401

J33

D10

1

E

12

1

1

12

34 5

3

33

6

6

4

13

64

44 5

BC

E

B

C

E

E

E

E

B

B

B

B

C

C

C

C

E

B

C

C102

ANT1L101

D102

Q10

1

L102

R104

C469

Q103

Q102

J32

C462

C460

D308

J30

C444

C435

C443

C431

C308

D307

Q301Q302 Q303

Q304

C312J4J27

J34

J1

C209

X401PbF

J5J6

J21

PQUP11329Z

J22

J25

J37

J35

J18

J17

J2

R307C302

L301

R314

DV401

K A

PO301

GND

2

1

SA301

JK1

C104

D10

3

DP

X40

1

J24

C41

3

J23

CF

401

J19

ING

ND

OU

T

J12 J1

3 J15

J16

J26

J10

J9

J8

J14

J20

J11

J7R

418

CF

402

R414

SW201

J3

D20

1L2

01

X20

1J3

6

J31

C40

1

D10

5

D10

4L1

04

R10

1

CH

+

CH

-

D30

5 L302

R30

1

D30

1

D30

2

D40

1

SA

302

C30

1

J29

R30

9

R30

6

D30

6

J28

D30

4

D30

3

L103

C30

4

C30

3

T40

2

13

64

T40

4

T40

1

T40

3 KX

-TC

2100

CIR

CU

IT B

OA

RD

(B

ase

Uni

t (C

ompo

nent

Vie

w))

A


61

30.2

. F

low

So

lder

Sid

eV

iew

Q30

9

Q10

4

Q40

5

Q40

3

R22

7R

228R

224

C20

3

R22

2

R22

3

R22

1G

ND

2

R22

9

C20

1C

208

C20

2

C43

7

C43

3

C43

2

C43

4

C41

9

C42

3C

416 IF

OU

T

IFG

ND

C41

5

C41

4

C41

2

C40

8

C40

9

C47

4C

446

C45

6C

458

C45

9

9.1V

RE

G

C45

4

C46

1 R43

6

R43

9

C46

3

C45

5

C45

1C

450

C45

2

C44

8

C44

5

C44

9

C44

2

C44

0

C45

7

C47

1

C47

2

C46

5

C40

4

C40

5

C40

7

C46

4C

467

C46

6

C46

8

C47

3

C40

3C

402

TP

6T

P1

TP

2

C10

3C

470

C10

5

1 6

3 4

1 6

3 4

1 6

3 4

6 4

1 3

TX

GN

D

GN

D1

TX

AN

T

C41

8

C42

8

C42

4C

425

C42

9

C20

7

C43

0

14 15

1

C42

1

C42

0

C41

0

C45

3R

423

C47

5

C44

1

43

56

42

2928

DE

T

R33

7

C44

7

IC40

1

R41

3

R40

6

R31

6

R31

5

C42

7C

426

C41

7C

422

LED

201

C43

8

C43

9

C43

6

R23

1

R20

9 R23

2

R21

5

R20

7 C20

4

IC20

1

R23

3

R23

4

R23

5R

202 R20

3

R41

9R

417

RX

DT

R41

5R

444

R41

6

R41

1

R21

1C

311

R20

4

LOC

AT

OR

R41

2

R41

0

R40

9

R40

8

R40

7R

404

R40

5

R40

3

RX

GN

DR

XA

NT

R43

2

R43

4

R43

0

R42

9

R43

3

R42

5

R42

7

R43

5

TP

7

C31

0

C31

4

C31

5

C30

6

C32

1C

313

R31

1R

302

R33

6R

334

R30

3

R30

4

R33

3

R31

7

R32

0R

308

R31

9R

318 R31

3

DC

12V

CH

+

CH

-

PW

R_G

ND

PbFR

105

R10

6R

109

R10

8

R10

7R

443

R11

0R

103

R10

2

R31

0

C30

7

GN

D3

TIP

RIN

G

R30

5R

321

R32

2

C30

9

R20

8

R21

7

C30

5

C32

3

R33

5

C32

2

C10

1

R31

2

R42

8

Q40

2

Q30

5

R42

6

R42

2R

421

R42

4

R43

1

TX

VC

O

RX

VC

O

C40

6

C41

1 R40

2

R44

5R

401

R43

7

R43

8

R44

0

R44

2

R44

1

Q40

4

Q40

1

R42

0

SQ

L

Q20

2

Q20

1

R20

6

R20

5R

216

R22

5

1112

2223

3334

144

R21

0

PD

own

5VR

EG

R22

6

R23

0

C20

6

R23

6

CH

_UP

C20

5

R32

3

KX

-TC

2100

CIR

CU

IT B

OA

RD

(B

ase

Uni

t (F

low

Sol

der

Sid

e V

iew

))

CH

-UP

RE

SE

T(C

PU

: 39)

CD

D(C

PU

: 13)

CH

G L

D

(CP

U: 4

)

XO

UT

(C

PU

: 14)

RX

DA

TA

(R

FIC

: 13)

DE

T O

UT

(R

FIC

: 27)

IF O

UT

(R

FIC

: 33)

IF G

ND

RX

VC

OR

XA

NT

TX

VC

OR

XG

ND

TX

GN

DT

XP

OW

ER

2ND

MIX

(R

FIC

: 37)

TX

DA

TA

(C

PU

: 23)

CH

G D

ET

(C

PU

: 27)

RIN

G D

ET

(C

PU

: 30)

RIN

G

TIP

PW

R_G

ND

DC

12V

DC

12V


62

31 C

IRC

UIT

BO

AR

D(H

AN

DS

ET

)31

.1.

Co

mp

on

ent

Vie

w

TX

DA

TA

(C

PU

: 25)

VD

D

(CP

U: 1

4)

RX

DA

TA

(RF

IC: 1

3)R

ES

ET

(CP

U: 4

3)C

HG

DE

T(C

PU

: 1)

VB

AT

(RF

IC: 3

6)

C60

2

C70

8

X80

1

R81

7R

812

R80

9

R81

0

R80

7

R80

8R

816

R82

1 R84

2R

820

R82

3

R82

2

R81

9

R81

1

R80

6

R80

5

R82

5R

852

R82

6

R82

4

R81

8

R73

1R

730

R72

9

R72

3

R72

5

R72

4

R70

8

R84

5

R72

6R

727

R72

8

BZ

1

R70

7

R71

8

R71

7 R71

9

R72

0R

721R

701

R72

2

R82

9

R82

8

R82

7R

714

R70

9

R83

2

R71

0

R70

4

KX

-TC

2100

R71

5

R71

2

R71

1R

713

R70

5

C82

9C

822 C

823C

875

28

2942

4356

15

141

I31

46 O

G

C80

7

C81

1

C84

5

C834

C83

7

C84

2C

840 C

843

C86

7C

835

C82

7

C83

0

C83

3

C86

9

C82

6

C84

1

C84

4

C84

6

C82

8

C82

5

C81

4

C81

6

C81

3

C81

8C

820

C82

1

DV

1T

803

T80

2

IC80

1

T80

4T

801

L801

CF

1

CF

2

DPX1

ANT2

BLACK

RED

C81

2

C82

4

C81

5

C85

9

A

C81

7

C87

4

C70

3

C70

4

C70

2

C86

8

C85

0

C84

7

C87

6

Pb

F

PQ

UP

1130

Z

C70

5

R70

6

R70

2

C70

6C

707

66

4

45

41

123

1

33

6 4

1 3

L602

4837

1324

3625

112

R84

9R

844

R81

5

R70

3

C81

0

AK

C80

9

C701

C601

D70

2

D601D602

D701

X701

RX

DT

PD

OW

N

VBAT

MIC22 1

CN1

MIC1

J601 J602

L701

L603

Q70

5

Q70

4

Q70

6

Q80

5

Q70

3Q

702

Q70

1

KX

-TC

2100

CIR

CU

IT B

OA

RD

(H

ands

et (

Com

pone

nt V

iew

))


63

31.2

. F

low

So

lder

Sid

eV

iew

KX

-TC

2100

CIR

CU

IT B

OA

RD

(H

ands

et (

Flo

w S

olde

r S

ide

Vie

w))

TX

PO

WE

R

C85

2

C86

5C

861

C85

3R

831

R80

3

IFO

UT

C80

1

C85

5R

836

R83

0

C85

4

C80

2

C87

0

C85

7R

835

C86

3

R80

4

C80

8

C87

1R

850

R85

1 RX

VC

O

R80

1C80

36

6

44

3

3

11

643 1

R83

4

R80

2

R83

3

C85

6

C80

5Q

801

Q80

2Q

804

C86

6

R84

3

DT

CO

UT

R83

8C

862

R83

9

C86

4R

837

R84

8C

848 R84

1C

860

C85

8

C83

2

C83

1

C83

6

REDIAL

LED

705

LED

703

LED

704

Pb

F

LED

702

DIR

EC

T

TX

VC

OC80

4

C83

9

C83

8

PS

AV

E

AU

TO

TALK

21

4

7

5

0

1 2

8

6

9

3

FLASH LED701

RINGER

LOUD

PROGRAM

MIC

GND OUTPUT

PAUSE

CH

#

Q80

3

C85

1

GN

DA

NT

_TP

ND

TC

SP

+S

P-

IFG

ND

13 4

6

C87

2C

873

DC

Pow

erS

uppl

y

+-

2ND

MIX

(RF

IC: 3

7)T

XV

CO

RX

VC

O

IF G

ND

TX

PO

WE

R

IF O

UT

(RF

IC: 3

3)


64

65


I.N./NKXTC2100BXBKXTC2100BXSKXTC2100BXTKXTC2100BXW

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Telephone Equipment KX-TC2100BXB KX-TC2100BXS KX …1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 4 1.1....

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