The 8th International Conferenceon Solid-State Sensors and Actuators
andEurosensors IX
DIGEST OF TECHNICAL PAPERS
JUNE 25-29, 1995STOCKHOLM, SWEDEN
VOLUME 1SESSIONS A1-PD6PAPERS NO 1-231
UB/TIB Hannover 89114 008 744
TRANSDUCERS '95 • EUROSENSORS IX
The 8th International Conference on Solid-State Sensors and Actuators, and Eurosensors IX. Stockholm, Sweden, June 25—29,1995
Contents
Date: 95-06-26Plenary Session
CHEMICAL SENSING WITH LASER SPECTROSCOPY 1-A0SVANBERG.S.*•UNIVERSITY OF LUND, SWEDEN
BIOMIMET1C SENSING SYSTEMS WITH ARRAYEDNONSPECIFIC SENSORS 2-AOMORIIZUMI.T.*"TOKYO INSTITUTE OF TECHNOLOGY, JAPAN
POLYSILICON INTEGRATED MICROSYSTEMS:TECHNOLOGIES AND APPLICATIONS 3-AOHOWE.R.T.*•UNIVERSITY OF CALIFORNIA, BERKELEY, USA
Date: 95-06-26
A1 Implantable Devices, Telemetry
LINKING SENSORS WITH TELEMETRY: IMPACT ON THESYSTEM DESIGN 4-A1PUERS.R.* (INVITED)•CATHOLIC UNIVERSITY OF LEUVEN, BELGIUM
AN IMPLANTABLE MULTICHANNEL DIGITAL NEURALRECORDING SYSTEM FOR A MICROMACHINED SIEVEELECTRODE 5-A1+AKIN.T.; NAJAFI, K.; BRADLEY.R. M.UNIVERSITY OF MICHIGAN, USA
SELF TUNING INDUCTIVE POWERING FOR IMPLANTABLETELEMETRIC MONITORING SYSTEMS 6-A1+VAN SCHUYLENBERGH, K.*; PUERS.R.*•KATHOLIEKE UNIVERSITEIT LEUVEN, BELGIUM
A MULTICHANNEL NEUROMUSCULAR MICROSTIMULATORWITH BIDIRECTIONAL TELEMETRY 7-A1+NARDIN.M.; NAJAFI, K.UNIVERSITY OF MICHIGAN, USA
MICROFABRICATION AND CHARACTERIZATION OFMICROELECTRODEARRAYS FOR IN VIVO NERVESIGNAL RECORDING 8-A1VALDERRAMA.E.*; GARRIDO, P.*; CABRUJA.E.*;HEIDUS.CHKA, P."; +HARSCH.A.**; GOPEL.W."•CENTRE NACIONAL DE MICROELECTRONICA, SPAIN;"UNIVERSITY OF TUBINGEN, GERMANY
AN ACTIVE MICROFABRICATED SCALP ELECTRODE-ARRAYFOR EEG RECORDING 9-A1+ALIZADEH-TAHERI.B.; SMITH,R. L.; KNIGHT, R. T.SRI,USA; UC DAVIS, USA
Date: 9S-06-26A2 Silicon Processes I
FABRICATION OF SOI WAFERS WITH BURIED CAVITIESUSING SILICON FUSION BONDING AND ELECTROCHEMICALETCHBACK 10-A2+NOWOROLSKI.J. M.; KLASSES, E.; LOGAN, J.; PETERSEN,K.; MCCULLEY.W.
UC BERKELEY, USA; STANFORD, USA; LUCAS NOVA-SENSOR, USA
AUTOMATIC ETCH STOP BURIED OXIDE USING EPITAXIALLATERAL OVERGROWTH 11-A2+GENNISSEN.P.T.J.*; BARTEK.M.*; FRENCH, P.J.*; SARRO,P.M."; WOLFFENBUTTEL.R.F.*•DELFT UNIVERSITY OF TECHNOLOGY.THE NETHERLANDS;"DELFT INST FOR MICROEL. & SUBMICRON TECH.,THE NETHERLANDS
A CMOS DISSOLVED WAFER PROCESS FOR INTEGRATEDP++ MICRO ELECTRO MECHANICAL SYSTEMS 12-A2+GIANCHANDANI.Y.; MA,K.; NAJAFI, K.UNIVERSITY OF MICHIGAN, USA
pH-CONTROLLED TMAH ETCHANTS FOR SILICONMICROMACHINING 13-A2+TABATA.O.*•TOYOTA CENTR.RES.AND DEVELOPM.LAB. INC, JAPAN
A NEW ETCHING METHOD FOR SINGLE CRYSTAL ALjO3
FILM ON Si USING Si ION IMPLANTATION 14-A2+ISHIDA.M.*; KIM.H.*; KIMURA.T.*; NAKAMURA, T*•TOYOHASHI UNIVERSITY OF TECHNOLOGY, JAPAN
Date: 95-06-26PA2 Silicon Processes I
CONFINED SELECTIVE EPITAXIAL GROWTH: POTENTIALFOR SMART SILICON SENSOR FABRICATION 15-PA2+BARTEK.M.*; GENNISSEN, P.T.J.*; FRENCH, P.J.*;WOLFFENBUTTEL, R.F.*•DELFT UNIVERSITY OF TECHNOLOGY, THE NETHERLANDS
SELECTIVE SEEDING OF COPPER FILMS ON POLYIMIDEPATTERNED SILICON SUBSTRATE, USING IONIMPLANTATION 16-PA2BHANSALI.S.; +SOOD, D. K.ROYAL MELBOURNE INSTITUTE OF TECHNOLOGY,AUSTRALIA
HEXSIL BIMORPHS FOR VERTICAL ACTUATION 17-PA2+KELLER.C. G.; HOWE, R. T.UC BERKELEY, USA
Date: 95-06-27
A3 Systems, Circuits
PARALLEL PROCESSING ARCHITECTURE FOR SENSORINFORMATION 18-A3ISHIKAWA, M.* (INVITED)•UNIVERSITY OF TOKYO, JAPAN
A LOW POWER WIRELESS MICROINSTRUMENTATIONSYSTEM FOR ENVIRONMENTAL MONITORING 19-A3+MASON.A.; YAZDI, N.; NAJAFI, K.; WISE, K. D.UNIVERSITY OF MICHIGAN, USA
AN ADVANCED ENGINE KNOCK DETECTION MODULEPERFORMES HIGHER ACCURATE MBT CONTROL AND FUELCONSUMPTION IMPROVEMENT 20-A3+KANEYASU.M.*; KURIHARA, N.*; KATOGI, K.*; TABUCHI, K.*•HITACHI LTD., JAPAN
TRANSDUCERS '95 • EUROSENSORS IX
The 8th International Conference on Solid-State Sensors and Actuators, and Eurosensors IX. Stockholm, Sweden, June 25 -29 .1995
LOCAL POSITIONING SYSTEM BY MEANS OF ENCLOSINGSIGNAL FIELD 21-A3+OHYAMA, S.*; KOBAYASHI, A.*•TOKYO INSTITUTE OF TECHNOLOGY, JAPAN
OVERSAMPLED A/D INTERFACE CIRCUIT FOR INTEGRATEDAC-POWER SENSOR 22-A3+MALCOVATI, P.*; MALOBERTI, F."; BALTES, H.*•ECOLE POLYTECHNIQUE FEDERALE DE ZURICH,SWITZERLAND;"UNIVERSITY OF PAVIA, ITALY
Date: 95-06-27
PA3 Systems, Circuits
A REFLECTED-LIGHT RECEIVER WITH 2nA SENSITIVITYUSING CDS AND A SEPARATE LOWPASS-FILTERING OFTHE INPUT SIGNAL AT EACH CLOCK-PHASE 23-PA3+KILLAT, D.*; SCHMITZ, R."•TECHNICAL UNIVERSITY OF DARMSTADT, GERMANY;"TELEFUNKEN MICROELECTRONIC GROUP, GERMANY
NEAR-SENSOR IMAGE PROCESSING, A VLSIREALIZATION 24-PA3+EKLUND, J.E.*; SVENSSON, C.*; ASTROM, A.*•LINKOPING UNIVERSITY, SWEDEN
INTEGRATED ELECTROSTATIC RMS-TO-DC CONVERTERUSING IC-COMPATIBLE SURFACEMICROMACHINING 25-PA3+VAN DRIEENHUIZEN, B.P.*; WOLFFENBUTTEL, R.F.*•DELFT UNIVERSITY OF TECHNOLOGY, NETHERLANDS
CONTACTLESS ANGLE MEASUREMENT BY CMOSMAGNETIC SENSOR WITH ON CHIP READ OUTCIRCUIT 26-PA3+HABERLI, A.*; ZIMMERLI, M.*; CASTAGNETTI, R.*;BALTES, H.*•ECOLE POLYTECHNIQUE FEDERALE DE ZURICH,SWITZERLAND
CMOS RC-OSCILLATOR TECHNIQUE FOR DIGITAL READOUT FROM AN IR BOLOMETER DETECTOR ARRAY 27-PA3+RINGH, U.*; JANSSON, C " ; SVENSSON, C " ;LIDDIARD.K."*•NATIONAL DEFENCE RESEARCH ESTABLISHMENT,SWEDEN;"LINKOPrNG UNIVERSITY.SWEDEN;"•DEFENCE SCIENCE & TECH. ORGANISATION,SOUTH AUSTRALIA
LOW-POWER SINGLE-CHIP CMOS POTENTIOSTAT 28-PA3+KAKEROW, R.*; KAPPERT, H.*; SPIEGEL, E.*; MANOLI, Y.*•FRAUNHOFER INSTITUTE OF MICROELECTRONIC,GERMANY
AN OSCILLATOR CIRCUIT FOR ELECTROSTATICALLYDRIVEN SILICON-BASED ONE-PORT RESONATORS 29-PA3+BIENSTMAN, J.*; TILMANS, H.A.C.*; STEYAERT, M.*;PUERS, R.*•KATHOLIEKE UNIVERSITEIT LEUVEN, BELGIUM
ON-CHIP INTEGRATION OF HIGH-VOLTAGE GENERATORCIRCUITS FOR ASIDE-DRIVE ELECTROSTATICMICROMOTOR 30-PA3+JIANG, H.; CARR, W. N.NEW JERSEY INSTITUTE OF TECHNOLOGY, USA
DIODE BASED THERMAL RMS CONVERTER WITH ON-CHIPCIRCUITRY BUILT USING STANDARD CMOSTECHNOLOGY 31-PA3+KLAASSEN, E. H.; REAY, R. J.; KOVACS, G. T. A.STANFORD UNIVERSITY, USA
HIGH-VOLTAGE DEVICES AND CIRCUITS FABRICATEDUSING FOUNDRY CMOS FOR USE WITH ELECTROSTATICMEM ACTUATORS 32-PA3+MALUF, N. I.; REAY, R. J.; KOVACS, G.T.A.STANFORD UNIVERSITY, USA
MIXED ANALOG-DIGITAL HIGHLY SENSITIVE SENSORINTERFACE CIRCUIT FOR LOW COST MICROSENSORS+BURSTEIN, A.; KAISER, W. J. 33-PA3UCLA, USA
Date: 95-06-27
A4 Silicon Processes II
FAST 3D LASER MICROMACHINING OF SILICON FORMICROMECHANICAL AND MICROFLUIDICAPPLICATIONS 34-A4+MULLENBORN.M.*; DIRAC, H.*; PETERSEN, J.W.*;BOUWSTRA, S.*•DANMARKS TEKNISKE UNIVERSITET, DENMARK
MICRO ASSEMBLY BY HIGH RATE CVD USING CW UVLASER 35-A4+SUGIHARA, M.*; MINAMI, K.*; ESASHI, M.*•TOHOKU UNIVERSITY, JAPAN
A RESHAPING TECHNOLOGY WITH JOULE HEAT FORTHREE DIMENSIONAL SILICON MICRO STRUCTURES 36-A4+FUKUTA, Y.*; +AKIYAMA, T.*; FUJITA, H.'•THE UNIVERSITY OF TOKYO, JAPAN
PROCESS-DEPENDENT THERMOPHYSICAL PROPERTIES OFCMOS IC THIN FILMS 37-A4+PAUL, O.*; BALTES, H.*•ECOLE POLYTECHNIQUE FEDERALE DE ZURICH,SWITZERLAND
MISTIC 1.1: A PROCESS COMPILER FOR MICROMACHINEDDEVICES 38-A4+HASANUZZAMAN, M.; MASTRANGELO, C. H.UNIVERSITY OF MICHIGAN, USA
Date: 95-06-27
PA4 Silicon Processes II
ALIGNMENT OF MASK PATTERNS TO CRYSTALORIENTATION 39-PA4+ENSELL, G.*•THE UNIVERSITY OF SOUTHAMPTON, UK
BORON ETCH-STOP IN TMAH 40-PA4+BERNSTEIN, R.W.*; HANNEBORG, A.*; MERINGDAL, F.*;NESE, M.*; SANDMO.H.*•SINTEF, NORWAY
GALLIUM DOPING FOR SILICON ETCH STOP IN KOH 41-PA4+SENNA, J. R.*; SMITH, R. L.•LAS, INST. DE PESQUISAS ESPACIAIS, BRAZIL; UC DAVIS,USA
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TRANSDUCERS '95 • EUROSENSORS IX
The 8th International Conference on Solid-State Sensors and Actuators, and Eurosensors IX. Stockholm, Sweden, June 25 -29 ,1995
Date: 95-06-27
A5 Surface Micromachining
IN-SITU PHOSPHORUS-DOPED POLYSILICON FORMEMS 42-A5+BIEBL, M.; MULHERN, G. T; HOWE, R. T.SIEMENS; UC BERKELEY, USA
THICK POLYCRISTALLINE SILICON FOR SURFACEMICROMECHANICAL APPLICATIONS: DEPOSITION,STRUCTURING AND MECHANICALCHARACTERIZATION 43-A5+LANGE.P.*; KIRSTEN, M.*; RIETHMULLER, W.*; WENK, B.*;ZWICKER, G.*;MORANTE, J.R."; ERICSON, F."*; SCHWEITZ, J.-A.*"•FRAUNHOFER-INSTITUT FUR SILIZIUMTECHN., GERMANY;"UNIVERSITAT DE BARCELONA, SPAIN; '"UPPSALAUNIVERSITY, SWEDEN
POLYSILICON SURFACE MODIFICATION TECHNIQUE TOREDUCE STICKING OF MICROSTRUCTURE 44-A5+YEE, Y.*; CHUN, K.*; LEE, J.D.*•SEOUL NATIONAL UNIVERSITY, KOREA
AMMONIUM FLUORIDE ANTI-STICTION SURFACETREATMENTS FOR POLYSILICONMICROSTRUCTURES 45-A5+HOUSTON, M. R.; MABOUDIAN, R.; HOWE, R. T.UC BERKELEY, USA
POST-PROCESSING RELEASE OF MICROSTRUCTURES BYELECTROMAGNETIC PULSES 46-A5+GOGOI, B.; MASTRANGELO, C. H.UNIVERSITY OF MICHIGAN, USA
Date: 95-06-27
PA5 Surface Micromachining
DIFFERENTIAL ADHESION METHOD FOR MICROSTRUCTURERELEASE: AN ALTERNATIVE TO THE SACRIFICIALLAYER 47-PA5+SMELA, E.*; INGANAS, O.*; LUNDSTROM, I.*•UNIVERSITY OF LINKOPING, SWEDEN
A NOVEL METHOD TO AVOID STICKING OF SURFACEMICROMACHINED STRUCTURES 48-PA5+KOZLOWSKI, F.*; LINDMAIR, N.*; SCHEITER, T " ; HIEROLD,C."; LANG, W.*•FRAUNHOFER INST. FOR SOLID STATE TECH., GERMANY;"SIEMENS CORP. RESEARCH AND DEVELOPMENT,GERMANY
PERMEABLE POLYSILICON ETCH-ACCESS WINDOWSFOR MICROSHELL FABRICATION 49-PA5+LEBOUITZ, K. S.; HOWE, R. T.; PISANO, A. P.UC BERKELEY, USA
Date: 95-06-2
A6 Bonding, Packaging
SILICON TO SILICON ANODIC BONDING USING EVAPORA-TED GLASS 50-A6+KRAUSE, P.*; SPORYS, M.'; OBERMEIER, E.*•TECHNICAL UNIVERSITY OF BERLIN, GERMANY
QUALITY OF THE ALUMINIUM PRESS-ON CONTACTSFOR GLASS TO SILICON BONDING 51-A6+KADAR, Z.*; BOSSCHE.A.*; MOLLINGER, J.*•DELFT UNIVERSITY OF TECHNOLOGY, THE NETHERLANDS
IN-SITU INVESTIGATION OF PRECISE HIGH STRENGTHMICRO ASSEMBLY USING Au-Si EUTECTIC BONDING 52-A6+TIENSUU, A.-L.*; SCHWEITZ, J.-A.*; JOHANSSON, S.*•UPPSALA UNIVERSITY, SWEDEN
CAVITY PRESSURE CONTROL FOR CRITICAL DAMPINGOF PACKAGED MICRO MECHANICAL DEVICES 53-A6MORIUCHI, T.*; +MINAMI, K.*; ESASHI, M.*•TOHOKU UNIVERSITY, JAPAN
HERMETICITY TESTING OF GLASS-SILICON PACKAGESWITH ON-CHIP FEEDTHROUGHS 54-A6+ARX, J. VON; ZIAIE, B.; DOKMECI, M.; NAJAFI, K.UNIVERSITY OF MICHIGAN, USA
Date: 954)6-27
PA6 Bonding, Packaging
PACKAGING OF ISFETs AT THE WAFER LEVEL BYPHOTOPATTERNABLE ENCAPSULANT RESINS. 55-PA6+MUNOZ, J.*; BRATOV, A." ; MAS, R.*; ABRAMOVA, N.";DOMINGUEZ, C.*; BARTROLI, J . "•CENTRO NACIONAL DE MICROELECTRONICA-CSIC, SPAIN;"UNIVERSIDAD AUTONOMA DE BARCELONA, SPAIN
PROPOSAL FOR NEW MULTICHIP-ON-SILICONPACKAGING SCHEME 56-PA6+GUERIN, L*; SCHAER, M.A.*; SACHOT, R.*; DUTOIT, M.*•SWISS FEDERAL INSTITUTE OF TECHNOLOGY,SWITZERLAND
BASIC MICRO MODULE FOR CHEMICAL SENSORS WITH ONCHIP HEATER AND BURIED SENSOR STRUCTURE 57-PA6+MUTSCHALL, D.*; SCHEIBE, C.*; OBERMEIER, E.*•TECHNICAL UNIVERSITY OF BERLIN, GERMANY
NEW METHOD FOR TESTING HERMETICITY OF SILICONSENSOR STRUCTURES 58-PA6+NESE, M.*; BERNSTEIN, R.W.*; JOHANSEN, I.-R.*;HANNEBORG, A.*; SPOOREN, R.*•SINTEF, NORWAY
FLEXIBLE POLYSILOXANE INTERCONNECTION BETWEENTWO SUBSTRATES FOR MICROSYSTEM ASSEMBLY 59-PA6ARQUINT, P.*; VAN DER WAL, P.D.*; +VAN DER SCHOOT,B.H.*; DE ROOIJ.N.F.*•UNIVERSITY OF NEUCHATEL, SWITZERLAND
AN INITIAL EXPERIMENTAL STUDY OF ROTATINGMICROMECHANICAL LIQUID O-RING PRESSURESEALS 60-PA6+COHEN, S.; MUNTZ, E. P.UNIVERSITY OF SOUTHERN CALIFORNIA, USA
MONITORING PLASMA OVER-ETCHING OFWAFER-BONDED MICROSTRUCTURES 61-PA6+GUPTA, R. K.; SCHMIDT, C. H. HSU. M. A; SENTURIA,S. D. MASSACHUSETTS INSTITUTE OF TECHNOLOGY, USA
A MULTILAYER CERAMIC PACKAGE FOR SILICONMICROMACHINED ACCELEROMETERS 62-PA6+POURAHMADI, F.; KOEN, E.; TERRY, S.EG&G IC SENSORS, USA
TRANSDUCERS '95 • EUROSENSORS IX
The 8th International Conference on Solid-State Sensors and Actuators, and Eurosensors IX. Stockholm, Sweden, June 2 5 - 2 9 . 1995 11
A RAPID AND SELECTIVE ANODIC BONDING METHOD63-PA6
+ITO, N.*; YAMADA, K.*; OKADA, H.*; NISHIMURA, M.*;KURIYAMA, T*•NEC CORPORATION, JAPAN
Date: 95-06-26
B1 Actuators: Optical Applications
INTEGRATED OPTICAL ENCODERSAWADA, R.* (INVITED)•NTT, JAPAN
64-B1
A SILICON OPTICAL MODULATOR WITH 5 MHz OPERATIONFOR FIBER-IN-THE-LOOP APPLICATIONS 65-B1+WALKER, J. A.; GOOSSEN, K. W.; ARNEY, S. C.AT&T BELL LABORATORIES, USA
MHz OPTO-MECHANICAL MODULATOR 66-B1+MARXER, C.*; GRETILLAT, M.A.*; JAECKLIN, V.P.";BAETTIG, R."*;ANTHAMATTEN, O.*"; DE ROOIJ, N.F.'•UNIVERSITY OF NEUCHATEL, SWITZERLAND; "ESECSA.SWITZERLAND;"•ASCOM TECH., SWITZERLAND
TWO DIMENSIONAL SILICION MICROMACHINED OPTICALSCANNER INTEGRATED WITH PHOTO DETECTOR ANDPIEZORESISTOR 67-B1+IKEDA, M.*; GOTO, H.*; SAKATA, M.*; WAKABAYASHI, S.*;IMANAKA, IK.*; TAKEUCHI, M.*; YADA, T.*•OMRON CORPORATION, JAPAN
AN ELECTROSTATICALLY OPERATED TORSION MIRRORFOR OPTICAL SWITCHING DEVICE 68-B1+TOSHIYOSHI, H.*; FUJITA, H.*•THE UNIVERSITY OF TOKYO, JAPAN
DEFORMABLE MICROMIRROR DEVICES AS PHASEMODULATING HIGH RESOLUTION LIGHT VALVES 69-B1DOLESCHAL, W.*; GEHNER, A.*; GRUNDKE, W.*;+KUCK, H.*; MELCHER, R.*;PAUFLER, J.*; SELTMANN, R.*; ZIMMER, G.*•FRAUNHOFER-INSTITUTE OF MICROELECTRONICS,GERMANY
Date: 95-06-26
PB1 Actuators: Optical Applications
INTEGRATION OF SURFACE MICROMACHINED POLYSILI-CON MIRRORS AND A STANDARD CMOS PROCESS 70-PB1+FISCHER, M.*; NAGELE, M.*; EICHNER, D.*; SCHOLLHORN,C.*; STROBEL, R.**UNIVERSITAT STUTTGART, GERMANY
A HIGH-RESOLUTION LASER-BASED DEFLECTIONMEASUREMENT SYSTEM.FOR CHARACTERIZINGALUMINUM ELECTROSTATIC ACTUATORS 71-PB1+HONER, K. A.; MALUF, N. I.; MARTINEZ, E.; KOVACS, G. T. A.STANFORD UNIVERSITY, USA
DESIGN AND FABRICATION OF MICRO MIRROR SUPPORTEDBY ELECTROPLATED NICKEL POSTS 72-PB1+CHUNG, S.W.*; SHIN, J.W.*; KIM, Y.K.*; HAN, B.S."•SEOUL NATIONAL UNIVERSITY, KOREA;"SAMSUNG ELECTRONICS CO., LTD., KOREA
Date: 95-06-26
B2 Magnetic Actuators
MAGNETIC SMALL FLYING MACHINES 73-B2+ARAI, K.I.*; SUGAWARA, W.*; HONDA, T.*•TOHOKU UNIVERSITY, JAPAN
FULLY BATCH FABRICATED MAGNETIC MICROACTUATORSUSING A TWO LAYER LIGA PROCESS 74-B2+ROGGE, B.*; MENZ, W.*; MOHR, J.*; SCHULZ, J.*•INSTITUT FUR MIKROSTRUKTURTECHNIK, GERMANY
ELECTROMAGNETIC LINEAR ACTUATORS WITH INDUCTIVEPOSITION SENSING FOR MICRO RELAY, MICRO VALVE ANDPRECISION POSITIONING APPLICATIONS 75-B2+GUCKEL, H.; EARLE S,T; KLEIN, J.; ZOOK, D.;OHNSTEIN, T.UNIVERSITY OF WISCONSIN,USA; HONEYWELL, USA
A MICROMACHINED PERMALLOY MAGNETIC ACTUATORARRAY FOR MICRO-ROBOTICS ASSEMBLY SYSTEMS 76-B2+LIU, C; TSAO, T; WILL, P.; TAI, Y.-C; LIU, W.-H.CALTECH, USA; UNIVERSITY OF SOUTHERN CALIFORNIA,USA
MAGNETIC MICROACTUATION OF TORSIONAL POLYSILICONSTRUCTURES 77-B2+JUDY, J. W.; MULLER, R. S.UC BERKELEY, USA
Date: 95-06-26
PB2 Magnetic Actuators
ELECTROSTATIC AND MAGNETOELASTICMICROACTUATION OF SixNy BRIDGES 78-PB2+SHEARWOOD, C.*; PATE, M.A.*; GIBBS, M.R.J.*;WHITEHOUSE, C.R.*•UNIVERSITY OF SHEFFIELD, UK
Date: 95-06-27
B3 Optical Devices
MICROMACHINED DEVICES FOR OPTICALAPPLICATIONS 79-B3DEIMEL, P.P.* (INVITED)•DAIMLER-BENZ AG RESEARCH, GERMANY
MICROMACHINED 1X2 OPTICAL FIBER SWITCH 80-B3+FIELD, L. A.; BURRIESCI, D. L; ROBRISH, P. R.; RUBY, R. C.HEWLETT-PACKARD, USA
SURFACE-MICROMACHINED MOVABLE SOI OPTICALWAVEGUIDES 81-B3ENG, T.T.H.*; SIN, S.S.Y.*; +KAN, S.C.*; WONG, G.K.L.**HONG KONG UNIV. OF SCIENCE & TECHNOLOGY,HONG KONG
MICROMACHINED OPTICAL CIRCULAR GRATINGS FORSURFACE LIGHT-EMITTING DEVICES 82-B3+SASAKI.A.*; NODA, S.*; ISHIKAWA, T*•KYOTO UNIVERSITY, JAPAN
AN ANTENNA-COUPLED ELECTRIC WAVE DETECTOR FORMICROWAVE AND INFRARED RAY 83-B3+ONOE, Y.*; KISHI, N.*; HARA, H.*; YAMAGISHI, H.**YOKOGAWA ELECTRIC CORPORATION, JAPAN
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TRANSDUCERS '95 • EUROSENSORSIX
The 8th International Conference on Solid-State Sensors and Actuators, and Eurosensors IX. Stockholm, Sweden, June 25 -29 ,1995
Date: 95-06-27
PB3 Optical Devices
A MECHANICAL SPLICE FOR FIBER RIBBONS 84-PB3+ELDERSTIG, H.*; VIEIDER, C.*; LINDSTROM, B."•INDUSTRIAL MICROELECTRONICS CENTER, SWEDEN;"ERICSSON COMPONENTS AB, SWEDEN
Date: 95-06-27
B4 Exploratory Devices
THERMALLY CONTROLLED MAGNETIZATIONMICRORELAY 85-B4+HASHIMOTO, E.*; UENISHI.Y.*; WATANABE, A.**NTT INTERDISCIPLINARY RESEARCH LAB., JAPAN
SURFACE MICROMACHINED MICROENGINE AS THE DRIVERFOR MICROMECHANICAL GEARS 86-B4+GARCIA, E. J.; SNIEGOWSKI, J. J.SANDIA NATIONAL LABORATORIES, USA
ANALYSIS OF A MICRO-ELECTRIC GENERATOR FORMICROSYSTEMS 87-B4+WILLIAMS, C.B.*; YATES, R.B.*•UNIVERSITY OF SHEFFIELD, UK
A PRECISION FLOW RESTRICTOR FOR MEDICAL INFUSIONTHERAPY 88-B4+DRAKE, J.; JERMAN, H.EG&G IC SENSORS, USA
DESIGN OF A BIOLOGICAL CELL FUSION DEVICE 89-B4+LEE, S.W.*; CHOI.J.H.*; KIM.Y.K.*'SEOUL NATIONAL UNIVERSITY, KOREA
Date: 95-06-27
PB4 Exploratory Devices
GENERATING A MICROPLASMA WITH POROUSSILICON 90-PB4+KOZLOWSKI, F.*; HUBER, B.*; STEINER, P.*; LANG, W.*•FRAUNHOFER INST. FOR SOLID STATE TECH., GERMANY
GAS BUBBLES ELECTROLYTICALLY GENERATED ATMICROCAVITY ELECTRODES (MCE) USED FOR THEMEASUREMENT OF THE DYNAMIC SURFACE TENSIONIN LIQUIDS 91-PB4+VOLANSCHI.A.*; OLTHUIS, W.*; BERGVELD, P.*•UNIVERSITY OF TWENTE, NETHERLANDS
Date: 95-06-27
B5 Piezoelectric Actuators
A PIEZOELECTRIC PSEUDO-STATIC ACTUATOR FORLARGE DISPLACEMENT UNDER AC VOLTAGEOPERATION 92-B5+TOSHIYOSHI, H.*; KOBAYASHI, D.*; FUJITA, H.*; UEDA.T."*THE UNIVERSITY OF TOKYO, JAPAN;"YOKOGAWA ELECTRIC CORPORATION, JAPAN
BENDING AND EXPANDING MOTION ACTUATORS 93-B5IDOGAKI, T.*; +TOMINAGA, T.*; OHYA, N.*; SENDA, K.*;HATTORI.T*•NIPPONDENSO CO..LTD., JAPAN
FABRICATION AND CHARACTERIZATION OF PZT THIN FILMSFOR MICROMOTORS 94-B5+MURALT, P.*; KOHLI, M.*; MAEDER, T.*; BROOKS, K.*;KHOLKIN.A.*; SETTER, N.*•ECOLE POLITECHNIQUE FEDERALE, SWITZERLAND
DIRECT FRICTIONAL DRIVEN SURFACE ACOUSTIC WAVEMOTOR 95-B5+TAKAHASHI, M.*; KUROSAWA, M.*; HIGUCHI, T*•THE UNIVERSITY OF TOKYO, JAPAN
SILICON MICROFABRICATED HORNS FOR POWERULTRASONICS+LAL.A.; WHITE, R. M.UC BERKELEY, USA
96-B5
Date: 95-06-27
PB5 Piezoelectric Actuators
POSITIONING TO NANOMETER RESOLUTION WITHULTRASONIC ACTUATORS 97-PB5+SNITKA, V.*; MIZARIENE, V.*; ZUKAUSKAS, D.*•RESEARCH INSTITUTE "VIBROTECHNIKA", LITHUANIA
PIEZOELECTRIC CANTILEVER BEAMS ACTUATED BY PZTSOL-GEL THIN FILM 98-PB5+LUGINBUHL, P.*; RACINE, G-A*; DE ROOIJ, N.F.*'UNIVERSITY OF NEUCHATEL, SWITZERLAND
SELF-EXCITED PIEZOELECTRIC CANTILEVEROSCILLATORS 99-PB5+LEE, S. S.; WHITE, R. M.UC BERKELEY, USA
WITHDRAWN 100-PB5
BASIC CHARACTERISTICS OF A PIEZOELECTRIC TYPE OFACTUATOR 101-PB5+SAKATA, M.*; WAKABAYASHI, S.*; TOTANI, H.*; IKEDA, M.*;GOTO, H.*; TAKEUCHI, M.*; YADA, T*•OMRON CORPORATION, JAPAN
Date: 95-06-27
B6 Electrostatic Actuators, ApplicationsFABRICATION OF AN ELECTROSTATIC MICROACTUATORWITH AN S-SHAPED FILM 102-B6+SHIKADA, M.*; SATO, K.*; HARADA, T*•HITACHI, LTD, JAPAN
ELECTROSTATICALLY EXCITED DIAPHRAGM DRIVEN AS ALOUDSPEAKER 103-B6+RANGSTEN, P.*; SMITH, L.*; ROSENGREN, L.*; HOK,B.*>'UPPSALA UNIVERSITY, SWEDEN; "HOK INSTRUMENT AB,SWEDEN
BATCH FABRICATION OF MECHANICAL PLATFORMS FORHIGH DENSITY DATA STORAGE 104-B6+FAN, L.-S.; WOODMAN, S.; REILEY, T. C ; ZAPPE.H. H.;FURUHATA, T.IBM, USA
CAPACITANCE BASED TUNABLE MICROMECHANICALRESONATORS 105-B6+ADAMS, S.; BERTSCH, F; MACDONALD, N. C; MOON, F. C.CORNELL UNIVERSITY, USA
TRANSDUCERS '95 • EUROSENSORS IX
The 8th International Conference on Solid-State Sensors and Actuators, and Eurosensors IX. Stockholm, Sweden, June 2 5 - 2 9 , 1995 13
ELECTRICAL LEVITATION FOR MICROMOTORS ANDMICROACCELEROMETERS 106-B6HE, G.H.*; CHEN, K.S.*; TAN, S.S."; +WANG, W.Y."•ZHEJIANG UNIVERSITY, CHINA; "CHINESE ACADEMY OFSCIENCES, CHINA
Date: 95-06-27
PB6 Electrostatic Actuators, Applications
DOUBLE V-BEAM SUSPENSION FOR LINEARMICROACTUATORS 107-PB6+KOTA, S.; SAGGERE, L; CRARY, S. B.UNIVERSITY OF MICHIGAN, USA
Date: 95-06-26
C1 Biosensors: Enzyme Based
NON-INVASIVE BLOOD GLUCOSE MONITORING 108-C1KURIYAMAJ.* (INVITED)*NEC CORPORATION, JAPAN
ULTRASENSITIVE BIOSENSORS 109-C1+SCHELLER, F.W.*; MAKOWER, A.*; BIER, F.F.*;WOLLENBERGER, U.*; STOCKLEIN, W.*; GHINDILIS, A.*;EREMENKO, A.*•UNIVERSITY OF POTSDAM, GERMANY
OPTIMIZATION AND STABILIZATION OF AN ULTRASENSITIVE BIOSENSOR FOR THE DETERMINATION OFINORGANIC PHOSPHATE BY ENZYMATICAMPLIFICATION 110-C1+CONRATH, N.*; HUWEL, S.*; GRUNDIG, B.'; HAALCK, L.*;SPENER, F.*; CAMMANN, K.*•WESTFALISCHE WILHELMS-UNIVERSITAT, GERMANY
TRANSCUTANEOUS LACTATE MONITORING WITH A MICRO-PLANAR AMPEROMETRIC BIOSENSOR 111-C1+ITO, N.*; MATSUMOTO, T.*; NAKAMOTO, S.*; FUJIWARA,H.*; MATSUMOTO, Y.*; KAYASHIMA, S.**; ARAI .T" ; KIKUCHI,M."; KARUBE, I."*•NEC CORPORATION, JAPAN; "NATIONAL DEFENSE MEDI-CAL COLLEGE,JAPAN; '"UNIVERSITY OF TOKYO, JAPAN
FLOW-CALORIMETRIC BIOSENSING OF ZINC (II) IONS WITHUSE OF THERMOLYSIN-IMMOBILIZED BEADS 112-C1SATOH, I.* '•KANAGAWA INSTITUTE OF TECHNOLOGY, JAPAN
IMPROVEMENTS IN THE STABILITY CHARACTERISTICS OFBIOSENSORS USING PROTEIN-POLYELECTROLYTECOMPLEXES 113-C1+GIBSON, T.D.*; PIERCE, B.L.J.*; HULBERT, J.N.*;GILLESPIE, S.*•UNIVERSITY OF LEEDS, UK
Date: 95-06-26
PC1 Biosensors: Enzyme Based
MICRODIALYSIS SYSTEM FOR CONTINUOUS GLUCOSEMONITORING 114-PC1+HINKERS, H.*; DUMSCHAT,*; STEINKUHL, R.*; CAMMANN,K.*; KNOLL, M.*•INSTITUT FUR CHEMO- UND BIOSENSORIK, GERMANY
TWO AMPEROMETRIC BIOSENSORS AS LIQUIDCHROMATOGRAPHIC DETECTORS FOR ON-LINEMONITORING OF CARBOHYDRATE CONSUMPTIONAND ETHANOL PRODUCTION IN BIOPROCESSES 115-PC1+LIDEN, H.*; BUTTLER, T.*; JEPPSSON, H.*; VOLC, J . " ;MARKO-VARGA, G.*; GORTON,L*•UNIVERSITY OF LUND, SWEDEN; "THE CZECH ACADEMYOF SCIENCES, THE CZECH REPUBLIC
KINETICS OF ELECTRON TRANSFER BETWEENHORSERADISH PEROXIQASE AND POTASSIUMHEXACYANOFERRATE (II) IN ORGANIC MEDIA ANDAQUEOUS SOLUTION 116-PC1+SURAREUNGCHAI, W.*; TURNER, A.P.F.*; SAINI, S.**CRANFIELD UNIVERSITY, UK
ORGANOPHOSPHORUS PESTICIDES ANALYSIS BY SOLIDSTATE SENSORS 117-PC1+CAMPANELLA, L.*; COLAPICCHIONI, C.*; FAVERO, G.*;SAMMARTINO, M.P.*; TOMASSETTI, M.*•UNIVERSITA "LA SAPIENZA", ITALY
IMMOBILIZATION OF ENZYMES ONTO THIENOVIOLOGEN-MODIFIED GOLD ELECTRODES 118-PC1+ALBERTS, W.M.*; LEKKALA, J.*; EVANS, P.E.";TURNER, A.P.F."*VTT CHEMICAL TECHNOLOGY, FINLAND; "CRANFIELDUNIVERSITY, UK
SELF-DOPED POLYANILINE AS A TRANSDUCER FORPOTENTIOMETRIC BIOSENSORS 119-PC1+KARYAKIN, A.**M.V.LOMONOSOV MOSCOW STATE UNIVERSITY, RUSSIA
ENZYME ELECTRODES FOR DETERMINATION OF PHENOLCONCENTRATION 120-PC1KAISHEVA, A.*; +ILIEV, I.*; CHRISTOV, S.*; KAZAREVA, R.*•BULGARIAN ACADEMY OF SCIENCES, BULGARIA
A NEW METHOD FOR THE CONTROLLED IMMOBILIZATIONOF ENZYME IN INORGANIC GELS (LAPONITE) FORAMPEROMETRIC GLUCOSE BIOSENSOR 121-PC1POYARD, S.*; +JAFFREZIC-RENAULT, N.*; MARTELET, C ;LABBE, P."; COSNIER, S . "•ECOLE CENTRALE DE LYON,FRANCE; "UNIVERSITEJOSEPH FOURIER, FRANCE
ELECTRON TRANSFER PRINCIPLES IN AMPEROMETRICBIOSENSORS: DIRECT ELECTRON TRANSFER BETWEENENZYMES AND AN ELECTRODE 122-PC1+LOTZBEYER, T.*; SCHUHMANN, W.*; SCHMIDT, H.-L*•TECHNISCHE UNIVERSITAT MUNCHEN, GERMANY
AN INTEGRATED THERMAL SENSOR ARRAY FOR MULTI-ANALYTE DETERMINATION DEMONSTRATED WITHGLUCOSE, UREA AND PENICILLIN 123-PC1+XIE, B.*; DANIELSSON, B.*'UNIVERSITY OF LUND, SWEDEN
ON LINE MONITORING OF GLUCOSE, LACTATE, GLUTAMINEAND GLUTAMATE DURING MAMMALIAN CELLCULTIVATIONS WITH INTEGRATED MICRO BIOSENSORARRAY 124-PC1+MOSER, I.*; JOBST, G.*; SVASEK, P.*; VARAHRAM, M.*;URBAN, G.*; SCHMIDT, J . " ; LEIST, C. "•TECHNICAL UNIVERSITY OF VIENNA, AUSTRIA;"CIBA-GEIGYAG, SWITZERLAND
14
TRANSDUCERS '95 • EUROSENSORS IX
The 8th International Conference on Solid-State Sensors and Actuators, and Eurosensors IX. Stockholm, Sweden, June 25 -29 ,1995
MICROSTRUCTURED POLYMER-BASED TRANSISTORSOBTAINED BY MEANS OF SCANNING ELECTROCHEMICALMICROSCOPY. APPLICATIONS AS TRANSDUCERS INBIOSENSORS 125-PC1+SCHUHMANN, W.*; KRANZ, C.*; HILLER, M.**; BAUERLE,P."; GAUB, H.E.*•TECHNISCHE UNIVERSITAT MUNCHEN, GERMANY;"UNIVERSITAT WURZBURG, GERMANY
A HOLOGRAPHIC BIOSENSOR 126-PC1+MILLINGTON, R.*; MAYES, A.*; BLYTH, J.*; LOWE, C*•CAMBRIDGE UNIVERSITY, UK
A DISPOSABLE SENSOR AND ITS APPLICATIONS IN THEMEASUREMENTS OF GLUCOSE AND LEAD 127-PC1+YU, P.*; DONG, S.*•CHINESE ACADEMY OF SCIENCES, CHINA
GOD FILMS BY PULSED LASER ABLATION 128-PC1+APTE, P.R.*; PATEL, A.B.*; AGARWAL, G.*; PAI, S.P.*;PURANDARE, S.C.*; PINTO, R.*; PHADKE, R.S.**TATA INSTITUTE OF FUNDAMENTAL RESEARCH, INDIA
THE STUDIES FOR THE MALATE TISSUE BIOSENSOR USINGMALIC ENZYME IN THE BUNDLE SHEATH CELL OF THECORN LEAF 129-PC1+KIM, U.R.*; ROH, K.S.*; HA, Y.D.*; HONG, Y.S.*; PARK, Y.S."•KEIMYUNG UNIVERSITY.KOREA; "TAEGU UNIVERSITY,KOREA
Date: 95-06-26
C2 Flow Sensors I
A MICROSENSOR WITH INTEGRATED HEAT SINK & FLOWGUIDE FOR GAS FLOW SENSING APPLICATIONS 130-C2+QIU, L.*; OBERMEIER, E.*•TECHNISCHE UNIVERSITAT BERLIN, GERMANY
RESPONSE SPEED OPTIMIZATION OF THERMAL GAS-FLOWSENSORS FOR MEDICAL APPLICATION 131-C2+VINK, J.*; VERHOEVEN, H.J.*; HUIJSING, J.H.*•DELFT UNIVERSITY OF TECHNOLOGY, NETHERLANDS
INFLUENCE OF DESIGN GEOMETRY AND PACKAGINGON THE RESPONSE OF THERMAL CMOS FLOWSENSORS 132-C2+MAYER, F.*; BALTES, H.*•EIDGENOSSISCHE TECH. HOCHSCHULE ZURICH,SWITZERLANDr
DESIGN OF INTEGRATED THERMAL FLOW SENSORS USINGTHERMAL SIGMA-DELTA MODULATION 133-C2+VERHOEVEN, H.J.*; HUIJSING, J.H.*•DELFT.UNIVERSITY OF TECHNOLOGY, NETHERLANDS
THE U-FLOWN, A NOVEL DEVICE MEASURING ACOUSTICALFLOWS 134-C2+DE BREE, H.-E.*; LEUSSINK, P.*; KORTHORST, T.*; JANSEN,H.*; LAMMERINK, T.*; ELWENSPOEK, M.*•UNIVERSITY OFTWENTE, THE NETHERLANDS
Date: 95-06-26
PC2 Flow Sensors I
SILICON TUBE STRUCTURES FOR FLUID DENSITYSENSORS+ENOKSSON, P.*; STEMME, G.*; STEMME, E.*•ROYAL INSTITUTE OF TECHNOLOGY, SWEDEN
135-PC2
A BATTERY OPERATED MICROSYSTEM FOR FLOWMEASUREMENTS 136-PC2+PIERRE, M.*; STEENIS, B.*; HERMANN, J.*; BOURGEOIS,C.*; BARDYN, J.-P.*; NOUAZE, V.**; DOMINGUEZ, D."*CSEM, SWITZERLAND; "SCHLUMBERGER INDUSTRIES,FRANCE
A POLYSILICON FLOW SENSOR FOR GAS FLOWMETERS+NEDA, T.*; NAKAMURA, K.*; TAKUMI.T.*•TOKYO GAS CO., LTD., JAPAN
137-PC2
Date: 95-06-27
C3 Three Dimensional Processing
LIGA AND RELATED TECHNOLOGIES FORINDUSTRIAL APPLICATIONS 138-C3MENZ, W.* (INVITED)•KERNFORSCHUNGSZENTRUM KARLSRUHE GMBH,GERMANY
SILICON FUSION BONDING AND DEEP REACTIVE IONETCHING: A NEW PROCESS FORMICROSTRUCTURES 139-C3+PETERSEN, K.; LOGAN, J.; KLAASSEN, E.; NOWOROLSKI,M.; MCCULLEY, W.;STORMENT, C; KOVACS, G.LUCAS NOVASENSOR, USA; STANFORD UNIVERSITY, USA;UC BERKELEY, USA
A NOVEL ETCH/DIFFUSION PROCESS FOR FABRICATINGHIGH ASPECT RATIO SI MICROSTRUCTURES 140-C3+JUAN, W. H.; PANG, S. W.UNIVERSITY OF MICHIGAN, USA
SILICON - BULK MICROMACHINING BY LOW TEMPERATUREETCHING IN HIGH DENSITY SF,/O2 - PLASMA 141-C3+BARTHA, J.W.*; GRESCHNER, J.*; JUNGINGER, R.*;PUECH, M.**; MAQUIN, P."; RAVEL, G . "•IBM GMTC, GERMANY; "ALCATEL CIT, FRANCE
THE BLACK SILICON METHOD V: A STUDY OF THEFABRICATING OF MOVABLE STRUCTURES FOR MICROELECTROMECHANICAL SYSTEMS 142-C3+DE BOER, M.*; JANSEN, H.*; ELWENSPOEK, M.*•UNIVERSITY OF TWENTE, NETHERLANDS
Date: 95-06-27
PC3 Three Dimensional Processing
LOW-COST TECHNOLOGY FOR MULTILAYERELECTROPLATED PARTS USING LAMINATED DRY FILMRESIST 143-PC3+LORENZ, H.*;PARATTE, L " ; LUTHIER, R.*"; RENAUD.-P.*;DE ROOIJ, N.F."•SWISS FEDERAL INSTITUTE OF TECHNOLOGY,SWITZERLAND;"UNIVERSITY OF NEUCHATEL.SWITZERLAND; *"ASULABS.A., SWITZERLAND
HIGH RESOLUTION SHADOW MASK PATTERNING IN DEEPHOLES AND ITS APPLICATION TO AN ELECTRICAL WAFERFEED-THROUGH 144-PC3+BURGER, G.J.*; SMULDERS, E.J.T.*; BERENSCHOT, J.W.*;LAMMERINK, T.S.J.*; FLUITMAN, J.H.J.*; IMAI, S . "'UNIVERSITY OF TWENTE, THE NETHERLANDS;"HITACHI LTD, JAPAN
TRANSDUCERS '95 • EUROSENSORS IX
The 8th International Conference on Solid-State Sensors and Actuators, and Eurosensors IX. Stockholm, Sweden, June 25 -29 ,1995 15
THE FORMATION OF ELECTROPLATING MOLDS BYREACTIVE ION ETCHING 145-PC3+CHANG, S.-C; PUTTY, M. W.; HICKS, D. B.GENERAL MOTORS R&D CENTER, USA
Date: 95-06-27
C4 Accelerometers I
DIODE INTEGRATED CAPACITIVE ACCELEROMETER WITHREDUCED STRUCTURAL DISTORTION 146-C4SHOJI, Y.*; YOSHIDA, M.*; MINAMI, K.*; +ESASHI, M.**TOHOKU UNIVERSITY, JAPAN
ISAAC (INTEGRATED SILICON AUTOMOTIVEACCELEROMETER) 147-C4+SPANGLER, L; KEMP, C. J.FORD MICROELECTRONICS, USA
NOVEL PROCESS FOR A MONOLITHICAL INTEGRATEDACCELEROMETER 148-C4+OFFENBERG, M.*; LARMER, F.*; ELSNER, B.*; M O N Z E L , H.*;RIETHMOLLER, W.**•ROBERT BOSCH GMBH, GERMANY; "FHG-ISIT, GERMANY
AN INTEGRATED FORCE-BALANCED CAPACITIVEACCELEROMETER FOR LOW-G APPLICATIONS 149-C4+CHAU, K. H.-L; LEWIS, S. R.; ZHAO, Y.; HOWE, R. T; BART,S. F; MARCHESELLI, R. G.ANALOG DEVICES, USA; UC BERKELEY, USA
A PIEZORESISTIVE SILICON ACCELEROMETER WITHMONOLITHICALLY INTEGRATED CMOS-CIRCUITRY 150-C4+SEIDEL.H.*; FRITSCH.U.*; GOTTINGER.R.*; SCHALK.J.*•DAIMLER-BENZ RESEARCH AND TECHNOLOGY, GERMANY
Date: 95-06-27
PC4 Accelerometers I
A HIGH-PERFORMANCE, LOW COST CAPACITIVEACCELEROMETER TRIMMED USING NONVOLATILEPOTENTIOMETERS (EEPOT'S) 151-PC4+TSCHAN, T; URBANEK, W.; LIM, M.; ALLEN, H.; KNUTTI, J.SILICON MICROSTRUCTURES, USA
IMPROVEMENT OF NOVEL NRLM METHOD FORACCELEROMETERS' CHARACTERIZATION TO THE RANGEOF100m/82 152-PC4+UEDA, K.*; UMEDA.A.*•NATIONAL LABORATORY OF METROLOGY, JAPAN
Date: 95-06-27
C5 Pressure Sensors I
A HIGH-ACCURACY MULTI-ELEMENT SILICON BAROMETRICPRESSURE SENSOR 153-C5+ZHANG, Y.; WISE, K. D.UNIVERSITY OF MICHIGAN, USA
SURFACE MICROMACHINED CAPACITIVE DIFFERENTIALPRESSURE SENSOR WITH LITHOGRAPHICALLY DEFINEDSILICON DIAPHRAGM 154-C5+MASTRANGELO, C. H.; ZHANG.X.; TANG.W. C.UNIVERSITY OF MICHIGAN, USA; FORD, USA
A FULLY INTEGRATED SURFACE MICROMACHINEDPRESSURE SENSOR WITH LOW TEMPERATUREDEPENDENCE 155-C5+DUDAICEVS, H.*; MANOLI, Y.*; MOKWA, W.*; SCHMIDT, M.*;SPIEGEL, E.**FRAUNHOFER INSTITUTE OF MICROELECTRONIC,GERMANY
CAPACITIVE SILICON DIFFERENTIAL PRESSURESENSOR 156-C5+HERMANN, J.*; BOURGEOIS, C.*; PORRET, F.*; KLOECK, B.**CSEM, SWITZERLAND
INTEGRATED PRESSURE SENSOR WITH REMOTE POWERSOURCE AND REMOTE READOUT 157-C5+CARR, W. N. CHAMARTI, S.; GU, X.NEW JERSEY INSTITUTE OF TECHNOLOGY, USA
Date: 95-06-27
PC5 Pressure Sensors I
CAPACITIVE PRESSURE SENSOR MOCK-UP WITHOUTCOMPENSATION CIRCUITS 158-PC5+BLASQUEZ, G.*; PONS, P.*; MENINI, P.*; HERBST, D.**;SCHULZ, M."; HOFFLINGER, B.*"*CNRS LAAS, FRANCE; "HT MIKROELEKTRONIKGMBH.GERMANY;*"INSTITUT FUR MIKROELEKTRONIK STUTTGART,GERMANY
Date: 95-06-27
C6 Scanning Probes, Tactile Sensors
SELF-EXCITED FORCE SENSING MICROCANTILEVERS WITHPIEZOELECTRIC THIN FILMS FOR DYNAMIC SCANNINGFORCE MICROSCOPY 159-C6+ITOH, T.*; SUGA.T*•THE UNIVERSITY OF TOKYO, JAPAN
LATERAL FORCE MEASUREMENTS IN A SCANNING FORCEMICROSCOPE WITH PIEZORESISTIVE SENSORS 160-C6+BRUGGER, J.*; BINGGELI.M.**; BURGER, J . " ; IMURA, R.***;DE ROOIJ, N.F.*•UNIVERSITY OF NEUCHATEL, SWITZERLAND; "CSEM INC,SWITZERLAND;•"HITACHI LTD, JAPAN
MICROELECTROMECHANICAL SCANNING TUNNELINGMICROSCOPE 161-C6+XU, Y.; MILLER, S. A.; MACDONALD, N. C.CORNELL UNIVERSITY, USA
AN ACOUSTIC TACTILE SENSING ELEMENT WITH FIVEDIMENSIONAL SENSITIVITY 162-C6+ANDO, S.*; SHINODA, H.*"UNIVERSITY OF TOKYO, JAPAN
A CMOS COMPATIBLE TRACTION STRESS SENSING ELE-MENT FOR USE IN HIGH RESOLUTION TACTILEIMAGING 163-C6+KANE, B. J.; KOVACS, G. T. A.STANFORD UNIVERSITY, USA
16
TRANSDUCERS '95 • EUROSENSORS IX
The 8th International Conference on Solid-State Sensors and Actuators, and Eurosensors IX. Stockholm, Sweden, June 25—29, 1995
Date: 95-06-27
PC6 Scanning Probes, Tactile Sensors
INTEGRATION OF A LARGE TIP WITH HIGH ASPECTRATIO ON AN XY-MICROSTAGE FOR AFM IMAGING 164-PC6+INDERMUHLE, P-F.*; DE ROOIJ.N.F*"UNIVERSITY OF NEUCHATEL, SWITZERLAND
SILICON THREE-AXIAL TACTILE SENSOR 165-PC6CHU, Z.*; +SARRO, P.M.*; MIDDELHOEK, S.**DELFT UNIVERSITY OF TECHNOLOGY, THE NETHERLANDS
A MINIATURISED FABRY-PEROT AFM-SENSOR 166-PC6+RUF, A.*; ABRAHAM, M.*; LACHER, M.*; MAYR, K.*;ZETTERER, T.**IMM INSTITUTE OF MICROTECHNOLOGY, GERMANY
A NON-CONTACT INDUCTIVE POSITION SENSOR FORUSE IN MICRO MACHINES 167-PC6+ZMOOD, R. B.; SOOD, D. K.; BHANSALI, S.; ZHANG, Y. C.ROYAL MELBOURNE INSTITUTE OF TECHNOLOGY,AUSTRALIA
A MICROMACHINED SUB-MICROMETER PHOTODIODE FORSCANNING PROBE MICROSCOPY 168-PC6+DAVIS, R. C ; WILLIAMS, C. C; NEUZIL, P.UNIV. OF UTAH, USA; ICM LTD., USA
Date : 95-06-26
D1 Gas Sensors: Pattern Recognition I
PERFORMANCE DEFINITION AND STANDARDISATION OFELECTRONIC NOSES 169-D1GARDNER, J.* (INVITED)•UNIVERSITY OF WARWICK, UK
ANALYSIS OF COMPLEX GAS MIXTURES BY PATTERNRECOGNITION WITH POLYMER BASED QUARTZMICROBALANCE SENSOR ARRAYS 170-D1+KRAUS, G.*; HIERLEMANN, A.*; GAUGLITZ, G.*; GOPEL, W.*•UNIVERSITY OF TUBINGEN, GERMANY
EVALUATION OF DYNAMIC SENSOR SIGNALS BYARTIFICIAL NEURAL NETWORKS 171-D1+KERNER, T.*; GOPPERT, J.*; HIERLEMANN, A.*;MITROVICS, J.*; SCHWEIZER-BERBERICH, M.*; WEIMAR, U.*;GOPEL.W.*•UNIVERSITY OF TUBINGEN, GERMANY
A CALIBRATION TECHNIQUE FOR AN ELECTRONICNOSE 172-D1+HOLMBERG, M.*; FRYDER, M.*; WINQUIST, F.*;LUNDSTROM, I.*•LINKOPING UNIVERSITY, SWEDEN
GAS IDENTIFICATION USING OXIDE SEMICONDUCTOR GASSENSOR ARRAY AND NEURAL-NETWORK PATTERNRECOGNITION . 173-D1HONG, H.-K.*; +SHIN, H.W.*; PARK, H.S.*; YUN, D.H.*;KWON, C.H.*; LEE, K.*; KIM, ST.**LG ELECTRONICS RESEARCH CENTER, KOREA
SCREENING OF IRRADIATED TOMATOES BY MEANS OF ANELECTRONIC NOSE 174-D1+WINQUIST.F.*; ARWIN.H.*; FORSTER.R.*; DAY.C.*; LUND.E.*;LUNDSTROM.I.*•LINKOPING UNIVERSITY, SWEDEN
Date: 95-06-26
PD1 Gas Sensors: Pattern Recognition IA PRACTICAL USE OF ELECTRONIC NOSES: QUALITYESTIMATION OF COD FILLET BOUGHT OVER THE COUNTER+WINQUIST.F.*; SUNDGREN.H.*; LUNDSTROM,I.* 175-PD1•LINKOPING UNIVERSITY, SWEDEN
MULTISENSOR MICROSYSTEM FOR CONTAMINANTS INAIR 176-PD1ALTHAINZ.P.*; +GOSCHNICK.J.*; EHRMANN.S.*; ACHE.H.J.*•KERNFORSCHUNGSZENTRUM, GERMANY
FUZZY NEURAL NETWORKS FOR GAS SENSING 177-PD1+VLACHOS,D.S.*;AVARITSIOTIS,J.N.*•NATIONAL TECHNICAL UNIVERSITY OF ATHENS, GREECE
LINEARISATION IN MULTICOMPONENT ANALYSIS BASED ONA HYBRID SENSOR-ARRAY WITH 19 SENSORELEMENTS 178-PD1+MITROVICS.J.*; WEIMAR.U.*; GOPEL,W.*•UNIVERSITY OF TUBINGEN, GERMANY
SENSOR ARRAY RECOGNITION OF VARIETIES OF A SAMEWINE 179-PD1+DI NATALE.C.*; DAVIDE, F.*; D'AMICO, A.*; NELLI, P.";GROPELLI, S." ; SBERVEGLIERI, G . "•UNIVERSITY OF ROME "TOR VERGATA", ITALY;"UNIVERSITY OF BRESCIA, ITALY
STUDY OF FLEXIBLE NEURAL NETWORK FOR OLFACTORYSENSOR SYSTEM 180-PD1+PING, W.*; RONG, L.*; WEIXUE, L*•ZHEJIANG UNIVERSITY, CHINA
Date: 95-06-26
D2 Gas sensors: Catalytic Gate Devices
HYDROGEN-SENSITIVE BREAKDOWN VOLTAGE INTHE I-V CHARACTERISTICS OF TIN DIOXIDE-BASEDSEMICONDUCTORS 181-D2+EGASHIRA.M.*; SHIMIZU.Y.*; TAKAO.Y.*; FUKUYAMA.Y.*•NAGASAKI UNIVERSITY.JAPAN
INFLUENCE OF THE INTERACTION BETWEEN MOLECULESON THE RESPONSE OF A METAL OXIDE SILICON CARBIDE(MOSIC) SENSOR 182-D2+BARANZAHI, A.*; LLOYD SPETZ, A.*; JOHANSSON, R.";HAMREFORS, G." ; LUNDSTROM, I.*•LINKOPING INSTITUTE OF TECHNOLOGY, SWEDEN;"ABB CORPORATE RESEARCH, SWEDEN
IN SITU MODIFICATION OF THE NOx AND CO SENSITIVITYOF THIN Pt-GATE MOSFET's 183-D2ZUBKANS, J. ' ; +SPETZ, A.L.*; SUNDGREN, H.*; WINQUIST, F.*;KLEPERIS, J." ;LUSIS,A."•LINKOPING INSTITUTE OF TECHNOLOGY, SWEDEN;"UNIVERSITY OF LATVIA.LATVIA
THE DETECTION OF MIXTURES OF NOx'S WITH HYDROGENUSING CATALYTIC METAL FILMS ON THE SANDIA ROBUSTSENSOR WITH PATTERN RECOGNITION 184-D2+HUGHES, R. C; OSBOURN, G. C ; BARTHOLOMEW, J. W.SANDIA NATIONAL LABORATORIES, USA
TRANSDUCERS '95 • EUROSENSORS IX
The 8th International Conference on Solid-State Sensors and Actuators, and Eurosensors IX. Stockholm, Sweden, June 25—29,1995 17
LANGMUIR-ANALYSIS ON HYDROGEN GAS RESPONSE OFPALLADIUM-GATE FET SENSORS 185-D2+MORITA, Y.*; NAKAMURA, K.*; KIM, C."•TOKYO GAS CO., LTD..JAPAN; "FUNCTIONAL LOGICCORPORATION, JAPAN
Date: 95-06-26
PD2 Gas Sensors: Catalytic Gate Devices
THIN PLATINUM GATE FIELD EFFECT TRANSISTORSAS AMMONIA SENSORS IN LIQUID 186-PD2+HEDBORG.E.*; WINQUIST.F.*; LUNDSTROM.I.*•LINKOPING UNIVERSITY, SWEDEN
FAST RESPONDING HIGH TEMPERATURE SENSORSFOR COMBUSTION CONTROL 187-PD2BARANZAHI.A*; SPETZ.A.L.*; GLAVMO.M.**; NYTOMT.J";+LUNDSTROM,I*•LINKOPING INSTITUTE OF TECHNOLOGY.SWEDEN;"MECELAB, SWEDEN
DIAMOND MICROELECTRONIC GAS SENSORS 188-PD2+GURBUZ, Y.; KANG, W.P.; DAVIDSON, J.L.; KINSER, D.L.;KERNS.D.V.VANDERBILT UNIVERSITY, USA
DETECTION OF HYDROGEN FROM GASES DISSOLVEDIN TRANSFORMER OIL BY Pd/Pt MISFET 189-PD2+BAEK, T.S.*; LEE, J.G.*; KANG, S.W.*; CHOI, S.Y.*•KYUNGPOOK NATIONAL UNIVERSITY, KOREA
Date: 95-06-27
D3 Micromachined Analysis Systems
MICROMACHINING CHEMICAL AND BIOCHEMICALANALYSIS AND REACTION SYSTEMS ON GLASSSUBSTRATESHARRISON, J.* (INVITED)•UNIVERSITY OF ALBERTA, USA
190-D3
INTEGRATION OF A MICRO LIQUID CHROMATOGRAPHONTO A SILICON CHIP 191-D3OCVIRK, G.*; +VERPOORTE, E."; MANZ, A." ; WIDMER, H.M."•TECHNICAL UNIVERSITY OF VIENNA, AUSTRIA;"CIBA-GEIGY LTD, SWITZERLAND
CONTINUOUS.SAMPLE PREPARATION USING FREE-FLOWELECTROPHORESIS ON A SILICONMICROSTRUCTURE 192-D3+MANZ, A.*; RAYMOND, D.*; WIDMER, H.M.*"CIBA-GEIGY LIMITED, SWITZERLAND
A MEMS-BASED MINIATURE DNA ANALYSIS SYSTEM 193-D3+NORTHRUP.M. A.; HILLS.R. F.; LANDRE.P; LEHEW.S.;HADLEY, D.; WATSON, R.; SAIKI, R.; SNINSKY, J. J.LAWRENCE LIVERMORE NATIONAL LABORATORY, USA
A MICROFABRICATED, ELECTROCHEMILUMINESCENCECELL FOR THE DETECTION OF AMPLIFIED DNA 194-D3HSUEH, Y.-T; +SMITH, R. L; NORTHRUP, M. A.UC DAVIS, USA; LAWRENCE LIVERMORE NATIONALLABORATORY, USA
Date: 95-06-27
PD3 Micromachined Analysis Systems
DIFFERENT COUPLINGS OF ELECTROCHEMICAL CHIPSENSORS WITH ACTUATORS IN MICROANALYTICALFLUIDIC SYSTEMS 195-PD3+HINTSCHE, R.*; PAESCHKE, M.*; UHLIG ,A.*; KRUSE, C.*;DITTRICH, F.*; PHAM, M.T."; HOWITZ, S . "•FRAUNHOFER-INSTITUTE FUR SILIZIUMTECHN., GERMANY;"FORSCHUNGSZENTRUM ROSSENDORF, GERMANY
SENSOR CONTROLLED PROCESSES IN CHEMICALMICROREACTORS 196-PD3+EHRFELD, W.*; HESSEL, V.*; MOBIUS, H.*; RICHTER, T**IMM INSTITUT FUR MIKROTECHNIK GMBH, GERMANY
A PLANAR MICROFABRICATED FLUID FILTER 197-PD3BRODY, J. P.*; OSBORN, T. D.; FOSTER, F. K.; YAGER.P.*, USA;UNIVERSITY OF WASHINGTON, USA
Date: 95-06-27
D4 Gas Sensors: Pattern Recognition II
ODOR-SOURCE LOCALIZATION IN CLEAN ROOM BYAUTONOMOUS MOBILE SENSING SYSTEM 198-D4ISHIDA, H.; KAGAWA, Y.; NAKAMOTO, T; MORIIZUMI, T.TOKYO INSTITUTE OF TECHNOLOGY, JAPAN
THE MECHANISM OF THE RESPONSE OF LIPIDS MIMICKINGOLFACTORY SENSORS TO ODOR ANTS 199-D4+SUN, A.*; SUN, J.L*; JIANG, Y.L.*; CUI, L.*; HAI, X.*•CHINESE ACADEMY OF SCIENCES, CHINA
PATTERN RECOGNITION USING GASMODULATION 200-D4+AUERBACH, F.*•TECHNISCHE UNIVERSITAT MUNCHEN, GERMANY
APPLICATION OF PLASMA POLYMER FILM COATEDSENSORS TO GAS IDENTIFICATION USING LINEARFILTERS 201-D4+NAKAMURA, M.*; SUGIMOTO, I.*; KUWANO, H.*•NTT INTERDISCIPLINARY RESEARCH LAB., JAPAN
SOLID ELECTROLYTES FOR GAS SENSING AT HIGHTEMPERATURES. MULTI ELECTRODE SETUP TO ANALYZEGAS MIXTURES 202-D4+REINHARDT, G.*; SOMOV, S.I."; SCHONAUER, U.*";GUTH, U.*"*; GOPEL, W.*"UNIVERSITY OF TUBINGEN, GERMANY;"INSTITUTE OF HIGH TEMP. ELECTROCHEMISTRY, RUSSIA;***ROTH TECHNIK FORSCHUNG GMBH, GERMANY;""UNIVERSITY OF GREIFSWALD, GERMANY
Date: 95-06-27
PD4 Gas Sensors: Pattern Recognition II
INTEGRATED SENSOR ARRAY FOR GAS ANALYSIS INCOMBUSTION ATMOSPHERES 203-PD4GENTINO, J.*; +GUTI...RREZ, J.*; ARES, L*; ROBLA, J.I.*;SAYAGO, I.*; HORRILLO, M.C.*; GUTIERREZ, P.*•LABORATORIO DE SENSORES, SPAIN
MULTISENSOR SYSTEM FOR PARTIAL PRESSURERATIOS OF GAS SPECIES 204-PD4+KOHL, D.*; KELLETER, J.*•UNIVERSITY OF GEISSEN, GERMANY
18
TRANSDUCERS '95 • EUROSENSORSIX
The 8th International Conference on Solid-State Sensors and Actuators, and Eurosensors IX. Stockholm, Sweden, June 2 5 - 2 9 , 1995
MULTI-FREQUENCY MEASUREMENTS OF ORGANICCONDUCTING POLYMERS FOR SENSING OF GASESAND VAPOURS 205-PD4AMRANI, M.E.*; PAYNE, PA.*; +PERSAUD, K.C.**UMIST, UK
NONLINEAR PREPROCESSING FOR SMART CHEMICALSENSING SYSTEMS 206-PD4+WILSON, D. M.; DEWEERTH, S. O.GEORGIA INSTITUTE OF TECHNOLOGY, USA
Date: 95-06-27D5 Gas Sensors: Thermal
THERMAL ANALYSIS AND DESIGN OF A MICRO-HOTPLATEFOR INTEGRATED GAS SENSOR APPLICATIONS 207-D5+FUNG, S.K.H.*; TANG, Z." ; CHAN, P.C.H.*; SIN, J.K.O.*;CHEUNG, P.W.**HONG KONG UNIV. OF SCIENCE & TECHNOLOGY,HONG KONG;"DALIAN UNIVERSITY OF TECHNOLOGY, CHINA
WITHDRAWN 208-D5
OPTIMIZED TEMPERATURE PULSE SEQUENCES FOR THEENHANCEMENT OF CHEMICALLY-SPECIFIC RESPONSEPATTERNS FROM MICRO-HOTPLATE GAS SENSORS 209-D5+CAVICCHI, R. E.; SUEHLE, J. S.; KREIDER, K. G.; GAITAN, M.;CHAPARALA, P.; KUNT, T.; MACAVOY, T.NATIONAL INSTITUTE OF STANDARDS AND TECH, USA;UNIVERSITY OF MARYLAND, USA
LOW POWER MICRO GAS SENSOR 210-D5+LEE, D.-D.*; CHUNG, W.-Y."; KIM, T.-H.*; BAEK, J.-M.*•KYUNGPOOK NATIONAL UNIVERSITY, KOREA; "SEMYUNGUNIVERSITY, KOREA
SELECTED-AREA DEPOSITION OF MULTIPLE ACTIVE FILMSFOR CONDUCTOMETRIC MICROSENSOR ARRAYS 211-D5+SEMANCIK, S.; CAVICCHI, R. E.; POIRIER, G. E.; ALLEN, J. D.;SUEHLE, J. S.; CHAPARALA, P.NATIONAL INSTITUTE OF STANDARDS AND TECH, USA
Date: 95-06-27
PD5 Chemical Sensors: Thermal
DESIGN OF THE INTERFACE ELECTRONICS FOR ANINTEGRATED MICROSENSOR FOR THE PREVENTIVEDETECTION OF WATER CONDENSATION 212-PD5+VANCAUWENBERGHE, O*; SHORT, J*; GIEHLER, E*;BILDSTEIN, P*; ANCEY, P"; GSCHWIND, M "*ESIEE, LSM,FRANCE; "IMRA EUROPE S.A., FRANCE
SI-PLANAR-PELLISTOR: DESIGN FOR TEMPERATUREMODULATED OPERATION 213-PD5+AIGNER, R.*; DIETL, M.*; KATTERLOHER, R.*; KLEE.V.*•TECHNISCHE UNIVERSITAT MUNCHEN, GERMANY
A NEW METHOD TO MEASURE THE ABSOLUTE-HUMIDITYINDEPENDENTLY OF THE AMBIENT TEMPERATURE 214-PD5+KIMURA, M.**TOHOKU-GAKUIN UNIVERSITY, JAPAN
Date: 95-06-27
D6 Chemical Sensors: New SensingLayers
SELECTIVE AND SENSITIVE DETECTION OF VOLATILEORGANIC COMPOUNDS IN PLASMA FILM TECHNOLOGYWITH AMINO ACIDS AND FLUOROPOLYMERS 215-D6+SUGIMOTO, I.*; NAKAMURA, M.*; KUWANO, H.**NTT INTERDISCIPLINARY RESEARCH LAB., JAPAN
ENHANCED ELECTROCHEMICAL PERFORMANCE OFSOLID-STATE SENSORS WITH SILICONE RUBBER BASEDMEMBRANES 216-D6+MALINOWSKA, E.; OKLEJAS, V.; HOWER, R. W.;BROWN, R. B.; MEYERHOFF, M. E.UNIVERSITY OF MICHIGAN, USA
IMPROVED EMF STABILITY OF SOLID STATE ION-SELEC-TIVE SENSORS BY INCORPORATION OF LIPOPHILICSILVER-CALIXARENE COMPLEXES WITHIN POLYMERICFILMS 217-D6+MERUVA, R. K.; MALINOWSKA, E. R; HOWER, R.W.;BROWN, R.B.; MEYERHOFF, M.E.UNIVERSITY OF MICHIGAN, USA
NEW SOLVENT SYSTEM FOR THE IMPROVEDELECTROCHEMICAL PERFORMANCE OF SCREENPRINTED POLYURETHANE MEMBRANE-BASEDSOLID-STATE SENSORS 218-D6+HOWER, R. W.; SHIN, J. H.; MERUVA, R. K.; BROWN, R. B.UNIVERSITY OF MICHIGAN, USA; KWANGWOON UNIVERSITY,USA
FORMATION OF SELF-ASSEMBLED MONOLAYER OF HEMEAND SYNTHETIC HEMOPEPTIDE ON GOLD: INTERACTIONWITH NITRIC OXIDE AND CARBON MONOXIDE 219-D6+PILLOUD, D. L; MOSER, C. C; FARID, R. S.; RABANAL, F.;ROBERTSON, D. E.; DUTTON, P. L.UNIVERSITY OF PENNSYLVANIA, USA
Date: 95-06-27
PD6 Chemical Sensors: New SensingLayers
NITRATE AND BICARBONATE SELECTIVECHEMFETS 220-PD6+ANTONISSE, M.M.G.*; STAUTHAMER, W.P.R.V.*; RUDKEVICH,D.M.*; ENGBERSEN, J.F.J.*; REINHOUDT, D.N.*•UNIVERSITY OF TWENTE, THE NETHERLANDS
APPLICATION OF SOL-GEL AND LASER EVAPORATION •METHODS TO OBTAIN THIN GAS SENSITIVE FILMS 221-PD6+VAIVARS, G.*; KLEPERIS, J.*; VITINS, A.*; LIBERTS, G.*;LUSIS, A.*•UNIVERSITY OF LATVIA, LATVIA
ACRYLATED POLYURETHANE AS AN ALTERNATIVEION-SELECTIVE MEMBRANE MATRIX FOR CHEMICALSENSORS 222-PD6+BRATOV, A.*; ABRAMOVA, N.*; MUNOZ, J.**; DOMINGUEZ,C " ; ALEGRET, S.*; BARTROLI, J.*; VLASOV, Y.*"•UNIVERSITAT AUTONOMA DE BARCELONA, SPAIN;"CENTRO NACIONAL DE MICROELECTRONICA-CSIC, SPAIN;***ST. PETERSBURG UNIVERSITY, RUSSIA
TRANSDUCERS '95 • EUROSENSORS IX
The 8th International Conference on Solid-State Sensors and Actuators, and Eu'rosensors IX. Stockholm, Sweden, June 25—29,1995 19
INTRODUCTION OF ELECTRICALLY CONDUCTINGMOLECULARLY IMPRINTED COMPOSITE POLYMERS ASRECOGNITION ELEMENTS IN CHEMICAL SENSORS 223-PD6+KRIZ, D.*; KHAYYAMI, M.*; DANIELSSON, B.*; LARSSON,P.-O.*; MOSBACH, K.*•UNIVERSITY OF LUND, SWEDEN
BEHAVIOUR OF CRYPTOPHANE MOLECULES IN GASMEDIA 224-PD6+SOUTEYRAND, E.*; NICOLAS, D.*; MARTIN, J.R.*; CHAUVET,J.P."; COLLET, A . "•ECOLE CENTRALE DE LYON, FRANCE;"ECOLE NORMALE SUPERIEURE DE LYON, FRANCE
MASS SENSITIVE DETECTION OF CO2 BY AMINOGROUP-FUNCTIONALIZED POLYMERS 225-PD6ZHOU.R.*; +SCHMEISSER, D.*; HIERLEMANN, A.*; WEIMAR,U.*; GOPEL, W.*•UNIVERSITY OF TUBINGEN, GERMANY
ORGANIC VAPOR SENSITIVITY IN A POROUS SILICONDEVICE 226-PD6+CHOE, I.*; WATANABE, K.*; OKADA, T.*; SATOH, Y.*•TOKAI UNIVERSITY JR. COLL., JAPAN
Date: 95-06-27
Industrialization of Sensors
MEMS: WHAT LIES AHEAD?+PETERSEN, K.*•LUCAS NOVASENSOR, USA
227-IND
SPECIAL FEATURES OF AUTOMOTIVE ONBOARDSENSORS 228-IND+IGARASHI, I.*•TOYOTA PHYSICAL AND CHEMICAL RES.INST., JAPAN
PHARMACIA BIOSENSOR - A TECHNOLOGICAL SUCCESSWITH COMMERCIAL POTENTIAL 229-IND+ANDREN, L.G.*•PHARMACIA BIOSENSOR AB, SWEDEN
INDUSTRIALIZATION OF AN R&D SENSORCOMPANY 230-IND+HORNTVEDT, S.*•SENSONOR, NORWAY
METAL OXIDE SENSORS 231-IND+MEIXNER, H.*; LAMPE, U.*•SIEMENS AG, GERMANY
Date: 95-06'-28
A7 Modelling, Analysis
CAD FOR MICROMECHANICAL SYSTEMS 232-A7SENTURIA, S.* (INVITED)•MASSACHUSETTS INSTITUTE OF TECHNOLOGY, USA
MAGNETOSTATIC MODELING OF AN INTEGRATEDMICROCONCENTRATOR 233-A7+SCHNEIDER, M.*; KORVINK, J.G.*; BALTES, H.*•ETH, SWITZERLAND
ON THE ELECTROMECHANICAL BEHAVIOUR OF THINPERFORATED BACKPLATES IN SILICON CONDENSERMICROPHONES 234-A7+PEDERSEN, M.*; OLTHUIS, W.*; BERGVELD, P.*•UNIVERSITY OF TWENTE, NETHERLANDS
STATIC AND DYNAMIC FLOW SIMULATION OF A KOH-ETCHED MICRO VALVE 23S-A7+ULRICH, J.*; FULLER, H.*; ZENGERLE, R."•SIEMENS AG, GERMANY; "FRAUNHOFER-INST. FOR SOLIDSTATE TECH., GERMANY
MEMBUILDER: AN AUTOMATED 3D SOLID MODELCONSTRUCTION PROGRAM FOR MICROELECTRO-MECHANICAL STRUCTURES FROM MASK AND PROCESSDATA 236-A7+OSTERBERG, P. M.; SENTURIA, S. D.MASSACHUSETTS INSTITUTE OF TECHNOLOGY, USA
Date: 95-06-28
PA7 Modelling, Analysis
A SIMPLE ANALYTICAL METHOD FOR MODELING FIELD-SENSITIVE FILM TRANSDUCERS 237-PA7MANOLESCU, A.*; +MANOLESCU, A.M.*•UNIVERSITY OF BUCHAREST, ROMANIA
CALCULATION OF THE QUALITY FACTOR OF TORSIONALRESONATORS IN THE LOW-PRESSURE REGION 238-PA7+KADAR, Z.*; KINDT, W.*; BOSSCHE, A.*; MOLLINGER, J.*•DELFT UNIVERSITY OF TECHNOLOGY, THE NETHERLANDS
SIMULATION OF A COMPLEX SENSOR SYSTEM USINGCOUPLED SIMULATION PROGRAMS 239-PA7+SCHROTH, A.*; BLOCHWITZ, T.*; GERLACH, G.*•DRESDEN UNIVERSITY OF TECHNOLOGY, GERMANY
CIRCUIT SIMULATION MODEL OF GAS DAMPING INMICROSTRUCTURES WITH NON-TRIVIAL GEOMETRIES
240-PA7+VEIJOLA, T.*; RYHANEN, T.**; KUISMA, H.";LAHDENPERA, J . "•HELSINKI UNIVERSITY OF TECHNOLOGY, FINLAND;"VAISALA TECHNOLOGIES INC., FINLAND
MODELLING AND SIMULATION OF A DIFFUSION LIMITEDGLUCOSE SENSOR 241-PA7CAMBIASO, A.*; DELFINO, L.*; +GRATTAROLA.G.*;VERRESCHI.G.*;ASHWORTH.D.**; MAINESA"; VADGAMA.P.""UNIVERSITY OF GENOA, ITALY; "HOPE HOSPITAL, UK
DIFFERENT STRATEGIES FOR THE NON-LINEARDYNAMICAL CALIBRATION OF GAS SENSORS 242-PA7+DAVIDE, F.A.M.*; Dl NATALE, C.*; D'AMICO, A.*; MARCO, S.**;PARDO, A."; HIERLEMANN, A.*"; MITROVICS, J . * " ;SCHWEIZER, M."*; WEIMAR, U."*; GOPEL, W.***•UNIVERSITA Dl ROMA, ITALY;"UNIVERSITAT DE BARCELONA, SPAIN;•"UNIVERSITY OF TUBINGEN, GERMANY
BAYESIAN OPTIMAL DESIGN OF EXPERIMENTS FORSENSOR CALIBRATION 243-PA7+CRARY, S.B.; JEONG ,Y.UNIVERSITY OF MICHIGAN, USA; CALVIN COLLEGE, USA
Date: 95-06-28
A8 Mechanical Properties
MICRO-INSTRUMENTATION FOR TRIBOLOGICALMEASUREMENTS+PRASAD, R.; MACDONALD, N. C; TAYLOR, D.CORNELL UNIVERSITY, USA
244-A8
20
TRANSDUCERS '95 • EUROSENSORSIX
The 8th International Conference on Solid-State Sensors and Actuators, and Eurosensors IX. Stockholm, Sweden, June 25—29,1995
